Flexible wiring board with electromagnetic shielding and method for manufacturing the same

Abstract

The present application provides a flexible circuit board with electromagnetic shielding and a manufacturing method thereof. The flexible circuit board includes a first electromagnetic shielding substrate with a first outer groove, a second electromagnetic shielding substrate with a second outer groove and a second inner groove, a circuit substrate with an S-shaped trace, a first cavity between the first electromagnetic shielding substrate and the circuit substrate, a second cavity between the second electromagnetic shielding substrate and the circuit substrate, and a fixing member disposed in the second outer groove. The first electromagnetic shielding substrate and the second electromagnetic shielding substrate can provide electromagnetic shielding and further cooperate with the first cavity and the second cavity to protect the circuit substrate. The fixing member can limit the bending swing of the circuit substrate.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a flexible circuit board, and particularly to a flexible circuit board with electromagnetic shielding and a manufacturing method thereof. BACKGROUND

[0002] Currently, the transmission line of coaxial cable type has the problems of occupying space and being not easy to bend, so it is not suitable for being arranged at the folding position of a folding mobile phone. Although the transmission line of the flexible strip line type can improve the problems of the transmission line of the coaxial cable type, the folding mobile phone will generate sliding friction during opening and folding, and the bending angle of the transmission line of the strip line type is not fixed, so the transmission line of the strip line type is easily squeezed and damaged at the bending position, resulting in the service life of the transmission line of the strip line type being reduced. SUMMARY

[0003] Therefore, an object of the present disclosure is to provide a flexible circuit board with electromagnetic shielding and a manufacturing method thereof, thereby improving the service life.

[0004] In order to achieve the above-mentioned object, the present disclosure provides a flexible circuit board with electromagnetic shielding. The flexible circuit board with electromagnetic shielding includes a first electromagnetic shielding substrate, a second electromagnetic shielding substrate, a circuit substrate, a first cavity, a second cavity, and a plurality of fixing members. The first electromagnetic shielding substrate has a plurality of parallel first outer grooves. The second electromagnetic shielding substrate has a plurality of parallel second outer grooves and a plurality of parallel second inner grooves. The circuit substrate is arranged between the first electromagnetic shielding substrate and the second electromagnetic shielding substrate, and includes a bending portion and two body portions. The bending portion is between the body portions, and the bending portion includes an S-shaped trace and has opposite first and second surfaces. The first surface faces the first outer grooves, and the second surface faces the second electromagnetic shielding substrate. The first cavity is between the first electromagnetic shielding substrate and the circuit substrate, and communicates with the first outer grooves. The second cavity is between the second electromagnetic shielding substrate and the circuit substrate, and communicates with the second inner grooves. The fixing members are arranged in the second outer grooves, respectively. The bending portion is adapted to bend along an axis, and the first outer grooves and the second outer grooves extend along the axis. After the bending portion is bent, the first surface is a concave curved surface, and the second surface is a convex curved surface.

[0005] In at least one embodiment of the present disclosure, the first electromagnetic shielding substrate includes a first dielectric layer and a first shielding layer. The first shielding layer is between the first dielectric layer and the first surface, the first shielding layer faces the first surface, and the first shielding layer has the first outer grooves.

[0006] In at least one embodiment of the present application, the second electromagnetic shielding substrate includes a second dielectric layer and a second shielding layer. The second shielding layer is between the second dielectric layer and the second surface, the second shielding layer faces the second surface, and the second shielding layer has the second inner grooves.

[0007] In at least one embodiment of the present application, the first shielding layer and the second shielding layer both include a metal mesh structure, the second inner grooves extend to the second dielectric layer, and the number of the second outer grooves is greater than the number of the second inner grooves.

[0008] In at least one embodiment of the present application, the flexible circuit board further includes two adhesive layers. The adhesive layers respectively bond the first electromagnetic shielding substrate and the circuit substrate, and bond the second electromagnetic shielding substrate and the circuit substrate.

