Continuous nickel plating process and device based on impurity removal control

Abstract

The present invention relates to the field of electroplating technology, and in particular to a continuous nickel plating process and device based on impurity removal control. The present invention provides a continuous nickel plating process based on impurity removal control, which is implemented based on a continuous nickel plating production line and includes a pre-plating section, a dark plating section, a semi-bright plating section, and a bright plating section; a solenoid valve and an electric pump are provided between a second electrolytic impurity removal tank and a third electrolytic impurity removal tank, which have the ability to interact with the plating solution, and realize interoperable collaborative impurity removal based on a collaborative impurity removal algorithm; the present invention provides a technical solution for multiple electrolytic impurity removal tanks for a continuous electroplating production line, which has a higher impurity removal capability; provides an impurity removal control method of a fitting function, which has better trend analysis; a technical means for determining the impurity change trend by the positive and negative nature of the derivative, which ensures the stability of the electrolyte and is more conducive to the stability of the electroplating quality; provides a plurality of electrolytic impurity removal tanks that can work independently and collaboratively, which can realize mutually supportive electrolytic impurity removal.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, and in particular to a continuous nickel plating process and device based on impurity removal control. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process of using electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics.

[0003] In a plating tank containing the electroplating solution, the cleaned and specially pretreated workpiece to be plated serves as the cathode, while the anode, made of the metal being plated, is connected to the positive and negative poles of a DC power supply, respectively. The electroplating solution consists of an aqueous solution containing a compound of the plating metal, conductive salts, buffers, pH adjusters, and additives. When electricity is applied, metal ions in the plating solution migrate to the cathode under the influence of the potential difference, forming a coating. Metal ions formed from the anode metal enter the plating solution to maintain the concentration of the plated metal ions. In some cases, such as chromium plating, an insoluble anode made of lead or lead-antimony alloy is used; it serves only to transfer electrons and conduct current. The chromium ion concentration in the electrolyte is maintained by regularly adding chromium compounds to the plating solution. During electroplating, factors such as the quality of the anode material, the composition of the plating solution, temperature, current density, duration of the electroplating, agitation intensity, precipitated impurities, and power waveform all affect the quality of the coating and require appropriate control.

[0004] During the pre-nickel plating production process, after long-term use of the plating solution in the nickel electroplating process, trace amounts of metal elements such as iron will dissolve into the plating solution. The increase in impurities will affect the quality of electroplating. Therefore, the plating solution needs to be regularly extracted for electrolytic de-impurity treatment to ensure that the trace element content in the plating solution does not affect the electroplating quality and efficiency.

[0005] Electrolysis is an effective method for removing metallic impurities from electroplating solutions. This method is simple to operate and applicable to a wide range of electroplating solutions. Its primary purpose is to purify the plating solution by precipitating metallic impurity ions at the cathode under a specific current density and appropriate conditions. Some organic impurities in the electrolyte can also be destroyed by electrolysis, followed by removal through adsorption with activated carbon. This is typically performed during periods of downtime or during production breaks. To maintain uninterrupted operation in the context of accelerated production, a small electrolysis unit can be installed within the plating tank, allowing for continuous electrolytic purification of the plating solution.

[0006] Electrolytic impurity removal involves separating a small section of the plating tank to serve as an electrolytic cell. The cell is equipped with an anode and a corrugated plate cathode. The plating solution is pumped from the bottom outlet of the plating tank into the bottom of the electrolytic cell via a circulating filter pump. The plating solution then flows upward through the electrolytic cell, returns to the plating tank through the overflow port on the upper part of the isolation baffle, and enters the pump at the other end of the plating tank through the bottom outlet. This continuous cycle allows electroplating operations and electrolytic purification of the plating solution to proceed simultaneously.

