Display panel and display device

Abstract

The application discloses a display panel and a display device. The display panel comprises at least one light emitting unit carrier plate and a driving back plate; the light emitting unit carrier plate comprises a first substrate, at least one micro light emitting unit device of a first light emitting color and at least one flow control thin film transistor, the first substrate is provided with a first signal overlap area, and the first signal overlap area is provided with a plurality of first overlap pads; the driving back plate comprises a second substrate and at least one (n-1)TmC driving circuit, the second substrate is provided with a second signal overlap area, and the second signal overlap area is provided with a plurality of second overlap pads, wherein n is an integer greater than or equal to 2, and m is an integer greater than or equal to 1; the (n-1)TmC driving circuit and the flow control thin film transistor correspond to each other to form a driving circuit of the micro light emitting unit device. The technical scheme provided in the embodiment of the application reduces the number of the first overlap pads or the number of signal vias on the light emitting unit carrier plate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a display panel and a display device. Background Technology

[0002] Micro LED in Package (MIP) substrates integrate Micro LEDs and discrete devices through integrated packaging technology. Specifically, micro-light-emitting units (including, but not limited to, Micro LED chips) are mass-transferred from an epitaxial wafer onto the substrate, then directly packaged, diced into single or multi-chip units, and then their light is split and mixed before being mounted. The substrate containing these micro-light-emitting units (including, but not limited to, Micro LEDs) is called a light-emitting unit substrate. After dicing, testing, and sorting, the substrate is placed on a driver backplane to complete the display panel fabrication. The advantages of MIPs lie in their flexibility and cost-effectiveness; MIP packaging technology can meet the needs of products with different pixel pitches. However, MIPs are essentially passive devices, requiring a large number of driver ICs to function in order to achieve panel display.

[0003] Thin-film transistors (TFTs) are suitable for low-cost, large-area semiconductor devices. If TFTs and MIPs are packaged together to form a driven MIP device, namely a TFT driving Micro LED in Package (TMIP) device, the cost of the driver IC can be greatly reduced.

[0004] However, current technology encapsulates the entire TFT pixel unit circuit and Micro-LED together. A typical pixel unit circuit consists of multiple TFTs, capacitors, and several signal control lines. This packaging structure often requires reserving numerous first-overlap pads as signal test pads at the edge of the light-emitting unit substrate, or numerous signal vias for photoelectric characteristic sorting and testing of TMIPs. For small-pitch TMIP devices, a large number of first-overlap pads or signal vias makes the process very difficult and reduces yield.

[0005] Therefore, there is an urgent need for a new TMIP device packaging structure that can minimize the number of first lap pads or signal vias on the light-emitting unit carrier. Summary of the Invention

[0006] The present invention provides a display panel and a display device to reduce the number of first lap pads or signal vias on the light-emitting unit carrier.

[0007] According to one aspect of the present invention, a display panel is provided, comprising:

[0008] At least one light-emitting unit carrier plate and a driving back plate, wherein the driving back plate is used to support at least one of the light-emitting unit carrier plates;

[0009] The light-emitting unit carrier includes a first substrate, at least one micro light-emitting unit device of at least one emitting color, and at least one fluidized thin-film transistor. The first substrate is provided with a first signal overlap area, and the first signal overlap area is provided with a plurality of first overlap pads. The micro light-emitting unit device, the fluidized thin-film transistor, and the first overlap pads are located on one side of the first substrate. The fluidized thin-film transistor is used to provide driving current to the micro light-emitting unit device in a one-to-one correspondence. The first overlap pads are used to provide power signals and control signals to the fluidized thin-film transistor, and the first overlap pads are used to provide power signals to the micro light-emitting unit device.

[0010] The driving backplane includes a second substrate and at least one (n-1)TmC driving circuit. The second substrate is provided with a second signal overlap region, and the second signal overlap region is provided with a plurality of second overlap pads. The value of n is an integer greater than or equal to 2, and the value of m includes an integer greater than or equal to 1. The (n-1)TmC driving circuit includes (n-1) thin film transistors and m capacitors. The (n-1)TmC driving circuit and the second overlap pads are located on one side of the second substrate, and the second overlap pads and the first overlap pads are electrically connected.

