Electronic devices
By adding a ring shielding base on the printed circuit board and setting solder dots and increasing surface wiring, the problem of large thickness of electronic equipment is solved, the thinning of electronic equipment is achieved, and the risk of short circuit is avoided.
Patent Information
- Application Number
- CN202311525026.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-15
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2043-11-15
AI Technical Summary
Existing electronic equipment is relatively thick and difficult to meet the demand for lightweighting.
By increasing the width of the annular shield base on the printed circuit board and extending it below the support bump, solder dots are provided to increase surface traces and reduce signal line layers, thereby reducing the thickness of the printed circuit board.
It effectively reduces the thickness of electronic equipment, realizes the lightness and thinness of electronic equipment, and avoids the risk of short circuit between the shield cover and the printed circuit board.
Smart Images
Figure CN118475062B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device. Background Art
[0002] With the continuous development of science and technology, more and more electronic devices, such as mobile phones, tablets, laptops, etc., are widely used in people's daily life and work, bringing great convenience to people's daily life and work.
[0003] People have higher and higher requirements not only on the performance of electronic devices such as photography, heat dissipation, and power consumption, but also on the thickness of electronic devices. How to reduce the thickness of electronic devices is an urgent problem to be solved. Summary of the invention
[0004] In order to solve the above technical problems, the present application provides an electronic device that can achieve lightweight and thin electronic devices.
[0005] In a first aspect, an embodiment of the present application provides an electronic device, which includes: a printed circuit board, a plurality of functional devices, a shielding cover and a shell; the printed circuit board includes a first surface and a second surface opposite to each other; the plurality of functional devices are arranged on the first surface and / or the second surface of the printed circuit board and are electrically connected to the printed circuit board; the shielding cover includes a top wall and an annular shielding enclosure, the annular shielding enclosure includes an annular shielding frame and an annular shielding base, the annular shielding base includes a first part and a second part, one end of the annular shielding frame is connected to the top wall, and the other end of the annular shielding frame is connected to the first part; a solder point is arranged between the second part and the printed circuit board, and the shielding cover is welded to the printed circuit board through the solder point, so that the printed circuit board, the top wall and the annular shielding frame form a sealed space, and at least some of the functional devices are located in the sealed space; the shell is located on at least one side of the printed circuit board, and a supporting protrusion is arranged on the surface of the shell facing the printed circuit board; the projection of the second part on the first surface overlaps with the projection of the supporting protrusion on the first surface, and a signal trace is arranged in an area of the preset surface of the printed circuit board corresponding to the first part, and the preset surface of the printed circuit board is the first surface and / or the second surface of the printed circuit board opposite to the supporting protrusion.
[0006] By extending the annular shielding base to the bottom of the supporting protrusion, the width of the annular shielding base is increased, and solder points are set between the partial area of the annular shielding base and the printed circuit board. The surface layer of the printed circuit board corresponding to the area where the solder points are not set can be set with wiring, so that the wiring of the surface layer of the printed circuit board increases. When the wiring of the surface layer of the printed circuit board increases, the printed circuit board does not need to set more signal line layers accordingly. In other words, when the wiring of the surface layer of the printed circuit board increases, the number of signal line layers of the printed circuit board can be reduced, thereby reducing the thickness of the printed circuit board. Exemplarily, when the surface layer of the printed circuit board corresponding to the area where the solder points are not set is not set with wiring, the signal line layer of the printed circuit board is ten layers; when the surface layer of the printed circuit board corresponding to the area where the solder points are not set is set with wiring, the signal line layer of the printed circuit board is eight layers, that is, two signal line layers are reduced, and the thickness of the printed circuit board is reduced from 0.7mm to 0.6mm, which is conducive to reducing the size of the electronic device in the thickness direction.
[0007] Exemplarily, the housing includes a middle plate of a middle frame or a printed circuit board bracket, etc.
[0008] Exemplarily, the plurality of functional devices may be disposed only on the first surface of the printed circuit board; may be disposed only on the second surface of the printed circuit board; or may be disposed partially on the first surface of the printed circuit board and partially on the second surface of the printed circuit board.
[0009] Exemplarily, the housing may be located on one side of the printed circuit board, or on both sides of the printed circuit board.
[0010] Exemplarily, a support protrusion is provided on the surface of the shell facing the printed circuit board. The support protrusion may be provided on the surface of the first surface of the shell facing the printed circuit board; or the support protrusion may be provided on the surface of the second surface of the shell facing the printed circuit board.
[0011] Exemplarily, the signal trace may be arranged in an area of the preset surface of the printed circuit board corresponding to the first part, such that a projection of the area of the first part on the plane where the printed circuit board is located overlaps with the signal trace.
[0012] Exemplarily, the first surface and the second surface are parallel to a plane formed by the X-axis and the Y-axis.
