Product surface copper plating quality detection method and detection device

Abstract

The present application discloses a method and device for detecting the quality of copper plating on a product surface, and relates to the technical field of plating detection. The method comprises: obtaining a copper plating on a product surface, and the copper plating on the product surface has a ternary copper plating quality constraint with a corresponding mark; performing an appearance quality detection on the copper plating on the product surface based on a copper plating appearance quality detector to obtain a copper plating appearance quality coefficient; performing a dimensional quality evaluation on the copper plating on the product surface to obtain a copper plating dimensional quality coefficient; performing a copper plating density evaluation on the copper plating on the product surface to obtain a copper plating density quality coefficient; constructing a copper plating quality comprehensive detection function; calculating and obtaining a comprehensive copper plating quality index; judging whether the comprehensive copper plating quality index is less than a preset copper plating quality index; and obtaining a copper plating quality warning signal if the comprehensive copper plating quality index is less than a preset copper plating quality index. Thus, the technical effects of high detection efficiency, online detection, and timely warning of copper plating defects are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of coating detection, and in particular to a method and a device for detecting the quality of copper plating on a product surface. Technical Background

[0002] Electroplating copper refers to a treatment method that forms a dense copper layer on the workpiece through the electrolytic copper plating process, thereby improving the corrosion resistance of the product or improving the appearance of the product. Quality inspection of the surface quality and dimensional quality of the coating is an important quality control step in production. When facing assembly line production, the existing inspection technology has the technical problems of low inspection efficiency, poor online inspection capability, and inability to detect copper plating defects in a timely manner. Summary of the invention

[0003] The purpose of this application is to provide a method and device for detecting the quality of copper plating on a product surface, so as to solve the technical problems of low detection efficiency, poor online detection capability, and inability to detect copper plating defects in a timely manner in the prior art.

[0004] In view of the above technical problems, the present application provides a method and a device for detecting the quality of copper plating on a product surface.

[0005] In a first aspect, the present application provides a method for detecting the quality of copper plating on a product surface, wherein the method comprises:

[0006] A copper plating layer on the surface of a product is obtained, and the copper plating layer on the surface of the product has a ternary copper plating quality constraint with a corresponding mark, and the ternary copper plating quality constraint includes a copper plating appearance quality constraint, a copper plating size quality constraint and a copper plating bonding force constraint; based on a pre-constructed copper plating appearance quality detector, an appearance quality detection is performed on the copper plating layer on the surface of the product according to the copper plating appearance quality constraint to obtain a copper plating appearance quality coefficient; based on the copper plating size quality constraint, a size quality compliance analysis function is used to evaluate the size quality of the copper plating layer on the surface of the product to obtain a copper plating size quality coefficient; based on the copper plating bonding force constraint, a copper plating density is evaluated on the copper plating layer on the surface of the product to obtain a copper plating density quality coefficient; a copper plating quality comprehensive detection function is constructed; based on the copper plating quality comprehensive detection function, the copper plating appearance quality coefficient, the copper plating size quality coefficient and the copper plating density quality coefficient are calculated to obtain a comprehensive copper plating quality index; it is determined whether the comprehensive copper plating quality index is less than a preset copper plating quality index; if the comprehensive copper plating quality index is less than the preset copper plating quality index, a copper plating quality warning signal is obtained.

[0007] In a second aspect, the present application also provides a product surface copper plating quality detection device, wherein the detection device comprises:

[0008] A coating acquisition module, the coating acquisition module is used to obtain the copper coating on the surface of the product, and the copper coating on the surface of the product has a correspondingly identified ternary copper coating quality constraint, and the ternary copper coating quality constraint includes a copper coating appearance quality constraint, a copper coating size quality constraint and a copper coating bonding force constraint; an appearance monitoring module, the appearance detection module is used to perform an appearance quality detection on the copper coating on the surface of the product according to the copper coating appearance quality constraint based on a pre-built copper coating appearance quality detector, and obtain a copper coating appearance quality coefficient; a size quality evaluation module, the size quality evaluation module is used to perform a size quality evaluation on the copper coating on the surface of the product according to a size quality compliance analysis function based on the copper coating size quality constraint, and obtain a copper coating size quality coefficient; a density evaluation module, the The density evaluation module is used to evaluate the copper plating density of the copper plating layer on the surface of the product based on the copper plating bonding force constraint to obtain the copper plating density quality coefficient; the detection construction module is used to construct a comprehensive detection function for copper plating quality; the comprehensive detection module is used to calculate the copper plating appearance quality coefficient, the copper plating size quality coefficient and the copper plating density quality coefficient based on the copper plating quality comprehensive detection function to obtain a comprehensive copper plating quality index; the quality evaluation module is used to determine whether the comprehensive copper plating quality index is less than a preset copper plating quality index; the early warning module is used to obtain a copper plating quality early warning signal if the comprehensive copper plating quality index is less than the preset copper plating quality index.

[0009] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0010] By obtaining the copper plating on the surface of the product, and the copper plating on the surface of the product has a three-element copper plating quality constraint with a corresponding mark, the three-element copper plating quality constraint includes copper plating appearance quality constraint, copper plating size quality constraint and copper plating bonding force constraint; based on the pre-constructed copper plating appearance quality detector, the appearance quality of the copper plating on the surface of the product is detected according to the copper plating appearance quality constraint, and the copper plating appearance quality coefficient is obtained; based on the copper plating size quality constraint, the size quality of the copper plating on the surface of the product is evaluated according to the size quality compliance analysis function, and the copper plating size quality coefficient is obtained; based on the copper plating bonding force constraint, the copper plating density of the copper plating on the surface of the product is evaluated to obtain the copper plating density quality coefficient; a copper plating quality comprehensive detection function is constructed; based on the copper plating quality comprehensive detection function, the copper plating appearance quality coefficient, the copper plating size quality coefficient and the copper plating density quality coefficient are calculated to obtain a comprehensive copper plating quality index; it is judged whether the comprehensive copper plating quality index is less than the preset copper plating quality index; if the comprehensive copper plating quality index is less than the preset copper plating quality index, a copper plating quality warning signal is obtained. Thus, the technical effect of high detection efficiency, online detection, and timely warning of copper plating defects is achieved.