[0011] The (n-1)TmC driving circuit and the flow-controlled thin-film transistor correspond one-to-one to form the driving circuit of the micro light-emitting unit device.

[0012] Optionally, the driving backplane further includes a driving chip and a plurality of first conductive vias. The driving chip and the (n-1)TmC driving circuit are located on two opposite surfaces of the second substrate. The first conductive vias are electrically connected to the driving chip through conductive lines, and the second lap pads cover the first conductive vias one by one.

[0013] Optionally, the first substrate is in contact with the second substrate, and the micro light-emitting unit device, the fluid control thin-film transistor, and the first bonding pad are located on the side of the first substrate away from the second substrate;

[0014] The second lap pad is electrically connected to the first lap pad via a conductive line, and the surface of the second lap pad away from the second substrate is flush with the surface of the first lap pad away from the first substrate.

[0015] Optionally, the first substrate further includes a plurality of second conductive vias, and the first lap pads cover the second conductive vias one by one;

[0016] The second lap pad contacts the first substrate. The micro light-emitting unit device, the fluid control thin film transistor and the first lap pad are located on the side of the first substrate away from the second substrate. The second lap pad is used to support the first substrate, and the second conductive via is located one-to-one within the orthographic projection of the second lap pad on the second substrate.

[0017] Optionally, the value of n is 2, and the value of m is 1.

[0018] Optionally, the first lap pad includes a VDD pad, a VSS pad, and at least one gate signal pad, wherein the gate signal pad provides a control signal to each of the flow control thin film transistors.

[0019] Optionally, the value of n is 5, and the value of m is 2.

[0020] Optionally, the first bonding pad includes a VDD pad, at least one VSS pad, and at least one gate signal pad. The gate signal pad provides a control signal to each of the flow control thin film transistors, and the VSS pad provides a power signal to each of the flow control thin film transistors.

[0021] Optionally, each of the micro-light-emitting unit devices of at least one emitting color on each of the light-emitting unit carriers constitutes a pixel.

[0022] According to another aspect of the present invention, a display device is provided, including a display panel as described in any of the embodiments of the present invention.

[0023] In this embodiment of the invention, a micro-light-emitting unit device is a sub-pixel, and n thin-film transistors and m capacitors constitute the driving circuit of a micro-light-emitting unit device. The light-emitting unit carrier only contains the flow-controlled thin-film transistors and the micro-light-emitting unit device, while the other parts of the driving circuit are fabricated on the driving backplane. For the driving circuit of the micro-light-emitting unit device composed of n thin-film transistors and m capacitors, the driving circuit corresponding to the sub-pixel of the light-emitting unit carrier contains 1 flow-controlled thin-film transistor, and the driving circuit corresponding to the sub-pixel of the driving backplane contains (n-1) thin-film transistors and m capacitors. That is, the driving backplane includes (n-1)TmC driving circuits, which greatly reduces the number of first lap pads used to provide test signals at the edge of the light-emitting unit carrier, or reduces the number of signal vias, which is beneficial for the testing and sorting of the light-emitting unit carrier, reduces the process difficulty, and improves the process yield of the light-emitting unit carrier and the display panel.

[0024] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a light-emitting unit carrier plate provided by existing technology;

[0027] Figure 2 This is a schematic diagram of a drive backplane provided by existing technology;

[0028] Figure 3 This is a schematic diagram of the structure of a light-emitting unit carrier plate provided in an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of a drive backplate provided in an embodiment of the present invention;

[0030] Figure 5 This is a cross-sectional structural diagram of a display panel provided in an embodiment of the present invention;

[0031] Figure 6 This is a cross-sectional structural diagram of a light-emitting unit carrier plate provided in an embodiment of the present invention;

[0032] Figure 7 This is a cross-sectional structural diagram of a drive backplate provided in an embodiment of the present invention;

[0033] Figure 8 This is a cross-sectional structural diagram of another display panel provided in an embodiment of the present invention;

[0034] Figure 9 This is a cross-sectional structural diagram of another light-emitting unit carrier plate provided in an embodiment of the present invention;

