A cold-pressing method for thin-film capacitor thermal polymerization and device thereof

Abstract

The application discloses a cold pressing method and device for thin film capacitor thermal polymerization, which comprises a base and a product clamping frame for clamping capacitor chip bodies, the top front side of the base is provided with a positioning block, the rear side is provided with a limiting assembly for positioning and placing the product clamping frame, the rear end of the base is provided with a first air cylinder, and the output end of the first air cylinder is provided with a push rod through a sliding block assembly. The application can cold press the capacitor chips, avoid the capacitor chips in a column from being skewed and deformed during the cold pressing process, make the capacitor chips be uniformly pressed and have high consistency, ensure the quality of the products, adjust the pressure according to the specifications of the capacitor chips, set the baffle, the cushion block wedge-shaped gasket and the flat gasket, improve the universality of the device, reduce the production cost, and the operation is simple, the working efficiency is improved, and the cold pressed capacitor chips can be well placed according to the requirements of thermal polymerization, and the subsequent working efficiency and quality are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitor product production, and in particular to a cold pressing method and device for thermal polymerization of a thin film capacitor. Background Art

[0002] With the continuous development and progress of industrial science and technology, the quality requirements for film capacitors used in the industrial and automotive fields are higher and the product volume is larger. The ordinary hot pressing process uses a hot press machine with constant temperature and constant pressure, which takes a long time, has a small number of single hot pressings, and is very inefficient. Moreover, during the hot pressing process, the core is exposed to the air, which contains oxygen and water vapor, making it difficult to achieve a relatively ideal polymerization effect or heat treatment effect.

[0003] Therefore, the film capacitor core in this field will use an oven for heat treatment or thermal polymerization. The current existing thermal polymerization or heat treatment mainly adopts the following methods:

[0004] 1) When heating in an ordinary oven, air is used as the heating heat circulation medium. Because there is water vapor and oxygen in the air and the core, the metal film material of the product is easily oxidized to varying degrees during the heat treatment in the oven, thereby reducing the electrical performance of the product.

[0005] 2) Use a vacuum oven for heating. Place the film capacitor core in a vacuum heating box and extract the air and water vapor as much as possible. However, since there is no gas in the box as a heat circulation medium, the interior can only be heated by radiation from the heating tube. The temperature uniformity is very poor, usually with a temperature difference of 10-20°C, resulting in poor product performance consistency, long heat treatment time, and high energy consumption.

[0006] The Chinese patent announcement number is CN115410825B, which discloses a "Thin Film Capacitor Thermal Polymerization Method and Device"; the present invention discloses a thin film capacitor thermal polymerization method and device, including a hot air circulation heating system, an inert gas and air duct switching system, a vacuum box, a power control system, a vacuum box inner cavity, and a capacitor chip clamp car. The above method and device greatly simplify the operation process and production cycle of the thin film capacitor core, thereby improving the production efficiency of the thin film capacitor and reducing its labor intensity. During the thermal polymerization process, contact with oxygen and water vapor is avoided throughout the process. At the end of the thermal polymerization, the inside of the core is also filled with an inert gas such as nitrogen to reduce the degree of oxidation of the metal film and improve the electrical parameter performance of the product; heating is carried out by circulating inert gas, and compared with the method of relying on heat radiation from the heating tube under a vacuum state, the temperature difference consistency in the box is greatly improved, which better ensures the stability and consistency of the product.

[0007] From the above-disclosed thermal polymerization method and device, it can be seen that it uses a capacitor chip fixture cart to place the capacitor chips that have been cold-pressed, and the heat circulation medium circulation air path in the vacuum box is to take in air from the side, so the end face of the capacitor chip must be perpendicular to the circulation air path when placed, ensuring that the capacitor chip is heated evenly during thermal polymerization.

[0008] However, the existing cold pressing method of capacitor chips is mostly manual operation, which is cumbersome and inefficient. It is also difficult to ensure uniform pressure on the capacitor chip, which affects the thermal polymerization effect of the capacitor chip. Summary of the Invention

[0009] The present invention provides a cold pressing method and device for thermal polymerization of thin film capacitors, which ensures that the pressure on the capacitor chip is uniform and consistent, is simple to operate, and has high work efficiency. In addition, the capacitor chip after cold pressing can be placed according to the requirements of the thermal polymerization method.