[0009] According to the above object of the present application, a manufacturing method of a flexible circuit board with electromagnetic shielding is provided. The method includes providing a first electromagnetic shielding substrate, a second electromagnetic shielding substrate, and a circuit substrate; bonding the first electromagnetic shielding substrate and the second electromagnetic shielding substrate to the circuit substrate to form a first cavity between the first electromagnetic shielding substrate and the circuit substrate, and to form a second cavity between the second electromagnetic shielding substrate and the circuit substrate; after the first electromagnetic shielding substrate and the second electromagnetic shielding substrate are bonded to the circuit substrate, bending the first electromagnetic shielding substrate, the second electromagnetic shielding substrate, and the circuit substrate, wherein the bent second electromagnetic shielding substrate has a plurality of outer grooves; and filling a curing adhesive into the plurality of outer grooves of the second electromagnetic shielding substrate to form a plurality of fasteners.

[0010] In at least one embodiment of the present application, the manufacturing method of the circuit substrate includes providing a single-sided board including a lower dielectric layer and a metal layer on the lower dielectric layer; patterning the metal layer to form an S-shaped trace; and laminating an upper dielectric layer, the upper dielectric layer bonding the lower dielectric layer to form a dielectric layer covering the S-shaped trace.

[0011] In at least one embodiment of the present application, the manufacturing method of the circuit substrate further includes attaching two adhesive layers to a first surface and a second surface of the dielectric layer.

[0012] In at least one embodiment of the present application, the manufacturing method of the first electromagnetic shielding substrate includes providing a single-sided board including a first dielectric layer, a first metal layer, and a first dielectric pattern layer having a first opening, the first metal layer being between the first dielectric layer and the first dielectric pattern layer; and patterning the first metal layer to expose a portion of the first metal layer in the first opening to form a plurality of parallel first outer grooves, thereby forming a metal mesh structure.

[0013] In at least one embodiment of the present application, the method for manufacturing the second electromagnetic shielding substrate comprises providing a single-sided board including a second dielectric layer, a second metal layer, and a second dielectric pattern layer having a second opening, the second metal layer being between the second dielectric layer and the second dielectric pattern layer; patterning the second metal layer to expose a portion of the second metal layer in the second opening to form a metal mesh structure; and forming a plurality of parallel second inner grooves in the second metal layer and a plurality of parallel second outer grooves in the second dielectric layer.

[0014] Based on the above, the circuit board has an S-shaped trace, which can reduce stress when bending and thus prevent the circuit board from being crushed and damaged, thereby achieving the purpose of protecting the circuit board. The first electromagnetic shielding substrate and the second electromagnetic shielding substrate can provide electromagnetic shielding effect and reduce stress when bending. The circuit board is located between the first electromagnetic shielding substrate and the second electromagnetic shielding substrate and cooperates with the first cavity and the second cavity to protect the circuit board. The arrangement of the fixing member can limit the bending swing of the circuit board. Therefore, the flexible circuit board can limit the bending swing while providing electromagnetic shielding and protection functions. The flexible circuit board can be further applied to a folding mobile phone and reduce the damage degree of sliding friction. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more obvious and easy to understand, the following is a description of the accompanying drawings.

[0016] Figure 1 A cross-sectional view of a flexible circuit board with electromagnetic shielding according to at least one embodiment of the present application is shown.

[0017] Figure 2 A cross-sectional view of a flexible circuit board in Figure 1 when not bent is shown.

[0018] Figure 3 A top plan view of the second electromagnetic shielding substrate in Figure 2 is shown.

[0019] Figure 4 A top plan view of the circuit board in Figure 2 is shown.

[0020] Figures 5A to 5C A cross-sectional view of a method for manufacturing a flexible circuit board in Figure 1 is shown.

[0021] Figure 6A A cross-sectional view of a method for manufacturing a first electromagnetic shielding substrate in Figure 6B is shown. Figure 5A A cross-sectional view of a method for manufacturing a first electromagnetic shielding substrate in is shown.

[0022] Figures 7A to 7C FIG. 1 shows a cross-sectional view of a flexible circuit board with electromagnetic shielding according to an embodiment of the present application. Figure 5A FIG. 2 shows a cross-sectional view of a second electromagnetic shielding substrate manufacturing method according to an embodiment of the present application.