[0035] Figure 10 This is a cross-sectional structural diagram of another drive backplate provided in an embodiment of the present invention;

[0036] Figure 11 This is a schematic diagram of a driving circuit corresponding to a micro light-emitting unit device provided in an embodiment of the present invention;

[0037] Figure 12 yes Figure 11The timing diagram of the driving circuit is shown;

[0038] Figure 13 This is a schematic diagram of another light-emitting unit carrier plate provided in an embodiment of the present invention;

[0039] Figure 14 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention;

[0040] Figure 15 yes Figure 14 A schematic diagram of the 1T1C driving circuit within the area where a light-emitting unit carrier board is placed;

[0041] Figure 16 This is a schematic diagram of another driving circuit corresponding to a micro light-emitting unit device provided in an embodiment of the present invention;

[0042] Figure 17 yes Figure 16 The timing diagram of the driving circuit is shown;

[0043] Figure 18 This is a schematic diagram of the structure of another light-emitting unit carrier provided in an embodiment of the present invention;

[0044] Figure 19 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention;

[0045] Figure 20 yes Figure 19 A schematic diagram of the 4T2C driving circuit within the area where a light-emitting unit carrier board is placed. Detailed Implementation

[0046] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0047] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that includes a series of steps or apparatuses is not necessarily limited to those explicitly listed, but may include other steps or apparatuses not explicitly listed or inherent to such processes, methods, products, or apparatuses.

[0048] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of a light-emitting unit carrier plate provided by existing technology. Figure 2 This is a schematic diagram of a driving backplane provided by the prior art. The light-emitting unit carrier 100 includes a first substrate 101, at least one micro light-emitting unit device 102 of at least one light-emitting color, and at least one nTmC driving circuit, wherein n is an integer greater than or equal to 2, and m is an integer greater than or equal to 1. The first substrate 101 is provided with a first signal overlap area, and the first signal overlap area is provided with a plurality of first overlap pads 104. The micro light-emitting unit device 102, the nTmC driving circuit, and the first overlap pads 104 are located on one side of the first substrate 101. The nTmC driving circuit is used to provide driving signals to the micro light-emitting unit device 102 in a one-to-one correspondence. The first overlap pads 104 are used to provide power signals and control signals to the nTmC driving circuit, and the first overlap pads 104 are used to provide power signals to the micro light-emitting unit device 102. The driving backplane 200 includes a second substrate 201, the second substrate 201 is provided with a second signal overlap area, and the second signal overlap area is provided with a plurality of second overlap pads 202. The nTmC drive circuit includes n thin-film transistors and m capacitors.

[0049] Since the entire nTmC driving circuit and the miniature light-emitting unit device 102 are packaged on the light-emitting unit carrier board 100, a large number of first overlap pads 104 need to be reserved at the edge of the light-emitting unit carrier board 100 as signal test pads, or a large number of signal vias need to be reserved for the photoelectric characteristic sorting test of TMIP. For small-pitch TMIP devices, a large number of first overlap pads or signal vias will make the process very difficult and reduce the yield.

[0050] To address the aforementioned technical problems, embodiments of the present invention provide the following technical solutions:

[0051] like Figure 3 and Figure 4As shown, Figure 3 This is a schematic diagram of the structure of a light-emitting unit carrier plate provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of a driving backplane provided in an embodiment of the present invention. The display panel includes: at least one light-emitting unit carrier 100 and a driving backplane 200. The driving backplane 200 supports at least one light-emitting unit carrier 100. The light-emitting unit carrier 100 includes a first substrate 101, at least one micro light-emitting unit device 102 of at least one emitting color, and at least one flow-controlled thin-film transistor 103. The first substrate 101 is provided with a first signal overlap area, and the first signal overlap area is provided with a plurality of first overlap pads 104. The micro light-emitting unit device 102, the flow-controlled thin-film transistor 103, and the first overlap pads 104 are located on one side of the first substrate 101. The flow-controlled thin-film transistor 103 is used to provide driving current to the micro light-emitting unit device 102 in a one-to-one correspondence, and the first overlap pads 104 are used to provide power to the flow-controlled thin-film transistor 103. The signal and control signals are provided by the first bonding pad 104, which is used to provide power signals to the micro light-emitting unit device 102. The driving backplane 200 includes a second substrate 201 and at least one (n-1)TmC driving circuit. The second substrate 201 is provided with a second signal bonding area, and the second signal bonding area is provided with a plurality of second bonding pads 202, wherein n is an integer greater than or equal to 2, m is an integer greater than or equal to 1, and the (n-1)TmC driving circuit includes (n-1) thin film transistors and m capacitors. The (n-1)TmC driving circuit and the second bonding pad 202 are located on one side of the second substrate 201, and the second bonding pad 202 and the first bonding pad 104 are electrically connected. The (n-1)TmC driving circuit and the flow-controlled thin film transistor 103 correspond one-to-one to form the driving circuit of the micro light-emitting unit device 102.