[0007] How to reduce the impact of trace impurity elements on electroplating quality is an important research direction. Related technologies are disclosed in the prior art:

[0008] A Chinese patent with authorization announcement number CN103668323B discloses a method for treating copper-nickel materials using an electrolysis-staged electrowinning method. Specifically, the method includes: first, removing impurities from the copper-nickel materials by pyrometallurgical melting and casting them into a copper-nickel complex anode plate; then, using the copper-nickel complex anode plate as the anode and stainless steel as the cathode, electrolysis is performed using a copper sulfate-sulfuric acid-hydrochloric acid system as the electrolyte until the copper ion concentration drops to 15-25 g / L, followed by two-stage electrowinning, at which point copper is obtained at the cathode; then, after removing impurities from the electrolyte solution with the copper ion concentration reduced to below 1 g / L, nickel is electrowinning performed, using graphite as the anode and stainless steel as the cathode. After the cathode cycle is completed, nickel is obtained at the cathode. This method fully utilizes the potential difference between copper and nickel during the electrolytic refining process, recovering copper by graded electrolysis and nickel by electrowinning the copper-nickel complex anode, thereby obtaining high-purity cathode copper and cathode nickel. The process is simple and has good prospects for industrial application.

[0009] Chinese patent publication number CN116583629A discloses an impurity removal device in an electrolyte; specifically, it is disclosed that: the device includes a purification tank located upstream of the cell for accommodating a bath; and at least one row, preferably at least two rows of alternating vertically oriented cathodes and anodes, which are configured to be operably connected to a power source for providing current to the anodes and cathodes. The dimensions of the vertically oriented cathode and anode rows are configured to be inserted into the tank. The purifier assembly is configured to maintain an anode-cathode distance (ACD) between the cathode and anode. The purifier is particularly suitable for removing sulfur, phosphorus, iron and / or gallium from cryolite for eco-friendly production of aluminum using a battery using an oxygen-evolving anode or an inert anode.

[0010] A Chinese patent with authorization announcement number CN103572331B discloses a method for manufacturing a fence-type titanium-based PbO2 anode for non-ferrous metal electrowinning; specifically, the method discloses that: the anode includes a titanium-clad copper conductive bus (1) and a group of vertical titanium rods (2) connected to the bottom of the titanium-clad copper conductive bus, each titanium rod being composed of a titanium substrate, a pretreatment layer, an α-PbO2 composite intermediate layer and a β-PbO2 composite activation surface layer from the inside to the outside; first, the titanium substrate is connected to the bottom of the titanium-clad copper conductive bus to form a fence structure, and then the titanium substrate part of the fence structure is degreased, sandblasted, oxide film removed, activated, and then alkaline electroplated with an α-PbO2 composite layer and acid electroplated with a β-PbO2 composite layer to obtain a fence-type titanium-based PbO2 anode plate for non-ferrous metal electrowinning. The novel anode prepared by the method of the present invention has excellent mechanical and corrosion resistance, and can greatly reduce the voltage of the electrolytic cell and reduce energy consumption in electrometallurgical processes such as wet zinc electrowinning, copper electrowinning, nickel electrowinning, and manganese electrowinning.

[0011] Chinese patent publication number CN2871562Y discloses an assembled continuous electrolytic purification device for electroplating production. Specifically, it comprises an electrolytic purification DC power supply, a simulated cathode and an anode connected to the electrolytic purification DC power supply via wires, and a device located within a plating solution storage tank. The simulated cathode is a 0.3mm to 1.0mm thick metal sheet, 800mm to 1200mm long and 800mm to 1000mm wide, corrugated at 100-150 degree angles at intervals of 100-150mm. The anode is made of a metal material consistent with the metal ions in the main salt of the plating solution and is enclosed in a double-layer polypropylene cloth anode bag. The DC power supply is 30-100A / 0-12V. Based on analysis and comparison of harmful metal impurities in the plating solution, the corresponding electrolytic purification process parameters are selected and adjusted promptly. Anode material is replenished regularly, and the anode bag and simulated cathode are replaced regularly to ensure that electroplating production and impurity removal do not interfere with each other, thereby improving electroplating quality and production efficiency.

