electronic devices

Abstract

This application discloses an electronic device, including a circuit board, a first antenna, and a second antenna. The circuit board includes a first feed line and a second feed line, the first feed line being electrically connected to the first antenna and the second feed line being electrically connected to the second antenna. A dielectric substrate and the circuit board are spaced apart in the thickness direction of the electronic device, wherein the first antenna and the second antenna are both disposed on the side of the circuit board facing the dielectric substrate. A conductive frame and a conductive connection portion are disposed between the dielectric substrate and the circuit board, and the conductive connection portion, the conductive frame, the dielectric substrate, and the circuit board form a cavity, in which the first antenna and the second antenna are located. The dielectric substrate includes a first region opposite to the first antenna, a second region opposite to the second antenna, and a third region located between the first region and the second region. The third region is provided with a conductive layer, and the conductive layer is provided with a plurality of first grooves recessed inward from the edge of the conductive layer.

Description

Technical Field

[0001] This application relates to the field of antenna technology, and more particularly to an electronic device. Background Technology

[0002] Millimeter wave (mmW) technology offers enormous communication capacity due to its large bandwidth, leading to numerous applications in 5G communications. Furthermore, its high directional diffraction-free characteristics also make it highly applicable in the field of detection.

[0003] Both conventional radar antennas and multi-input multi-output (MIMO) radar antennas utilize a transmitting antenna (TX) to emit coded electromagnetic waves, which radiate through space to an object. Due to the object's own electromagnetic properties, scattered waves are transmitted to the receiving antenna (RX). Signal processing allows for target detection. As a crucial component for transmitting and receiving low-modulation electromagnetic signals, the radar antenna element is naturally a key research focus.

[0004] However, in radar sensing systems, the isolation between transmitting and receiving antennas is no longer solely determined by electromagnetic field propagation through multiple paths. Instead, it is affected by complex path propagation and coupling, leading to a deterioration in isolation and impacting the performance of the sensing system. Summary of the Invention

[0005] This application provides an electronic device that solves the problem of poor antenna unit isolation.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] This application provides an electronic device, comprising: a circuit board; a first antenna and a second antenna, both disposed on the circuit board; the circuit board including a first feed line and a second feed line, the first feed line being electrically connected to the first antenna and the second feed line being electrically connected to the second antenna; a dielectric substrate, the dielectric substrate and the circuit board being spaced apart in the thickness direction of the electronic device, wherein the first antenna and the second antenna are both disposed on the side of the circuit board facing the dielectric substrate; a conductive frame and a conductive connection portion, the conductive frame being disposed on one side of the first antenna and the second antenna, the conductive connection portion being disposed on the other side of the first antenna and the second antenna, and the conductive frame and the conductive connection portion being disposed between the dielectric substrate and the circuit board along the thickness direction of the electronic device, the conductive connection portion, the conductive frame, the dielectric substrate and the circuit board forming a cavity, the first antenna and the second antenna being located within the cavity; wherein the dielectric substrate includes: a first region opposite to the first antenna, a second region opposite to the second antenna, and a third region located between the first region and the second region, wherein the third region is provided with a conductive layer, and the conductive layer is provided with a plurality of first grooves recessed inward from the edge of the conductive layer. Therefore, the structure of the electronic device can be reused as a housing component in the antenna module, improving the antenna's directivity and eliminating the need for a separate housing component, thus saving space. Furthermore, the first groove on the conductive layer can suppress impedance matching issues in the suppression frequency band. Additionally, the groove generates a reverse radiated current around it due to resonance, reducing the antenna element's radiation effect in the suppression frequency band, achieving field decoupling and better filtering characteristics. This also improves the isolation between the first and second antennas.

[0008] In one optional implementation, the conductive frame includes: a fourth region opposite to the first antenna, a fifth region opposite to the second antenna, and a sixth region located between the fourth and fifth regions, and a plurality of second grooves recessed inward from the edges of the conductive frame. Thus, by providing second grooves on the conductive frame, impedance matching of the antenna can be disrupted in the suppression frequency band. Furthermore, the grooves also generate reverse radiated currents around them due to resonance, reducing the radiation effect of the antenna element in the suppression frequency band, achieving field decoupling, and realizing better filtering characteristics. This can further improve the isolation between the first and second antennas.

[0009] In one alternative implementation, the conductive frame has a second groove formed on its edge near the dielectric substrate. This facilitates the installation of the second groove.

[0010] In one alternative implementation, the conductive layer is provided near the edge of the conductive frame, and / or the conductive layer is provided with the first groove near the edge of the conductive connection portion. This allows for the creation of more grooves.

[0011] In one alternative implementation, the depth l of the first groove satisfies: Where λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first or second antenna, and A is a preset error threshold, A≤λ / 10. Therefore, the filtering effect of the first groove is better.

[0012] In one alternative implementation, the width d of the first groove satisfies: Where λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first or second antenna. Therefore, more first grooves can be created.

[0013] In one optional implementation, a plurality of the first grooves extend from the third region to the first region and / or the second region, and the length of the plurality of the first grooves in the first region and / or the second region is less than [a certain value]. Where λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first or second antenna. Therefore, the first cutoff structure has a wider range, which can improve the isolation between the first and second antennas.

[0014] In one optional implementation, the first and second regions are provided with a plurality of conductive patches arranged in an array. This array arrangement of conductive patches increases the transmittance of the dielectric substrate for radio frequency signals in the corresponding frequency band, making it easier for energy to pass through the housing assembly, thereby improving the transmittance of the housing assembly.

[0015] In one optional implementation, the conductive patch has a square structure, and the side length of the conductive patch is [missing information]. The distance between the centers of two adjacent conductive patches is Where λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first or second antenna. This allows for further improvement in the transmittance of the conductive dielectric plate.

[0016] In one alternative implementation, the conductive patch has slits. This can further improve the transmittance of the conductive dielectric plate.

[0017] In one optional implementation, the first region and the second region are provided with conductive grids, and the distance between the centers of two adjacent conductive grids is [missing information]. Where λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first or second antenna. This allows for further improvement in the transmittance of the conductive dielectric plate.

[0018] In one alternative implementation, the electronic device includes a cover plate comprising a display area and a non-display area, the non-display area surrounding the display area, and the glass housing located within the non-display area. This avoids affecting the display area.

[0019] In one alternative implementation, the electronic device includes a back cover comprising the glass housing. This allows the back cover of the electronic device to be reused as the antenna housing, improving the antenna's directivity and eliminating the need for a separate housing assembly, thus saving space.

[0020] In one optional implementation, the conductive connection includes a display screen and conductive foam stacked along the thickness direction of the electronic device, wherein the display screen is located between the dielectric substrate and the conductive foam, and the conductive foam is located between the display screen and the circuit board. This allows the display screen and conductive foam of the electronic device to be reused in the antenna housing, improving the antenna's directivity and eliminating the need for a separate housing assembly, thus saving space.