[0052] Optionally, the micro-light-emitting unit device 102 includes at least one of mini-LED chips, micro-LED chips, and quantum dot LED chips. Optionally, the light-emitting unit carrier 100 includes red-emitting, green-emitting, and blue-emitting micro-light-emitting unit devices 102.

[0053] For example, Figure 4 The illustrated drive backplate 200 includes four light-emitting unit carrier plate placement areas, enabling the drive backplate 200 to support four light-emitting unit carrier plates 100. It should be noted that, in this embodiment of the invention, the drive backplate 200 includes four, but is not limited to, four light-emitting unit carrier plate placement areas A1.

[0054] In this embodiment of the invention, a micro-light-emitting unit device 102 is a sub-pixel, and n TFTs and m capacitors constitute the driving circuit of a micro-light-emitting unit device 102. The light-emitting unit carrier 100 only includes a flow-controlled thin-film transistor 103 and a micro-light-emitting unit device 102, while the other parts of the driving circuit are fabricated on the driving backplate 200. For the driving circuit of the micro-light-emitting unit device consisting of n TFTs and m capacitors, the driving circuit corresponding to the sub-pixel of the light-emitting unit carrier 100 includes one flow-controlled thin-film transistor 103, and the driving circuit corresponding to the sub-pixel of the driving backplate 200 includes (n-1) TFTs and m capacitors. That is, the driving backplate 200 includes a (n-1)TmC driving circuit, which greatly reduces the number of first lap pads 104 used to provide test signals at the edge of the light-emitting unit carrier 100, or reduces the number of signal vias, which is beneficial for the testing and sorting of the light-emitting unit carrier 100, reduces the process difficulty, and improves the process yield of the light-emitting unit carrier 100 and the display panel.

[0055] It should be noted that the fabrication method of this light-emitting unit carrier includes the following steps:

[0056] S110. A sacrificial layer is formed on a glass substrate, and a first substrate is formed on the surface of the sacrificial layer away from the glass substrate.

[0057] S120. A driving circuit and a first signal overlap region are fabricated on the surface of the first substrate away from the sacrificial layer.

[0058] S130, Transfer micro-light-emitting unit devices to the first surface of the first substrate.

[0059] S140. A packaging layer is formed on the first surface side of the first substrate, exposing the first signal overlap area.

[0060] S150. Perform sorting tests on each pixel, including at least one of voltage, brightness, and wavelength.

[0061] S160. Cut the display panel into multiple independent light-emitting unit carriers along the cutting groove.

[0062] For pixels that pass the sorting test, they are cut into individual light-emitting unit carriers 100. Each light-emitting unit carrier 100 has one pixel. Each pixel includes red-emitting micro-light-emitting unit devices 102, green-emitting micro-light-emitting unit devices 102, and blue-emitting micro-light-emitting unit devices 102, and each micro-light-emitting unit device 102 is a sub-pixel. The light-emitting unit carrier 100 only contains flow-controlled thin-film transistors 103 and micro-light-emitting unit devices 102, while the other parts of the driving circuit are fabricated on the driving backplane 200. This greatly reduces the number of first lap pads 104 used to provide test signals at the edge of the light-emitting unit carrier 100, or reduces the number of signal vias, which is beneficial for the testing and sorting of the light-emitting unit carrier 100, reduces the process difficulty, and improves the process yield of the light-emitting unit carrier 100 and the display panel.

