Wafer double-side cleaning device and method

Abstract

The application provides a wafer double-side cleaning device and method, which comprises a cleaning platform, a cleaning pool is formed in the cleaning platform, a grabbing device for clamping a wafer is arranged in the cleaning pool, the grabbing device comprises oppositely arranged upper and lower grabbing components, the lower and upper surfaces of the wafer are sequentially vacuum grabbed by the lower and upper grabbing components to complete double-side cleaning of the wafer; the upper grabbing component comprises an upper grabbing base and an upper grabbing end, a vacuum grabbing block is mounted on the sidewall of the upper grabbing end, the vacuum grabbing block comprises a grabbing block one and a grabbing block two, and the upper grabbing component is further provided with a drying gas flow towards the wafer side. The application improves the wafer surface cleaning and drying efficiency, has good cleaning and drying effects, and guarantees the quality of finished wafers.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer cleaning, in particular to a wafer double-side cleaning device and method. BACKGROUND

[0002] Centrifugal cleaning with cleaning liquid is a common way of wafer cleaning, which sprays cleaning liquid on the surface of the wafer while controlling high-speed rotation of the wafer, and can clean the surface of the wafer efficiently under the action of centrifugal force.

[0003] The centrifugal cleaning method needs to fix the other side of the wafer, and needs to clean both sides of the wafer, so the cleaning equipment needs to be stopped and the wafer needs to be turned over, and then the other side of the wafer needs to be cleaned. The traditional wafer double-side cleaning method needs to stop the equipment, which affects the efficiency of wafer cleaning. At the same time, the wafer needs to be dried again after double-side cleaning, and the drying step is the same as double-side cleaning. The drying gas flow is controlled to blow out to the two sides of the wafer respectively to achieve efficient drying. The traditional cleaning and drying method has many steps, which reduces the efficiency of wafer cleaning and drying. SUMMARY

[0004] In view of the above problems, the present application provides a wafer double-side cleaning device and method, which improves the efficiency of wafer surface cleaning and drying, has good cleaning and drying effect, and guarantees the quality of finished wafers.

[0005] To solve the above problems, the technical scheme adopted by the present application is as follows:

[0006] A wafer double-side cleaning device, comprising a cleaning platform, a cleaning pool is formed in the cleaning platform, a grabbing device for clamping a wafer is arranged in the cleaning pool, the grabbing device comprises an upper grabbing assembly and a lower grabbing assembly arranged oppositely, the lower grabbing assembly and the upper grabbing assembly are used to complete double-side cleaning of the wafer by negative pressure grabbing of the lower surface and the upper surface of the wafer in sequence, the upper grabbing assembly comprises an upper grabbing base and an upper grabbing end, a negative pressure grabbing block is mounted on the side wall of the upper grabbing end, the negative pressure grabbing block comprises a grabbing block one and a grabbing block two, the upper grabbing assembly is further provided with a drying gas flow towards one side of the wafer, and the drying gas flow is controlled to blow towards the upper surface of the wafer while the grabbing block one and the grabbing block two are alternately controlled to realize negative pressure grabbing of the wafer.

[0007] Preferably, a first telescopic assembly and a rotating assembly are arranged between the upper grabbing base and the upper grabbing end, the upper grabbing end is controlled to telescope through the first telescopic assembly, and the upper grabbing end is controlled to rotate through the rotating assembly.

[0008] Preferably, the first telescopic assembly comprises a telescopic rod and a telescopic sleeve, the telescopic rod and the telescopic sleeve slide relative to each other and can rotate synchronously, and the rotating assembly comprises an electric control device coupled with the telescopic rod.

[0009] Preferably, the upper grabbing end is provided with a receiving groove at the bottom, and a second telescopic assembly is arranged in the receiving groove, and the second telescopic assembly is used to control the grabbing block two to enter and exit the receiving groove.

[0010] Preferably, the grabbing block one is arranged outside the grabbing block two and is annularly arranged in multiple numbers, and an opening for the dry gas flow to pass through is formed between two adjacent grabbing block ones.

