Robotic Arm Testing Method, Device, Electronic Device and Storage Medium

Abstract

The present invention discloses a method, device, electronic device and storage medium for testing a robotic arm, relating to the technical field of robotic arms. The method includes: when the current robotic arm is carrying a wafer, obtaining the current single telescopic offset of the current robotic arm and a first preset single telescopic offset; comparing the current single telescopic offset with the first preset single telescopic offset; when the current single telescopic offset is less than the first preset single telescopic offset, determining that the current stable state of the current robotic arm is that the current robotic arm is stable; when the current single telescopic offset is greater than or equal to the first preset single telescopic offset, determining that the current stable state of the current robotic arm is that the current robotic arm is unstable. The technical solution of the embodiments of the present invention realizes the stability detection of the robotic arm, thereby ensuring the quality of semiconductor products produced using wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of robotic arms, and in particular to a robotic arm testing method, device, electronic equipment and storage medium. Background Art

[0002] Wafers are the basic materials for manufacturing various semiconductor products, and their quality directly affects the performance and reliability of semiconductor wafers. Semiconductor wafers are widely used in computers, communications, consumer electronics, automotive electronics, aerospace and other fields, and are the cornerstone of modern electronic products. In the process of producing semiconductor products, wafers are usually handled by robotic arms. Therefore, the stability of the robotic arm will directly affect the quality of semiconductor products produced using wafers. At present, there is a lack of such a method for detecting the stability of the robotic arm, which needs to be solved urgently. Summary of the invention

[0003] The present invention provides a mechanical arm testing method, device, electronic equipment and storage medium, which realize the stability detection of the mechanical arm, thereby ensuring the quality of semiconductor products produced by using wafers.

[0004] According to one aspect of the present invention, a method for testing a robotic arm is provided, the method comprising:

[0005] When the current robot arm is carrying the wafer, obtaining a current single telescopic offset and a first preset single telescopic offset of the current robot arm;

[0006] comparing the current single telescopic offset with the first preset single telescopic offset;

[0007] When the current single telescopic offset is less than a first preset single telescopic offset, determining that the current stable state of the current mechanical arm is that the current mechanical arm is stable;

[0008] When the current single telescopic offset is greater than or equal to a first preset single telescopic offset, it is determined that the current stable state of the current robotic arm is that the current robotic arm is unstable.

[0009] According to another aspect of the present invention, a mechanical arm testing device is provided, the device comprising:

[0010] A current telescopic offset acquisition module, used to acquire a current telescopic offset and a first preset telescopic offset of the current robotic arm when the current robotic arm is carrying the wafer;

[0011] a current telescopic offset comparison module, configured to compare the current telescopic offset with the first preset telescopic offset;

[0012] The first current stable state determination module is configured to determine that the current stable state of the current robotic arm is stable when the current telescopic offset is less than the first preset telescopic offset;

[0013] The second current stable state determination module is configured to determine that the current stable state of the current robotic arm is unstable when the current telescopic offset is greater than or equal to the first preset telescopic offset.

[0014] According to another aspect of the present invention, there is provided an electronic device, which includes:

[0015] At least one processor; and

[0016] A memory communicatively connected to the at least one processor; wherein,

[0017] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the robotic arm testing method according to any embodiment of the present invention.

[0018] According to another aspect of the present invention, there is provided a computer-readable storage medium storing computer instructions for causing a processor to implement the robotic arm testing method according to any embodiment of the present invention when executed.

[0019] According to another aspect of the present invention, there is provided a computer program product including a computer program which, when executed by a processor, implements the robotic arm testing method according to any embodiment of the present invention.

[0020] In the technical solution of the embodiment of the present invention, when the current robotic arm transports a wafer, by comparing the current single telescopic offset with the first preset single telescopic offset, according to the comparison result, the current stable state of the current robotic arm is determined. While the robotic arm transports the wafer, the stability detection of the robotic arm is realized, thereby ensuring the quality of the semiconductor products produced using the wafer; at the same time, by comparing the current single telescopic offset with the first preset single telescopic offset, the detection process of the robotic arm stability detection is simplified, and the detection efficiency of the robotic arm stability detection is improved.

[0021] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0023] Figure 1 is a flowchart of a robotic arm testing method provided in Embodiment 1 of the present invention;

[0024] Figure 2 is a flowchart of a robotic arm testing method provided in Embodiment 2 of the present invention;

[0025] Figure 3 is a schematic structural diagram of a GUI interface provided in Embodiment 3 of the present invention;

[0026] Figure 4 is a schematic interface diagram of a pie chart of robotic arm offset provided in Embodiment 3 of the present invention;

[0027] Figure 5 is a schematic diagram of the principle of the Pythagorean theorem provided in Embodiment 3 of the present invention;

[0028] Figure 6 is a schematic interface diagram of a line chart of robotic arm offset provided in Embodiment 3 of the present invention;

[0029] Figure 7 is a flowchart of a method for displaying offset data of a robotic arm provided in Embodiment 3 of the present invention;

[0030] Figure 8 is a schematic structural diagram of a robotic arm testing device provided in Embodiment 4 of the present invention;

[0031] Figure 9 is a schematic structural diagram of an electronic device for implementing the robotic arm testing method of the embodiments of the present invention. Detailed implementation manners

[0032] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] It should be noted that the terms "first", "second", etc. in the description, claims and the above drawings of the present invention are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0034] Embodiment 1

[0035] Figure 1 The figure is a flowchart of a robotic arm testing method provided in Embodiment 1 of the present invention. The embodiments of the present invention are applicable to the situation where the robotic arm is tested while the robotic arm transports wafers. This method can be executed by a robotic arm testing device, which can be implemented in the form of hardware and / or software. The robotic arm testing device can be configured in an electronic device with the function of testing the robotic arm, such as a client or a server.