[0023] Figures 8A to 8D FIG. 3 shows a cross-sectional view of a flexible circuit board with electromagnetic shielding according to another embodiment of the present application. Figure 5A FIG. 4 shows a cross-sectional view of a circuit substrate manufacturing method according to an embodiment of the present application. DETAILED DESCRIPTION

[0024] The embodiments of the present application are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable concepts that can be embodied in a wide variety of specific contexts. The embodiments discussed and disclosed are merely for illustrative purposes and are not intended to limit the scope of the present application. For example, the statement "a first feature is formed on a second feature" includes embodiments in which the first feature is in direct contact with the second feature, as well as embodiments in which other features are formed between the first feature and the second feature such that the first feature does not directly contact the second feature.

[0025] In addition, spatially relative terms, such as "beneath", "below", "lower", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0026] FIG. 1 shows a cross-sectional view of a flexible circuit board with electromagnetic shielding according to an embodiment of the present application. Figure 1 and Figure 2 wherein Figure 1 FIG. 1 shows a cross-sectional view of a flexible circuit board with electromagnetic shielding according to an embodiment of the present application. Figure 2 FIG. 2 shows a cross-sectional view of a second electromagnetic shielding substrate manufacturing method according to an embodiment of the present application. Figure 1 and Figure 2 The flexible circuit board 100 includes a first electromagnetic shielding substrate 110, a second electromagnetic shielding substrate 120, a circuit substrate 130, a first cavity 140, a second cavity 150, and a plurality of fasteners 160.

[0027] The first electromagnetic shielding substrate 110 has a plurality of first outer grooves 111. The first electromagnetic shielding substrate 110 includes a first dielectric layer 112 and a first shielding layer 113. The first shielding layer 113 is between the first dielectric layer 112 and the first surface 130fs of the circuit substrate 130. The first shielding layer 113 faces the first surface 130fs of the circuit substrate 130. The first outer grooves 111 are in the first shielding layer 113. In one example, the first shielding layer 113 includes a metal mesh structure 114 and a plurality of circuit structures 115, and the circuit structures 115 are connected on both sides of the metal mesh structure 114. The metal mesh structure 114 corresponds to the bending portion 131 of the circuit substrate 130, and the circuit structures 115 correspond to the body portion 132 of the circuit substrate 130. The metal mesh structure 114 can reduce stress during bending and provide shielding effect, thereby achieving protection and shielding.

[0028] In one example, each of the first outer grooves 111 is a gradually tapered opening pattern. As shown in Figure 2 , the first outer grooves 111 gradually taper upwardly and extend through the first shielding layer 113, and do not extend into the first dielectric layer 112. As shown in Figure 1 , the first outer grooves 111 allow the first electromagnetic shielding substrate 110 to be bent smoothly.

[0029] Referring back to Figure 1 and Figure 2 , the second electromagnetic shielding substrate 120 has a plurality of second outer grooves 121 and a plurality of second inner grooves 122, so that the second electromagnetic shielding substrate 120 can be bent smoothly. The second electromagnetic shielding substrate 120 includes a second dielectric layer 123 and a second shielding layer 124. The second shielding layer 124 is between the second dielectric layer 123 and the second surface 130ss of the circuit substrate 130. The second shielding layer 124 faces the second surface 130ss of the circuit substrate 130, and the second shielding layer 124 has the second inner grooves 122.

[0030] As shown in Figure 1 and Figure 3 , Figure 3 a top view of the second electromagnetic shielding substrate 120 is shown. The second shielding layer 124 includes a metal mesh structure 125 and a plurality of circuit structures 126, and the circuit structures 126 are connected on both sides of the metal mesh structure 125. The metal mesh structure 125 corresponds to the bending portion 131 of the circuit substrate 130, and the circuit structures 126 correspond to the body portion 132 of the circuit substrate 130. The metal mesh structure 125 can reduce stress during bending and provide shielding effect, thereby achieving protection and shielding. In one example, the second inner grooves 122 extend to the second dielectric layer 123.

