An adaptive microfluidic heat dissipation semiconductor chip and packaging method thereof

Abstract

The present invention relates to the technical field related to semiconductor chips and their packaging, and discloses an adaptive microfluidic heat dissipation type semiconductor chip and its packaging method, including: a packaging component, a microfluidic heat dissipation chip, the microfluidic heat dissipation chip includes a semiconductor chip, a microfluidic heat dissipation component, the semiconductor chip includes a plurality of pads, terminals, a data input circuit, a data output circuit, an internal welding wire, and an internal circuit, and the microfluidic heat dissipation chip is welded and connected with the corresponding pads and terminals through the internal welding wire; in the adaptive microfluidic heat dissipation type semiconductor chip and its packaging method of the present invention, the combination of the packaging structure and the microfluidic heat dissipation component can realize the adaptive microfluidic heat dissipation function, further improve the actual effect of the limited heat dissipation space and the heat dissipation flow, and greatly improve the actual efficiency of microfluidic heat dissipation.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductors and their packaging, and more specifically, particularly relates to an adaptive microfluidic heat dissipation type semiconductor chip and a packaging method thereof. Background Art

[0002] With the rapid development of social economy, the shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting chips and enhancing electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits.

[0003] The heat dissipation of semiconductor chips and the overall heat dissipation effect after their packaging process determines their operating efficiency and service life after they are put into use. However, the existing technology still has the following defects in semiconductor chips and their packaging process:

[0004] 1. The contact-type heat dissipation structure used in the semiconductor chip in the prior art cannot ensure the heat flow, thus resulting in the problem of heat accumulation;

[0005] 2. The packaging structure of semiconductor chips in the prior art does not have an adaptive heat dissipation function for semiconductor chips, and thus cannot adjust its heat dissipation efficiency according to the actual heating effect of the chip;

[0006] 3. The single function of semiconductor chips and their packaging structures in the prior art leads to heat accumulation and airflow blockage on the surface of the semiconductor chips during actual applications. The heat cannot be effectively dissipated and is limited by the heat dissipation function of the packaging components. As a result, the actual chip operation efficiency is often lower than the calibration, which affects the chip performance.

[0007] Therefore, in view of this, the existing structure and defects are studied and improved, and an adaptive microfluidic heat dissipation semiconductor chip and a packaging method thereof are provided, in order to achieve a more practical purpose. Summary of the invention

[0008] The present invention provides an adaptive microfluidic heat dissipation type semiconductor chip and a packaging method thereof, which are used to overcome the above-mentioned defects in the prior art.

[0009] The purpose and effect of the adaptive microfluidic heat dissipation semiconductor chip and its packaging method of the present invention are achieved by the following specific technical means:

[0010] A self-adaptive microfluidic heat dissipation semiconductor chip and its packaging method, comprising: a packaging component, a microfluidic heat dissipation chip, the microfluidic heat dissipation chip comprising a semiconductor chip, a microfluidic heat dissipation component, the semiconductor chip comprising a plurality of pads, terminals, a data input circuit, a data output circuit, an internal welding wire, and an internal circuit, the microfluidic heat dissipation chip is welded and connected with the corresponding pads and terminals through the internal welding wire, the microfluidic heat dissipation component comprises an array of heat-conducting spacer bars fixedly arranged on the surface of the semiconductor chip, a heat dissipation gap is formed between each of the heat-conducting spacer bars, the left end of each of the heat-conducting spacer bars is welded and connected to a contact heat-conducting sheet, a fixed limiting column is arranged at the right end of the heat-conducting spacer bar, a heat-conducting column is fixedly installed on the top of the fixed limiting column, the packaging component comprises a packaging substrate and a packaging cover plate, a chip embedding groove is arranged in the packaging substrate, the microfluidic heat dissipation chip is embedded and fixedly installed in the chip embedding groove, and a heat-conducting column is fixedly installed on the top of the fixed limiting column. The heat dissipation fan of the package cover is fixedly installed at the lower side of the heat dissipation part, and an adaptive heat dissipation mechanism is fixedly installed at the inner side of the package cover at the lower side of the heat dissipation fan. The adaptive heat dissipation mechanism comprises an adaptive heat dissipation box, and the adaptive heat dissipation box array is provided with an air flow heat dissipation slot connected with the chip embedding slot, a heat dissipation adjustment plate is rotatably installed in the air flow heat dissipation slot, and an adaptive component for regulating the heat dissipation adjustment plate is fixedly installed on the side of the air flow heat dissipation slot, and the heat dissipation flow corresponding to the air flow heat dissipation slot is adjusted by rotating the heat dissipation adjustment plate, and a heat dissipation liquid box is provided in the adaptive heat dissipation box, and the top end of the heat conductive sheet is embedded in the heat dissipation liquid box.