[0013] According to the first aspect, the electronic device further comprises a printed circuit board bracket; the printed circuit board bracket is located on the side of the second surface of the printed circuit board away from the first surface of the printed circuit board, and a support protrusion is arranged on the surface of the printed circuit board bracket facing the printed circuit board; the shell comprises the printed circuit board bracket. That is, the above shell is a printed circuit board bracket in the electronic device. During the falling process of the whole machine, in order to support the printed circuit board and prevent the printed circuit board from breaking and failing during the falling process, the printed circuit board bracket is generally provided with a support protrusion, and the annular shielding base extends to the bottom of the support protrusion, and then a solder point is arranged between the annular shielding base extending to the bottom of the support protrusion and the printed circuit board, so that the position where the solder point was originally arranged can be used to arrange the wiring, so that the wiring on the surface of the printed circuit board is increased.
[0014] Exemplarily, the printed circuit board bracket is used to fix some components on the printed circuit board and / or to carry some components.
[0015] According to the first aspect, or any implementation of the first aspect above, the electronic device further includes a middle frame, the middle frame includes a middle plate; the middle plate is located on the side of the first surface of the printed circuit board away from the second surface of the printed circuit board; the shell includes the middle plate. That is, the shell is the middle plate of the middle frame of the electronic device. During the fall of the whole machine, in order to support the middle plate and prevent the camera from impacting the middle plate and causing the middle plate to deform, thereby affecting the display module and other problems, the middle plate of the middle frame is generally provided with a supporting protrusion, and the annular shielding base extends to the bottom of the supporting protrusion, and then a solder point is set between the annular shielding base extending to the bottom of the supporting protrusion and the printed circuit board. In this way, the position where the solder point was originally set can be used to set the wiring, so that the number of wirings on the surface of the printed circuit board increases.
[0016] According to the first aspect, or any implementation of the first aspect above, the plane where the annular shielding base is located is parallel to the plane where the printed circuit board is located. That is, by controlling the flatness, the plane where the annular shielding base is located is parallel to the plane where the printed circuit board is located, so that the shielding cover can be prevented from contacting other traces in the printed circuit board, thereby causing the risk of short circuit.
[0017] According to the first aspect, or any implementation of the first aspect above, the second part includes a first edge and a second edge, the first edge contacts the edge of the first part, and the second edge is located on the side of the first edge away from the edge of the first part; the second edge is flush with the side of the supporting protrusion.
[0018] In this way, the width of the annular shielding base is larger. When the area where the soldering point is set remains unchanged, more wiring can be set in the area of the printed circuit board corresponding to other areas of the annular shielding base, further reducing the thickness of the printed circuit board.
[0019] Exemplarily, in a direction from the first edge to the second edge, the second edge is flush with a side edge of the supporting protrusion.
[0020] According to the first aspect, or any implementation of the first aspect, the width of the annular shielding base is greater than or equal to 2 mm and less than or equal to 5 mm.
[0021] This arrangement will neither affect the arrangement of other traces on the printed circuit board due to the large width of the annular shielding base, nor prevent the printed circuit board from being unable to reserve more areas for arranging signal traces due to the small width of the annular shielding base.
[0022] According to the first aspect, or any implementation of the first aspect, the width of the second portion is greater than or equal to 0.2 mm and less than or equal to 0.5 mm.
[0023] This arrangement will neither occupy too much area of the printed circuit board due to the larger width of the second portion, thereby hindering the arrangement of other wirings, nor affect the electrical connection performance between the shielding cover and the printed circuit board due to the smaller width of the second portion.
[0024] According to the first aspect, or any implementation of the first aspect, the distance between the surface of the supporting protrusion facing the printed circuit board and the annular shielding base is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.
[0025] Such an arrangement will neither be disadvantageous to the slim design of the electronic device due to the large distance between the surface of the supporting protrusion facing the printed circuit board and the annular shielding base, nor will it cause the shell to contact with the annular shielding base due to the small distance between the surface of the supporting protrusion facing the printed circuit board and the annular shielding base, thereby causing a short circuit.
[0026] According to the first aspect, or any implementation of the first aspect, an insulating structure is provided on the surface of the support protrusion facing the printed circuit board.
[0027] With this arrangement, there is no risk of short circuit between the housing and the annular shielding base even due to process errors or other reasons.
[0028] According to the first aspect, or any implementation of the first aspect, the insulating structure includes an insulating film.
[0029] That is to say, the insulating structure is formed by a coating process, and the process is simple.
[0030] According to the first aspect, or any implementation of the first aspect above, the shielding cover is an integrally formed shielding cover, so that the sealing effect of the sealed space formed by the printed circuit board, the top wall and the annular shielding frame is better, thereby making the shielding effect of the shielding cover better.
[0031] According to the first aspect, or any one of the implementations of the first aspect above, the shielding cover includes a shielding member and a shielding cover buckled on the shielding member, so as to facilitate the preparation of the shielding cover.