[0011] The above description is only an overview of the technical solution of the present application. In order to more clearly illustrate the technical means of the present application and to implement it in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The embodiments of the present invention and the following brief description are illustrated in conjunction with the accompanying drawings, which are described as follows:

[0013] Figure 1 This is a flow chart of the method for detecting the quality of copper plating on the surface of the product of this application;

[0014] Figure 2 A schematic diagram of a process for performing appearance quality inspection in the surface copper plating quality inspection method of the product of this application to obtain the copper plating appearance quality coefficient;

[0015] Figure 3 This is a schematic diagram of the structure of the copper plating quality detection device for the product surface of this application.

[0016] Explanation of the accompanying drawings: coating acquisition module 11, appearance monitoring module 12, size quality evaluation module 13, density evaluation module 14, detection construction module 15, comprehensive detection module 16, quality assessment module 17, early warning module 18. DETAILED DESCRIPTION

[0017] The present application solves the technical problems faced by the prior art, such as low detection efficiency, poor online detection capability, and inability to timely detect copper plating defects, by providing a product surface copper plating quality detection method and detection device.

[0018] The solution in the embodiment of the present technology, in order to solve the above problems, adopts the following overall ideas:

[0019] Obtain the copper plating on the surface of the product and ensure that it meets the three-element copper plating quality constraints with corresponding labels, including copper plating appearance quality, copper plating size quality and copper plating bonding quality; use the pre-established copper plating appearance quality detector to detect the appearance quality of the copper plating on the surface of the product to obtain the copper plating appearance quality coefficient; according to the copper plating size quality constraint, use the size quality compliance analysis function to evaluate the size quality of the copper plating on the surface of the product to obtain the copper plating size quality coefficient; according to the copper plating bonding constraint, evaluate the copper plating density of the copper plating on the surface of the product to obtain the copper plating density quality coefficient; establish a copper plating quality comprehensive detection function; use the copper plating quality comprehensive detection function to comprehensively calculate the copper plating appearance quality coefficient, copper plating size quality coefficient and copper plating density quality coefficient to generate a comprehensive copper plating quality index; check whether the comprehensive copper plating quality index is less than the preset copper plating quality index; if the comprehensive copper plating quality index is lower than the preset value, trigger the copper plating quality warning signal. Thus, the technical effect of high detection efficiency, online detection and timely warning of copper plating defects is achieved.

[0020] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the drawings and specific implementation methods of the specification. It should be noted that the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments of the present application. It should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. It should also be noted that for the sake of ease of description, only the parts related to the present invention are shown in the drawings, rather than all of them.

[0021] Embodiment 1

[0022] like Figure 1 As shown, the present application provides a method for detecting the quality of copper plating on a product surface, the method comprising:

[0023] S100: Obtaining a copper plating layer on the surface of a product, wherein the copper plating layer on the surface of the product has a correspondingly marked ternary copper plating quality constraint, wherein the ternary copper plating quality constraint includes a copper plating appearance quality constraint, a copper plating size quality constraint, and a copper plating bonding strength constraint

[0024] Optionally, first obtain the surface of the product to be tested, on which there is a layer of copper plating. The copper plating has a three-dimensional copper plating quality constraint. Among them, the copper plating appearance quality constraint means that the appearance quality of the copper plating needs to meet specific standards or requirements, including surface smoothness, color uniformity, no bubbles or cracks, etc. The copper plating size quality constraint means that the size of the copper plating, such as thickness, width, length, etc., needs to meet specific specifications. The copper plating bonding constraint specifies the strength range of the bonding between the copper plating and the product. The copper plating must be firmly attached to the surface of the product and should not fall off or separate easily. Copper plating bonding refers to the adhesion strength or degree of bonding between the copper plating and the product (usually metal or other materials). It indicates whether the copper plating is tightly adhered to the product and whether it is easy to peel off or separate during use.

[0025] S200: Based on a pre-built copper plating appearance quality detector, perform appearance quality detection on the copper plating layer on the surface of the product according to the copper plating appearance quality constraint to obtain a copper plating appearance quality coefficient;

[0026] Optionally, the copper plating appearance quality detector is a device or system for evaluating the appearance quality of the copper plating layer. The copper plating appearance quality detector detects the appearance of the copper plating layer based on optical sensors and image processing technology to ensure that the copper plating layer on the surface of the product meets the quality standards and requirements. Among them, the optical sensor includes CCD, COMS or other optical sensors, which are used to capture images of the product surface.

[0027] Optionally, the copper plating appearance quality detector also includes a light source for providing uniform lighting to ensure that each detail of the copper plating layer is clearly visible in the image. The copper plating appearance quality detector realizes the automation of the appearance quality inspection of the copper plating layer on the product surface, which helps to improve production efficiency, reduce human errors, and ensure that product quality meets standards. In addition, the copper plating appearance quality detector can be applied in real-time or high-speed production environments to meet the requirements of industrial production.