[0011] Preferably, a protective cover is arranged outside the upper grabbing assembly, a first end of the protective cover is fixed with the upper grabbing base, a second end of the protective cover extends towards the upper grabbing end and is sleeved outside the upper grabbing end, and the second end of the protective cover is provided with a predetermined gap from the upper surface of the wafer.

[0012] The protective cover can form a protective structure outside the upper surface of the wafer, the size of the bottom of the protective cover is consistent with the size of the wafer, the protective cover can protect the wafer from above, and liquid splashing on the lower surface of the wafer is avoided to enter the upper end surface of the wafer, meanwhile, the predetermined gap between the protective cover and the wafer can be used for the dry gas flow to blow out, a certain gas pressure in the protective cover is released, the dry gas flow can continuously be discharged from the predetermined gap, liquid splashing into the upper surface of the wafer is further avoided, the cleaning and drying effects of the upper surface of the wafer are further ensured, and the overall cleaning and drying efficiency of the wafer is improved.

[0013] Preferably, the protective cover comprises a horn-shaped protective main body and a circular ring-shaped protective end, the protective end is close to the wafer side, and the side wall of the protective main body is provided with an air inlet interface for the dry gas flow to enter.

[0014] Preferably, the cleaning pool is provided with a jet cleaning device, the jet cleaning device comprises a cleaning swing arm, and cleaning holes are arranged on the upper and lower sides of the cleaning swing arm.

[0015] Preferably, a position control device is arranged on the upper end of the cleaning platform, and the position control device is used to control the upper grabbing assembly to move and be staggered with the lower grabbing assembly.

[0016] A wafer double-sided cleaning method using the wafer double-sided cleaning device, comprising the following steps: S1, controlling the lower grabbing assembly to grab the lower surface of the wafer to complete the cleaning of the upper surface of the wafer; S2, controlling the upper grabbing assembly to grab the upper surface of the wafer to complete the cleaning of the lower surface of the wafer; and S3, alternately controlling the grabbing block one and the grabbing block two to realize the negative pressure grabbing of the wafer, and controlling the dry gas flow to blow towards the upper surface of the wafer to complete the drying of the upper surface of the wafer.

[0017] The beneficial effects of the present application are:

[0018] Compared with the traditional double-sided cleaning and drying mode, the above structure can simplify the steps of double-sided cleaning and drying of the wafer, greatly improve the efficiency of wafer surface cleaning and drying, and the cleaning and drying effect is good, and the quality of finished wafer is guaranteed. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a perspective structural schematic diagram of the present application.

[0020] Figure 2 It is a perspective structural schematic diagram of the present application Figure 1 .

[0021] Figure 3 It is a schematic diagram of the upper surface cleaning state of the wafer.

[0022] Figure 4 It is a schematic diagram of the lower surface cleaning state of the wafer.

[0023] Figure 5 It is a perspective structural schematic diagram of the upper grabbing assembly of the present application.

[0024] Figure 6 It is a schematic diagram of the internal structure of the upper grabbing assembly of the present application.

[0025] Figure 7 It is a schematic diagram of the upper grabbing assembly of the present application.

[0026] Figure 8 It is a perspective structural schematic diagram of the upper grabbing assembly and the protective cover of the present application.

[0027] Figure 9 It is a schematic diagram of the internal structure of the upper grabbing assembly and the protective cover of the present application.

[0028] In the figure: 100, cleaning platform; 110, cleaning pool; 200, grabbing device; 210, lower grabbing assembly; 220, upper grabbing assembly; 221, upper grabbing end; 2211, second telescopic assembly; 2212, containing groove; 222, upper grabbing base; 2221, telescopic sleeve; 2222, telescopic rod; 2223, electric control device; 223, negative pressure grabbing block; 2231, grabbing block one; 2232, grabbing block two; 2233, notch; 300, wafer; 400, jet cleaning device; 500, protective cover; 510, air inlet; 520, protective main body; 530, protective end; 600, position control device; 610, electric guide rail; 620, electric sliding block; 630, connecting workpiece. DETAILED DESCRIPTION

[0029] The present application will be further described below in conjunction with the drawings and examples.

