Method and apparatus for cutting silicon rod, and electronic device

Abstract

The embodiment of the present application provides a kind of cutting method and device of silicon rod, electronic equipment, applied to silicon rod cutting equipment, which comprises the following steps: obtaining the cutting data of the silicon rod to be cut;Based on the cutting data, the number of kerf that will be generated by cutting the silicon rod to be cut is calculated, and the first kerf value is obtained;Based on the preset correlation between the number of kerf and the return rate of the silicon rod cutting equipment, the first return rate corresponding to the first kerf value is determined;Based on the first return rate, the silicon rod to be cut is cut.The present application can not only reduce the high wire consumption rate when cutting short silicon rods, but also reduce the waste of cutting wire.It can also reduce the high breakage rate when cutting long silicon rods.

Description

Technical Field

[0001] This invention relates to the field of silicon rod cutting technology, and more particularly to a method, apparatus, and electronic device for cutting silicon rods. Background Technology

[0002] With the continuous development of the modern economy, monocrystalline silicon, as a clean energy source, is being widely used in various industries. Photovoltaic power generation, as a leading clean energy source, is receiving increasing attention. Monocrystalline silicon rods, also known as silicon rods, are a raw material for photovoltaic power generation and have a wide market demand.

[0003] Currently, one method of processing silicon rods is to use a cutting machine to cut large-sized silicon rods into multiple segments that meet size requirements for subsequent processing.

[0004] However, current cutting machine processes are based on longer silicon rods, resulting in higher wire consumption when cutting shorter silicon rods, thus wasting cutting wire. Summary of the Invention

[0005] This invention provides a method, apparatus, and electronic device for cutting silicon rods, to solve the problem of high wire consumption rate in existing cutting machines, which leads to wasted cutting wire.

[0006] In a first aspect, embodiments of the present invention provide a method for cutting silicon rods, applied to a silicon rod cutting device, the method comprising:

[0007] Obtain the cutting data of the silicon rod to be cut;

[0008] Based on the cutting data, the number of cutting edges that will be generated when cutting the silicon rod to be cut is calculated to obtain the first cutting edge value;

[0009] Based on the preset correlation between the number of blades and the return rate of the silicon rod cutting device, the first return rate corresponding to the first blade value is determined;

[0010] The silicon rod to be cut is cut based on the first loop rate.

[0011] Optionally, based on a preset correlation between the number of blades and the return rate of the silicon rod cutting device, the first return rate corresponding to the first blade value is determined, including:

[0012] Determine the preset correlation between the number of blades and the return rate in the current cutting mode; the preset correlation between the number of blades and the return rate is different for different cutting modes.

[0013] Based on the preset correlation between the number of blades and the return rate in the current cutting mode, the first return rate corresponding to the first blade value is determined.

[0014] Optionally, before determining the preset correlation between the number of blades and the return rate in the current cutting mode, the method further includes:

[0015] Receive the user's first input to the target mode control in the current display interface; wherein the current display interface displays multiple mode controls, and each mode control corresponds to a cut-off mode, and the target mode control is one of the multiple mode controls;

[0016] In response to the first input, the cut-off mode corresponding to the target mode control is set to the current cut-off mode.

[0017] Optionally, after cutting the silicon rod to be cut based on the first loop rate, the method further includes:

[0018] Receive the user's second input;

[0019] In response to the second input, the preset correlation between the number of cutting edges and the return rate is adjusted.

[0020] Optionally, the preset correlation between the number of cutting edges and the return rate includes:

[0021] The ratio of the target number of cutting edges to the target wear rate;

[0022] The target wear rate is equal to 1 minus the target hysteresis rate.

[0023] Optionally, the cutting data includes: the number of silicon rods to be cut, and the scribing data for each silicon rod; based on the cutting data, the number of cutting edges that will be generated when cutting the silicon rods to be cut is calculated to obtain a first cutting edge value, including:

[0024] Based on the scribing data and the number of silicon rods to be cut, the number of segments that will be produced by cutting is calculated;

[0025] When the number of silicon rods to be cut is one, the number of segments that will be produced by cutting is determined as the first cutting edge value;

[0026] When the number of silicon rods to be cut is N, the difference between the number of segments that will be produced by cutting and M is determined as the first cutting edge value; where N is an integer greater than 0, and M is equal to the difference between the number of silicon rods to be cut and 1.

