Method of fixing an assembly carrier and carrier fixing device

The position of the positioning module is automatically adjusted through the processor, loading platform and adjustment module of the carrier fixing equipment, which solves the problem of low efficiency of carrier fixing in circuit board preparation, realizes automatic fixing of the carrier, and improves safety and efficiency.

CN118678549BActive Publication Date: 2025-10-10INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202410773298.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-06-14
Publication Date
2025-10-10
Estimated Expiration
2044-06-14

AI Technical Summary

Technical Problem

The existing fixing method of circuit board preparation carriers is inefficient and poses safety risks. Conventional fixing by manual drilling leads to repeated drilling and manpower consumption.

Method used

A vehicle fixing device is used, including a processor, a loading platform, an adjustment module and a positioning module. By obtaining vehicle information and deployment position, the position of the positioning module is automatically adjusted to achieve automatic fixation of the vehicle.

Benefits of technology

The efficiency of vehicle fixation is improved, the manpower consumption and safety hazards caused by manual drilling are avoided, and the automatic fixation of the vehicle is realized.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

Embodiments of the present application provide a fixing method of an assembly carrier and a carrier fixing device, wherein the method comprises: obtaining carrier information of a target assembly carrier needed in a current process of manufacturing a circuit board, and obtaining deployment position information of the target assembly carrier on a carrier platform, wherein the carrier information is used to indicate distribution of a target positioning slot of the target assembly carrier on the target assembly carrier; converting target position information of the target positioning slot according to the carrier information and the deployment position information; generating target movement parameters of an adjusting module according to a reference position currently located by a positioning module and the target position information; and controlling the adjusting module to move the positioning module into the target positioning slot according to a movement mode indicated by the target movement parameters. Through the present application, the problem of low fixing efficiency of the assembly carrier is solved, and the effect of improving the fixing efficiency of the assembly carrier is achieved.
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Description

Technical Field

[0001] The embodiments of the present application relate to the field of computers, and more particularly, to a method for fixing an assembled vehicle and a vehicle fixing device. Background Art

[0002] With the development of the manufacturing industry, automatic optimization equipment has been applied in more and more fields. In the process of manufacturing circuit boards, a circuit board preparation carrier is needed, and the circuit board is placed on the circuit board preparation carrier. When preparing the circuit board, the circuit board preparation carrier needs to be fixed on the platform base. At present, the circuit board preparation carrier often needs to be fixed on the platform base by bolts. Personnel have to manually drill and fix them on different models of circuit board preparation carriers with a hand drill each time. On the one hand, repeated drilling and manpower consumption will occur due to improper carrier fixation or inappropriate drilling position. On the other hand, manual drilling also has a large safety hazard. The drill bit will break during the drilling process, causing personal injury. In summary, the current carrier fixing method has low fixation efficiency for circuit board preparation carriers. Summary of the Invention

[0003] The embodiments of the present application provide a method for fixing an assembled vehicle and a vehicle fixing device, so as to at least solve the problem of low fixing efficiency of the assembled vehicle.

[0004] According to one embodiment of the present application, a method for fixing an assembly tool is provided, wherein the tool fixing device includes a processor, a loading platform, an adjustment module and a positioning module, wherein the adjustment module is deployed on the loading platform, and the positioning module is connected to the adjustment module. The loading platform is used to place various types of assembly tools required for preparing circuit boards, and different types of assembly tools are used to prepare different types of circuit boards. The assembly tool is provided with a positioning groove, and the adjustment module is used to adjust the relative position relationship between the positioning module and the positioning groove on the assembly tool. The method is applied to the processor, and the method includes: obtaining the carrier information of the target assembly tool to be used in the current process of preparing the circuit board , and obtain the deployment position information of the target assembly vehicle on the carrier platform, wherein the carrier information is used to indicate the distribution of the target positioning slots of the target assembly vehicle on the target assembly vehicle; convert the target position information of the target positioning slot according to the carrier information and the deployment position information, wherein the target position information is used to indicate the relative position relationship between the target positioning slot and the target reference point on the carrier platform; generate the target movement parameters of the adjustment module according to the current reference position of the positioning module and the target position information; control the adjustment module to move the positioning module to the target positioning slot according to the movement method indicated by the target movement parameters.

[0005] Optionally, generating the target movement parameter of the adjustment module according to the current reference position of the positioning module and the target position information includes:

[0006] Calculating position information between the target positioning slot and the positioning module based on the reference position and the target position information, wherein the position information is used to indicate a relative position relationship between the target positioning slot and the positioning module;

[0007] The target movement parameter of the adjustment module is generated according to the position information.

[0008] Optionally, the adjustment module includes a first bridge and a second bridge, the first end of the first bridge is connected to the second bridge and the second bridge is perpendicular to the first bridge, the first end of the second bridge is connected to the loading platform and the second bridge is perpendicular to the platform surface of the loading platform, the length of the second bridge is equal to the second side of the loading platform and the second bridge is parallel to the second side, the first bridge is configured to allow movement along the first side, the first side is the side on the platform surface of the loading platform that intersects with the first side, the second bridge is configured to allow up and down movement along the first bridge, the positioning module is deployed on the second bridge, and the positioning module is configured to allow movement along the second bridge.

[0009] Generating the target movement parameter of the adjustment module according to the position information includes:

[0010] Determine a first distance between the target positioning groove and the positioning module in a first direction as a first moving distance of the first bridge along the first side, wherein the first direction is a moving direction of the first bridge along the first side;

[0011] Determine a second distance between the target positioning groove and the positioning module in a second direction as a second moving distance of the second bridge along the first bridge, wherein the second direction is a direction perpendicular to the platform surface of the loading platform;

[0012] The third distance between the target positioning groove and the positioning module in the third direction is determined as the third moving distance of the positioning module along the second bridge, wherein the third direction is the moving direction of the positioning module along the second bridge, the position information includes the first distance, the second distance and the third distance, and the target movement parameters include the first moving distance, the second moving distance and the third moving distance.