[0032] According to the first aspect, or any implementation of the first aspect above, the housing and the support protrusion are integrally formed. Of course, the housing and the support protrusion can also be formed separately and then fixed together by welding or bonding. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 A schematic diagram of the front structure of an electronic device provided in an embodiment of the present application;
[0034] Figure 2 A schematic diagram of the back structure of an electronic device provided in an embodiment of the present application;
[0035] Figure 3 for Figure 2 an exploded view of the electronic device shown;
[0036] Figure 4 for Figure 1 A cross-sectional view of the electronic device shown along the AA' direction;
[0037] Figure 5 for Figure 3 A local magnified image of the middle BB area;
[0038] Figure 6 for Figure 1 Another cross-sectional view of the electronic device shown along the AA' direction;
[0039] Figure 7 for Figure 1 Another cross-sectional view of the electronic device shown along the AA' direction;
[0040] Figure 8 for Figure 1 Another cross-sectional view of the electronic device shown along the AA' direction;
[0041] Fig. 9 A schematic diagram of the structure of a shielding cover provided in an embodiment of the present application;
[0042] Fig.10 for Fig. 9 An exploded view of the shield shown;
[0043] Fig.11A schematic diagram of the structure of another shielding cover provided in an embodiment of the present application;
[0044] Fig.12 for Figure 1 Another cross-sectional view of the electronic device shown along the AA' direction;
[0045] Fig.13 for Figure 1 Another cross-sectional view of the electronic device shown along the AA' direction;
[0046] Fig.14 for Figure 1 Another cross-sectional view of the electronic device shown along the AA' direction;
[0047] Fig.15 A simplified position relationship diagram of the shielding cover, the supporting protrusion and the printed circuit board provided in the embodiment of the present application;
[0048] Fig.16 This is another simplified position relationship diagram of the shielding cover, the supporting protrusion and the printed circuit board provided in the embodiment of the present application. DETAILED DESCRIPTION
[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0050] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.
[0051] The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects rather than to describe a specific order of target objects.
[0052] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.
[0053] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more than two. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.
[0054] The embodiment of the present application provides an electronic device, which may be a mobile phone, a laptop computer, a tablet computer, a personal digital assistant (PDA), a car computer, a television, a smart wearable device, a smart home device, etc. The embodiment of the present application does not specifically limit the specific form of the above electronic device. For the convenience of explanation, the following description takes the electronic device as an example.
[0055] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the front structure of an electronic device provided in an embodiment of the present application is shown. Figure 2 This is a schematic diagram of the back structure of an electronic device provided in an embodiment of the present application. Figure 1 and Figure 2 As shown, the mobile phone 100 includes a display module 10 , a back cover (also called a battery cover) 20 and a middle frame 30 .
[0056] Figure 1 and Figure 2 In the figure, the mobile phone 100 is in the shape of a rectangular flat plate. In order to facilitate the clear description of the subsequent structural features and the positional relationship of the structural features, the positional relationship of the various structures in the mobile phone is specified in the X-axis direction, the Y-axis direction and the Z-axis direction, wherein the X-axis direction is the width direction of the mobile phone, the Y-axis direction is the length direction of the mobile phone, and the Z-axis direction is the thickness direction of the mobile phone. It can be understood that the coordinate system (i.e., the X-axis, Y-axis and Z-axis) of the electronic device can be flexibly set according to actual needs, and no specific limitation is made here. In other optional embodiments, the shape of the electronic device can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc. Of course, the electronic device can also be a foldable electronic device, etc.
[0057] See also Figure 3 , Figure 3 for Figure 2 An exploded view of the electronic device shown, wherein Figure 3 Only part of the structure of the electronic device is shown, and not all of the structure is shown. Along the Z-axis direction, the display module 10 and the back cover 20 are arranged opposite to each other, and the middle frame 30 is located between the display module 10 and the back cover 20. The middle frame 30 includes an annular appearance part 31 exposed to the outside and a middle plate 32 located inside the annular appearance part 31 and between the display module 10 and the back cover 20. The display module 10, the annular appearance part 31 and the back cover 20 can enclose a receiving cavity.
[0058] See also Figure 4 , Figure 4 for Figure 1 A cross-sectional view of the electronic device shown in FIG. Figure 4 As shown, the accommodating cavity is provided with a middle plate 32, a battery 40, a printed circuit board (PCB) 50, a printed circuit board bracket 80, a functional device 60 and other structures. Along the Z-axis direction, the middle plate 32 includes a first surface 321 and a second surface 322, and the second surface 322 is located on the side of the first surface 321 away from the display module 10. The middle plate 32 is used to support at least part of the structure in the accommodating cavity. For example, the display module 10 is provided on the first surface 321 of the middle plate 32 by adhesive, etc., and the display module 10 and the like are supported by the first surface 321 of the middle plate 32.
[0059] Combination Figure 3 The second surface 322 of the middle plate 32 is divided into at least a battery setting area 322a and a PCB setting area 322b. The second surface 322 of the middle plate 32 is partially raised to form a battery compartment 41 arranged around the battery 40. The battery compartment 41 is located in the battery setting area 322a. Along the Z-axis direction, the PCB 50 is opposite to the PCB setting area 322b, that is, the projection of the PCB 50 on the second surface 322 overlaps with the PCB setting area 322b.
