Display panel and display device

Abstract

The present application belongs to the field of display, and specifically relates to a display panel and a display device, wherein the display panel includes a base substrate, a driving circuit layer, a pixel definition layer, a conductor structure, an eaves layer, a light-emitting layer and a cathode layer, which are formed in sequence, wherein the pixel definition layer includes a pixel opening area and a pixel definition part around the pixel opening area, wherein the conductor structure is formed on the side of the pixel definition part away from the base substrate, wherein the conductor structure includes at least a first conductor layer, wherein the eaves layer covers the first conductor layer to form a slit area, wherein the side edge of the conductor structure is deflected toward the side away from the base substrate, so that the opening direction of the slit area is deflected toward the side away from the base substrate, and the cathode is formed on the side of the display light-emitting part away from the base substrate and extends to the slit area to connect with the first conductor layer. The opening direction of the slit area is deflected toward the side away from the base substrate, and compared with the scheme in which the opening direction of the slit area is parallel to the base substrate, the contact area of ​​the cathode and the conductor structure overlap is increased, and the cathode impedance is reduced.

Description

Technical Field

[0001] The present application belongs to the field of display, and specifically relates to a display panel and a display device. Background Art

[0002] OLED (Organic Light Emitting Diode) display panels have the advantages of being light and thin, high brightness, low power consumption, fast response, high clarity, and a wide color gamut, and their status in the display field is becoming increasingly important.

[0003] The display panel includes a pixel definition layer, a conductor unit and an eaves unit. The pixel definition layer includes a pixel opening area and a pixel definition portion that defines the pixel opening area. The conductor unit is formed on the pixel definition portion, and the eaves unit is formed on the conductor unit. A gap is easily formed between the conductor unit and the eaves unit.

[0004] The organic light-emitting material forming the display light-emitting part is separated by the eaves unit, and the metal material forming the cathode is connected through the conductor unit. Due to the evaporation angle of the metal material, only a small area of ​​the cathode is overlapped with the conductor unit, resulting in an increase in the cathode impedance. Summary of the invention

[0005] The purpose of the present application is to provide a display panel and a display device to increase the contact area between the cathode and the conductor unit and reduce the cathode impedance.

[0006] In order to achieve the above object, the present application provides a display panel, including a base substrate and a driving circuit layer, wherein the driving circuit layer is formed on one side of the base substrate, and the display panel further includes:

[0007] A pixel definition layer is formed on a side of the driving circuit layer away from the base substrate, wherein the pixel definition layer includes a pixel opening area and a pixel definition portion around the pixel opening area;

[0008] A conductor structure, formed on a side of the pixel definition portion away from the base substrate, the conductor structure comprising at least a first conductor layer;

[0009] an eaves layer, covering the first conductor layer, wherein a slit region is formed on a side of the first conductor layer close to the pixel opening region, and a side edge of the conductor structure close to the pixel opening region is tilted away from the base substrate, so that an opening direction of the slit region is tilted away from the base substrate;

[0010] The light-emitting layer includes a plurality of display light-emitting portions, wherein the display light-emitting portions are at least formed in the pixel opening area;

[0011] The cathode layer includes a plurality of cathodes, wherein the cathodes are formed on a side of the display light emitting portion away from the base substrate and extend to the slit area to be connected to the first conductor layer.

[0012] Optionally, the display panel also includes a raising layer, which is formed between the pixel definition portion and the conductor structure, and the raising layer forms an inverted trapezoidal cross-section groove on the side away from the base substrate, and the conductor structure is located in the inverted trapezoidal cross-section groove close to the lower surface of the base substrate.

[0013] Optionally, the conductor structure also includes a second conductor layer, which is formed on a side of the first conductor layer away from the base substrate, the slit area is located on a side of the second conductor layer close to the base substrate, the cathode covers at least a portion of the lower surface of the second conductor layer to form the slit area, and the orthographic projection of the second conductor layer on the base substrate is located within the orthographic projection of the eaves layer on the base substrate.

[0014] Optionally, the material of the padding layer includes a conductive material, and the material of the padding layer is different from the material of the pixel definition layer.

[0015] Optionally, the conductor structure also includes a third conductor layer, which is formed on a side of the first conductor layer close to the substrate, the slit area is located on a side of the third conductor layer away from the substrate, and the cathode covers at least a portion of the upper surface of the third conductor layer to form the slit.