[0030] During the manufacturing process, wafers need to be cleaned on both sides to remove residual particulate impurities from the wafer surface in order to ensure the quality of the finished semiconductor chips.

[0031] Centrifugal cleaning with cleaning fluid is a common method for cleaning wafers. While controlling the wafer to rotate at high speed, the cleaning fluid is sprayed onto the wafer surface. Under the action of centrifugal force, the wafer surface can be cleaned efficiently.

[0032] Centrifugal cleaning requires fixing one side of the wafer to be cleaned. Cleaning both sides of the wafer requires stopping the cleaning equipment and flipping the wafer before cleaning the other side. Traditional double-sided wafer cleaning requires stopping the equipment, which affects the efficiency of wafer cleaning. At the same time, the wafer needs to be dried again after double-sided cleaning. The drying process is the same as double-sided cleaning, controlling the drying airflow to blow out onto both sides of the wafer to achieve efficient drying. Traditional cleaning and drying methods have many steps, which reduces the efficiency of wafer cleaning and drying.

[0033] See attached document Figure 1 -Appendix Figure 9 A wafer double-sided cleaning apparatus includes a cleaning platform 100, a cleaning tank 110 formed inside the cleaning platform 100, and a gripping device 200 for holding wafers 300 inside the cleaning tank 110. The gripping device 200 includes an upper gripping component 220 and a lower gripping component 210 arranged opposite to each other. The lower gripping component 210 and the upper gripping component 220 successively grip the lower and upper surfaces of the wafers 300 with negative pressure to complete the double-sided cleaning of the wafers. First, the lower gripping component 210 applies negative pressure to grip the lower surface of the wafers 300 to clean the upper surface of the wafers 300. Then, the upper gripping component 220 applies negative pressure to grip the upper surface of the wafers 300 to clean the lower surface of the wafers 300. The above operation is repeated to complete the continuous double-sided cleaning of multiple wafers 300. In this way, the wafers 300 do not need to be flipped by a robotic arm. The position of the wafers 300 is adjusted within the cleaning tank 110 to complete the continuous double-sided cleaning of the wafers 300.

[0034] Specifically, the upper grabbing assembly 220 comprises an upper grabbing base 222 and an upper grabbing end 221, a negative pressure grabbing block 223 is mounted on the sidewall of the upper grabbing end 221, the negative pressure grabbing block 223 comprises a grabbing block one 2231 and a grabbing block two 2232, the upper grabbing assembly 220 is further provided with a dry gas flow towards the side of the wafer 300, the dry gas flow flows from above to the direction of the wafer 300, and the surface of the wafer 300 can be cleaned and dried; the dry gas flow towards the upper surface of the wafer 300 is controlled, and the grabbing block one 2231 and the grabbing block two 2232 are alternately controlled to realize negative pressure grabbing of the wafer 300, the grabbing block one 2231 and the grabbing block two 2232 can be controlled to be telescopic or one of them can be telescopic, and the wafer 300 can be alternately negatively grabbed by the spraying cleaning device 400, and through the above-mentioned manner, the area of the wafer 300 clamped can be changed, the dry gas flow can dry the upper surface of the wafer 300 in all directions, and the drying effect of the overall structure is improved.

[0035] Here, the dry gas flow can select a middle-to-outside blowing mechanism, the gas outlet position and the gas flow rate of the dry gas flow can form a gas protection barrier on the outside of the upper surface of the wafer 300, and the gas protection barrier can shield and protect part of the splashed liquid while cleaning the lower surface of the wafer 300, thereby ensuring the cleaning and drying effect of the upper surface of the wafer 300 and the surface quality of the finished wafer 300.

[0036] After the upper surface of the wafer 300 is dried and the lower surface is cleaned, only the lower surface of the wafer 300 needs to be dried to complete the continuous cleaning and drying of the two surfaces of the wafer 300, compared with the traditional distribution and overturning processing mode, the processing steps of the wafer 300 cleaning and drying are greatly simplified, the processing efficiency is high, the cleaning effect of the surface of the wafer 300 is good, and the quality is guaranteed.