[0060] See also Figure 5 , Figure 5 for Figure 3 A partial enlarged view of the BB area. Figure 3-Figure 5 As shown, the second surface 322 of the middle plate 32 is provided with a support protrusion 3221 (in order to distinguish the support protrusion 81 in the following content, the support protrusion 3221 on the middle plate 32 may also be referred to as the first support protrusion 3221). The first support protrusion 3221 at least surrounds the four sides of the camera. The first support protrusion 3221 is used to support the periphery of the camera to prevent the camera from impacting the middle plate 32 during the whole device falling, causing the middle plate 32 to deform. The deformation of the middle plate 32 may affect the display module 10 arranged on the middle plate 32, thereby causing display problems.
[0061] It should be noted that the first supporting protrusion 3221 can be integrally formed with the middle plate 32 or can be separately formed, which is not limited in the embodiment of the present application.
[0062] Continue to see Figure 4, along the Z-axis direction, the PCB 50 includes a first surface 51 and a second surface 52 facing each other, and the second surface 52 of the PCB 50 is located on the side of the first surface 51 of the PCB 50 away from the second surface 322 of the middle plate 32. The functional device 60 includes a first functional device and a second functional device. The first functional device can be arranged on the first surface 51 and / or the second surface 52 of the PCB 50 and is electrically connected to the PCB 50, and the second functional device may not be arranged on the PCB 50, but is electrically connected to the PCB 50. The first functional device may include a processor, a radio frequency integrated circuit (RFIC), a radio frequency front end module (RFFEM), and a display driver chip (a chip for driving the display module 10 to display). The second functional device may include a camera and other devices. Of course, the functional device 60 may also include only the first functional device; or, only the second functional device.
[0063] PCB 50 includes N signal line layers, where N is a positive integer greater than or equal to 2, and each signal line layer includes a plurality of signal lines. The first functional device can be soldered to PCB 50 through a solder point and electrically connected to different signal lines in PCB 50. The second functional device can be electrically connected to different signal lines in PCB 50 through a flexible printed circuit (FPC). In some embodiments, a board to board connector (BTB) is provided between the FPC and PCB 50, and the FPC is electrically connected to the PCB 50 through the BTB. That is to say, the devices in the electronic device are electrically connected through the signal lines in each signal line layer of PCB 50, thereby realizing signal transmission and interaction.
[0064] Along the Z-axis direction, the printed circuit board bracket 80 is located on the side of the PCB 50 away from the middle plate 32. The printed circuit board bracket 80 is used to fix some devices on the PCB 50 and / or to carry some devices. A support protrusion 81 is provided on the surface of the printed circuit board bracket 80 facing the PCB 50 (in order to distinguish the support protrusion 3221 in the above content, the support protrusion 81 on the printed circuit board bracket 80 can also be referred to as the second support protrusion 81). The second support protrusion 81 is used to support the PCB 50 during the whole machine falling process to prevent the PCB 50 from breaking and failing during the falling process.
[0065] It should be noted that the second supporting protrusion 81 can be integrally formed with the printed circuit board bracket 80, or can be separately formed, which is not limited in the embodiment of the present application.
[0066] Understandably, Figure 1-Figure 4 The following figures and the related drawings only schematically show some components included in the mobile phone 100. The actual mobile phone 100 may have more or fewer components than those shown in the figures, or some components may be combined, or some components may be separated, or the components may be arranged differently. The components shown in the figures may be implemented in hardware, software, or a combination of software and hardware.
[0067] In one scenario, the device in the first functional component (such as RFIC, etc.) may be interfered by external interference signals and interference signals emitted by adjacent devices, thereby affecting its normal operation. In order to shield external interference signals, see Figure 6 , Figure 6 for Figure 1 Another cross-sectional view of the electronic device along the AA' direction is shown. Figure 6 As shown, a shielding cover 70 can be provided on the PCB 50. Specifically, the shielding cover 70 includes a top wall 71 and an annular shielding enclosure 72. The annular shielding enclosure 72 includes an annular shielding frame 721 and an annular shielding base 722. The plane where the top wall 71 is located can be parallel to the plane formed by the X-axis and the Y-axis, and the annular shielding frame 721 is arranged around the top wall 71 and is perpendicular to the plane where the top wall 71 is located. The annular shielding base 722 is connected to the annular shielding frame 721, and the annular shielding base 722 is arranged around the annular shielding frame 721, and the plane where the annular shielding base 722 is located can be parallel to the plane formed by the X-axis and the Y-axis. The annular shielding base 722 is welded to the PCB 50 through solder points, and then the shielding cover 70 is welded and fixed to the PCB 50, so that the PCB 50, the top wall 71 and the annular shielding frame 721 form a sealed space, and the device that needs to shield other signal interference is arranged in the sealed space. Since the shielding cover 70 is electrically connected to the PCB 50 through the solder joints, the shielding signal sent from other devices can be received through the PCB 50 to shield the interference of other signals on the devices located in the shielding cover 70 .
