High power sealed aircraft equipment heat sink configuration

Abstract

The application provides a high-power sealed aviation equipment heat dissipation configuration and relates to the field of avionics technology, which comprises a sealed machine case, the sealed machine case comprises a sealed shell surrounded by a side wall, a bottom plate and a cover plate, the edge of the bottom plate extends perpendicularly to the direction away from the cover plate to form an extended edge, so that the sealed machine case is divided into an upper sealed cavity and a lower open cavity by the bottom plate; a schematic external connector is installed on the side wall in the sealed cavity, a motherboard module is installed in the sealed cavity, the schematic external connector is connected with the motherboard module through a rigid-flexible plate; a plurality of high-power module boards are installed on the side wall in the sealed cavity; a fan, a machine case air inlet and a machine case air outlet are installed in the open cavity, and machine case air guide fins and heat-sensitive air outlet guide fins are arranged on the bottom plate in the open cavity respectively. The heat dissipation configuration improves the overall heat dissipation capacity of the sealed machine case and enhances the safety and reliability of the normal work of the sealed equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of avionics, in particular to a high-power sealed avionics equipment heat dissipation configuration. BACKGROUND

[0002] With the structure of the sealed avionics equipment (such as sealed data acquisition management processor, etc.) tends to miniaturization, the device function is integrated and the internal high-power module board is accelerated, the environmental adaptability requirement of the device is higher and higher, which makes the thermal design become one of the important indicators of the sealed avionics equipment. For a long time, in the heat dissipation design of the sealed avionics equipment, the heat generated on the high-power module board is usually transmitted to the shell case through the self heat dissipation frame and exchanged with the outside air and dissipated, and the heat exchange efficiency of the outside air is very low, which cannot effectively dissipate the heat of the sealed equipment, so that the internal heat of the sealed equipment is accumulated in large amount, the internal temperature of the equipment exceeds the maximum temperature of the stable operation, which affects the safety and reliability of the equipment.

[0003] Under the impetus of the development trend of the sealed avionics equipment towards miniaturization and integration, innovative thermal design control method needs to be adopted to ensure that the equipment does not exceed the maximum temperature of the stable operation under the working environmental conditions. SUMMARY

[0004] Therefore, the present application provides a high-power sealed avionics equipment heat dissipation configuration, which improves the heat dissipation capacity of the high-power sealed avionics equipment, so that the equipment does not exceed the maximum temperature of the stable operation under the working environmental conditions, and enhances the safety and reliability of the sealed equipment under the normal working environment.

[0005] The present application provides the following technical solutions: a high-power sealed avionics equipment heat dissipation configuration, comprising:

[0006] A sealed case, the sealed case comprises a sealed shell surrounded by a side wall, a bottom plate and a cover plate, the edge of the bottom plate extends perpendicularly to the direction away from the cover plate to form an extended edge, so as to separate the sealed case into a sealed cavity in the upper part and an open cavity in the lower part by the bottom plate;

[0007] The side wall in the sealed cavity is provided with an external connector, the bottom plate in the sealed cavity is provided with a motherboard module, and the external connector and the motherboard module are connected through a rigid-flexible plate; a plurality of high-power module plates are arranged on the side wall in the sealed cavity; the high-power module plate comprises a heat-consuming device and a module cold plate, the heat-consuming device is arranged on the module cold plate, the two sides of the two module cold plates are fixedly connected through a locking device to fix the heat-consuming device between the two module cold plates, the bottom of the module cold plate is provided with a heat-conducting pin sleeve, the bottom plate is provided with a heat-conducting top pin corresponding to the module cold plate, and the heat-conducting top pin is inserted into the heat-conducting pin sleeve in a matched mode; the top end surface of the module cold plate is provided with a module plate heat-conducting pad, and the module plate heat-conducting pad is tightly attached to the cover plate.

[0008] The bottom plate in the open cavity is provided with a fan, a plurality of grooves are formed in the extension edge to form an air inlet of the case, and a plurality of through holes are formed in the extension edge to form an air outlet of the case; the bottom plate in the open cavity is further provided with case air guide fins and heat-sensitive air outlet guide fins.

