Circuit board for transmitting terahertz frequency signals and method for manufacturing the same

Abstract

The application provides a circuit board for transmitting terahertz frequency signals and a manufacturing method thereof. The circuit board comprises a dielectric layer, a first metal pattern layer, a second metal pattern layer, at least one transceiving antenna and at least one electromagnetic wave transceiving module. The first metal pattern layer has at least one radiation hole. The transceiving antenna and the electromagnetic wave transceiving module are arranged in the dielectric layer, and the transceiving antenna overlaps the radiation hole. When the electromagnetic wave transceiving module generates an electromagnetic wave signal, the transceiving antenna receives the electromagnetic wave signal and radiates electromagnetic waves, and the electromagnetic waves are radiated outward from the radiation hole. The frequency of the electromagnetic wave signal is in the terahertz frequency band, the frequency of the electromagnetic wave is the same as that of the electromagnetic wave signal, and therefore wireless signal transmission can be achieved between the electromagnetic wave transceiving module and the transceiving antenna, so as to reduce the layout space of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to a circuit board and a manufacturing method thereof, and particularly relates to a circuit board and a manufacturing method thereof for transmitting terahertz frequency signals. BACKGROUND

[0002] The signal transmission between the conventional transmitting / receiving circuit and the antenna is transmitted through a wired manner, and the transmission method includes using a microstrip line, a strip line, a coaxial cable, etc. However, even if the transmitting / receiving circuit is miniaturized to be a chip, the chip and the antenna are still transmitted through a wired manner, which occupies more space and is not conducive to the miniaturization development of mobile devices (such as mobile phones or tablets). At present, the antenna and the transmitting / receiving circuit are integrated into an integrated circuit (chip) through an antenna in package (AiP) technology to become a complete transceiver module. However, the process of the antenna in package technology is still quite difficult, which leads to the fact that the yield of the antenna in package is still not ideal. SUMMARY

[0003] At least one embodiment of the present application provides a circuit board and a manufacturing method thereof for transmitting terahertz frequency signals, which can enable the signal transmission between the transmitting / receiving circuit and the antenna in a wireless transmission manner.

[0004] The circuit board for transmitting terahertz frequency signals provided by at least one embodiment of the present application includes a dielectric layer, a first metal pattern layer, a second metal pattern layer, at least one transceiving antenna, and at least one electromagnetic wave transceiving module. The first metal pattern layer has at least one radiation hole. The first metal pattern layer, the second metal pattern layer, and the dielectric layer are stacked, and the dielectric layer is arranged between the first metal pattern layer and the second metal pattern layer. The transceiving antenna is arranged at a position corresponding to the radiation hole of the dielectric layer, and the vertical projection of the transceiving antenna overlaps the radiation hole. The electromagnetic wave transceiving module is arranged in the dielectric layer, and the electromagnetic wave transceiving module has a transmission distance with the transceiving antenna. When the electromagnetic wave transceiving module generates an electromagnetic wave signal, the frequency of the electromagnetic wave signal is in the range of the terahertz frequency band, the transceiving antenna receives the electromagnetic wave signal and radiates the electromagnetic wave, and the electromagnetic wave is radiated outward from the radiation hole, wherein the frequency of the electromagnetic wave is the same as the frequency of the electromagnetic wave signal. When the transceiving antenna receives the electromagnetic wave transmitted from the outside of the radiation hole, the transceiving antenna radiates the electromagnetic wave to the electromagnetic wave transceiving module.

[0005] In at least one embodiment of the present application, the length of the radiation hole is in the range of one quarter to one half of the wavelength of the electromagnetic wave.

[0006] In at least one embodiment of the present application, the transmission distance is in the range of one quarter to one half of the wavelength of the electromagnetic wave.

[0007] In at least one embodiment of the present application, the transceiving antenna is an array antenna, and includes a plurality of antenna units, the antenna units are arranged at intervals, and the interval between any two adjacent antenna units is in the range of one-eighth to one-quarter of the wavelength of the electromagnetic wave.

[0008] In at least one embodiment of the present application, the circuit board includes a plurality of electromagnetic wave transceiving modules, and the interval between any two adjacent electromagnetic wave transceiving modules is greater than twice the wavelength of the electromagnetic wave.