[0068] It should be noted that the above description is based on the example that the device that needs to be provided with the shielding cover 70 is provided on the first surface 51 of the PCB 50, but it does not constitute a limitation of the present application. Figure 7 , Figure 7 for Figure 1 Another cross-sectional view of the electronic device along the AA' direction is shown. Figure 7 As shown, the device that needs to be provided with the shielding cover 70 can also be provided on the second surface 52 of the PCB 50. Alternatively, see Figure 8 , Figure 8 for Figure 1 Another cross-sectional view of the electronic device along the AA' direction is shown. Figure 8As shown, components requiring shielding covers 70 are disposed on both the first surface 51 and the second surface 52 of the PCB 50 .
[0069] As for the specific structure of the shielding cover 70 , the embodiment of the present application does not limit the specific structure of the shielding cover 70 .
[0070] For a possible implementation, see Fig. 9 and Fig.10 , Fig. 9 A schematic diagram of the structure of a shielding cover provided in an embodiment of the present application is shown in FIG. Fig.10 for Fig. 9 An exploded view of the shield is shown in Figure 1. Fig. 9 and Fig.10 As shown, the shielding cover 70 includes a shielding member 70a and a shielding cover 70b buckled on the shielding member 70a, and the shielding member 70a and the shielding cover 70b together constitute the shielding cover 70. That is, the shielding member 70a and the shielding cover 70b are formed separately, so that the preparation of the shielding cover 70 is convenient.
[0071] For a possible implementation, see Fig.11 , Fig.11 This is a schematic diagram of the structure of another shielding cover provided in an embodiment of the present application. Fig.11 As shown, the shielding cover 70 is an integrated structure, so that the sealing effect of the sealed space formed by the PCB 50, the top wall 71 and the annular shielding frame 721 is better, thereby making the shielding effect of the shielding cover 70 better.
[0072] It should be noted that the embodiments of the present application are described by taking the example that the shielding cover 70 includes a shielding member 70a and a shielding cover 70b buckled on the shielding member 70a.
[0073] In order to achieve thinner and lighter electronic devices, in one example, see Fig.12 , Fig.12 for Figure 1 Another cross-sectional view of the electronic device along the AA' direction is shown. Fig.12As shown, a shielding cover 70 is disposed on the first surface 51 of the PCB 50, and the shielding cover 70 is disposed adjacent to the first supporting protrusion 3221 on the middle plate 32. The annular shielding base 722 includes a first portion 7221 and a second portion 7222. One end of the annular shielding frame 721 is connected to the top wall 71, the other end of the annular shielding frame 721 is connected to one end of the first portion 7221, and the other end of the first portion 7221 is connected to the second portion 7222. A solder point is disposed between the second portion 7222 and the PCB 50, and the shielding cover 70 is soldered to the PCB 50 through the solder point, so that a sealed space is enclosed by the PCB 50, the top wall 71 and the annular shielding frame 721. The projection of the second part 7222 on the plane formed by the X-axis and the Y-axis overlaps with the projection of the first supporting protrusion 3221 on the middle plate 32 on the plane formed by the X-axis and the Y-axis. That is, by extending a partial area of the annular shielding base 722 to below the first supporting protrusion 3221, a signal routing can be set in the area of the first surface 51 of the PCB 50 corresponding to the first part 7221 of the annular shielding base 722.
[0074] It is understandable that the area of the first surface 51 of the PCB 50 corresponding to the first part 7221 of the annular shielding base 722 is the area where the projection of the first part 7221 of the annular shielding base 722 on the first surface 51 of the PCB 50 is located. The following examples are the same and will not be repeated.
[0075] For another example, see Fig.13 , Fig.13 for Figure 1 Another cross-sectional view of the electronic device along the AA' direction is shown. Fig.13 As shown, a shielding cover 70 is disposed on the second surface 52 of the PCB 50, and the shielding cover 70 is disposed adjacent to the second supporting protrusion 81 on the printed circuit board bracket 80. The annular shielding base 722 includes a first portion 7221 and a second portion 7222, one end of the annular shielding frame 721 is connected to the top wall 71, the other end of the annular shielding frame 721 is connected to one end of the first portion 7221, and the other end of the first portion 7221 is connected to the second portion 7222. A solder point is disposed between the second portion 7222 and the PCB 50, and the shielding cover 70 is welded to the PCB 50 through the solder point, so that the PCB 50, the top wall 71 and the annular shielding frame 721 form a sealed space. The projection of the second part 7222 on the plane formed by the X-axis and the Y-axis overlaps with the projection of the second supporting protrusion 81 on the printed circuit board bracket 80 on the plane formed by the X-axis and the Y-axis. That is, by extending a partial area of the annular shielding base 722 to the bottom of the second supporting protrusion 81, a signal routing can be set in the area of the second surface 52 of the PCB 50 corresponding to the first part 7221 of the annular shielding base 722.