[0011] A further technical solution is that the adaptive component includes an adaptive slide cylinder, which is fixedly installed on the inner wall of the side of the airflow heat dissipation groove. An adaptive adjustment cavity is provided in the adaptive slide cylinder, and an adjustment piston is slidably installed in the adaptive adjustment cavity. The right side cavity of the adjustment piston is filled with heated and expanded gas, and a plug hole is provided at the bottom of the right side cavity of the adjustment piston. The top of the heat-conducting column passes through the corresponding hole on the inner wall of the adaptive heat dissipation box and the plug hole, and the top end of the heat-conducting column is embedded and sealed in the adaptive adjustment cavity.

[0012] A further technical solution is that a transmission base is fixedly installed on the right bottom wall of the adaptive adjustment chamber, and an adjusting shaft is rotatably installed on the transmission base. A spiral rotating part is provided on the outer wall of the adjusting shaft, and a through hole matching the spiral rotating part is provided at the center of the adjusting piston. The adjusting piston is rotatably installed on the adjusting shaft, and a mutually engaging linear limiting structure is provided between the outer wall of the adjusting piston and the inner wall of the adaptive adjustment chamber. The linear limiting structure is a groove arranged on the inner wall of the adaptive adjustment chamber and a protrusion arranged on the outer wall of the adjusting piston, so that the adjusting piston is slidably arranged in the adaptive adjustment chamber and cannot rotate. A transmission shaft is fixedly installed on the end of the adjusting shaft, and a reset spring is arranged between the adjusting piston and the left inner wall of the adaptive adjustment chamber.

[0013] A further technical solution is that a heat dissipation adjustment shaft is rotatably installed in the airflow heat dissipation groove, the heat dissipation adjustment shaft passes through and is fixed to the central through hole of the heat dissipation adjustment plate, a sleeve is provided at the right end of the heat dissipation adjustment shaft, and an engaging tooth block is fixedly installed at the end of the transmission shaft, and the transmission shaft and the corresponding heat dissipation adjustment shaft are fixed by docking and connecting with the engaging tooth block and the sleeve.

[0014] According to a further technical solution, the heat dissipation liquid box is filled with cooling heat-absorbing liquid, a guide motor is installed at the bottom of the heat dissipation liquid box, and an output shaft of the guide motor is rotatably disposed in the heat dissipation liquid box and is equipped with stirring blades.

[0015] According to a further technical solution, the chip embedding groove is symmetrically provided with fixing grooves, and fixed limiting columns are installed in the fixing grooves through threaded docking. Matching fixing notches are provided on both sides of the semiconductor chip, and the matching fixing notches correspond to the positions of the fixing grooves and are fixed by the fixed limiting columns.

[0016] According to a further technical solution, an embedding groove is provided on a side of the packaging cover plate, and the heat conducting sheet is embedded and sealed in the embedding groove. Part of the heat conducting sheet structure is placed on the outside to facilitate heat dissipation.

[0017] According to a further technical solution, the top surface of the semiconductor chip is coated with an insulating film, the top of the insulating film is coated with a coating liquid, the coating liquid forms a coating layer after solidification, and forms a heat dissipation layer directly contacting the semiconductor chip, and the thermally conductive spacer rod is fixedly installed on the outside of the coating layer.

[0018] According to a further technical solution, the coating liquid comprises a liquefied molding mixture for heat dissipation and fine aluminum oxide particles.