[0009] In at least one embodiment of the present application, the circuit board includes a plurality of electromagnetic wave transceiving modules and at least one shielding structure, and the shielding structure is arranged between any two adjacent electromagnetic wave transceiving modules.

[0010] The method for manufacturing a circuit board for transmitting terahertz frequency signals provided by at least one embodiment of the present application includes: providing a first substrate, the first substrate including a first substrate dielectric layer and a first substrate metal layer, wherein the first substrate dielectric layer and the first substrate metal layer are stacked, the first substrate metal layer has at least one radiation hole, and at least one transceiving antenna is arranged at the first substrate dielectric layer corresponding to the radiation hole, and the vertical projection of the transceiving antenna overlaps the radiation hole; providing a second substrate, the second substrate including a second substrate dielectric layer and a second substrate metal layer, wherein the second substrate dielectric layer and the second substrate metal layer are stacked, and at least one electromagnetic wave transceiving module is arranged in the second substrate dielectric layer; and stacking the first substrate and the second substrate, and aligning the electromagnetic wave transceiving module with the transceiving antenna.

[0011] In at least one embodiment of the present application, the step of forming the first substrate includes: providing a first single-sided board; patterning the metal layer of the first single-sided board to form a radiation hole; providing a double-sided board; patterning one of the metal layers of the double-sided board to form a transceiving antenna; patterning the other metal layer of the double-sided board to form at least one hole, wherein the vertical projection of the transceiving antenna overlaps the hole; and pressing the first single-sided board and the double-sided board together to combine the first single-sided board and the double-sided board, wherein the vertical projection of the transceiving antenna overlaps the radiation hole.

[0012] In at least one embodiment of the present application, when the transceiving antenna is a plurality of transceiving antennas, the step of providing the first substrate further includes: forming a shielding hole between any two adjacent transceiving antennas of the first substrate; and filling a shielding structure into the shielding hole.

[0013] In at least one embodiment of the present application, the step of forming the second substrate includes: providing a first dielectric layer, a bonding dielectric layer, a second single-sided board, and an electromagnetic wave transceiving module, wherein the bonding dielectric layer is located between the first dielectric layer and the second dielectric layer of the second single-sided board, the bonding dielectric layer forms at least one through hole, and the electromagnetic wave transceiving module is located in the through hole; and pressing the first dielectric layer, the bonding dielectric layer, and the second single-sided board together to combine the first dielectric layer, the bonding dielectric layer, and the second single-sided board.

[0014] Based on the above, in the circuit board disclosed in the above embodiments, the electromagnetic wave transceiving module arranged in the dielectric layer can emit electromagnetic wave signals in the terahertz frequency band range and receive electromagnetic waves, and the terahertz frequency band range overlaps the frequency range of the millimeter waves radiated by the transceiving antenna, so that wireless signal transmission can be performed between the electromagnetic wave transceiving module and the transceiving antenna, thereby achieving the advantage of reducing the layout space of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0015] For a more complete understanding of the embodiments and their advantages, reference is now made to the following description taken in conjunction with the accompanying drawings in which:

[0016] FIG. 1A is a cross-sectional schematic view of a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application;

[0017] FIG. 1B is an enlarged schematic view of the transceiving antenna of FIG. 1A

[0018] FIG. 2A is a schematic view of wireless signal transmission between the transceiving antenna and the electromagnetic wave transceiving module;

[0019] FIG. 2B is a block diagram of wireless signal transmission between the transceiving antenna and the electromagnetic wave transceiving module;

[0020] FIG. 3A to FIG. 3C is a cross-sectional schematic view of forming a first substrate in a method of manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application;

[0021] FIG. 4 is a cross-sectional schematic view of forming a second substrate in a method of manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application; and

[0022] FIG. 5 is a cross-sectional schematic view of combining the first substrate and the second substrate in a method of manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. DETAILED DESCRIPTION

[0023] ​In the following detailed description, for the purposes of clarity, the meaning of "above", "below", "upper", "lower", "right", "left", "rear", "front", "rearward", "forward", "vertical", "horizontal", "upward", "downward", "clockwise" and "counter clockwise" and other directions are provided with respect to the orientations of the figures and not with respect to the actual tool, area, component or layer being described. Unless specifically stated, the meaning of "about" or "approximately" used in connection with a given value or range of values, means that the value or range of values is within a reasonable expected range and allows for measurement errors, manufacturing tolerances, and variations. Such expected range of values extends roughly + / - 10% from the stated value. It is also possible to use other ranges and / or amounts as desired. For example, "about" can mean within one or more standard deviations, such as + / - 30%, + / - 20%, + / - 10%, or + / - 5% from the stated value. The use of "about" or "approximately" can apply to one, some, or all of the values used in the description.