[0076] It is understandable that the area of the second surface 52 of the PCB 50 corresponding to the first part 7221 of the annular shielding base 722 is the area where the projection of the first part 7221 of the annular shielding base 722 on the second surface 52 of the PCB 50 is located. The following examples are the same and will not be repeated.
[0077] In one example, Fig.14 for Figure 1 Another cross-sectional view of the electronic device along the AA' direction is shown. Fig.14 As shown, a shielding cover 70 is disposed on the first surface 51 of the PCB 50, and the shielding cover 70 is disposed adjacent to the first supporting protrusion 3221 on the middle plate 32; and a shielding cover 70 is also disposed on the second surface 52 of the PCB 50, and the shielding cover 70 is disposed adjacent to the second supporting protrusion 81 on the printed circuit board bracket 80. For the purpose of distinction, the shielding cover 70 disposed on the first surface 51 of the PCB 50 is a first shielding cover, and the shielding cover 70 disposed on the second surface 52 of the PCB 50 is a second shielding cover.
[0078] The annular shielding base 722 includes a first portion 7221 and a second portion 7222. One end of the annular shielding frame 721 is connected to the top wall 71, the other end of the annular shielding frame 721 is connected to one end of the first portion 7221, and the other end of the first portion 7221 is connected to the second portion 7222. A solder point is provided between the second portion 7222 and the PCB 50, and the shielding cover 70 is soldered to the PCB 50 through the solder point, so that the PCB 50, the top wall 71 and the annular shielding frame 721 form a sealed space. The projection of the second portion 7222 of the first shielding cover on the plane formed by the X-axis and the Y-axis overlaps with the projection of the first supporting protrusion 3221 on the middle plate 32 on the plane formed by the X-axis and the Y-axis, that is, by extending a part of the annular shielding base 722 to below the first supporting protrusion 3221, a signal line can be provided in the area of the first surface 51 of the PCB 50 corresponding to the first portion 7221 of the annular shielding base 722. The projection of the second part 7222 of the second shielding cover on the plane formed by the X-axis and the Y-axis overlaps with the projection of the second supporting protrusion 81 on the printed circuit board bracket 80 on the plane formed by the X-axis and the Y-axis. That is, by extending a partial area of the annular shielding base 722 to below the second supporting protrusion 81, a signal routing can be set in the area of the second surface 52 of the PCB 50 corresponding to the first part 7221 of the annular shielding base 722.
[0079] It can be seen from the above three examples that by extending the annular shielding base 722 to below the first supporting protrusion 3221 and / or the second supporting protrusion 81, and then setting a solder point between the annular shielding base 722 extending below the supporting protrusion and the PCB 50, the position where the solder point is originally set (such as Figure 6-Figure 8 As shown in FIG. 5 , signal routing can be arranged so that the number of routings on the surface layer of PCB 50 increases. When the number of routings on the surface layer of PCB 50 increases, accordingly, PCB 50 does not need to arrange more signal line layers. In other words, when the number of routings on the surface layer of PCB 50 increases, when the number of signal lines in PCB 50 needs to remain unchanged, the number of signal line layers of PCB 50 can be reduced, thereby reducing the thickness of PCB 50.
[0080] Exemplarily, when no routing is set on the surface layer of PCB 50 corresponding to the area where no solder point is set (such as the first part 7221), the signal line layer of PCB 50 is ten layers; when routing is set on the surface layer of PCB50 corresponding to the area where no solder point is set (such as the first part 7221), the signal line layer of PCB 50 is eight layers, that is, two signal line layers are reduced, and the thickness gain of PCB 50 can be reduced from 0.7 mm to 0.6 mm, which is beneficial to reducing the size of the electronic device in the thickness direction (that is, the Z-axis direction).
[0081] In order to further reduce the thickness of the PCB 50, see Fig.15 , Fig.15 A simplified position relationship diagram of the shielding cover, the support protrusion and the printed circuit board provided in the embodiment of the present application. Fig.12 and Fig.15 As shown, the second portion 7222 of the annular shielding base 722 includes a first edge 7222a and a second edge 7222b, wherein the first edge 7222a contacts the edge of the first portion 7221, and the second edge 7222b is located on the side of the first edge 7222a away from the edge of the first portion 7221; the second edge 7222b is in contact with the support protrusion (such as Fig.12 The sides of the first support protrusion 3221) shown are flush.
[0082] With this arrangement, when the area where the solder point is set remains unchanged, more traces can be set in the area of PCB 50 corresponding to other areas of the annular shielding base 722 (such as the first part 7221), thereby increasing the traces on the surface of PCB 50, which is beneficial to further reduce the thickness of PCB 50.