[0036] See Figure 1 The robotic arm testing method shown in the figure includes:

[0037] S110. When the current robotic arm transports wafers, obtain the current single-stretch offset and the first preset single-stretch offset of the current robotic arm.

[0038] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished and sliced, a silicon wafer is formed, that is, a wafer. According to the wafer diameter, it can be divided into specifications such as 4 inches, 5 inches, 6 inches and 8 inches. In recent years, 12 inches have been developed and even larger specifications (such as 14 inches, 15 inches, 16 inches and above 20 inches, etc.) have been researched and developed. After the surface of the wafer is specially treated, it can be used to manufacture various semiconductor devices. The wafer is the basic material for manufacturing various semiconductor products, and its quality directly affects the performance and reliability of semiconductor chips. Semiconductor wafers are widely used in fields such as computers, communications, consumer electronics, automotive electronics and aerospace, and are the cornerstone of modern electronic products.

[0039] In the process of manufacturing semiconductor products, a robotic arm can be used to transport wafers. For example, in wafer loading and unloading, the robotic arm can be used to pick up wafers from a storage cassette or a conveyor belt and place them in a processing device or a storage device. Another example is that in the wafer alignment process, the robotic arm can be used to accurately place the wafer on the workbench of the processing device to ensure correct positioning and alignment. Another example is that in the wafer inspection and sorting process, the robotic arm can be used to move the wafer into a detection device for quality inspection and classify and sort it according to quality or other attributes. Another example is that in the feeding and discharging process, the robotic arm can be used to take out the processed wafer from the processing device and place it on a conveyor belt or in a storage cassette.

[0040] The current robotic arm can be the robotic arm that is transporting wafers at the current moment. The current single-stretch offset can be the deviation value between the relative displacement between the center position of the handling part of the current robotic arm and the center position of the wafer during a single stretch movement of the current robotic arm when transporting wafers and the actual displacement of the current robotic arm during a single stretch movement. The current single-stretch offset can be used to characterize the handling stability of the current robotic arm. It can be understood that the smaller the current single-stretch offset, the higher the handling stability of the current robotic arm, and the lower the risk of the wafer falling when the current robotic arm transports the wafer; the larger the current single-stretch offset, the lower the handling stability of the current robotic arm, and the higher the risk of the wafer falling when the current robotic arm transports the wafer. The first preset single-stretch offset can be the upper limit value of the deviation value between the relative displacement between the center position of the handling part of the current robotic arm and the center position of the wafer during a single stretch movement of the robotic arm when it is in a stable state and the actual displacement of the current robotic arm during a single stretch movement, which is preset. The first preset single-stretch offset can be used to assist in detecting the stable state of the current robotic arm. Exemplarily, the first preset single-stretch offset can be 20 mm. Optionally, the first preset single-stretch offset can be pre-stored in a database or this device.

[0041] Specifically, when the current robotic arm transports the wafer, a position sensor of the robotic arm can be used to detect the center position of the handling part of the current robotic arm. A position sensor in the area where the wafer is located can be used to detect the center position of the wafer. The relative displacement between the center position of the handling part of the current robotic arm and the center position of the wafer can be calculated. A position sensor of the robotic arm can be used to detect the actual displacement of the current robotic arm during a single stretch movement. The deviation value between the relative displacement and the actual displacement can be calculated to obtain the current single-stretch offset. The first preset single-stretch offset pre-stored in this device can be obtained.

[0042] S120. Compare the current single-stretch offset with the first preset single-stretch offset.

[0043] S130. When the current single - stroke telescopic offset is less than the first preset single - stroke telescopic offset, determine that the current stable state of the current robotic arm is that the current robotic arm is stable.

[0044] The current stable state can be used to characterize the handling stability of the current robotic arm. Exemplarily, the current stable state can include that the current robotic arm is stable and the current robotic arm is unstable. When the current single - stroke telescopic offset is less than the first preset single - stroke telescopic offset, it can be understood that the handling stability of the current robotic arm is relatively high, and when the current robotic arm transports the wafer, there is no risk of the wafer falling.

[0045] Specifically, when the current single - stroke telescopic offset is less than the first preset single - stroke telescopic offset, it can be determined that the current stable state of the current robotic arm is that the current robotic arm is stable.

[0046] Optionally, after determining that the current stable state of the current robotic arm is that the current robotic arm is stable, it is considered that there is no risk of the wafer falling when the current robotic arm transports the wafer, and the current robotic arm continues to transport the wafer.

[0047] S140. When the current single - stroke telescopic offset is greater than or equal to the first preset single - stroke telescopic offset, determine that the current stable state of the current robotic arm is that the current robotic arm is unstable.

[0048] When the current single - stroke telescopic offset is greater than or equal to the first preset single - stroke telescopic offset, it can be understood that the handling stability of the current robotic arm is relatively low, and when the current robotic arm transports the wafer, there is a risk of the wafer falling.

[0049] Specifically, when the current single - stroke telescopic offset is greater than or equal to the first preset single - stroke telescopic offset, it can be determined that the current stable state of the current robotic arm is that the current robotic arm is unstable.

[0050] In an optional embodiment of the present invention, after determining that the current stable state of the current robotic arm is that the current robotic arm is unstable, it further includes: obtaining the current stable states of at least one other robotic arm belonging to the same current process flow as the current robotic arm; determining the process stable state of the current process flow according to the current stable state of the current robotic arm and the current stable states of the other robotic arms.