[0016] Optionally, the material of the padding layer includes a non-conductive organic material, and the material of the padding layer is different from the material of the pixel definition layer.

[0017] Optionally, a side of the pixel definition portion away from the base substrate forms an inverted trapezoidal cross-section groove, and the conductor structure is located in the inverted trapezoidal cross-section groove close to the lower surface of the base substrate.

[0018] Optionally, the opening direction of the slit area is tilted 30° to 40° away from the substrate.

[0019] Optionally, the side edge of the eave layer close to the pixel opening area is tilted away from the base substrate, and the angle at which the side edge of the eave layer is tilted away from the base substrate is equal to the angle at which the side edge of the conductor structure is tilted away from the base substrate.

[0020] The present application also provides a display device, comprising:

[0021] the display panel;

[0022] A main board is connected to the display panel.

[0023] The display panel and display device disclosed in this application have the following beneficial effects:

[0024] In the present application, the display panel includes a substrate, a driving circuit layer, a pixel definition layer, a conductor structure, an eaves layer, a light-emitting layer and a cathode layer, the driving circuit layer is formed on one side of the substrate, the pixel definition layer is formed on the side of the driving circuit layer away from the substrate, the pixel definition layer includes a pixel opening area and a pixel definition part around the pixel opening area, the conductor structure is formed on the side of the pixel definition part away from the substrate, the conductor structure includes at least a first conductor layer, the eaves layer covers the first conductor layer, a slit area is formed on the side of the first conductor layer close to the pixel opening area, the side edge of the conductor structure close to the pixel opening area is deflected toward the side away from the substrate, so that the opening direction of the slit area is deflected toward the side away from the substrate, and the cathode is formed on the side of the display light-emitting part away from the substrate and extends to the slit area to connect with the first conductor layer. Compared with the scheme in which the opening direction of the slit area is parallel to the substrate, the present application increases the contact area of ​​the cathode and the conductor structure overlap and reduces the cathode impedance.

[0025] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0026] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 It is a schematic diagram of the structure of the display panel in the first embodiment of the present application.

[0029] Figure 2 It is a schematic diagram of the evaporation angle of the organic light-emitting material and the cathode material in Example 1 of the present application.

[0030] Figure 3 It is a schematic diagram of the structure of the display panel in the second embodiment of the present application.

[0031] Figure 4 It is a schematic diagram of the structure of the display device in the third embodiment of the present application.

[0032] Description of reference numerals:

[0033] 100, base substrate; 200, driving circuit layer;

[0034] 311, anode; 320, pixel definition layer; 321, pixel opening area; 322, pixel definition part; 330, conductor structure; 331, first conductor layer; 332, second conductor layer; 333, third conductor layer; 301, slit area; 340, eaves layer; 351, display light-emitting part; 361, cathode; 370, padding layer; 10, display panel; 20, motherboard. DETAILED DESCRIPTION

[0035] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0036] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0037] The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

[0038] Embodiment 1

[0039] See also Figure 1 and Figure 2 As shown, in this embodiment, the display panel 10 includes a base substrate 100, a driving circuit layer 200, an anode layer, a pixel definition layer 320, a conductor structure 330, an eaves layer 340, a light-emitting layer and a cathode layer. The driving circuit layer 200 is formed on one side of the base substrate 100, and the driving circuit layer 200 includes a plurality of pixel driving circuits. The base substrate 100 includes a glass substrate or a polyimide (Pi) substrate. The anode layer is formed on the side of the driving circuit layer 200 away from the base substrate 100, and the anode layer includes a plurality of anodes 311 arranged at intervals, and the anodes 311 are connected to the pixel driving circuits one by one.

[0040] The pixel definition layer 320 is formed on the side of the driving circuit layer 200 away from the base substrate 100. The pixel definition layer 320 includes a pixel opening area 321 and a pixel definition portion 322 around the pixel opening area 321 that defines the pixel opening area 321. The pixel definition portion 322 covers the edge area of ​​the anode 311, and the pixel opening area 321 exposes the central area of ​​the anode 311.

