Diamond uniform arrangement forming device

Abstract

The present invention relates to a short-spacing diamond uniform arrangement forming device; the device comprises a diamond particle distribution component; the distribution component comprises a diamond particle adsorption mechanism, a diamond vibration flattening device, and a servo electric cylinder; the diamond vibration flattening device is arranged below the diamond particle adsorption mechanism to flatten the diamond particles in the material tray; the diamond particle adsorption mechanism comprises a diamond uniform arrangement adsorption device and an adsorption tube; the diamond uniform arrangement adsorption device comprises an arrangement locking plate A and an arrangement locking plate B respectively; the arrangement locking plate A and the arrangement locking plate B are respectively provided with fixed hole arrays A and fixed hole arrays B with different arrangements; the adsorption tube comprises an adsorption tube A and an adsorption tube B, which respectively pass through the fixed hole array A and the fixed hole array B. The adsorption tube A and the adsorption tube B successively release diamond particles at the female mold cavity according to the process requirements, and the formed diamond arrangement is denser than the arrangement of the adsorption tube A / adsorption tube B, thereby improving the cutting performance of the diamond tool head.

Description

Technical Field

[0001] The invention relates to the technical field of diamond bit manufacturing, in particular to a diamond uniform arrangement molding device. Background Art

[0002] The diamond cutter head is mainly connected to the substrate by welding methods such as silver welding or laser welding. Diamond particles are wrapped inside the diamond cutter head to increase the cutting performance. The diamond particles in the diamond cutter head in the prior art are arranged in an orderly manner in the working layer according to a certain rule. For example, a diamond cutter head in the utility model patent with the authorization announcement number CN208215691U discloses a similar diamond cutter head. In order to manufacture this kind of diamond cutter head, the prior art also specially designs a diamond particle distribution device for the arrangement of diamond particles. For example, the invention patent with the authorization announcement number CN112974800B provides a diamond particle distribution device for the arrangement of diamond particles. In the actual production process, the fixing holes on the arrangement locking plate in the technical solution are arranged in a single orderly manner, and it is impossible to achieve a product with multiple diamonds arranged in an orderly manner, and the fixing holes are difficult to further increase after reaching a certain density limit; this leads to the arrangement density of diamond particles in the working layer being limited, and the cutting performance of the diamond cutter head reaches a bottleneck. Summary of the invention

[0003] The purpose of the present invention is to solve the above problems and provide a diamond uniform arrangement forming device.

[0004] The technical scheme of the present invention is: a diamond uniform arrangement forming device, which is arranged on both sides of a stamping platform; the stamping platform is provided with a female mold cavity and a male mold that match each other; the device includes a diamond particle distribution component symmetrically arranged relative to the stamping platform; the diamond particle distribution component includes a diamond particle adsorption mechanism, a diamond vibration flattening device, and a servo electric cylinder that drives the diamond particle adsorption mechanism to move horizontally back and forth above the female mold cavity; the diamond particle distribution component has realized its function in various forms in the prior art, such as the one disclosed in the authorization announcement number CN112974800B A diamond particle distribution device; a diamond vibration flattening device is arranged below the diamond particle adsorption mechanism, and the top surface carries diamond particles; the diamond particle adsorption mechanism includes a diamond uniform arrangement adsorption device and an adsorption tube arranged on both sides of the stamping platform; the diamond uniform arrangement adsorption devices arranged on both sides of the stamping platform are respectively an arrangement locking plate A and an arrangement locking plate B; the arrangement locking plate A and the arrangement locking plate B are respectively provided with fixed hole arrays A and fixed hole arrays B with different arrangements; the adsorption tube includes an adsorption tube A and an adsorption tube B, which pass through the fixed hole array A and the fixed hole array B respectively.

[0005] Preferably, a cleaning box is provided between the diamond particle distribution assembly and the stamping platform; the width of the cleaning box is equivalent to the arrangement range of the male mold; an upward cleaning sponge is provided in the cleaning box; and the upper end surface of the cleaning sponge is not lower than the bottom end of the adsorption tube.