[0019] The present invention also includes a packaging method for an adaptive microfluidic heat dissipation semiconductor chip, comprising:

[0020] S1: chip surface treatment, providing an insulating film on the surface of the semiconductor chip, and continuously coating the coating liquid, the coating liquid solidifies to form a coating layer, and forms a heat dissipation layer directly contacting the semiconductor chip;

[0021] S2: Install the microfluidic heat dissipation component by coating the bottom of the heat-conducting spacer with adhesive heat-conducting liquid and pressing and embedding it into the corresponding position of the outer wall of the semiconductor chip;

[0022] S3: embedding and fixing the microfluidic heat dissipation chip, placing the semiconductor chip and the microfluidic heat dissipation component in the chip embedding groove, and ensuring that the bottom pins of the semiconductor chip are in contact with the docking pins in the chip embedding groove. After embedding in the fixing groove, the microfluidic heat dissipation chip is fixed by two sets of fixed limit columns;

[0023] S4: Packaging, snapping the packaging cover plate onto the upper side of the packaging substrate, inserting each thermal conductive column into the corresponding plug hole, and fixing it through screw holes;

[0024] S5: Introduce temperature-variable gas, remove the screw holes and bolt structure on the side of the heat dissipation and ventilation part, remove the ventilation hole membrane, connect the air pump and the conduit with the air injection holes at the bottom of each adaptive adjustment cavity to input temperature-variable gas with a specified air pressure, and then reset each component to complete the packaging.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] In an adaptive microfluidic heat dissipation semiconductor chip and its packaging method of the present invention, the microfluidic heat dissipation component can greatly improve the heat dissipation efficiency of the chip surface. The contact heat dissipation structure used for semiconductor chips in the prior art cannot ensure the heat flow, so there is a heat accumulation problem. In the present invention, the microfluidic heat dissipation component is embedded on the top of the chip, so that microfluidic intervals are formed between each heat-conducting spacer rod on the outside of the semiconductor chip. At the same time, with the packaging, a microfluidic heat dissipation channel for airflow is formed on the top of the semiconductor chip, thereby greatly reducing the heat accumulation problem during the operation of the chip.

[0027] In an adaptive microfluidic heat dissipation type semiconductor chip and its packaging method of the present invention, the overall heat dissipation function of the packaged chip is further optimized by optimizing the setting of the packaging structure. The packaging structure of the semiconductor chip in the prior art does not have the adaptive heat dissipation function to cope with the semiconductor chip, and thus cannot adjust its heat dissipation efficiency according to the actual heating effect of the chip. In the present invention, through a compact and highly integrated packaging structure, an adaptive heat dissipation mechanism and a flow guide structure are installed inside it, so that during the chip operation process, the air flow inside the packaging component can be dispersed outward through the air permeable membrane by starting the heat dissipation fan, so that for the chip, the heat generated on the chip surface generates negative pressure through the rotation of the heat dissipation fan, and cooperates with the microfluidic heat dissipation component to enable the heat and airflow to be output and dissipated outward from the airflow heat dissipation groove in a timely manner, thereby further avoiding the problem of heat accumulation on the chip surface or in the packaging structure, and improving the heat dissipation and operation efficiency of the packaged chip;

[0028] In an adaptive microfluidic heat dissipation semiconductor chip and its packaging method of the present invention, the combination of the packaging structure and the microfluidic heat dissipation component can realize the adaptive microfluidic heat dissipation function. The single function of the semiconductor chip and its packaging structure in the prior art leads to the problem of heat accumulation and airflow blockage on the surface of the semiconductor chip during actual application, which cannot be effectively dissipated and is limited by the heat dissipation processing function of the packaging component, resulting in the actual chip The operating efficiency is often lower than the calibration, thereby affecting the chip performance. In the present invention, the heat-conducting columns on the side of the heat-conducting spacer rods are used to directly conduct the temperature at the corresponding position of each heat-conducting spacer rod, and react in the corresponding adaptive adjustment cavity, so that the heat generation and heat accumulation at different positions on the chip surface are adjusted. Under different circumstances, there will be differences in the heat introduced into the adaptive adjustment cavity by the heat conductive column, which will cause differences in the expansion of the internal temperature-changing gas. When the temperature-changing gas in the adaptive adjustment cavity heats up and expands, it will push the adjustment piston to move, thereby driving the adjustment shaft to rotate, so that the corresponding heat dissipation adjustment plate is driven to deflect through the transmission shaft, thereby increasing the flow rate of the corresponding airflow heat dissipation slot. Under the condition that the overall airflow output remains unchanged, the flow rate of each airflow heat dissipation slot is adaptively adjusted to increase the flow dissipation rate of the high-temperature position on the chip surface, while the relatively low temperature or low heat generation position is in a low-flow heat dissipation state, thereby achieving an adaptive heat dissipation adjustment effect, further improving the actual effect of limited heat dissipation space and heat dissipation flow, and greatly improving the actual efficiency of microfluidic heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the microfluidic heat dissipation chip and its packaging assembly of the present invention;