[0051] The current process flow can be the process flow to which the current robotic arm belongs. Exemplarily, the current process flow can include any one of cleaning, deposition, engraving, ion implantation, annealing, metallization, and packaging, etc. The same process flow can include at least two robotic arms. The process stable state of the current process flow can be used to characterize the quality stability of the semiconductor products produced by the current process flow.

[0052] Specifically, after determining that the current stable state of the current robotic arm is that the current robotic arm is unstable, the current stable states of at least one other robotic arm belonging to the same current process flow as the current robotic arm can be obtained. The proportion of the current stable states in all the current stable states where the robotic arm is stable among the current stable state of the current robotic arm and the current stable states of each other robotic arm can be calculated to obtain the proportion of the current process flow. The proportion of the current process flow can be compared with the preset proportion of the process flow. When the proportion of the current process flow is greater than or equal to the preset proportion of the process flow, it is determined that the process stable state of the current process flow is that the current process flow is stable; when the proportion of the current process flow is less than the preset proportion of the process flow, it is determined that the process stable state of the current process flow is that the current process flow is unstable.

[0053] After determining that the current stable state of the current robotic arm is that the current robotic arm is unstable, this solution obtains the current stable states of at least one other robotic arm belonging to the same current process flow as the current robotic arm, and determines the process stable state of the current process flow according to the current stable state of the current robotic arm and the current stable states of each other robotic arm, realizing the detection of the process stable state of the current process flow and ensuring the stability of the semiconductor products produced by the current process flow.

[0054] In the technical solution of the embodiment of the present invention, when the current robotic arm transports the wafer, by comparing the current single - stretch offset with the first preset single - stretch offset, according to the comparison result, the current stable state of the current robotic arm is determined. While the robotic arm transports the wafer, the stability detection of the robotic arm is realized, thus ensuring the quality of the semiconductor products produced using the wafer; at the same time, by the way of comparing the current single - stretch offset with the first preset single - stretch offset, the detection process of the robotic arm stability detection is simplified, and the detection efficiency of the robotic arm stability detection is improved.

[0055] Embodiment 2

[0056] Figure 2The flowchart of a robotic arm testing method provided in the second embodiment of the present invention. On the basis of the above embodiment, after determining that the current stable state of the current robotic arm is unstable, the present invention further adds "obtaining a second preset single-stretch offset; wherein, the first preset single-stretch offset is less than the second preset single-stretch offset; comparing the current single-stretch offset with the second preset single-stretch offset; when the current single-stretch offset is less than the second preset single-stretch offset, determining that the current stable degree of the current robotic arm is the first stable degree; when the current single-stretch offset is greater than or equal to the second preset single-stretch offset, determining that the current stable degree of the current robotic arm is the second stable degree". On the basis of detecting the stable state of the robotic arm, the stable degree of the robotic arm is further detected, improving the comprehensiveness and accuracy of the robotic arm stability detection. It should be noted that for the parts not detailed in the embodiments of the present invention, reference may be made to the descriptions of other embodiments.

[0057] See Figure 2 The robotic arm testing method shown in

[0058] S210. When the current robotic arm is handling a wafer, obtain the current single-stretch offset and the first preset single-stretch offset of the current robotic arm.

[0059] S220. Compare the current single-stretch offset with the first preset single-stretch offset.

[0060] S230. When the current single-stretch offset is less than the first preset single-stretch offset, determine that the current stable state of the current robotic arm is stable.

[0061] S240. When the current single-stretch offset is greater than or equal to the first preset single-stretch offset, determine that the current stable state of the current robotic arm is unstable.

[0062] S250. Obtain the second preset single-stretch offset.

[0063] The second preset single-stretch offset can be the upper limit value of the deviation value between the relative displacement between the center position of the handling part of the current robotic arm and the center position of the wafer center and the actual displacement of the current robotic arm during a single-stretch movement when the robotic arm is in the first stable degree, which is preset. The second preset single-stretch offset can be used to assist in detecting the stable degree of the current robotic arm. Exemplarily, the second preset single-stretch offset can be 40 mm. Among them, the first preset single-stretch offset is less than the second preset single-stretch offset. Optionally, the second preset single-stretch offset can be pre-stored in the database or this device.

[0064] Specifically, the second preset single - stretch offset pre - stored in this device can be obtained.

[0065] S260. Compare the current single - stretch offset with the second preset single - stretch offset.

[0066] S270. When the current single - stretch offset is less than the second preset single - stretch offset, determine that the current stability level of the current robotic arm is the first stability level.

[0067] That the current single - stretch offset is less than the second preset single - stretch offset can be understood as that the handling stability of the current robotic arm is relatively low. When the current robotic arm handles the wafer, there is a risk of the wafer falling, and the risk of falling is relatively low. The first stability level can be used to characterize that when the current robotic arm handles the wafer, there is a risk of the wafer falling, and the risk of falling is relatively low.

[0068] Specifically, when the current single - stretch offset is less than the second preset single - stretch offset, it can be determined that the current stability level of the current robotic arm is the first stability level.

[0069] In an optional embodiment of the present invention, after determining that the current stability level of the current robotic arm is the first stability level, it further includes: calculating the current single - correction value of the current robotic arm according to the current single - stretch offset; adjusting the current robotic arm according to the current single - correction value so that the current robotic arm can stably handle the wafer.

[0070] The current single - correction value can be used to correct the current robotic arm.

