An air handling device

Abstract

This invention discloses an air handling device, including a housing, a fan assembly and a semiconductor refrigeration device located within the housing. The housing has an air inlet and an air outlet. The housing includes a front panel, a rear panel, and a side panel connecting the front and rear panels. The width of the side panel is much smaller than the length and height of the front and rear panels. The semiconductor refrigeration device includes a cold-end component and a hot-end component, which are vertically arranged within the housing and sequentially arranged from the air inlet to the air outlet. Therefore, the width of the side panel of this air handling device is much smaller than the length and height of the front and rear panels. The housing structure and the arrangement of the semiconductor refrigeration device within the housing make the air handling device a thin-film design. This thin-film air handling device can be placed against a wall or suspended from a wall, occupying little indoor space and improving the utilization rate of indoor space.

Description

Technical Field

[0001] This invention belongs to the field of air handling equipment technology, specifically, it relates to a thin air handling device. Background Technology

[0002] As people's living standards improve, they have higher requirements for indoor air quality and humidity. As a result, air handling devices such as air purifiers, humidifiers, and dehumidifiers have emerged.

[0003] Existing air handling units typically house an air handling module within a casing. The air handling module is large, and the casing is also a large cylindrical or square column. Placing this air handling unit indoors occupies a significant amount of indoor space, causing inconvenience to users and hindering their daily operations such as cleaning.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0005] This invention proposes an air handling device to solve the technical problem that existing air handling devices are placed indoors and occupy a large amount of indoor space.

[0006] To achieve the above-mentioned invention / design objectives, the present invention adopts the following technical solution:

[0007] An air handling device includes a housing, a fan assembly and a thermoelectric cooling device located within the housing. The housing has an air inlet and an air outlet. The housing includes a front panel, a rear panel, and a side panel for connecting the front and rear panels. The width of the side panel is significantly smaller than the length and height of the front and rear panels. The air inlet and air outlet are located on the side panel. The thermoelectric cooling device includes a cold-end assembly and a hot-end assembly, which are vertically arranged within the housing and sequentially arranged from the air inlet to the air outlet.

[0008] In the air handling device described above, the amount of air passing through the hot end component at the same time is less than the amount of air passing through the cold end component.

[0009] As described above, in the air handling device, the cold end assembly includes cooling fins, the hot end assembly includes a heat dissipation plate, and the heat dissipation plate is provided with heating ventilation holes;

[0010] Alternatively, the cold end assembly includes cooling fins, the hot end assembly includes heating fins, the arrangement density of the cooling fins is greater than the arrangement density of the cooling fins, and / or, the tilt angle of the cooling fins is smaller than the tilt angle of the heating fins.

[0011] Alternatively, the cold end assembly includes a cooling plate with cooling ventilation holes, the hot end assembly includes a heat sink with heating ventilation holes, the diameter of the cooling ventilation holes is larger than the diameter of the heating ventilation holes, and / or the number of cooling ventilation holes is greater than the number of heating ventilation holes.

[0012] In the air handling device described above, the arrangement direction of the cooling fins is the same as or approximately the same as the direction of the airflow entering through the air inlet.

[0013] In the air handling device described above, the cold end assembly includes at least two sets of cold end assemblies arranged sequentially in the direction from the air inlet to the air outlet, wherein the amount of air passing through the upstream cold end assembly at the same time is greater than the amount of air passing through the downstream cold end assembly.

[0014] In the air handling device described above, the hot end assembly includes at least two sets of hot end assemblies arranged sequentially in the direction from the air inlet to the air outlet, wherein the amount of air passing through the upstream hot end assembly at the same time is less than the amount of air passing through the downstream hot end assembly.

[0015] As described above, the air handling apparatus includes an upstream fan assembly located upstream of the cold end assembly and a downstream fan assembly located downstream of the hot end assembly, and both the upstream fan assembly and the downstream fan assembly include at least two vertically arranged fans.

[0016] The air handling unit as described above includes a condensate receiving device for receiving condensate from the cold end assembly, and the front panel is provided with a mounting port for installing the condensate receiving device.