[0010] One of the purposes of the present invention is to provide a cold pressing device for thermal polymerization of thin film capacitors, comprising a base and a product clamping frame for clamping a capacitor chip body, wherein a positioning block is provided on the front side of the top of the base, and a limiting assembly is provided on the rear side for positioning and placing the product clamping frame, a first cylinder is provided on the rear end of the base, and a push rod is provided on the output end thereof through a slider assembly for applying pressure to the capacitor chip body in the product clamping frame; a bracket is provided on the rear side of the top of the base, and a second cylinder is provided on the bracket, and a pressure block is provided on the output end of the second cylinder for applying pressure to the capacitor chip body in the product clamping frame;

[0011] The product clamping frame is provided with openings on both the upper and lower sides, and a through hole corresponding to the push rod is provided at the rear end thereof, wherein a number of partitions, pads, flat gaskets, kraft paper sheets and two wedge-shaped gaskets are placed, which are used to cooperate with the push rod to apply pressure to the capacitor chip body;

[0012] A pad is provided on the top of the base to ensure that the end faces of the capacitor chip body are flush when placed in the product clamping frame.

[0013] Preferably, the first cylinder and the second cylinder are respectively provided with a first pressure gauge and a second pressure gauge to monitor their pressures, so as to facilitate adjustment of the output pressures of the first cylinder and the second cylinder.

[0014] Preferably, the second cylinder is replaced by a booster cylinder, the output pressure of the booster cylinder is greater than the output pressure of the first cylinder, and the output end of the booster cylinder is connected to the pressure block through a pressure sensor for detecting the pressure applied by the pressure block.

[0015] Preferably, the limiting assembly is composed of a flat plate with threaded holes at both ends as the main body, and L-shaped limiting plates are symmetrically screwed to both ends of the top of the flat plate by screws. The L-shaped limiting plate is provided with a waist hole for adjusting its screw-fixing position to suit product clamping frames of different width specifications.

[0016] Preferably, the positioning block is fixed to the base by screwing with screws, and the through hole penetrated by the screw is a waist hole, which is used to adjust its screw fixing position to be suitable for product clamping frames of different length specifications.

[0017] Preferably, the number of through holes at the rear end of the product clamping frame is four and distributed in a rectangular shape, and the corresponding number of push rods is also four, so that the pressure applied by the push rods is more uniform.

[0018] Preferably, the width of the partition is greater than the spacing between the left and right through holes, so that the push rod pushes the partition to apply pressure, and the width of the pad, wedge-shaped gasket and flat gasket is less than the spacing between the left and right through holes, so that the push rod can place it between the partition and the rear end of the product clamping frame after applying pressure to the partition.

[0019] Preferably, the base is tilted, and one end of the positioning block is lower than one end of the first cylinder, so that the partitions, pads, flat gaskets and kraft paper sheets are not easily collapsed when the operator places them.

[0020] Another object of the present invention is to provide a process for cold pressing a thin film capacitor using the thin film capacitor cold pressing device, comprising the following steps:

[0021] 1) Adjust the pressure of the first and second cylinders according to the specifications of the capacitor chip body so that they can exert sufficient pressure on the capacitor chip body through the push rod and the pressure block without damaging the capacitor chip body;

[0022] 2) Select a product holding frame of appropriate size according to the specifications of the capacitor chip body, place its front end in the positioning block, and the rear end in the limit assembly, and adjust the position of the positioning block and the L-shaped limit plate to position and limit the product holding frame so that the through hole at the rear end of the product holding frame corresponds to the push rod and the center of its rear end is directly below the pressure block;

[0023] 3) Place several capacitor chip bodies in sequence from the front end to the back end of the product clamping frame, with the bottom end of the capacitor chip body fitted with the pad. Depending on the size of the capacitor chip body, place a partition between each capacitor chip body, or place a partition between two or more capacitor chip bodies, and place a partition behind the last capacitor chip body. Place kraft paper between the capacitor chip bodies and between the capacitor chip body and the partition, as well as the product clamping frame, to prevent damage to the capacitor chip body when pressure is applied.