[0037] In summary, compared with the traditional double-sided cleaning and drying mode, the above-mentioned structure can simplify the steps of wafer double-sided cleaning and drying, greatly improve the efficiency of wafer 300 surface cleaning and drying, and has good cleaning and drying effect, and the quality of the finished wafer 300 is guaranteed.

[0038] Further, the first telescopic assembly and the rotating assembly are arranged between the upper grabbing base 222 and the upper grabbing end 221, the upper grabbing end 221 is controlled to be telescopic through the first telescopic assembly, the upper grabbing end 221 is controlled to rotate through the rotating assembly, the negative pressure grabbing block 223 on the sidewall of the upper grabbing end 221 can negatively grab the wafer 300 on the surface of the lower grabbing assembly 210 by controlling the overall telescopic of the upper grabbing end 221, the wafer 300 can be controlled to rotate at high speed by the negative pressure grabbing block 223 through the rotating assembly, and the surface of the wafer 300 can be cleaned efficiently.

[0039] Specifically, the first telescopic assembly comprises a telescopic rod 2222 and a telescopic sleeve 2221, the telescopic rod 2222 and the telescopic sleeve 2221 slide relative to each other and can rotate synchronously, a sliding groove and a sliding strip structure can be arranged between the telescopic rod 2222 and the telescopic sleeve 2221 to ensure that the two can slide relative to each other while transmitting torque to rotate synchronously, the rotating assembly comprises an electric control device 2223 coupled with the telescopic rod 2222, the electric control device 2223 can be selected as a gear assembly for power transmission, and the whole is controlled to rotate by a motor, meeting the requirement of high-speed rotation of the wafer 300.

[0040] The bottom of the upper grabbing end 221 is provided with a containing groove 2212, and the second telescopic assembly 2211 is arranged in the containing groove 2212, the second telescopic assembly 2211 is used for controlling the grabbing block two 2232 to enter or exit the containing groove 2212, and the second telescopic assembly 2211 can control the linear movement of the grabbing block two 2232, so as to control the positions of the grabbing block two 2232 and the grabbing block one 2231, realize the alternate clamping of the grabbing block one 2231 and the grabbing block two 2232 on the wafer 300, and make the drying gas flow dry the upper surface of the wafer 300 in all directions, thereby ensuring the quality of finished products.

[0041] The second telescopic assembly 2211 and the first telescopic assembly can be selected to be adjusted and controlled by an existing electric telescopic, pneumatic telescopic or hydraulic telescopic according to the specific structure of the internal structure size.

[0042] Specific reference is made to the accompanying drawings Figure 7 Preferably, the grabbing block one 2231 is annularly arranged outside the grabbing block two 2232 and is a plurality of, an annular gap 2233 for the drying gas flow to pass through is formed between the two adjacent grabbing block ones 2231, and the grabbing block two 2232 is circularly arranged between the plurality of grabbing block ones 2231, the plurality of grabbing block ones 2231 can be located outside to perform negative pressure grabbing on the outer position of the wafer 300, and the grabbing block two 2232 can be located in the middle to perform negative pressure grabbing on the middle position of the wafer 300; the drying gas flow can flow in and out through the annular gap 2233 to circularly dry the inner and outer positions of the upper surface of the wafer 300, realize the all-directional drying of the surface of the wafer 300, and ensure the drying effect of the upper surface of the wafer 300.

[0043] Through the above structure design, the center of the wafer 300 grabbed on the upper surface is consistent with the center of the wafer 300, in the process of driving the wafer 300 to rotate at a high speed, the stability of the wafer 300 in the process of the alternate negative pressure grabbing of the grabbing block one 2231 and the grabbing block two 2232 is ensured, and the normal cleaning process is ensured.