[0021] In one alternative implementation, the conductive connection includes a metal bracket, through which the dielectric substrate is connected to the circuit board. Thus, the metal bracket can serve as part of the antenna housing, improving the antenna's directivity.

[0022] In one alternative implementation, the electronic device includes a frame, the conductive frame comprising a first portion and a second portion connected to each other, the first portion being embedded inside the frame and the second portion being connected to the circuit board. Thus, the conductive frame is disposed within the frame, saving space.

[0023] In one alternative implementation, the first portion and the second portion are perpendicular, with the second portion positioned close to the surface of the circuit board away from the dielectric substrate. Thus, the second portion can also be used to carry the circuit board.

[0024] In one alternative implementation, the conductive frame is positioned opposite to the conductive connection portion, and the cavity has a semi-enclosed structure. This reduces the space occupied by the cavity-based electronic device.

[0025] In one alternative implementation, the first antenna and the second antenna operate in the same frequency band, and both are millimeter-wave antennas. The distance between the first antenna and the second antenna is greater than or equal to the wavelength of the space wave corresponding to the resonant frequency of either the first antenna or the second antenna. Therefore, the millimeter-wave antenna occupies less space.

[0026] In one optional implementation, the first antenna is a receiving antenna and the second antenna is a transmitting antenna; alternatively, the first antenna is a transmitting antenna and the second antenna is a receiving antenna. Thus, the first and second antennas can function as radar antennas to transmit and receive electromagnetic waves.

[0027] In one alternative implementation, the electronic device includes intelligent transportation equipment, smart home equipment, intelligent manufacturing equipment, drones, or robots. Therefore, the antenna of the electronic device can be a radar antenna, and the electronic device has a radar sensing system to achieve intelligent control. Attached Figure Description

[0028] Figure 1 A schematic diagram of a smart home system provided in an embodiment of this application;

[0029] Figure 2 A schematic diagram of the disassembly structure of an electronic device provided in an embodiment of this application;

[0030] Figure 3a This is a schematic diagram of the structure of an antenna module;

[0031] Figure 3b for Figure 3a Side view of the antenna module;

[0032] Figure 4a This is a schematic diagram of the structure of an antenna;

[0033] Figure 4b This is a frame diagram of an antenna;

[0034] Figure 5 for Figure 3a The transmission efficiency curve of the antenna module shown is displayed.

[0035] Figure 6a This is a schematic diagram of another type of antenna module;

[0036] Figure 6b for Figure 6a Side view of the antenna module;

[0037] Figure 7 for Figure 6a Physical diagram of the antenna module;

[0038] Figure 8 This is a schematic diagram of the structure of a dielectric substrate;

[0039] Figure 9 This is a schematic diagram of another type of dielectric substrate;

[0040] Figure 10a for Figure 6a The electric field vector diagram of the antenna module shown;

[0041] Figure 10b for Figure 6a The electric field amplitude diagram of the antenna module shown is as follows;

[0042] Figure 11 for Figure 6a The transmission efficiency curve of the antenna shown is shown.

[0043] Figure 12 for Figure 6a The diagram shows the parameter distribution of the antenna, including S11, S31, and S21.

[0044] Figure 13a This is a schematic diagram of the structure of an antenna module provided in an embodiment of this application;

[0045] Figure 13b for Figure 13a Side view of the antenna module;

[0046] Figure 14 for Figure 13a A schematic diagram of a mid-mounted antenna module in an electronic device;

[0047] Figure 15a for Figure 13a Physical diagram of the antenna module;

[0048] Figure 15b for Figure 14 A cross-sectional view of a medium antenna module (AA).

[0049] Figure 15c for Figure 14 Another AA cross-sectional view of the antenna module;

[0050] Figure 16 for Figure 14 Schematic diagram of the medium dielectric substrate;

[0051] Figure 17 for Figure 14 Plan view of the intermediate dielectric substrate;

[0052] Figure 18 for Figure 13a The parameter distribution diagrams of S11, S31, and S21 of the antenna module shown are presented.

[0053] Figure 19 This is a schematic diagram of another antenna module provided in an embodiment of this application;

[0054] Figure 20 for Figure 19 Side view of the antenna module;

[0055] Figure 21 for Figure 19 A cross-sectional view of the antenna module;

[0056] Figure 22 This is a schematic diagram of a conductive frame structure;

[0057] Figure 23 for Figure 19 The parameter distribution diagrams of S11, S31, and S21 of the antenna module shown are presented.

[0058] Figure 24 for Figure 19 The electric field vector diagram of the antenna module shown;

[0059] Figure 25 for Figure 19 The electric field amplitude diagram of the antenna module shown is as follows;

[0060] Figure 26 A frame diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0062] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0063] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0064] The following explains the terminology that may appear in the embodiments of this application.

[0065] Antenna return loss: This can be understood as the ratio of the signal power reflected back to the antenna port after passing through the antenna circuit to the transmit power at the antenna port. The smaller the reflected signal, the larger the signal radiated into space through the antenna, and the higher the antenna's radiation efficiency. Conversely, the larger the reflected signal, the smaller the signal radiated into space through the antenna, and the lower the antenna's radiation efficiency.

[0066] Antenna return loss can be represented by the S11 parameter, which is usually negative. The smaller the S11 parameter, the smaller the antenna return loss and the greater the antenna's radiation efficiency; the larger the S11 parameter, the greater the antenna return loss and the lower the antenna's radiation efficiency.

[0067] Antenna isolation: refers to the ratio of the power of the signal transmitted by one antenna to the power of the signal received by another antenna.

[0068] Ground plane (also known as floor): This can be formed by a single layer or multiple layers in a circuit board. The circuit board can be a printed circuit board, such as an 8-layer, 10-layer, or 12-14-layer board with 8, 10, 12, 13, or 14 layers of conductive material, or components separated and electrically insulated by dielectric or insulating layers such as fiberglass or polymers. A circuit board typically includes a dielectric substrate, a ground plane, and trace layers. The trace layers / conductive layers are electrically connected through vias and can form the entire ground plane. Components such as displays, touchscreens, input buttons, transmitters, processors, memory, batteries, charging circuits, and System-on-Chip (SoC) structures can be mounted on or connected to the circuit board; or electrically connected to the trace layers / conductive layers within the circuit board. For example, an RF source is connected to a trace layer. The ground plane is made of conductive material. The conductive material can be any of the following: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil on an insulating substrate and tin-plated copper, cloth impregnated with graphite powder, a graphite-coated substrate, a copper-plated substrate, a brass-plated substrate, and an aluminum-plated substrate. Those skilled in the art will understand that the floor can also be made of other conductive materials. The floor can also be a thin metal film beneath the screen of an electronic device (such as a mobile phone).

[0069] Smart home technology embodies the interconnectedness of everything under the influence of the internet. It connects various devices in the home, such as audio-visual equipment, smart lighting, smart curtains, smart air conditioners, security monitoring equipment, digital cinema systems, and smart appliances, through IoT technology. This provides a variety of functions and methods, including appliance control, lighting control, remote telephone control, indoor and outdoor remote control, burglar alarms, environmental monitoring, and HVAC control. Among the various functions of smart home control, smart lighting is a relatively basic control method, enabling lights to be turned on when the door is opened or before the door is opened, and turned off when the door is closed.