[0041] The conductor structure 330 is formed on the side of the pixel definition portion 322 away from the base substrate 100. The conductor structure 330 includes at least a first conductor layer 331. The eaves layer 340 covers the first conductor layer 331. The orthographic projection of the first conductor layer 331 on the base substrate 100 is located within the orthographic projection of the first conductor layer 331 on the base substrate 100, and a slit area 301 is formed on the side of the first conductor layer 331 close to the pixel opening area 321, and the slit area 301 is located on the side of the eaves layer 340 close to the base substrate 100. The side edge of the conductor structure 330 close to the pixel opening area 321 is tilted toward the side away from the base substrate 100, that is, the side edge of the conductor structure 330 close to the pixel opening area 321 is bent or curved toward the side away from the base substrate 100, so that the opening direction of the slit area 301 is tilted toward the side away from the base substrate 100. When the side portion of the conductor structure 330 is not tilted toward the side away from the base substrate 100, the opening direction of the slit area 301 is parallel to the base substrate 100 and points to the pixel opening area 321. When the side portion of the conductor structure 330 is tilted toward the side away from the base substrate 100, the opening direction of the slit area 301 forms a certain angle with the base substrate 100.

[0042] The light-emitting layer includes a plurality of display light-emitting portions 351, and the display light-emitting portions 351 are at least formed in the pixel opening area 321, and the display light-emitting portions 351 are connected to the anode 311 in a one-to-one correspondence. The cathode layer includes a plurality of cathodes 361, and the cathode 361 is formed on the side of the display light-emitting portion 351 away from the base substrate 100 and extends to the slit area 301 and is connected to the first conductor layer 331. The light-emitting layer can be made of organic light-emitting materials, and the cathode layer can be made of metal materials. When the organic light-emitting material and the cathode layer material are evaporated, the evaporation angle of the organic light-emitting material is α, and the evaporation angle of the cathode layer material is β. The organic light-emitting material is separated by the eaves layer 340, and the cathode layer material fills the slit area 301, forming a cathode 361 connected to the first conductor layer 331 of the conductor structure 330. Since the side portion of the conductor structure 330 close to the pixel opening area 321 is tilted toward the side away from the base substrate 100, the opening direction of the slit area 301 is tilted toward the side away from the base substrate 100. Compared with the scheme in which the opening direction of the slit area 301 is set parallel to the base substrate 100, the contact area between the cathode 361 and the conductor structure 330 is increased, and the impedance of the cathode 361 is reduced.

[0043] In this embodiment, the display panel 10 includes a base substrate 100, a driving circuit layer 200, a pixel definition layer 320, a conductor structure 330, an eaves layer 340, a light-emitting layer and a cathode layer. The driving circuit layer 200 is formed on one side of the base substrate 100, the pixel definition layer 320 is formed on the side of the driving circuit layer 200 away from the base substrate 100, the pixel definition layer 320 includes a pixel opening area 321 and a pixel definition portion 322 around the pixel opening area 321, the conductor structure 330 is formed on the side of the pixel definition portion 322 away from the base substrate 100, the conductor structure 330 includes at least a first conductor layer 331, the eaves layer 340 covers the first conductor layer 331, and a slit area 301 is formed on the side of the first conductor layer 331 close to the pixel opening area 321, the opening direction of the slit area 301 is inclined toward the side away from the base substrate 100, and the cathode 361 is formed on the side of the display light-emitting portion 351 away from the base substrate 100 and extends to the slit area 301 and is connected to the first conductor layer 331. Compared with the solution in which the opening direction of the slit area 301 is arranged parallel to the base substrate 100 , the present application increases the contact area between the cathode 361 and the conductor structure 330 and reduces the impedance of the cathode 361 .

[0044] In some embodiments, the display panel 10 further includes a raised layer 370, which is formed between the pixel definition portion 322 and the conductor structure 330. The raised layer 370 forms an inverted trapezoidal cross-section groove on the side away from the base substrate 100, and the lower surface of the conductor structure 330 close to the base substrate 100 is located in the inverted trapezoidal cross-section groove. The raised layer 370 below the side portion of the conductor structure 330 close to the pixel opening area 321 is a wedge with two sharp corners facing each other, and the center portion of the conductor structure 330 away from the pixel opening area 321 is in contact with the pixel definition portion 322 or connected through the raised layer 370. In other words, the cross section of the raised layer 370 is a wedge with two sharp corners facing each other, and the upper surface of the raised layer 370 and the upper surface of the pixel definition portion 322 together form an inverted trapezoidal cross-section groove, or the upper surface of the raised layer 370 forms an inverted trapezoidal cross-section groove.

[0045] When the conductor structure 330 includes the first conductor layer 331, the lower surface of the first conductor layer 331 is located in the inverted trapezoidal cross-section groove. Since the padding layer 370 pads the side of the conductor structure 330 close to the pixel opening area 321, the side of the conductor structure 330 close to the pixel opening area 321 is tilted away from the base substrate 100, thereby making the opening direction of the slit area 301 tilted away from the base substrate 100.