[0006] Furthermore, there are four cleaning boxes, which are symmetrically arranged on both sides of the stamping platform; the cleaning boxes on the same side are arranged along the direction of the servo electric cylinder; and the cleaning sponges on the same side are arranged close to each other.

[0007] Furthermore, the cleaning box is also provided with a collecting notch which horizontally penetrates the cleaning box; the position of the collecting notch corresponds to the position of the male mold.

[0008] Preferably, the diameters of adsorption tube A and adsorption tube B are different; and the sizes of diamond particles carried on the top surface of the corresponding diamond vibration flattening device are correspondingly different.

[0009] Preferably, the diamond particle adsorption mechanism also includes a vertical lifting cylinder for driving the diamond uniformly arranged adsorption device and the adsorption tube to vertically lift and lower.

[0010] Furthermore, the shape of the locking plate A and the shape of the locking plate B are arranged to match the shape of the male mold.

[0011] The beneficial effects of the present invention are as follows: the diamond uniform arrangement forming device of the present invention has the following advantages:

[0012] (1) The present invention arranges the diamond particle distribution components symmetrically on both sides of the stamping platform; and the adsorption tubes A and B on both sides of the stamping platform are arranged according to different rules; thus, the adsorption tubes A and B release the diamond particles successively above the female mold cavity, and the resulting diamond arrangement density is significantly greater than the arrangement density of the adsorption tubes A and B, thereby improving the cutting performance and product service life of the diamond bit;

[0013] (2) The cleaning box of the present invention is used to clean and collect the excess diamond particles at the bottom of the adsorption tube; the cleaning sponges on the same side are arranged close to each other; during the reciprocating movement of the diamond particle adsorption mechanism, the cleaning sponge can push the excess diamond particles at the bottom of the adsorption tube into the box body of the cleaning box;

[0014] (3) The adsorption tube A and the adsorption tube B of the present invention have different calibers, so they can adsorb diamond particles of different particle sizes; the corresponding diamond particle sizes carried on the top surface of the diamond vibration flattening device are different, and are used to feed diamond particles of different particle sizes. In this way, diamond particles of different particle sizes can be arranged on the working layer of the diamond cutter head, and its cutting performance can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a working diagram of the diamond uniform arrangement forming device of the present invention. Figure 1 ;

[0016] Figure 2 yes Figure 1 I magnified view of;

[0017] Figure 3 This is a working diagram of the diamond uniform arrangement forming device of the present invention. Figure 2 ;

[0018] Figure 4 yes Figure 3 II enlarged view;

[0019] Figure 5 yes Figure 1 The main view;

[0020] Figure 6 yes Figure 5 AA section view;

[0021] Figure 7 is a stereogram of a diamond particle cloth assembly;

[0022] Figure 8 yes Figure 7 A vertical cross-sectional view of

[0023] Fig. 9 yes Figure 8 BB cross-sectional view;

[0024] In the figure: 0. stamping platform, 01. male mold, 1. diamond particle distribution component, 11. diamond particle adsorption mechanism, 111. diamond uniform arrangement adsorption device, 1111. arrangement locking plate A, 11111. fixed hole array A, 1112. arrangement locking plate B, 11121. fixed hole array B, 112. adsorption tube, 1121. adsorption tube A, 1122. adsorption tube B, 113. vertical lifting cylinder, 114. negative pressure box, 1141. negative pressure chamber, 1142. cylinder sleeve, 1143. negative pressure tube, 115. hydraulic motor, 1151. screw, 116. pillar, 12. diamond vibration flattening device, 121. vibrator, 13. servo electric cylinder, 2. cleaning box, 21. cleaning sponge, 22. collection gap. Implementation