[0012] However, the above prior art still has the following problems:

[0013] 1. Most of the electrolytic impurity removal tanks in the prior art are single tank settings, which have insufficient impurity removal capabilities for different work sections.

[0014] 2. Most of the electrolytic de-doping tanks in the prior art try to increase the current to reduce the impurity content. However, the fluctuation of the impurity content may cause the change of the electroplating effect, and the stability is poor.

[0015] 3. The prior art does not disclose a technical means by which multiple electrolytic decontamination tanks can work independently or in a coordinated and interconnected manner. Summary of the Invention

[0016] To achieve the purpose of the present invention, the present invention is implemented through the following technical solutions:

[0017] A continuous nickel plating process based on impurity removal control, the continuous nickel plating process is implemented based on a continuous nickel plating production line; the continuous nickel plating production line includes a pre-plating section, a dark plating section, a semi-bright plating section, and a bright plating section; the pre-plating section, the dark plating section, the semi-bright plating section, and the bright plating section are respectively provided with a first electrolytic impurity removal tank, a second electrolytic impurity removal tank, a third electrolytic impurity removal tank, and a fourth electrolytic impurity removal tank; the first electrolytic impurity removal tank, the second electrolytic impurity removal tank, the third electrolytic impurity removal tank, and the fourth electrolytic impurity removal tank are respectively provided with a sampling port, the sampling port being connected to a component analyzer for detecting the ion concentration in the electroplating solution; an electromagnetic valve and an electric pump are provided between the second electrolytic impurity removal tank and the third electrolytic impurity removal tank, and the electroplating solution has the ability to interact; the second electrolytic impurity removal tank and the third electrolytic impurity removal tank achieve interoperable collaborative impurity removal based on a collaborative impurity removal algorithm; the collaborative impurity removal algorithm includes:

[0018] S1. Determine the type of impurities: Determine the type of impurity ions by analyzing the composition of the waste electrolyte;

[0019] S2. Impurity concentration sampling: At a preset time interval Δt, the concentrations of impurity ions in the second electrolytic decontamination tank and the third electrolytic decontamination tank are detected, respectively, to obtain a second tank impurity concentration data set {(p2(nΔt), nΔt)} and a third tank impurity concentration data set {(p3(nΔt), nΔt)}; wherein n is the sampling sequence number, which is a natural number; p2(nΔt) and p3(nΔt) represent the second tank impurity concentration and the third tank impurity concentration, respectively, at the nth sampling time;

[0020] S3. Fitting to obtain an impurity concentration function; fitting the second tank impurity concentration data set {(p2(nΔt), nΔt)} and the third tank impurity concentration data set {(p3(nΔt), nΔt)} respectively to obtain the time-dependent second tank impurity concentration function f2(t) and the third tank impurity concentration function f3(t);

[0021] S4. Derivative the impurity concentration curve; derivate the second tank impurity concentration function f2(t) and the third tank impurity concentration function f3(t) with respect to time to obtain the second tank impurity concentration trend function f'2(t) and the third tank impurity concentration trend function f'3(t);

[0022] S5, continuous control of electrolytic dedoping; according to the positive and negative of the second tank impurity concentration trend function f'2(t) and the third tank impurity concentration trend function f'3(t), determine whether the impurity concentration is stable. If it is unstable, adjust the current density of electrolytic dedoping.

[0023] Furthermore, step S5 specifically includes:

[0024] S51, determine the positivity of the second tank impurity concentration trend function f'2(t) and the third tank impurity concentration trend function f'3(t) at any time, if they satisfy:

[0025] T1: f'2(t) < 0 or f'2(t) > 0, and the duration exceeds the preset time threshold T0, then it is determined that the impurity concentration in the second tank is unstable;

[0026] T1: f'3(t) < 0 or f'3(t) > 0, and the duration exceeds the preset time threshold T0, then it is determined that the impurity concentration in the third tank is unstable;

[0027] S52. If the impurity concentration is unstable, adjust the current density of the corresponding electrolytic impurity removal tank:

[0028] If f'2(t)<0 or f'3(t)<0, reduce the current density of the corresponding electrolytic desulfurization tank:

[0029] If f'2(t)>0 or f'3(t)>0, the current density of the corresponding electrolytic dedoping tank is increased.