[0071] Optionally, the current single - stretch offset can be directly determined as the current single - correction value of the current robotic arm. The current robotic arm can be adjusted according to the current single - correction value.

[0072] Optionally, the current single - rotation offset can be obtained. The current single - stretch offset can be directly determined as the current single - stretch correction value of the current robotic arm. The current single - rotation offset can be obtained, and the current single - rotation offset can be directly determined as the current single - rotation correction value of the current robotic arm. The current single - correction value of the current robotic arm is determined according to the current single - stretch correction value and the current single - rotation correction value. The current robotic arm can be adjusted according to the current single - correction value.

[0073] In this solution, after determining that the current stability level of the current robotic arm is the first stability level, the current single - correction value of the current robotic arm is calculated according to the current single - stretch offset, and the current robotic arm is adjusted according to the current single - correction value, which ensures that the current robotic arm can stably handle the wafer subsequently and improves the stability of the current robotic arm in handling the wafer.

[0074] S280. When the current single telescopic offset is greater than or equal to the second preset single telescopic offset, determine that the current stability of the current robotic arm is the second stability level.

[0075] The current single telescopic offset being greater than or equal to the second preset single telescopic offset can be understood as that the handling stability of the current robotic arm is relatively low. When the current robotic arm is handling a wafer, there is a risk of the wafer falling, and the risk of falling is relatively high. The second stability level can be used to characterize that when the current robotic arm is handling a wafer, there is a risk of the wafer falling, and the risk of falling is relatively high. Both the first stability level and the second stability level are the handling stability levels of the robotic arm when there is a risk of the wafer falling when the current robotic arm is handling the wafer. However, the risk of the wafer falling corresponding to the second stability level is higher than the risk of the wafer falling corresponding to the first stability level.

[0076] Specifically, when the current single telescopic offset is greater than or equal to the second preset single telescopic offset, it can be determined that the current stability of the current robotic arm is the second stability level.

[0077] Optionally, the current telescopic offset, the current stability state, and the current stability level of the current robotic arm can be visually displayed. Exemplarily, the time can be used as the abscissa, the current telescopic offset can be used as the ordinate, and the change of the current telescopic offset of the current robotic arm can be displayed in the form of a line chart or a pie chart. While displaying the pie chart, the current stability state and the current stability level can also be displayed in different colors. For example, the current robotic arm can be displayed in white when it is stable; the first stability level of the current robotic arm can be displayed in orange; the second stability level of the current robotic arm can be displayed in red.

[0078] In an optional embodiment of the present invention, after determining that the current stability of the current robotic arm is the second stability level, it further includes: controlling the current robotic arm to stop handling the wafer; obtaining at least two single telescopic offsets of the current robotic arm within the current time period, and detecting the change state of the current telescopic offset of the current robotic arm; when the change state of the current telescopic offset is a growth-type change, determining that the cause of the deviation is robotic arm wear.

[0079] The current stability level of the current robotic arm is the second stability level. It can be understood that when the current robotic arm is carrying wafers, the risk of wafer dropping is relatively high. The current time period can be a preset time period including the current moment. The single telescopic offset of the current robotic arm within the current time period is at least two. It can be understood that within the current time period, the current robotic arm has at least two single telescopic movements, that is, it carries wafers at least twice. The current telescopic offset change state can be used to characterize the change of the single telescopic offset of the current robotic arm. The current telescopic offset change state is a growth-type change. It can be understood that the single telescopic offset of the current robotic arm is getting larger and larger. The reason for the deviation can be the reason for the generation of the single telescopic offset. The wear of the robotic arm can be that there is wear on the components of the robotic arm.

[0080] Specifically, after determining that the current stability level of the current robotic arm is the second stability level, the current robotic arm can be controlled to stop carrying wafers. At least two single telescopic offsets of the current robotic arm within the current time period can be obtained. At the same time, the single telescopic offsets of each current robotic arm can be compared in chronological order. When it is detected that the single telescopic offset of the current robotic arm is getting larger and larger, it is determined that the current telescopic offset change state of the current robotic arm is a growth-type change. At this time, it is determined that the reason for the deviation is the wear of the robotic arm.

[0081] Optionally, after determining that the reason for the deviation is the wear of the robotic arm, the reason for the deviation can be fed back to the robotic arm operation and maintenance party, so that the robotic arm operation and maintenance party can adjust the robotic arm with wear.

[0082] In this solution, after determining that the current stability level of the current robotic arm is the second stability level, the current robotic arm is controlled to stop carrying wafers, avoiding the problem of high dropping risk when carrying wafers when the current robotic arm is unstable, and ensuring the stability of wafer handling; by obtaining the single telescopic offset of each current robotic arm within the current time period and detecting the current telescopic offset change state of the current robotic arm, when the current telescopic offset change state is a growth-type change, it is determined that the reason for the deviation is the wear of the robotic arm. Based on the current telescopic offset change state, the reason for the deviation of the current robotic arm is determined when the current telescopic offset change state is a growth-type change, facilitating subsequent adjustment of the current robotic arm, thereby improving the stability of the current robotic arm in subsequent wafer handling.

[0083] In an alternative embodiment of the present invention, after obtaining the single telescopic offset of at least two current robotic arms within the current time period and detecting the change state of the current telescopic offset of the current robotic arm, the following steps are further included: when the change state of the current telescopic offset is unchanged, obtaining the telescopic offset of the current robotic arm before leaving the factory; comparing the current telescopic offset with the telescopic offset before leaving the factory; when the current telescopic offset is equal to the telescopic offset before leaving the factory, determining that the cause of the deviation is the robotic arm installation reason; when the current telescopic offset is greater than the telescopic offset before leaving the factory, determining that the cause of the deviation is the robotic arm transportation reason.

