A silicon wafer cleaning device for solar cell production

Abstract

The present invention relates to the technical field of solar panel production, and specifically to a silicon wafer cleaning device for solar cell production, comprising a cleaning chamber and a cleaning pool installed inside the cleaning chamber, wherein a plurality of cleaning pools are provided, the plurality of cleaning pools are located inside the cleaning chamber, and silicon wafers are cleaned in multiple steps through the plurality of cleaning pools, a plurality of movable telescopic mechanisms are installed inside the cleaning chamber, and further comprising: a clamping and positioning mechanism, wherein the clamping and positioning mechanism is installed at the bottom of the movable telescopic mechanism, and the clamping and positioning mechanism is moved inside the cleaning chamber through the movable telescopic mechanism; the silicon wafer cleaning device for solar cell production enables a plurality of silicon wafers located inside the cleaning pool to move relative to the inside of the cleaning pool, thereby accelerating the disturbance of the cleaning liquid inside the cleaning pool, so that the cleaning liquid can fully contact with the surface of the silicon wafer, thereby achieving the effect of quickly and efficiently cleaning the surface of the silicon wafer.

Description

Technical Field

[0001] The invention relates to the technical field of solar cell panel production, in particular to a silicon wafer cleaning device for solar cell wafer production. Background Art

[0002] During the processing of solar cell silicon wafers, various impurities such as particles, metal particles, silicon powder dust and organic impurities will be adsorbed. These pollutants will reduce the insulation performance of silicon wafers, affect the performance of PN junctions, and even cause the breakdown voltage of PN junctions to decrease and surface leakage, thereby reducing the conversion efficiency of the cells. At the same time, during the preparation of solar energy materials, the silicon surface is usually coated with a layer of anti-reflection film with good performance. However, harmful impurity ions entering the silicon dioxide layer will reduce its insulation performance. Therefore, the existing cleaning can remove these impurities and improve the insulation performance of silicon wafers, thereby improving the conversion efficiency of cells and improving the quality of solar cell preparation.

[0003] At present, in the production process of existing solar cells, during the cleaning process of silicon wafers, a plurality of cleaning tanks are equipped inside the cleaning chamber to ensure that the silicon wafers can be thoroughly cleaned through multiple steps. Common cleaning tanks mainly include a front cleaning tank, a main cleaning tank, a deionized water tank, etc., and through the cooperation of multiple mobile manipulators inside the cleaning chamber, the silicon wafers located at the cleaning frame are pre-treated, cleaned, rinsed and dried in the multiple cleaning tanks in sequence;

[0004] However, when cleaning the existing silicon wafers, on the one hand, multiple silicon wafers are placed in a cleaning frame, and most of the silicon wafers are close and fixed, so it takes a long time to soak and clean them in multiple cleaning tanks in turn. On the other hand, after the multiple silicon wafers are soaked and cleaned in the cleaning tank, they are transferred to the next cleaning tank by a robot for cleaning. This process will result in a lot of cleaning liquid from the previous cleaning tank remaining on the surface of the silicon wafer and the cleaning frame, thereby affecting the cleaning efficiency of the silicon wafer. Summary of the invention

[0005] The object of the present invention is to provide a silicon wafer cleaning device for producing solar cell wafers to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: A silicon wafer cleaning device for solar cell production, comprising a cleaning chamber and a cleaning pool installed inside the cleaning chamber, wherein a plurality of cleaning pools are provided, the plurality of cleaning pools are located inside the cleaning chamber, and the silicon wafer is cleaned in multiple steps through the plurality of cleaning pools, a plurality of movable telescopic mechanisms are installed inside the cleaning chamber, and further comprising:

[0007] A clamping and positioning mechanism, wherein the clamping and positioning mechanism is installed at the bottom of the movable telescopic mechanism, and the clamping and positioning mechanism moves inside the cleaning chamber through the movable telescopic mechanism;

[0008] A silicon wafer support mechanism, wherein the silicon wafer support mechanism is moved into the cleaning tank through a clamping and positioning mechanism, and the silicon wafer support mechanism is used to support a plurality of silicon wafers during cleaning;

[0009] A cleaning liquid removal mechanism is provided, wherein a plurality of cleaning liquid removal mechanisms are installed at both ends of the cleaning tank, and the cleaning liquid removal mechanism cooperates with the silicon wafer supporting mechanism to remove the residual cleaning liquid on the cleaned silicon wafer inside the cleaning tank.

[0010] The clamping and positioning mechanism comprises a support shell installed at the bottom of the mobile telescopic mechanism, a bidirectional threaded screw is installed inside the support shell, and a driving motor for driving the bidirectional threaded screw is installed at one end of the outer side of the support shell;

[0011] The outer side of the bidirectional threaded screw is threadedly sleeved with two movable sleeves, the two movable sleeves slide through the bottom of the support shell, and clamping plates are fixedly installed on the bottom of the two movable sleeves, and the two clamping plates are used to clamp the silicon wafer support mechanism.