[0009] According to an embodiment of the present application, the heat-conducting telescopic sleeve is embedded in the heat-conducting pin sleeve, and the heat-conducting top pin is inserted into the heat-conducting telescopic sleeve in a matched mode.

[0010] According to an embodiment of the present application, a plurality of module plate guide grooves are arranged on the side wall in the sealed cavity, and the high-power module plate is arranged in the module plate guide groove to connect the high-power module plate and the side wall of the sealed cavity.

[0011] According to an embodiment of the present application, the locking device is in contact with the module plate guide groove.

[0012] According to an embodiment of the present application, a plurality of cold plate heat dissipation fins are arranged on the outer side wall of the module cold plate, and a heat-conducting pad for the heat-consuming device is attached to the inner side wall of the module cold plate.

[0013] According to an embodiment of the present application, the fan is arranged on one side of the bottom plate close to the external connector, the case air guide fins are arranged in a fan-shaped radial distribution in the middle of the bottom plate with the fan as the center, and the heat-sensitive air outlet guide fins are divided into two rows and arranged on the two sides of the case air guide fins.

[0014] According to an embodiment of the present application, the air inlets of the case are arranged around the fan, and the air outlets of the case are arranged on one side corresponding to the positions of the high-power module plates.

[0015] According to one embodiment of the present application, the intelligent control assembly is fixed on the mother board module.

[0016] According to one embodiment of the present application, the intelligent control assembly is fixed on the mother board module.

[0017] According to one embodiment of the present application, the heat-conducting telescopic sleeve is made of a material with strong heat-conducting property and repeated deformation.

[0018] Compared with the prior art, the above at least one technical solution adopted by the embodiment of the present application can achieve the beneficial effects at least including: the present application adopts innovative heat dissipation layout and heat design strategy, and maximally adopts multi-path heat dissipation mode, so that the heat generated by the high-power module plate is dissipated to the outside of the case through the four surfaces of the top platform, the two side locking devices and the heat-conducting sleeve at the bottom for heat conduction and positioning. The innovative design of the present application physically isolates the sealed device into two areas, the inner cavity is used for placing the high-power module plate, and the open area isolated at the bottom of the sealed device is designed for installing the fan for heat dissipation. The fan is reasonably controlled in speed by the intelligent control assembly to achieve the best heat dissipation mode. The bottom of the sealed case and the corresponding open area of the fan are designed with specially arranged heat-sensitive heat dissipation fins, the heat-conducting top pin in the inner cavity of the sealed device cooperates with the heat-conducting telescopic sleeve on the high-power module plate to transfer the heat generated on the high-power module plate to the heat-sensitive heat dissipation fins, and then the heat on the heat-sensitive heat dissipation fins is dissipated by the fan blowing of the fan in the open area at the bottom of the sealed device to achieve the purpose of overall heat dissipation of the sealed device. The present application improves the heat dissipation performance of the high-power sealed device, and guarantees the thermal stability and reliability of the sealed device.

[0019] The specific beneficial effects are as follows:

[0020] 1) Sealed case isolation and cavity design

[0021] The conventional sealed device is designed with a closed inner cavity, and almost all high-power module plates are placed in the inner cavity. The high-power module plates rely on the heat conduction between the two side locking strips and the case, and the heat conduction efficiency is low due to factors such as surface roughness and mutual cooperation. When the device is working, the heat generated by the high-power module plates affects each other, and a large amount of heat is generated and gathered in the sealed cavity, which is not conducive to the thermal stability of the product.

[0022] In the design of the present application, the device is designed as two physically isolated areas, the inner cavity is used to place the high-power module board, and the open area isolated at the bottom of the sealed device is designed to install the fan for heat dissipation. The open area of the device and the corresponding area of the fan are designed with specially arranged heat-sensitive cooling fins. The heat-sensitive cooling fins are in contact with the high-power module board to transfer heat. This design transfers the heat generated by the high-power module board from the sealed inner cavity to the external open area, and cooperates with the fan for intelligent control of heat dissipation, achieving innovative heat dissipation effect.

[0023] 2) Improve the heat conduction path configuration heat dissipation design

[0024] The high-power module board in the inner cavity of the traditional device relies on the two locking strips on both sides to conduct heat with the case. Due to factors such as surface roughness and mutual cooperation, the heat transfer efficiency is low, and the heat is accumulated in the inner cavity of the device.