[0013] Optionally, converting the target position information of the target positioning slot according to the vehicle information and the deployment position information includes:

[0014] generate coordinate conversion information between the first coordinate system and a second coordinate system according to first coordinates of a plurality of reference datum points on the target assembly carrier in the first coordinate system, wherein the first coordinate system is a coordinate system constructed on the object platform with the target datum point as a coordinate origin, the second coordinate system is a coordinate system constructed on the target assembly carrier, the deployment position information comprises the first coordinates, and the coordinate conversion information is used to indicate a conversion relationship between coordinates in the first coordinate system and coordinates in the second coordinate system;

[0015] convert second coordinates of the target positioning slot in the second coordinate system into target coordinates in the first coordinate system using the coordinate conversion information, wherein the carrier information comprises the second coordinates, and the target position information comprises the target coordinates.

[0016] Optionally, the method further comprises:

[0017] acquiring first relative position information of a plurality of reference datum points on the target assembly carrier relative to the target datum point on the object platform, wherein the first relative position information is used to indicate a relative position relationship between the reference datum points and the target datum point;

[0018] generating first coordinates of the reference datum points in the first coordinate system using the first relative position information, wherein the deployment position information comprises the first coordinates, and the first coordinate system is a coordinate system constructed on the object platform with the target datum point as a coordinate origin.

[0019] Optionally, the carrier fixing device further comprises a base, and the object platform is disposed on the base and is configured to allow movement on the base.

[0020] After the controlling the adjusting module to move the positioning module into the target positioning slot in the movement manner indicated by the target movement parameter, the method further comprises:

[0021] acquiring a relative distance between the target assembly carrier and an assembly device used for assembling circuit boards;

[0022] generating reference movement parameters corresponding to the relative distance in a case where the relative distance between the target assembly carrier and the assembly device used for assembling circuit boards is greater than a target distance, wherein the reference movement parameters are used to indicate a movement manner of the object platform on the base.

[0023] move the object platform to a target position on the base in a moving manner indicated by the reference moving parameter, wherein a relative distance between the target assembly carrier and the assembly device is less than or equal to the target distance when the object platform is at the target position.

[0024] Optionally, the obtaining the relative distance between the target assembly carrier and the assembly device for assembling the circuit board comprises:

[0025] acquiring second relative position information of the assembly device relative to the target reference point on the object platform, wherein the second relative position information is used to indicate a relative position relationship between the assembly device and the target reference point;

[0026] generating a third coordinate of the assembly device in a first coordinate system using the second relative position information, wherein the first coordinate system is a coordinate system constructed on the object platform with the target reference point as a coordinate origin;

[0027] calculating a first coordinate of the target assembly carrier in the first coordinate system and the third coordinate to obtain the relative distance between the target assembly carrier and the assembly device, wherein the target position information comprises the first coordinate.

[0028] According to another embodiment of the present application, a carrier fixing device is provided, which comprises a processor, an object platform, an adjusting module and a positioning module, wherein the adjusting module is arranged on the object platform, the positioning module is connected with the adjusting module, the object platform is used to place assembly carriers of multiple types required for preparing circuit boards, assembly carriers of different types are used to prepare circuit boards of different types, the assembly carriers are provided with positioning grooves, the adjusting module is used to adjust a relative position relationship between the positioning module and the positioning grooves on the assembly carriers, and the processor is used to execute steps in any of the method embodiments.

[0029] According to still another embodiment of the present application, a computer readable storage medium is further provided, wherein the computer readable storage medium stores a computer program, and the computer program is set to execute steps in any of the method embodiments when running.

[0030] According to still another embodiment of the present application, an electronic device is further provided, which comprises a memory and a processor, the memory stores a computer program, and the processor is set to execute the computer program to execute steps in any of the method embodiments.

[0031] Through the present application, a processor, a carrying platform, an adjustment module and a positioning module are deployed on the carrier fixing device. The carrying platform is used to place the assembly vehicle required for preparing the circuit board. The assembly vehicle is provided with a positioning slot. The adjustment module is used to adjust the relative position relationship between the positioning module and the positioning slot on the assembly vehicle, and then by obtaining the carrier information of the target assembly vehicle required to be used in the current process of preparing the circuit board and the deployment position information of the target assembly vehicle on the carrying platform, the relative position relationship between the target positioning slot and the target base point on the carrying platform is converted. According to the target movement parameters that can be generated to indicate the movement mode of the positioning module, the positioning module can be moved to the target positioning slot according to the target movement parameters by controlling the adjustment module, so as to realize automatic adjustment of the position of the positioning module according to the carrier information of the target assembly vehicle and the deployment position information of the target assembly vehicle on the carrying platform, and automatically fix the assembly vehicle deployed on the carrying platform, avoiding the consumption of human resources caused by manual drilling fixation. Therefore, the problem of low fixing efficiency of the assembly vehicle can be solved, and the effect of improving the fixing efficiency of the assembly vehicle can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a hardware structure block diagram of a server device for a method for fixing an assembled tool according to an embodiment of the present application;

[0033] Figure 2 is a flow chart of a method for fixing an assembly tool according to an embodiment of the present application;

[0034] Figure 3 is a schematic diagram of an optional adjustment module according to an embodiment of the present application;

[0035] Figure 4 is a schematic diagram of an optional carrier fixing device according to an embodiment of the present application;

[0036] Figure 5 is a side view of an optional carrier fixing device according to an embodiment of the present application;

[0037] Figure 6 is a top view of an optional carrier fixing device according to an embodiment of the present application;

[0038] Figure 7 is an optional carrier fixing flow chart according to an embodiment of the device application;

[0039] Figure 8 4 is a structural block diagram of a fixing device for assembling a vehicle according to an embodiment of the present application. DETAILED DESCRIPTION

[0040] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0041] It should be noted that the terms "first", "second", etc. in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0042] The method embodiments provided in the embodiments of the present application can be executed in a server device or a similar computing device. Taking running on a server device as an example, Figure 1 FIG. 1 is a hardware structure diagram of a server device for a method of fixing a component mounted on an embodiment of the present application. Figure 1 As shown, the server device may include one or more ( Figure 1 Only one is shown) a processor 102 (the processor 102 may include but is not limited to a microprocessor MCU or a programmable logic device FPGA and other processing devices) and a memory 104 for storing data, wherein the above-mentioned server device may also include a transmission device 106 for communication functions and an input and output device 108. It will be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above server device. Figure 1 More or fewer components than shown, or with Figure 1 Different configurations shown.