[0030] Figure 2 It is a schematic diagram of the combined top view structure of the microfluidic heat dissipation chip and its packaging assembly of the present invention;

[0031] Figure 3 It is a schematic structural diagram of the package cover plate in the disassembled state in the present invention;

[0032] Figure 4 It is a schematic diagram of the structure of the packaging cover plate in the present invention that will adapt to the disassembly state of the heat dissipation mechanism;

[0033] Figure 5 It is a schematic diagram of the internal structure of the heat dissipation mechanism in the present invention;

[0034] Figure 6 is a schematic diagram of the internal structure of the adaptive component in the present invention;

[0035] Figure 7 It is a schematic structural diagram of the installation state of the microfluidic heat dissipation chip in the packaging substrate of the present invention;

[0036] Figure 8 It is a schematic diagram of the structure of the packaging substrate in the present invention with the microfluidic heat dissipation chip disassembled;

[0037] Fig. 9 It is a schematic structural diagram of the microfluidic heat dissipation chip in the present invention in a disassembled state;

[0038] Fig.10 It is a schematic diagram of the structure of the microfluidic heat dissipation chip in the present invention when viewed from above.

[0039] Description of reference numerals:

[0040] Packaging substrate 11, packaging cover plate 12, heat dissipation and ventilation part 13, ventilation hole membrane 14, heat conductive sheet 15, heat dissipation fan 16, adaptive heat dissipation mechanism 20, adaptive heat dissipation box 21, heat dissipation liquid box 22, guide motor 23, air flow heat dissipation groove 24, heat dissipation adjustment plate 25, heat dissipation adjustment shaft 26, adaptive component 30, adaptive slide 31, adaptive adjustment cavity 32, adjustment piston 33, plug hole 35, transmission base 36, adjustment shaft 37, spiral rotating part 38, return spring 39, transmission shaft 40, interlocking tooth block 41, fixing groove 46, chip embedding groove 45, microfluidic heat dissipation chip 50, semiconductor chip 51, matching fixing notch 52, thermal conductive spacer rod 53, contact thermal conductive sheet 55, fixed limit column 56, thermal conductive column 57, extension support part 66. DETAILED DESCRIPTION

[0041] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0042] In the description of the present invention, unless otherwise specified, "plurality" means two or more than two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] Example:

[0045] As attached Figure 1 To Attachment Fig.10 As shown:

[0046] The invention provides an adaptive micro-fluidic heat dissipation type semiconductor chip and a packaging method thereof.