[0025] Example 1: See Figure 1-9A diamond uniform arrangement forming device is arranged on both sides of a stamping platform 0; a diamond cutter head is stamped on the stamping platform 0; a female mold cavity and a male mold 01 are provided on the stamping platform 0, which match each other; the female mold cavity and the male mold 01 match the shape of the diamond cutter head to be stamped; the device includes a diamond particle distribution component 1 symmetrically arranged relative to the stamping platform 0; the diamond particle distribution component 1 includes a diamond particle adsorption mechanism 11, a diamond vibration flattening device 12, and a servo electric cylinder 13 that drives the diamond particle adsorption mechanism 11 to move horizontally back and forth above the female mold cavity; the servo electric cylinder 13 selected in this embodiment is a pneumatic rod; the diamond vibration flattening device 12 and the female mold cavity are respectively provided with The pneumatic rod is famous for its quick response. The pneumatic rod is used in this embodiment to speed up the production rhythm and improve the production efficiency. The diamond particle distribution component 1 has realized its function in various forms in the prior art, such as the diamond particle distribution device disclosed in the authorization announcement number CN112974800B. The diamond vibration flattening device 12 is arranged below the diamond particle adsorption mechanism 11, and the top surface carries diamond particles. The diamond vibration flattening device 12 is provided with a vibrator 121, which is used to make the diamond particles move back and forth in the diamond vibration flattening device 12 to ensure that the diamond particle adsorption mechanism 11 can be successfully adsorbed every time. The particle adsorption mechanism 11 includes a diamond uniformly arranged adsorption device 111 and an adsorption tube 112 arranged on both sides of the stamping platform 0; the diamond uniformly arranged adsorption devices 111 arranged on both sides of the stamping platform 0 are respectively arranged and locked plates A 1111 and arranged and locked plates B 1112, which are respectively arranged on both sides of the stamping platform 0; the arranged and locked plates A 1111 and arranged and locked plates B 1112 are respectively provided with fixed hole arrays A 11111 and fixed hole arrays B 11121 arranged in different arrangements; the adsorption tube 112 includes an adsorption tube A 1121 and an adsorption tube B 1122, which respectively pass through the fixed hole arrays A 11111 and the fixed hole arrays B 11121; the adsorption tube A 1121 and the adsorption tube B 1122 are respectively extended from the fixed hole arrays A 11111 and the fixed hole arrays B 11121; the adsorption tube A 1121 and the adsorption tube B 1122 are respectively extended and locked. 122 are used to absorb the diamond particles on both sides of the stamping platform 0 respectively; the fixed hole array A 11111 and the fixed hole array B 11121 make the diamond particles absorbed by the adsorption tube A 1121 and the diamond particles absorbed by the adsorption tube B 1122 arranged according to different rules; the servo electric cylinder 13 delivers the diamond particle adsorption mechanism 11 on both sides of the stamping platform 0 to the top of the female mold cavity in turn; the adsorption tube A 1121 and the adsorption tube B 1122 release the diamond particles in turn; the arrangement density of the diamond particles falling into the female mold cavity is higher than that of the fixed hole array A 11111 and the fixed hole array B 11121, thereby further improving the cutting performance and product service life of the diamond bit.

[0026] Compared with the prior art, the present invention symmetrically arranges the diamond particle distribution assembly 1 on both sides of the stamping platform 0; and the adsorption tube A 1121 and the adsorption tube B 1122 on both sides of the stamping platform 0 are arranged according to different rules; in this way, the adsorption tube A 1121 and the adsorption tube B 1122 successively release diamond particles above the female mold cavity, and the resulting diamond arrangement density is significantly greater than the arrangement density of the adsorption tube A 1121 and the arrangement density of the adsorption tube B 1122, thereby improving the cutting performance of the diamond bit and the service life of the diamond bit.