[0043] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the method for fixing the assembly tool in the embodiment of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, implementing the above-mentioned method. The memory 104 may include a high-speed random access memory and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include a memory remotely located relative to the processor 102, and these remote memories can be connected to the server device via a network. Examples of the above-mentioned network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0044] The transmission device 106 is used to receive or send data via a network. A specific example of the aforementioned network may include a wireless network provided by a communication provider of the server device. In one embodiment, the transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to enable communication with the Internet. In another embodiment, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0045] In this embodiment, a method for fixing an assembly tool is provided. The tool fixing device includes a processor, a loading platform, an adjustment module and a positioning module. The adjustment module is deployed on the loading platform, and the positioning module is connected to the adjustment module. The loading platform is used to place various types of assembly tools required for preparing circuit boards. Different types of assembly tools are used to prepare different types of circuit boards. Positioning grooves are provided on the assembly tool. The adjustment module is used to adjust the relative position relationship between the positioning module and the positioning grooves on the assembly tool. The method is applied to the processor. Figure 2 is a flow chart of a method for fixing an assembly tool according to an embodiment of the present application, such as Figure 2 As shown, the process includes the following steps:

[0046] Step S202: Acquire carrier information of a target assembly tool to be used in the current process of preparing a circuit board, and acquire deployment position information of the target assembly tool on the carrier platform, wherein the carrier information is used to indicate the distribution of target positioning slots of the target assembly tool on the target assembly tool;

[0047] Step S204: Convert target position information of the target positioning slot according to the carrier information and the deployment position information, wherein the target position information is used to indicate the relative position relationship between the target positioning slot and the target reference point on the loading platform;

[0048] Step S206, generating target movement parameters of the adjustment module according to the current reference position of the positioning module and the target position information;

[0049] Step S208 : Controlling the adjustment module to move the positioning module to the target positioning slot according to the movement method indicated by the target movement parameter.

[0050] Through the above steps, a processor, a carrying platform, an adjustment module and a positioning module are deployed on the carrier fixing device. The carrying platform is used to place the assembly vehicle required for preparing the circuit board. The assembly vehicle is provided with a positioning groove. The adjustment module is used to adjust the relative position relationship between the positioning module and the positioning groove on the assembly vehicle. Then, by obtaining the carrier information of the target assembly vehicle required to be used in the current process of preparing the circuit board and the deployment position information of the target assembly vehicle on the carrying platform, the relative position relationship between the target positioning groove and the target base point on the carrying platform is converted. According to the target movement parameter that can be generated to indicate the movement mode of the positioning module, the positioning module can be moved to the target positioning groove according to the target movement parameter by controlling the adjustment module, so as to realize automatic adjustment of the position of the positioning module according to the carrier information of the target assembly vehicle and the deployment position information of the target assembly vehicle on the carrying platform, and automatically fix the assembly vehicle deployed on the carrying platform, thereby avoiding the consumption of human resources caused by manual drilling fixation. Therefore, the problem of low fixing efficiency of the assembly vehicle can be solved, and the effect of improving the fixing efficiency of the assembly vehicle can be achieved.

[0051] Optionally, in an embodiment of the present application, the processor may be connected to the adjustment module, and the processor is used to control the adjustment module to adjust the position of the positioning module, which is not limited in this solution.

[0052] Optionally, in an embodiment of the present application, the assembly container is used to place the circuit boards to be prepared, and then the circuit board assembly equipment on the production line assembles the circuit boards on the assembly container. In actual applications, different assembly containers have different carrier information (such as carrier size, deployment position of the positioning grooves on the carrier, etc.), so different types of assembly containers are used to prepare different types of circuit boards.

[0053] In the embodiment provided in the above step S202, the assembly vehicle information is used to indicate the distribution of the target positioning grooves on the target assembly vehicle. The assembly vehicle information may include, but is not limited to, the size information of the target assembly vehicle, the coordinate position of the target positioning grooves on the target assembly vehicle, etc. This solution does not limit this.

[0054] Optionally, in an embodiment of the present application, the carrier information can be obtained from an information set of a carrier fixing device, which stores carrier information of different models of assembly carriers. The processor performs keyword recognition on the preparation work order entered by the operator to obtain the carrier model of the assembly carrier required for preparing the target model of circuit board recorded in the work order, wherein the preparation work order is used to indicate the information of the circuit boards that need to be prepared that year; and then the assembly carrier information corresponding to the current carrier model can be filtered out from the information set. Alternatively, an image acquisition device is also deployed on the carrier fixing device, and the image acquisition device is used to capture the carrier image of the assembled carrier placed on the loading platform, and then extract the carrier features of the assembled carrier from the carrier image (which may include but is not limited to the shape of the assembled carrier, the shape of the circuit board deployed on the assembled carrier, the component features on the circuit board, etc.); and then the carrier features can be similarly matched with the carrier features in the carrier feature set of the carrier fixing device, so as to filter out the target carrier features with a similarity greater than the target similarity from the carrier feature set; determine the carrier model of the assembled carrier with the target carrier feature, and thus filter out the assembled carrier information corresponding to the current carrier model from the information set.

[0055] Optionally, in an embodiment of the present application, a plurality of first sensors may be deployed on the assembly vehicle, and the plurality of first sensors are respectively deployed at a plurality of reference datum points of the assembly vehicle, and a second sensor may be deployed at a target datum point on the loading platform, and then the second sensor interacts with each of the first sensors to obtain the relative position of the first sensor relative to the second sensor; by converting the relative positions of the plurality of first sensors relative to the second sensor, the coordinate position of the first sensor in a first coordinate system established on the loading platform is obtained, and the coordinate position is determined as the deployment position information of the loading platform, wherein the first coordinate system is a coordinate system established on the loading platform with a target datum point as the coordinate origin. In the above embodiment, the first sensor and the second sensor may be, but are not limited to, distance sensors. Through the above embodiment, by deploying the first sensor on the assembly vehicle and the second sensor on the loading platform, the deployment position information of the assembly vehicle on the loading platform is automatically located, thereby accurately locating the position of the positioning slot on the assembly vehicle. During this process, it is not necessary to place the assembly vehicle at a specific position on the loading platform, so that the assembly vehicle can be located at the position of the positioning slot at any position on the loading platform, thereby improving the degree of automation of vehicle fixation.

[0056] In the embodiment provided in the above step S204, the target position information may be, but is not limited to, the distance and angle of the target positioning slot relative to the target reference point, or it may also be the position coordinates of the target point positioning slot in a coordinate system with the target reference point as the coordinate origin. This solution does not limit this.