[0017] The air handling device described above includes a vertically arranged humidification device, a water distribution device at the top of the humidification device, a water receiving device at the bottom of the humidification device, the water distribution device and the condensate receiving device being connected via a water supply device, and the water receiving device being either connected to or not connected to the condensate receiving device.

[0018] The air handling device described above includes a vertically arranged air purification device located near the air inlet.

[0019] Compared with the prior art, the advantages and positive effects of the present invention are:

[0020] The air handling device of the present invention includes a housing, a fan assembly and a semiconductor refrigeration device located within the housing. The housing has an air inlet and an air outlet. The housing includes a front panel, a rear panel, and a side panel connecting the front and rear panels. The width of the side panel is much smaller than the length and height of the front and rear panels. The semiconductor refrigeration device includes a cold-end component and a hot-end component, which are vertically arranged within the housing and sequentially arranged from the air inlet to the air outlet. Therefore, the width of the side panel of the air handling device of the present invention is much smaller than the length and height of the front and rear panels. The housing structure and the arrangement of the semiconductor refrigeration device within the housing make the air handling device a thin-film air handling device. This thin-film air handling device can be placed against a wall or suspended from a wall, occupying little indoor space and improving the utilization rate of indoor space.

[0021] Other features and advantages of the present invention will become clearer after reading the detailed embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 , 2 This is a schematic diagram of an air treatment device according to a specific embodiment of the present invention.

[0024] Figure 3 , 4 This is a schematic diagram of the internal structure of the air handling device according to a specific embodiment of the present invention.

[0025] Figure 5 , 6 This is a schematic diagram of the internal fixed structure of the air handling device according to a specific embodiment of the present invention.

[0026] Figure 7 This is a schematic diagram of a fan assembly according to a specific embodiment of the present invention.

[0027] Figure 8 , 9 This is a schematic diagram of a semiconductor cooling device according to a specific embodiment of the present invention.

[0028] Figure 10 This is a schematic diagram of a humidification device according to a specific embodiment of the present invention.

[0029] Figure 11 This is a top view of a humidification device according to a specific embodiment of the present invention.

[0030] In the picture,

[0031] 1. Housing; 11. Front panel; 111. Mounting port; 12. Rear panel; 13. Side panel; 131. Air inlet; 132. Air outlet; 14. Mounting bracket;

[0032] 2. Fan assembly; 21. Fan; 22. Mounting bracket; 23. Protective frame; 24. Limiting plate; 241. Auxiliary plate;

[0033] 3. Semiconductor refrigeration device; 31. Cold end assembly; 311. Refrigeration fins; 32. Hot end assembly; 321. Heat sink; 3211. Heating ventilation hole; 33. Semiconductor refrigeration device mounting bracket;

[0034] 4. Air purification device;

[0035] 5. Humidification device; 51. Water distribution device; 52. Water receiving device;

[0036] 6. Condensate collection device;

[0037] 7. Water supply device. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. In the description of embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0041] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0042] In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0043] As people's demands for quality of life increase, they not only have higher requirements for indoor air quality and humidity, but also for highly integrated home appliances to save indoor space. Therefore, air handling units with purification and / or dehumidification and / or humidification functions are becoming increasingly popular. Existing air handling units generally consist of large cylindrical or square cylindrical housings, occupying significant indoor space and causing inconvenience to users.

[0044] To address the aforementioned issues, the air handling unit's casing structure and the arrangement of its internal air handling modules have been modified to create a thin-walled enclosure. This thin-walled air handling unit can be mounted flush against a wall, occupying only the width of the side wall in the direction perpendicular to the wall. Furthermore, the air handling unit can be directly suspended from the wall, taking up virtually no indoor space.

[0045] The air handling unit includes a housing, a fan assembly and a thermoelectric cooling device located within the housing. The housing has an air inlet and an air outlet. The housing includes a front panel, a rear panel, and side panels connecting the front and rear panels. The width of the side panels is much smaller than the length and height of the front and rear panels. The thermoelectric cooling device includes a cold-end assembly and a hot-end assembly, which are vertically arranged within the housing and sequentially arranged from the air inlet to the air outlet. Therefore, the arrangement of the air handling unit housing and its internal thermoelectric cooling device makes the air handling unit a slim unit. This slim air handling unit can be placed against a wall or suspended from a wall, occupying minimal indoor space and improving the utilization of indoor space.