[0030] Furthermore, step S5 further includes:

[0031] S53. If the current density of any electrolytic decontamination tank has increased to the maximum allowable value and f'2(t)>0 or f'3(t)>0 is still present, the solenoid valve and the electric pump between the second electrolytic decontamination tank and the third electrolytic decontamination tank are opened to perform coordinated decontamination of the electroplating solution.

[0032] A continuous nickel plating device based on impurity removal control, the continuous nickel plating device based on impurity removal control is a continuous nickel plating production line, including a pre-plating section, a dark plating section, a semi-bright plating section, and a bright plating section; the pre-plating section, the dark plating section, the semi-bright plating section, and the bright plating section are respectively provided with a first electrolytic impurity removal tank, a second electrolytic impurity removal tank, a third electrolytic impurity removal tank, and a fourth electrolytic impurity removal tank; the first electrolytic impurity removal tank, the second electrolytic impurity removal tank, the third electrolytic impurity removal tank, and the fourth electrolytic impurity removal tank are respectively provided with sampling ports, and the sampling ports are connected to a component analyzer for detecting the ion concentration in the plating solution; an electromagnetic valve and an electric pump are provided between the second electrolytic impurity removal tank and the third electrolytic impurity removal tank, and the plating solution has the ability to interact; the continuous nickel plating device based on impurity removal control is used to perform the continuous nickel plating process based on impurity removal control.

[0033] Furthermore, the pre-plating section, dark plating section, semi-bright plating section, and bright plating section are respectively provided with a first leakage receiving slot, a second leakage receiving slot, a third leakage receiving slot, and a fourth leakage receiving slot.

[0034] Furthermore, the pre-plating section, dark plating section, semi-bright plating section, and bright plating section are respectively provided with a first water washing tank, a second water washing tank, a third water washing tank, and a fourth water washing tank.

[0035] Furthermore, the volume of the first water washing tank, the second water washing tank, the third water washing tank and the fourth water washing tank are all 10m 3 .

[0036] Furthermore, the dimensions of the first electrolytic decontamination tank, the second electrolytic decontamination tank, the third electrolytic decontamination tank and the fourth electrolytic decontamination tank are 6000mm×2000mm×1500mm, and the effective liquid capacity is 15m3 when working online. 2 Built-in stainless steel corrugated plate as electrolytic cathode, titanium-coated iridium oxide as anode, single tank anode area 5m 2 The area ratio of cathode to anode is 1:1, and the cathode and anode are separated by a fence in the tank.

[0037] A continuous nickel plating process control module based on impurity removal control comprises a controller and a memory, wherein the memory stores a compilable program for executing the continuous nickel plating process based on impurity removal control.

[0038] The beneficial effects of the present invention are:

[0039] 1. The present invention provides a technical solution for multiple electrolytic impurity removal tanks for continuous electroplating production lines, which has higher impurity removal capacity than a single impurity removal tank.

[0040] 2. The present invention provides an impurity removal control method based on a fitting function, which has better trend analysis than the prior art technical means of separately measuring impurity concentration.

[0041] 3. The present invention provides a technical means for determining the impurity change trend by the positive or negative nature of the derivative, thereby ensuring the stability of the electrolyte. Compared with simply reducing the concentration of impurity ions, maintaining the impurity ions in a stable state at a low level is more conducive to the stability of electroplating quality.

[0042] 4. The present invention provides multiple electrolytic decontamination tanks that can work independently or collaboratively, which can achieve electrolytic decontamination that helps each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 Schematic diagram of the method of the present invention.