[0046] When making the padding layer 370, the padding layer 370 material may be first formed on the pixel definition portion 322, and then an etching or baking process may be used to form an inclined upper surface of the padding layer 370, and then the excess padding layer 370 material may be etched away to form the padding layer 370. The padding layer 370 may be made of a conductive material or a non-conductive material, and the conductive material may include a conductive metal material, and the non-conductive material may include polyimide, silicon nitride, silicon oxide, silicon oxynitride, and the like.

[0047] It should be noted that a raising layer 370 is provided below the conductor structure 330, and an inverted trapezoidal cross-section groove is formed on the upper surface of the raising layer 370. The inclined upper surface of the raising layer 370 can make the side of the conductor structure 330 close to the pixel opening area 321 deflect toward the side away from the base substrate 100, but is not limited to this. An inverted trapezoidal cross-section groove can also be formed on the pixel defining portion 322, and the side of the conductor structure 330 close to the pixel opening area 321 can be deflected toward the side away from the base substrate 100 through the inclined surface of the inverted trapezoidal cross-section groove of the pixel defining portion 322. The specific situation can be determined according to the circumstances.

[0048] By forming a raised layer 370 between the conductor structure 330 and the pixel definition portion 322, the side edge of the conductor structure 330 close to the pixel opening region 321 is tilted toward the side away from the base substrate 100 through the inclined upper surface of the raised layer 370, so that the opening direction of the slit region 301 is tilted toward the side away from the base substrate 100 more easily. At the same time, compared with the solution of forming an inverted trapezoidal cross-section groove on the pixel definition portion 322, the raised layer 370 is provided below the conductor structure 330, which can reduce the process difficulty and improve the yield of the display panel 10.

[0049] In some embodiments, the conductor structure 330 further includes a second conductor layer 332, the second conductor layer 332 is formed on a side of the first conductor layer 331 away from the base substrate 100, the slit area 301 is located on a side of the second conductor layer 332 close to the base substrate 100, and the cathode 361 covers at least a portion of the lower surface of the second conductor layer 332 forming the slit area 301. The orthographic projection of the second conductor layer 332 on the base substrate 100 is located within the orthographic projection of the eaves layer 340 on the base substrate 100.

[0050] A second conductor layer 332 is arranged between the first conductor layer 331 and the eaves layer 340. The second conductor layer 332 can raise the eaves layer 340 to increase the entrance area of ​​the slit area 301. At the same time, the cathode 361 overlaps with the side surface of the first conductor layer 331 and part of the lower surface of the second conductor layer 332, further increasing the contact area between the cathode 361 and the conductor structure 330 and reducing the impedance of the cathode 361.

[0051] In some embodiments, the material of the padding layer 370 includes a conductive material, such as a conductive metal material, and the pixel definition layer 320 can be made of an organic material, such as polyimide. The material of the padding layer 370 is different from the material of the pixel definition layer 320, so that there is an etching selectivity between the padding layer 370 and the pixel definition layer 320, so as to facilitate the manufacture of the padding layer 370. The orthographic projection of the first conductor layer 331 on the base substrate 100 is located within the orthographic projection of the padding layer 370 on the base substrate 100. The slit area 301 is located between the upper surface of the padding layer 370, the side surface of the first conductor layer 331, and the lower surface of the second conductor layer 332.

[0052] The padding layer 370 is made of conductive material and the cathode layer material is evaporated to form a cathode 361 that overlaps with the conductor structure 330. The cathode 361 overlaps part of the upper surface of the padding layer 370, the side of the first conductor layer 331, and part of the lower surface of the second conductor layer 332, further increasing the contact area between the cathode 361 and the conductor structure 330 and reducing the impedance of the cathode 361.

[0053] In some embodiments, the conductor structure 330 further includes a third conductor layer 333, and the third conductor layer 333 is formed on the side of the first conductor layer 331 close to the substrate 100. The slit area 301 is located on the side of the third conductor layer 333 away from the substrate 100. The conductor structure 330 may include one of the second conductor layer 332 and the third conductor layer 333, or may include both the second conductor layer 332 and the third conductor layer 333. When the conductor structure 330 includes both the second conductor layer 332 and the third conductor layer 333, the slit area 301 is located between the upper surface of the third conductor layer 333, the side surface of the first conductor layer 331, and the lower surface of the second conductor layer 332.