[0031] AsFigure 2 As shown, the second inner grooves 122 are downwardly tapered and extend through the second shielding layer 124 and into the second dielectric layer 123. In one example, the number of the second outer grooves 121 is greater than the number of the second inner grooves 122 to facilitate the bending of the second electromagnetic shielding substrate 120.

[0032] Referring back to Figure 1 With Figure 2 the circuit substrate 130 is disposed between the first electromagnetic shielding substrate 110 and the second electromagnetic shielding substrate 120, and is protected by the first electromagnetic shielding substrate 110 and the second electromagnetic shielding substrate 120 to provide electromagnetic shielding. In one example, the flexible circuit board 100 includes a plurality of adhesive layers 135. The adhesive layers 135 bond the first electromagnetic shielding substrate 110 to the circuit substrate 130 and bond the second electromagnetic shielding substrate 120 to the circuit substrate 130. In one example, the adhesive layers 135 do not completely cover the first surface 130fs and the second surface 130ss. As shown, Figure 1 the adhesive layers 135 do not cover the bending portion 131 of the circuit substrate 130.

[0033] As shown, Figure 2 the circuit substrate 130 includes a bending portion 131 and two body portions 132. The bending portion 131 is disposed between the body portions 132. As shown, Figure 4 a top plan view of the circuit substrate 130. The bending portion 131 includes an S-shaped trace 133. The S-shaped trace 133 reduces stress during bending, thereby avoiding damage from bending and improving the service life.

[0034] Referring back to Figure 2 the bending portion 131 has a first surface 130fs and a second surface 130ss facing away from each other, wherein the first surface 130fs faces the first outer grooves 111 of the first electromagnetic shielding substrate 110 and the second surface 130ss faces the second inner grooves 122 of the second electromagnetic shielding substrate 120. In one example, the circuit substrate 130 includes a dielectric layer 134. The dielectric layer 134 covers the S-shaped trace 133, i.e., the S-shaped trace 133 is not exposed outside the dielectric layer 134. As shown, Figure 1 the bending portion 131 is adapted to bend along an axis L, and the first outer grooves 111 and the second outer grooves 121 extend along the axis L. As shown, Figure 2 after the bending portion 131 is bent, the first surface 130fs is a concave surface and the second surface 130ss is a convex surface.

[0035] Referring back to Figure 1 With Figure 2The first cavity 140 is located between the first electromagnetic shielding substrate 110 and the circuit substrate 130, and is in communication with the first outer groove 111. When the flexible circuit board 100 is bent, the first cavity 140 can provide space to accommodate the deformed first electromagnetic shielding substrate 110, so that the deformed first electromagnetic shielding substrate 110 does not press the circuit substrate 130, thereby achieving the effect of protecting the circuit substrate 130 when bent.

[0036] Referring back to Figure 1 and Figure 2 , the second cavity 150 is located between the second electromagnetic shielding substrate 120 and the circuit substrate 130, and is in communication with the second inner groove 122. When the flexible circuit board 100 is bent, the second cavity 150 can provide space to accommodate the deformed second electromagnetic shielding substrate 120, so that the deformed second electromagnetic shielding substrate 120 does not press the circuit substrate 130, thereby achieving the effect of protecting the circuit substrate 130 when bent.

[0037] Referring back to Figure 1 , the fixing member 160 is arranged in the second outer groove 121, respectively, to limit the bending angle of the second electromagnetic shielding substrate 120. That is, the second electromagnetic shielding substrate 120 can maintain a proper bending angle to limit the bending swing of the circuit substrate 130. In an example, the fixing member 160 arranged in the second outer groove 121 can limit the bending swing of the circuit substrate 130 to 45°±15°.

[0038] Referring back to Figures 5A to 5C , a cross-sectional view of a manufacturing method of a flexible circuit board 100 with electromagnetic shielding according to at least one embodiment of the present application is shown. As shown in Figure 5A , first, the first electromagnetic shielding substrate 110, the second electromagnetic shielding substrate 120, and the circuit substrate 130 are provided.