[0044] Figure 2 The figure is a schematic diagram of the working section structure of the continuous nickel plating production line of the present invention. DETAILED DESCRIPTION

[0045] In order to deepen the understanding of the present invention, the present invention will be further described in detail below with reference to the examples. The examples are only used to explain the present invention and do not constitute a limitation on the scope of protection of the present invention. Specific embodiment 1

[0047] according to Figure 1 As shown, this embodiment provides a continuous nickel plating process based on impurity removal control, and the continuous nickel plating process is implemented based on a continuous nickel plating production line; the continuous nickel plating production line includes a pre-plating section, a dark plating section, a semi-bright plating section, and a bright plating section; the pre-plating section, the dark plating section, the semi-bright plating section, and the bright plating section are respectively provided with a first electrolytic impurity removal tank, a second electrolytic impurity removal tank, a third electrolytic impurity removal tank, and a fourth electrolytic impurity removal tank; the first electrolytic impurity removal tank, the second electrolytic impurity removal tank, the third electrolytic impurity removal tank, and the fourth electrolytic impurity removal tank are respectively provided with a sampling port, and the sampling port is connected to a component analyzer for detecting the ion concentration in the plating solution; an electromagnetic valve and an electric pump are provided between the second electrolytic impurity removal tank and the third electrolytic impurity removal tank, and the plating solution has the ability to interact; the second electrolytic impurity removal tank and the third electrolytic impurity removal tank realize interoperable collaborative impurity removal based on a collaborative impurity removal method; the collaborative impurity removal algorithm includes:

[0048] S1. Determine the type of impurities: Determine the type of impurity ions by analyzing the composition of the waste electrolyte;

[0049] S2. Impurity concentration sampling: At a preset time interval Δt, the concentrations of impurity ions in the second electrolytic decontamination tank and the third electrolytic decontamination tank are detected, respectively, to obtain a second tank impurity concentration data set {(p2(nΔt), nΔt)} and a third tank impurity concentration data set {(p3(nΔt), nΔt)}; wherein n is the sampling sequence number, which is a natural number; p2(nΔt) and p3(nΔt) represent the second tank impurity concentration and the third tank impurity concentration, respectively, at the nth sampling time;

[0050] S3. Fitting to obtain an impurity concentration function; fitting the second tank impurity concentration data set {(p2(nΔt), nΔt)} and the third tank impurity concentration data set {(p3(nΔt), nΔt)} respectively to obtain the time-dependent second tank impurity concentration function f2(t) and the third tank impurity concentration function f3(t);

[0051] S4. Derivative the impurity concentration curve; derivate the second tank impurity concentration function f2(t) and the third tank impurity concentration function f3(t) with respect to time to obtain the second tank impurity concentration trend function f'2(t) and the third tank impurity concentration trend function f'3(t);

[0052] S5, continuous control of electrolytic dedoping; according to the positive and negative of the second tank impurity concentration trend function f'2(t) and the third tank impurity concentration trend function f'3(t), determine whether the impurity concentration is stable. If it is unstable, adjust the current density of electrolytic dedoping.

[0053] Furthermore, step S5 specifically includes:

[0054] S51, determine the positivity of the second tank impurity concentration trend function f'2(t) and the third tank impurity concentration trend function f'3(t) at any time, if they satisfy:

[0055] T1: f'2(t) < 0 or f'2(t) > 0, and the duration exceeds the preset time threshold T0, then it is determined that the impurity concentration in the second tank is unstable;

[0056] T1: f'3(t) < 0 or f'3(t) > 0, and the duration exceeds the preset time threshold T0, then it is determined that the impurity concentration in the third tank is unstable;

[0057] S52. If the impurity concentration is unstable, adjust the current density of the corresponding electrolytic impurity removal tank:

[0058] If f'2(t)<0 or f'3(t)<0, reduce the current density of the corresponding electrolytic desulfurization tank:

[0059] If f'2(t)>0 or f'3(t)>0, the current density of the corresponding electrolytic dedoping tank is increased.