[0012] Wherein, the silicon wafer support mechanism comprises a first spray frame, a second spray frame and a bottom fixing frame which are sequentially distributed from top to bottom;

[0013] The first spray frame, the second spray frame and the bottom fixed frame are fixedly connected to each other with a transfer shell on both sides;

[0014] A guide mechanism connected to a clamping plate is provided between the two sides of the first spray frame and the second spray frame;

[0015] A support frame is fixedly installed inside the bottom fixed frame, and two sets of linkage mechanisms are arranged on the support frame, and a plurality of placement racks are evenly connected to the tops of the two sets of linkage mechanisms, and the placement racks are provided with placement slots, and the placement racks place silicon wafers through the placement slots;

[0016] A rotating mechanism, wherein the rotating mechanism is installed at the center of the bottom fixed frame, and a first rotating shaft and a second rotating shaft are rotatably connected to the rotating mechanism, and the rotating mechanism synchronously drives two sets of linkage mechanisms through the first rotating shaft and the second rotating shaft respectively;

[0017] The driving mechanism is installed at the bottom of the supporting shell, and the supporting shell is used to drive the rotating mechanism, and the silicon wafer supporting mechanism is provided to achieve the function of supporting multiple silicon wafers.

[0018] The guide mechanism comprises guide blocks installed on both sides of the first spray frame and the second spray frame, and the clamping plate is provided with guide grooves at positions corresponding to the guide blocks. By providing the guide mechanism, the clamping plate can be limited and guided during clamping.

[0019] Wherein, the linkage mechanism comprises a first connecting rod and a second connecting rod located in the middle of the support frame and respectively sleeved on the outside of the first rotating shaft or the second rotating shaft;

[0020] One end of the first connecting rod is fixedly connected to the first rotating shaft or the second rotating shaft, and the second connecting rod is slidably sleeved on the outside of the first rotating shaft or the second rotating shaft;

[0021] A third connecting rod and a fourth connecting rod, wherein the third connecting rod and the fourth connecting rod are provided in plurality, and the plurality of third connecting rods and the fourth connecting rods are cross-distributed in pairs, a synchronization shaft is rotatably connected between the cross-distributed third connecting rods and the fourth connecting rods, adjacent third connecting rods and the fourth connecting rods are hinged by a pin, and the third connecting rod and the fourth connecting rod near the first connecting rod and the second connecting rod are hinged by a pin;

[0022] The tops of the multiple synchronization shafts all pass through the top opening of the support frame, and the tops of the multiple synchronization shafts are rotatably connected with synchronization blocks. The multiple synchronization blocks are respectively fixedly installed on the bottom of the placement rack, and the placement rack is synchronously driven through the linkage mechanism.

[0023] Wherein, the rotating mechanism comprises a first rotating gear and a second rotating gear which are respectively fixedly sleeved on the outside of the first rotating shaft and the second rotating shaft, and the first rotating gear is meshedly connected with the second rotating gear;

[0024] A positioning shaft is fixedly installed on the top of the first rotating gear, and a worm wheel is fixedly connected to the top of the positioning shaft, and a worm is meshingly connected to the outer side of the worm wheel;

[0025] A fixing frame for supporting the worm is installed on the support frame, and a rotating shaft is installed at one end of the fixing frame;

[0026] One end of the rotating shaft is fixedly connected to the worm, and one end of the rotating shaft located outside the fixed frame is fixedly connected to a transmission gear, and the transmission gear is connected to the driving mechanism. Through the rotating mechanism, the first rotating shaft and the second rotating shaft are driven in reverse.

[0027] Wherein, the driving mechanism includes a support rod fixedly installed at the bottom of the support shell, a guide rack fixedly installed at the bottom of the support rod, and the guide rack is meshed and connected with the transmission gear, and the driving mechanism is provided to drive the transmission gear.

[0028] Among them, the transfer shell is respectively provided with through holes connected with the first spray frame and the second spray frame, and the first spray frame and the second spray frame have hollow cavities inside, and the first spray frame and the second spray frame are provided with multiple spray holes on the inner side. The bottom of the transfer shell close to the cleaning liquid removal mechanism is provided with a connecting hole for connecting with it.

[0029] The cleaning liquid removal mechanism comprises a water tank arranged outside the cleaning pool, a water pump is installed on the top of the water tank, and an outlet pipe is connected to the output end of the water pump, the water pump guides the water in the water tank to the outlet pipe, the top of the outlet pipe is L-shaped, and the top of the outlet pipe is connected to a telescopic pipe, and one end of the telescopic pipe is connected to a water outlet pipe;

[0030] The outlet pipe is provided with an outlet hole at a position corresponding to the connection hole, and one end of the outlet pipe close to the transfer shell is spherical;

[0031] The water outlet pipe and the top of the cleaning tank are provided with a connecting piece, and the cleaning liquid removing mechanism is provided to remove the cleaning liquid on the surface of the silicon wafer after cleaning in the cleaning tank.