[0039] Then, as shown in Figure 5B , the first electromagnetic shielding substrate 110 and the second electromagnetic shielding substrate 120 are combined with the circuit substrate 130, that is, the adhesive layer 135 of the circuit substrate 130 is used to bond the first electromagnetic shielding substrate 110 and the second electromagnetic shielding substrate 120, respectively, to form the first cavity 140 between the first electromagnetic shielding substrate 110 and the circuit substrate 130, and to form the second cavity 150 between the second electromagnetic shielding substrate 120 and the circuit substrate 130.

[0040] Then, as shown in Figure 5C , then, the first electromagnetic shielding substrate 110, the second electromagnetic shielding substrate 120, and the circuit substrate 130 are bent, and the curing glue is filled into the second electromagnetic shielding substrate 120. After the curing glue is cured, the fixing member 160 is formed. The fixing member 160 can fix the bending angle of the second electromagnetic shielding substrate 120 within a specific swing range, for example, 45°±15°.

[0041] Referring to Figure 6A with Figure 6B FIG. 1A illustrates a cross-sectional view of a first electromagnetic shielding substrate 110 manufacturing method according to at least one embodiment of the present disclosure. As shown in FIG. 1A, a single panel 116 is provided. The single panel 116 includes a first dielectric layer 112, a first metal layer 117, and a first dielectric pattern layer 118. The first metal layer 117 is between the first dielectric layer 112 and the first dielectric pattern layer 118. The first dielectric pattern layer 118 has a first opening 118o. Figure 6A Next, as shown in FIG. 1B, the first metal layer 117 is patterned to form a first shielding layer 113. A portion of the first metal layer 117 exposed in the first opening 118o of the first dielectric pattern layer 118 forms a plurality of parallel first inner grooves 111, and a metal mesh structure 114 providing electromagnetic shielding is formed.

[0042] Figure 6B Next, as shown in FIG. 1B, the first metal layer 117 is patterned to form a first shielding layer 113. A portion of the first metal layer 117 exposed in the first opening 118o of the first dielectric pattern layer 118 forms a plurality of parallel first inner grooves 111, and a metal mesh structure 114 providing electromagnetic shielding is formed.

[0043] Referring to Figures 7A to 7C FIG. 2A illustrates a cross-sectional view of a second electromagnetic shielding substrate 120 manufacturing method according to at least one embodiment of the present disclosure. As shown in FIG. 2A, a single panel 127 is provided. The single panel 127 includes a second dielectric layer 123, a second metal layer 128, and a second dielectric pattern layer 129. The second metal layer 128 is between the second dielectric layer 123 and the second dielectric pattern layer 129. The second dielectric pattern layer 129 has a second opening 129o. Figure 7A Next, as shown in FIG. 2B, the second metal layer 128 is patterned to form a second shielding layer 124. A portion of the second metal layer 128 exposed in the second opening 129o of the second dielectric pattern layer 129 forms a plurality of parallel second inner grooves 122, and a metal mesh structure 125 providing electromagnetic shielding is formed.

[0044] Figure 7B Next, as shown in FIG. 2B, the second metal layer 128 is patterned to form a second shielding layer 124. A portion of the second metal layer 128 exposed in the second opening 129o of the second dielectric pattern layer 129 forms a plurality of parallel second inner grooves 122, and a metal mesh structure 125 providing electromagnetic shielding is formed.

[0045] Next, as shown in FIG. 2B, a plurality of parallel second inner grooves 122 are formed in the second metal layer 128, and a plurality of parallel second outer grooves 121 are formed in the second dielectric layer 123. Figure 7C Referring to

[0046] FIG. 3A illustrates a cross-sectional view of a circuit substrate 130 manufacturing method according to at least one embodiment of the present disclosure. As shown in FIG. 3A, a single panel 136 is provided. The single panel 136 includes a lower dielectric layer 137 and a metal layer 138. The metal layer 138 is on the lower dielectric layer 137. Figures 8A to 8D Figure 8A Next, as shown in FIG. 3B, the metal layer 138 is patterned to form an S-shaped trace 133.

[0047] Next, as shown in FIG. 3B, the metal layer 138 is patterned to form an S-shaped trace 133. Figure 8B Next, as shown in FIG. 3B, the metal layer 138 is patterned to form an S-shaped trace 133.