[0060] Furthermore, step S5 further includes:

[0061] S53. If the current density of any electrolytic decontamination tank has increased to the maximum allowable value and f'2(t)>0 or f'3(t)>0 is still present, the solenoid valve and the electric pump between the second electrolytic decontamination tank and the third electrolytic decontamination tank are opened to perform coordinated decontamination of the electroplating solution. Specific embodiment 2

[0063] according to Figure 2As shown, the present invention also provides a continuous nickel plating device based on impurity removal control, and the continuous nickel plating device based on impurity removal control is a continuous nickel plating production line, including a pre-plating section, a dark plating section, a semi-bright plating section, and a bright plating section; the pre-plating section, the dark plating section, the semi-bright plating section, and the bright plating section are respectively provided with a first electrolytic impurity removal tank, a second electrolytic impurity removal tank, a third electrolytic impurity removal tank, and a fourth electrolytic impurity removal tank; the first electrolytic impurity removal tank, the second electrolytic impurity removal tank, the third electrolytic impurity removal tank, and the fourth electrolytic impurity removal tank are respectively provided with sampling ports, and the sampling ports are connected to a component analyzer for detecting the ion concentration in the plating solution; an electromagnetic valve and an electric pump are provided between the second electrolytic impurity removal tank and the third electrolytic impurity removal tank, which have the ability to interact with the plating solution; the continuous nickel plating device based on impurity removal control is used to perform the continuous nickel plating process based on impurity removal control.

[0064] Furthermore, the pre-plating section, dark plating section, semi-bright plating section, and bright plating section are respectively provided with a first leakage receiving slot, a second leakage receiving slot, a third leakage receiving slot, and a fourth leakage receiving slot.

[0065] Furthermore, the pre-plating section, dark plating section, semi-bright plating section, and bright plating section are respectively provided with a first water washing tank, a second water washing tank, a third water washing tank, and a fourth water washing tank.

[0066] Furthermore, the volume of the first water washing tank, the second water washing tank, the third water washing tank and the fourth water washing tank are all 10m 3 .

[0067] Furthermore, the dimensions of the first electrolytic decontamination tank, the second electrolytic decontamination tank, the third electrolytic decontamination tank and the fourth electrolytic decontamination tank are 6000mm×2000mm×1500mm, and the effective liquid capacity is 15m3 when working online. 2 Built-in stainless steel corrugated plate as electrolytic cathode, titanium-coated iridium oxide as anode, single tank anode area 5m 2 The area ratio of cathode to anode is 1:1, and the cathode and anode are separated by a fence in the tank. Specific embodiment three

[0069] The present invention also provides a continuous nickel plating process control module based on impurity removal control, the control module includes a controller and a memory, and the memory stores a compilable program for executing the continuous nickel plating process based on impurity removal control.