[0024] 4) After placing the capacitor chip body, partition, and kraft paper, start the first cylinder to extend, which drives the push rod to move through the slider assembly. After the push rod passes through the through hole, it presses against the rearmost partition and pushes the partition to press against the capacitor chip body until the partition stops moving.

[0025] 5) After the push rod applies pressure to the capacitor chip body, there is a gap between the rearmost partition and the rear end of the product clamping frame. At this time, several pads and flat gaskets are placed in, and then two wedge-shaped gaskets are placed close to the rear end of the product clamping frame after the inclined surfaces are aligned. This fills the gap between the partition and the rear end of the product clamping frame. Then, the second cylinder is activated to drive the pressure block downward. The pressure block applies pressure to the wedge-shaped gasket to prevent the pads, flat gaskets and wedge gaskets from falling and maintain pressure on the capacitor chip body.

[0026] 6) Start the first cylinder to retract and drive the push rod to exit the product clamping frame. Then remove the product clamping frame holding the capacitor chip body from the positioning block and limit assembly, flip its opening 90° and place it on the external capacitor chip fixture with the sides facing each other. Then place an empty product clamping frame into the positioning block and limit assembly, and repeat steps 3) to 5).

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention can perform cold pressing on capacitor chips, and can avoid skew deformation of capacitor chips in a row during the cold pressing process, so that the capacitor chips are pressed evenly and with high consistency, thereby ensuring the quality of the product; the pressure can be adjusted according to the specifications of the capacitor chips, and partitions, pads, wedge-shaped gaskets and flat gaskets are provided, thereby improving the versatility of the device, reducing production costs, and simplifying the operation, thereby improving work efficiency; the capacitor chips after cold pressing can be well placed in accordance with the requirements of thermal polymerization, thereby improving subsequent work efficiency and quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of the present invention;

[0029] Figure 2 Schematic diagram of a top view of the structure of an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of a positioning method of a product clamping frame according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the three-dimensional structure of the capacitor chip body clamped by the clamping frame of the product according to the embodiment of the present invention;

[0032] Figure 5 for Figure 4 Schematic diagram of the top view structure;

[0033] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure of AA;

[0034] Figure 7 This is a schematic diagram of the end face structure of the clamping frame of the product according to an embodiment of the present invention;

[0035] Figure 8 This is a schematic diagram of a clamping frame of a product according to an embodiment of the present invention clamping a capacitor chip body of another specification;

[0036] Figure 9 A schematic diagram of a product clamping frame according to an embodiment of the present invention being placed on a capacitor chip fixture vehicle;

[0037] Figure 10 This is a schematic diagram of the main structure of another embodiment of the present invention.

[0038] In the figure: 1. Base, 2. First cylinder, 3. Slider assembly, 301. Push rod, 4. Bracket, 5. Second cylinder, 6. Pressure block, 7. Positioning block, 8. Limit assembly, 801. L-shaped limit plate, 9. Product clamping frame, 901. Through hole, 10. Pad plate, 11. Capacitor chip body, 12. First pressure gauge, 13. Second pressure gauge, 14. Partition, 15. Pad, 16. Wedge-shaped gasket, 17. Flat gasket, 18. Kraft paper, 19. Capacitor chip fixture cart, 20. Booster cylinder, 21. Pressure sensor. DETAILED DESCRIPTION

[0039] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "vertical", "horizontal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0040] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Example

[0041] like Figures 1 to 7As shown, the embodiment of the present application comprises a base 1 and a product clamping frame 9 for clamping the capacitor chip body 11, the front top side of the base 1 is provided with a positioning block 7, the rear side is provided with a limiting assembly 8 for positioning and placing the product clamping frame 9, the rear end of the base 1 is provided with a first air cylinder 2, and the output end thereof is provided with a push rod 301 through a sliding block assembly 3, for exerting pressure on the capacitor chip body 11 in the product clamping frame 9; the top rear side of the base 1 is provided with a bracket 4, the bracket 4 is provided with a second air cylinder 5, the output end of the second air cylinder 5 is provided with a pressing block 6, for exerting pressure on the capacitor chip body 11 in the product clamping frame 9;

[0042] The product clamping frame 9 is provided with openings on the upper and lower sides, and the rear end thereof is provided with through holes 901 corresponding to the push rods 301, a plurality of partition plates 14, cushion blocks 15, flat gaskets 17 and two wedge-shaped gaskets 16 are placed therein, for cooperating with the push rods 301 to press the capacitor chip body 11; the top of the base 1 is provided with a flat plate 10 for ensuring that the end faces of the capacitor chip body 11 placed in the product clamping frame 9 are flush.