[0046] The following is in conjunction with the appendix Figure 1-11 A detailed description of the air handling unit:

[0047] The air handling unit includes a housing 1, a fan assembly 2 located within the housing 1, and a semiconductor refrigeration unit 3, to form an air handling unit with dehumidification function.

[0048] In some embodiments, the housing 1 is provided with a fan assembly 2, a semiconductor cooling device 3 and an air purification device 4 to form an air handling device with dehumidification and purification functions.

[0049] In some embodiments, a fan assembly 2, a semiconductor cooling device 3, and a humidifying device 5 are disposed within the housing to form an air handling device with dehumidification and humidification functions.

[0050] In some embodiments, a fan assembly 2, a semiconductor cooling device 3, an air purification device 4, and a humidification device 5 are provided inside the housing to form an air handling device with dehumidification, purification, and humidification functions.

[0051] An air inlet 131 and an air outlet 132 are provided on the housing 1 to realize the air intake and exhaust of the air handling device.

[0052] The housing 1 includes a front panel 11, a rear panel 12, and a side panel 13 for connecting the front panel 11 and the rear panel 12.

[0053] In some embodiments, a bracket 14 is provided on the housing 1, and the air handling unit is mounted on the wall via the bracket 14.

[0054] The front panel 11 and the rear panel 12 are the same size, and the front panel 11 and the rear panel 12 are rectangular or square.

[0055] The side panel 13 includes a left side panel, a right side panel, a top side panel, and a bottom side panel.

[0056] The side panel 13 and the rear panel 12 are integrally formed, and the front panel 11 is mounted on the side panel 13.

[0057] The width D of the side panel 13 is much smaller than the length L and height H of the front panel 11 and the rear panel 12.

[0058] The width D of the side panel 13 refers to the size of the side panel 13 located between the front panel 11 and the rear panel 12.

[0059] The length L of the front panel 11 and the rear panel 12 refers to the dimensions of the front panel 11 and the rear panel 12 in the left-right direction.

[0060] The height H of the front panel 11 and the rear panel 12 refers to the dimensions of the front panel 11 and the rear panel 12 in the vertical direction.

[0061] An air inlet 131 and an air outlet 132 are provided on the side panel 13.

[0062] In some embodiments, an air inlet 131 is provided on the left side panel and an air outlet 132 is provided on the right side panel.

[0063] In some embodiments, an air inlet 131 is provided on the right side panel and an air outlet 132 is provided on the left side panel.

[0064] exist Figure 8 ,9 In the example, the semiconductor cooling device 3 includes a semiconductor cooling chip (not shown in the figure, located between the cold end component 31 and the hot end component 32), the cold end component 31 and the hot end component 32, which are arranged vertically in the housing 1 and are arranged sequentially in the direction from the air inlet 131 to the air outlet 132.

[0065] The semiconductor cooling device 3 is installed inside the housing 1 via the semiconductor cooling device mounting bracket 33.

[0066] In some embodiments, the semiconductor cooling chip is horizontally disposed between the cold end component 31 and the hot end component 32 to avoid the semiconductor cooling chip obstructing airflow.

[0067] When the fan assembly 2 is running, air enters the housing 1 from the air inlet 131, is condensed and dehumidified by the cold end assembly 31, and is then heated by the hot end assembly before being blown out from the air outlet 132.

[0068] To improve dehumidification, the amount of air passing through the hot-end component 32 is less than the amount of air passing through the cold-end component 31 within the same time period. The hot-end component 32 limits the amount of air passing through, thus increasing the time that air stays in the cold-end component 31 and improving the dehumidification effect.

[0069] The cold end assembly 31 includes cooling fins 311.

[0070] Specifically, the cold end of the semiconductor cooling chip is connected to a cooling pipe, and several cooling fins 311 are arranged on the cooling pipe. The heat generated by the cold end of the semiconductor cooling chip is transferred to the cooling fins 311 through the cooling pipe for cooling and to condense the moisture in the air.