[0054] The conductor structure 330 further includes a third conductor layer 333. When the cathode layer material is evaporated to form a cathode 361 overlapping the conductor structure 330, the cathode 361 overlaps a portion of the upper surface of the third conductor layer 333, the side surface of the first conductor layer 331, and a portion of the lower surface of the second conductor layer 332, further increasing the contact area of ​​the cathode 361 overlapping the conductor structure 330 and reducing the impedance of the cathode 361. At the same time, the provision of the third conductor layer 333 increases the material selection range of the padding layer 370, which is conducive to reducing the difficulty of manufacturing the padding layer 370 and reducing the manufacturing cost of the display panel 10.

[0055] In some embodiments, the material of the padding layer 370 includes a non-conductive organic material, and the non-conductive organic material includes polyimide. The material of the padding layer 370 is different from the material of the pixel definition layer 320, so that the padding layer 370 and the pixel definition layer 320 have etching selectivity, so as to facilitate the manufacture of the padding layer 370.

[0056] The padding layer 370 is made of non-conductive organic material, which is conducive to reducing the difficulty of manufacturing the padding layer 370 and reducing the manufacturing cost of the display panel 10. At the same time, the padding layer 370 can separate the display light-emitting portion 351 and the conductor structure 330 to avoid the conductor structure 330 connecting the adjacent display light-emitting portion 351 to cause crosstalk.

[0057] In some embodiments, the side portion of the eaves layer 340 close to the pixel opening area 321 is tilted toward the side away from the base substrate 100, and the angle at which the side portion of the eaves layer 340 is tilted away from the base substrate 100 is equal to the angle at which the side portion of the conductor structure 330 is tilted away from the base substrate 100.

[0058] The side edges of the eaves layer 340 and the conductor structure 330 are both tilted away from the base substrate 100 and the tilt angles are equal. The tilting of the side edges of the eaves layer 340 and the conductor structure 330 does not affect the opening size of the slit area 301, which is conducive to the cathode 361 extending to the slit area 301 and overlapping the conductor structure 330.

[0059] In some embodiments, the opening direction of the slit region 301 is tilted by less than 50° away from the substrate 100. Preferably, the opening direction of the slit region 301 is tilted by 30° to 40°, such as 30°, 35°, and 40°, away from the substrate 100.

[0060] The opening direction of the slit region 301 is tilted 30° to 40° away from the base substrate 100 , which matches the evaporation angle of the cathode layer material and facilitates the cathode 361 to extend to the slit region 301 and overlap with the conductor structure 330 .

[0061] Embodiment 2

[0062] The main difference between the second embodiment and the first embodiment is that the structure of making the side portion of the conductor structure 330 close to the pixel opening area 321 deflect toward the side away from the base substrate 100 is different. In the first embodiment, a padding layer 370 is arranged below the conductor structure 330, and the upper surface of the padding layer 370 forms an inverted trapezoidal cross-section groove. In this embodiment, an inverted trapezoidal cross-section groove is formed on the side of the pixel definition portion 322 away from the base substrate 100, and the lower surface of the conductor structure 330 close to the base substrate 100 is located in the inverted trapezoidal cross-section groove. When the conductor structure 330 includes a first conductor layer 331, the lower surface of the first conductor layer 331 is located in the inverted trapezoidal cross-section groove, and when the conductor structure 330 includes a first conductor layer 331 and a third conductor layer 333, the lower surface of the third conductor layer 333 is located in the inverted trapezoidal cross-section groove.

[0063] An inverted trapezoidal cross-section groove is formed on the side of the pixel definition portion 322 away from the base substrate 100, and the inclined surface of the inverted trapezoidal cross-section groove is used to make the side portion of the conductor structure 330 close to the pixel opening area 321 deviate toward the side away from the base substrate 100. In addition, the side portion of the conductor structure 330 close to the pixel opening area 321 is deviated toward the side away from the base substrate 100 by using the padding layer 370. This can reduce one film layer, thereby simplifying the structure of the display panel 10 and reducing the manufacturing cost of the display panel 10.

[0064] Embodiment 3

[0065] See also Figure 4 As shown, the display device in this embodiment includes a display panel 10 and a main board 20, and the main board 20 is connected to the display panel 10. The display panel 10 includes the display panel 10 disclosed in the first embodiment and the second embodiment.