[0044] In order to be able to concentrate on the dry air flow, strengthen the drying effect, and at the same time be able to protect the splashing liquid, a protective cover 500 is installed outside the upper grabbing assembly 220, the first end of the protective cover 500 is fixed with the upper grabbing base 222, the second end of the protective cover 500 extends towards the upper grabbing end 221 and is sleeved outside the upper grabbing end 221, and the second end of the protective cover 500 has a predetermined gap with the upper surface of the wafer 300. By setting the protective cover 500, a protective structure can be formed outside the upper surface of the wafer 300, the size of the bottom of the protective cover 500 is consistent with the size of the wafer 300, the protective cover 500 can protect the wafer 300 from above, avoid the liquid on the lower surface of the wafer 300 from splashing to the upper end surface of the wafer 300, and at the same time, the predetermined gap between the protective cover 500 and the wafer 300 can supply the dry air flow to blow out, maintain a certain gas pressure in the protective cover 500, the dry air flow can continuously discharge from the predetermined gap, further avoid the liquid from splashing into the upper surface of the wafer 300, further ensure the cleaning and drying effect of the upper surface of the wafer 300, and improve the overall cleaning and drying efficiency of the wafer 300.

[0045] Specifically, the protective cover 500 includes a horn-shaped protective body 520 and a circular ring-shaped protective end 530, the protective end 530 is close to the wafer 300 side, the sidewall of the protective body 520 is provided with an air inlet interface 510 for the dry air flow to enter, the protective body 520 can form a containing chamber with the upper grabbing end 221, can store dry gas, and ensure that the protective cover 500 contains sufficient pressure; at the same time, by setting the protective end 530, the length of the predetermined gap between the wafer 300 can be extended to maintain the size of the pressure in the protective cover 500, and ensure that the dry gas is discharged at a predetermined rate.

[0046] A spraying cleaning device 400 is arranged in the cleaning tank 110, the spraying cleaning device 400 includes a cleaning swing arm, cleaning holes are arranged on the upper and lower sides of the cleaning swing arm, and a through valve is further arranged in the spraying cleaning device 400 to control the through of the cleaning holes on the upper and lower sides to realize adaptive cleaning of the wafers 300 on different sides; the cleaning swing arm can reciprocate according to a predetermined path to realize efficient cleaning of the upper and lower surfaces of the wafer 300 and ensure the cleaning effect of the upper and lower surfaces of the wafer 300.

[0047] The control position device 600 is installed on the upper end of the cleaning platform 100, and the upper grabbing assembly 220 is controlled to be moved out of phase with the lower grabbing assembly 210 through the control position device 600. The control position device 600 preferably comprises an electric guide rail 610, an electric sliding block 620 and a connecting workpiece 630. The electric guide rail 610 controls the linear movement of the electric sliding block 620. The electric sliding block 620 is fixed with the upper grabbing assembly 220 through the connecting workpiece 630, thereby controlling the linear movement of the upper grabbing assembly 220 out of phase with the lower grabbing assembly 210. During the loading and unloading of the wafer 300, the upper grabbing assembly 220 is controlled to be moved to the outer side, so as to facilitate the loading and unloading of the wafer 300, and ensure that the overall structure can efficiently clean both sides of the wafer 300.

[0048] A wafer double-sided cleaning method using the wafer double-sided cleaning device, comprising the following steps:

[0049] S1, the lower grabbing assembly 210 is controlled to grab the lower surface of the wafer 300, and the cleaning of the upper surface of the wafer 300 is completed.

[0050] S2, the upper grabbing assembly 220 is controlled to grab the upper surface of the wafer 300, and the cleaning of the lower surface of the wafer 300 is completed.

[0051] S3, the grabbing block one 2231 and the grabbing block two 2232 are alternately controlled to realize the negative pressure grabbing of the wafer 300, and the dry air flow is controlled to blow towards the upper surface of the wafer 300 to complete the drying of the upper surface of the wafer 300. At this time, the lower surface of the wafer 300 is cleaned while the upper surface of the wafer 300 that has been cleaned is dried, which reduces the subsequent processing procedure of the wafer 300 and improves the cleaning and drying efficiency of the wafer 300. At the same time, the upper surface of the wafer 300 can be protected, the upper surface of the wafer 300 is kept clean, and the quality of the wafer 300 as a whole is ensured.