[0027] Secondly, embodiments of the present invention also provide a silicon rod cutting device, applied to silicon rod cutting equipment, the device comprising:

[0028] The acquisition module is used to acquire the cutting data of the silicon rod to be cut;

[0029] The first calculation module is used to calculate the number of cutting edges that will be generated when cutting the silicon rod to be cut based on the cutting data, and to obtain the first cutting edge value.

[0030] The second calculation module is used to determine the first return rate corresponding to the first blade value based on the preset correlation between the number of blades and the return rate of the silicon rod cutting device.

[0031] A cutting module is used to cut the silicon rod to be cut based on the first loop rate.

[0032] Optionally, the second computing module includes:

[0033] The mode unit is used to determine the preset correlation between the number of blades and the return rate in the current cutting mode; wherein, the preset correlation between the number of blades and the return rate is different in different cutting modes.

[0034] The calculation unit is used to determine the first return rate corresponding to the first cut value based on a preset correlation between the number of cuts and the return rate in the current cutting mode.

[0035] Thirdly, embodiments of the present invention also provide an electronic device, including a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the silicon rod cutting method as described above.

[0036] Fourthly, embodiments of the present invention also provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the silicon rod cutting method described above.

[0037] In this embodiment of the invention, after acquiring the cutting data of the silicon rod to be cut, the number of cutting edges that will be generated when cutting the silicon rod is calculated, i.e., the first cutting edge value. Then, based on a preset correlation between the number of cutting edges and the return rate of the silicon rod cutting device, the first return rate corresponding to the first cutting edge value is determined as the return rate required for this cutting operation. Finally, the silicon rod to be cut is cut based on the first return rate. This embodiment of the invention no longer uses a fixed return rate to cut silicon rods of different lengths, but flexibly adjusts the return rate used for cutting based on the number of cutting edges that will be generated. This not only reduces the excessively high wire consumption rate when cutting shorter silicon rods, reducing wire waste, but also reduces the excessively high wire breakage rate when cutting longer silicon rods. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 A flowchart illustrating the steps of a silicon rod cutting method provided in an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of cutting a single silicon rod according to an embodiment of the present invention;

[0041] Figure 3 This is a schematic diagram of cutting three silicon rods according to an embodiment of the present invention;

[0042] Figure 4 A flowchart illustrating the practical application of the silicon rod cutting method provided in this embodiment of the invention;

[0043] Figure 5 This is a structural block diagram of a silicon rod cutting device provided in an embodiment of the present invention;

[0044] Figure 6 This is a partial structural block diagram of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0047] In various embodiments of the present invention, it should be understood that the sequence number of each process described below does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0048] See Figure 1This invention provides a method for cutting silicon rods, which is applied to a silicon rod cutting device. The silicon rod cutting device can be a multi-wire cutting machine for processing silicon rods, which will not be described in detail here.

[0049] The method may include:

[0050] Step 101: Obtain the cutting data of the silicon rod to be cut.

[0051] It should be noted that the cutting data includes the data required to cut the silicon ingot to be cut. This cutting data can be obtained by scanning the work order accompanying the silicon ingot. Specifically, after placing the silicon ingot to be cut at the loading position, the cutting data is obtained by scanning the work order. Then, the wafer tray and the main roller in the cutting chamber automatically adjust their position spacing according to the cutting data. Subsequently, the robotic arm picks up the wafer ingot and places it on the wafer tray, which then moves into the cutting chamber.

[0052] Step 102: Calculate the number of cutting edges that will be generated when cutting the silicon rod to be cut based on the cutting data, and obtain the first cutting edge value.

[0053] It should be noted that the cutting edge can be understood as the opening on the silicon rod being cut. For example... Figure 2 As shown, for a silicon rod to be cut, if cutting will result in six segments (segment 1, segment 2, segment 3, segment 4, segment 5, and segment 6), and wafers need to be removed from the end, then five points need to be cut on the silicon rod to be cut, resulting in cutting edges: edge 1, edge 2, edge 3, edge 4, edge 5, and edge 6. The corresponding number of cutting edges is 6. Here, the first cutting edge value is the calculated number of cutting edges that will be generated when cutting the silicon rod to be cut.