[0028] Further, such as Figure 2 As shown, based on the pre-built copper plating appearance quality detector, the appearance quality of the copper plating layer on the surface of the product is detected according to the copper plating appearance quality constraint to obtain the copper plating appearance quality coefficient, and step S200 also includes:

[0029] Constructing the copper plating appearance quality detector, wherein the copper plating appearance quality detector includes a copper plating appearance acquisition component and a binary copper plating appearance feature recognition component, and the binary copper plating appearance feature recognition component includes an appearance defect recognition channel and an appearance color recognition channel;

[0030] Based on the copper plating appearance collection component, appearance information of the copper plating layer on the surface of the product is collected to obtain the appearance information of the copper plating layer;

[0031] Based on the appearance defect recognition channel, feature recognition is performed on the copper plating appearance information to obtain a copper plating appearance-defect recognition result;

[0032] Performing feature recognition on the copper plating appearance information based on the appearance color recognition channel to obtain a copper plating appearance-color recognition result;

[0033] Based on the copper plating appearance quality constraint, an appearance quality analysis is performed according to the copper plating appearance-defect recognition result and the copper plating appearance-color recognition result to generate the copper plating appearance quality coefficient.

[0034] The copper plating appearance acquisition component is used to collect images or visual data of the copper plating on the surface of the product. It includes cameras, optical sensors, image acquisition devices, etc. The copper plating appearance acquisition component captures the appearance information of the copper plating and converts it into digital images or data for subsequent processing.

[0035] The appearance defect recognition channel is used to detect and identify appearance defects on copper plating, including bubbles, spots, cracks, abrasions, tumors, etc. The appearance defect recognition channel uses image processing technology and algorithms to find abnormal areas in the image and mark these areas as appearance defects.

[0036] In addition, copper plating can be treated with appropriate chemical treatment to obtain decorative copper plating colors such as bronze, copper green, black and natural color. The appearance color recognition channel is used to detect and identify the color characteristics of copper plating. By analyzing the color uniformity of copper plating, it is ensured that the color of copper plating is consistent with the color of standard decorative copper plating.

[0037] Optionally, feature recognition is performed on the copper coating appearance information to obtain a copper coating appearance-defect recognition result, using image processing technology, including edge detection, texture analysis, shape detection, etc., to identify abnormal areas in the image. If a possible defect is found, an appearance-defect recognition result is generated to indicate the location and nature of the defect. The appearance-defect recognition result includes information such as the type of defect, location coordinates, and size of the defect.

[0038] Optionally, feature recognition is performed on the copper coating appearance information to obtain a copper coating appearance-color recognition result by analyzing the color uniformity of the copper coating. The appearance color recognition channel uses color analysis techniques, such as color histogram analysis, color matching, etc. to identify color problems of the copper coating. Among them, the appearance-color recognition result includes information about color consistency, such as color uniformity, color difference, etc.

[0039] Furthermore, the step of generating the copper plating appearance quality coefficient also includes:

[0040] Based on the copper coating appearance-defect identification result, the surface quality of the copper coating is evaluated to obtain the surface quality coefficient of the copper coating;

[0041] Extracting the color requirements of the copper plating layer based on the copper plating appearance quality constraints;

[0042] Comparing the copper plating appearance-color recognition result based on the copper plating color requirement to obtain the copper plating color compliance coefficient;

[0043] The copper plating surface quality coefficient and the copper plating color compliance coefficient are weightedly calculated based on the first weight constraint to obtain the copper plating appearance quality coefficient.

[0044] The copper plating appearance quality coefficient is a comprehensive assessment that considers defects and color factors based on different weights. The value of the coefficient reflects the appearance quality of the copper plating, with high values ​​indicating high quality and low values ​​indicating low quality. Based on the generated copper plating appearance quality coefficient, it is possible to determine whether the copper plating on the surface of the product meets the appearance quality standards. If the coefficient is higher than the predetermined threshold, the product is considered qualified; otherwise, subsequent processing or repair may be required. Through the appearance quality analysis process, an objective evaluation of the appearance quality of the copper plating on the surface of the product can be achieved.

[0045] The surface quality coefficient of the copper plating reflects the degree of defects and quality status of the copper plating. Optionally, first, the defect identification results of the copper plating are analyzed in detail. Including checking and identifying various defects, such as bubbles, cracks, pits, etc. Each defect is divided into different severity levels according to the characteristic size of the defect. Then, according to the copper plating appearance quality constraints and product quality standards, weights are assigned to defects of different types and severity. Defects that have a greater impact on the surface quality of the product should be given higher weights. Among them, these weights can be empirical or adjusted according to actual conditions. Finally, the surface quality coefficient of the copper plating is calculated by comprehensively considering the weights of various defects. Exemplarily, the surface quality coefficient of the copper plating is a value between 0 and 1, where 1 means perfect and 0 means serious defects. The calculation method includes weighted average method or other suitable methods to obtain the final quality coefficient according to the severity of different defects. Through the surface quality evaluation process, the surface quality of the copper plating can be objectively quantified, providing a high confidence surface quality coefficient for subsequent steps.

[0046] Optionally, the color requirements of the copper plating layer include color value, glossiness, uniformity, average deviation, etc. Among them, the specific numerical format of the color value includes RGB (red, green, blue), CMYK (cyan, magenta, yellow, black), etc., which is determined based on the copper plating appearance quality constraints.

[0047] Optionally, the copper coating color requirement is compared with the copper coating appearance-color recognition result, and various comparison algorithms can be used, including color difference calculation, color histogram comparison, etc. Exemplarily, the color similarity calculation measures the difference between the actual color and the required color through the color similarity index. Color similarity indexes include Euclidean distance, CIE76, CIE94, CIEDE2000, etc. The difference between colors is quantified through the copper coating color compliance coefficient, and the color of the copper coating is quantitatively evaluated to see whether it meets the predetermined color requirements, thereby ensuring that the color quality of the product meets the standards and customer requirements.

[0048] Optionally, the first weight constraint includes a copper plating surface quality coefficient weight constraint and a copper plating color compliance coefficient weight constraint. The sum of the two weight constraint values ​​is 1, and the two weight constraint values ​​can be adjusted according to specific needs. The first weight constraint clarifies the relative importance of the copper plating surface quality coefficient and the copper plating color compliance coefficient. Through weighted calculation, the quality of the copper plating on the product surface can be more comprehensively evaluated to ensure that the target copper plating not only meets the requirements in appearance, but also is consistent with expectations in color.