[0052] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer double-side cleaning device, comprising a cleaning platform (100), a cleaning pool (110) is formed inside the cleaning platform (100), a gripping device (200) for clamping a wafer (300) is arranged inside the cleaning pool (110), characterized in that: the gripping device (200) comprises oppositely arranged upper gripping assembly (220) and lower gripping assembly (210), the lower gripping assembly (210) and the upper gripping assembly (220) are used to successively vacuum grip the lower surface and the upper surface of the wafer (300) to complete the double-side cleaning of the wafer; the upper gripping assembly (220) comprises an upper gripping base (222) and an upper gripping end (221), a negative pressure gripping block (223) is mounted on the side wall of the upper gripping end (221), the negative pressure gripping block (223) comprises a gripping block one (2231) and a gripping block two (2232), the upper gripping assembly (220) is further provided with a drying gas flow towards one side of the wafer (300), the drying gas flow is controlled to blow towards the upper surface of the wafer (300), and the gripping block one (2231) and the gripping block two (2232) are alternately controlled to realize the negative pressure gripping of the wafer (300); a protective cover (500) is mounted on the outside of the upper gripping assembly (220), the first end of the protective cover (500) is fixed with the upper gripping base (222), the second end of the protective cover (500) extends towards the upper gripping end (221) and is sleeved outside the upper gripping end (221), and the second end of the protective cover (500) has a predetermined gap with the upper surface of the wafer (300); the predetermined gap between the protective cover and the wafer is used for blowing out the drying gas flow, a certain gas pressure is maintained in the protective cover, the drying gas flow is continuously discharged from the predetermined gap, and liquid splashing into the upper surface of the wafer is avoided. a first telescopic assembly and a rotating assembly are arranged between the upper gripping base (222) and the upper gripping end (221), the upper gripping end (221) is controlled to stretch and retract through the first telescopic assembly, and the upper gripping end (221) is controlled to rotate through the rotating assembly.

2. The wafer double side cleaning apparatus according to claim 1, wherein the first telescopic assembly comprises a telescopic rod (2222) and a telescopic sleeve (2221), the telescopic rod (2222) and the telescopic sleeve (2221) slide relative to each other and can rotate synchronously, and the rotating assembly comprises an electric control device (2223) connected with the telescopic rod (2222).

3. The wafer double side cleaning apparatus according to claim 2, wherein a containing groove (2212) is formed in the bottom of the upper gripping end (221), a second telescopic assembly (2211) is arranged in the containing groove (2212), and the gripping block two (2232) is controlled to enter and exit the containing groove (2212) through the second telescopic assembly (2211).

4. The wafer double side cleaning apparatus according to claim 1, wherein the gripping block one (2231) is arranged outside the gripping block two (2232) and annularly arranged as a plurality of, and a gap (2233) for the drying gas flow to pass through is formed between two adjacent gripping block ones (2231).

5. The wafer double side cleaning apparatus according to claim 1, wherein ​ 6. The wafer double side cleaning apparatus according to claim 1, wherein The protective cover (500) includes a horn-shaped protective body (520) and an annular protective end (530). The protective end (530) is located near the wafer (300). The protective body (520) has an air inlet (510) on its sidewall for the entry of dry airflow.

7. The wafer double side cleaning apparatus according to claim 1, wherein The cleaning tank (110) is equipped with a spray cleaning device (400), which includes a cleaning swing arm with cleaning holes on both the upper and lower sides.

8. The wafer double side cleaning apparatus according to claim 1, wherein The cleaning platform (100) is equipped with a position control device (600) at its upper end. The position control device (600) controls the upper gripping component (220) to move and be offset from the lower gripping component (210).

9. A method of cleaning both sides of a wafer, characterized by, Using the wafer double-sided cleaning apparatus according to any one of claims 1-8 includes the following steps: S1. The gripping component (210) is controlled to grip the lower surface of the wafer (300) to complete the cleaning of the upper surface of the wafer (300); S2. Control the upper gripping component (220) to grip the upper surface of the wafer (300) and complete the cleaning of the lower surface of the wafer (300); S3. The gripping block 1 (2231) and gripping block 2 (2232) are alternately controlled to achieve negative pressure gripping of the wafer (300), while the drying airflow is controlled to blow towards the upper surface of the wafer (300) to complete the drying of the upper surface of the wafer (300).

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