[0043] As a preferred, the first air cylinder 2 and the second air cylinder 5 are respectively provided with a first pressure gauge 12 and a second pressure gauge 13 to monitor the pressure thereof, facilitating the adjustment of the output pressure of the first air cylinder 2 and the second air cylinder 5.

[0044] As a preferred, the limiting assembly 8 has a flat plate with threaded holes at both ends as the main body, L-shaped limiting plates 801 are symmetrically screwed on both ends of the top of the flat plate through screws, the L-shaped limiting plates 801 are provided with waist holes for adjusting the screwing and fixing position thereof, so as to be suitable for product clamping frames 9 of different width specifications.

[0045] As a preferred, the positioning block 7 is fixed by screwing with the base 1, and the through hole thereof penetrated by the screw is a waist hole for adjusting the screwing and fixing position thereof, so as to be suitable for product clamping frames 9 of different length specifications.

[0046] As a preferred, the number of through holes 901 at the rear end of the product clamping frame 9 is four, and they are distributed in a rectangular shape, and the number of corresponding push rods 301 is also four, so that the pressure exerted by the push rods 301 is more uniform.

[0047] As a preferred, the width of the partition plate 14 is greater than the distance between the through holes 901 on the left and right sides, so that the push rod 301 pushes the partition plate 14 to exert pressure, and the width of the cushion block 15, the wedge-shaped gasket 16 and the flat gasket 17 is less than the distance between the through holes 901 on the left and right sides, so that after the push rod 301 exerts pressure on the partition plate 14, the partition plate 14 is placed between the partition plate 14 and the rear end of the product clamping frame 9.

[0048] When the capacitor chip body 11 needs to be cold-pressed, the pressures of the first cylinder 2 and the second cylinder 5 are first adjusted according to the specifications of the capacitor chip body 11 so that sufficient pressure is applied to the capacitor chip body 11 through the push rod 301 and the pressing block 6 without damaging the capacitor chip body 11.

[0049] Then, according to the specifications of the capacitor chip body 11, a product clamping frame 9 of appropriate size is selected, and its front end is placed in the positioning block 7, and its rear end is placed in the limiting assembly 8. The positions of the positioning block 7 and the L-shaped limiting plate 801 are adjusted to position and limit the product clamping frame 9 so that the through hole 901 at the rear end of the product clamping frame 9 corresponds to the push rod 301, and the center of its rear end is directly below the pressing block 6;

[0050] like Figure 5 As shown, seven capacitor chip bodies 11 are placed in sequence from the front end to the rear end of the product clamping frame 9, and the bottom end surface of the capacitor chip body 11 is attached to the pad plate 10, which facilitates the subsequent gold spraying process on the end surface of the capacitor chip body 11; the specifications of the capacitor chip body 11 are relatively large, and only a partition 14 needs to be placed between the last capacitor chip body 11 and the product clamping frame 9. During the pressure application process, the capacitor chip body 11 in this column will not bend too much, resulting in uneven pressure or deformation, such as Figure 8 As shown, when nine capacitor chip bodies 11 of smaller specifications are placed in sequence from the front end to the rear end of the product clamping frame 9, a partition 14 is placed between two or more capacitor chip bodies 11, and a partition 14 is placed on the back side of the last capacitor chip body 11 to prevent the capacitor chip bodies 11 in this row from being bent too much, resulting in uneven pressure or deformation. Kraft paper sheets 18 are placed between the capacitor chip bodies 11 and between the capacitor chip bodies 11 and the partition 14, as well as the product clamping frame 9, to prevent damage to the capacitor chip bodies 11 when pressure is applied.