[0054] Understandably, before cutting the silicon rod, it's necessary to determine how many segments it will be cut into, the length of each segment, and the cutting positions—that is, the cutting data. Therefore, even before the silicon rod is cut, the number of blades that will be produced during the cutting process can be calculated using the cutting data.

[0055] Step 103: Based on the preset correlation between the number of blades and the return rate of the silicon rod cutting device, determine the first return rate corresponding to the first blade value.

[0056] It should be noted that when cutting the silicon rod, the cutting wire reciprocates to achieve the cutting. One reciprocating motion of the cutting wire constitutes one cycle. Within one cycle, the wire is first released and then returned to complete one reciprocating motion. The return rate is the quotient obtained by dividing the return length by the release length. For example, if the release length in one cycle is 100 meters and the return length is 99.5 meters, then the return rate is 99.5%.

[0057] It is understandable that during the silicon rod cutting process using a silicon rod cutting device, the number of cutting edges and the set wire return rate are directly related. A larger number of cutting edges indicates more severe wear on the cutting wire. To reduce the risk of wire breakage, the wire return rate should be correspondingly smaller. Therefore, based on this, a correlation information can be pre-generated and stored in the silicon rod cutting device as a preset correlation between the number of cutting edges and the wire return rate. Specifically, a correlation information table between the number of cutting edges and the wire return rate can be set. This table records all possible cutting edge numbers during the silicon rod cutting process, and then records a different wire return rate for each different number of cutting edges. For any given number of cutting edges, the corresponding wire return rate is a reasonable value, ensuring that neither excessive wire breakage nor excessive wire wastage occurs during the silicon rod cutting process. For example, if the number of blades is 6, setting the return rate to a value greater than 99% will result in an excessively high breakage rate, while setting the return rate to a value less than 99% will result in an excessively high wire consumption rate. Therefore, in the associated information table, the return rate value corresponding to the number of blades of 6 is 99%.

[0058] Step 104: Cut the silicon rod to be cut based on the first loop rate.

[0059] In this step, the return rate used by the silicon rod cutting equipment for this cutting is set to the first return rate, and then the cutting begins.

[0060] In this embodiment of the invention, after acquiring the cutting data of the silicon rod to be cut, the number of cutting edges that will be generated when cutting the silicon rod is calculated, i.e., the first cutting edge value. Then, based on a preset correlation between the number of cutting edges and the return rate of the silicon rod cutting device, the first return rate corresponding to the first cutting edge value is determined as the return rate required for this cutting operation. Finally, the silicon rod to be cut is cut based on the first return rate. This embodiment of the invention no longer uses a fixed return rate to cut silicon rods of different lengths, but flexibly adjusts the return rate used for cutting based on the number of cutting edges that will be generated. This not only reduces the excessively high wire consumption rate when cutting shorter silicon rods, reducing wire waste, but also reduces the excessively high wire breakage rate when cutting longer silicon rods.

[0061] Optionally, based on a preset correlation between the number of blades and the return rate of the silicon rod cutting equipment, the first return rate corresponding to the first blade value is determined, including:

[0062] Determine the preset correlation between the number of blades and the return rate in the current cutting mode; the preset correlation between the number of blades and the return rate is different for different cutting modes.

[0063] Based on the preset correlation between the number of blades and the return rate in the current cutting mode, the first return rate corresponding to the first blade value is determined.

[0064] It should be noted that the cutting modes of the silicon rod cutting equipment can include: a single-rod cutting mode that cuts only one silicon rod and a multi-rod cutting mode that cuts multiple silicon rods simultaneously. It is understood that even with the same number of cutting edges, the wear on the cutting wires will differ between the two cutting modes. Therefore, it is necessary to set corresponding preset relationships for each cutting mode. Preferably, the multi-rod cutting mode can be further divided into different cutting modes according to the specific number of silicon rods to be cut, and then corresponding preset relationships can be set for each cutting mode.

[0065] Understandably, the current cutting mode can be determined based on the number of silicon rods to be cut. For example, if there is only one silicon rod to be cut, the current cutting mode can be a single-rod cutting mode. If there are multiple silicon rods to be cut, the current cutting mode can be a multiple-rod cutting mode.

[0066] In this embodiment of the invention, the wear differences caused by cutting different numbers of silicon rods on the cutting wire are taken into account. For different cutting modes, different preset correlations between the number of cutting edges and the return rate are set, thereby obtaining a more reasonable first return rate.