[0071] The cooling pipe includes a horizontal section and a vertical section, with the cooling fins 311 located on the vertical section.

[0072] The arrangement direction of the cooling fins 311 is the same as or approximately the same as the direction of the airflow entering through the air inlet 131.

[0073] The cooling fins 311 are arranged in a horizontal or nearly horizontal direction.

[0074] The hot end component 32 includes a heat sink 321.

[0075] Specifically, the hot end of the semiconductor cooling chip is connected to a heat pipe, and the heat sink 321 is connected to the hot end of the semiconductor cooling chip through the heat pipe. The heat generated by the hot end of the semiconductor cooling chip is transferred to the heat sink 321 for heat dissipation through the heat pipe.

[0076] Heating ventilation holes 3211 are provided on the heat sink 321, and the amount of air passing through the hot end component 32 at the same time is less than the amount of air passing through the cold end component 31.

[0077] In some embodiments, the cold end component includes cooling fins, the hot end component includes heating fins, the arrangement density of the cooling fins is greater than the arrangement density of the cooling fins, and / or the tilt angle of the cooling fins is less than the tilt angle of the heating fins, so that the amount of air passing through the hot end component 32 in the same time is less than the amount of air passing through the cold end component 31, thereby achieving the purpose of improving the dehumidification effect.

[0078] In some embodiments, the cold end component includes a cooling plate with cooling ventilation holes, the hot end component includes a heat sink with heating ventilation holes, the diameter of the cooling ventilation holes is larger than the diameter of the heating ventilation holes, and / or the number of cooling ventilation holes is greater than the number of heating ventilation holes, so that the amount of air passing through the hot end component 32 at the same time is less than the amount of air passing through the cold end component 31, thereby improving the dehumidification effect.

[0079] The cold end assembly 31 includes at least two sets of cold end assemblies 31 arranged sequentially in the direction from the air inlet 131 to the air outlet 132.

[0080] The amount of air passing through the upstream cold-end component is greater than the amount of air passing through the downstream cold-end component at the same time. This increases the residence time of air in the cold-end component, thereby improving the dehumidification effect.

[0081] In some embodiments, both the upstream cold end component and the downstream cold end component include cooling fins, the arrangement density of the upstream cooling fins is greater than that of the downstream cooling fins, and / or the tilt angle of the upstream cooling fins is less than that of the downstream heating fins, thereby making the amount of air passing through the upstream cold end component less than the amount of air passing through the downstream cold end component in the same time, so as to improve the dehumidification effect.

[0082] The hot end assembly 32 includes at least two sets of hot end assemblies 32 arranged sequentially in the direction from the air inlet 131 to the air outlet 132.

[0083] The amount of air passing through the upstream hot-end component at the same time is less than the amount of air passing through the downstream hot-end component. This reduces the time it takes for air to be discharged from the hot-end component and increases the air circulation speed.

[0084] In some embodiments, both the upstream and downstream hot-end components include a heat sink, and the heat sink is provided with heating ventilation holes. The diameter of the heating ventilation holes in the upstream hot-end component is larger than the diameter of the heating ventilation holes in the downstream hot-end component, and / or, the number of heating ventilation holes in the upstream hot-end component is greater than the number of heating ventilation holes in the downstream hot-end component, so that the amount of air passing through the upstream hot-end component at the same time is less than the amount of air passing through the downstream hot-end component, thereby reducing the time for air to be discharged from the hot-end component and improving the air circulation speed.

[0085] exist Figure 7 In the example, fan assembly 2 includes an upstream fan assembly located upstream of cold end assembly 31 and a downstream fan assembly located downstream of hot end assembly 32.

[0086] The upstream fan assembly allows air from outside the housing 1 to enter the cold end assembly 31 through the air inlet 131, where it is condensed and dehumidified.

[0087] Setting up a downstream fan assembly allows air from the hot end assembly 32 to be quickly discharged from the housing 1 through the air outlet 132.

[0088] Both the upstream and downstream wind turbine components include at least two vertically arranged wind turbines 21.