[0048] Figure 8C ​​​​The upper layer dielectric layer 139 is shown to be laminated. The upper layer dielectric layer 139 combines with the lower layer dielectric layer 137 to form a dielectric layer 134 covering the S-shaped trace 133. That is, the S-shaped trace 133 is between the upper layer dielectric layer 139 and the lower layer dielectric layer 137.

[0049] Next, as shown in FIG. 1C, the adhesive layer 135 is attached to the first surface 130fs and the second surface 130ss of the dielectric layer 134. Figure 8D

[0050] From the above embodiments, the S-shaped trace of the circuit board, the metal mesh structure of the first electromagnetic shielding substrate, and the metal mesh structure of the second electromagnetic shielding substrate can reduce stress during bending, provide protection and increase service life. The first electromagnetic shielding substrate and the second electromagnetic shielding substrate are located on opposite sides of the circuit board, and the first electromagnetic shielding substrate and the second electromagnetic shielding substrate are used to protect the circuit board. Furthermore, the first electromagnetic shielding substrate and the second electromagnetic shielding substrate are respectively matched with the first cavity and the second cavity to avoid pressing the circuit board during bending, thereby achieving the purpose of protecting the circuit board. The fixing member can limit the bending swing of the circuit board. Therefore, when the flexible circuit board provides electromagnetic shielding and protection functions, the bending swing can also be limited, so that the flexible circuit board disclosed in the above embodiments can be further applied to folding mobile phones, and the damage degree of sliding friction is reduced.

[0051] Although the present application has been disclosed with the above embodiments, it is not intended to limit the present disclosure, and those skilled in the art can make various modifications and improvements without departing from the spirit and scope of the present disclosure, therefore the protection scope of the present disclosure shall be subject to the appended claims.

[0052]

Symbol Description

[0053] 100: flexible circuit board

[0054] 110: first electromagnetic shielding substrate

[0055] 111: first outer groove

[0056] 112: first dielectric layer

[0057] 113: first shielding layer

[0058] 114: metal mesh structure

[0059] 115: circuit structure

[0060] 116: single-sided board

[0061] 117: first metal layer

[0062] 118: first dielectric pattern layer

[0063] 118o: first opening​

[0064] 120: second electromagnetic shielding substrate

[0065] 121: second outer groove

[0066] 122: second inner groove

[0067] 123: second dielectric layer

[0068] 124: second shielding layer

[0069] 125: metal mesh structure

[0070] 126: circuit structure

[0071] 127: single-sided board

[0072] 128: second metal layer

[0073] 129: second dielectric pattern layer

[0074] 129o: second opening

[0075] 130: circuit substrate

[0076] 130fs: first surface

[0077] 130ss: second surface

[0078] 131: bending portion

[0079] 132: body portion

[0080] 133: S-shaped trace

[0081] 134: dielectric layer

[0082] 135: adhesive layer

[0083] 136: single-sided board

[0084] 137: lower dielectric layer

[0085] 138: metal layer

[0086] 139: upper dielectric layer

[0087] 140: first cavity

[0088] 150: second cavity

[0089] 160: fixing member

[0090] L: axis

Claims

1. A flexible circuit board with electromagnetic shielding, characterized in that... The flexible circuit board includes: The first electromagnetic shielding substrate has multiple parallel first outer grooves; The second electromagnetic shielding substrate has multiple parallel second outer grooves and multiple parallel second inner grooves, wherein the number of second outer grooves is greater than the number of second inner grooves; A circuit board is disposed between a first electromagnetic shielding substrate and a second electromagnetic shielding substrate, and includes a bending portion and two body portions. The bending portion is between the body portions, and the bending portion includes an S-shaped trace and has a first surface and a second surface facing each other. The first surface faces the first outer groove, and the second surface faces the second electromagnetic shielding substrate. The first cavity is located between the first electromagnetic shielding substrate and the circuit substrate, and is connected to the first outer trench. The second cavity is located between the second electromagnetic shielding substrate and the circuit substrate, and communicates with the second inner trench; and Both the first electromagnetic shielding substrate and the second electromagnetic shielding substrate contain a metal mesh structure. Most of the fasteners are respectively installed in the second outer groove; The bending portion is adapted to bend along the axis, and both the first outer groove and the second outer groove extend along the axis; After the bending portion is bent, the first surface is a concave curved surface, while the second surface is a convex curved surface.

