A method, device, equipment and medium for determining micro-porosity of binderless hard metal

Abstract

The application discloses a kind of binderless hard metal microporosity determination method, device, equipment and medium, comprising: target binderless hard metal is vibrated and polished, so that the surface roughness of target binderless hard metal is lower than preset roughness threshold value;According to preset acquisition rule, obtain several field images on the surface of target binderless hard metal;Based on binary method, the porosity corresponding to each field image of target binderless hard metal is determined respectively, wherein each field image includes several pores;According to preset screening rule, one or more target field images are screened from several field images;According to the porosity of one or more target field images, the porosity of target binderless hard metal is determined.The application belongs to alloy porosity field.The application can more accurately determine the porosity of micropore in target binderless hard metal.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of alloy porosity, and particularly relates to a method, device, equipment and medium for determining micro-porosity of binderless hard alloy. BACKGROUND

[0002] The ultra-fine grain binderless hard alloy refers to a hard alloy material with WC grain size ≤0.5 μm and without or with a small amount of metal binder phase (<0.5 %), which has obvious advantages in wear resistance, corrosion resistance, oxidation resistance, polishing property and thermal conductivity compared with the traditional WC-Co hard alloy. The binderless hard alloy usually needs to be sintered under high temperature and high pressure to obtain a density of >99 %. There are two common methods for measuring the porosity of the hard alloy. The first method is to calculate the porosity by measuring the density. The second method is to measure the porosity by a metallographic optical microscope.

[0003] For the first method, the carbon content of the binderless hard alloy is almost a constant value, and it is difficult to control the carbon content in the actual production. There is usually a part of W2C phase in the alloy, and the content of the W2C phase calculated by the K value method of the XRD usually has an error of 5 %. The existence of the part of W2C phase affects the evaluation of the actual density of the alloy, in other words, the accuracy of the first method for measuring the porosity is low. For the second method, the micro-porosity in the binderless hard alloy usually exists in the grain boundary of the alloy in the form of sub-micron or smaller pores, which cannot be detected under the low magnification (100-200 times) or even high magnification (1500 times) optical microscope, in other words, the second method cannot measure the micro-porosity in the binderless hard alloy. Therefore, how to accurately determine the porosity of the micro-porosity in the binderless hard alloy is a problem to be solved. SUMMARY

[0004] The embodiments of the present application provide a method, device, equipment and medium for determining the micro-porosity of the binderless hard alloy, solve the technical problem that the porosity of the micro-porosity of the binderless hard alloy cannot be accurately determined in the prior art, and achieve the technical effect that the porosity of the micro-porosity in the binderless hard alloy is accurately determined.

[0005] In a first aspect, the present application provides a method for determining the micro-porosity of a binderless hard alloy, and the method comprises the following steps.

[0006] Vibration polishing is performed on the target binderless hard alloy, so that the surface roughness of the target binderless hard alloy is lower than a preset roughness threshold.

[0007] According to a preset acquisition rule, a plurality of field images on the surface of the target binderless hard alloy are acquired.

[0008] According to the binarization method, the porosity corresponding to each field image of the target binderless hard alloy is determined respectively, wherein each field image includes a plurality of pores;

[0009] According to the preset screening rule, one or more target field images are screened from the plurality of field images;

[0010] According to the porosity of the one or more target field images, the porosity of the target binderless hard alloy is determined.

[0011] Further, according to the binarization method, the porosity corresponding to each field image of the target binderless hard alloy is determined respectively, including:

[0012] For each field image, steps S131-S133 are performed, including:

[0013] Step S131, the field image is binarized to obtain a binary image corresponding to the field image, wherein the field image and the binary image correspond one by one;

[0014] Step S132, iteratively adjust the threshold value until the similarity between the first target pore in the binary image and the second target pore in the corresponding field image is greater than the similarity threshold value, wherein the first target pore and the second target pore correspond one by one, the binary image includes a plurality of first target pores, and the field image includes a plurality of second target pores;

[0015] Step S133, according to the area proportion of all first target pores in the binary image, the porosity of the field image is determined.