[0047] Refer to the attached Figure 1 To Attachment Fig.10, including: a packaging component 10, a microfluidic heat dissipation chip 50, the microfluidic heat dissipation chip 50 includes a semiconductor chip 51, a microfluidic heat dissipation component, the semiconductor chip 51 includes a plurality of pads, terminals, a data input circuit, a data output circuit, an internal welding wire, and an internal circuit, the microfluidic heat dissipation chip 50 is welded and connected with the corresponding pads and terminals through the internal welding wire, the microfluidic heat dissipation component includes an array of heat-conducting spacer bars 53 fixedly arranged on the surface of the semiconductor chip 51, a heat dissipation gap is formed between each heat-conducting spacer bar 53, the left end of each heat-conducting spacer bar 53 is welded and connected to the contact heat-conducting sheet 55, a fixed limiting column 56 is provided at the right end of the heat-conducting spacer bar 53, and a heat-conducting column 57 is fixedly installed on the top of the fixed limiting column 56, the packaging component 10 includes a packaging substrate 11 and a packaging cover plate 12, a chip embedding groove 45 is provided in the packaging substrate 11, the microfluidic heat dissipation chip 50 is embedded and fixedly installed in the chip embedding groove 45, and the chip embedding groove 45 is provided with a heat-conducting column 57 connected to the contact heat-conducting sheet 55 A heat conducting sheet 15 and a packaging cover plate 12 are fixedly mounted on the upper side of the packaging substrate 11 by means of screws and screw hole components to form a packaging box body. A heat dissipation air permeable portion 13 is provided on the top end surface of the packaging cover plate 12. A breathable hole membrane 14 for ventilation and heat dissipation is provided in the center of the heat dissipation air permeable portion 13. A heat dissipation fan 16 is fixedly mounted on the inner side of the packaging cover plate 12 at a position below the heat dissipation air permeable portion 13. An adaptive heat dissipation mechanism 20 is fixedly mounted on the inner side of the packaging cover plate 12 at a position below the heat dissipation air permeable portion 13. The adaptive heat dissipation mechanism 20 includes an adaptive heat dissipation box 21. The adaptive heat dissipation box 21 array is provided with airflow heat dissipation slots 24 connected to the chip embedding slots 45. A heat dissipation adjustment plate 25 is rotatably mounted in the airflow heat dissipation slots 24. An adaptive component 30 for regulating the heat dissipation adjustment plate 25 is fixedly mounted on the side of the airflow heat dissipation slots 24. The heat dissipation flow rate connected to the corresponding airflow heat dissipation slots 24 is adjusted by rotating the heat dissipation adjustment plate 25. A heat dissipation liquid box 22 is provided in the adaptive heat dissipation box 21. The top end of the heat conducting sheet 15 is embedded in the heat dissipation liquid box 22.

[0048] Preferably, the adaptive component 30 includes an adaptive slide 31, which is fixedly mounted on the inner wall of the side of the airflow heat dissipation groove 24. An adaptive adjustment chamber 32 is provided in the adaptive slide 31, and an adjustment piston 33 is slidably installed in the adaptive adjustment chamber 32. The cavity on the right side of the adjustment piston 33 is filled with heated and expanded gas. A plug hole 35 is provided at the bottom of the cavity on the right side of the adjustment piston 33. The top of the heat-conducting column 57 passes through the corresponding holes on the inner wall of the adaptive heat dissipation box 21 and the plug hole 35, and the top end of the heat-conducting column 57 is embedded and sealed in the adaptive adjustment chamber 32.

[0049] Preferably, a transmission base 36 is fixedly installed on the right bottom wall of the adaptive adjustment chamber 32, and an adjustment shaft 37 is rotatably installed on the transmission base 36. A spiral rotating part 38 is provided on the outer wall of the adjustment shaft 37, and a through hole matching the spiral rotating part 38 is provided at the center of the adjustment piston 33. The adjustment piston 33 is rotatably installed on the adjustment shaft 37, and a linear limiting structure that fits mutually is provided between the outer wall of the adjustment piston 33 and the inner wall of the adaptive adjustment chamber 32. The linear limiting structure is a groove arranged on the inner wall of the adaptive adjustment chamber 32 and a protrusion arranged on the outer wall of the adjustment piston 33, so that the adjustment piston 33 is slidably arranged in the adaptive adjustment chamber 32 and cannot rotate. A transmission shaft 40 is fixedly installed on the end of the adjustment shaft 37, and a reset spring 39 is provided between the adjustment piston 33 and the left inner wall of the adaptive adjustment chamber 32.

[0050] Preferably, a heat dissipation adjustment shaft 26 is rotatably installed in the airflow heat dissipation groove 24, the heat dissipation adjustment shaft 26 passes through the central through hole of the fixed heat dissipation adjustment plate 25, a sleeve is provided at the right end of the heat dissipation adjustment shaft 26, and an engaging tooth block 41 is fixedly installed at the end of the transmission shaft 40, and the transmission shaft 40 and the corresponding heat dissipation adjustment shaft 26 are fixed by docking and fixing with the sleeve through the engaging tooth block 41.