[0070] The basic logic for implementing smart home control is as follows: inferring the user's intentions based on user commands or scenarios, then using these inferred intentions as input to the smart home controller, which subsequently controls the corresponding smart home devices to perform a set of actions. Figure 1 The scenario depicted includes user 001, a radar sensing system, and smart home device 002. The user engages in daily activities, which are captured by the radar sensing system, which infers the user's intentions. The radar sensing system then determines the strategy to be executed by the smart home device. Smart home device 002 then executes this strategy.

[0071] Smart home devices can include smart TVs, projectors, smart water heaters, smart curtains, smart clothes racks, smart washing machines, and other home appliances. Smart homes typically incorporate integrated circuits that respond to control strategies determined by the smart home controller based on the user's physical and physiological activities in daily life, thereby altering the smart home's operating mode.

[0072] The radar sensing system can be integrated into the electronic device 10. In this embodiment, the electronic device 10 can be a mobile phone, tablet computer, laptop computer, smart home device, smart bracelet, smartwatch, smart helmet, smart glasses, etc. The electronic device 10 can also be a handheld device with wireless communication capabilities, a computing device, or other processing devices connected to a wireless modem, an in-vehicle device, an electronic device in a 5G network, or an electronic device in a future evolved public land mobile network (PLMN), etc. This embodiment is not limited to these categories. Figure 1 An electronic device 10 provided in an embodiment of this application is illustrated by way of example.

[0073] like Figure 2 As shown, the electronic device 10 may include: a cover 13, a display / module 15, a printed circuit board (PCB) 17, a middle frame 19, and a rear cover 21. It should be understood that in some embodiments, the cover 13 may be a glass cover, but it may also be replaced with a cover made of other materials, such as an ultra-thin glass cover, a PET (Polyethylene terephthalate) cover, etc.

[0074] The cover plate 13 can be set close to the display screen 15, and can be mainly used to protect the display screen 15 from dust.

[0075] In one embodiment, the display screen 15 may include a liquid crystal display (LCD), a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc., and this application does not limit it.

[0076] The middle frame 19 mainly serves to support the entire machine. Figure 2The diagram shows PCB 17 positioned between the middle frame 19 and the back cover 21. It should be understood that in one embodiment, PCB 17 may also be positioned between the middle frame 19 and the display screen 15; this application does not impose any limitations on this. The printed circuit board PCB 17 can be made of flame-retardant material (FR-4) dielectric, Rogers dielectric, or a hybrid dielectric of Rogers and FR-4, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric is a high-frequency board. Electronic components, such as radio frequency chips, are mounted on PCB 17.

[0077] In one embodiment, a metal layer may be disposed on the printed circuit board PCB 17. This metal layer can be used to ground electronic components carried on the PCB 17, or to ground other components such as bracket antennas, frame antennas, etc. This metal layer may be referred to as a ground plane, grounding plate, or grounding layer. In one embodiment, the metal layer can be formed by etching metal onto the surface of any dielectric substrate in the PCB 17. In one embodiment, the grounding metal layer may be disposed on the side of the PCB 17 near the middle frame 19. In one embodiment, the edge of the PCB 17 can be considered as the edge of its grounding layer. In one embodiment, the metal middle frame 19 may also be used to ground the aforementioned components. The electronic device 10 may also have other ground planes / grounding plates, as previously described, and will not be repeated here.

[0078] Due to the compact nature of electronic devices, a ground plane / grounding layer is typically provided in the internal space 0-2mm from the inner surface of the frame (e.g., printed circuit boards, mid-frames, screen metal layers, batteries, etc. can all be considered part of the ground plane). In one embodiment, a medium is filled between the frame and the ground plane. The length and width of the rectangle formed by the inner surface contour of the filling medium can be simply considered as the length and width of the ground plane; alternatively, the length and width of the rectangle formed by the superimposed contour of all conductive parts inside the frame can be considered as the length and width of the ground plane.

[0079] The electronic device 10 may also include a battery (not shown). The battery may be disposed between the middle frame 19 and the back cover 21, or between the middle frame 19 and the display screen 15; this application does not limit this. In some embodiments, the PCB 17 is divided into a motherboard and a daughterboard, and the battery may be disposed between the motherboard and the daughterboard. The motherboard may be disposed between the middle frame 19 and the upper edge of the battery, and the daughterboard may be disposed between the middle frame 19 and the lower edge of the battery.

[0080] The electronic device 10 may also include a bezel 11, which may be formed of a conductive material such as metal. The bezel 11 may be disposed between the display screen 15 and the back cover 21 and extend circumferentially around the periphery of the electronic device 10. The bezel 11 may have four sides surrounding the display screen 15 to help secure the display screen 15. In one implementation, the bezel 11 made of a metallic material can be directly used as the metallic bezel of the electronic device 10, forming a metallic bezel appearance suitable for industrial design (ID). In another implementation, the outer surface of the bezel 11 may also be a non-metallic material, such as a plastic bezel, forming a non-metallic bezel appearance suitable for non-metallic ID.

[0081] The middle frame 19 may include a border 11. The middle frame 19, including the border 11, is a single unit that supports the electronic components in the device. The cover plate 13 and the rear cover 21 respectively cover the upper and lower edges of the border to form the housing of the electronic device. Alternatively, the border 11 may not be considered part of the middle frame 19. In one embodiment, the border 11 may be connected to the middle frame 19 and integrally formed. In another embodiment, the border 11 may include an inwardly extending protrusion to connect to the middle frame 19, for example, by means of spring clips, screws, welding, etc. In one embodiment, the cover plate 13, the rear cover 21, the border 11, and the middle frame 19 may be collectively referred to as the housing of the electronic device 10. It should be understood that "housing" may be used to refer to part or all of any one of the cover plate 13, the rear cover 21, the border 11, or the middle frame 19, or to any combination of the cover plate 13, the rear cover 21, the border 11, or the middle frame 19.

[0082] The back cover 21 can be made of metal; it can also be made of non-conductive material, such as glass back cover, plastic back cover, or other non-metallic back cover; or it can be made of both conductive and non-conductive materials.

[0083] In one embodiment, the back cover 21, which includes conductive material, can replace the middle frame 19 and serve as an integral part with the frame 11, providing support for the electronic components in the whole device.

[0084] In one embodiment, conductive portions in the mid-frame 19 and / or rear cover 21 can serve as a reference ground for the electronic device 10, wherein the frame 11, PCB 17, etc. of the electronic device can be grounded through electrical connection with the mid-frame.

[0085] In one embodiment, the radar sensing system includes an antenna, such as a radar antenna, which may be housed within a housing, such as a bracket antenna. Figure 2 (Not shown in the image). In one embodiment, the radar antenna is a millimeter-wave antenna.