[0063] Optionally, based on the above technical solutions, such as Figure 5 As shown, Figure 5 This is a cross-sectional structural diagram of a display panel provided in an embodiment of the present invention. The driving backplate 200 also includes a driving chip 203 and a plurality of first conductive vias 204. The driving chip 203 and the (n-1)TmC driving circuit are located on two opposite surfaces of the second substrate 201. The first conductive vias 204 are electrically connected to the driving chip 203 through conductive lines. The second lap pads 202 cover the first conductive vias one by one.

[0064] Specifically, in the driving backplane 200, the driving chip 203 transmits the driving signal to the second bonding pad 202 through the conductive line and the first conductive via 204, and then the first bonding pad 104 is used to provide the driving signal to the light-emitting unit carrier board 100.

[0065] Optionally, based on the above technical solutions, such as Figure 5 As shown, the first substrate 101 is in contact with the second substrate 201. The micro light-emitting unit device 102, the fluid control thin film transistor 103 and the first lap pad 104 are located on the side of the first substrate 101 away from the second substrate 201. The second lap pad 202 is electrically connected to the first lap pad 104 through a conductive line, and the surface of the second lap pad 202 away from the second substrate 201 is flush with the surface of the first lap pad 104 away from the first substrate 101.

[0066] Specifically, the flow-controlled thin-film transistor 103 and the first bonding pad 104 are electrically connected through contact. The flow-controlled thin-film transistor 103 provides driving current to each of the micro light-emitting unit devices 102. The first bonding pad 104 provides power and control signals to the flow-controlled thin-film transistor 103 and also provides power signals to the micro light-emitting unit devices 102. The driving chip 203 transmits the driving signal to the second bonding pad 202 through conductive lines and the first conductive via 204, and then provides the driving signal to the light-emitting unit carrier board 100 through the first bonding pad 104.

[0067] Specifically, Figure 6 This is a cross-sectional structural diagram of a light-emitting unit carrier plate provided in an embodiment of the present invention. Figure 7 This is a cross-sectional structural diagram of a drive backplate provided in an embodiment of the present invention. Figure 6 The light-emitting unit carrier plate 100 shown is placed on Figure 7 By placing the drive backplate 200 shown above, one can obtain Figure 5 The image shows a modular display panel. The drive backplate 200 supports the light-emitting unit carrier plate 100. Figure 5 The second lap pad 202 of the drive backplane 200 is electrically connected to the first lap pad 104 of the light-emitting unit carrier board 100 via conductive lines, such as gold wire bonding.

[0068] Optionally, the display panel further includes a module encapsulation layer 300, which covers the light-emitting unit carrier 100 and the second substrate 201. Specifically, the module encapsulation layer 300 may include multiple sublayers, which may be a stack of organic and inorganic layers to prevent the intrusion of oxygen and moisture.

[0069] Optionally, based on the above technical solutions, such as Figure 8 As shown, Figure 8 This is a cross-sectional structural diagram of another display panel provided in an embodiment of the present invention. The first substrate 101 further includes a plurality of second conductive vias 106, and the first lap pads 104 cover the second conductive vias 106 one by one. The second lap pads 202 are in contact with the first substrate 101. The micro light-emitting unit device 102, the flow control thin film transistor 103 and the first lap pads 104 are located on the side of the first substrate 101 away from the second substrate 201. The second lap pads 202 are used to support the first substrate 101, and the second conductive vias 106 are located within the orthographic projection of the second lap pads 202 on the second substrate 201.

[0070] Specifically, the flow-controlled thin-film transistor 103 and the first bonding pad 104 are electrically connected through contact. The flow-controlled thin-film transistor 103 provides driving current to each of the micro light-emitting unit devices 102. The first bonding pad 104 provides power and control signals to the flow-controlled thin-film transistor 103 and also provides power signals to the micro light-emitting unit devices 102. The driving chip 203 transmits the driving signal to the second bonding pad 202 through conductive lines and the first conductive via 204, and then provides the driving signal to the light-emitting unit carrier board 100 through the first bonding pad 104.