[0049] S300: Based on the copper plating dimensional quality constraint, a dimensional quality evaluation is performed on the copper plating layer on the surface of the product according to a dimensional quality compliance analysis function to obtain a copper plating dimensional quality coefficient;

[0050] Further, based on the copper plating dimensional quality constraint, the dimensional quality of the copper plating layer on the surface of the product is evaluated according to the dimensional quality compliance analysis function to obtain the copper plating dimensional quality coefficient. Step S300 includes:

[0051] Modeling is performed based on the copper plating size quality constraint to obtain a standard copper plating model, and the standard copper plating model is randomly divided to obtain Q copper plating benchmark sub-models, where Q is a positive integer greater than 1;

[0052] Collecting actual size information of the copper plating layer on the surface of the product to obtain actual size characteristics of the copper plating layer, and modeling according to the actual size characteristics of the copper plating layer to obtain an actual copper plating layer model;

[0053] Based on the Q copper plating layer reference sub-models, the actual copper plating layer models are respectively aligned and compared to obtain Q regional size consistency;

[0054] Based on the dimensional consistency of the Q regions, the copper plating dimensional quality coefficient is calculated according to the dimensional quality compliance analysis function.

[0055] The standard copper plating model describes the dimensional characteristics of copper plating that meets the standards, including length, width, thickness, etc. The process of modeling and obtaining the standard copper plating model based on copper plating dimensional quality constraints is used to define the standard size of copper plating and further generate multiple benchmark sub-models for quality inspection.

[0056] Optionally, the standard copper plating model is randomly divided to generate multiple copper plating benchmark sub-models, which are used to obtain multiple standard copper plating partitions with random range sizes to simulate the diversity of copper plating, better adapt to copper plating with different shape and size characteristics, and help to more comprehensively evaluate the dimensional quality of copper plating.

[0057] Among them, the copper plating benchmark sub-model is used to compare with the copper plating on the surface of the product in actual inspection to determine whether the copper plating on the surface of the product meets the standards and whether it meets the dimensional quality constraints.

[0058] Further, based on the copper plating dimensional quality constraint, the dimensional quality of the copper plating layer on the surface of the product is evaluated according to the dimensional quality compliance analysis function to obtain the copper plating dimensional quality coefficient, and step S300 further includes:

[0059] Construct the dimensional quality compliance analysis function, wherein the dimensional quality compliance analysis function is:

[0060] ;

[0061] Among them, SIQ represents the copper plating dimensional quality coefficient, The average value of the size consistency of Q regions, SIC i Represents the i-th region size consistency among Q region size consistency, where i is a positive integer, i belongs to Q, w1 is a first preset weight value, w2 is a second preset weight value, and the sum of w1 and w2 is 1.

[0062] Furthermore, Measures the consistency of sizes between regions. The higher the average value, the more consistent the sizes of different regions are, and the higher the quality. It is used to measure the discrete degree of size consistency of each area.

[0063] The calculation of SIQ takes into account the dimensional consistency of different areas of the copper coating and the user's concern for the consistency of different areas (represented by w1 and w2). The higher the SIQ value, the better the dimensional quality of the copper coating, and vice versa. It is used to evaluate whether the copper coating meets the dimensional quality constraints.

[0064] S400: Evaluating the copper plating density of the copper plating layer on the surface of the product based on the copper plating bonding force constraint to obtain a copper plating density quality coefficient;

[0065] The copper plating density evaluation is used to quantitatively measure the bonding strength between the copper plating layer on the product surface and the product substrate. Among them, the dense copper plating layer usually has better bonding strength and higher quality.

[0066] Optionally, the copper plating density evaluation is carried out by combining multiple technologies and methods, involving microscopes, X-ray diffractometers, electron microscopes and other equipment to obtain detailed information about the density of the copper plating on the product surface.

[0067] Further, the copper plating density of the copper plating layer on the surface of the product is evaluated under the copper plating bonding force constraint to obtain the copper plating density quality coefficient, and step S400 includes:

[0068] Obtaining the plating matrix characteristics, actual copper plating process information and copper plating characteristics of the copper plating layer on the surface of the product;

[0069] Obtaining plating substrate feature record data, actual copper plating process information record data, copper plating feature record data and plating bonding strength record data;

[0070] Based on the recorded data of the plating substrate characteristics, the recorded data of the actual copper plating process information, the recorded data of the copper plating characteristics and the recorded data of the plating bonding strength, a BP neural network is trained to obtain a plating bonding strength prediction channel that meets the convergence condition;

[0071] Based on the coating bonding force prediction channel, the coating bonding force of the copper coating on the surface of the product is predicted according to the coating substrate characteristics, the actual copper plating process information and the copper coating characteristics to obtain the predicted coating bonding force;

[0072] The copper plating density quality coefficient is generated, wherein the copper plating density quality coefficient is obtained by calculating the ratio of the predicted plating bonding force to the copper plating bonding force constraint.

[0073] Optionally, the coating bonding strength is predicted and obtained based on the corresponding relationship between the substrate characteristics of different copper coating samples, the actual copper coating process information and the copper coating characteristics. This achieves the acquisition of a highly confident predicted coating bonding strength without destructive testing of the copper coating on the product surface.

[0074] Optionally, based on the BP neural network, a coating bonding force prediction channel is constructed, and the coating bonding force prediction channel is used to obtain the predicted coating bonding force according to the coating substrate characteristics, the actual copper plating process information and the copper plating layer characteristics. Among them, the coating substrate characteristics, the actual copper plating process information and the copper plating layer characteristics are the prediction constraint characteristics of the coating bonding force prediction channel, and the predicted coating bonding force is the prediction response characteristic of the coating bonding force prediction channel.