[0084] The change state of the current telescopic offset being unchanged can be understood as that the single telescopic offsets of the current robotic arm within the current time period are the same. The current telescopic offset being greater than the telescopic offset before leaving the factory can be understood as that the current telescopic offset is larger compared to before leaving the factory. The reason for the robotic arm transportation can be that due to the influence during the transportation process of the robotic arm, the current telescopic offset of the current robotic arm becomes larger. The current telescopic offset being equal to the telescopic offset before leaving the factory can be understood as that the current telescopic offset remains unchanged compared to before leaving the factory. The reason for the robotic arm installation can be that due to reasons such as the tightness of bolts during the installation process of the robotic arm, there is a current telescopic offset of the current robotic arm. The telescopic offset before leaving the factory can be used to represent the deviation value between the relative displacement between the center position of the handling part of the current robotic arm and the center position of the wafer during a single telescopic movement of the current robotic arm when handling the wafer at the time of leaving the factory and the actual displacement of the current robotic arm during a single telescopic movement. The single telescopic offset before leaving the factory can be used to represent the handling stability of the current robotic arm before leaving the factory.

[0085] Specifically, after obtaining the single telescopic offset of at least two current robotic arms within the current time period and detecting the change state of the current telescopic offset of the current robotic arm, when the change state of the current telescopic offset is unchanged, the telescopic offset of the current robotic arm before leaving the factory can be obtained. The current telescopic offset and the telescopic offset before leaving the factory can be compared. When the current telescopic offset is equal to the telescopic offset before leaving the factory, it can be determined that the cause of the deviation is the robotic arm installation reason. When the current telescopic offset is greater than the telescopic offset before leaving the factory, it can be determined that the cause of the deviation is the robotic arm transportation reason.

[0086] This solution obtains the single telescopic offset of at least two current robotic arms within the current time period, and after detecting the change state of the current telescopic offset of the current robotic arm, when the change state of the current telescopic offset is unchanged, the telescopic offset before leaving the factory of the current robotic arm is introduced. By comparing the current telescopic offset with the telescopic offset before leaving the factory, when the current telescopic offset is equal to the telescopic offset before leaving the factory, it is determined that the cause of the deviation is the installation of the robotic arm; when the current telescopic offset is greater than the telescopic offset before leaving the factory, it is determined that the cause of the deviation is the transportation of the robotic arm. This realizes the determination of the cause of the deviation of the current robotic arm when the change state of the current telescopic offset is unchanged, facilitating subsequent adjustment of the current robotic arm, thereby improving the stability of the current robotic arm in subsequent wafer handling.

[0087] The technical solution of the embodiment of the present invention introduces a second preset single telescopic offset. By comparing the current single telescopic offset with the second preset single telescopic offset, the current stability degree of the current robotic arm is determined. On the basis of detecting the stable state of the robotic arm, the detection of the stability degree of the robotic arm is further realized, improving the comprehensiveness and accuracy of the robotic arm stability detection.

[0088] Embodiment III

[0089] A robotic arm is a machine device that can simulate the movements of a human arm, featuring flexibility and high precision. Robotic arms require high stability and precision, so testing the robotic arm is a very important step. The purpose of testing the offset of the robotic arm is to evaluate the stability of the robotic arm, including motion accuracy, trajectory, load capacity, etc. By testing the offset of the robotic arm, the performance indicators of the robotic arm can be understood, providing a basis for subsequent optimization of the robotic arm.

[0090] Existing methods for testing the offset of robotic arms include static testing methods, dynamic testing methods, motion accuracy methods, comparison methods, force control methods, etc. Most of these methods use image processing algorithms to calculate performance indicators such as the speed, acceleration, and motion smoothness of the robotic arm.

[0091] However, in the actual use process, the result evaluation stage for testing the offset of the robotic arm is a relatively complex part. The staff of the machine platform need to evaluate the stability of the robotic arm based on the test results of the robotic arm offset. Then, presenting the data clearly and intuitively can improve the efficiency of evaluating the stability of the robotic arm for the robotic arm operation and maintenance party.

[0092] The collation of the offset data of existing robotic arms is complex and not intuitive. Moreover, if there is a large amount of data that needs to be observed and evaluated, a tool for intuitively presenting a large amount of offset data is required. For the operation and maintenance parties of robotic arms, paying attention to and collecting the offset data of robotic arms in real time helps to observe the stability of robotic arms and optimize the telescopic deviation of robotic arms.

[0093] To solve the problem that it is difficult to display the offset data of the current robotic arm, this solution also improves the presentation method of the offset data of the robotic arm, provides a tool for presenting the offset data of the robotic arm, and achieves the effect of intuitively displaying the data.

[0094] Specifically, the tool of the present invention mainly includes the search and display of the offset data of the robotic arm, which is used to intuitively present the offset data of the robotic arm. As Figure 3 shown, the present invention can provide a GUI (Graphical User Interface) interface, including a robotic arm offset pie chart, a robotic arm offset line chart, a robotic arm process history query method, and a robotic arm process history query result.