[0086] In one embodiment, such as Figure 3a As shown, antenna 100 includes a first antenna 1001 and a second antenna 1002. In one embodiment, the first antenna 1001 and the second antenna 1002 operate in the same frequency band. In another embodiment, both the first antenna 1001 and the second antenna 1002 are millimeter-wave antennas, operating in the frequency band of 10 GHz to 100 GHz. For example, the first antenna 1001 and the second antenna 1002 operate at 24 GHz.

[0087] Figure 4a This is a schematic diagram of an antenna structure. (Example) Figure 4a As shown, the first antenna 1001 and the second antenna 1002 are both mounted on the circuit board 101. The first antenna 1001 and the second antenna 1002 are spaced apart, which improves the isolation between the first antenna 1001 and the second antenna 1002.

[0088] Figure 4b This is a frame diagram of an antenna. (Example) Figure 4b As shown, the first antenna 1001 or the second antenna 1002 includes: a radio frequency interface chip and an algorithm processing unit. The algorithm unit is used to control the radio frequency interface chip to transmit or receive electromagnetic waves according to user instructions or instructions inferred from user actions.

[0089] To improve the stability of antenna radiation, in some embodiments of the application, such as Figure 3a , Figure 3b As shown, the antenna can be placed in the cavity of the electronic device 10, and a dielectric substrate 102 is placed on one side of the cavity, so that the antenna 100 is opposite to the dielectric substrate 102.

[0090] In one embodiment, the cavity is formed by a dielectric substrate 102, a circuit board 101, a conductive frame 103, and a conductive connection portion 104. The dielectric substrate 102 and the circuit board 101 are stacked, and the conductive frame 103 and the conductive connection portion 104 are both located between the dielectric substrate 102 and the circuit board 101. In one embodiment, the conductive frame 103 and the conductive connection portion 104 are used to connect the dielectric substrate 102 and the circuit board 101. In one embodiment, there is a gap between the conductive frame 103 and / or the conductive connection portion 104 and the dielectric substrate 102; and / or there is a gap between the conductive frame 103 and / or the conductive connection portion 104 and the circuit board 101.

[0091] In one embodiment, the cavity includes at least four surfaces, with the dielectric plate 102 as the top surface, the circuit board 101 as the bottom surface, and multiple conductive connection parts 104. The conductive frame 103 and the multiple conductive connection parts 104 are connected end to end in sequence and are respectively connected to the four sides of the dielectric plate 102 and the circuit board 101 to form four side surfaces, which together with the dielectric plate 102 and the circuit board 101 form the cavity.

[0092] In one embodiment, the cavity is a semi-enclosed structure, with the conductive frame 103 and the conductive connection portion 104 arranged opposite to each other and connected to the two sides of the dielectric substrate 102 and the circuit board 101, respectively, serving as the two sides of the cavity.

[0093] In another embodiment, the cavity is a semi-enclosed structure, and the conductive frame 103 and the conductive connection part 104 are respectively connected to the three sides of the dielectric plate 102 and the circuit board 101, serving as the three sides of the cavity.

[0094] This cavity is not a completely sealed cavity; gaps may exist on its surface. The length of the gap should meet the following requirement: less than... Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna. It should be understood that the gap can be interpreted as an insulating gap, for example, it may include the gap between the conductive frame 103 and / or the conductive connection portion 104 and the circuit board 101.

[0095] In one embodiment, the dielectric substrate 102 and the circuit board 101 are spaced apart in the thickness direction of the electronic device. For example, the dielectric substrate 102 and the circuit board 101 may be arranged parallel to each other in the thickness direction of the electronic device. Here, the thickness direction of the electronic device refers to... Figure 2 , Figure 3a , Figure 3b The Y direction shown is... Figure 2 The orientation of the cover plate 13, display screen 15, middle frame 19 and back cover 21 of the electronic device 10 are stacked.

[0096] The first antenna 1001 or the second antenna 1002 is both located on the side of the circuit board 101 facing the dielectric substrate 102.

[0097] The dielectric substrate 102 is a structure capable of transmitting electromagnetic waves, and its dielectric constant is 3-10.

[0098] In one embodiment, the material of the dielectric substrate 102 includes insulating materials such as glass and resin. For example, the dielectric substrate 101 includes a glass housing 1020. The glass housing 1020 can be, for example... Figure 2 A portion of the cover 13 of the electronic device 10 shown can also be as follows: Figure 2 Part of the back cover 21 of the electronic device 10 shown.

[0099] Specifically, circuit board 101 may be part of the ground plane / grounding layer of electronic device 10. Circuit board 101 may be part of the circuit board of electronic device 10. For example, circuit board 101 may be... Figure 1This is part of PCB17. The circuit board 101 can be any metal layer inside the electronic device, not limited to the ground plane of the electronic device.

[0100] In one embodiment, the circuit board 101 includes a first feed line and a second feed line. The first feed line is electrically connected to the first antenna 1001 and is used to power the first antenna 1001. The second feed line is electrically connected to the second antenna 1002 and is used to power the second antenna 1002.

[0101] The first and second feeders are electrically connected to the RF interface chip for transmitting RF signals. In one embodiment, the first feeder is connected to the transmit port of the RF interface chip, and the second feeder is connected to the receive port of the RF interface chip. In this case, the first antenna 1001 is a transmitting antenna used to transmit electromagnetic waves to the outside, and the second antenna 1002 is a receiving antenna used to receive external electromagnetic waves.

[0102] In another embodiment, the first feeder is connected to the receiving port of the RF interface chip, the second feeder is connected to the transmitting port of the RF interface chip, the first antenna 1001 is a receiving antenna, and the second antenna 1002 is a transmitting antenna.

[0103] Example, Figure 3a The first antenna 1001 has two antennas, both of which are receiving antennas, and the second antenna 1002 has one antenna, which is a transmitting antenna.

[0104] The conductive frame 103 can be made of Figure 1 At least a portion of the frame 11 of the illustrated electronic device is formed, wherein the conductive frame 103 may be, for example, a conductive frame disposed around the periphery of the electronic device. In some embodiments, the conductive frame 103 may be, for example, a straight strip frame on the side frame, or an L-shaped frame at the junction of the top frame and the side frame.

[0105] The radar antenna's dielectric substrate 102, circuit board 101, conductive frame 103, and conductive connection 104 are all located in the area enclosed by the frame 11. For example, the conductive frame 103 and conductive connection 104 are arranged relative to the frame 11.

[0106] It should be noted that the conductive frame 103 can be a conductive frame formed of conductive materials such as metal, or it can be a conductive frame formed of non-conductive materials such as plastic and resin, as well as a conductive radiator disposed inside the non-conductive material, or a conductive radiator embedded inside the non-conductive material.

[0107] In one embodiment, the conductive connection portion 104 is formed by a display screen, conductive foam or metal spring, metal via or metal bracket. At least one opposing portion of the dielectric plate 102 and the circuit board 101 surrounding the cavity are connected via the conductive connection portion 104.

[0108] The embodiments of this application do not limit the structure of the cavity. In some embodiments of this application, the cavity may be a hollow structure.