[0075] The coating bonding force prediction channel includes an input layer, a hidden layer, and an output layer. The number of neurons in the input layer is equal to the number of input features, and the number of neurons in the output layer is equal to the number of values ​​to be predicted. The number of hidden layers and the number of neurons in each hidden layer are adjustable hyperparameters. The convergence condition refers to the preset accuracy range.

[0076] S500: Construct a comprehensive copper plating quality detection function;

[0077] The copper plating quality comprehensive detection function is constructed based on the ternary copper plating quality constraints. The comprehensive copper plating quality index is calculated through the copper plating appearance quality coefficient, copper plating size quality coefficient, and copper plating density quality coefficient. The copper plating quality comprehensive detection function is used to quickly and comprehensively evaluate the copper plating quality of the product.

[0078] Furthermore, the copper plating quality comprehensive detection function in step S500 is:

[0079] ;

[0080] Among them, COQ represents the comprehensive copper plating quality index, g represents the comprehensive copper plating quality operator, APQ represents the copper plating appearance quality coefficient, SIQ represents the copper plating size quality coefficient, MOQ represents the copper plating density quality coefficient, α, β, and γ are the copper plating appearance quality weight, copper plating size quality weight, and copper plating density quality weight, respectively, and the sum of α, β, and γ is 1.

[0081] Optionally, the weights α, β, and γ are adjusted according to the importance of the quality indicators to meet specific application requirements. The higher the COQ, the better the copper coating quality of the product.

[0082] S600: Calculating the copper plating appearance quality coefficient, the copper plating size quality coefficient and the copper plating density quality coefficient based on the copper plating quality comprehensive detection function to obtain a comprehensive copper plating quality index;

[0083] The comprehensive copper plating quality index is used to quantitatively reflect the comprehensive quality of the copper plating on the product surface, evaluate the overall quality of the copper plating on the product surface, and then determine whether the product meets the copper plating quality requirements and whether further processing or improvement is required.

[0084] S700: Determine whether the comprehensive copper plating quality index is less than a preset copper plating quality index;

[0085] Optionally, the preset copper plating quality index is obtained based on the same method principle as above according to the ternary copper plating quality constraint. Please understand that for the sake of brevity of the specification, no further explanation is given here.

[0086] S800: If the comprehensive copper plating quality index is less than the preset copper plating quality index, a copper plating quality warning signal is obtained.

[0087] When the comprehensive copper plating quality index is less than the preset copper plating quality index, the copper plating quality detection feedback is provided by issuing a copper plating quality warning signal. The copper plating quality warning signal indicates that the quality of the copper plating layer on the surface of the product does not meet the expected standard.

[0088] Optionally, measures can be taken to improve the production process or perform quality control to ensure that the copper plating quality of the product reaches the expected level, thereby avoiding the production of defective products and improving product quality and reliability.

[0089] In summary, the product surface copper plating quality detection method provided by the present invention has the following technical effects:

[0090] By obtaining the copper plating on the surface of the product, and the copper plating on the surface of the product has a ternary copper plating quality constraint with a corresponding mark, the ternary copper plating quality constraint includes copper plating appearance quality constraint, copper plating size quality constraint and copper plating bonding force constraint; based on the pre-constructed copper plating appearance quality detector, the appearance quality of the copper plating on the surface of the product is detected according to the copper plating appearance quality constraint, and the copper plating appearance quality coefficient is obtained; based on the copper plating size quality constraint, the size quality of the copper plating on the surface of the product is evaluated according to the size quality compliance analysis function, and the copper plating size quality coefficient is obtained; based on the copper plating bonding force constraint, the copper plating density of the copper plating on the surface of the product is evaluated, and the copper plating density quality coefficient is obtained; a copper plating quality comprehensive detection function is constructed; based on the copper plating quality comprehensive detection function, the copper plating appearance quality coefficient, the copper plating size quality coefficient and the copper plating density quality coefficient are calculated to obtain a comprehensive copper plating quality index; it is judged whether the comprehensive copper plating quality index is less than the preset copper plating quality index; if the comprehensive copper plating quality index is less than the preset copper plating quality index, a copper plating quality warning signal is obtained.

[0091] Embodiment 2

[0092] Based on the same concept as the method for detecting the quality of copper plating on the surface of the product in the embodiment, Figure 3 As shown, the present application also provides a product surface copper plating quality detection device, the detection device comprising:

[0093] The coating acquisition module 11 is used to obtain the copper coating on the surface of the product, and the copper coating on the surface of the product has a correspondingly marked ternary copper coating quality constraint, and the ternary copper coating quality constraint includes a copper coating appearance quality constraint, a copper coating size quality constraint, and a copper coating bonding strength constraint;

[0094] An appearance monitoring module 12 is used to perform appearance quality detection on the copper plating layer on the surface of the product according to the copper plating appearance quality constraint based on a pre-built copper plating appearance quality detector to obtain a copper plating appearance quality coefficient;

[0095] A dimensional quality evaluation module 13 is used to evaluate the dimensional quality of the copper plating layer on the surface of the product based on the copper plating dimensional quality constraint and according to a dimensional quality compliance analysis function to obtain a copper plating dimensional quality coefficient;

[0096] A density evaluation module 14 is used to evaluate the copper plating density of the copper plating layer on the surface of the product based on the copper plating bonding force constraint to obtain a copper plating density quality coefficient;

[0097] A detection construction module 15 is used to construct a comprehensive detection function for copper plating quality;

[0098] A comprehensive detection module 16, for calculating the copper plating appearance quality coefficient, the copper plating size quality coefficient and the copper plating density quality coefficient based on the copper plating quality comprehensive detection function to obtain a comprehensive copper plating quality index;

[0099] A quality evaluation module 17, used to determine whether the comprehensive copper plating quality index is less than a preset copper plating quality index;

[0100] The early warning module 18 is used to obtain a copper plating quality early warning signal if the comprehensive copper plating quality index is less than the preset copper plating quality index.