[0051] Preferably, the heat dissipation liquid box 22 is filled with cooling heat-absorbing liquid, and a guide motor 23 is installed at the bottom of the heat dissipation liquid box 22. The output shaft of the guide motor 23 is rotatably disposed in the heat dissipation liquid box 22 and is equipped with stirring blades.

[0052] Preferably, the chip embedding groove 45 is symmetrically provided with fixing grooves 46 , and the fixing grooves 46 are internally threadedly connected with fixing limit columns 56 . Matching fixing notches 52 are provided on both sides of the semiconductor chip 51 , and the matching fixing notches 52 correspond to the positions of the fixing grooves 46 and are fixed by the fixing limit columns 56 .

[0053] Preferably, an embedding groove is provided on the side of the packaging cover plate 12, and the heat conducting sheet 15 is embedded and sealed in the embedding groove, and a part of the structure of the heat conducting sheet 15 is placed on the outside to facilitate heat dissipation.

[0054] Preferably, the top surface of the semiconductor chip 51 is coated with an insulating film, and the top of the insulating film is coated with a coating liquid. After the coating liquid is cured, a coating layer is formed, and a heat dissipation layer directly contacting the semiconductor chip is formed. The thermal conductive spacer rod 53 is fixedly installed on the outside of the coating layer.

[0055] Preferably, the coating liquid includes a liquefied molding mixture for heat dissipation and fine aluminum oxide particles.

[0056] The present invention also includes a packaging method for an adaptive microfluidic heat dissipation semiconductor chip, comprising:

[0057] S1: Chip surface treatment, setting an insulating film on the surface of the semiconductor chip 51, and continuously coating the coating liquid, the coating liquid is solidified to form a coating layer, and a heat dissipation layer directly contacting the semiconductor chip is formed;

[0058] S2: Install the microfluidic heat dissipation component by coating the bottom of the heat-conducting spacer rod 53 with adhesive heat-conducting liquid and pressing and embedding it into the corresponding position of the outer wall of the semiconductor chip 51;

[0059] S3: embedding and fixing the microfluidic heat dissipation chip 50, placing the semiconductor chip 51 and the microfluidic heat dissipation assembly in the chip embedding groove 45, and ensuring that the bottom pins of the semiconductor chip 51 are in contact with the docking pins in the chip embedding groove 45, and after embedding in the fixing groove 46, the microfluidic heat dissipation chip 50 is fixed by two sets of fixed limiting columns 56;

[0060] S4: Packaging, the packaging cover plate 12 is buckled and placed on the upper side of the packaging substrate 11, and each heat-conducting column 57 is inserted into the corresponding plug hole 35, and fixed by screw holes;

[0061] S5: Introduce temperature-variable gas, remove the screw holes and bolt structure on the side of the heat dissipation and ventilation part 13, remove the ventilation hole membrane 14, connect the air pump and the conduit with the air injection holes at the bottom of each adaptive adjustment cavity 32 to input temperature-variable gas of specified pressure, and then reset each component to complete the packaging.

[0062] In an adaptive microfluidic heat dissipation semiconductor chip and its packaging method of the present invention, the microfluidic heat dissipation component can greatly improve the heat dissipation efficiency of the chip surface. The contact heat dissipation structure used for semiconductor chips in the prior art cannot ensure the heat flow, so there is a heat accumulation problem. In the present invention, the microfluidic heat dissipation component is embedded on the top of the chip, so that a microfluidic interval is formed between each heat-conducting spacer rod 53 on the outside of the semiconductor chip 51, and at the same time, with the packaging, a microfluidic heat dissipation channel for airflow is formed on the top of the semiconductor chip 51, thereby greatly reducing the heat accumulation problem during the operation of the chip;

[0063] In an adaptive microfluidic heat dissipation type semiconductor chip and its packaging method of the present invention, the overall heat dissipation function of the packaged chip is further optimized by optimizing the setting of the packaging structure. The packaging structure of the semiconductor chip in the prior art does not have the adaptive heat dissipation function to cope with the semiconductor chip, and thus cannot adjust its heat dissipation efficiency according to the actual heating effect of the chip. In the present invention, through a compact and highly integrated packaging structure, an adaptive heat dissipation mechanism 20 and a flow guide structure are installed inside it, so that during the chip operation process, the air flow inside the packaging component 10 can be dispersed outward through the air permeable membrane 14 by starting the heat dissipation fan 16, so that for the chip, the heat generated on the chip surface generates negative pressure through the rotation of the heat dissipation fan 16, and cooperates with the microfluidic heat dissipation component to enable the heat and airflow to be output and dissipated outward from the airflow heat dissipation slot 24 in a timely manner, thereby further avoiding the problem of heat accumulation on the chip surface or in the packaging structure, and improving the heat dissipation and operation efficiency of the packaged chip;