[0109] In some other embodiments of this application, the cavity is also filled with a medium, which is an insulating material, such as resin or polychlorinated biphenyls (PCBs).

[0110] The electronic device provided in this application embodiment has a radar antenna 100 disposed in the cavity of the electronic device 10, and a dielectric substrate 102 disposed on the cavity at a position opposite to the radar antenna 100, so that the radar antenna 100 receives and transmits electromagnetic waves through the dielectric substrate 102, thereby improving the radiation efficiency of the antenna and making the radiation pattern more controllable.

[0111] Among them, the glass shell 1020 has a high dielectric constant, which makes it easy to generate a large reflection effect on electromagnetic fields, thus affecting the transmission efficiency of the antenna. Figure 5 for Figure 3a The diagram shows the transmission efficiency curve of the antenna module. Figure 5 As shown, the maximum transmittance is only -2.4dB, indicating low transmission efficiency.

[0112] To further improve the antenna's transmittance, in one embodiment, such as Figure 6a , Figure 6b , Figure 7 As shown, the dielectric substrate 102 further includes a conductive patch 1021 disposed on the glass housing 1020. For example... Figure 8 , Figure 9 As shown, the dielectric substrate 102 includes an array of conductive patches 1021, with gaps between adjacent conductive patches 1021. Each array of conductive patches 1021 is opposite to an antenna element; that is, along the thickness direction of the electronic device, the center of one array of conductive patches 1021 is opposite to the center of one antenna element. However, this "opposite" in this embodiment is not strictly relative and may contain errors. In this embodiment, the conductive patches 1021 are disposed on the same layer, that is, the conductive patches 1021 constitute a wave-transparent layer.

[0113] In one embodiment, such as Figure 8As shown, the conductive patch 1021 is a square conductive patch, and the side length of the conductive patch 1021 is one-fifth of the dielectric wavelength. An error of one-tenth of the wavelength is permissible. The period length of the conductive patch 1021 is approximately one-quarter of the dielectric wavelength, with an error of one-tenth of the wavelength permissible. The period length refers to the distance between the centers of two adjacent conductive patches 1021.

[0114] In one embodiment, such as Figure 9 As shown, the conductive patch 1021 is a square conductive patch, and the dimensions and periodic dimensions of the square conductive patch are as described above. The square conductive patch is also provided with an annular gap, which is made of a square ring. The side length of the square ring is smaller than the side length of the square conductive patch, and the difference is less than one-tenth of the dielectric wavelength.

[0115] Figure 11 for Figure 6a The diagram shows the transmission efficiency curve of the antenna. Figure 11 As shown, the highest transmittance is -9dB, compared to Figure 5 Compared to previous methods, this improves the antenna's transmission efficiency and ensures the transmission effect of the electromagnetic field.

[0116] Therefore, by providing the conductive patch 1021 on the glass housing 1020, the transmittance of the housing assembly to the corresponding frequency band radio frequency signal can be increased, making it easier for energy to be transmitted out of the housing assembly, thereby improving the wave transmittance of the housing assembly.

[0117] However, in radar sensing systems, the isolation between transmitting and receiving antennas is no longer solely determined by electromagnetic field propagation through multiple paths. Instead, it is affected by complex path propagation and coupling, leading to a deterioration in isolation and impacting the performance of the sensing system.

[0118] Figure 10a for Figure 6a The electric field vector diagram of the antenna module shown. Figure 10b for Figure 6a The electric field amplitude diagram of the antenna module shown is as follows. Figure 10a , Figure 10b As shown, after adding structures such as dielectric substrate and metal support, a large electric field direction is formed from the dielectric substrate to the metal support, which forms a waveguide connecting the first antenna and the second antenna, and will affect the isolation between the first antenna and the second antenna.

[0119] Figure 12 for Figure 6a The diagram shows the parameter distribution of the antenna, including S11, S31, and S21. Figure 6aThe first antenna 1001 is a dual-receiver antenna, and the second antenna 1002 is a transmitting antenna. The second antenna 1002 is designated as antenna 1, the first antenna closer to the second antenna 1002 is designated as antenna 2, and the first antenna farther from the second antenna 1002 is designated as antenna 3. Figure 6a The reflection coefficient of antenna 1 is as follows Figure 12 The S11 curve is shown in the figure. Figure 6a The isolation between antenna 1 and antenna 3 is as follows Figure 12 As shown in the S31 curve. Figure 6a The isolation between antennas 1 and 2 is as follows: Figure 12 The S21 curve is shown in the figure. The maximum isolation between the first antenna and the second antenna (antenna 1 and antenna 2) is approximately 30 dB.

[0120] To improve the isolation between the first and second antennas, embodiments of this application improve the aforementioned housing assembly. In some embodiments of this application, a cutoff structure may be provided on the surface of the glass housing 1020 of the dielectric substrate 102.

[0121] Figure 13a This is a schematic diagram of the structure of an antenna module provided in an embodiment of this application. Figure 13b for Figure 13a Side view of the antenna module. In one embodiment, such as... Figure 13a , Figure 13b As shown, the antenna module includes a housing assembly and an antenna. The housing assembly includes a dielectric substrate 102, a circuit board 101, a conductive frame 103, and a conductive connection portion 104.

[0122] The dielectric substrate 102 and the circuit board 101 are stacked, and the conductive frame 103 and the conductive connection part 104 are used to connect the dielectric substrate 102 and the circuit board 101.

[0123] The dielectric substrate 102, circuit board 101, conductive frame 103 and conductive connection part 104 together form a cavity, and the antenna is disposed in the cavity.

[0124] This cavity is not a completely sealed cavity; its surface may have gaps. The length of these gaps should meet the following requirement: less than... Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna.

[0125] In one embodiment, the antenna is, for example, the radar antenna described in the above embodiment, including: a first antenna 1001 and a second antenna 1002, both of which are disposed on the circuit board 101.

[0126] The first antenna 1001 and the second antenna 1002 operate in the same frequency band, and both the first antenna 1001 and the second antenna 1002 are millimeter-wave antennas. The distance between the first antenna 1001 and the second antenna 1002 is greater than or equal to the wavelength of the space wave corresponding to the resonant frequency of the first antenna 1001 or the second antenna 1002.

[0127] In one embodiment, the first antenna 1001 is a transmitting antenna used to transmit electromagnetic waves to the outside, and the second antenna 1002 is a receiving antenna used to receive electromagnetic waves reflected back from external objects. In another embodiment, the first antenna 1001 is a receiving antenna, and the second antenna 1002 is a transmitting antenna.

[0128] The dielectric substrate 102 includes a glass shell 1020, and a conductive patch 1021 and a first cutoff structure 1022 disposed on the surface of the glass shell 1020.

[0129] The glass housing 1020 includes a first surface and a second surface opposite to each other. The first surface of the glass housing 1020 is close to the circuit board 101, and the second surface of the glass housing 1020 is away from the circuit board 101.