[0032] The connecting piece includes a connecting sleeve fixedly sleeved on the outside of the water outlet pipe, and two connecting rods are slidably penetrated through the connecting sleeve, and one end of the connecting rod close to the outer wall of the cleaning tank is fixedly connected to a connecting plate, and the connecting plate is fixedly installed on the cleaning tank;

[0033] The other end of the connecting rod is fixedly connected to the limiting block;

[0034] A connecting spring is provided on the outer side of the connecting rod, one end of the connecting spring is fixedly connected to the connecting sleeve, and the other end of the connecting spring is connected to a pressure sensor, which is mounted on the connecting plate and is connected to the water outlet pipe and the cleaning pool through a connecting piece.

[0035] The present invention has at least the following beneficial effects:

[0036] 1. When the present invention is in use, the clamping end of the existing manipulator inside the cleaning chamber is set as a clamping and positioning mechanism, so that it can cooperate with the silicon wafer supporting mechanism in the present invention to achieve the function of stably clamping and moving the silicon wafer supporting mechanism. At the same time, the clamping and positioning mechanism can cooperate with the silicon wafer supporting mechanism, so that multiple silicon wafers located inside the cleaning tank can be moved relative to the inside of the cleaning tank, thereby accelerating the disturbance of the cleaning liquid inside the cleaning tank, so that the cleaning liquid can fully contact the surface of the silicon wafer, and achieve the function of quickly and efficiently cleaning the surface of the silicon wafer.

[0037] 2. When the present invention is in use, the cleaning liquid removal mechanism is provided at both ends of each cleaning tank. Therefore, after the multiple silicon wafers at the silicon wafer supporting mechanism are cleaned in the corresponding cleaning tank, the cleaning liquid removal mechanism and the silicon wafer supporting mechanism cooperate with each other to remove the cleaning liquid remaining on the outside of the silicon wafer, thereby ensuring that the silicon wafer is fully cleaned in the next cleaning step. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0039] Figure 2 It is a schematic diagram of the structure of the cleaning pool of the present invention;

[0040] Figure 3 This is a schematic diagram of the internal structure of the cleaning pool of the present invention;

[0041] Figure 4 It is a schematic diagram of the side cross-sectional structure of the cleaning pool of the present invention;

[0042] Figure 5 This is a schematic diagram of the bottom fixing frame structure of the present invention;

[0043] Figure 6 It is a schematic diagram of the transfer shell structure in the present invention;

[0044] Figure 7 This is a schematic diagram of the bottom structure of the bottom fixing frame of the present invention;

[0045] Figure 8 This is a schematic diagram of the internal structure of the support shell of the present invention;

[0046] Fig. 9 It is a schematic diagram of the structure of the guide mechanism of the present invention;

[0047] Fig.10 This is a schematic diagram of the structure of the placement rack of the present invention;

[0048] Fig.11 It is a schematic diagram of the linkage mechanism structure of the present invention;

[0049] Fig.12 It is a bottom view structural schematic diagram of the linkage mechanism of the present invention;

[0050] Fig.13 It is a side view structural schematic diagram of the placement rack of the present invention;

[0051] Fig.14 This is a schematic diagram of the top view of the support frame of the present invention;

[0052] Fig.15 For the present invention Fig.14 A schematic diagram of the enlarged structure of the middle A area;

[0053] Fig.16 This is a schematic diagram of the water tank structure of the present invention;

[0054] Fig.17 For the present invention Fig.16 Schematic diagram of the enlarged structure of the middle B area;

[0055] Fig.18 This is a structural diagram of Embodiment 2 of the present invention.

[0056] In the figure: 1-cleaning chamber; 2-cleaning tank; 21-center positioning block; 22-edge positioning block; 3-movable telescopic mechanism; 4-clamping positioning mechanism; 41-support shell; 42-bidirectional threaded screw; 43-driving motor; 44-moving sleeve; 45-clamping plate; 451-guide groove; 5-silicon wafer support mechanism; 51-first spray frame; 52-second spray frame; 53-bottom fixed frame; 54-transfer shell; 55-support frame; 56-linkage mechanism; 561-first connecting rod; 562-second connecting rod; 563-third connecting rod; 564-fourth connecting rod; 565-synchronizing shaft; 566-synchronizing block; 57-placing rack; 571- Placement slot; 58-first rotating axis; 59-second rotating axis; 6-cleaning liquid removal mechanism; 61-water tank; 62-water pump; 63-export pipe; 64-telescopic pipe; 65-water outlet pipe; 66-connecting piece; 661-connecting sleeve; 662-connecting rod; 663-connecting plate; 664-limiting block; 665-connecting spring; 666-pressure sensor; 7-rotating mechanism; 71-first rotating gear; 72-second rotating gear; 73-positioning shaft; 74-worm wheel; 75-worm; 76-fixed frame; 77-rotating shaft; 78-transmission gear; 8-driving mechanism; 81-support rod; 82-guide rack; 9-guide mechanism; 91-guide block. DETAILED DESCRIPTION