[0057] In the embodiment provided in the above step S206, the target movement parameters are used to indicate the moving direction and moving distance of the positioning module. In the embodiment of the present application, a rectangular coordinate system can be constructed with the target reference point as the coordinate origin, but is not limited to. The X-axis and Y-axis of the rectangular coordinate system are parallel to the platform surface of the loading platform, and the Z-axis is perpendicular to the platform surface of the loading platform. The target movement parameters can be, but are not limited to, the moving distance of the positioning module driven by the adjustment module in the X-axis direction, the moving distance of the positioning module driven in the Y-axis direction, and the moving distance of the positioning module driven in the Z-axis direction.

[0058] As an optional embodiment, generating the target movement parameter of the adjustment module according to the current reference position of the positioning module and the target position information includes:

[0059] Calculating position information between the target positioning slot and the positioning module based on the reference position and the target position information, wherein the position information is used to indicate a relative position relationship between the target positioning slot and the positioning module;

[0060] The target movement parameter of the adjustment module is generated according to the position information.

[0061] Optionally, in an embodiment of the present application, the location information may include, but is not limited to, the relative direction and relative distance between the target positioning groove and the positioning module, etc., which is not limited in this solution.

[0062] Optionally, in an embodiment of the present application, when calculating the position information between the target positioning slot and the positioning module, the target reference point can be used as the reference point between the target positioning slot and the positioning module for calculation. For example, the reference position is used to indicate the position of the current positioning module relative to the target reference point, and the candidate position of the target positioning slot is determined based on the deployment position information, wherein the candidate position information is used to indicate the position of the target positioning slot relative to the target reference point, and then the position information can be converted according to the reference position and the candidate position. This solution does not limit this.

[0063] Through the above content, by obtaining the current reference position of the positioning module, and then using the reference position and target position information to calculate the position information between the positioning module and the target positioning slot, and generating movement parameters based on the position information, the accuracy of the generated movement parameters is guaranteed.

[0064] As an optional embodiment,

[0065] The adjustment module includes a first bridge and a second bridge, wherein the first end of the first bridge is connected to the second bridge and the second bridge is perpendicular to the first bridge, the first end of the second bridge is connected to the loading platform and the second bridge is perpendicular to the platform surface of the loading platform, the length of the second bridge is equal to the second side of the loading platform and the second bridge is parallel to the second side, the first bridge is configured to allow movement along the first side, the first side is the side on the platform surface of the loading platform that intersects with the first side, the second bridge is configured to allow up and down movement along the first bridge, and the positioning module is deployed on the second bridge, and the positioning module is configured to allow movement along the second bridge.

[0066] Generating the target movement parameter of the adjustment module according to the position information includes:

[0067] Determine a first distance between the target positioning groove and the positioning module in a first direction as a first moving distance of the first bridge along the first side, wherein the first direction is a moving direction of the first bridge along the first side;

[0068] Determine a second distance between the target positioning groove and the positioning module in a second direction as a second moving distance of the second bridge along the first bridge, wherein the second direction is a direction perpendicular to the platform surface of the loading platform;

[0069] The third distance between the target positioning groove and the positioning module in the third direction is determined as the third moving distance of the positioning module along the second bridge, wherein the third direction is the moving direction of the positioning module along the second bridge, the position information includes the first distance, the second distance and the third distance, and the target movement parameters include the first moving distance, the second moving distance and the third moving distance.

[0070] Optionally, in an embodiment of the present application, the adjustment module also includes a first drive motor deployed corresponding to the first bridge, a second drive motor deployed corresponding to the second bridge, and a third drive motor deployed corresponding to the positioning module, wherein the first drive motor is used to drive the first bridge to move along the edge of the loading platform, the second drive motor is used to drive the second bridge to move along the direction of the first bridge, and the third drive motor is used to drive the positioning module to move along the second bridge. This solution does not limit this.

[0071] Figure 3 is a schematic diagram of an optional adjustment module according to an embodiment of the present application, such as Figure 3As shown, the first bridge is deployed perpendicular to the carrier plane, and the second bridge is deployed parallel to the carrier plane. The first bridge can move along the edge of the carrier plane, thereby driving the second bridge to move along the carrier plane. The second bridge can move up and down along the first bridge, and the positioning module can move along the second bridge.

[0072] Through the above content, by deploying the first bridge and the second bridge, the positioning module can be accurately and quickly moved to the position of the positioning slot on the assembly vehicle, thereby improving the fixing efficiency of the assembly vehicle.

[0073] As an optional embodiment, converting the target position information of the target positioning slot according to the vehicle information and the deployment position information includes:

[0074] generating coordinate conversion information between the first coordinate system and the second coordinate system according to first coordinates of a plurality of reference reference points on the target assembly vehicle in the first coordinate system of the carrier platform, wherein the first coordinate system is a coordinate system constructed on the carrier platform with the target reference point as a coordinate origin, and the second coordinate system is a coordinate system constructed on the target assembly vehicle, the deployment position information includes the first coordinates, and the coordinate conversion information is used to indicate a conversion relationship between coordinates in the first coordinate system and coordinates in the second coordinate system;

[0075] The coordinate conversion information is used to convert the second coordinates of the target positioning slot in the second coordinate system into target coordinates in the first coordinate system, wherein the vehicle information includes the second coordinates and the target position information includes the target coordinates.

[0076] Through the above content, by deploying reference datum points on the target assembly vehicle and deploying target datum points on the loading platform, a first coordinate system is constructed with the target datum point as the coordinate origin, and a second coordinate system is constructed with the reference datum point as the coordinate origin. By generating a conversion relationship between the coordinates in the first coordinate system and the second coordinate system based on the first coordinate of the reference datum point in the first coordinate system, the coordinates of the target positioning groove in the second coordinate system are converted into the target coordinates in the first coordinate system, that is, the coordinate position of the target positioning groove in the coordinate system of the target reference point is determined by coordinate conversion, thereby achieving accurate positioning of the target positioning groove on the assembly vehicle placed at any position on the loading platform.

[0077] As an optional embodiment, obtaining the deployment position information of the target assembly vehicle on the loading platform includes:

[0078] acquire first relative position information of a plurality of reference fiducials on the target assembly carrier relative to the target fiducial on the object carrier platform, wherein the first relative position information is used to indicate a relative position relationship between the reference fiducials and the target fiducial;

[0079] generate a first coordinate of the reference fiducials in a first coordinate system using the first relative position information, wherein the deployment position information comprises the first coordinate, and the first coordinate system is a coordinate system constructed on the object carrier platform with the target fiducial as a coordinate origin.