[0130] In some embodiments, such as Figure 13a , Figure 13b As shown, the conductive patch 1021 and the first cutoff structure 1022 are disposed on the first surface of the glass housing 1020. In some embodiments, the conductive patch 1021 and the first cutoff structure 1022 are disposed on the second surface of the glass housing 1020. In some other embodiments, the conductive patch 1021 and the first cutoff structure 1022 are disposed on both the first and second surfaces of the glass housing 1020.

[0131] The glass housing 1020 includes: a first region opposite to the first antenna 1001, a second region opposite to the second antenna 1002, and a third region located between the first region and the second region. The first region and the second region are provided with conductive patches 1021, which are respectively disposed opposite to the first antenna 1001 and the second antenna 1002. The third region is provided with a first cutoff structure 1022, which is opposite to a region on the circuit board 101 where neither the first antenna 1001 nor the second antenna 1002 is disposed, and this region is located between the first antenna 1001 and the second antenna 1002.

[0132] The first cutoff structure 1022, relative to the area on the circuit board 101 where the first antenna 1001 and the second antenna 1002 are not disposed, means that the first cutoff structure 1022 at least completely covers the third region of the dielectric substrate. In one embodiment, the first cutoff structure 1022 may also extend into the first and second regions, with the extension range being less than or equal to half the wavelength of the dielectric wave.

[0133] In the above embodiments, with Figure 13a For example, the area on the dielectric substrate 101 opposite to the first antenna 1001 refers to the area on the dielectric substrate 101 that has the same size as the first antenna 1001 in the Z direction and completely covers the dielectric substrate in the X direction. The area on the dielectric substrate 101 opposite to the second antenna 1002 refers to the area on the dielectric substrate 101 that has the same size as the second antenna 1002 in the Z direction and completely covers the dielectric substrate in the X direction.

[0134] The structure of the conductive patch 1021 can be referred to the description of the above embodiments, and will not be repeated here.

[0135] Figure 14 for Figure 13a A schematic diagram of a mid-mounted antenna module in an electronic device. (Example) Figure 14 As shown, the antenna module can be placed in the cavity of the electronic device 10, and the structure of the electronic device 10 can be reused as a housing component for the antenna module, thus eliminating the need for a separate housing component and saving more space.

[0136] The dielectric substrate 102 and the circuit board 101 are spaced apart in the thickness direction of the electronic device. For example, the dielectric substrate 102 and the circuit board 101 may be arranged parallel in the thickness direction of the electronic device.

[0137] like Figure 13a , Figure 13b As shown, the dielectric plate 102 includes a glass housing 1020. (As indicated...) Figure 14 As shown, the glass housing 1020 may be part of the cover 13 of the electronic device 10. In other embodiments, the glass housing 1020 may also be as follows: Figure 2 Part of the back cover 21 of the electronic device 10 shown.

[0138] Figure 15a for Figure 13a Physical diagram of the antenna module. Figure 15b for Figure 14 A cross-sectional view of the antenna module (AA). For example... Figure 15a , Figure 15bAs shown, the cover plate includes a display area 131 opposite to the display screen 15, and a non-display area 132 disposed around the display area 131. The glass housing 1020 of the antenna module is located within the non-display area 132. Thus, the display module of the electronic device can be prevented from being affected.

[0139] The circuit board 101 can be part of the floor / ground plane / ground layer of the electronic device 10. The circuit board 101 can be part of the circuit board of the electronic device 10. For example, the circuit board 101 can be part of the PCB disposed between the middle frame 19 and the display screen 15. Herein, the circuit board 101 can be any metal layer inside the electronic device, not limited to the ground plane of the electronic device.

[0140] The conductive frame 103 can be formed by at least a part of the frame 11 of the electronic device. Herein, the conductive frame 103 can be, for example, a conductive frame disposed around the periphery of the electronic device. In some embodiments, the conductive frame 103 can be, for example, a straight bar-shaped frame on the side frame, or an L-shaped frame at the connection of the top frame and the side frame.

[0141] Herein, the dielectric plate 102 of the radar antenna, the circuit board 101, the conductive frame 103, and the conductive connection portion 104 are all located within the area surrounded by the frame 11. For example, the conductive frame 103 and the conductive connection portion 104 are disposed relative to the frame 十一.

[0142] Herein, the conductive frame 103 can be a conductive frame formed by a conductive material such as metal, or can be a conductive frame formed by a non-conductive material such as plastic or resin, and a conductive radiator disposed inside the non-conductive material, or a conductive component embedded inside the non-conductive material.

[0143] For example, Figure 15b the cross-sectional shape of the conductive frame 103 in is L-shaped. Herein, the vertical side of the L-shaped conductive frame is embedded inside the non-conductive material of the frame 11, and the horizontal side of the L-shaped conductive frame is disposed on the lower surface of the circuit board 101.

[0144] Herein, the circuit board 101 includes opposite first and second surfaces. The first surface of the circuit board 101 faces the cover plate 13, and the second surface of the circuit board 101 is close to the middle frame 11. The lower surface of the above circuit board 101 is the second surface of the circuit board 101.

[0145] The structure of the conductive connection portion 104 is not limited in the embodiments of the present application. The conductive connection portion 104 is formed by conductive foam or metal spring pieces, metal vias or metal brackets. Herein, at least one opposite part of the dielectric plate 102 and the circuit board 101 enclosing the cavity are connected through the conductive connection portion 104.

[0146] In one embodiment, such as Figure 15b As shown, the conductive connection portion 104 includes a conductive foam 1041 and a display screen 15. The display screen 15 is located between the cover plate 13 and the conductive foam 1041, and the conductive foam 1041 is located between the display screen 15 and the circuit board 101. In this embodiment, the structure located between the two components may be a portion of the structure located between them.

[0147] In one embodiment, the cover plate 13 is connected to the circuit board 101 in sequence via conductive foam 1041 and display screen 15.

[0148] The display screen 15 includes opposing first and second surfaces, with the first surface of the display screen 15 contacting the cover plate 13. The conductive foam 1041 includes opposing first and second surfaces, with the second surface of the display screen 15 contacting the first surface of the conductive foam 1041, and the second surface of the conductive foam contacting the first surface of the circuit board 101.

[0149] Figure 15c for Figure 14 Another AA cross-sectional view of the antenna module. In another embodiment, as... Figure 15c As shown, the conductive connection portion 104 includes a metal bracket 1042, and the cover plate 13 is connected to the circuit board 101 through the metal bracket 1042. The metal bracket 1042 includes a first end and a second end opposite to each other. The first end of the metal bracket 1042 is in contact with the cover plate 13, and the first end of the metal bracket 1042 is in contact with the first surface of the circuit board 101.

[0150] The embodiments of this application do not limit the structure of the cavity. In some embodiments of this application, the cavity may be a hollow structure.

[0151] In some other embodiments of this application, the cavity is also filled with a medium, which is an insulating material, such as resin or polychlorinated biphenyls (PCBs).