[0016] Further, according to the preset acquisition rule, a plurality of field images on the surface of the target binderless hard alloy are acquired, including:

[0017] The shape of the target binderless hard alloy is acquired;

[0018] When the target binderless hard alloy is a square, a plurality of field images are acquired equidistantly on the diagonal lines of the target binderless hard alloy.

[0019] Further, according to the preset acquisition rule, a plurality of field images on the surface of the target binderless hard alloy are acquired, further including:

[0020] When the target binderless hard alloy is a circle, a plurality of field images are acquired equidistantly on any diameter of the target binderless hard alloy.

[0021] Further, before the target binderless hard alloy is vibrated and polished, the method further includes:

[0022] The target binderless hard alloy is coarsely polished, including:

[0023] placing a chromium oxide polishing solution, an aluminum oxide polishing solution, or a magnesium oxide polishing solution on a surface of the target binderless hard alloy;

[0024] controlling the polishing disc to perform a radial reciprocating motion and applying a first constant pressure;

[0025] after the coarse polishing is completed, performing fine polishing on the target binderless hard alloy, comprising:

[0026] placing a soft wool fabric on the surface of the target binderless hard alloy;

[0027] controlling the polishing disc to perform a radial reciprocating motion and applying a second constant pressure, the second constant pressure being lower than the first constant pressure;

[0028] finishing the fine polishing.

[0029] Further, according to a preset screening rule, one or more target field images are screened from the plurality of field images, comprising:

[0030] screening a field image with the most pores from the plurality of field images;

[0031] taking the field image with the most pores as the target field image.

[0032] Further, according to a preset screening rule, one or more target field images are screened from the plurality of field images, further comprising:

[0033] screening a field image with the most pores and a field image with the least pores from the plurality of field images and eliminating the field image with the least pores;

[0034] taking the remaining field images as the target field images.

[0035] In a second aspect, the present application provides a device for determining the micro-porosity of a binderless hard alloy, comprising:

[0036] a polishing module configured to perform vibration polishing on the target binderless hard alloy, so that the surface roughness of the target binderless hard alloy is lower than a preset roughness threshold;

[0037] an image acquisition module configured to acquire a plurality of field images on the surface of the target binderless hard alloy according to a preset acquisition rule;

[0038] a determination module configured to determine the porosity corresponding to each field image of the target binderless hard alloy based on a binary method, wherein each field image includes a plurality of pores;

[0039] a screening module configured to screen one or more target field images from the plurality of field images according to a preset screening rule;

[0040] a porosity determination module configured to determine the porosity of the target binderless hard metal according to the porosities of one or more target field of view images.

[0041] In a third aspect, the present application provides an electronic device, comprising:

[0042] a processor;

[0043] a memory for storing processor-executable instructions;

[0044] The processor is configured to perform to implement the binderless hard metal micro-porosity determination method provided in the first aspect.

[0045] In a fourth aspect, the present application provides a non-transitory computer-readable storage medium, when the instructions in the storage medium are executed by the processor of the electronic device, the electronic device can perform to implement the binderless hard metal micro-porosity determination method provided in the first aspect.

[0046] The one or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0047] The present application provides a binderless hard metal micro-porosity determination method, comprising: performing vibration polishing on a target binderless hard metal, so that the surface roughness of the target binderless hard metal is lower than a preset roughness threshold; obtaining a plurality of field of view images on the surface of the target binderless hard metal according to a preset acquisition rule; determining the porosity corresponding to each field of view image of the target binderless hard metal based on a binary method, wherein each field of view image includes a plurality of pores; selecting one or more target field of view images from the plurality of field of view images according to a preset screening rule; and determining the porosity of the target binderless hard metal according to the porosities of the one or more target field of view images. Compared with the prior art which cannot accurately determine the porosity of the micro-pores in the target binderless hard metal, the present application can accurately determine the porosity of the micro-pores in the target binderless hard metal. BRIEF DESCRIPTION OF DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0049] Figure 1 A flowchart of a binderless hard metal micro-porosity determination method provided by the present application is shown in the figure;

[0050] Figure 2 A schematic view of a field of view image provided for the present application;

[0051] Figure 3 A schematic view of a corresponding binarized image provided for the present application; Figure 2 A schematic view of a corresponding binarized image provided for the present application;

[0052] Figure 4 A structural schematic view of a binderless hard alloy microporosity determination device provided for the present application;

[0053] Figure 5 A structural schematic view of an electronic device provided for the present application. DETAILED DESCRIPTION

[0054] The embodiment of the present application provides a binderless hard alloy microporosity determination method, and solves the technical problem that it is difficult to accurately determine the porosity of the micropore of the binderless hard alloy in the prior art.