[0057] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0058] Embodiment 1

[0059] See also Figures 1 to 17A silicon wafer cleaning device for solar cell production includes a cleaning chamber 1 and a cleaning pool 2 installed inside the cleaning chamber 1. A plurality of cleaning pools 2 are provided, and the plurality of cleaning pools 2 are located inside the cleaning chamber 1. The silicon wafer is cleaned in multiple steps through the plurality of cleaning pools 2. A plurality of mobile telescopic mechanisms 3 are installed inside the cleaning chamber 1. The mobile telescopic mechanism 3 is an existing mechanism that can reciprocate horizontally inside the cleaning chamber 1 and can move up and down relative to the cleaning pool 2. The mobile telescopic mechanism 3 in the present invention is a mobile manipulator. A clamping and positioning mechanism 4 is installed at the bottom of the mobile telescopic mechanism 3. The clamping and positioning mechanism 4 moves inside the cleaning chamber 1 through the mobile telescopic mechanism 3. The clamping end is improved to the clamping and positioning mechanism 4. The specific clamping and positioning mechanism 4 is:

[0060] The clamping and positioning mechanism 4 includes a support shell 41 installed at the bottom of the mobile telescopic mechanism 3, a bidirectional threaded screw 42 is installed inside the support shell 41, and a driving motor 43 for driving the bidirectional threaded screw 42 is installed at one end of the outer side of the support shell 41;

[0061] The outer side of the bidirectional threaded screw 42 is threadedly sleeved with two movable sleeves 44, which slide through the bottom of the support shell 41, and the bottom of the two movable sleeves 44 is fixedly installed with clamping plates 45, which are used to clamp the silicon wafer support mechanism 5;

[0062] Specific implementation process: When the wafer support mechanism 5 is supported, the two clamping plates 45 are aligned with the outside of the wafer support mechanism 5, and the two-way threaded screw 42 is rotated by the driving motor 43. When the two-way threaded screw 42 rotates, the two moving sleeves 44 are provided with driving forces in opposite directions. Due to the limiting effect of the supporting shell 41, the two clamping plates 45 move toward each other, and through the operation of the mobile telescopic mechanism 3, the two clamping plates 45 are further moved to the outside of the wafer support mechanism 5, so as to clamp the wafer support mechanism 5.

[0063] A silicon wafer supporting mechanism 5, which is moved into the cleaning tank 2 through the clamping and positioning mechanism 4, and is used to support multiple silicon wafers during cleaning;

[0064] The silicon wafer support mechanism 5 includes a first spray frame 51, a second spray frame 52 and a bottom fixing frame 53 which are sequentially arranged from top to bottom;

[0065] A transfer shell 54 is fixedly connected between the first spray frame 51, the second spray frame 52 and the two sides of the bottom fixed frame 53;

[0066] The first spray frame 51 and the second spray frame 52 are provided with guide mechanisms 9 connected to the clamping plate 45 on both sides thereof. The guide mechanisms 9 include guide blocks 91 installed on both sides of the first spray frame 51 and the second spray frame 52. Two guide blocks 91 are provided, and the two guide blocks 91 are fixedly connected to the outer sides of the corresponding first spray frame 51 and the second spray frame 52. The clamping plate 45 is provided with guide grooves 451 at positions corresponding to the guide blocks 91. That is, through the setting of the guide grooves 451, the clamping plate 45 is set in a U-shape with the opening facing downward. Therefore, when the clamping plate 45 clamps the first spray frame 51 and the second spray frame 52, due to the guidance of the two guide blocks 91, the clamping positions of the first spray frame 51 and the second spray frame 52 by the two clamping plates 45 are limited, so that the clamping positions of the first spray frame 51 and the second spray frame 52 are accurately positioned by the clamping plate 45.