[0152] Figure 16 for Figure 14 A schematic diagram of the structure of a medium-dielectric substrate. (See diagram below.) Figure 16 As shown, the dielectric substrate includes two conductive patch arrays and a first cutoff structure 1022 disposed between the two conductive patch arrays. The conductive patch 1021 is a square conductive patch, and the side length of the conductive patch 1021 is one-fifth of the dielectric wavelength. An error of one-tenth of the wavelength is permissible. The period length of the conductive patch 1021 is approximately one-quarter of the dielectric wavelength, with an error of one-tenth of the wavelength permissible. The period length refers to the distance between the centers of two adjacent conductive patches 1021.

[0153] Figure 17 for Figure 14 A plan view of the intermediate dielectric substrate. (e.g.) Figure 16 As shown, the dielectric substrate includes: an array of two conductive patches 1021, and a first cutoff structure 1022 disposed between the two conductive patch arrays 1021. Each conductive patch 1021 includes a conductive grid. The slot length of the conductive grid is one-fifth of the wavelength of the dielectric wave corresponding to the resonant frequency of the first or second antenna, with a permissible error of one-tenth of the wavelength. The period length of the conductive grid is approximately one-quarter of the dielectric wavelength, with a permissible error of one-tenth of the wavelength. The period length refers to the distance between the centers of two adjacent conductive grids.

[0154] The following is combined Figure 17 The structure of the first cutoff structure 1022 will be described. In one embodiment, the first cutoff structure 1022 includes: a conductive layer disposed on the dielectric substrate, wherein the conductive layer has a plurality of first grooves 10221 recessed inward from the edge of the conductive layer.

[0155] The conductive layer is located near the edge of the conductive frame 103, and / or the conductive layer is provided with a first groove 10221 near the edge of the conductive connection portion 104.

[0156] For example, the first grooves 10221 are spaced apart along the Z direction at the edge of the conductive layer. The conductive layer has two rows of first grooves 10221 in the X direction, and the two rows of first grooves 10221 are arranged opposite to each other.

[0157] The shape of the first groove 10221 is not limited in this embodiment. The shape of the first groove 10221 includes any of the following: straight, curved, or broken line.

[0158] like Figure 17 As shown, the depth l1 of the first groove satisfies: Where λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first or second antenna, and A is the preset error threshold, which is approximately λ / 10.

[0159] like Figure 17 As shown, the width d1 of the first groove satisfies: Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna.

[0160] Figure 18 for Figure 13a The diagram shows the parameter distribution of the antenna module, including S11, S31, and S21. Figure 13aThe first antenna 1001 is a dual-receiver antenna, and the second antenna 1002 is a transmitting antenna. The second antenna 1002 is designated as antenna 1, the first antenna closer to the second antenna 1002 is designated as antenna 2, and the first antenna farther from the second antenna 1002 is designated as antenna 3. Figure 13a The reflection coefficient of antenna 1 is as follows Figure 18 The S11 curve is shown in the figure. Figure 13a The isolation between antenna 1 and antenna 3 is as follows Figure 18 As shown in the S31 curve. Figure 13a The isolation between antennas 1 and 2 is as follows: Figure 18 The S21 curve is shown in the figure. The maximum isolation between the first and second antennas (antenna 1 and antenna 2) is approximately 34 dB. Figure 6a Compared to antenna modules without a first and second cutoff structure, the isolation is improved by 4dB.

[0161] To further improve the isolation between the first antenna and the second antenna, in some embodiments of this application, such as... Figure 19 , Figure 20 , Figure 21 , Figure 22 As shown, a second cutoff structure 1031 can be provided on the conductive border 103.

[0162] like Figure 19 As shown, the conductive frame 103 includes: a fourth region opposite to the first antenna 1001, a fifth region opposite to the second antenna 1002, and a sixth region located between the fourth region and the fifth region, wherein the sixth region is provided with a second cut-off structure 1031.

[0163] In the above embodiments, with Figure 19 For example, the area of ​​the conductive frame 103 opposite to the first antenna 1001 refers to the area of ​​the conductive frame 103 that has the same size as the first antenna 1001 in the Z direction and completely covers the conductive frame 103 in the Y direction. The area of ​​the dielectric substrate 101 opposite to the second antenna 1002 refers to the area of ​​the conductive frame 103 that has the same size as the second antenna 1002 in the Z direction and completely covers the conductive frame 103 in the Y direction.

[0164] In one embodiment, such as Figure 22 As shown, the second cutoff structure 1031 includes a plurality of second grooves disposed on the conductive frame 103. The second grooves are formed at the edge of the conductive frame 103 near the dielectric substrate. The second grooves are spaced apart along the edge of the conductive frame 103. The second grooves are spaced apart along the Z-direction along the edge of the conductive frame 103. The conductive layer has one row of second grooves in the Y-direction.

[0165] The shape of the second groove includes any of the following: straight, curved, or broken.

[0166] like Figure 22 As shown, the depth l2 of the second groove satisfies: Where λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first or second antenna, and A is the preset error threshold, which is approximately λ / 10.

[0167] like Figure 22 As shown, the width d2 of the second groove satisfies: Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna.

[0168] In other embodiments of this application, the electronic device includes: the first cutoff structure 1022 disposed on the dielectric substrate 102 and the second cutoff structure 1031 disposed on the conductive frame 103.

[0169] Figure 23 for Figure 19 The diagram shows the parameter distribution of the antenna module, including S11, S31, and S21. Figure 19 The first antenna 1001 is a dual-receiver antenna, and the second antenna 1002 is a transmitting antenna. The second antenna 1002 is designated as antenna 1, the first antenna closer to the second antenna 1002 is designated as antenna 2, and the first antenna farther from the second antenna 1002 is designated as antenna 3. Figure 19 The reflection coefficient of antenna 1 is as follows Figure 23 The S11 curve is shown in the figure. Figure 19 The isolation between antenna 1 and antenna 3 is as follows Figure 23 As shown in the S31 curve. Figure 19 The isolation between antennas 1 and 2 is as follows: Figure 23 The S21 curve is shown in the figure. The maximum isolation between the first and second antennas (antenna 1 and antenna 2) is approximately 40 dB. Figure 6a Compared to antenna modules without a first and second cutoff structure, the isolation is improved by 10dB.

[0170] Figure 24 for Figure 19 The electric field vector diagram of the antenna module shown. Figure 25 for Figure 19 The electric field amplitude diagram of the antenna module shown is as follows. Figure 24 As shown, between the first antenna and the second antenna ( Figure 24 (the area outlined in the middle) and Figure 10a Compared to the location indicated by the middle arrow, the electromagnetic field strength is significantly reduced, the field distribution is smaller, and the isolation is higher.

[0171] Figure 26A framework diagram of the electronic device provided in the embodiments of this application, such as... Figure 26 As shown, the electronic device 10 may also include a communication module 010.

[0172] For example, the communication module 010 includes: a first antenna 1001, a second antenna 1002, a mobile communication module, a wireless communication module, a modem processor, and a baseband processor, etc., as described in the above embodiments.