[0071] Specifically, Figure 9 This is a cross-sectional structural diagram of another light-emitting unit carrier plate provided in an embodiment of the present invention. Figure 10 This is a schematic cross-sectional view of another drive backplate provided in an embodiment of the present invention. Figure 9 The light-emitting unit carrier plate 100 shown is placed on Figure 10 By placing the drive backplate 200 shown above, one can obtain Figure 8 The image shows a spliced ​​display panel. The second lap pad 202 of the drive backplate 200 supports the light-emitting unit carrier plate 100. Figure 10 The second lap pad 202 of the driving backplate 200 is electrically connected to the first lap pad 104 of the light-emitting unit carrier plate 100 through the second conductive via 106 of the first substrate 101.

[0072] Optionally, the light-emitting unit carrier 100 further includes a light-emitting unit carrier encapsulation layer 105 to prevent the intrusion of oxygen and moisture.

[0073] Optionally, based on the above technical solutions, such as Figure 11 As shown, Figure 11 This is a schematic diagram of a driving circuit corresponding to a micro light-emitting unit device provided in an embodiment of the present invention. The driving circuit includes n TFTs and m capacitors, where n is 2 and m is 1. Figure 12 yes Figure 11 The timing diagram of the drive circuit is shown. (See example.) Figure 11 As shown, the 2T1C driver circuit can implement the simplest digital PWM (Pulse Width Modulation) drive, including one switching thin-film transistor T1, one flow-controlled thin-film transistor T2, one storage capacitor, a scan control signal Scan, a data control signal Data, a power supply line VDD, and a ground line GND. Figure 13 As shown, Figure 13 This is a schematic diagram of another light-emitting unit carrier provided in an embodiment of the present invention. The driving circuit corresponding to the sub-pixel of the light-emitting unit carrier 100 includes one flow-controlled thin-film transistor 103, i.e., thin-film transistor T2. Figure 14 and Figure 15 As shown, Figure 14 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention. Figure 15 yes Figure 14 A schematic diagram of the 1T1C driving circuit within the area where a light-emitting unit carrier board is placed. Taking the driving circuit of a 2T1C pixel unit as an example, the TMIP light-emitting unit carrier board 100 of the present invention only requires 5 first lap pads 104 or vias, namely 1 VDD pad (the three RGB sub-pixels can share the pad), 1 Vss pad (the three RGB sub-pixels can share the pad), and the gate pad of the R / G / B current-controlled thin-film transistor T2. Specific sorting test method: Apply high and low level signals to the VDD and Vss pads, apply a high level to the gate pad of the R / G / B current-controlled thin-film transistor T2, and observe the luminous brightness, current, and wavelength of the micro-light-emitting unit device 102; apply high and low level signals to the VDD and Vss pads, apply a low level to the gate pad of the R / G / B current-controlled thin-film transistor T2, and observe the dark-state brightness and current of the micro-light-emitting unit device 102; the TMIP light-emitting unit carrier board 100 only contains the current-controlled thin-film transistor T2 and the micro-light-emitting unit device 102, while the thin-film transistor T1 and capacitor are fabricated on the driving backplane 200. For the 2T1C driving circuit, existing TMIP technology requires setting nine first overlapping pads 104 or signal vias on the light-emitting unit carrier board 100. The above technical solution greatly reduces the number of first lap pads 104 on the edge of the light-emitting unit carrier board 100 used to provide test signals, or reduces the number of signal vias, which is beneficial for the testing and sorting of the light-emitting unit carrier board 100, reduces the process difficulty, and improves the process yield of the light-emitting unit carrier board 100 and the display panel.

[0074] Optionally, based on the above technical solutions, such as Figure 13 As shown, the first bonding pad 104 includes a VDD pad, a VSS pad, and at least one gate signal pad, which provides control signals to the flow control thin film transistors 103 in a one-to-one correspondence.