[0067] Optionally, before determining the preset correlation between the number of blades and the return rate in the current cutting mode, the method further includes:

[0068] Receive the user's first input on the target mode control in the currently displayed interface; wherein, the currently displayed interface displays multiple mode controls, and each mode control corresponds to a cut-off mode, and the target mode control is one of the multiple mode controls.

[0069] In response to the first input, the cut-off mode corresponding to the target mode control is set to the current cut-off mode.

[0070] It should be noted that the operator of the silicon rod cutting equipment can determine which cutting mode is required for the current cutting operation. For example, after determining that the cutting needs to be performed in the first cutting mode, the operator can input the first input into the mode control corresponding to the first cutting mode, thereby setting the first cutting mode as the current cutting mode. The first input includes, but is not limited to, operations such as clicking, sliding, and long pressing.

[0071] In this embodiment of the invention, the operator can determine which cutting mode is required for the current cutting operation, and then set the corresponding cutting mode as the current cutting mode based on the operator's input. This avoids potential errors in machine judgment.

[0072] Optionally, after cutting the silicon rod to be cut based on the first loop rate, the method further includes:

[0073] Receive the user's second input.

[0074] In response to the second input, adjust the preset correlation between the number of blades and the return rate.

[0075] It should be noted that the second input includes, but is not limited to, operations such as clicking, swiping, and long-pressing. Preferably, a configuration interface can be displayed, showing the preset relationship between the currently configured number of blades and the return rate. Users can input the second information in the configuration interface to freely configure the preset relationship between the number of blades and the return rate according to their needs.

[0076] In this embodiment of the invention, users can freely configure the preset correlation between the number of blades and the return rate according to their own needs, thereby improving the flexibility of silicon rod cutting.

[0077] Optionally, the preset correlation between the number of blades and the return rate includes:

[0078] The ratio of the target number of cutting edges to the target wear rate;

[0079] The target wear rate is equal to 1 minus the target hysteresis rate.

[0080] It should be noted that the target number of cutting edges can be understood as a standard number of cutting edges; the target return rate can be understood as a standard return rate. During the cutting of silicon rods, when the number of cutting edges produced equals the standard number of cutting edges, the standard return rate is the most reasonable return rate value. Setting the return rate to the standard return rate can minimize both wire consumption and breakage rates. Here, the number of cutting edges produced during the cutting process with the largest number of cutting edges within a certain period can be taken as the target number of cutting edges, and the set return rate can be taken as the target return rate.

[0081] Specifically, when calculating the first loop rate using the ratio of the target number of cutting edges to the target wear rate, Formula 1 can be used.

[0082] Formula 1: in, Indicates the first loop rate; X represents the target lap rate; Y represents the first cutting edge value; and Y represents the target number of cutting edges.

[0083] It is understandable that when adjusting the preset correlation between the number of cutting edges and the return rate, the specific values ​​of the target number of cutting edges and the target return rate can be adjusted, as can the relationship between the target number of cutting edges and the target return rate, which will not be elaborated here.

[0084] In this embodiment of the invention, the ratio of the target number of cutting edges to the target wear rate is determined as a preset correlation between the number of cutting edges and the return rate. This allows for the acquisition of a first return rate with a reasonable value, avoiding problems such as excessively high wire breakage rate and excessively high wire consumption rate.

[0085] Optionally, the cutting data includes: the number of silicon rods to be cut, and the scribing data for each silicon rod; based on the cutting data, the number of cutting edges that will be generated when cutting the silicon rods is calculated to obtain a first cutting edge value, including:

[0086] Based on the scribing data and the number of silicon rods to be cut, the number of segments that will be produced by cutting is calculated.

[0087] When there is only one silicon rod to be cut, the number of segments that will be produced by the cut is determined as the first cutting edge value.

[0088] When there are N silicon rods to be cut, the difference between the number of segments to be cut and M is determined as the first cutting edge value; where N is an integer greater than 0, and M is equal to the difference between the number of silicon rods to be cut and 1.

[0089] It should be noted that, such as Figure 2 As shown, when there is only one silicon rod to be cut, the number of segments produced by the cut is equal to the number of cutting edges. Therefore, the number of segments produced by the cut can be defined as the first cutting edge value. When there are multiple silicon rods to be cut, the number of segments produced by the cut and the number of cutting edges have a fixed numerical relationship. Since only one wafer is taken, the first cutting edge value can be calculated based on Formula 2.