[0089] Specifically, both the upstream and downstream wind turbine components include a vertical mounting bracket 22, and at least two wind turbines 21 are arranged on the vertical mounting bracket 22.

[0090] To protect the wind turbine 21, both the upstream and downstream wind turbine assemblies include a protective frame 23, and the vertical mounting bracket 22 and the wind turbine located on the vertical mounting bracket 22 are both located within the protective frame 23.

[0091] exist Figure 5 , 6 In the example, a limiting plate 24 for installing the fan assembly is provided inside the housing 1. Specifically, two limiting plates 24 are provided on both the top and bottom side panels. The top of the protective frame 23 is inserted between the two limiting plates 24 on the top side panel, and the bottom of the protective frame 23 is inserted between the two limiting plates 24 on the bottom side panel.

[0092] The air handling unit includes a long strip-shaped air purification device 4, which is vertically arranged inside the housing 1 and is located near the air inlet 131.

[0093] exist Figure 5 , 6 In the example, the air purification device 4 is located upstream of the upstream fan assembly, and a limit plate 24 is provided inside the housing 1, with the air purification device 4 inserted between the limit plates 24.

[0094] In some embodiments, the air purification device 4 and the upstream fan assembly may share a limiting plate 24 at adjacent locations.

[0095] In order to collect the condensate generated by the cold end component 31, the air handling unit includes a condensate receiving device 6 for collecting the condensate from the cold end component 31. The condensate receiving device 6 is located below the cold end component 31. In order to increase the volume of the condensate receiving device 6 and minimize its height, so as to maximize the air duct within the same housing volume, the condensate receiving device 6 extends to the bottom of the hot end component to increase the volume of the condensate receiving device 6 in the lateral direction.

[0096] To facilitate drainage, emptying, and cleaning operations of the condensate collection device 6, a mounting port 111 for installing the condensate collection device 6 is provided on the front panel 11. The mounting port 111 is located on the front panel 11 near the bottom side panel.

[0097] exist Figure 5 , 6 In the example, a limiting plate 24 is provided inside the housing 1 for limiting the installation of the condensate receiving device 6.

[0098] In some embodiments, the condensate receiving device 6 and the upstream fan assembly may share a limiting plate 24 at adjacent locations.

[0099] The air handling unit includes a long strip-shaped humidifier 5, which is vertically arranged inside the housing 1. A water distribution device 51 is provided at the top of the humidifier 5, and a water receiving device 52 is provided at the bottom of the humidifier 5.

[0100] In some embodiments, the water distribution device 51 is a water tank with a plurality of drainage holes.

[0101] In some embodiments, the water distribution device 51 may also be a water pipe with several drainage holes.

[0102] The water distribution device 51 is connected to the condensate receiving device 6 via a water supply device 7, and the water distribution device 51 receives water from the condensate receiving device 6 via the water supply device 7.

[0103] In some embodiments, the water supply device 7 includes a water supply pipe and a water supply pump.

[0104] exist Figure 5 , 6 In the example, the housing 1 is provided with a limiting plate 24 for installing the humidifying device 5. On the opposite side of the limiting plate 24, there are auxiliary plates 241 protruding from the opposite side. The water distribution device 51 and the water receiving device 52 are fitted between the auxiliary plates 241.

[0105] The water supply pipe is installed on the limiting plate 24, and the water pump is located between the limiting plates 24 to improve the stability of the water supply device 7 installation.

[0106] The other end of the water supply pipe is located inside the condensate receiving device, or inside the water receiving device.

[0107] In some embodiments, the water receiving device 52 is connected to the condensate receiving device 6, which is located below the water receiving device 52. The water receiving device 52 is a water receiving tray with a drain hole.

[0108] A filter is installed in the middle of the condensate receiving device 6. The filter is used to filter the condensate received. The water supply pipe of the water supply device 7 is located downstream of the filter.

[0109] In some embodiments, the water receiving device 52 and the condensate receiving device 6 are integrally formed.

[0110] In some embodiments, the water receiving device 52 and the condensate receiving device 6 are not connected and are set up independently.