[0173] The first antenna 1001 and the second antenna 1002 can be used to transmit and receive electromagnetic wave signals. Each antenna in a smart appliance can be used to cover one or more communication frequency bands.

[0174] Mobile communication modules can provide solutions for wireless communication applications in smart appliances, including 2G, 3G, 4G, and 5G technologies. A mobile communication module may include at least one waveguide, a switch, a power amplifier, and a low-noise amplifier (LNA). The mobile communication module can receive electromagnetic waves via an antenna, perform wave transmission and amplification processing on the received electromagnetic waves, and transmit them to a modem processor for demodulation. The mobile communication module can also amplify the signal modulated by the modem processor and radiate the amplified signal as electromagnetic waves via the antenna. In some embodiments, at least some functional modules of the mobile communication module may be housed within a processor. In some embodiments, at least some functional modules of the mobile communication module and at least some modules of the processor may be housed in the same device.

[0175] A modem processor may include a modulator and a demodulator. The modulator modulates a low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates a received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to a baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to an application processor. The application processor outputs sound signals through an audio device (not limited to speakers, microphones, etc.) or displays images or videos on a display screen. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor and housed within the same device as a mobile communication module or other functional modules.

[0176] Wireless communication modules can provide solutions for smart appliances using various wireless communication technologies, including Wireless Local Area Networks (WLAN) (such as Wireless Fidelity (Wi-Fi)), Bluetooth (BT), Global Navigation Satellite System (GNSS), Frequency Modulation (FM), Near Field Communication (NFC), and Infrared (IR). A wireless communication module can integrate at least one communication processing module. The module receives electromagnetic waves via an antenna, performs frequency modulation and transmission processing on the electromagnetic wave signals, and sends the processed signal to the processor. The module can also receive signals to be transmitted from the processor, perform frequency modulation and amplification, and then convert them into electromagnetic waves for radiation via the antenna.

[0177] In some embodiments, one antenna of the smart appliance is coupled to a mobile communication module, and another antenna is coupled to a wireless communication module, enabling the smart appliance to communicate with networks and other devices via wireless communication technology. This wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technologies. The GNSS may include Global Positioning System (GPS), Global Navigation Satellite System (GLONASS), BeiDou Navigation Satellite System (BDS), Quasi-Zenith Satellite System (QZSS), and / or Satellite Based Augmentation Systems (SBAS).

[0178] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: circuit board, The first antenna and the second antenna are both mounted on the circuit board. The circuit board includes a first feed line and a second feed line. The first feed line is electrically connected to the first antenna, and the second feed line is electrically connected to the second antenna. A dielectric substrate and a circuit board are spaced apart in the thickness direction of the electronic device, wherein the first antenna and the second antenna are both disposed on the side of the circuit board facing the dielectric substrate; A conductive frame and a conductive connection portion are provided. The conductive frame is disposed on one side of the first antenna and the second antenna, and the conductive connection portion is disposed on the other side of the first antenna and the second antenna. The conductive frame and the conductive connection portion are respectively disposed between the dielectric substrate and the circuit board along the thickness direction of the electronic device. The conductive connection portion, the conductive frame, the dielectric substrate and the circuit board form a cavity. The dielectric substrate includes: a first region opposite to the first antenna, a second region opposite to the second antenna, and a third region located between the first region and the second region. The third region is provided with a conductive layer, and the conductive layer is provided with a plurality of first grooves recessed inward from the edge of the conductive layer.

2. The electronic device according to claim 1, characterized in that, The conductive layer is located near the edge of the conductive frame, and / or the conductive layer is provided with the first groove near the edge of the conductive connection portion.

3. The electronic device according to claim 1 or 2, characterized in that, The depth l of the first groove satisfies: Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna, and A is a preset error threshold, A≤λ / 10.

4. The electronic device according to claim 3, characterized in that, The width d of the first groove satisfies: Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna.

5. The electronic device according to any one of claims 1-4, characterized in that, The plurality of first grooves extend from the third region to the first region and / or the second region, and the length of the plurality of first grooves in the first region and / or the second region is less than Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna.

6. The electronic device according to any one of claims 1-5, characterized in that, The conductive frame includes: a fourth region opposite to the first antenna, a fifth region opposite to the second antenna, and a sixth region located between the fourth region and the fifth region, the sixth region including: a plurality of second grooves recessed inward from the edge of the conductive frame.

7. The electronic device according to claim 6, characterized in that, The conductive frame has a second groove on its edge near the dielectric substrate.

8. The electronic device according to any one of claims 1-7, characterized in that, The first and second regions are provided with multiple conductive patches arranged in an array.

9. The electronic device according to claim 8, characterized in that, The conductive patch has a square structure, and the distance between the centers of two adjacent conductive patches is [missing information]. Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna.

10. The electronic device according to claim 9, characterized in that, The conductive patch has an annular gap.

11. The electronic device according to any one of claims 1-10, characterized in that, The first and second regions are provided with conductive grids, and the distance between the centers of two adjacent conductive grids is [missing information]. Wherein, λ is the wavelength of the dielectric wave corresponding to the resonant frequency of the first antenna or the second antenna.

12. The electronic device according to any one of claims 1-11, characterized in that, The electronic device includes: a cover plate, the cover plate including: a display area and a non-display area, the non-display area being disposed around the display area, and the media plate being located within the non-display area; or, the electronic device includes: a rear cover, the rear cover including the media plate.

13. The electronic device according to any one of claims 1-12, characterized in that, The conductive connection includes: a display screen and conductive foam stacked along the thickness direction of the electronic device, wherein the display screen is located between the dielectric substrate and the conductive foam, and the conductive foam is located between the display screen and the circuit board.

14. The electronic device according to any one of claims 1-13, characterized in that, The conductive connection includes a metal bracket, and the dielectric board is connected to the circuit board through the metal bracket.

15. The electronic device according to any one of claims 1-14, characterized in that, The electronic device includes a frame surrounding the periphery of the electronic device. The conductive frame includes a first part and a second part connected to each other. The first part is embedded inside the frame, and the second part is connected to the circuit board.

16. The electronic device according to claim 15, characterized in that, The first portion and the second portion are perpendicular, with the second portion close to the surface of the circuit board away from the dielectric substrate.

17. The electronic device according to any one of claims 1-16, characterized in that, The conductive frame is disposed opposite to the conductive connection portion, and the cavity is a semi-closed structure.

18. The electronic device according to any one of claims 1-17, characterized in that, The first antenna and the second antenna operate in the same frequency band, and both the first antenna and the second antenna are millimeter-wave antennas. The distance between the first antenna and the second antenna is greater than or equal to the wavelength of the space wave corresponding to the resonant frequency of the first antenna or the second antenna.

19. The electronic device according to any one of claims 1-18, characterized in that, The first antenna is a receiving antenna and the second antenna is a transmitting antenna, or the first antenna is a transmitting antenna and the second antenna is a receiving antenna.

20. The electronic device according to any one of claims 1-19, characterized in that, The electronic devices include intelligent transportation equipment, smart home equipment, intelligent manufacturing equipment, drones, or robots.

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