[0080] Optionally, in the embodiments of the present application, the reference fiducials and the target fiducials can be respectively provided with sensors, i.e., a first sensor is disposed on the target fiducial, and a second sensor is disposed on the reference fiducial, and the relative position information between the second sensor and the first sensor is determined through the interaction between the first sensor and the second sensor, i.e., the first relative position information of the reference fiducials relative to the target fiducial is obtained.

[0081] As an optional embodiment, the carrier fixing device further comprises a base, and the object carrier platform is disposed on the base, and the object carrier platform is configured to allow movement on the base,

[0082] After the control of the adjustment module to move the positioning module into the target positioning slot in the movement mode indicated by the target movement parameter, the method further comprises:

[0083] acquire a relative distance between the target assembly carrier and an assembly device for assembling circuit boards;

[0084] in a case where the relative distance between the target assembly carrier and the assembly device for assembling circuit boards is greater than a target distance, generate reference movement parameters corresponding to the relative distance, wherein the reference movement parameters are used to indicate a movement mode of the object carrier platform on the base;

[0085] move the object carrier platform to a target position on the base in the movement mode indicated by the reference movement parameters, wherein when the object carrier platform is at the target position, the relative distance between the target assembly carrier and the assembly device is less than or equal to the target distance.

[0086] Optionally, in the embodiments of the present application, the assembly device is used to assemble circuit boards placed on the target assembly carrier.

[0087] Optionally, in an embodiment of the present application, the relative distance between the target assembly vehicle and the assembly equipment can be collected by sensors deployed on the target assembly vehicle and the assembly equipment, and the relative distance between the target assembly vehicle and the assembly equipment can be obtained through interaction between the sensors.

[0088] Optionally, in an embodiment of the present application, the reference movement parameter may be, but is not limited to, indicating a movement mode of the base relative to the assembly device. The movement mode may be, but is not limited to, including the base moving forward, backward, left, right, upward, downward, and other directions relative to the assembly device. By moving the base, the loading platform is mobilized to move, and then the target assembly vehicle is driven to move, thereby adjusting the relative position relationship between the target assembly vehicle and the assembly device.

[0089] Through the above steps, by adjusting the movement of the base relative to the assembly equipment according to the relative distance between the target assembly vehicle and the assembly equipment for assembling circuit boards, the relative position between the target assembly vehicle and the assembly equipment is automatically adjusted, thereby facilitating the assembly equipment to produce and process the circuit boards on the target assembly vehicle.

[0090] As an optional embodiment, obtaining the relative distance between the target assembly tool and an assembly device for assembling a circuit board includes:

[0091] Collecting second relative position information of the assembly device relative to the target reference point on the loading platform, wherein the second relative position information is used to indicate the relative position relationship between the assembly device and the target reference point;

[0092] generating a third coordinate of the assembly device in the first coordinate system using the second relative position information, wherein the first coordinate system is a coordinate system constructed on the loading platform with the target reference point as a coordinate origin;

[0093] The first coordinate and the third coordinate of the target assembly tool in the first coordinate system are calculated to obtain a relative distance between the target assembly tool and the assembly equipment, wherein the target position information includes the first coordinate.

[0094] Optionally, in an embodiment of the present application, a sensor may be deployed at a certain position on the assembly equipment, and a sensor may be deployed at a target reference point of the load, thereby collecting second relative position information of the assembly equipment relative to the target reference point.

[0095] Through the above steps, by collecting the second relative position information of the target reference point on the assembly equipment and the loading platform, and then converting the third coordinate of the assembly equipment in the first coordinate system constructed with the target reference point as the origin according to the second relative position information, and then calculating the relative position between the target assembly vehicle and the assembly equipment according to the coordinates of the target assembly vehicle and the assembly equipment in the first coordinate system, the accuracy of the collection result of the relative distance between the assembly equipment and the target assembly vehicle is ensured.

[0096] The embodiment of the present application provides a component fixing device, Figure 4 is a schematic diagram of an optional carrier fixing device according to an embodiment of the present application, such as Figure 4 As shown, it includes: a processor, a loading platform, an adjustment module and a positioning module, wherein the adjustment module is deployed on the loading platform, the positioning module is connected to the adjustment module, the loading platform is used to place various types of assembly tools required for preparing circuit boards, and different types of assembly tools are used to prepare different types of circuit boards. Positioning grooves are provided on the assembly tools, and the adjustment module is used to adjust the relative position relationship between the positioning module and the positioning grooves on the assembly tools.

[0097] In the above embodiment, most of the internal electrical components of the entire device can be controlled by a single-chip microcomputer (processor), a simple logic circuit, and an intelligent monitoring vehicle status information device. The standard electrical control components, the execution end is controlled by a motor to perform the control action and the fixed position length, fixed pressure size, and fixed height on the vehicle, and the transmission is carried out by a motor, a coupling (or a reducer), and a belt. The components from bottom to top are the device controller (processor), the adjustment module (including but not limited to: transmission screw, main drive motor 1, coupling (or reducer), main drive motor 2), and the pressure block mechanism (positioning module).

[0098] The intelligent vehicle status information monitoring device uses Wi-Fi to achieve real-time monitoring and real-time push of vehicle status operation information, methods, devices, equipment and storable media, ensuring that production line technicians can promptly confirm whether the vehicle corresponds correctly.

[0099] The device also takes into account the dimensions of the actual server PCB automatic assembly platform (loading platform) and assembly vehicle, and reserves sufficient width and height for the pressing mechanism to expand the three-dimensional space. Therefore, the compatibility and size of the device are not a single fixed situation, but are presented in a movable and adjustable form. However, the versatility of the equipment requires that the transmission screw and pressing mechanism therein be reserved with sufficient size to facilitate the expansion of more usage scope.

[0100] Figure 5 is a side view of an optional carrier fixing device according to an embodiment of the present application, Figure 6is a top view of an optional carrier fixing device according to an embodiment of the present application, such as Figure 5 and Figure 6 As shown, the assembly vehicle is deployed on a loading platform, which is placed on a base that can move the loading platform in all directions. A person uses the interactive interface of the assembly vehicle fixture to control the adjustment module to adjust the position of the positioning module, thereby moving the positioning module to the corresponding groove on the assembly vehicle and securing the assembly vehicle.