[0101] Furthermore, the appearance monitoring module 12 also includes:

[0102] A detection construction unit, used to construct the copper plating appearance quality detector, wherein the copper plating appearance quality detector includes a copper plating appearance acquisition component and a binary copper plating appearance feature recognition component, and the binary copper plating appearance feature recognition component includes an appearance defect recognition channel and an appearance color recognition channel;

[0103] An appearance information collection unit, used to collect appearance information of the copper plating layer on the surface of the product based on the copper plating appearance collection component to obtain the appearance information of the copper plating layer;

[0104] A defect recognition unit, used for performing feature recognition on the copper plating appearance information based on the appearance defect recognition channel to obtain a copper plating appearance-defect recognition result;

[0105] A color recognition unit, used for performing feature recognition on the copper plating appearance information based on the appearance color recognition channel to obtain a copper plating appearance-color recognition result;

[0106] The appearance quality analysis unit is used to perform appearance quality analysis based on the copper plating appearance quality constraint, according to the copper plating appearance-defect recognition result and the copper plating appearance-color recognition result, and generate the copper plating appearance quality coefficient.

[0107] Furthermore, the appearance quality analysis unit also includes:

[0108] A surface quality evaluation unit, used to evaluate the surface quality of the copper plating layer based on the copper plating layer appearance-defect recognition result, and obtain a surface quality coefficient of the copper plating layer;

[0109] A color requirement acquisition unit, used for extracting the color requirement of the copper plating layer based on the copper plating appearance quality constraint;

[0110] A color compliance comparison unit, used for comparing the copper plating appearance-color recognition result based on the copper plating color requirement to obtain the copper plating color compliance coefficient;

[0111] A weighted calculation unit is used to perform weighted calculation on the surface quality coefficient of the copper plating layer and the color compliance coefficient of the copper plating layer based on a first weight constraint to obtain the copper plating appearance quality coefficient.

[0112] Furthermore, the size quality evaluation module 13 also includes:

[0113] A benchmark modeling unit, used for modeling based on the copper plating size quality constraint to obtain a standard copper plating model, and randomly dividing the standard copper plating model to obtain Q copper plating benchmark sub-models, where Q is a positive integer greater than 1;

[0114] An actual modeling unit, used to collect actual size information of the copper plating layer on the surface of the product, obtain actual size characteristics of the copper plating layer, and perform modeling according to the actual size characteristics of the copper plating layer to obtain an actual copper plating layer model;

[0115] A registration and comparison unit, used for performing registration and comparison on the actual copper plating layer model based on the Q copper plating layer reference sub-models, respectively, to obtain Q regional size consistency;

[0116] The quality coefficient unit is used to calculate the copper plating size quality coefficient based on the size consistency of the Q regions and according to the size quality compliance analysis function.

[0117] Furthermore, the quality coefficient unit also includes a dimensional quality compliance analysis function unit, which is used to construct the dimensional quality compliance analysis function, wherein the dimensional quality compliance analysis function is:

[0118] ;

[0119] Among them, SIQ represents the copper plating dimensional quality coefficient, The average value of the size consistency of Q regions, SIC iRepresents the i-th region size consistency among Q region size consistency, where i is a positive integer, i belongs to Q, w1 is a first preset weight value, w2 is a second preset weight value, and the sum of w1 and w2 is 1.

[0120] Furthermore, the density evaluation module 14 also includes:

[0121] A feature acquisition unit, used to obtain the plating matrix features, actual copper plating process information and copper plating features of the copper plating layer on the surface of the product;

[0122] A record acquisition unit, used to obtain the plating substrate feature record data, the actual copper plating process information record data, the copper plating feature record data and the plating bonding strength record data;

[0123] A channel acquisition unit, used to train a BP neural network based on the plating substrate feature record data, the actual copper plating process information record data, the copper plating feature record data and the plating bonding force record data to obtain a plating bonding force prediction channel that meets the convergence condition;

[0124] A bonding force prediction unit is used to predict the bonding force of the copper plating on the surface of the product based on the plating bonding force prediction channel, according to the plating substrate characteristics, the actual copper plating process information and the copper plating characteristics, to obtain a predicted plating bonding force;

[0125] A quality coefficient unit is used to generate the copper plating density quality coefficient, wherein the copper plating density quality coefficient is obtained by calculating the ratio of the predicted plating bonding strength to the copper plating bonding strength constraint.

[0126] Furthermore, the detection construction module 15 also includes:

[0127] The copper plating quality comprehensive detection function unit includes a copper plating quality comprehensive detection function, wherein the copper plating quality comprehensive detection function is:

[0128] ;

[0129] Among them, COQ represents the comprehensive copper plating quality index, g represents the comprehensive copper plating quality operator, APQ represents the copper plating appearance quality coefficient, SIQ represents the copper plating size quality coefficient, MOQ represents the copper plating density quality coefficient, α, β, and γ are the copper plating appearance quality weight, copper plating size quality weight, and copper plating density quality weight, respectively, and the sum of α, β, and γ is 1.

[0130] It should be understood that the embodiments mentioned in this specification focus on their differences from other embodiments. The specific embodiments in the aforementioned embodiment one are also applicable to the product surface copper plating quality detection device described in embodiment two. For the sake of brevity of the specification, they will not be further expanded here.

[0131] It should be understood that the embodiments disclosed in this application and the above description can enable those skilled in the art to use this application to implement this application. At the same time, this application is not limited to the above-mentioned embodiments, and obvious modifications and variations of the embodiments mentioned in this application also fall within the scope of the principles of this application.