[0025] In the design of the present application, the heat conduction path between the high-power module board and the sealed case is optimized and designed, and the contact between the top and bottom of the high-power module board and the sealed case is increased. A small platform parallel to the cover plate is designed at the top of the high-power module board, and a heat-conducting pad with excellent heat-conducting performance is pasted on the small platform to transfer the heat of the module board to the cover plate for heat dissipation. A heat-conducting pin sleeve and an embedded heat-conducting expansion sleeve are designed at the bottom of the high-power module board. The heat-conducting pin sleeve and the heat-conducting expansion sleeve are made of materials with strong heat-conducting and repeated deformation properties. The heat-conducting pin sleeve and the heat-conducting expansion sleeve are in contact with the heat-conducting top pin inside the sealed case, which plays a role in positioning and transferring heat. By increasing the external heat conduction path of the high-power module board, all four surfaces of the high-power module board are in contact with the sealed case for heat dissipation, increasing the heat dissipation path of the high-power module board and making the heat dissipation path smooth.

[0026] 3) Fan intelligent control heat dissipation design

[0027] With the development of device integration and miniaturization, the power of aviation equipment also increases. When the natural heat dissipation method cannot meet the heat dissipation needs of the sealed device, reasonable measures need to be taken to ensure the reliability of the device under environmental conditions.

[0028] In the present application, the device is physically isolated into two areas, the external open area is designed with irregularly arranged heat-sensitive cooling fins, and the fan corresponding to the heat-sensitive cooling fins is adjusted and installed. The external heat-sensitive cooling fins are in close contact with the heat-conducting pin sleeve at the bottom of the high-power module board in the inner cavity of the device, and the heat generated by the high-power module board is transferred to the heat-sensitive cooling fins in the open area. At the same time, the transferred heat causes the heat-sensitive cooling fins to change shape to cooperate with the intelligent control fan to preferentially blow away the heat in the local area. In the process, the fan parameters and the shape of the heat-sensitive cooling fins are automatically adjusted according to the change of the temperature inside the device, and the fan and the heat-sensitive cooling fins cooperate to achieve the best blowing and heat dissipation effect of the fan, so that the temperature in the inner cavity of the device is maintained within a reasonable range.

[0029] 4) Sealing machine case open area configuration design

[0030] In the design of the present application, the sealing machine case open area is designed with heat-sensitive heat dissipation fins, and a fan is installed near the position of the external connector. The heat-sensitive heat dissipation fins form a fan-shaped radiation-like arrangement centered on the fan, ensuring that the contact area on the air path increases when the fan is running, thereby allowing more heat transferred from the high-power module board in the inner cavity to the heat-sensitive heat dissipation fins to be carried away. The sealing machine case open area is designed with a machine case air outlet and a heat-sensitive air outlet guide fin on both sides, and a machine case air inlet is designed in the area close to the fan at the front end, ensuring smooth air intake and air outlet related to the fan in the working state of the fan, and excellent overall heat dissipation of the equipment.

[0031] The present application transmits heat to the heat-sensitive heat dissipation fins in the open area of the device by cooperating the heat-conducting pin sleeve for heat conduction and positioning at the bottom of the heat-generating high-power module board with the heat-conducting top pin of the sealing device, and at the same time, the transmitted heat causes the heat-sensitive heat dissipation fins to change shape to cooperate with the intelligent control fan to preferentially blow away the heat in the local area. Through the adjustment of the open area heat dissipation fin and the fan intelligent control assembly, the heat on the heat-sensitive heat dissipation fins is dissipated by the fan blowing to achieve the purpose of overall heat dissipation of the sealing device. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0033] Figure 1 It is a front view schematic diagram of the high-power sealing device of the embodiment of the present application.

[0034] Figure 2 It is a bottom view schematic diagram of the high-power sealing device of the embodiment of the present application.

[0035] Figure 3 It is a bottom view schematic diagram of the sealing machine case of the embodiment of the present application.

[0036] Figure 4 It is a schematic diagram of the cavity of the sealing machine case of the embodiment of the present application.

[0037] Figure 5 It is an explosion schematic diagram of the high-power sealing device of the embodiment of the present application.