[0051] After the capacitor chip body 11, the partition 14, and the kraft paper 18 are placed, the first cylinder 2 is activated to extend, which drives the push rod 301 to move through the slider assembly 3. The push rod 301 passes through the through hole 901 and abuts against the rearmost partition 14. It pushes the partition 14 to press against the capacitor chip body 11 until the partition 11 stops moving.

[0052] After the push rod 301 applies pressure to the capacitor chip body 11, a gap exists between the rearmost partition 14 and the rear end of the product clamping frame 9. At this time, a spacer block 15 and a flat gasket 17 are inserted. Then, two wedge-shaped gaskets 16 are placed close to the rear end of the product clamping frame 9 after their inclined surfaces are aligned. In this way, the gap between the spacer 14 and the rear end of the product clamping frame 9 is filled. Then, the second cylinder 5 is activated to drive the pressure block 6 to move downward. The pressure block 6 applies pressure to the wedge-shaped gasket 16, so that the spacer block 15, the flat gasket 17 and the wedge-shaped gasket 16 do not fall off and maintain pressure on the capacitor chip body 11.

[0053] Start the first cylinder 2 to contract and drive the push rod 301 to exit the product clamping frame 9, then take out the product clamping frame 9 that clamps the capacitor chip body 11 from the positioning block 7 and the limit assembly 8, and flip its opening 90° and place it on the external capacitor chip fixture trolley 19 facing both sides, then place an empty product clamping frame 9 into the positioning block 7 and the limit assembly 8, repeat the above steps to complete the cold pressing process of the same batch of capacitor chip bodies 11. Example

[0054] like Figure 10 As shown, based on the first embodiment, the second cylinder 5 is replaced by a boosting cylinder 20. The output pressure of the boosting cylinder 20 is greater than the output pressure of the first cylinder 2. The output end of the boosting cylinder 20 is connected to the pressure block 6 through a pressure sensor 21 for detecting the pressure applied by the pressure block 6. After the first cylinder 2 applies pressure to the capacitor chip body 11 through the push rod 301 and the partition 14, the boosting cylinder 20 applies pressure to the wedge-shaped gasket 16 through the pressure block 6. The pressure applied by the boosting cylinder 20 is greater than the pressure applied by the first cylinder 2, which can cause the rearmost partition 14 to separate from the push rod 301. At this time, the push rod 301 no longer applies pressure to the capacitor chip body 11. Therefore, after the first cylinder 2 contracts and drives the push rod 301 to exit the product clamping frame 9, the pressure on the capacitor chip body 11 will not change. In this way, the pressure on the capacitor chip body 11 of the same batch can be guaranteed to be uniform, and the product quality will not be uneven due to different pressures, thereby ensuring product quality.

[0055] Preferably, the base 1 is tilted, and one end of the positioning block 7 is lower than the end of the first cylinder 2, so that the partition 14, the cushion block 15, the flat gasket 17 and the kraft paper sheet 18 are not easily collapsed when the operator places them.

[0056] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A cold pressing device for thermal polymerization of thin film capacitors, characterized by: The product clamping frame includes a base and a product clamping frame for clamping the capacitor chip body. A positioning block is provided on the front side of the top of the base, and a limit assembly is provided on the rear side for positioning and placing the product clamping frame. A first cylinder is provided at the rear end of the base, and a push rod is provided at its output end through a slider assembly for applying pressure to the capacitor chip body in the product clamping frame. A bracket is provided on the rear side of the top of the base, and a second cylinder is provided on the bracket. A pressure block is provided at the output end of the second cylinder for applying pressure to the capacitor chip body in the product clamping frame. The product clamping frame is provided with openings on both the upper and lower sides, and a through hole corresponding to the push rod is provided at the rear end thereof, wherein a number of partitions, pads, flat gaskets, kraft paper sheets and two wedge-shaped gaskets are placed, which are used to cooperate with the push rod to apply pressure to the capacitor chip body; A pad is provided on the top of the base to ensure that the end faces of the capacitor chip body are flush when placed in the product clamping frame; The limiting assembly is mainly composed of a flat plate with threaded holes at both ends. L-shaped limiting plates are symmetrically screwed to both ends of the top of the flat plate by screws. The L-shaped limiting plate is provided with waist holes for adjusting its screw-fixing position to adapt to product clamping frames of different widths. The positioning block is fixed to the base by screwing with screws, and the through hole penetrated by the screw is a waist hole, which is used to adjust the screw fixing position to be suitable for product clamping frames of different length specifications.