[0055] The technical scheme of the embodiment of the present application is to solve the above technical problem, and the general idea is as follows:

[0056] A binderless hard alloy microporosity determination method, the method comprising: performing vibration polishing on a target binderless hard alloy, so that the surface roughness of the target binderless hard alloy is lower than a preset roughness threshold; obtaining a plurality of field of view images on the surface of the target binderless hard alloy according to a preset acquisition rule; determining the porosity corresponding to each field of view image of the target binderless hard alloy based on a binary method, wherein a plurality of pores are included in each field of view image; screening one or more target field of view images from the plurality of field of view images according to a preset screening rule; and determining the porosity of the target binderless hard alloy according to the porosity of the one or more target field of view images.

[0057] In order to better understand the above technical scheme, the above technical scheme will be described in detail in combination with the drawings of the specification and the specific embodiments.

[0058] Firstly, the term "and / or" appearing in the present text is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that there are three cases of A alone, A and B together, and B alone. In addition, the character " / " in the present text generally represents an "or" relationship between the front and rear associated objects.

[0059] In the prior art, the W2C phase content in the binderless hard alloy cannot be accurately quantified, thereby affecting the measurement of the actual density of the alloy, resulting in errors in the calculation of the density; and the conventional metallographic porosity evaluation method is not applicable to the porosity of <A02B00 (that is, the binderless hard alloy with smaller porosity), and the purpose of the present application is to determine the porosity of the <A02B00 porosity in the binderless hard alloy.

[0060] The present application provides a binderless hard alloy microporosity determination method as shown in Figure 1 The method comprises steps S11-S15:

[0061] Step S11, vibration polishing the target binderless hard alloy, so that the surface roughness of the target binderless hard alloy is lower than a preset roughness threshold.

[0062] Step S12, according to a preset acquisition rule, acquiring a plurality of field images on the surface of the target binderless hard alloy.

[0063] Step S13, based on the binary method, respectively determining the porosity corresponding to each field image of the target binderless hard alloy, wherein each field image includes a plurality of pores.

[0064] Step S14, according to a preset screening rule, screening one or more target field images from the plurality of field images.

[0065] Step S15, according to the porosity of the one or more target field images, determining the porosity of the target binderless hard alloy.

[0066] Step S11, vibration polishing the target binderless hard alloy, so that the surface roughness of the target binderless hard alloy is lower than a preset roughness threshold.

[0067] Before vibration polishing the target binderless hard alloy, the method further comprises: rough polishing the target binderless hard alloy, comprising: placing chromium oxide polishing liquid, aluminum oxide polishing liquid or magnesium oxide polishing liquid on the surface of the target binderless hard alloy; controlling the polishing disc to perform radial reciprocating motion and applying a first constant pressure; after ending the rough polishing, fine polishing the target binderless hard alloy, comprising: placing soft wool fabric on the surface of the target binderless hard alloy; control the polishing disc to perform radial reciprocating motion and apply a second constant pressure, the second constant pressure is lower than the first constant pressure; end fine polishing.

[0068] Specifically, before the target binderless hard metal is subjected to the vibration polishing, the target binderless hard metal can be subjected to mechanical polishing, which includes a coarse polishing stage and a fine polishing stage. During the machining of the workpiece, the target binderless hard metal may have some fine protrusions, depressions, oxide scales and scratches. If the vibration polishing is directly performed, the surface may not be uniform, and the desired machining requirements cannot be met. However, the mechanical polishing can eliminate these problems and make the surface of the workpiece smooth and more suitable for further vibration polishing. In other words, before the target binderless hard metal is subjected to the vibration polishing, the target binderless hard metal is subjected to the mechanical polishing, which can eliminate unnecessary pores of the target binderless hard metal and improve the smoothness of the target binderless hard metal.