[0067] A support frame 55 is fixedly installed on the inner side of the bottom fixed frame 53, and two groups of linkage mechanisms 56 are arranged on the support frame 55, and multiple placement racks 57 are evenly connected to the tops of the two groups of linkage mechanisms 56. In this embodiment, the placement rack 57 is U-shaped, and multiple placement racks 57 are slidably connected to the first spray frame 51, the second spray frame 52 and the bottom fixed frame 53, so as to achieve the function of limiting and guiding the placement rack 57. A placement groove 571 is arranged at the placement rack 57, and the placement rack 57 places the silicon wafer through the placement groove 571. At the same time, a plurality of water holes are arranged on the placement rack 57, so as to ensure that the cleaning liquid can fully enter the placement groove 571 inside the placement rack 57, so that the cleaning liquid is fully in contact with the silicon wafer at the placement groove 571, so as to achieve the cleaning of the silicon wafer;

[0068] The rotating mechanism 7 is installed at the center of the bottom fixed frame 53, and the rotating mechanism 7 is rotatably connected with a first rotating shaft 58 and a second rotating shaft 59. The rotating mechanism 7 synchronously drives the two sets of linkage mechanisms 56 through the first rotating shaft 58 and the second rotating shaft 59 respectively;

[0069] The linkage mechanism 56 includes a first connecting rod 561 and a second connecting rod 562 located in the middle of the support frame 55 and respectively sleeved on the outside of the first rotating shaft 58 or the second rotating shaft 59;

[0070] One end of the first connecting rod 561 is fixedly connected to the first rotating shaft 58 or the second rotating shaft 59, and the second connecting rod 562 is slidably sleeved on the outside of the first rotating shaft 58 or the second rotating shaft 59;

[0071] A third connecting support rod 563 and a fourth connecting support rod 564 are provided in plurality, and the plurality of third connecting support rods 563 and the fourth connecting support rods 564 are cross-distributed in pairs, a synchronization shaft 565 is rotatably connected between the cross-distributed third connecting support rods 563 and the fourth connecting support rods 564, adjacent third connecting support rods 563 and the fourth connecting support rods 564 are hinged by a pin, and the third connecting support rods 563 and the fourth connecting support rods 564 near the first connecting support rod 561 and the second connecting support rod 562 are hinged by a pin;

[0072] The tops of the multiple synchronization shafts 565 all pass through the top opening of the support frame 55, and the tops of the multiple synchronization shafts 565 are rotatably connected with synchronization blocks 566, and the multiple synchronization blocks 566 are respectively fixedly installed at the bottom of the placement frame 57. In this embodiment, each group of the linkage mechanism 56 is provided with two first connecting rods 561 and second connecting rods 562, and the first connecting rods 561 and the second connecting rods 562 are a group, which are distributed at both ends of the multiple third connecting rods 563 and the fourth connecting rods 564, and one end of the first connecting rods 561 and the second connecting rods 562 away from the support frame 55 is rotatably connected with a moving block through a pin shaft, and the moving block is slidably connected to the support frame 55, thereby realizing the function of stably connecting the multiple connecting rods;

[0073] The rotating mechanism 7 comprises a first rotating gear 71 and a second rotating gear 72 which are respectively fixedly sleeved on the outside of the first rotating shaft 58 and the second rotating shaft 59, and the first rotating gear 71 is meshedly connected with the second rotating gear 72;

[0074] A positioning shaft 73 is fixedly mounted on the top of the first rotating gear 71, and a worm wheel 74 is fixedly connected to the top of the positioning shaft 73, and a worm 75 is meshingly connected to the outer side of the worm wheel 74;

[0075] A fixing frame 76 for supporting the worm 75 is mounted on the supporting frame 55, and a rotating shaft 77 is mounted on one end of the fixing frame 76;

[0076] One end of the rotating shaft 77 is fixedly connected to the worm 75, and one end of the rotating shaft 77 located outside the fixing frame 76 is fixedly connected to a transmission gear 78, and the transmission gear 78 is connected to the driving mechanism 8;

[0077] The driving mechanism 8 is installed at the bottom of the supporting shell 41, and the supporting shell 41 is used to drive the rotating mechanism 7. The driving mechanism 8 includes a supporting rod 81 fixedly installed at the bottom of the supporting shell 41, and a guide rack 82 is fixedly installed at the bottom of the supporting rod 81, and the guide rack 82 is meshed and connected with the transmission gear 78.

[0078] Specific implementation process: After silicon wafers are placed in the placement grooves 571 of the multiple placement racks 57 inside the silicon wafer support mechanism 5, and are placed in the center position of the cleaning tank 2 through the clamping and positioning mechanism 4, the two clamping plates 45 located on the outside of the first spray frame 51 and the second spray frame 52 are separated from the first spray frame 51 and the second spray frame 52, and as the support shell 41 moves downward, the guide rack 82 is engaged with the transmission gear 78, and the transmission gear 78 is driven by the driving force, so that the transmission gear 78 rotates. When the transmission gear 78 rotates, the worm 75 thereon is driven to rotate synchronously. When the worm 75 rotates, the worm wheel 74 is driven to rotate, and the worm wheel 74 drives the first rotating gear 71 to rotate through the positioning shaft 73, and the first rotating gear 71 drives the second rotating gear 72 to rotate in the opposite direction, so that the first rotating shaft 58 and the second rotating shaft 59 rotate in the opposite direction. The rod 561 is fixed thereto, so when the first rotating shaft 58 and the second rotating shaft 59 rotate, the first connecting support rod 561 thereon is driven to rotate synchronously, and when the first connecting support rod 561 rotates at a certain angle, the second connecting support rod 562 is driven to rotate through the pin shaft, and at the same time, multiple third connecting support rods 563 and fourth connecting support rods 564 are rotated synchronously, so that the placement rack 57 connected to the center of the third connecting support rod 563 and the fourth connecting support rod 564 is moved synchronously, and further the spacing between the multiple placement racks 57 on the support frame 55 is synchronously increased, and as the guide rack 82 moves upward, the spacing between the multiple placement racks 57 is synchronously reduced, so that in this process, the multiple placement frames are reciprocated and telescopically moved relative to the cleaning tank 2, and while moving, the disturbance of the cleaning liquid inside the cleaning tank 2 is accelerated, so that the cleaning liquid fully contacts the silicon wafers at the placement rack 57, thereby achieving the effect of fully cleaning the silicon wafers.