[0024] Second, the use of "about", "approximately", or "substantially" in the content of this disclosure encompasses both the numerical values recited and a reasonable range of values that would be understood by one of ordinary skill in the art to be equivalent in light of the stated value and the applicable context. This range of values can be determined by the error allowed in the measurement system or process limitation, such as from either the measurement system or process conditions. Additionally, "about" can mean within one or more standard deviations, such as + / - 30%, + / - 20%, + / - 10%, or + / - 5% from the stated value. The use of "about" or "approximately" can apply to one, some, or all of the values used in the description, depending on the optical, etching, mechanical, or other properties that are acceptable.

[0025] The terminology used in the content of this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the claims. As used in the description of the embodiments and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0026] The circuit board for transmitting terahertz frequency signals of the present application can be used in any electronic device having wireless communication function, which enables signal transmission between the transmitting / receiving circuit and the antenna in a wireless transmission manner.

[0027] FIG. 1A is a schematic cross-sectional view of the circuit board 100 for transmitting terahertz frequency signals of at least one embodiment of the present application. Referring to FIG. 1A , the circuit board 100 includes a plurality of dielectric layers 111 and 112, a first metal pattern layer 121, a second metal pattern layer 122, a third metal pattern layer 123, at least one transceiving antenna 130, and at least one electromagnetic wave transceiving module 140. For example, FIG. 1AFor example, the circuit board 100 includes a plurality of transceiving antennas 130 and a plurality of electromagnetic wave transceiving modules 140. In other embodiments, the circuit board 100 can include only one of each of the transceiving antennas 130 and the electromagnetic wave transceiving modules 140.

[0028] The present application is related to FIG. 1A Two dielectric layers 111 and 112 are used as an example, but not limited thereto. The dielectric layers 111 and 112 are located between the first metal pattern layer 121, the second metal pattern layer 122 and the third metal pattern layer 123, and the dielectric layers 111 and 112, the first metal pattern layer 121, the second metal pattern layer 122 and the third metal pattern layer 123 are all stacked and combined together. It should be noted that the material of the circuit board 100 is not limited, and a flexible substrate or a rigid substrate can be used.

[0029] The first metal pattern layer 121 has a plurality of radiation holes 124, so that the upper part of the dielectric layer 111 is exposed, and the first metal pattern layer 121 further has a trace or / and a ground pattern. The second metal pattern layer 122 also has a trace or / and a ground pattern. The third metal pattern layer 123 has a plurality of holes 125, and the holes 125 respectively overlap the radiation holes 124 when vertically projected towards the first metal pattern layer 121. In addition, the third metal pattern layer 123 also has a trace or / and a ground pattern.

[0030] In the present example, the number of each of the radiation holes 124 and the holes 125 is the same as the number of the transceiving antennas 130, and the positions of the transceiving antennas 130 respectively correspond to and align with the radiation holes 124 and the holes 125. The length l of each radiation hole 124 is in the range of one quarter to one half of the wavelength of the electromagnetic wave radiated by the corresponding transceiving antenna 130, so that the corresponding transceiving antenna 130 obtains greater gain.

[0031] FIG. 1B is FIG. 1A An enlarged schematic view of the transceiving antenna 130. Please refer to FIG. 1A and FIG. 1BThe transceiving antennas 130 are disposed in the dielectric layer 111 and located between the radiation holes 124 and the holes 125. Each transceiving antenna 130 vertically projects toward the corresponding radiation hole 124 and overlaps the corresponding radiation hole 124, and vertically projects toward the corresponding hole 125 and overlaps the corresponding hole 125. Each transceiving antenna 130 is an array antenna and includes a plurality of antenna elements 131. The antenna elements 131 are arranged at intervals, and any two adjacent antenna elements 131 have a spacing d, wherein the length of the spacing d is in the range of one-eighth to one-quarter of the wavelength of the electromagnetic wave radiated by the corresponding transceiving antenna 130, so as to improve the bandwidth of the transceiving antenna 130.