[0069] After the mechanical polishing, the vibration polishing can be performed, which aims to remove the surface deformation layer remaining after the mechanical polishing and quickly remove the micro scratches and deformation layer left on the surface of the sample after the mechanical polishing, so as to obtain a smooth and stress-free surface.

[0070] Through the mechanical polishing and the vibration polishing, the surface of the target binderless hard metal can be smooth, which is more conducive to determining the porosity of the target binderless hard metal (to avoid interference caused by large pores). In addition, the preset roughness threshold can be 0.02 μm.

[0071] In step S12, a plurality of field images on the surface of the target binderless hard metal are acquired according to a preset acquisition rule.

[0072] Generally, the target binderless hard metal used for the experiment is of a regular shape, for example, a rectangle (square) or a circle.

[0073] In order to more comprehensively obtain the pores on the surface of the target binderless hard metal, when the target binderless hard metal is a rectangle (square), a plurality of field images are sequentially and equidistantly acquired on the diagonal lines of the target binderless hard metal.

[0074] It can be understood that sequentially and equidistantly acquiring a plurality of field images on the diagonal lines of the target binderless hard metal can ensure that all surfaces of the target binderless hard metal can be more comprehensively covered (the pores on all surfaces of the target binderless hard metal are not uniformly distributed). Specifically, the number of the field images can be 5, 10 or 20, or can be determined according to the actual size of the target binderless hard metal.

[0075] When the target binderless hard metal is a circle, a plurality of field images are sequentially and equidistantly acquired on any diameter of the target binderless hard metal.

[0076] When the target unbound cemented carbide is circular, the rules for obtaining the field of view image are the same as those for the "rectangular" type mentioned above. The goal is to obtain the field of view image of all parts of the target unbound cemented carbide surface as comprehensively as possible, which will not be elaborated here.

[0077] Step S13: Based on the binary method, determine the porosity corresponding to each field image of the target unbound phase cemented carbide, wherein each field image includes several pores.

[0078] For each field of view image, steps S131-S133 are performed, including:

[0079] Step S131: Binarize the field image to obtain a binarized image corresponding to the field image, wherein the field image and the binarized image correspond one-to-one.

[0080] Step S132: Iteratively adjust the threshold until the similarity between the first target aperture in the binarized image and the corresponding second target aperture in the field of view image is greater than the similarity threshold. The first target aperture and the second target aperture correspond one-to-one. The binarized image includes a number of first target apertures and the field of view image includes a number of second target apertures.

[0081] Step S133: Determine the porosity of the field of view image based on the area ratio of all first target pores in the binarized image.

[0082] Observation can be performed under an electron microscope, obtaining several field-of-view images as described in step S12. Each field-of-view image contains several pores. Figure 2 This is a schematic diagram of a certain field of view.

[0083] Binarize the field-of-view image to obtain a binary image corresponding to the field-of-view image, such as... Figure 3 To and Figure 2 The corresponding binarized image. When the binarized image is obtained, the threshold is 0, and the binarized image is black. Although there are holes in the binarized image, they are not visible because the entire binarized image is black.

[0084] In this application, a single threshold segmentation method is adopted. The first threshold is set to zero, and the second threshold is continuously adjusted. The image is continuously compared with the field of view image. When the similarity between the first target aperture in the binarized image and the second target aperture in the field of view image is greater than the similarity threshold (the similarity needs to consider both the similarity of the area occupied by the two apertures and the similarity of the contour), the porosity of the field of view image can be determined by using several first target apertures in the binarized image.