[0038] Figure 6 It is a schematic diagram of the outer contour of the high-power module board of the embodiment of the present application.

[0039] Figure 7It is a schematic diagram of heat dissipation of the high-power module board of the embodiment of the present application.

[0040] Figure 8 It is a schematic diagram of the side view of the high-power sealed device of the embodiment of the present application.

[0041] Figure 9 It is a schematic diagram of the cooperation of the heat-conducting pin sleeve and the heat-conducting top pin of the embodiment of the present application.

[0042] Figure 10 It is a schematic diagram of the heat-conducting telescopic sleeve structure of the embodiment of the present application.

[0043] Figure 11 It is a schematic diagram of the heat-conducting top pin structure of the embodiment of the present application.

[0044] Among them, 1 is a sealing machine box; 2 is a schematic external connector; 3 is a bottom plate; 4 is a cover plate; 5 is a cover plate fastener; 6 is a module board heat-conducting pad; 7 is a high-power module board; 8 is a heat-conducting pin sleeve; 9 is a heat-conducting top pin; 10 is a mother board module; 11 is a fan; 12 is a module cold plate; 13 is a cold plate heat dissipation fin; 14 is a module board connector; 15 is a heat-conducting pad of a heat-consuming device; 16 is a heat-consuming device; 17 is a heat-conducting telescopic sleeve; 18 is a machine box air inlet; 19 is a machine box air outlet; 20 is a machine box air guide fin; 21 is a heat-sensitive air outlet guide fin; 22 is a module board guide groove; 23 is a bottom plate air inlet; 24 is an intelligent control component; 25 is a locking device. DETAILED DESCRIPTION

[0045] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0046] The embodiments of the present application are described below through specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. Obviously, the described embodiments are only some of the embodiments of the present application, not all. The present application can also be implemented or applied through other different specific embodiments, and various modifications or changes can be made to the details in the specification without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0047] As shown in Figures 1-11 , the embodiment of the present application provides a high-power sealed aviation device heat dissipation configuration, which comprises:

[0048] A sealed machine case 1, which comprises a sealed shell surrounded by a side wall, a bottom plate 3 and a cover plate 4, the edge of the bottom plate 3 extends perpendicularly to the direction away from the cover plate 4 to form an extended edge, so as to divide the sealed machine case into an upper sealed cavity and a lower open cavity by the bottom plate 3;

[0049] A schematic external connector 2 is installed on the side wall in the sealed cavity, a motherboard module 10 is installed on the bottom plate 3 in the sealed cavity, and the schematic external connector 2 is connected with the motherboard module 10 through a rigid-flexible plate; a plurality of high-power module boards 7 are also installed on the side wall in the sealed cavity; the high-power module board 7 comprises a heat-consuming device 16 and a module cold plate 12, the heat-consuming device 16 is installed on the module cold plate 12, the two sides of the two module cold plates 12 are fixedly connected through locking devices 25 to fix the heat-consuming device 16 between the two module cold plates 12, a heat-conducting pin sleeve 8 is fixed at the bottom of the module cold plate 12, a heat-conducting top pin 9 is arranged at the position corresponding to the module cold plate 12 on the bottom plate 3, and the heat-conducting top pin 9 is inserted into the heat-conducting pin sleeve 8 in cooperation; a module board connector 14 is also arranged at the bottom of the module cold plate 12, and the module board connector 14 is inserted into the motherboard module 10; a module board heat-conducting pad 6 is pasted on the top end face of the module cold plate 12, and the module board heat-conducting pad 6 is tightly attached to the cover plate 4;

[0050] A fan 11 is installed on the bottom plate 3 in the open cavity, a plurality of grooves are formed on the extended edge to form a machine case air inlet 18, a plurality of through holes are formed on the extended edge to form a machine case air outlet 19, and a machine case air guide fin 20 and a heat-sensitive air outlet guide fin 21 are respectively arranged on the bottom plate 3 in the open cavity.

[0051] In an embodiment, a heat-conducting telescopic sleeve 17 is further included, which is embedded in the heat-conducting pin sleeve 8, and the heat-conducting top pin 9 is inserted into the heat-conducting telescopic sleeve 17 in cooperation. The heat-conducting telescopic sleeve 17 is made of a material with strong heat conductivity and repeated deformation.