[0032] The antenna elements 131 are patch antennas. In the present example, the transceiving antennas 130 are array antennas in which the antenna elements 131 are arranged in one row and four columns (1x4), but are not limited thereto, and the transceiving antennas 130 can also be array antennas in which the antenna elements 131 are arranged in four rows and four columns (4x4) or eight rows and eight columns (8x8). The transceiving antennas 130 can be controlled to form a predetermined antenna pattern in a beamforming manner, and the beams emitted by the transceiving antennas 130 can be beam scanned from the radiation holes 124 to the outside of the circuit board 100.

[0033] The electromagnetic wave transceiving modules 140 are disposed in the dielectric layer 112 and have a transmission distance D from the transceiving antennas 130. The electromagnetic wave transceiving modules 140 are aligned with the transceiving antennas 130 through the holes 125, so that each transceiving antenna 130 is aligned with one radiation hole 124 and one hole 125.

[0034] FIG. 2A is a schematic diagram of wireless signal transmission between the transceiving antennas 130 and the electromagnetic wave transceiving modules 140, and FIG. 2B is a block diagram of wireless signal transmission between the transceiving antennas 130 and the electromagnetic wave transceiving modules 140. Please refer to FIG. 1A 、 FIG. 2A and FIG. 2B In the present example, the electromagnetic wave transceiving modules 140 can be made into chips, such as integrated circuits (ICs). Each electromagnetic wave transceiving module 140 has a processor 141, a transmitting circuit 142, a receiving circuit 143, an electromagnetic wave transmitter 144, and an electromagnetic wave receiver 145.

[0035] The processor 141 is configured to process electronic signals to perform operations, recognitions, sampling of feature values, etc. The transmitting circuit 142 is configured to process electronic signals to control the radiation of the transceiving antenna 130. The receiving circuit 143 is configured to process electronic signals converted from electromagnetic waves radiated by the transceiving antenna 130. The electromagnetic wave transmitter 144 is configured to generate electromagnetic wave signals, and can be a laser diode or a maser diode. The electromagnetic wave receiver 145 is configured to convert received electromagnetic waves into electronic signals, and can be a photodiode.

[0036] The frequency of the electromagnetic wave signals is in the range of the terahertz band. The terahertz band is a frequency range of 100 GHz (0.1 THz) to 10,000 GHz (10 THz), in which the low-frequency part of the terahertz band overlaps with the frequency band of the millimeter wave radiated by the transceiving antenna 130. Therefore, the electromagnetic wave transceiving module 140 generates electromagnetic wave signals with a frequency in the low-frequency part of the terahertz band, which is the same as the frequency of the electromagnetic wave radiated by the transceiving antenna 130, so that wireless signal transmission can be performed between the electromagnetic wave transceiving module 140 and the transceiving antenna 130.

[0037] Further, the transmission distance D between the electromagnetic wave transceiving module 140 and the transceiving antenna 130 is in the range of one quarter to one half of the wavelength of the electromagnetic wave radiated by the corresponding transceiving antenna 130. The transmission distance D in this range can reduce the loss of electromagnetic wave signals and electromagnetic wave transmission.

[0038] The process of the transceiving antenna 130 radiating electromagnetic waves is that the electronic signal is modulated by the transmitting circuit 142, the electromagnetic wave transmitter 144 generates and transmits electromagnetic wave signals according to the modulated electronic signal to the transceiving antenna 130, the transceiving antenna 130 radiates electromagnetic waves according to the received electromagnetic wave signals, and the electromagnetic waves can be radiated outward from the radiation hole 124. The process of the transceiving antenna 130 receiving electromagnetic waves is that the transceiving antenna 130 receives electromagnetic waves transmitted from the outside of the radiation hole 124 and radiates the electromagnetic waves to the electromagnetic wave transceiving module 140, the electromagnetic wave receiver 145 converts the received electromagnetic waves into electronic signals and transmits them to the receiving circuit 143, and the receiving circuit 143 demodulates the electronic signals and transmits them to the processor 141.