[0064] In an adaptive microfluidic heat dissipation type semiconductor chip and its packaging method of the present invention, the combination of the packaging structure and the microfluidic heat dissipation component can realize the adaptive microfluidic heat dissipation function. The single function of the semiconductor chip and its packaging structure in the prior art leads to the problem of heat accumulation and airflow blockage on the surface of the semiconductor chip during actual application, which cannot be effectively dissipated and is limited by the heat dissipation processing function of the packaging component, resulting in the actual chip The operating efficiency is often lower than the calibration, thereby affecting the chip performance. In the present invention, the heat-conducting column 57 on the side of the heat-conducting spacer rod 53 is used to directly conduct the temperature at the corresponding position of each heat-conducting spacer rod 53, and reacts in the corresponding adaptive adjustment cavity 32, so that the heat generation and heat accumulation conditions at different positions on the chip surface are different. There will be differences in the heat introduced into the adaptive adjustment cavity 32 by the heat conductive column 57, which will cause differences in the expansion of the internal temperature-changing gas. When the temperature-changing gas in the adaptive adjustment cavity 32 heats up and expands, it will push the adjustment piston 33 to move, thereby driving the adjustment shaft 37 to rotate, so that the corresponding heat dissipation adjustment plate 25 is driven to deflect through the transmission shaft 40, thereby increasing the flow rate of the corresponding airflow heat dissipation slot 24. Under the condition that the overall airflow output remains unchanged, the flow rate of each airflow heat dissipation slot 24 is adaptively adjusted, so that the flow dissipation rate of the high-temperature position on the chip surface can be increased, while the relatively low temperature or low heat generation position is in a low flow heat dissipation state, thereby achieving an adaptive heat dissipation adjustment effect, further improving the actual effect of limited heat dissipation space and heat dissipation flow, and greatly improving the actual efficiency of microfluidic heat dissipation.

[0065] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An adaptive microfluidic heat dissipation semiconductor chip, characterized in that: The invention comprises a packaging component and a microfluidic heat dissipation chip, wherein the microfluidic heat dissipation chip comprises a semiconductor chip and a microfluidic heat dissipation component, wherein the semiconductor chip comprises a plurality of pads, terminals, a data input circuit, a data output circuit, an internal welding wire, and an internal circuit, wherein the microfluidic heat dissipation chip is welded and connected with the corresponding pads and terminals through the internal welding wires, wherein the microfluidic heat dissipation component comprises a heat-conducting spacer bar fixedly arranged in an array on the surface of the semiconductor chip, a heat dissipation gap is formed between each of the heat-conducting spacer bars, a left end of each of the heat-conducting spacer bars is welded and connected to a contact heat-conducting sheet, a fixed limiting column is arranged at the right end of the heat-conducting spacer bar, a heat-conducting column is fixedly installed on the top of the fixed limiting column, the packaging component comprises a packaging substrate and a packaging cover plate, a chip embedding groove is arranged in the packaging substrate, the microfluidic heat dissipation chip is embedded and fixedly installed in the chip embedding groove, and a heat-conducting sheet connected to the contact heat-conducting sheet is arranged in the chip embedding groove The heat dissipation fan is fixedly installed on the inner side of the packaging cover plate at a position below the heat dissipation ventilation part; an adaptive heat dissipation mechanism is fixedly installed on the inner side of the packaging cover plate at a position below the heat dissipation ventilation part; the adaptive heat dissipation mechanism includes an adaptive heat dissipation box, the adaptive heat dissipation box array is provided with an airflow heat dissipation slot connected with the chip embedding slot, a heat dissipation adjustment plate is rotatably installed in the airflow heat dissipation slot, an adaptive component for regulating the heat dissipation adjustment plate is fixedly installed on the side of the airflow heat dissipation slot, the heat dissipation adjustment plate is rotated to adjust the heat dissipation flow corresponding to the airflow heat dissipation slot, a heat dissipation liquid box is provided in the adaptive heat dissipation box, and the top end of the heat conductive sheet is embedded in the heat dissipation liquid box.