[0052] In an embodiment, an intelligent control assembly 24 is further included, which is installed in the sealed cavity to collect the temperature in the sealed cavity, and is in control connection with the fan 11 to control the opening and closing and the wind speed of the fan 11 in real time according to the collected temperature in the sealed cavity. Further, the intelligent control assembly 24 is fixed on the motherboard module 10.

[0053] In an embodiment, a plurality of module plate guide grooves 22 are further included, which are arranged on the side wall in the sealed cavity, and the high-power module plate 7 is installed in the module plate guide groove 22 to connect the high-power module plate 7 with the side wall of the sealed cavity. Further, the locking device is in contact with the module plate guide groove.

[0054] In order to further improve heat dissipation, in an embodiment, a plurality of cold plate heat dissipation fins 13 are arranged on the outer side wall of the module cold plate 12, and a heat dissipation device heat-conducting pad 15 is attached to the inner side wall of the module cold plate 12.

[0055] The high-power sealed aviation equipment heat dissipation configuration provided by the embodiment can efficiently transfer the heat generated by the high-power module plate to the heat-sensitive heat dissipation fins in the open area through physical thermal isolation of the sealed cabinet, and can reasonably dissipate heat through intelligent control of the fan, thereby solving the problem of low heat dissipation efficiency of the traditional sealed cabinet, improving the heat dissipation capacity of the sealed cabinet, and improving the thermal stability of the high-power sealed aviation product.

[0056] In specific implementation, the high-power sealed aviation equipment heat dissipation configuration of the embodiment specifically includes:

[0057] The sealed cabinet 1, the schematic external connector 2, the bottom plate 3, and the cover plate 4 form the external features of the sealed aviation equipment, and the cover plate 4 is fixedly connected through the cover plate fastener 5. The sealed cabinet 1 is isolated into two areas, of which the upper part is in a sealed structure form, and is designed to be installed with a heat-conducting top pin 9, a module plate guide groove 22, a high-power module plate 7, a module plate heat-conducting pad 6, a mother board module 10, and an intelligent control assembly 24 (such as shown in Figure 1 and Figure 2 The lower part of the sealed cabinet 1 is designed to be installed with a fan 11, a cabinet air inlet 18, a cabinet air outlet 19, a cabinet air guide fin 20, and a heat-sensitive air outlet guide fin 21. The schematic external connector 2 is connected to the mother board module 10 through the rigid-flex board in the sealed cabinet 1, the intelligent control assembly 24 is installed on the mother board module 10, and the intelligent control assembly 10 is connected to the fan 11 through a wire (such as shown in Figure 3 and Figure 4 ).

[0058] The high-power module plate 7 is composed of a heat-conducting pin sleeve 8, a module cold plate 12, a module plate connector 14, a heat-dissipation device 16, a heat-dissipation device heat-conducting pad 15, a locking device 25 and a heat-conducting telescopic sleeve 17. The heat-dissipation device 16 generates heat which is transferred to the module cold plate 12 with cold plate heat-dissipation fins 13 through the heat-dissipation device heat-conducting pad 15. The module cold plate 12 is designed with a small platform at the top. The module plate heat-conducting pad 6 is pasted on the small platform to contact the cover plate 4, so that the heat generated by the high-power module plate 7 is transferred to the cover plate 4 for dissipation. The heat-conducting pin sleeve 8 is installed at the bottom of the module cold plate 12. The heat-conducting telescopic sleeve 17 is embedded in the heat-conducting pin sleeve 8. The heat-conducting telescopic sleeve 17 is designed with a material with strong heat-conducting property and repeated deformation. When the high-power module plate 7 is inserted into the module plate guide groove 22 in the sealed cabinet 1, the heat-conducting pin sleeve 8 will cooperate with the heat-conducting top pin 9 installed inside the sealed cabinet 1. The heat-conducting telescopic sleeve 17 embedded in the heat-conducting pin sleeve 8 cooperates with the heat-conducting top pin 9 to play a double role of mutual insertion and heat transfer, so that the heat generated by the high-power module plate 7 is transferred to the heat-sensitive heat-dissipation fins in the open area of the sealed cabinet 1 for dissipation. The high-power module plate 7 is designed with the locking device 25 on both sides. The locking device 25 cooperates with the module plate guide groove 22 of the sealed cabinet 1 to transfer the heat generated by the high-power module plate 7 to the sealed cabinet 1 for dissipation. The high-power module plate 7 has heat transfer and dissipation in four directions (as shown in Figures 8-11 ).