[0101] First, the personnel place the carrier at the origin sensor on the assembly platform (the sensor is a distance sensor that can record the relative position of the carrier on the automatic assembly platform), and press the equipment start button on the controller human-machine interface. At this time, the carrier fixing device of the automatic assembly platform will obtain the current assembly station carrier information from the production process control system through the wifi device, including the carrier width, that is, the distance between the two pressing mechanisms (positioning modules), the position of the two pressing mechanisms, the lifting height, and the pressure size, and then convert this information into the motion parameters of the motor and the pressing mechanism, and send pulses and input and output interactive signals to the motor and the pressing mechanism to execute the fixed carrier action. After the carrier is fixed, the operator can continue to issue corresponding process commands to let the base of the carrier fixing device drag the entire carrier platform to move in the X and Y directions, so that the processing area is moved to the front of the operator's standing position, so that the operator can implement the PCB component assembly process.

[0102] When the provided carrier does not match the actual demand, and the position, lifting height, and pressure value of the pressing mechanism exceed the set error accuracy, the pressing mechanism will interfere with the carrier and then feedback alarm signals and buzzer prompts; when the provided carrier does not match the actual demand, and the position, lifting height, and pressure value of the pressing mechanism are less than the set error accuracy, the equipment enters the self-tuning mode and continuously adjusts, and adjusts to a threshold far less than the error accuracy in a short time, and jumps out of the self-tuning mode to continue the next task; when a person is hit by the equipment when the assembly process is not carried out normally, and a certain damage pressure is reached, the equipment will also feedback signals and buzzer prompts through the motor torque limit alarm (high-precision and accurate detection).

[0103] Figure 7 This is an optional carrier fixing flow chart according to an embodiment of the device application, such as Figure 7 As shown, it at least includes the following steps:

[0104] Step S701: Acquire monitoring rules and operating machine attribute information: Automatically acquire the assembly station carrier field information for the automated assembly platforms on each line, and then automatically acquire the corresponding fields in the production process control system, such as the assembly station machine model name, required carrier, and carrier length, width, and thickness. When production line technicians modify machine model information in the production process control system, the information before and after the change is automatically acquired for the corresponding fields in the production process control system, such as the assembly station machine model name, required carrier, and carrier length, width, and thickness.

[0105] Step S702, automatically obtain and generate the on-site assembly tool positioning device model database change information: automatically monitor the corresponding fields such as the assembly station model name, the carrier required by the model, the carrier length, width and thickness in the assembly tool positioning device model database of each line body in the production line. When the production line technician modifies the database, that is, when a change occurs in the assembly tool positioning device model database, the data before and after the change is generated, and these acquired data are stored in the log table in the local database and automatically sorted.

[0106] Step S703, incrementally back up the monitored assembly tool positioning device model change information to the database server: establish a DBLINK connection between the local log table and the data warehouse server, regularly obtain the three field data of production line type, assembly station model name, and change time in the local log table, and compare it with the three field information of production line type, assembly station model name, and change time in the data warehouse server. If it already exists, the local log table change data will not be inserted into the data warehouse. If it does not exist, the local log table change data will be inserted into the data warehouse.

[0107] The above process realizes real-time monitoring, real-time warning, and real-time push of the attribute information of the machine models running in the assembly station, ensuring the confirmation of the data modified by the production line technicians. The carrier monitoring, warning, and automatic fixing device (carrier fixing equipment) based on the server PCB automatic assembly platform in this application can be used in any carrier monitoring, warning, and automatic fixing occasions, not limited to this example.

[0108] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0109] An embodiment of the present application also provides a carrier fixing device, which includes a processor, a carrier platform, an adjustment module and a positioning module, wherein the adjustment module is deployed on the carrier platform, and the positioning module is connected to the adjustment module. The carrier platform is used to place various types of assembly carriers required for preparing circuit boards, and different types of assembly carriers are used to prepare different types of circuit boards. Positioning grooves are provided on the assembly carriers, and the adjustment module is used to adjust the relative position relationship between the positioning module and the positioning grooves on the assembly carriers. The processor is configured to execute the steps of any of the above method embodiments during operation.

[0110] This embodiment also provides a fixture for assembling a load, which is used to implement the above-mentioned embodiments and preferred embodiments. Details already described will not be repeated here. As used below, the term "module" may refer to a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented using software, implementation using hardware, or a combination of software and hardware, is also possible and contemplated.

[0111] Figure 8 is a structural block diagram of a fixing device for assembling a tool according to an embodiment of the present application, such as Figure 8 As shown, the carrier fixing device includes a processor, a carrier platform, an adjustment module and a positioning module, wherein the adjustment module is deployed on the carrier platform, the positioning module is connected to the adjustment module, the carrier platform is used to place various types of assembly tools required for preparing circuit boards, and different types of assembly tools are used to prepare different types of circuit boards. The assembly tools are provided with positioning grooves, and the adjustment module is used to adjust the relative position relationship between the positioning module and the positioning grooves on the assembly tools. The device is applied to the processor, and the device includes:

[0112] An acquisition module is used to obtain carrier information of a target assembly vehicle to be used in the current process of preparing a circuit board, and to obtain deployment position information of the target assembly vehicle on the carrier platform, wherein the carrier information is used to indicate the distribution of target positioning grooves of the target assembly vehicle on the target assembly vehicle;

[0113] a conversion module, configured to convert target position information of the target positioning slot according to the carrier information and the deployment position information, wherein the target position information is used to indicate a relative positional relationship between the target positioning slot and a target reference point on the carrier platform;

[0114] a first generating module, configured to generate a target movement parameter of the adjusting module according to the current reference position of the positioning module and the target position information;

[0115] The control module is configured to control the adjusting module to move the positioning module to the target positioning slot according to a movement mode indicated by the target movement parameter.

[0116] By the above, the processor, the object carrying platform, the adjusting module and the positioning module are deployed on the carrier fixing device. The object carrying platform is used to place an assembly carrier required for preparing a circuit board. The assembly carrier is provided with a positioning slot. The adjusting module is used to adjust the relative position relationship between the positioning module and the positioning slot on the assembly carrier. Then, the relative position relationship between the target positioning slot and the target base point on the object carrying platform is converted according to the carrier information of the target assembly carrier required in the process of preparing the circuit board and the deployment position information of the target assembly carrier on the object carrying platform. According to the target movement parameter which can be generated to indicate the movement mode of the positioning module, the positioning module can be moved to the target positioning slot according to the target movement parameter by controlling the adjusting module. The position of the positioning module is automatically adjusted according to the carrier information of the target assembly carrier and the deployment position information of the target assembly carrier on the object carrying platform. The assembly carrier deployed on the object carrying platform is automatically fixed. The consumption of human resources caused by manual drilling is avoided. Therefore, the problem of low fixing efficiency of the assembly carrier can be solved. The fixing efficiency of the assembly carrier is improved.