[0066] The display device includes a display panel 10, which includes a substrate 100, a driving circuit layer 200, a pixel definition layer 320, a conductor structure 330, an eaves layer 340, a light-emitting layer and a cathode layer. The driving circuit layer 200 is formed on one side of the substrate 100, the pixel definition layer 320 is formed on the side of the driving circuit layer 200 away from the substrate 100, the pixel definition layer 320 includes a pixel opening area 321 and a pixel definition part 322 around the pixel opening area 321, the conductor structure 330 is formed on the side of the pixel definition part 322 away from the substrate 100, the conductor structure 330 includes at least a first conductor layer 331, the eaves layer 340 covers the first conductor layer 331, and a slit area 301 is formed on the side of the first conductor layer 331 close to the pixel opening area 321, the opening direction of the slit area 301 is inclined toward the side away from the substrate 100, and the cathode 361 is formed on the side of the display light-emitting part 351 away from the substrate 100 and extends to the slit area 301 and is connected to the first conductor layer 331. Compared with the solution in which the opening direction of the slit area 301 is arranged parallel to the base substrate 100, the present application increases the contact area between the cathode 361 and the conductor structure 330, reduces the impedance of the cathode 361, and improves the display quality of the display device.

[0067] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0068] In this application, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0069] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0070] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims

1. A display panel, comprising a base substrate and a driving circuit layer, wherein the driving circuit layer is formed on one side of the base substrate, characterized in that: The display panel further includes: A pixel definition layer is formed on a side of the driving circuit layer away from the base substrate, wherein the pixel definition layer includes a pixel opening area and a pixel definition portion around the pixel opening area; A conductor structure, formed on a side of the pixel definition portion away from the base substrate, the conductor structure comprising at least a first conductor layer; an eaves layer, covering the first conductor layer, wherein the first conductor layer forms a slit region on a side close to the pixel opening region, and two side edges of the conductor structure close to the pixel opening region are inclined toward a side away from the base substrate, and two side edges of the eaves layer close to the pixel opening region are inclined toward a side away from the base substrate, so that the opening directions of the slit regions on both sides of the conductor structure are inclined toward a side away from the base substrate; The light-emitting layer includes a plurality of display light-emitting portions, wherein the display light-emitting portions are at least formed in the pixel opening area; The cathode layer includes a plurality of cathodes, wherein the cathodes are formed on a side of the display light emitting portion away from the base substrate and extend to the slit area to be connected to the first conductor layer.

2. The display panel according to claim 1, characterized in that: The display panel also includes a cushioning layer formed between the pixel definition portion and the conductor structure, the cushioning layer forms an inverted trapezoidal cross-section groove on the side away from the base substrate, and the conductor structure is located in the inverted trapezoidal cross-section groove close to the lower surface of the base substrate.

3. The display panel according to claim 2, characterized in that: The conductor structure also includes a second conductor layer, which is formed on a side of the first conductor layer away from the base substrate, the slit area is located on a side of the second conductor layer close to the base substrate, the cathode covers at least a portion of the lower surface of the second conductor layer to form the slit area, and the orthographic projection of the second conductor layer on the base substrate is located within the orthographic projection of the eaves layer on the base substrate.

4. The display panel according to claim 3, characterized in that: The material of the padding layer includes a conductive material, and the material of the padding layer is different from the material of the pixel definition layer.

5. The display panel according to claim 2 or 3, characterized in that: The conductor structure also includes a third conductor layer, which is formed on a side of the first conductor layer close to the substrate, the slit area is located on a side of the third conductor layer away from the substrate, and the cathode covers at least a portion of the upper surface of the third conductor layer to form the slit.

6. The display panel according to claim 5, characterized in that: The material of the padding layer includes a non-conductive organic material, and the material of the padding layer is different from the material of the pixel definition layer.

7. The display panel according to claim 1, characterized in that: The pixel definition portion forms an inverted trapezoidal cross-section groove on a side away from the base substrate, and the conductor structure is located in the inverted trapezoidal cross-section groove close to the lower surface of the base substrate.

8. The display panel according to claim 1, characterized in that: The opening direction of the slit area is inclined by 30° to 40° away from the substrate.

9. The display panel according to claim 1, characterized in that: The angle at which the side edge of the eave layer is inclined away from the base substrate is equal to the angle at which the side edge of the conductor structure is inclined away from the base substrate.

10. A display device, characterized in that: include: The display panel according to any one of claims 1 to 9; A main board is connected to the display panel.

Images