[0083] In actual application, when the width of the annular shielding base 722 is relatively wide, the first part 7221 of the annular shielding base 722 is in a suspended state, and due to the effect of gravity, the first part 7221 of the annular shielding base 722 may collapse in the direction toward the PCB 50, causing the first part 7221 to contact other signal traces in the PCB 50, thereby causing the risk of short circuit. In the embodiment of the present application, through plane control, the plane where the annular shielding base 722 is located is parallel to the plane where the PCB 50 is located. In this way, the first part 7221 can be prevented from contacting other signal traces in the PCB 50, thereby causing the risk of short circuit.
[0084] Continue to see Fig.15 , the width W1 of the annular shielding base 722 is not limited in the embodiment of the present application. In a possible implementation, the width W1 of the annular shielding base 722 is greater than or equal to 1.2 mm and less than or equal to 10 mm. Exemplarily, the width W1 of the annular shielding base 722 may include 1.2 mm, 5 mm, 8 mm, or 10 mm.
[0085] Further, the width W1 of the annular shielding base 722 is greater than or equal to 2 mm and less than or equal to 5 mm. Exemplarily, the width W1 of the annular shielding base 722 may include 2 mm, 3 mm, 4 mm or 5 mm.
[0086] In this way, the arrangement of other wirings on the PCB 50 will not be affected due to the larger width W1 of the annular shielding base 722, and a short circuit will not be caused by the contact between the annular shielding base 722 and the PCB 50. Also, the PCB 50 will not be unable to reserve more areas (the area corresponding to the first part 7221) for setting signal wiring due to the smaller width of the annular shielding base 722.
[0087] Continue to see Fig.15 , the width W2 of the second portion 7222 is not limited in the present embodiment. In a possible implementation, the width W2 of the second portion 7222 is greater than or equal to 0.2 mm and less than or equal to 0.5 mm. Exemplarily, the width W2 of the second portion 7222 includes 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm.
[0088] This arrangement will neither occupy too much area of the PCB 50 due to the larger width W2 of the second portion, thereby preventing the arrangement of other traces, nor will it affect the electrical connection performance between the shielding cover 70 and the PCB 50 due to the smaller width W2 of the second portion.
[0089] Continue to see Fig.15, for the closest distance W3 between the annular shielding frame 721 and the side of the supporting protrusion (the first supporting protrusion 3221 and / or the second supporting protrusion 81), the embodiment of the present application does not limit the closest distance W3 between the annular shielding frame 721 and the side of the supporting protrusion. In a possible implementation, the closest distance W3 between the annular shielding frame 721 and the side of the supporting protrusion is greater than or equal to 0.3mm, and less than or equal to 0.8mm. Exemplarily, the closest distance W3 between the annular shielding frame 721 and the side of the supporting protrusion may include 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm or 0.8mm.
[0090] This arrangement will neither affect the arrangement of other components on the PCB 50 due to the large distance W3 between the annular shielding frame 721 and the side of the supporting protrusion, nor will the shielding cover 70 contact the supporting protrusion due to the small distance W3 between the annular shielding frame 721 and the side of the supporting protrusion, thereby causing a short circuit.
[0091] Continue to see Fig.15 When the shielding cover 70 is disposed on the first surface 51 of the PCB 50, the distance W4 between the top wall 71 and the middle plate 32 is not limited in the embodiment of the present application. In a possible implementation, the distance W4 between the top wall 71 and the middle plate 32 is greater than or equal to 0.15 mm. Exemplarily, the distance W4 between the top wall 71 and the middle plate 32 may include 0.15 mm, 0.2 mm, 0.25 mm, or 0.3 mm.
[0092] When the shielding cover 70 is disposed on the second surface 52 of the PCB 50, the distance W4 between the top wall 71 and the printed circuit board bracket 80 is not limited in the embodiment of the present application. In a possible implementation, the distance W4 between the top wall 71 and the printed circuit board bracket 80 is greater than or equal to 0.15 mm. Exemplarily, the distance W4 between the top wall 71 and the printed circuit board bracket 80 may include 0.15 mm, 0.2 mm, 0.25 mm or 0.3 mm.
[0093] Continue to see Fig.15 , the gap W5 between the annular shielding base 722 and the PCB 50 is not limited in the embodiment of the present application. Exemplarily, the gap W5 between the annular shielding base 722 and the PCB 50 can be 0.05 mm or the like.
[0094] Continue to see Fig.15, for the distance W6 between the surface of the support protrusion facing the PCB 50 side and the annular shielding base 722, the embodiment of the present application does not limit the distance W6 between the surface of the support protrusion facing the PCB 50 side and the annular shielding base 722. In a possible implementation, the distance W6 between the surface of the support protrusion facing the PCB 50 side and the annular shielding base 722 is greater than or equal to 0.1mm, and less than or equal to 0.3mm. Exemplarily, the distance between the surface of the support protrusion facing the printed circuit board side and the annular shielding base includes 0.1mm, 0.2mm or 0.3mm.
[0095] Such a configuration will neither be detrimental to the slim design of the electronic device due to the large distance between the surface of the support protrusion facing the PCB 50 side and the annular shielding base 722, nor will it cause the risk of a short circuit due to the small distance between the surface of the support protrusion facing the PCB 50 side and the annular shielding base 722, causing the support protrusion to contact the annular shielding base 722.