[0117] Optionally, the first generating module comprises:

[0118] The computing unit is configured to calculate position information between the target positioning slot and the positioning module according to the reference position and the target position information, where the position information is used to indicate the relative position relationship between the target positioning slot and the positioning module.

[0119] The first generating unit is configured to generate the target movement parameter of the adjusting module according to the position information.

[0120] Optionally, the adjusting module comprises a first bridge and a second bridge. The first end of the first bridge is connected to the second bridge, and the second bridge is perpendicular to the first bridge. The first end of the second bridge is connected to the object carrying platform, and the second bridge is perpendicular to the platform surface of the object carrying platform. The length of the second bridge is equal to the second side of the object carrying platform, and the second bridge is parallel to the second side. The first bridge is configured to allow movement along the first side, which is the side of the platform surface of the object carrying platform intersecting with the first side. The second bridge is configured to allow movement up and down along the first bridge. The positioning module is deployed on the second bridge, and the positioning module is configured to allow movement along the second bridge.

[0121] The first generating unit is configured to:

[0122] Determine a first distance between the target positioning groove and the positioning module in a first direction as a first moving distance of the first bridge along the first side, wherein the first direction is a moving direction of the first bridge along the first side;

[0123] Determine a second distance between the target positioning groove and the positioning module in a second direction as a second moving distance of the second bridge along the first bridge, wherein the second direction is a direction perpendicular to the platform surface of the loading platform;

[0124] The third distance between the target positioning groove and the positioning module in the third direction is determined as the third moving distance of the positioning module along the second bridge, wherein the third direction is the moving direction of the positioning module along the second bridge, the position information includes the first distance, the second distance and the third distance, and the target movement parameters include the first moving distance, the second moving distance and the third moving distance.

[0125] Optionally, the conversion module includes: a second generating unit, configured to generate coordinate conversion information between the first coordinate system and the second coordinate system according to first coordinates of a plurality of reference reference points on the target assembly vehicle in the first coordinate system of the carrier platform, wherein the first coordinate system is a coordinate system constructed on the carrier platform with the target reference point as a coordinate origin, the second coordinate system is a coordinate system constructed on the target assembly vehicle, the deployment position information includes the first coordinate, and the coordinate conversion information is used to indicate a conversion relationship between the coordinates in the first coordinate system and the coordinates in the second coordinate system;

[0126] A conversion unit is used to use the coordinate conversion information to convert the second coordinate of the target positioning slot in the second coordinate system into the target coordinate in the first coordinate system, wherein the vehicle information includes the second coordinate and the target position information includes the target coordinate.

[0127] Optionally, the acquisition module includes: a first acquisition unit, configured to acquire first relative position information of a plurality of reference reference points on the target assembly vehicle relative to the target reference point on the loading platform, wherein the first relative position information is used to indicate a relative position relationship between the reference reference points and the target reference point;

[0128] A third generating unit is configured to generate a first coordinate of the reference reference point in a first coordinate system using the first relative position information, wherein the deployment position information includes the first coordinate, and the first coordinate system is a coordinate system constructed on the carrier platform with the target reference point as the coordinate origin.

[0129] Optionally, the carrier fixing device further comprises a base, the carrier platform is disposed on the base, and the carrier platform is configured to allow movement on the base,

[0130] The device further comprises an acquisition module configured to acquire a relative distance between the target assembly carrier and an assembly device for assembling circuit boards after the control module controls the adjustment module to move the positioning module into the target positioning slot according to the movement manner indicated by the target movement parameter.

[0131] A second generation module is configured to generate a reference movement parameter corresponding to the relative distance between the target assembly carrier and the assembly device for assembling circuit boards when the relative distance is greater than a target distance, wherein the reference movement parameter is used to indicate a movement manner of the carrier platform on the base.

[0132] A movement module is configured to move the carrier platform to a target position on the base according to the movement manner indicated by the reference movement parameter, wherein the relative distance between the target assembly carrier and the assembly device is less than or equal to the target distance when the carrier platform is at the target position.

[0133] Optionally, the acquisition module comprises:

[0134] An acquisition unit is configured to acquire second relative position information of the assembly device relative to the target reference point on the carrier platform, wherein the second relative position information is used to indicate a relative position relationship between the assembly device and the target reference point.

[0135] A fourth generation unit is configured to generate a third coordinate of the assembly device in a first coordinate system using the second relative position information, wherein the first coordinate system is a coordinate system constructed on the carrier platform with the target reference point as a coordinate origin.

[0136] A calculation unit is configured to calculate a first coordinate of the target assembly carrier in the first coordinate system and the third coordinate to obtain a relative distance between the target assembly carrier and the assembly device, wherein the target position information comprises the first coordinate.

[0137] It should be noted that each of the above modules can be implemented by software or hardware, and for the latter, the following implementation manners can be used, but are not limited thereto: all the above modules are located in the same processor; or the above modules are located in different processors in any combination.

[0138] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above method embodiments when run.

[0139] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0140] An embodiment of the present application further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0141] In an exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0142] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any one of the above method embodiments are implemented.

[0143] An embodiment of the present application further provides another computer program product, comprising a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any of the above method embodiments are implemented.

[0144] An embodiment of the present application also provides a computer program, which includes computer instructions, which are stored in a computer-readable storage medium; a processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the steps of any of the above method embodiments.

[0145] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail here.

[0146] It should be apparent to those skilled in the art that the modules or steps of the application described above can be implemented with general computing devices, which can be centralized on a single computing device or distributed on a network of multiple computing devices, and which can be implemented with program codes executable by the computing devices, so that they can be stored in storage devices and executed by the computing devices, and in some cases, the steps shown or described can be executed in different orders than shown, or made into individual integrated circuit modules, or made into a single integrated circuit module. Thus, the present application is not limited to any particular combination of hardware and software.