2. The adaptive microfluidic heat dissipation semiconductor chip according to claim 1, characterized in that: The adaptive component includes an adaptive slide cylinder, which is fixedly installed on the inner wall of the side of the airflow heat dissipation groove. An adaptive adjustment cavity is provided in the adaptive slide cylinder, and an adjustment piston is slidably installed in the adaptive adjustment cavity. The right cavity of the adjustment piston is filled with heated and expanded gas. A plug hole is provided at the bottom of the right cavity of the adjustment piston. The top of the heat-conducting column passes through the corresponding hole on the inner wall of the adaptive heat dissipation box and the plug hole, and the top end of the heat-conducting column is embedded and sealed in the adaptive adjustment cavity.

3. The adaptive microfluidic heat dissipation semiconductor chip according to claim 2, characterized in that: A transmission base is fixedly installed on the right bottom wall of the adaptive adjustment chamber, and an adjusting shaft is rotatably installed on the transmission base. A spiral rotating part is provided on the outer wall of the adjusting shaft, and a through hole matching the spiral rotating part is provided at the center of the adjusting piston. The adjusting piston is rotatably installed on the adjusting shaft, and a mutually embedded linear limiting structure is provided between the outer wall of the adjusting piston and the inner wall of the adaptive adjustment chamber. The linear limiting structure is a groove arranged on the inner wall of the adaptive adjustment chamber and a protrusion arranged on the outer wall of the adjusting piston, so that the adjusting piston is slidably arranged in the adaptive adjustment chamber and cannot rotate. A transmission shaft is fixedly installed on the end of the adjusting shaft, and a reset spring is arranged between the adjusting piston and the left inner wall of the adaptive adjustment chamber.

4. The adaptive microfluidic heat dissipation semiconductor chip according to claim 3, characterized in that: A heat dissipation adjustment shaft is rotatably installed in the airflow heat dissipation groove, and the heat dissipation adjustment shaft passes through and is fixed to the central through hole of the heat dissipation adjustment plate. A sleeve is provided at the right end of the heat dissipation adjustment shaft, and an engaging tooth block is fixedly installed at the end of the transmission shaft. The transmission shaft and the corresponding heat dissipation adjustment shaft are fixed by docking and fixing through the engaging tooth block and the sleeve.

5. The adaptive microfluidic heat dissipation semiconductor chip according to claim 1, characterized in that: The heat dissipation liquid box is filled with cooling heat-absorbing liquid, a guide motor is installed at the bottom of the heat dissipation liquid box, and the guide motor output shaft is rotatably arranged in the heat dissipation liquid box and is installed with stirring blades.

6. The adaptive microfluidic heat dissipation semiconductor chip according to claim 1, characterized in that: The chip embedding groove is symmetrically provided with fixing grooves, and the fixing grooves are threadedly connected with fixing limit columns. Matching fixing notches are provided on both sides of the semiconductor chip, and the matching fixing notches correspond to the positions of the fixing grooves and are fixed by the fixing limit columns.

7. The adaptive microfluidic heat dissipation semiconductor chip according to claim 1, characterized in that: The side of the packaging cover plate is provided with an embedding groove, and the heat conducting sheet is embedded and sealed in the embedding groove. The partial structure of the heat conducting sheet is placed on the outside to facilitate heat dissipation.

8. The adaptive microfluidic heat dissipation semiconductor chip according to claim 1, characterized in that: The top surface of the semiconductor chip is coated with an insulating film, and the top of the insulating film is coated with a coating liquid. The coating liquid forms a coating layer after solidification, and forms a heat dissipation layer directly contacting the semiconductor chip. The thermal conductive spacer rod is fixedly installed outside the coating layer.

9. The adaptive microfluidic heat dissipation semiconductor chip according to claim 8, characterized in that: The coating liquid includes a liquefied molding mixture for heat dissipation and fine aluminum oxide particles.

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