[0085] like Figure 2 and Figure 3 As shown, Figure 2There are several second target pores in the image, Figure 3 There are several first target pores in the image, wherein the second target pores A correspond to the first target pores B. (Generally, the background of the field-of-view image is a gray map, and the pores are black; the background of the binary image is black, and the pores are red)

[0086] In the step S13, Figure 3 In the step S13, Figure Three All are black, and the pores are invisible. By continuously adjusting the threshold value, the outline of the first target pores is more clear. When the threshold value is 【55±10】, the similarity between the second target pores A and the first target pores B is greater than the similarity threshold value (that is, the similarity between the area of A and the area of B, the similarity between the outline of A and the outline of B). In the same way, continuously adjust the remaining second target pores and the first target pores. When they are all greater than the similarity threshold value, the porosity of the target binderless hard metal can be determined by using the several first target pores in the binary image.

[0087] The ratio between the sum of the areas of all the first target pores in the binary image and the area of the binary image is taken as the porosity of the field-of-view image.

[0088] In the step S14, one or more target field-of-view images are selected from the several field-of-view images according to a preset screening rule.

[0089] It needs to be noted that in a real working environment, in order to reduce the working steps and improve the efficiency, in the step S13, the electron microscope can be directly used to observe several fields of view. If the pores of a certain field of view are obviously more than those of the remaining fields of view, the porosity of the field of view with the most pores can be directly taken as the porosity of the target binderless hard metal. In other words, for this case, it is not necessary to perform the step S14.

[0090] In addition, one or more target field-of-view images can be selected by the following methods, including method {1} and {method 2}.

[0091] {Method 1}: The field-of-view image with the most pores is selected from the several field-of-view images; and the field-of-view image with the most pores is taken as the target field-of-view image.

[0092] {Method 2}: The field-of-view image with the most pores and the field-of-view image with the least pores are selected from the several field-of-view images and are removed; and the remaining field-of-view images are all taken as the target field-of-view images.

[0093] In the step S15, the porosity of the target binderless hard metal is determined according to the porosity of the one or more target field-of-view images.

[0094] When the method {1} in step S14 is adopted, the porosity of the field of view image with the most pores is the porosity of the target binderless hard alloy. When the method {2} in step S14 is adopted, the average value of the porosities of the target field of view images is taken as the porosity of the target binderless hard alloy.

[0095] In summary, the present application provides a method for determining the micro-porosity of a binderless hard alloy, which comprises: performing vibration polishing on a target binderless hard alloy, so that the surface roughness of the target binderless hard alloy is lower than a preset roughness threshold; obtaining a plurality of field of view images on the surface of the target binderless hard alloy according to a preset acquisition rule; determining the porosity corresponding to each field of view image of the target binderless hard alloy based on a binary method, wherein each field of view image includes a plurality of pores; selecting one or more target field of view images from the plurality of field of view images according to a preset screening rule; and determining the porosity of the target binderless hard alloy according to the porosity of the one or more target field of view images. Compared with the prior art which cannot accurately determine the porosity of the micro-pores in the target binderless hard alloy, the present application can accurately determine the porosity of the micro-pores in the target binderless hard alloy. Specific embodiments:

[0097] Two ultra-fine grain binderless hard alloy samples with different densities were taken as the research objects. The density of sample No. 1 was 15.33 g / cm 3 , and the density of sample No. 2 was 15.67 g / cm 3 . An electric spark wire cutting ultra-fine grain binderless hard alloy sample was used to form a detection surface with a diameter of 6 mm. First, the cutting sample was embedded into a 30 mm sample using a hot-pressing machine and conductive resin, and then the sample was ground and polished on a struers automatic grinding and polishing machine. The surface to be characterized of the hot-embedded sample was first ground flat using a diamond grinding disc with water as the grinding agent to remove the surface resin and the heat-affected zone after electric spark wire cutting. Then, the sample was mechanically polished once on a polishing cloth using micron-sized diamond suspension as the polishing agent. Finally, the surface was cleaned with ethanol and dried with cold air to obtain a once-polished sample. Second, the once-polished sample was polished twice on a buehler vibration polisher using sol-gel alumina suspension as the second mechanical polishing medium, a standard weight of 600 g, and a vibration frequency of 40 Hz for 4 h to obtain a twice-polished sample. The sample was cleaned and dried to obtain a binderless hard alloy SEM sample. Finally, a representative area image was obtained using an EVO18 type scanning electron microscope, and the image data was processed using a binary method. A single threshold segmentation method was used, with the first threshold set to zero and the second threshold adjusted to 60. The porosity measurement result of sample 1 was 0.41%, and the porosity measurement result of sample 2 was 0.01%.