[0039] It is to be noted that the distance L between any two adjacent electromagnetic wave transceiving modules 140 is greater than twice the wavelength of the electromagnetic wave to avoid interference between the adjacent electromagnetic wave transceiving modules 140. Further, the circuit board 100 further comprises a plurality of shielding structures 150, which can be metal structures, such as copper pillars. The shielding structures 150 can be disposed between any two adjacent electromagnetic wave transceiving modules 140 to provide better shielding effect between the electromagnetic wave transceiving modules 140. In addition, the shielding structures 150 can also be disposed between any two adjacent transceiving antennas 130 to shield the interference between the transceiving antennas 130.

[0040] FIG. 3A to FIG. 3C In the method of manufacturing the circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application, a cross-sectional view of a first substrate 400 is formed. Please refer to FIG. 3A First, a first single-sided board 200 is provided, wherein the first single-sided board 200 comprises a dielectric layer 210 and a metal layer 220. The dielectric layer 210 and the metal layer 220 are stacked. Then, the metal layer 220 is patterned to form a plurality of radiation holes 124 to expose the dielectric layer 210, for example, by photolithography and etching to pattern the metal layer 220. Please refer to FIG. 3B After that, a double-sided board 300 is provided, wherein the double-sided board 300 comprises a dielectric layer 310 and two metal layers 320 and 330. The metal layers 320 and 330 are respectively stacked on the upper and lower surfaces of the dielectric layer 310. Then, the metal layer 320 is patterned to form the transceiving antennas 130. Further, the metal layer 330 is patterned to form the holes 125, wherein the transceiving antennas 130 respectively overlap the holes 125 when vertically projected toward the holes 125. The way of patterning the metal layers 320 and 330, for example, comprises photolithography and etching.

[0041] Please refer to FIG. 3C Then, the first single-sided board 200 and the double-sided board 300 are pressed together in a manner that the dielectric layer 210 and the metal layer 320 face each other, so that the first single-sided board 200 and the double-sided board 300 are combined, wherein the vertically projected transceiving antennas 130 toward the radiation holes 124 respectively overlap the radiation holes 124. The radiation holes 124 and the holes 125 are respectively located on the opposite sides of the combined first single-sided board 200 and the double-sided board 300.

[0042] The combined first single-sided board 200 and the double-sided board 300 become the first substrate 400, wherein the first substrate 400 comprises a first substrate dielectric layer 410 and two first substrate metal layers 420 and 430, and the first substrate metal layers 420 and 430 are respectively stacked on the upper and lower surfaces of the first substrate dielectric layer 410. The transceiving antennas 130 are disposed in the first substrate dielectric layer 410.

[0043] See also FIG. 1A The first substrate dielectric layer 410 is the dielectric layer 111 of the circuit board 100. The first substrate metal layer 420 can be patterned to form traces and / or ground patterns, thereby becoming a first metal pattern layer 121. The first substrate metal layer 430 can be patterned to form traces and / or ground patterns, thereby becoming a third metal pattern layer 123. Next, a plurality of shielding holes are formed between any two adjacent transceiver antennas 130 on the first substrate 400, wherein the shielding holes are formed, for example, by laser drilling. Then, the shielding structure 150 is filled into the shielding holes.

[0044] FIG. 4 This is a cross-sectional schematic diagram of the second substrate 600 formed in a method for manufacturing a circuit board for transmitting terahertz frequency signals, according to at least one embodiment of this application. Please refer to... FIG. 1A and FIG. 4 First, a first dielectric layer 510, a bonding dielectric layer 520, a second single-sided panel 530, and an electromagnetic wave transceiver module 140 are provided. The second single-sided panel 530 includes a second dielectric layer 531 and a metal layer 532, wherein the second dielectric layer 531 and the metal layer 532 are stacked. The bonding dielectric layer 520 is located between the first dielectric layer 510 and the second dielectric layer 531, and forms at least one through-hole 521. In this example, the bonding dielectric layer 520 forms two through-holes 521, and the electromagnetic wave transceiver module 140 is located within each of the through-holes 521. The materials of the first dielectric layer 510, the bonding dielectric layer 520, and the second dielectric layer 531 are, for example, liquid crystal polymers (LCP).