2. The flexible circuit board with electromagnetic shielding according to claim 1, characterized in that... The first electromagnetic shielding substrate includes: First dielectric layer; and A first shielding layer is located between the first dielectric layer and the first surface, with the first shielding layer facing the first surface, and the first shielding layer has the first outer groove.

3. The flexible circuit board with electromagnetic shielding according to claim 2, characterized in that... The second electromagnetic shielding substrate includes: Second dielectric layer; and The second shielding layer is located between the second dielectric layer and the second surface, with the second shielding layer facing the second surface, and the second shielding layer has the second inner groove.

4. The flexible circuit board with electromagnetic shielding according to claim 3, characterized in that... The second inner groove extends to the second dielectric layer.

5. The flexible circuit board with electromagnetic shielding according to claim 3, characterized in that... The flexible circuit board also includes: Two adhesive layers are respectively bonded to the first electromagnetic shielding substrate and the circuit substrate, and to the second electromagnetic shielding substrate and the circuit substrate.

6. A method for manufacturing a flexible circuit board with electromagnetic shielding, characterized in that... The method for manufacturing the flexible circuit board includes: A first electromagnetic shielding substrate, a second electromagnetic shielding substrate, and a circuit board are provided, wherein both the first electromagnetic shielding substrate and the second electromagnetic shielding substrate include a metal mesh structure. The first electromagnetic shielding substrate and the second electromagnetic shielding substrate are combined on the circuit substrate to form a first cavity between the first electromagnetic shielding substrate and the circuit substrate, and to form a second cavity between the second electromagnetic shielding substrate and the circuit substrate. After the first electromagnetic shielding substrate and the second electromagnetic shielding substrate are bonded to the circuit substrate, the first electromagnetic shielding substrate, the second electromagnetic shielding substrate and the circuit substrate are bent, wherein the bent first electromagnetic shielding substrate has a plurality of first outer grooves and the bent second electromagnetic shielding substrate has a plurality of second outer grooves, and the number of the plurality of second outer grooves is greater than the number of the plurality of second inner grooves. as well as Curing adhesive is filled into the plurality of second outer grooves of the second electromagnetic shielding substrate to form a plurality of fasteners.

7. The method for manufacturing a flexible circuit board with electromagnetic shielding according to claim 6, characterized in that... The method for manufacturing the circuit board includes: A single-sided panel is provided, comprising a lower dielectric layer and a metal layer situated on the lower dielectric layer; The metal layer is patterned to form S-shaped traces; as well as The upper dielectric layer is laminated together with the lower dielectric layer to form a dielectric layer covering the S-shaped trace.

8. The method for manufacturing a flexible circuit board with electromagnetic shielding according to claim 7, characterized in that... The method for manufacturing the circuit board further includes: Two adhesive layers are applied to the first and second surfaces of the medium layer.

9. The method for manufacturing a flexible circuit board with electromagnetic shielding according to claim 6, characterized in that... The manufacturing method of the first electromagnetic shielding substrate includes: A single-sided panel is provided, including a first dielectric layer, a first metal layer and a first dielectric pattern layer having a first opening, wherein the first metal layer is located between the first dielectric layer and the first dielectric pattern layer. as well as The first metal layer is patterned so that a portion of the first metal layer exposed in the first opening forms multiple parallel first outer grooves, thereby forming the metal mesh structure.

10. The method for manufacturing a flexible circuit board with electromagnetic shielding according to claim 6, characterized in that... The manufacturing method of the second electromagnetic shielding substrate includes: A single-sided panel is provided, including a second dielectric layer, a second metal layer and a second dielectric pattern layer having a second opening, wherein the second metal layer is located between the second dielectric layer and the second dielectric pattern layer; The second metal layer is patterned so that a portion of the second metal layer exposed in the second opening forms the metal mesh structure; as well as Multiple parallel second inner trenches are formed in the second metal layer, and multiple parallel second outer trenches are formed in the second dielectric layer.

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