[0090] Formula 2: First cutting edge value = Number of segments to be cut - (Number of silicon rods to be cut - 1). For example... Figure 3 As shown, for three silicon rods to be cut, the cutting will result in 11 segments. Using Formula 2, the first cutting edge value is calculated as 11 - (3 - 1) = 9. Of course, when there are multiple silicon rods to be cut, Formula 3 can be used to calculate the first loop rate.

[0091] Formula 3: in, Indicates the first loop rate; C represents the target loop rate; D represents the number of segments that will be generated by cutting; Y represents the number of silicon rods to be cut; and Y represents the target number of cutting edges.

[0092] In this embodiment of the invention, the first cutting edge value can be accurately calculated by the number of segments to be cut and the number of silicon rods to be cut.

[0093] like Figure 4The diagram shown is a flowchart of the actual application of the silicon rod cutting method provided in this embodiment of the invention, including: starting;

[0094] Step 401: Determine if this cut is a single-bar cut. If yes, proceed to step 402; otherwise, proceed to step 403. It's understandable that some silicon rods are short, and cutting only one short rod at a time is too inefficient. To improve efficiency, multiple short silicon rods are placed into the wafer tray and cut simultaneously. Furthermore, even if the same number of effective segments are cut, the wear on the dicing wire differs between cutting only one silicon rod and cutting multiple silicon rods at once. Therefore, it's necessary to distinguish whether it's a single-bar cut.

[0095] Step 402: Scan the work order for the silicon rod to be cut.

[0096] Step 403: Scan the work order for each silicon rod to be cut in sequence.

[0097] Step 404: Determine whether the number of segments generated by this cut meets the standard number of segments. If yes, proceed to step 406; otherwise, proceed to step 405. Here, a standard number of segments and its corresponding standard loop rate are preset.

[0098] Step 405: The actual yield rate of the formula is calculated by converting the actual number of cutting edges to the standard number of cutting edges, and cutting is performed according to the actual yield rate of the formula. Specifically, when cutting a single wire, the number of segments that will be produced in this cut is first calculated. Since the number of segments is equal to the number of cutting edges, the number of cutting edges that will be produced in this cut can be obtained, i.e., the actual number of cutting edges. Based on Formula 1 above, the yield rate of the actual formula can be calculated. In this step, the yield rate of the actual formula is the first yield rate in Formula 1; the actual number of cutting edges in this step is the first cutting edge value in Formula 1; and the standard number of cutting edges in this step is the target number of cutting edges in Formula 1. It can be understood that a higher yield rate indicates less wear on the cutting wire, and the yield rate in Formula 1... The wear rate of the cutting line. To calculate the wear rate corresponding to this cut, we need to consider the ratio of the actual number of cutting blades to the standard number of cutting blades, and finally obtain the return rate corresponding to this cut.

[0099] The process of calculating the return rate when performing multiple cuts is similar to that when performing a single cut. The difference lies in that, when performing multiple cuts, the return rate of the actual formula is calculated using Formula 3. The return rate of the actual formula in this step is the first return rate in Formula 3; the actual number of cutting edges in this step is the result of C-(D-1) in Formula 3; and the standard number of cutting edges in this step is the target number of cutting edges in Formula 3.

[0100] Step 406: Cut according to the standard recipe. The hysteresis rate in the standard recipe is the hysteresis rate for the corresponding standard number of segments.

[0101] Finish.

[0102] In this embodiment of the invention, by flexibly adjusting the return rate for different silicon rod conditions, the excessively high wire consumption rate of short silicon rods can be reduced, and the wire breakage rate of long silicon rods can be decreased.

[0103] like Figure 5 As shown, this embodiment of the invention also provides a silicon rod cutting device, applied to silicon rod cutting equipment, the device comprising:

[0104] The acquisition module 51 is used to acquire the cutting data of the silicon rod to be cut;

[0105] The first calculation module 52 is used to calculate the number of cutting edges that will be generated when cutting the silicon rod to be cut based on the cutting data, and to obtain the first cutting edge value.

[0106] The second calculation module 53 is used to determine the first loop rate corresponding to the first blade value based on the preset correlation between the number of blades and the loop rate of the silicon rod cutting device.

[0107] The cutting module 54 is used to cut the silicon rod to be cut based on the first loop rate.