[0147] The preferred embodiments of the present application described above are only used to explain the principles of the present application and not limit the present application. Any modification, equivalent replacement, improvement, etc. within the principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for fixing an assembled tool, characterized in that: The carrier fixing device includes a processor, a carrier platform, an adjustment module and a positioning module, wherein the adjustment module is deployed on the carrier platform, the positioning module is connected to the adjustment module, the carrier platform is used to place various types of assembly carriers required for preparing circuit boards, and different types of assembly carriers are used to prepare different types of circuit boards. The assembly carrier is provided with a positioning groove, and the adjustment module is used to adjust the relative position relationship between the positioning module and the positioning groove on the assembly carrier. The method is applied to the processor, and the method includes: Obtaining carrier information of a target assembly vehicle to be used in the current process of preparing a circuit board, and obtaining deployment position information of the target assembly vehicle on the carrier platform, wherein the carrier information is used to indicate the distribution of target positioning grooves of the target assembly vehicle on the target assembly vehicle; Converting target position information of the target positioning slot according to the carrier information and the deployment position information, wherein the target position information is used to indicate the relative position relationship between the target positioning slot and the target reference point on the carrier platform; generating a target movement parameter of the adjustment module according to the current reference position of the positioning module and the target position information; Controlling the adjustment module to move the positioning module to the target positioning slot in a movement manner indicated by the target movement parameter; The converting the target position information of the target positioning slot according to the vehicle information and the deployment position information includes: Coordinate conversion information between the first coordinate system and the second coordinate system is generated based on the first coordinates of multiple reference reference points on the target assembly vehicle in the first coordinate system of the carrier platform, wherein the first coordinate system is a coordinate system constructed on the carrier platform with the target reference point as the coordinate origin, and the second coordinate system is a coordinate system constructed on the target assembly vehicle, the deployment position information includes the first coordinate, and the coordinate conversion information is used to indicate the conversion relationship between the coordinates in the first coordinate system and the coordinates in the second coordinate system; the coordinate conversion information is used to convert the second coordinate of the target positioning slot in the second coordinate system into the target coordinate in the first coordinate system, wherein the carrier information includes the second coordinate, and the target position information includes the target coordinate.

2. The method according to claim 1, characterized in that Generating the target movement parameter of the adjustment module according to the current reference position of the positioning module and the target position information includes: Calculating position information between the target positioning slot and the positioning module based on the reference position and the target position information, wherein the position information is used to indicate a relative position relationship between the target positioning slot and the positioning module; The target movement parameter of the adjustment module is generated according to the position information.

3. The method according to claim 2, characterized in that The adjustment module includes a first bridge and a second bridge, wherein the first end of the first bridge is connected to the second bridge and the second bridge is perpendicular to the first bridge, the first end of the second bridge is connected to the loading platform and the second bridge is perpendicular to the platform surface of the loading platform, the length of the second bridge is equal to the second side of the loading platform and the second bridge is parallel to the second side, the first bridge is configured to allow movement along the first side, the first side is the side on the platform surface of the loading platform that intersects with the first side, the second bridge is configured to allow up and down movement along the first bridge, and the positioning module is deployed on the second bridge, and the positioning module is configured to allow movement along the second bridge. Generating the target movement parameter of the adjustment module according to the position information includes: Determine a first distance between the target positioning groove and the positioning module in a first direction as a first moving distance of the first bridge along the first side, wherein the first direction is a moving direction of the first bridge along the first side; Determine a second distance between the target positioning groove and the positioning module in a second direction as a second moving distance of the second bridge along the first bridge, wherein the second direction is a direction perpendicular to the platform surface of the loading platform; The third distance between the target positioning groove and the positioning module in the third direction is determined as the third moving distance of the positioning module along the second bridge, wherein the third direction is the moving direction of the positioning module along the second bridge, the position information includes the first distance, the second distance and the third distance, and the target movement parameters include the first moving distance, the second moving distance and the third moving distance.

4. The method according to claim 1, wherein The acquiring of the deployment position information of the target assembly vehicle on the loading platform includes: Collecting first relative position information of a plurality of reference reference points on the target assembly vehicle relative to the target reference point on the loading platform, wherein the first relative position information is used to indicate a relative position relationship between the reference reference points and the target reference point; The first relative position information is used to generate first coordinates of the reference datum point in a first coordinate system.

5. The method according to claim 1, wherein The carrier fixing device further includes a base, the carrier platform is disposed on the base, and the carrier platform is configured to allow movement on the base. After controlling the adjustment module to move the positioning module to the target positioning slot in a movement manner indicated by the target movement parameter, the method further includes: Obtaining a relative distance between the target assembly tool and an assembly device for assembling a circuit board; generating a reference movement parameter corresponding to the relative distance when the relative distance between the target assembly tool and the assembly equipment for assembling circuit boards is greater than a target distance, wherein the reference movement parameter is used to indicate a movement mode of the loading platform on the base; The carrier platform is moved to a target position on the base in a movement manner indicated by the reference movement parameters, wherein when the carrier platform is at the target position, the relative distance between the target assembly tool and the assembly equipment is less than or equal to the target distance.

6. The method according to claim 5, characterized in that The obtaining of the relative distance between the target assembly tool and an assembly device for assembling a circuit board includes: Collecting second relative position information of the assembly device relative to the target reference point on the loading platform, wherein the second relative position information is used to indicate the relative position relationship between the assembly device and the target reference point; generating a third coordinate of the assembly device in the first coordinate system using the second relative position information, wherein the first coordinate system is a coordinate system constructed on the loading platform with the target reference point as a coordinate origin; The first coordinate and the third coordinate of the target assembly tool in the first coordinate system are calculated to obtain a relative distance between the target assembly tool and the assembly equipment, wherein the target position information includes the first coordinate.

7. A carrier fixing device, characterized in that: The carrier fixing device includes a processor, a carrier platform, an adjustment module and a positioning module, wherein the adjustment module is deployed on the carrier platform, the positioning module is connected to the adjustment module, the carrier platform is used to place various types of assembly carriers required for preparing circuit boards, and different types of assembly carriers are used to prepare different types of circuit boards. Positioning grooves are provided on the assembly carrier, and the adjustment module is used to adjust the relative position relationship between the positioning module and the positioning grooves on the assembly carrier, and the processor is used to execute the steps of the method described in any one of claims 1 to 6.

8. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the method described in any one of claims 1 to 6 when executed by a processor.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

Citation Information

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