[0096] Further, in order to avoid the contact between the supporting protrusion and the annular shielding base 722 due to process errors, etc., see Fig.16 , Fig.16 This is another simplified position relationship diagram of the shielding cover, the support protrusion and the printed circuit board provided in the embodiment of the present application. Fig.16 As shown, an insulating structure 90 is provided on the surface of the support protrusion facing the PCB 50. In this way, even if there is a process error or the like, there is no risk of short circuit between the support protrusion and the annular shielding base 722.
[0097] Exemplarily, the insulating structure 90 includes an insulating film, that is, the insulating structure 90 is formed by a coating process, so that the process of forming the insulating structure 90 is simple and low in cost.
[0098] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. An electronic device, characterized in that: include: Printed circuit boards; The printed circuit board comprises a first surface and a second surface opposite to each other; Multiple functional devices; A plurality of the functional devices are arranged on the first surface and / or the second surface of the printed circuit board and are electrically connected to the printed circuit board; A shielding cover; the shielding cover comprises a top wall and an annular shielding enclosure, the annular shielding enclosure comprises an annular shielding frame and an annular shielding base, the annular shielding base comprises a first part and a second part, one end of the annular shielding frame is connected to the top wall, and the other end of the annular shielding frame is connected to the first part; a soldering point is provided between the second part and the printed circuit board, and the shielding cover is welded to the printed circuit board through the soldering point, so that the printed circuit board, the top wall and the annular shielding frame enclose a sealed space, and at least part of the functional device is located in the sealed space; A housing; the housing is located on at least one side of the printed circuit board, and a support protrusion is provided on the surface of the housing facing the printed circuit board; The projection of the second part on the first surface overlaps with the projection of the supporting protrusion on the first surface, and a signal trace is arranged in an area of the preset surface of the printed circuit board corresponding to the first part, so as to reduce the number of signal line layers of the printed circuit board and thereby reduce the thickness of the printed circuit board; the preset surface of the printed circuit board is the first surface and / or the second surface of the printed circuit board opposite to the supporting protrusion.
2. The electronic device according to claim 1, characterized in that: The electronic device further comprises a printed circuit board bracket; the printed circuit board bracket is located on a side of the second surface of the printed circuit board away from the first surface of the printed circuit board, and a supporting protrusion is arranged on a surface of the printed circuit board bracket facing the printed circuit board; The housing includes a printed circuit board support.
3. The electronic device according to claim 1, characterized in that: The electronic device further comprises a middle frame, wherein the middle frame comprises a middle plate; the middle plate is located on a side of the first surface of the printed circuit board away from the second surface of the printed circuit board, and a support protrusion is arranged on a surface of the middle plate facing the printed circuit board; The housing includes a middle plate.
4. The electronic device according to claim 1, characterized in that: The electronic device further comprises a printed circuit board bracket; the printed circuit board bracket is located on a side of the second surface of the printed circuit board away from the first surface of the printed circuit board, and a supporting protrusion is arranged on a surface of the printed circuit board bracket facing the printed circuit board; The electronic device further comprises a middle frame, wherein the middle frame comprises a middle plate; the middle plate is located on a side of the first surface of the printed circuit board away from the second surface of the printed circuit board, and a support protrusion is arranged on a surface of the middle plate facing the printed circuit board; The housing includes a printed circuit board bracket and a middle plate.
5. The electronic device according to any one of claims 1 to 4, characterized in that: The plane where the annular shielding base is located is parallel to the plane where the printed circuit board is located.
6. The electronic device according to any one of claims 1 to 4, characterized in that: The second portion includes a first edge and a second edge, the first edge is in contact with the edge of the first portion, and the second edge is located on a side of the first edge away from the edge of the first portion; The second edge is flush with the side edge of the supporting protrusion.
7. The electronic device according to any one of claims 1 to 4, characterized in that: The width of the annular shielding base is greater than or equal to 2 mm and less than or equal to 5 mm.
8. The electronic device according to any one of claims 1 to 4, characterized in that: The width of the second portion is greater than or equal to 0.2 mm and less than or equal to 0.5 mm.
9. The electronic device according to any one of claims 1 to 4, characterized in that: The distance between the surface of the supporting protrusion facing the printed circuit board and the annular shielding base is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.
10. The electronic device according to any one of claims 1 to 4, characterized in that: An insulating structure is arranged on the surface of the supporting protrusion facing the printed circuit board.
11. The electronic device according to claim 10, characterized in that: The insulating structure includes an insulating film.
12. The electronic device according to any one of claims 1 to 4, characterized in that: The shielding cover is an integrally formed shielding cover.
13. The electronic device according to any one of claims 1 to 4, characterized in that: The shielding case comprises a shielding member and a shielding cover buckled on the shielding member.
14. The electronic device according to any one of claims 1 to 4, characterized in that: The shell and the supporting protrusion are integrally formed.