[0095] Figure 4 It is a schematic diagram of the interface of the robotic arm offset pie chart. As Figure 4 shown, the T-axis represents the offset of the robotic arm's one-time telescopic movement distance from the center of the wafer circle (i.e., the current telescopic offset), and the R-axis represents the offset of the robotic arm's one-time rotational movement distance from the center of the wafer circle (i.e., the current rotational offset). As Figure 5 shown, the offset data of the robotic arm for one time can be obtained by calculating the "Pythagorean theorem" for the current telescopic offset and the current rotational offset, that is, the square of the T value plus the square of the R value, and this data can be reflected on the pie chart through the "+" icon. Optionally, the "Update Data" button can be clicked to update the pie chart of the offset data of the robotic arm, and the position of the corresponding "+" icon will change accordingly. The "Clear Data" button can also be clicked to clear the pie chart of the offset data of the robotic arm in one key.

[0096] Figure 6 It is a schematic diagram of the interface of the robotic arm offset line chart. As Figure 6 shown, the horizontal axis represents the movement time of the robotic arm, and the vertical axis represents the current telescopic offset of the robotic arm. Different colors in the line chart can correspond to different robotic arms.

[0097] A method for querying the process history of a robotic arm can be defined. Specifically, first, the target module in which the robotic arm operates can be selected, and then the operation time period can be selected. After that, the historical process information of the robotic arm can be retrieved by choosing either "According to Batch" or "According to Menu". Among them, "According to Batch" is to query the offset data of the corresponding robotic arm based on the wafer batch information, while "According to Menu" is to display the offset data of the robotic arm according to the menu of the process flow. Click the query button to search for the data. Exemplarily, the process flow can include steps such as cleaning, deposition, etching, ion implantation, annealing, metallization, and packaging. Optionally, the same batch corresponds to the same robotic arm. The same process flow corresponds to at least two robotic arms. Thus, the reliability, consistency, and excellent performance of the produced semiconductor products can be ensured.

[0098] The query results of the robotic arm process history can be retrieved. Specifically, the process history table information within a certain time period can be queried. The checkbox in the first column can indicate whether to display the offset data of the robotic arm in this process history in the line chart. By checking the checkbox, the historical offset data of the robotic arm can be queried in the line chart; by checking multiple pieces of historical process information, the offset situation of the robotic arm during the historical process can be clearly displayed. The information in the second column can be the batch information of the process history previously performed by the machine tool. The third column can indicate the line color presented by the currently queried offset data in the line chart.

[0099] Figure 7 It is a flowchart of a method for displaying the offset data of a robotic arm. Refer to Figure 7 The method for displaying the offset data of the robotic arm shown, includes:

[0100] S710, Data acquisition.

[0101] Specifically, the central position of the handling part of the robotic arm, the center position of the wafer, and the actual displacement of the current robotic arm during a telescopic movement can be obtained through serial communication. Exemplarily, after the client sends a request, the server starts to receive, process, and return the request to the UI (User Interface). For example, the offset data of the robotic arm can be fed back to the GUI (Graphical User Interface) through the server.

[0102] S720, Data conversion.

[0103] Specifically, the offset data of the robotic arm fed back by the server can be calculated. For example, the relative displacement between the central position of the handling part of the current robotic arm and the center position of the wafer can be calculated. The deviation value between the relative displacement and the actual displacement can be calculated to obtain the current single - telescopic offset. Correspondingly, the current single - rotation offset can also be calculated.

[0104] S730, Pythagorean theorem.

[0105] Specifically, the offset data from the robotic arm to the center of the wafer can be calculated by using the "Pythagorean theorem" for the current single telescopic offset and the current single rotational offset.

[0106] S740, Image generation.

[0107] Specifically, the Sci Chart (big data reporting plugin) integration method can be adopted to convert the offset data from the robotic arm to the center of the wafer into image points in a pie chart or a line chart.

[0108] S750, Image presentation.

[0109] Specifically, the result of image generation can be presented on the GUI, showing a pie chart, a line chart, etc.

[0110] The pie chart in this solution can intuitively display the offset information of a single movement of the robotic arm; the line chart can intuitively display the offset information of the robotic arm movement over a period of time; through different methods of querying the offset of the robotic arm, the way of querying data can be simplified; through querying the process history of the robotic arm, the historical process information can be intuitively displayed.

[0111] Embodiment 4

[0112] Figure 8 FIG. is a schematic structural diagram of a robotic arm testing device provided in Embodiment 4 of the present invention. The embodiment of the present invention is applicable to the situation where the robotic arm is tested while the robotic arm transports the wafer. The device can execute the robotic arm testing method. The device can be implemented in the form of hardware and / or software. The device can be configured in an electronic device with a robotic arm testing function, such as a client or a server.

[0113] See Figure 8The shown robotic arm testing device includes: a current telescopic offset acquisition module 810, a current telescopic offset comparison module 820, a first current stable state determination module 830, and a second current stable state determination module 840. Among them, the current telescopic offset acquisition module 810 is used to acquire the current telescopic offset and a first preset telescopic offset of the current robotic arm when the current robotic arm transports a wafer; the current telescopic offset comparison module 820 is used to compare the current telescopic offset with the first preset telescopic offset; the first current stable state determination module 830 is used to determine that the current stable state of the current robotic arm is stable when the current telescopic offset is less than the first preset telescopic offset; the second current stable state determination module 840 is used to determine that the current stable state of the current robotic arm is unstable when the current telescopic offset is greater than or equal to the first preset telescopic offset.

[0114] The technical solution of the embodiment of the present invention, when the current robotic arm transports a wafer, by comparing the current single - telescopic offset with the first preset single - telescopic offset, according to the comparison result, determines the current stable state of the current robotic arm, and realizes the stability detection of the robotic arm while the robotic arm transports the wafer, thereby ensuring the quality of the semiconductor products produced using the wafer; at the same time, by comparing the current single - telescopic offset with the first preset single - telescopic offset, simplifies the detection process of the robotic arm stability detection and improves the detection efficiency of the robotic arm stability detection.