[0108] Optionally, the second computing module 52 includes:

[0109] The mode unit is used to determine the preset correlation between the number of blades and the return rate in the current cutting mode; wherein, the preset correlation between the number of blades and the return rate is different in different cutting modes.

[0110] The calculation unit is used to determine the first return rate corresponding to the first cut value based on the preset correlation between the number of cuts and the return rate in the current cutting mode.

[0111] Optionally, it also includes:

[0112] The first input module is used to receive the user's first input to the target mode control in the current display interface; wherein, the current display interface displays multiple mode controls, and each mode control corresponds to a cut-off mode, and the target mode control is one of the multiple mode controls;

[0113] The first response module is used to respond to the first input and set the cut-off mode corresponding to the target mode control to the current cut-off mode.

[0114] Optionally, the device further includes:

[0115] The second input module is used to receive a second input from the user.

[0116] The second response module is used to respond to the second input and adjust the preset correlation between the number of blades and the return rate.

[0117] Optionally, the preset correlation between the number of blades and the return rate includes:

[0118] The ratio of the target number of cutting edges to the target wear rate;

[0119] The target wear rate is equal to 1 minus the target hysteresis rate.

[0120] Optionally, the cutting data includes: the number of silicon rods to be cut, and the scribing data for each silicon rod; the first calculation module 52 is specifically used for:

[0121] Based on the scribing data and the number of silicon rods to be cut, the number of segments that will be produced by cutting is calculated.

[0122] When there is only one silicon rod to be cut, the number of segments that will be produced by cutting is determined as the first cutting edge value;

[0123] When there are N silicon rods to be cut, the difference between the number of segments to be cut and M is determined as the first cutting edge value; where N is an integer greater than 0, and M is equal to the difference between the number of silicon rods to be cut and 1.

[0124] In this embodiment of the invention, after acquiring the cutting data of the silicon rod to be cut, the number of cutting edges that will be generated when cutting the silicon rod is calculated, i.e., the first cutting edge value. Then, based on a preset correlation between the number of cutting edges and the return rate of the silicon rod cutting device, the first return rate corresponding to the first cutting edge value is determined as the return rate required for this cutting operation. Finally, the silicon rod to be cut is cut based on the first return rate. This embodiment of the invention no longer uses a fixed return rate to cut silicon rods of different lengths, but flexibly adjusts the return rate used for cutting based on the number of cutting edges that will be generated. This not only reduces the excessively high wire consumption rate when cutting shorter silicon rods, reducing wire waste, but also reduces the excessively high wire breakage rate when cutting longer silicon rods.

[0125] The silicon rod cutting device provided in this application embodiment can achieve Figure 1 and Figure 4 The various processes implemented in the method embodiments achieve the same technical effect, and will not be described again here to avoid repetition.

[0126] On the other hand, embodiments of the present invention also provide an electronic device, including a memory, a processor, a bus, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the steps in the above-described silicon rod cutting method.

[0127] For example, see below. Figure 6A schematic diagram of a partial physical structure of an electronic device is shown.

[0128] like Figure 6 As shown, the electronic device may include a processor 610, a communications interface 620, a memory 630, and a communication bus 640, wherein the processor 610, the communications interface 620, and the memory 630 communicate with each other via the communication bus 640. The processor 610 can call logical instructions in the memory 630 to execute the following methods:

[0129] Obtain the cutting data of the silicon rod to be cut;

[0130] The number of cutting edges that will be generated when cutting the silicon rod to be cut is calculated based on the cutting data, and the first cutting edge value is obtained.

[0131] Based on the preset correlation between the number of blades and the return rate of the silicon rod cutting equipment, the first return rate corresponding to the first blade value is determined;

[0132] The silicon rod to be cut is cut based on the first return rate.

[0133] Furthermore, the logical instructions in the aforementioned memory 630 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0134] Furthermore, embodiments of the present invention also provide a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the silicon rod cutting method provided in the above embodiments, including, for example:

[0135] Obtain the cutting data of the silicon rod to be cut;

[0136] The number of cutting edges that will be generated when cutting the silicon rod to be cut is calculated based on the cutting data, and the first cutting edge value is obtained.

[0137] Based on the preset correlation between the number of blades and the return rate of the silicon rod cutting equipment, the first return rate corresponding to the first blade value is determined;

[0138] The silicon rod to be cut is cut based on the first return rate.