[0045] Next, the first dielectric layer 510, the bonding dielectric layer 520, and the second single-sided panel 530 are laminated together to form a second substrate 600. The second substrate 600 includes a second substrate dielectric layer 610 and a second substrate metal layer 620, and the second substrate dielectric layer 610 and the second substrate metal layer 620 are stacked. The second substrate dielectric layer 610 is the dielectric layer 112 of the circuit board 100. The second substrate metal layer 620 can be patterned to form traces and / or grounding patterns, thereby becoming a second metal pattern layer 122. The electromagnetic wave transceiver module 140 is disposed within the second substrate dielectric layer 610.

[0046] Subsequently, a plurality of shielding holes are formed between any two adjacent electromagnetic transceiver modules 140 on the second substrate 600. Then, the shielding structure 150 is filled into the shielding holes.

[0047] FIG. 5is a cross-sectional view of the first substrate 400 and the second substrate 600 combined in a method of manufacturing a circuit board for transmitting terahertz frequency signals according to at least one embodiment of the present application. Please refer to FIG. 1A and FIG. 5 The first substrate 400 and the second substrate 600 are stacked (false pressure) with the first substrate metal layer 430 and the second substrate dielectric layer 610 facing each other, and the electromagnetic wave transceiver module 140 is aligned with the transceiving antenna 130 to manufacture the circuit board 100. The first substrate dielectric layer 410 is the dielectric layer 111, and the second substrate dielectric layer 610 is the dielectric layer 112. The first substrate metal layer 420 can form the first metal pattern layer 121, the second substrate metal layer 620 can form the second metal pattern layer 122, and the first substrate metal layer 430 can form the third metal pattern layer 123.

[0048] In summary, in the circuit board disclosed in the above embodiments, the electromagnetic wave transceiver module arranged in the dielectric layer can emit electromagnetic wave signals in the terahertz frequency band range and receive electromagnetic waves, and the frequency range of the terahertz frequency band overlaps the frequency range of the millimeter wave radiated by the transceiving antenna, so that wireless signal transmission can be performed between the electromagnetic wave transceiver module and the transceiving antenna, thereby achieving the advantage of reducing the layout space of the circuit board.

[0049] Although the present application has been disclosed with the above embodiments, it is not intended to limit the present application, and those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be defined by the appended claims.

[0050]