[0115] In an alternative embodiment of the present invention, the device further includes: a second preset single - telescopic offset acquisition module, which is used to acquire a second preset single - telescopic offset after determining that the current stable state of the current robotic arm is unstable for the current robotic arm; where the first preset single - telescopic offset is less than the second preset single - telescopic offset; a second preset single - telescopic offset comparison module, which is used to compare the current single - telescopic offset with the second preset single - telescopic offset; a first stability degree determination module, which is used to determine that the current stability degree of the current robotic arm is the first stability degree when the current single - telescopic offset is less than the second preset single - telescopic offset; a second stability degree determination module, which is used to determine that the current stability degree of the current robotic arm is the second stability degree when the current single - telescopic offset is greater than or equal to the second preset single - telescopic offset.

[0116] In an alternative embodiment of the present invention, the device further includes: a current single - correction value calculation module, which is used to calculate the current single - correction value of the current robotic arm according to the current single - telescopic offset after determining that the current stability degree of the current robotic arm is the first stability degree; a current robotic arm adjustment module, which is used to adjust the current robotic arm according to the current single - correction value so that the current robotic arm can stably transport the wafer.

[0117] In an alternative embodiment of the present invention, the device further includes: a wafer handling stop module, configured to control the current robotic arm to stop handling wafers after determining that the current stability level of the current robotic arm is the second stability level; a current telescopic offset change state detection module, configured to obtain the single telescopic offset of at least two current robotic arms within the current time period, and detect the current telescopic offset change state of the current robotic arm; a first deviation cause determination module, configured to determine that the cause of the deviation is robotic arm wear when the current telescopic offset change state is a growing change.

[0118] In an alternative embodiment of the present invention, the device further includes: a pre-factory telescopic offset acquisition module, configured to obtain the pre-factory telescopic offset of the current robotic arm when the current telescopic offset change state is unchanged after obtaining the single telescopic offset of at least two current robotic arms within the current time period and detecting the current telescopic offset change state of the current robotic arm; a pre-factory telescopic offset comparison module, configured to compare the current telescopic offset with the pre-factory telescopic offset; a second deviation cause determination module, configured to determine that the cause of the deviation is robotic arm installation reason when the current telescopic offset is equal to the pre-factory telescopic offset; a third deviation cause determination module, configured to determine that the cause of the deviation is robotic arm transportation reason when the current telescopic offset is greater than the pre-factory telescopic offset.

[0119] In an alternative embodiment of the present invention, the device further includes: an other current stability state acquisition module, configured to obtain the current stability state of at least one other robotic arm belonging to the same current process flow as the current robotic arm after determining that the current stability state of the current robotic arm is unstable; a process stability state determination module, configured to determine the process stability state of the current process flow according to the current stability state of the current robotic arm and the current stability states of the other robotic arms.

[0120] The robotic arm testing device provided by the embodiments of the present invention can execute the robotic arm testing method provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing the method.

[0121] In the technical solution of the embodiments of the present invention, the acquisition, storage, and application of the current single telescopic offset, the first preset single telescopic offset, the second preset single telescopic offset, the single telescopic offsets of at least two current robotic arms within the current time period, and the pre-factory telescopic offset of the current robotic arm, etc., all comply with the provisions of relevant laws and regulations and do not violate public order and good customs.

[0122] Embodiment Five

[0123] Figure 9The structural schematic diagram of an electronic device 900 that can be used to implement the embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0124] As Figure 9 shown, the electronic device 900 includes at least one processor 901, and a memory communicatively connected to the at least one processor 901, such as read-only memory (ROM) 902, random access memory (RAM) 903, etc. Among them, the memory stores a computer program executable by the at least one processor. The processor 901 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 902 or the computer program loaded from the storage unit 908 into the random access memory (RAM) 903. In the RAM 903, various programs and data required for the operation of the electronic device 900 can also be stored. The processor 901, the ROM 902, and the RAM 903 are connected to each other through a bus 904. The input / output (I / O) interface 905 is also connected to the bus 904.

[0125] Multiple components in the electronic device 900 are connected to the I / O interface 905, including: an input unit 906, such as a keyboard, a mouse, etc.; an output unit 907, such as various types of displays, speakers, etc.; a storage unit 908, such as a magnetic disk, an optical disc, etc.; and a communication unit 909, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 909 allows the electronic device 900 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0126] The processor 901 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the processor 901 include but are not limited to a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 901 executes the various methods and processes described above, such as the robotic arm test method.

[0127] In some embodiments, the robotic arm testing method can be implemented as a computer program tangibly embodied in a computer-readable storage medium, such as storage unit 908. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 900 via the ROM 902 and / or the communication unit 909. When the computer program is loaded into the RAM 903 and executed by the processor 901, one or more steps of the robotic arm testing method described above can be performed. Alternatively, in other embodiments, the processor 901 can be configured to execute the robotic arm testing method by any other suitable means (e.g., by means of firmware).

[0128] The various embodiments of the systems and techniques described above in this document can be implemented in digital electronic circuitry, integrated circuit systems, field programmable gate arrays (FPGA), application specific integrated circuits (ASIC), application specific standard products (ASSP), systems on a chip (SOC), complex programmable logic devices (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special-purpose or general-purpose programmable processor that receives data and instructions from a storage system, at least one input device, and at least one output device, and transmits the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0129] The computer programs for implementing the methods of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer programs are executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer programs can be executed entirely on the machine, partially on the machine, as a stand-alone software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0130] In the context of the present invention, a computer-readable storage medium can be a tangible medium that can contain or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer-readable storage medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, the computer-readable storage medium can be a machine-readable signal medium. More specific examples of the machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0131] In order to provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the electronic device. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0132] The systems and techniques described herein can be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: local area network (LAN), wide area network (WAN), blockchain network, and the Internet.