[0027] A cleaning box 2 is provided between the diamond particle distribution assembly 1 and the stamping platform 0, which is used to clean and collect the excess diamond particles at the bottom of the adsorption tube 112; the width of the cleaning box 2 is equivalent to the arrangement range of the male mold 01, so as to facilitate the cleaning and collection of the excess diamond particles at the bottom of the adsorption tube 112; an upward cleaning sponge 21 is provided in the cleaning box 2; the upper end surface of the cleaning sponge 21 is not lower than the bottom end of the adsorption tube 112; the cleaning sponge 21 is used to clean the bottom end of the adsorption tube 112 to ensure the adsorption stability of the adsorption tube 112 to the diamond particles.

[0028] There are four cleaning boxes 2, which are symmetrically arranged on both sides of the stamping platform 0; the cleaning boxes 2 on the same side are arranged along the direction of the servo electric cylinder 13; the cleaning sponges 21 on the same side are arranged close to each other; when the diamond particle adsorption mechanism 11 moves back and forth, the cleaning sponge 21 can push the excess diamond particles at the bottom of the adsorption tube 112 into the box body of the cleaning box 2.

[0029] The cleaning box 2 is also provided with a collecting notch 22 which passes through the cleaning box 2 horizontally; the position of the collecting notch 22 corresponds to the position of the male mold 01; after the bottom end of the needle tube enters the cleaning box 2 through the collecting notch 22, it is still sealed by the wall of the cleaning box 2, and the cleaning sponge 21 removes the excess diamond particles at the bottom end of the adsorption tube 112; the removed diamond particles are restricted in the cleaning box 2 by the wall of the cleaning box 2, so they are easy to collect.

[0030] The diameters of the adsorption tube A 1121 and the adsorption tube B 1122 are different, so diamond particles of different particle sizes can be adsorbed; the corresponding diamond particle sizes carried on the top surface of the diamond vibration flattening device 12 are different, and are used to feed diamond particles of different particle sizes. In this way, diamond particles of different particle sizes can be arranged on the working layer of the diamond cutter head, and its cutting performance can be improved.

[0031] The diamond particle adsorption mechanism 11 also includes a vertical lifting cylinder 113 for driving the diamond uniformly arranged adsorption device 111 and the adsorption tube 112 to vertically lift and lower. This can make the bottom end of the adsorption tube 112 as close to the female mold cavity as possible to ensure that the arrangement pattern of the adsorption tube 112 can be maintained after the diamond particles are released. It can also make the bottom end of the adsorption tube 112 close to the top surface of the diamond vibration flattening device 12, which is conducive to the bottom end of the adsorption tube 112 to adsorb the diamond particles.

[0032] The shape of the arrangement and locking plate A 1111 and the shape of the arrangement and locking plate B 1112 match the shape of the male mold 01; the arrangement and locking plate A 1111 and the arrangement and locking plate B 1112 can be driven into the female mold cavity by the vertical lifting cylinder 113 to reduce the falling height of the diamond particles to ensure the final arrangement density stability of the diamond particles.

[0033] Working principle of this embodiment: The present invention arranges the diamond particle distribution assembly 1 symmetrically on both sides of the stamping platform 0; and the adsorption tube A 1121 and the adsorption tube B 1122 on both sides of the stamping platform 0 are arranged according to different rules; in this way, the adsorption tube A 1121 and the adsorption tube B 1122 release diamond particles successively above the female mold cavity, and the resulting diamond arrangement density is significantly greater than the arrangement density of the adsorption tube A 1121 and the arrangement density of the adsorption tube B 1122, thereby improving the cutting performance of the diamond cutter head. The adsorption tube A 1121 and the adsorption tube B 1122 have different calibers, so diamond particles of different particle sizes can be adsorbed; the corresponding diamond particle sizes carried on the top surface of the diamond vibration flattening device 12 are different, and are used to feed diamond particles of different particle sizes. In this way, diamond particles of different particle sizes can be arranged correspondingly on the working layer of the diamond cutter head, and its cutting performance is improved.