2. The cold pressing device for thermal polymerization of thin film capacitors according to claim 1, characterized in that: The first cylinder and the second cylinder are respectively provided with a first pressure gauge and a second pressure gauge to monitor their pressures, thereby facilitating adjustment of the output pressures of the first cylinder and the second cylinder.

3. The cold pressing device for thermal polymerization of thin film capacitors according to claim 1, characterized in that: The second cylinder is replaced by a booster cylinder, the output pressure of the booster cylinder is greater than the output pressure of the first cylinder, and the output end of the booster cylinder is connected to the pressure block through a pressure sensor for detecting the pressure applied by the pressure block.

4. The cold pressing device for thermal polymerization of thin film capacitors according to claim 1, characterized in that: The number of through holes at the rear end of the product clamping frame is four and they are distributed in a rectangular shape. The corresponding number of push rods is also four, so that the pressure applied by the push rods is more uniform.

5. The cold pressing device for thermal polymerization of thin film capacitors according to claim 4, characterized in that: The width of the partition is greater than the spacing between the left and right through holes, so that the push rod pushes the partition to apply pressure. The width of the pad, wedge-shaped gasket and flat gasket is less than the spacing between the left and right through holes, so that the push rod can place it between the partition and the rear end of the product clamping frame after applying pressure to the partition.

6. The cold pressing device for thermal polymerization of thin film capacitors according to claim 1, characterized in that: The base is tilted, and one end of the positioning block is lower than the end of the first cylinder, so that the base is not prone to collapse when the operator places the partition, the pad, the flat gasket and the kraft paper.

7. A process for cold pressing a thin film capacitor using the cold pressing device for thermal polymerization of a thin film capacitor according to any one of claims 1 to 6, comprising the following steps: 1) Adjust the pressure of the first and second cylinders according to the specifications of the capacitor chip body so that the push rod and the pressure block can exert pressure on the capacitor chip body without damaging the capacitor chip body; 2) Select a product clamping frame according to the specifications of the capacitor chip body, place its front end in the positioning block, and the rear end in the limit assembly, and adjust the position of the positioning block and the L-shaped limit plate to position and limit the product clamping frame so that the through hole at the rear end of the product clamping frame corresponds to the push rod and the center of its rear end is directly below the pressure block; 3) Place several capacitor chip bodies in sequence from the front end to the back end of the product clamping frame, with the bottom end of the capacitor chip body fitted with the pad. Depending on the size of the capacitor chip body, place a partition between each capacitor chip body, or place a partition between two or more capacitor chip bodies, and place a partition behind the last capacitor chip body. Place kraft paper between the capacitor chip bodies and between the capacitor chip body and the partition, as well as the product clamping frame, to prevent damage to the capacitor chip body when pressure is applied. 4) After placing the capacitor chip body, partition, and kraft paper, start the first cylinder to extend, which drives the push rod to move through the slider assembly. After the push rod passes through the through hole, it presses against the rearmost partition and pushes the partition to press against the capacitor chip body until the partition stops moving. 5) After the push rod applies pressure to the capacitor chip body, there is a gap between the rearmost partition and the rear end of the product clamping frame. At this time, several pads and flat gaskets are placed in, and then two wedge-shaped gaskets are placed close to the rear end of the product clamping frame after the inclined surfaces are aligned. This fills the gap between the partition and the rear end of the product clamping frame. Then, the second cylinder is activated to drive the pressure block downward. The pressure block applies pressure to the wedge-shaped gasket to prevent the pads, flat gaskets and wedge gaskets from falling and maintain pressure on the capacitor chip body. 6) Start the first cylinder to retract and drive the push rod to exit the product clamping frame. Then remove the product clamping frame holding the capacitor chip body from the positioning block and limit assembly, flip its opening 90° and place it on the external capacitor chip fixture with the sides facing each other. Then place an empty product clamping frame into the positioning block and limit assembly, and repeat steps 3) to 5).

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