[0139] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0140] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0141] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for cutting a silicon rod, characterized in that, The method, applied to silicon rod cutting equipment, includes: Obtain cutting data for the silicon rods to be cut; the cutting data includes: the number of silicon rods to be cut, and the scribing data for each silicon rod to be cut; Based on the cutting data, the number of cutting edges that will be generated when cutting the silicon rod to be cut is calculated to obtain the first cutting edge value; The step of calculating the number of cutting edges that will be generated when cutting the silicon rod to be cut based on the cutting data to obtain the first cutting edge value includes: calculating the number of segments that will be generated by cutting based on the scribing data and the number of silicon rods to be cut; when the number of silicon rods to be cut is one, determining the number of segments that will be generated by cutting as the first cutting edge value; when the number of silicon rods to be cut is N, determining the difference between the number of segments that will be generated by cutting and M as the first cutting edge value; wherein N is an integer greater than 0, and M is equal to the difference between the number of silicon rods to be cut and 1. Based on the preset correlation between the number of blades and the return rate of the silicon rod cutting device, the first return rate corresponding to the first blade value is determined; The step of determining the first return rate corresponding to the first blade value based on the preset correlation between the number of blades and the return rate of the silicon rod cutting device includes: determining the preset correlation between the number of blades and the return rate in the current cutting mode; wherein the preset correlation between the number of blades and the return rate is different in different cutting modes; and determining the first return rate corresponding to the first blade value based on the preset correlation between the number of blades and the return rate in the current cutting mode. The silicon rod to be cut is cut based on the first loop rate.

2. The method according to claim 1, characterized in that, Before determining the preset correlation between the number of blades and the return rate in the current cutting mode, the method further includes: Receive the user's first input to the target mode control in the current display interface; wherein the current display interface displays multiple mode controls, and each mode control corresponds to a cut-off mode, and the target mode control is one of the multiple mode controls; In response to the first input, the cut-off mode corresponding to the target mode control is set to the current cut-off mode.

3. The method according to claim 1, characterized in that, After cutting the silicon rod to be cut based on the first loop rate, the method further includes: Receive the user's second input; In response to the second input, the preset correlation between the number of cutting edges and the return rate is adjusted.

4. The method according to claim 1 or 3, characterized in that, The preset correlation between the number of cutting edges and the loop rate includes: The ratio of the target number of cutting edges to the target wear rate; The target wear rate is equal to 1 minus the target hysteresis rate.

5. A silicon rod cutting device, characterized in that, Applied to silicon rod cutting equipment, the device includes: The acquisition module is used to acquire cutting data of the silicon rods to be cut; the cutting data includes: the number of silicon rods to be cut, and the scribing data of each silicon rod to be cut; A first calculation module is used to calculate the number of cutting edges that will be generated when cutting the silicon rod to be cut based on the cutting data, and obtain a first cutting edge value; wherein, the step of calculating the number of cutting edges that will be generated when cutting the silicon rod to be cut based on the cutting data and obtaining the first cutting edge value includes: calculating the number of segments that will be generated when cutting based on the scribing data and the number of silicon rods to be cut; when the number of silicon rods to be cut is one, determining the number of segments that will be generated when cutting as the first cutting edge value; when the number of silicon rods to be cut is N, determining the difference between the number of segments that will be generated when cutting and M as the first cutting edge value; wherein N is an integer greater than 0, and M is equal to the difference between the number of silicon rods to be cut and 1; The second calculation module is used to determine the first return rate corresponding to the first blade value based on a preset correlation between the number of blades and the return rate of the silicon rod cutting device; wherein, the second calculation module includes: a mode unit, used to determine a preset correlation between the number of blades and the return rate in the current cutting mode; wherein, the preset correlation between the number of blades and the return rate is different in different cutting modes; and a calculation unit, used to determine the first return rate corresponding to the first blade value based on the preset correlation between the number of blades and the return rate in the current cutting mode. A cutting module is used to cut the silicon rod to be cut based on the first loop rate.

6. An electronic device comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, characterized in that, When the computer program is executed by the processor, it implements the steps of the silicon rod cutting method as described in any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, A computer program is stored on the computer-readable storage medium, which, when executed by a processor, implements the steps of the silicon rod cutting method as described in any one of claims 1 to 4.

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