Claims

1. A method for detecting the quality of copper plating on a product surface, characterized in that: The method comprises: Obtaining a copper plating layer on the surface of a product, wherein the copper plating layer on the surface of the product has a correspondingly identified ternary copper plating quality constraint, wherein the ternary copper plating quality constraint includes a copper plating appearance quality constraint, a copper plating size quality constraint, and a copper plating bonding force constraint; Based on a pre-built copper plating appearance quality detector, the appearance quality of the copper plating layer on the surface of the product is detected according to the copper plating appearance quality constraint to obtain a copper plating appearance quality coefficient; Based on the copper plating dimensional quality constraint, the dimensional quality of the copper plating layer on the surface of the product is evaluated according to a dimensional quality compliance analysis function to obtain a copper plating dimensional quality coefficient; Based on the copper plating bonding force constraint, the copper plating density of the copper plating layer on the surface of the product is evaluated to obtain a copper plating density quality coefficient; Construct a comprehensive copper plating quality detection function; Calculating the copper plating appearance quality coefficient, the copper plating size quality coefficient and the copper plating density quality coefficient based on the copper plating quality comprehensive detection function to obtain a comprehensive copper plating quality index; Determining whether the comprehensive copper plating quality index is less than a preset copper plating quality index; If the comprehensive copper plating quality index is less than the preset copper plating quality index, a copper plating quality warning signal is obtained; Based on a pre-built copper plating appearance quality detector, the appearance quality of the copper plating layer on the surface of the product is detected according to the copper plating appearance quality constraint to obtain a copper plating appearance quality coefficient, including: Constructing the copper plating appearance quality detector, wherein the copper plating appearance quality detector includes a copper plating appearance acquisition component and a binary copper plating appearance feature recognition component, and the binary copper plating appearance feature recognition component includes an appearance defect recognition channel and an appearance color recognition channel; Based on the copper plating appearance collection component, appearance information of the copper plating layer on the surface of the product is collected to obtain the appearance information of the copper plating layer; Based on the appearance defect recognition channel, feature recognition is performed on the copper plating appearance information to obtain a copper plating appearance-defect recognition result; Performing feature recognition on the copper plating appearance information based on the appearance color recognition channel to obtain a copper plating appearance-color recognition result; Based on the copper plating appearance quality constraint, performing appearance quality analysis according to the copper plating appearance-defect recognition result and the copper plating appearance-color recognition result, and generating the copper plating appearance quality coefficient; Generating the copper plating appearance quality coefficient includes: Based on the copper coating appearance-defect identification result, the surface quality of the copper coating is evaluated to obtain the surface quality coefficient of the copper coating; Extracting the color requirements of the copper plating layer based on the copper plating appearance quality constraints; Comparing the copper plating appearance-color recognition result based on the copper plating color requirement to obtain the copper plating color compliance coefficient; Performing weighted calculation on the copper plating surface quality coefficient and the copper plating color compliance coefficient based on a first weight constraint to obtain the copper plating appearance quality coefficient; Based on the copper plating dimensional quality constraint, the dimensional quality of the copper plating layer on the surface of the product is evaluated according to the dimensional quality compliance analysis function to obtain the copper plating dimensional quality coefficient, including: Modeling is performed based on the copper plating size quality constraint to obtain a standard copper plating model, and the standard copper plating model is randomly divided to obtain Q copper plating benchmark sub-models, where Q is a positive integer greater than 1; Collecting actual size information of the copper plating layer on the surface of the product to obtain actual size characteristics of the copper plating layer, and modeling according to the actual size characteristics of the copper plating layer to obtain an actual copper plating layer model; Based on the Q copper plating layer reference sub-models, the actual copper plating layer models are respectively aligned and compared to obtain Q regional size consistency; Based on the dimensional consistency of the Q regions, the copper plating dimensional quality coefficient is calculated according to the dimensional quality compliance analysis function; Construct the dimensional quality compliance analysis function, wherein the dimensional quality compliance analysis function is: Among them, SIQ represents the copper plating dimensional quality coefficient, The average value of the size consistency of Q regions, SIC i Representing the i-th region size consistency among Q region size consistency, where i is a positive integer, i belongs to Q, w1 is a first preset weight value, w2 is a second preset weight value, and the sum of w1 and w2 is 1; Based on the copper plating bonding force constraint, the copper plating density of the copper plating layer on the surface of the product is evaluated to obtain the copper plating density quality coefficient, including: Obtaining the plating matrix characteristics, actual copper plating process information and copper plating characteristics of the copper plating layer on the surface of the product; Obtaining plating substrate feature record data, actual copper plating process information record data, copper plating feature record data and plating bonding strength record data; Based on the recorded data of the plating substrate characteristics, the recorded data of the actual copper plating process information, the recorded data of the copper plating characteristics and the recorded data of the plating bonding strength, a BP neural network is trained to obtain a plating bonding strength prediction channel that meets the convergence condition; Based on the coating bonding force prediction channel, the coating bonding force of the copper coating on the surface of the product is predicted according to the coating substrate characteristics, the actual copper plating process information and the copper coating characteristics to obtain the predicted coating bonding force; Generating the copper plating density quality coefficient, wherein the copper plating density quality coefficient is obtained by calculating the ratio of the predicted plating bonding force to the copper plating bonding force constraint; The copper plating quality comprehensive detection function is: ； ； Among them, COQ represents the comprehensive copper plating quality index, g represents the comprehensive copper plating quality operator, APQ represents the copper plating appearance quality coefficient, SIQ represents the copper plating size quality coefficient, MOQ represents the copper plating density quality coefficient, α, β, and γ are the copper plating appearance quality weight, copper plating size quality weight, and copper plating density quality weight, respectively, and the sum of α, β, and γ is 1.