[0059] The bottom open area of the sealed cabinet 1 is designed with a cabinet air inlet 18, a cabinet air outlet 19, cabinet air guide fins 20 and heat-sensitive air outlet guide fins 21. The fan 11 is installed near the schematic external connector 2, and the cabinet air guide fins 20 form a fan 11-centered fan-shaped radial arrangement, which ensures that the contact area on the air path increases when the fan 11 is running, thereby carrying away more heat transferred from the high-power module board 7 in the inner cavity to the heat-sensitive heat dissipation fins. The heat-sensitive air outlet guide fins 21 are divided into two rows and distributed on both sides of the cabinet air guide fins 20. The heat-sensitive air outlet guide fins 21 can change shape with changes in temperature on the fins. The intelligent control component 24 controls the operating parameters of the fan 11, and the heat transferred simultaneously causes the heat-sensitive air outlet guide fins 21 to change shape to cooperate with the intelligent control component 24 to control the fan 11 to preferentially blow away the heat in the local area, achieving the purpose of dissipating heat from the module board. The cabinet air inlet 18 is distributed around the fan 11 in the sealed cabinet 1, and the cabinet air outlet 19 is distributed in the area where the high-power module board 7 is installed in the sealed cabinet 1. The sealed cabinet 1 does not have a cabinet air outlet 19 at the tail, which ensures that the air inlet and air outlet related to the fan are smooth in the working state of the fan 11, and the overall heat dissipation of the equipment is excellent. The sealed cabinet 1 is installed with a fan intelligent control component 24. When the intelligent control component 24 detects that the temperature in the inner cavity of the equipment reaches a certain degree, it controls the fan 11 to blow and dissipate heat. The bottom plate 3 has a bottom plate air inlet hole 23 corresponding to the fan 11. In the adjustment process, the intelligent control component 24 can automatically adjust the parameters of the fan 11 according to the temperature change in the sealed cavity of the equipment, achieving the best fan blowing and heat dissipation effect, and keeping the temperature in the inner cavity of the equipment within a reasonable range (such as Figure 4 and Figure 5 indicated).

[0060] The sealed machine case 1 is divided into a sealed inner cavity and an open bottom area by physical isolation, and a high-power module plate 7 and a smart control assembly 24 corresponding to the fan 11 are designed and installed inside, the heat generated by the high-power module plate 7 is transferred to the outside in four directions, the heat-conducting pin sleeve 8 at the bottom of the high-power module plate 7 is guided by the heat-conducting top pin 9 inside the sealed machine case 1, and the heat is transferred to the heat-sensitive air outlet guide fin 21 of the open cavity of the sealed machine case 1, the cooling air blows on the machine case air guide fin 20 arranged in a fan-shaped radiation pattern centered on the fan 11, and the whole product is cooled. The partition design of the sealed machine case 1 improves the heat dissipation layout capability, operability and maintainability of the sealed equipment. The design of the high-power module plate 7 transferring heat to the outside in four directions at the same time enhances the heat conduction path of the sealed equipment to the outside, ensures that the generated heat is evenly dispersed, and improves the thermal stability of the sealed equipment. The combination of the fan 11 and the smart control assembly 24, according to the actual demand, intelligently controls and adjusts the parameters of the fan 11 to ensure that the electronic devices in the inner cavity of the sealed machine case 1 are within a reasonable working temperature range, innovates the path of intelligent heat dissipation and control of the sealed machine case, improves the overall heat dissipation capability of the sealed equipment, so that it does not exceed the maximum temperature of stable operation under the working environmental conditions, and ensures the safety of normal operation of the equipment under the environmental conditions, and the reliability of long-term operation (as shown in Figure 6 and Figure 7 ).