Symbol Description

[0051] 100: circuit board

[0052] 111: dielectric layer

[0053] 112: dielectric layer

[0054] 121: first metal pattern layer

[0055] 122: second metal pattern layer

[0056] 123: third metal pattern layer

[0057] 124: radiation hole

[0058] 125: hole

[0059] 130: transceiving antenna

[0060] 131: antenna unit

[0061] 140: electromagnetic wave transceiver module

[0062] 141: processor

[0063] 142: transmitting circuit

[0064] 143: receiving circuit

[0065] 144: electromagnetic wave transmitter

[0066] 145: electromagnetic wave receiver

[0067] 150: shielding structure

[0068] 200: first single panel

[0069] 210: dielectric layer

[0070] 220: metal layer

[0071] 300: double panel

[0072] 310: dielectric layer

[0073] 320, 330: metal layer

[0074] 400: first substrate

[0075] 410: first substrate dielectric layer

[0076] 420, 430: first substrate metal layer

[0077] 510: first dielectric layer

[0078] 520: bonding dielectric layer

[0079] 521: through hole

[0080] 530: second single panel

[0081] 531: second dielectric layer

[0082] 532: metal layer

[0083] 600: second substrate

[0084] 610: second substrate dielectric layer

[0085] 620: second substrate metal layer

[0086] l: length

[0087] d: distance

[0088] D: transmission distance

[0089] L: distance

Claims

1. A circuit board for transmitting terahertz frequency signals, characterized by, The application comprises: a dielectric layer; a first metal pattern layer having at least one radiation hole; a second metal pattern layer, the first metal pattern layer, the second metal pattern layer and the dielectric layer are stacked, and the dielectric layer is arranged between the first metal pattern layer and the second metal pattern layer; at least one transceiving antenna arranged at the dielectric layer corresponding to the radiation hole, and its vertical projection overlaps the radiation hole; and at least one electromagnetic wave transceiving module arranged in the dielectric layer, and the electromagnetic wave transceiving module and the transceiving antenna have a transmission distance therebetween; when the electromagnetic wave transceiving module generates an electromagnetic wave signal, wherein the frequency of the electromagnetic wave signal is in the range of terahertz frequency band, the transceiving antenna receives the electromagnetic wave signal and radiates electromagnetic wave, and the electromagnetic wave is radiated outward from the radiation hole, wherein the frequency of the electromagnetic wave is the same as the frequency of the electromagnetic wave signal; when the transceiving antenna receives the electromagnetic wave transmitted from the outside of the radiation hole, the transceiving antenna radiates the electromagnetic wave to the electromagnetic wave transceiving module. The length of the radiation hole is in the range of one quarter to one half of the wavelength of the electromagnetic wave.

2. The circuit board for transmitting a terahertz frequency signal according to claim 1, wherein, The transmission distance is in the range of one quarter to one half of the wavelength of the electromagnetic wave.

3. The circuit board for transmitting a terahertz frequency signal according to claim 1, wherein, The transceiving antenna is an array antenna, and comprises a plurality of antenna units, the antenna units are arranged at intervals, and the distance between any two adjacent antenna units is in the range of one eighth to one quarter of the wavelength of the electromagnetic wave.

4. The circuit board for transmitting a terahertz frequency signal according to claim 1, wherein, A plurality of electromagnetic wave transceiving modules are included, and the distance between any two adjacent electromagnetic wave transceiving modules is greater than twice the wavelength of the electromagnetic wave.

5. The circuit board for transmitting a terahertz frequency signal according to claim 1, wherein, A plurality of electromagnetic wave transceiving modules and at least one shielding structure are included, and the shielding structure is arranged between any two adjacent electromagnetic wave transceiving modules.

6. The circuit board for transmitting terahertz frequency signals of claim 1, wherein, The application comprises:

7. A method of manufacturing a circuit board for transmitting a terahertz frequency signal, characterized by, providing a first substrate, the first substrate comprises a first substrate dielectric layer and a first substrate metal layer, wherein the first substrate dielectric layer and the first substrate metal layer are stacked, the first substrate metal layer has at least one radiation hole, and at least one transceiving antenna is arranged at the first substrate dielectric layer corresponding to the radiation hole, and its vertical projection overlaps the radiation hole; providing a second substrate, the second substrate comprises a second substrate dielectric layer and a second substrate metal layer, wherein the second substrate dielectric layer and the second substrate metal layer are stacked, and at least one electromagnetic wave transceiving module is arranged in the second substrate dielectric layer; and stacking the first substrate and the second substrate, and aligning the electromagnetic wave transceiving module with the transceiving antenna. The steps of forming the first substrate comprise:

8. The method of manufacturing a circuit board that transmits a terahertz frequency signal according to claim 7, wherein, providing a first single panel; patterning the metal layer of the first single panel to form the radiation hole; providing a double panel; patterning one of the metal layers of the double panel to form the transceiving antenna; patterning the other metal layer of the double panel to form at least one hole, wherein the vertical projection of the transceiving antenna overlaps the hole; and pressing the first single panel and the double panel together to combine the first single panel and the double panel, wherein the vertical projection of the transceiving antenna overlaps the radiation hole. ​ 9. The method of manufacturing a circuit board that transmits a terahertz frequency signal according to claim 7, wherein, When the transceiving antennas are multiple, the step of providing the first substrate further comprises: forming a shielding hole between any two adjacent transceiving antennas of the first substrate; filling a shielding structure into the shielding hole.

10. The method of manufacturing a circuit board that transmits a terahertz frequency signal according to claim 7, wherein, The step of forming the second substrate comprises: providing a first dielectric layer, a bonding dielectric layer, a second single-sided board and the electromagnetic wave transceiving module, wherein the bonding dielectric layer is located between the first dielectric layer and a second dielectric layer of the second single-sided board, the bonding dielectric layer forms at least one through hole, and the electromagnetic wave transceiving module is located in the through hole; and pressing the first dielectric layer, the bonding dielectric layer and the second single-sided board to combine the first dielectric layer, the bonding dielectric layer and the second single-sided board.

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