2. Product surface copper plating quality detection device, characterized in that: The device comprises: A coating acquisition module, wherein the coating acquisition module is used to obtain a copper coating on a product surface, and the copper coating on the product surface has a correspondingly identified ternary copper coating quality constraint, wherein the ternary copper coating quality constraint includes a copper coating appearance quality constraint, a copper coating size quality constraint, and a copper coating bonding strength constraint; An appearance monitoring module, wherein the appearance monitoring module is used to perform appearance quality detection on the copper plating layer on the surface of the product according to the copper plating appearance quality constraint based on a pre-built copper plating appearance quality detector, and obtain a copper plating appearance quality coefficient; A dimensional quality evaluation module, wherein the dimensional quality evaluation module is used to evaluate the dimensional quality of the copper plating layer on the surface of the product based on the copper plating dimensional quality constraint and according to a dimensional quality compliance analysis function to obtain a copper plating dimensional quality coefficient; A density evaluation module, the density evaluation module is used to evaluate the copper plating density of the copper plating layer on the surface of the product based on the copper plating bonding force constraint to obtain a copper plating density quality coefficient; A detection building module, wherein the detection building module is used to construct a comprehensive detection function for copper plating quality; A comprehensive detection module, the comprehensive detection module is used to calculate the copper plating appearance quality coefficient, the copper plating size quality coefficient and the copper plating density quality coefficient based on the copper plating quality comprehensive detection function to obtain a comprehensive copper plating quality index; A quality evaluation module, the quality evaluation module is used to determine whether the comprehensive copper plating quality index is less than a preset copper plating quality index; An early warning module, the early warning module is used to obtain a copper plating quality early warning signal if the comprehensive copper plating quality index is less than the preset copper plating quality index; The appearance monitoring module also includes: A detection construction unit, used to construct the copper plating appearance quality detector, wherein the copper plating appearance quality detector includes a copper plating appearance acquisition component and a binary copper plating appearance feature recognition component, and the binary copper plating appearance feature recognition component includes an appearance defect recognition channel and an appearance color recognition channel; An appearance information collection unit, used to collect appearance information of the copper plating layer on the surface of the product based on the copper plating appearance collection component to obtain the appearance information of the copper plating layer; A defect recognition unit, used for performing feature recognition on the copper plating appearance information based on the appearance defect recognition channel to obtain a copper plating appearance-defect recognition result; A color recognition unit, used for performing feature recognition on the copper plating appearance information based on the appearance color recognition channel to obtain a copper plating appearance-color recognition result; an appearance quality analysis unit, configured to perform appearance quality analysis based on the copper plating appearance quality constraint, according to the copper plating appearance-defect recognition result and the copper plating appearance-color recognition result, and generate the copper plating appearance quality coefficient; The appearance quality analysis unit also includes: A surface quality evaluation unit, used to evaluate the surface quality of the copper plating layer based on the copper plating layer appearance-defect recognition result, and obtain a surface quality coefficient of the copper plating layer; A color requirement acquisition unit, used for extracting the color requirement of the copper plating layer based on the copper plating appearance quality constraint; A color compliance comparison unit, used for comparing the copper plating appearance-color recognition result based on the copper plating color requirement to obtain the copper plating color compliance coefficient; A weighted calculation unit, configured to perform weighted calculation on the surface quality coefficient of the copper plating layer and the color compliance coefficient of the copper plating layer based on a first weight constraint to obtain the copper plating appearance quality coefficient; The size quality evaluation module also includes: A benchmark modeling unit, used for modeling based on the copper plating size quality constraint to obtain a standard copper plating model, and randomly dividing the standard copper plating model to obtain Q copper plating benchmark sub-models, where Q is a positive integer greater than 1; An actual modeling unit, used to collect actual size information of the copper plating layer on the surface of the product, obtain actual size characteristics of the copper plating layer, and perform modeling according to the actual size characteristics of the copper plating layer to obtain an actual copper plating layer model; A registration and comparison unit, used for performing registration and comparison on the actual copper plating layer model based on the Q copper plating layer reference sub-models, respectively, to obtain Q regional size consistency; A quality coefficient unit, used to calculate the copper plating size quality coefficient based on the size consistency of the Q regions and according to the size quality compliance analysis function; The quality coefficient unit also includes a dimensional quality compliance analysis function unit, which is used to construct the dimensional quality compliance analysis function, wherein the dimensional quality compliance analysis function is: Among them, SIQ represents the copper plating dimensional quality coefficient, The average value of the size consistency of Q regions, SIC i Representing the i-th region size consistency among Q region size consistency, where i is a positive integer, i belongs to Q, w1 is a first preset weight value, w2 is a second preset weight value, and the sum of w1 and w2 is 1; The density evaluation module also includes: A feature acquisition unit, used to obtain the plating matrix features, actual copper plating process information and copper plating features of the copper plating layer on the surface of the product; A record acquisition unit, used to obtain the plating substrate feature record data, the actual copper plating process information record data, the copper plating feature record data and the plating bonding strength record data; A channel acquisition unit, used to train a BP neural network based on the plating substrate feature record data, the actual copper plating process information record data, the copper plating feature record data and the plating bonding force record data to obtain a plating bonding force prediction channel that meets the convergence condition; A bonding force prediction unit is used to predict the bonding force of the copper plating on the surface of the product based on the plating bonding force prediction channel, according to the plating substrate characteristics, the actual copper plating process information and the copper plating characteristics, to obtain a predicted plating bonding force; A quality coefficient unit, used for generating the copper plating density quality coefficient, wherein the copper plating density quality coefficient is obtained by calculating the ratio of the predicted plating bonding force to the copper plating bonding force constraint; The detection building blocks also include: The copper plating quality comprehensive detection function unit includes a copper plating quality comprehensive detection function, wherein the copper plating quality comprehensive detection function is: ； ； Among them, COQ represents the comprehensive copper plating quality index, g represents the comprehensive copper plating quality operator, APQ represents the copper plating appearance quality coefficient, SIQ represents the copper plating size quality coefficient, MOQ represents the copper plating density quality coefficient, α, β, and γ are the copper plating appearance quality weight, copper plating size quality weight, and copper plating density quality weight, respectively, and the sum of α, β, and γ is 1.

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