[0079] The cleaning liquid removal mechanism 6 is provided with a plurality of cleaning liquid removal mechanisms 6, and the plurality of cleaning liquid removal mechanisms 6 are installed at both ends of the cleaning tank 2. The cleaning liquid removal mechanism 6 cooperates with the silicon wafer supporting mechanism 5 to remove the cleaning liquid remaining on the cleaned silicon wafers in the cleaning tank 2. The transfer shell 54 is provided with through holes connected to the first spray frame 51 and the second spray frame 52, respectively. In this embodiment, the transfer shell 54 is close to the cleaning liquid removal mechanism 6 on one side in an arc shape, which can cooperate with the spherical water outlet pipe 65, and at the same time realize the first spray frame 51, the second spray frame 52 and the bottom fixed frame 53 in the process of moving down or up along the cleaning tank 2. The first spray frame 51 and the second spray frame 52 are hollow cavities, and the first spray frame 51 and the second spray frame 52 are provided with a plurality of spray holes on the inner side. The bottom of the transfer shell 54 close to the cleaning liquid removal mechanism 6 is provided with a connecting hole for connecting with it.

[0080] The cleaning liquid removal mechanism 6 includes a water tank 61 arranged outside the cleaning pool 2, a water pump 62 is installed on the top of the water tank 61, and the output end of the water pump 62 is connected to a derivation pipe 63, the water pump 62 guides the water in the water tank 61 to the derivation pipe 63, the top of the derivation pipe 63 is L-shaped, and the top of the derivation pipe 63 is connected to a telescopic pipe 64, and one end of the telescopic pipe 64 is connected to a water outlet pipe 65;

[0081] The outlet pipe 65 is provided with an outlet hole at a position corresponding to the connection hole, and one end of the outlet pipe 65 close to the transfer shell 54 is spherical in shape;

[0082] A connector 66 is provided between the water outlet pipe 65 and the top of the cleaning pool 2. The connector 66 includes a connector sleeve 661 fixedly sleeved on the outside of the water outlet pipe 65, and two connector rods 662 are slidably penetrated through the connector sleeve 661. One end of the connector rod 662 close to the outer wall of the cleaning pool 2 is fixedly connected to a connector plate 663, and the connector plate 663 is fixedly installed on the cleaning pool 2.

[0083] The other end of the connecting rod 662 is fixedly connected to the limiting block 664;

[0084] A connecting spring 665 is sleeved on the outer side of the connecting rod 662 . One end of the connecting spring 665 is fixedly connected to the connecting sleeve 661 , and the other end of the connecting spring 665 is connected to a pressure sensor 666 . The pressure sensor 666 is mounted on the connecting plate 663 .

[0085] Specific implementation process: After the silicon wafers located at multiple placement racks 57 are cleaned inside a cleaning tank 2, they are clamped by the clamping plate 45 to move upward along the cleaning tank 2. During the upward movement, the two outer sides of the transfer shells 54 contact the water outlet pipe 65. Then, due to the limiting action of the ball shape at one end of the water outlet pipe 65, the water outlet pipe 65 is connected with the connecting spring 665, the connecting sleeve 661 and the connecting rod 662, so that the water outlet pipe 65 moves along the side wall of the cleaning tank 2 through the connecting sleeve 661. As the transfer shell 54 moves upward, it slides synchronously along the water outlet pipe 65. When the transfer shell 54 moves to the point where its connecting hole contacts the water outlet pipe 65, the water outlet pipe 65 is moved along the side wall of the cleaning tank 2 due to the reverse elastic force of the connecting spring 665. , further making one end of the water outlet pipe 65 stuck in the connecting hole, then the pressure sensor 666 detects that its signal value changes, then the water pump 62 runs, so that the clean water in the water tank 61 is finally discharged from the water outlet hole position of the water outlet pipe 65 through the outlet pipe 63 and the telescopic tube 64, the water flows into the transfer shell 54, and respectively enters the first spray frame 51 and the second spray frame 52 through the through hole, and then sprays out from the multiple spray holes of the first spray frame 51 and the second spray frame 52, further realizing the function of cleaning the silicon wafer and the supporting parts outside the silicon wafer. When the cleaning is completed, the water pump 62 stops running, and with the operation of the moving telescopic mechanism 3 and the clamping and positioning mechanism 4, the silicon wafer at the cleaning pool 2 is further moved to the next cleaning pool 2 for cleaning.