[0061] In the embodiment of the application, based on the existing certain type of aviation product, the innovative heat dissipation configuration improves the thermal stability of the sealed electronic equipment, improves the heat dissipation capability of the high-power sealed aviation equipment, so that it does not exceed the maximum temperature of stable operation under the working environmental conditions, and ensures the safety of normal operation of the equipment under the environmental conditions, and the reliability of long-term operation. The heat dissipation configuration principle of the high-power sealed aviation equipment is reliable, easy to operate and implement, and can effectively improve the overall performance of the sealed aviation equipment.

[0062] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A high power sealed aircraft equipment cooling configuration, characterized by, The utility model relates to a sealed machine case, the sealed machine case includes the sealed shell that constitutes by side wall, bottom plate and cover plate, the edge of bottom plate extends the extension edge perpendicularly in the direction away from the cover plate, and the sealed machine case is divided into the sealed cavity of upper portion and the open cavity of lower portion through bottom plate, the side wall in the sealed cavity is installed the schematic external connector, the bottom plate in the sealed cavity is installed the female board module, and the schematic external connector is connected with the female board module through rigid-flexible board, the side wall in the sealed cavity is installed still several high -power module boards, the high -power module board includes heat -wasting device and module cold plate, heat -wasting device is installed on the module cold plate, and the both sides of two module cold plates are fixedly connected through locking device to fix heat -wasting device between two module cold plates, and the bottom of module cold plate is fixed heat -conducting pin sleeve, the corresponding position of bottom plate with module cold plate is provided heat -conducting top pin, and heat -conducting top pin is cooperated with heat -conducting pin sleeve and inserts, the bottom of module cold plate is provided module board connector still, and module board connector is inserted with female board module, the top end face of module cold plate is pasted module board heat -conducting pad, and module board heat -conducting pad is close to cover plate. The bottom plate in the open cavity is installed fan, a plurality of recesses are seted up on the extension edge to form the air inlet of machine case, a plurality of through holes are seted up on the extension edge to form the air outlet of machine case, and the bottom plate in the open cavity is provided with machine case air guide fin and heat -sensitive air outlet guide fin respectively. It further includes a heat-conducting telescopic sleeve, the heat-conducting telescopic sleeve is embedded in the heat-conducting pin sleeve, and the heat-conducting top pin is inserted into the heat-conducting telescopic sleeve and cooperates with the heat-conducting telescopic sleeve. It further includes a plurality of module board guide grooves, the module board guide grooves are arranged on the side wall in the sealed cavity, and the high-power module board is installed in the module board guide groove to connect the high-power module board with the side wall of the sealed cavity.

2. The high power sealed aircraft equipment heat sink configuration of claim 1, wherein, The locking device is in contact with the module board guide groove.

3. The high power sealed aerospace device heat dissipation configuration of claim 1, wherein, A plurality of cold plate heat dissipation fins are arranged on the outer side wall of the module cold plate, and a heat dissipation pad for heat-consuming devices is pasted on the inner side wall of the module cold plate.

4. The high power sealed aerospace device heat dissipation configuration of claim 3, wherein, The fan is installed on one side of the bottom plate close to the schematic external connector, the machine case air guide fins are arranged in a fan-shaped radial pattern in the middle of the bottom plate with the fan as the center, and the heat-sensitive air outlet guide fins are divided into two rows and arranged on both sides of the machine case air guide fins.

5. The high power sealed aerospace device heat dissipation configuration of claim 1, wherein, The air inlets of the machine case are distributed around the fan, and the air outlets of the machine case are distributed on one side corresponding to the positions of the high-power module boards.

6. The high power sealed aerospace device heat dissipation configuration of claim 1, wherein, It further includes an intelligent control assembly, the intelligent control assembly is installed in the sealed cavity for collecting the temperature in the sealed cavity, the intelligent control assembly is in control connection with the fan for controlling the opening and closing and wind speed of the fan in real time according to the collected temperature in the sealed cavity.

7. The high power sealed aerospace device heat dissipation configuration of claim 1, wherein, The intelligent control assembly is fixed on the female board module.

8. The high power sealed aerospace device heat dissipation configuration of claim 1, wherein, The heat-conducting telescopic sleeve is made of a material that can repeatedly deform and has strong heat conductivity.

9. The high power sealed aerospace device heat dissipation configuration of claim 8, wherein, ​ 10. The high power sealed aerospace device heat dissipation configuration of claim 2, wherein, ​

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