[0111] When the fan assembly 2 is running, air outside the housing 1 passes through the air inlet 131, air purification device 4, semiconductor refrigeration device 3, and humidification device 5, and is then discharged from the air outlet 132. When only purification is needed, the humidification device 5 and semiconductor refrigeration device 3 are turned off. As air flows through the air purification device 4, impurities in the air are filtered out, achieving purification. When humidification is needed, the semiconductor refrigeration device 3 is turned off, and the water supply device 7 is activated, raising water from the condensate collection device 6 to the humidification device 5. The water wets the humidification device 5, and as air flows through it, the moisture is carried away, achieving humidification. When dehumidification is needed, the water pump of the water supply device 7 is turned off, and the semiconductor refrigeration device 3 is activated. As air flows through the evaporator and condenser of the semiconductor refrigeration device 3, water vapor in the air is condensed into condensate, achieving dehumidification.

[0112] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions claimed by the present invention.

Claims

1. An air handling device, comprising a housing, a fan assembly and a semiconductor refrigeration device located within the housing, wherein an air inlet and an air outlet are provided on the housing, characterized in that, The housing includes a front panel, a rear panel, and a side panel for connecting the front panel and the rear panel. The width of the side panel is much smaller than the length and height of the front panel and the rear panel. The air inlet and the air outlet are provided on the side panel. The semiconductor cooling device includes a cold end component and a hot end component. The cold end component and the hot end component are arranged vertically inside the housing. The cold end component and the hot end component are arranged sequentially in the direction from the air inlet to the air outlet.

2. The air handling apparatus according to claim 1, characterized in that, The amount of air passing through the hot end component at the same time is less than the amount of air passing through the cold end component.

3. The air handling apparatus according to claim 2, characterized in that, The cold end component includes cooling fins, and the hot end component includes a heat sink with heating ventilation holes provided on the heat sink. Alternatively, the cold end assembly includes cooling fins, the hot end assembly includes heating fins, the arrangement density of the cooling fins is greater than the arrangement density of the cooling fins, and / or, the tilt angle of the cooling fins is smaller than the tilt angle of the heating fins. Alternatively, the cold end assembly includes a cooling plate with cooling ventilation holes, the hot end assembly includes a heat sink with heating ventilation holes, the diameter of the cooling ventilation holes is larger than the diameter of the heating ventilation holes, and / or the number of cooling ventilation holes is greater than the number of heating ventilation holes.

4. The air handling apparatus according to claim 3, characterized in that, The arrangement direction of the cooling fins is the same as or approximately the same as the direction of the airflow entering through the air inlet.

5. The air handling apparatus according to claim 2, characterized in that, The cold end assembly includes at least two sets of cold end assemblies arranged sequentially in the direction from the air inlet to the air outlet, wherein the amount of air passing through the upstream cold end assembly at the same time is greater than the amount of air passing through the downstream cold end assembly.

6. The air handling apparatus according to claim 2, characterized in that, The hot end assembly includes at least two sets of hot end assemblies arranged sequentially in the direction from the air inlet to the air outlet, wherein the amount of air passing through the upstream hot end assembly at the same time is less than the amount of air passing through the downstream hot end assembly.

7. The air handling apparatus according to claim 2, characterized in that, The fan assembly includes an upstream fan assembly located upstream of the cold end assembly and a downstream fan assembly located downstream of the hot end assembly, and both the upstream fan assembly and the downstream fan assembly include at least two fans arranged vertically.

8. The air handling apparatus according to claim 1, characterized in that, The air handling unit includes a condensate receiving device for receiving condensate from the cold end components, and the front panel is provided with a mounting port for installing the condensate receiving device.

9. The air handling apparatus according to claim 8, characterized in that, The air handling unit includes a vertically arranged humidification device. A water distribution device is provided at the top of the humidification device, and a water receiving device is provided at the bottom of the humidification device. The water distribution device and the condensate receiving device are connected through a water supply device. The water receiving device may or may not be connected to the condensate receiving device.

10. The air handling apparatus according to claim 1, characterized in that, The air handling unit includes a vertically arranged air purification device located near the air inlet.

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