[0034] Embodiment 2: Embodiment 2 is basically the same as Embodiment 1, and the similarities are not repeated here. The difference is that: the diamond particle adsorption mechanism 11 also includes a negative pressure box 114 and a hydraulic motor 115; the bottom of the negative pressure box 114 is penetrated by a needle tube; a negative pressure chamber 1141 connected to the needle tube is provided in the negative pressure box 114; two negative pressure tubes 1143 connected to the negative pressure chamber 1141 are provided on the top of the negative pressure box 114; the negative pressure chamber 1141 provides a stable negative pressure suction force for the adsorption tube 112 to adsorb diamond particles; the negative pressure tube 1143 provides a negative pressure source for the negative pressure chamber 1141; the negative pressure box 11 A sleeve 1142 with internal threads is vertically fixed on the top; the hydraulic motor 115 is arranged above the diamond uniform arrangement adsorption device 111, and is connected to the diamond uniform arrangement adsorption device 111 through pillars 116 arranged at four corners; a screw rod 1151 is coaxially fixed to the output end of the hydraulic motor 115; the screw rod 1151 is threadedly matched with the internal threads of the sleeve; the hydraulic motor 115 drives the screw rod 1151 to rotate; the rotating screw rod 1151 acts on the sleeve, and the negative pressure box 114 is lifted and lowered together; and the needle tube is extended and retracted relative to the diamond uniform arrangement adsorption device 111.

Claims

1. A diamond uniform arrangement forming device, arranged on both sides of a stamping platform; the stamping platform is provided with a female mold cavity and a male mold that match each other; characterized in that: The device comprises a diamond particle distribution component symmetrically arranged relative to a stamping platform; the diamond particle distribution component comprises a diamond particle adsorption mechanism, a diamond vibration flattening device, and a servo electric cylinder driving the diamond particle adsorption mechanism to move horizontally back and forth above a female mold cavity; the diamond vibration flattening device is arranged below the diamond particle adsorption mechanism, and the top surface carries diamond particles; the diamond particle adsorption mechanism comprises a diamond uniform arrangement adsorption device and an adsorption tube arranged on both sides of the stamping platform; the diamond uniform arrangement adsorption devices arranged on both sides of the stamping platform are an arrangement locking plate A and an arrangement locking plate B respectively; the arrangement locking plate A and the arrangement locking plate B are respectively provided with fixed hole arrays A and fixed hole arrays B with different arrangements; the adsorption tube comprises an adsorption tube A and an adsorption tube B, which respectively pass through the fixed hole array A and the fixed hole array B; the adsorption tube A and the adsorption tube B have different calibers; and the corresponding diamond particle sizes carried on the top surface of the diamond vibration flattening device are different.

2. The diamond uniform arrangement forming device according to claim 1, characterized in that: A cleaning box is arranged between the diamond particle distribution assembly and the stamping platform; the width of the cleaning box is equivalent to the arrangement range of the male mold; an upward cleaning sponge is arranged in the cleaning box; and the upper end surface of the cleaning sponge is not lower than the bottom end of the adsorption tube.

3. The diamond uniform arrangement forming device according to claim 2, characterized in that: There are four cleaning boxes, which are symmetrically arranged on both sides of the stamping platform; the cleaning boxes on the same side are arranged along the direction of the servo electric cylinder; and the cleaning sponges on the same side are arranged close to each other.

4. The diamond uniform arrangement forming device according to claim 2, characterized in that: The cleaning box is also provided with a collecting notch which runs through the cleaning box horizontally; the position of the collecting notch corresponds to the position of the male mold.

5. The diamond uniform arrangement forming device according to claim 1, characterized in that: The diamond particle adsorption mechanism also includes a vertical lifting cylinder for driving the diamond uniformly arranged adsorption device and the adsorption tube to vertically lift and lower.

6. The diamond uniform arrangement forming device according to claim 5, characterized in that: The shape of the locking plate A and the shape of the locking plate B are arranged to match the shape of the male mold.

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