[0133] A computing system may include a client and a server. The client and the server are generally far from each other and usually interact via a communication network. The relationship between the client and the server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or a cloud host, which is a host product in the cloud computing service system, and solves the defects of difficult management and weak business scalability existing in traditional physical hosts and VPS (Virtual Private Server) services.

[0134] It should be understood that various forms of processes shown above can be used, steps can be reordered, added or deleted. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and no limitation is made herein.

[0135] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A robotic arm testing method, characterized in that, The method includes: When the current robotic arm is handling a wafer, obtaining the current single - stroke offset of the current robotic arm and a first preset single - stroke offset; Comparing the current single - stroke offset with the first preset single - stroke offset; When the current single - stroke offset is less than the first preset single - stroke offset, determining that the current stable state of the current robotic arm is that the current robotic arm is stable; When the current single - stroke offset is greater than or equal to the first preset single - stroke offset, determining that the current stable state of the current robotic arm is that the current robotic arm is unstable; Obtaining a second preset single - stroke offset; wherein, the first preset single - stroke offset is less than the second preset single - stroke offset; Comparing the current single - stroke offset with the second preset single - stroke offset; When the current single - stroke offset is less than the second preset single - stroke offset, determining that the current stability level of the current robotic arm is the first stability level; When the current single - stroke offset is greater than or equal to the second preset single - stroke offset, determining that the current stability level of the current robotic arm is the second stability level.

2. The method according to claim 1, wherein After determining that the current stability level of the current robotic arm is the first stability level, it further includes: Calculating a current single - stroke correction value of the current robotic arm according to the current single - stroke offset; Adjusting the current robotic arm according to the current single - stroke correction value so that the current robotic arm can handle the wafer stably.

3. The method according to claim 1, wherein After determining that the current stability level of the current robotic arm is the second stability level, it further includes: Controlling the current robotic arm to stop handling the wafer; Obtaining the single - stroke offsets of at least two current robotic arms within the current time period and detecting the change state of the current stroke offset of the current robotic arm; When the change state of the current stroke offset is an increasing change, determining that the cause of the deviation is robotic arm wear.

4. The method according to claim 3, characterized in that After obtaining the single - stroke offsets of at least two current robotic arms within the current time period and detecting the change state of the current stroke offset of the current robotic arm, it further includes: When the change state of the current stroke offset is no change, obtaining the pre - factory stroke offset of the current robotic arm before leaving the factory; Comparing the current single - stroke offset with the pre - factory stroke offset; When the current single - stroke offset is equal to the pre - factory stroke offset, determining that the cause of the deviation is the robotic arm installation reason; When the current single - stroke offset is greater than the pre - factory stroke offset, determining that the cause of the deviation is the robotic arm transportation reason.

5. The method according to claim 1, characterized in that, After determining that the current stable state of the current robotic arm is that the current robotic arm is unstable, it further includes: Obtaining the current stable states of at least one other robotic arm belonging to the same current process flow as the current robotic arm; Calculating the proportion of the current stable state of the robotic arm being stable among the current stable states of the current robotic arm and each of the other robotic arms to obtain the proportion of the current process flow. Compare the current process flow ratio with the preset process flow ratio; When the current process flow ratio is greater than or equal to the preset process flow ratio, determine that the process stable state of the current process flow is that the current process flow is stable; When the current process flow ratio is less than the preset process flow ratio, determine that the process stable state of the current process flow is that the current process flow is unstable.

6. A robotic arm testing device, characterized in that, The device includes: A current telescopic offset acquisition module, configured to acquire the current single - telescopic offset and the first preset single - telescopic offset of the current robotic arm when the current robotic arm transports a wafer; A current telescopic offset comparison module, configured to compare the current single - telescopic offset with the first preset single - telescopic offset; A first current stable state determination module, configured to determine that the current stable state of the current robotic arm is stable when the current single - telescopic offset is less than the first preset single - telescopic offset; A second current stable state determination module, configured to determine that the current stable state of the current robotic arm is unstable when the current single - telescopic offset is greater than or equal to the first preset single - telescopic offset; A second preset single - telescopic offset acquisition module, configured to acquire a second preset single - telescopic offset; wherein, the first preset single - telescopic offset is less than the second preset single - telescopic offset; A second preset single - telescopic offset comparison module, configured to compare the current single - telescopic offset with the second preset single - telescopic offset; A first stability degree determination module, configured to determine that the current stability degree of the current robotic arm is the first stability degree when the current single - telescopic offset is less than the second preset single - telescopic offset; A second stability degree determination module, configured to determine that the current stability degree of the current robotic arm is the second stability degree when the current single - telescopic offset is greater than or equal to the second preset single - telescopic offset.

7. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and when the computer program is executed by the at least one processor, the at least one processor is enabled to execute the robotic arm testing method according to any one of claims 1 - 5.

8. A computer-readable storage medium, characterized in that, The computer - readable storage medium stores computer instructions, and when the computer instructions are executed by a processor, the robotic arm testing method according to any one of claims 1 - 5 is implemented.

9. A computer program product, characterized in that, The computer program product includes a computer program, and when the computer program is executed by a processor, the robotic arm testing method according to any one of claims 1 - 5 is implemented.

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