[0075] For example, Figure 13 The diagram illustrates red-emitting, green-emitting, and blue-emitting micro-light-emitting unit devices 102. The first bonding pad 104 includes a VDD pad, a VSS pad, and three gate signal pads: gate signal pad G1, gate signal pad G2, and gate signal pad G3. Gate signal pads G1, G2, and G3 provide control signals to the current-controlled thin-film transistor 103 (i.e., thin-film transistor T2) in a one-to-one correspondence. The VDD and VSS pads are used to provide power signals.

[0076] Optionally, based on the above technical solutions, such as Figure 16 As shown, Figure 16 This is a schematic diagram of another driving circuit corresponding to a micro light-emitting unit device provided in an embodiment of the present invention. The driving circuit includes n TFTs and m capacitors, where n is 5 and m is 2. Figure 17 yes Figure 16 The timing diagram of the drive circuit is shown. Figure 16 As shown, the driving circuit of the 5T2C pixel unit can realize analog PWM drive, which includes four switching thin-film transistors T1 / T2 / T3 / T4, one flow-controlled thin-film transistor T5, two storage capacitors C1 / C2, scan control signals Scan / VC1 / Vba, data control signal Data, slope signal sweep, power supply line VDD, and ground line GND. Figure 18 As shown, Figure 18 This is a schematic diagram of another light-emitting unit carrier provided in an embodiment of the present invention. The driving circuit corresponding to the sub-pixel of the light-emitting unit carrier 100 includes one flow-controlled thin-film transistor 103, i.e., thin-film transistor T5. Figure 19 and Figure 20 As shown, Figure 19 This is a schematic diagram of another drive backplate provided in an embodiment of the present invention. Figure 20 yes Figure 19 A schematic diagram of the 4T2C driving circuit within the area where a light-emitting unit carrier board is placed. Taking the driving circuit of a 5T2C pixel unit as an example, the TMIP light-emitting carrier board of the present invention only requires 7 first overlapping pads 104 or vias, namely 1 VDD pad (the three RGB sub-pixels can share the pad), 3 Vss pads (the three RGB sub-pixels can share the pad), and the gate pad of the R / G / B current-controlled thin-film transistor T5. The specific sorting test method is as follows: High and low level signals are applied to the VDD and Vss pads, and a high level is applied to the gate pad of the R / G / B current-controlled thin-film transistor T5. The luminous intensity, current, and wavelength of the micro-light-emitting unit device 102 are observed. High and low level signals are applied to the VDD and Vss pads, and a low level is applied to the gate pad of the R / G / B current-controlled thin-film transistor T5. The dark-state brightness and current of the micro-light-emitting unit device 102 are observed. The TMIP light-emitting unit carrier board 100 only contains the current-controlled thin-film transistor T5 and the micro-light-emitting unit device 102, while the thin-film transistors T1 / T2 / T3 / T4 and capacitors C1 / C2 are fabricated on the driver backplane 200. For the 5T2C driver circuit, existing TMIP technology requires 18 first overlap pads or signal vias. The above technical solution greatly reduces the number of first lap pads 104 on the edge of the light-emitting unit carrier board 100 used to provide test signals, or reduces the number of signal vias, which is beneficial for the testing and sorting of the light-emitting unit carrier board 100, reduces the process difficulty, and improves the process yield of the light-emitting unit carrier board 100 and the display panel.

[0077] Optionally, based on the above technical solutions, such as Figure 18 As shown, the first bonding pad 104 includes a VDD pad, at least one VSS pad, and at least one gate signal pad. The gate signal pad provides control signals to the current-controlled thin-film transistors 103 in a one-to-one correspondence, and the VSS pad provides power signals to the current-controlled thin-film transistors 103 in a one-to-one correspondence.

[0078] For example, Figure 18 The diagram illustrates red-emitting, green-emitting, and blue-emitting micro-light-emitting unit devices 102. The first bonding pad 104 includes a VDD pad, three VSS pads, and three gate signal pads. The three gate signal pads are gate signal pads G1, G2, and G3. The three VSS pads are VSS pads SG, SR, and SB. Gate signal pads G1, G2, and G3 provide control signals to the current-controlled thin-film transistor 103, i.e., thin-film transistor T5, in a one-to-one correspondence. The VDD pad, VSS pads SG, SR, and SB are used to provide power signals to the thin-film transistor T5.