[0086] Embodiment 2

[0087] See also Fig.18 , Embodiment 2 is a further supplementary explanation of Embodiment 1, specifically: a center positioning block 21 and two edge positioning blocks 22 are respectively installed at the Y axis inside the cleaning tank 2, the center positioning block 21 is a cross shape, and the two edge positioning blocks 22 are rectangular, and the bottom of the bottom fixing frame 53 is provided with a card slot corresponding to the center positioning block 21 and the edge positioning block 22;

[0088] When the bottom fixing frame 53 is placed inside the cleaning tank 2 , the card slots at the bottom thereof are respectively sleeved on the outside of the central positioning block 21 and the two edge positioning blocks 22 , thereby ensuring the stability of the bottom fixing frame 53 inside the cleaning tank 2 .

[0089] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0090] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cleaning device for solar cell production, comprising a cleaning chamber (1) and a cleaning pool (2) installed inside the cleaning chamber (1), wherein a plurality of cleaning pools (2) are provided, the plurality of cleaning pools (2) are located inside the cleaning chamber (1), and the silicon wafer is cleaned in multiple steps through the plurality of cleaning pools (2), and a plurality of movable telescopic mechanisms (3) are installed inside the cleaning chamber (1), characterized in that: Also included are: A clamping and positioning mechanism (4), wherein the clamping and positioning mechanism (4) is installed at the bottom of the movable and retractable mechanism (3), and the clamping and positioning mechanism (4) moves inside the cleaning chamber (1) through the movable and retractable mechanism (3); A silicon wafer support mechanism (5), wherein the silicon wafer support mechanism (5) is moved into the cleaning tank (2) via the clamping and positioning mechanism (4), and the silicon wafer support mechanism (5) is used to support a plurality of silicon wafers during cleaning; A cleaning liquid removal mechanism (6), wherein a plurality of cleaning liquid removal mechanisms (6) are provided and the plurality of cleaning liquid removal mechanisms (6) are installed at both ends of the cleaning tank (2), and the cleaning liquid removal mechanism (6) cooperates with the silicon wafer support mechanism (5) to remove the cleaning liquid remaining on the cleaned silicon wafer inside the cleaning tank (2); The silicon wafer supporting mechanism (5) comprises a first spray frame (51), a second spray frame (52) and a bottom fixing frame (53) which are sequentially distributed from top to bottom; A transfer shell (54) is fixedly connected between the two sides of the first spray frame (51), the second spray frame (52) and the bottom fixed frame (53); The bottom of the transfer shell (54) close to the cleaning liquid removal mechanism (6) is provided with a connection hole for connecting with the cleaning liquid removal mechanism (6); A guide mechanism (9) connected to the clamping plate (45) is provided between the two sides of the first spray frame (51) and the second spray frame (52); A support frame (55) is fixedly installed inside the bottom fixed frame (53), two groups of linkage mechanisms (56) are provided on the support frame (55), and a plurality of placement racks (57) are evenly connected to the tops of the two groups of linkage mechanisms (56), the placement racks (57) are provided with placement grooves (571), and the placement racks (57) place silicon wafers through the placement grooves (571); A rotating mechanism (7), wherein the rotating mechanism (7) is installed at the center of the bottom fixed frame (53), and a first rotating shaft (58) and a second rotating shaft (59) are rotatably connected to the rotating mechanism (7), and the rotating mechanism (7) synchronously drives two sets of linkage mechanisms (56) through the first rotating shaft (58) and the second rotating shaft (59); A driving mechanism (8), wherein the driving mechanism (8) is mounted on the bottom of the supporting shell (41), and the supporting shell (41) is used to drive the rotating mechanism (7); The cleaning liquid removal mechanism (6) comprises a water tank (61) arranged outside the cleaning pool (2), a water pump (62) is installed on the top of the water tank (61), and the output end of the water pump (62) is connected to an outlet pipe (63), the water pump (62) guides water in the water tank (61) to the outlet pipe (63), the top of the outlet pipe (63) is L-shaped, and the top of the outlet pipe (63) is connected to a telescopic pipe (64), and one end of the telescopic pipe (64) is connected to a water outlet pipe (65); The water outlet pipe (65) is provided with a water outlet hole at a position corresponding to the connection hole, and one end of the water outlet pipe (65) close to the transfer shell (54) is spherical; The water outlet pipe (65) and the top of the cleaning tank (2) are provided with a connecting piece (66); The connecting member (66) comprises a connecting sleeve (661) fixedly sleeved on the outside of the water outlet pipe (65), and two connecting rods (662) are slidably penetrated through the connecting sleeve (661), and one end of the connecting rod (662) close to the outer wall of the cleaning tank (2) is fixedly connected to a connecting plate (663), and the connecting plate (663) is fixedly installed on the cleaning tank (2); The other end of the connecting rod (662) is fixedly connected to a limiting block (664); A connecting spring (665) is sleeved on the outside of the connecting rod (662), one end of the connecting spring (665) is fixedly connected to the connecting sleeve (661), and the other end of the connecting spring (665) is connected to a pressure sensor (666), and the pressure sensor (666) is installed on the connecting plate (663).