[0070] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A continuous nickel plating process based on impurity removal control includes a pre-plating section, a dark plating section, a semi-bright plating section, and a bright plating section. Each section is provided with a first electrolytic impurity removal tank, a second electrolytic impurity removal tank, a third electrolytic impurity removal tank, and a fourth electrolytic impurity removal tank; It is characterized by: The second electrolytic impurity removal tank and the third electrolytic impurity removal tank realize interoperable collaborative impurity removal based on a collaborative impurity removal algorithm; The collaborative impurity removal algorithm includes: S1. Determine the type of impurities: Determine the type of impurity ions by analyzing the composition of the waste electrolyte; S2, impurity concentration sampling; at preset time intervals , respectively detect the concentration of impurity ions in the second electrolytic dedoping tank and the third electrolytic dedoping tank, and obtain the impurity concentration data set of the second tank And the third tank impurity concentration data set ;in, is the sampling sequence number, which is a natural number; and Respectively expressed in The impurity concentration of the second tank and the impurity concentration of the third tank during the second sampling; S3, fitting to obtain the impurity concentration function; respectively, the impurity concentration data set of the second tank and the third tank impurity concentration data set Fitting is performed to obtain the time-dependent second tank impurity concentration function and the third tank impurity concentration function ; S4. Derivative of the impurity concentration curve; Derivative of the impurity concentration function of the second tank and the third tank impurity concentration function Taking the time as the derivative, we get the impurity concentration trend function of the second tank and the third tank impurity concentration trend function ; S5, continuous control of electrolytic de-doping; according to the impurity concentration trend function of the second tank and the third tank impurity concentration trend function The positive and negative of the impurity concentration is used to determine whether it is stable. If it is unstable, the current density of the electrolytic de-impurity is adjusted; specifically, the following are included: S51, determine the impurity concentration trend function of the second tank at any time and the third tank impurity concentration trend function The positivity of , if it satisfies: T1: or , and the duration exceeds the preset time threshold , it is determined that the impurity concentration in the second tank is unstable; T1: or , and the duration exceeds the preset time threshold , it is determined that the impurity concentration in the third tank is unstable; S52. If the impurity concentration is unstable, adjust the current density of the corresponding electrolytic impurity removal tank: like or , then reduce the current density of the corresponding electrolytic decontamination tank: like or , then increase the current density of the corresponding electrolytic decontamination tank; S53, if the current density of any electrolytic impurity removal tank has increased to the maximum allowable value, there is still or If the second electrolytic impurity removal tank is too large, the electromagnetic valve and the electric pump between the second electrolytic impurity removal tank and the third electrolytic impurity removal tank are opened to perform coordinated impurity removal of the electroplating solution.

2. The continuous nickel plating process based on impurity removal control according to claim 1, characterized in that: The pre-plating section, dark plating section, semi-bright plating section and bright plating section are respectively provided with a first leakage receiving slot, a second leakage receiving slot, a third leakage receiving slot and a fourth leakage receiving slot.

3. A continuous nickel plating device based on impurity removal control, for implementing the continuous nickel plating process based on impurity removal control according to claim 1, wherein the continuous nickel plating device based on impurity removal control is a continuous nickel plating production line, comprising a pre-plating section, a dark plating section, a semi-bright plating section, and a bright plating section; each section is respectively provided with a first electrolytic impurity removal tank, a second electrolytic impurity removal tank, a third electrolytic impurity removal tank, and a fourth electrolytic impurity removal tank; The first electrolytic de-doping tank, the second electrolytic de-doping tank, the third electrolytic de-doping tank and the fourth electrolytic de-doping tank are respectively provided with sampling ports, and the sampling ports are connected to a component analyzer for detecting the ion concentration in the electroplating solution; An electromagnetic valve and an electric pump are provided between the second electrolytic decontamination tank and the third electrolytic decontamination tank, and the electroplating solution has the capability of interacting.

4. The continuous nickel plating device based on impurity removal control according to claim 3, characterized in that: The pre-plating section, dark plating section, semi-bright plating section and bright plating section are respectively provided with a first water washing tank, a second water washing tank, a third water washing tank and a fourth water washing tank.

5. The continuous nickel plating device based on impurity removal control according to claim 4, characterized in that: The volumes of the first water washing tank, the second water washing tank, the third water washing tank and the fourth water washing tank are all .

6. The continuous nickel plating device based on impurity removal control according to claim 5, characterized in that: The dimensions of the first electrolytic decontamination tank, the second electrolytic decontamination tank, the third electrolytic decontamination tank and the fourth electrolytic decontamination tank are 6000mm×2000mm×1500mm, and the effective liquid capacity is 15m3 when working online. 2 Built-in stainless steel corrugated plate as electrolytic cathode, titanium-coated iridium oxide as anode, single tank anode area 5m 2 The area ratio of cathode to anode is 1:1, and the cathode and anode are separated by a fence in the tank.

7. A control module for a continuous nickel plating process based on impurity removal control, the control module comprising a controller and a memory, wherein the memory stores a compilable program for executing the continuous nickel plating process based on impurity removal control according to claim 1.

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