[0079] Optionally, based on the above technical solution, each light-emitting unit carrier 100 has at least one micro light-emitting unit device of at least one color constituting a pixel. When multiple light-emitting unit carriers 100 are placed on the driving backplate 200, a splicing display panel with multiple pixels as the smallest splicing unit can also be realized.

[0080] This invention also provides a display device comprising any of the display panels described in this invention. Therefore, the beneficial effects of this display device comprising any of the display panels described in this invention will not be elaborated further here.

[0081] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0082] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display panel, characterized in that, include: At least one light-emitting unit carrier plate and a driving back plate, wherein the driving back plate is used to support at least one of the light-emitting unit carrier plates; The light-emitting unit carrier includes a first substrate, at least one micro light-emitting unit device of at least one emitting color, and at least one fluidized thin-film transistor. The first substrate is provided with a first signal overlap area, and the first signal overlap area is provided with a plurality of first overlap pads. The micro light-emitting unit device, the fluidized thin-film transistor, and the first overlap pads are located on one side of the first substrate. The fluidized thin-film transistor is used to provide driving current to the micro light-emitting unit device in a one-to-one correspondence. The first overlap pads are used to provide power signals and control signals to the fluidized thin-film transistor, and the first overlap pads are used to provide power signals to the micro light-emitting unit device. The driving backplane includes a second substrate and at least one (n-1)TmC driving circuit. The second substrate is provided with a second signal overlap region, and the second signal overlap region is provided with a plurality of second overlap pads. The value of n is an integer greater than or equal to 2, and the value of m includes an integer greater than or equal to 1. The (n-1)TmC driving circuit includes (n-1) thin film transistors and m capacitors. The (n-1)TmC driving circuit and the second overlap pads are located on one side of the second substrate, and the second overlap pads and the first overlap pads are electrically connected. The (n-1)TmC driving circuit and the flow-controlled thin-film transistor correspond one-to-one to form the driving circuit of the micro light-emitting unit device.

2. The display panel according to claim 1, characterized in that, The driving backplane also includes a driving chip and a plurality of first conductive vias. The driving chip and the (n-1)TmC driving circuit are located on two opposite surfaces of the second substrate. The first conductive vias are electrically connected to the driving chip through conductive lines. The second lap pads cover the first conductive vias one by one.

3. The display panel according to claim 1, characterized in that, The first substrate is in contact with the second substrate, and the micro light-emitting unit device, the fluid control thin film transistor and the first bonding pad are located on the side of the first substrate away from the second substrate; The second lap pad is electrically connected to the first lap pad via a conductive line, and the surface of the second lap pad away from the second substrate is flush with the surface of the first lap pad away from the first substrate.

4. The display panel according to claim 1, characterized in that, The first substrate also includes a plurality of second conductive vias, and the first lap pads cover the second conductive vias one by one; The second lap pad contacts the first substrate. The micro light-emitting unit device, the fluid control thin film transistor and the first lap pad are located on the side of the first substrate away from the second substrate. The second lap pad is used to support the first substrate, and the second conductive via is located one-to-one within the orthographic projection of the second lap pad on the second substrate.

5. The display panel according to claim 1, characterized in that, The value of n is 2, and the value of m is 1.

6. The display panel according to claim 5, characterized in that, The first lap pad includes a VDD pad, a VSS pad, and at least one gate signal pad, wherein the gate signal pad provides control signals to the flow control thin film transistors in a one-to-one correspondence.

7. The display panel according to claim 1, characterized in that, The value of n is 5, and the value of m is 2.

8. The display panel according to claim 7, characterized in that, The first bonding pad includes a VDD pad, at least one VSS pad, and at least one gate signal pad. The gate signal pad provides control signals to the flow control thin film transistors one by one, and the VSS pad provides power signals to the flow control thin film transistors one by one.

9. The display panel according to claim 1, characterized in that, Each of the micro-light-emitting unit devices of at least one emitting color on each of the light-emitting unit carriers constitutes a pixel.

10. A display device, characterized in that, Includes the display panel described in any one of claims 1-9.

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