2. The silicon wafer cleaning device for solar cell production according to claim 1, characterized in that: The clamping and positioning mechanism (4) comprises a support shell (41) installed at the bottom of the movable telescopic mechanism (3), a bidirectional threaded screw (42) is installed inside the support shell (41), and a driving motor (43) for driving the bidirectional threaded screw (42) is installed at one end of the outer side of the support shell (41); The outer side of the bidirectional threaded screw (42) is threadedly sleeved with two movable sleeves (44), the two movable sleeves (44) slide through the bottom of the support shell (41), and clamping plates (45) are fixedly installed at the bottom of the two movable sleeves (44), and the two clamping plates (45) are used to clamp the silicon wafer support mechanism (5).

3. The silicon wafer cleaning device for solar cell production according to claim 2, characterized in that: The guide mechanism (9) comprises guide blocks (91) installed on both sides of the first spray frame (51) and the second spray frame (52), and the clamping plate (45) is provided with a guide groove (451) at a position corresponding to the guide block (91).

4. The silicon wafer cleaning device for solar cell production according to claim 3, characterized in that: The linkage mechanism (56) comprises a first connecting rod (561) and a second connecting rod (562) which are located in the middle of the support frame (55) and are respectively sleeved on the outside of the first rotating shaft (58) or the second rotating shaft (59); One end of the first connecting rod (561) is fixedly connected to the first rotating shaft (58) or the second rotating shaft (59), and the second connecting rod (562) is slidably sleeved on the outside of the first rotating shaft (58) or the second rotating shaft (59); A third connecting support rod (563) and a fourth connecting support rod (564), wherein a plurality of the third connecting support rods (563) and the fourth connecting support rod (564) are provided, and the plurality of third connecting support rods (563) and the fourth connecting support rods (564) are cross-distributed in pairs, a synchronization shaft (565) is rotatably connected between the cross-distributed third connecting support rods (563) and the fourth connecting support rods (564), adjacent third connecting support rods (563) and the fourth connecting support rod (564) are hinged by a pin, and the third connecting support rod (563) and the fourth connecting support rod (564) near the first connecting support rod (561) and the second connecting support rod (562) are hinged by a pin; The tops of the plurality of synchronization shafts (565) all pass through the top opening of the support frame (55), and the tops of the plurality of synchronization shafts (565) are rotatably connected with synchronization blocks (566), and the plurality of synchronization blocks (566) are respectively fixedly mounted on the bottom of the placement frame (57).

5. The silicon wafer cleaning device for solar cell production according to claim 4, characterized in that: The rotating mechanism (7) comprises a first rotating gear (71) and a second rotating gear (72) which are respectively fixedly sleeved on the outside of the first rotating shaft (58) and the second rotating shaft (59), and the first rotating gear (71) is meshingly connected with the second rotating gear (72); A positioning shaft (73) is fixedly mounted on the top of the first rotating gear (71), and a worm wheel (74) is fixedly connected to the top of the positioning shaft (73), and a worm (75) is meshingly connected to the outer side of the worm wheel (74); A fixing frame (76) for supporting the worm (75) is installed on the supporting frame (55), and a rotating shaft (77) is installed at one end of the fixing frame (76); One end of the rotating shaft (77) is fixedly connected to the worm (75), and one end of the rotating shaft (77) located outside the fixing frame (76) is fixedly connected to a transmission gear (78), and the transmission gear (78) is connected to the driving mechanism (8).

6. The silicon wafer cleaning device for solar cell production according to claim 5, characterized in that: The driving mechanism (8) comprises a support rod (81) fixedly mounted on the bottom of the support shell (41), a guide rack (82) fixedly mounted on the bottom of the support rod (81), and the guide rack (82) is meshingly connected with the transmission gear (78).

7. The silicon wafer cleaning device for solar cell production according to claim 6, characterized in that: The transfer shell (54) is provided with through holes communicating with the first spray frame (51) and the second spray frame (52), respectively, and the first spray frame (51) and the second spray frame (52) are hollow cavities inside, and the first spray frame (51) and the second spray frame (52) are provided with a plurality of spray holes inside.

Images