[0098] Based on the same inventive concept, the present application provides a kind of electronic device as shown in Figure 4 The device comprises:

[0099] A polishing module 41 is used for vibration polishing the target binderless hard alloy, so that the surface roughness of the target binderless hard alloy is less than a preset roughness threshold value;

[0100] An image acquisition module 42 is used for acquiring a plurality of field images on the surface of the target binderless hard alloy according to a preset acquisition rule;

[0101] A determination module 43 is used for determining the porosity corresponding to each field image of the target binderless hard alloy based on a binary method, wherein each field image includes a plurality of pores;

[0102] A screening module 44 is used for screening one or more target field images from the plurality of field images according to a preset screening rule;

[0103] A porosity determination module 45 is used for determining the porosity of the target binderless hard alloy according to the porosity of one or more target field images.

[0104] Based on the same inventive concept, the present application also provides a kind of electronic device as shown in Figure 5 The electronic device comprises:

[0105] A processor 51;

[0106] A memory 52 for storing executable instructions of the processor 51;

[0107] The processor 51 is configured to execute to implement the method for determining the micro-porosity of the binderless hard alloy as described above.

[0108] Based on the same inventive concept, the present application also provides a kind of non-transitory computer readable storage medium, when the instructions in the storage medium are executed by the processor 51 of the electronic device, so that the electronic device can execute the method for determining the micro-porosity of the binderless hard alloy as described above.

[0109] Since the electronic device introduced in the embodiment is the electronic device used to implement the method for processing information in the embodiment of the present application, the specific implementation of the electronic device and its various forms can be understood by those skilled in the art based on the method for processing information introduced in the embodiment of the present application, so the electronic device how to implement the method in the embodiment of the present application will not be introduced in detail. As long as the electronic device used to implement the method for processing information in the embodiment of the present application is implemented by those skilled in the art, it belongs to the scope of the present application.

[0110] Those skilled in the art will appreciate that embodiments of the present application can be readily used as software, hardware, or a combination of software and hardware. In one

[0111] The present application is described in reference to the flowchart illustrations and / or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart Figure One one or more functions specified in the flowchart block or blocks. Figure One means for performing each of the functions specified in the flowchart block or blocks.

[0112] These computer program instructions can also be stored in a computer- readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the Figure One one or more functions specified in the flowchart block or blocks. Figure One means for performing each of the functions specified in the flowchart block or blocks.

[0113] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure One one or more functions specified in the flowchart block or blocks. Figure One means for performing each of the functions specified in the flowchart block or blocks.

[0114] While preferred embodiments of the application have been described, those skilled in the art will appreciate that additional modifications and variations to the preferred embodiments are possible in light of the above teachings. It is, therefore, intended that the appended claims be construed to cover all such modifications and variations as fall within the true spirit and scope of the present application.

[0115] Obviously, many modifications and variations of the present application are possible in light of the above teachings. It is, therefore, to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A binder phase-free cemented carbide microporosity determination method, characterized by, The method comprises: vibration polishing of the target binderless hard alloy, so that the surface roughness of the target binderless hard alloy is lower than a preset roughness threshold; acquiring a plurality of field images on the surface of the target binderless hard alloy according to a preset acquisition rule; determining the porosity of each field image of the target binderless hard alloy based on a binary method, wherein each field image includes a plurality of pores, comprising: for each field image, steps S131-S133 are performed, comprising: step S131, binaryzation processing of the field image to obtain a binary image corresponding to the field image, wherein the field image and the binary image are one-to-one corresponding; step S132, iteratively adjusting the threshold until the similarity between the first target pore in the binary image and the second target pore in the corresponding field image is greater than a similarity threshold, wherein the first target pore and the second target pore are one-to-one corresponding, the binary image includes a plurality of first target pores, and the field image includes a plurality of second target pores; step S133, determining the porosity of the field image according to the area ratio of all first target pores in the binary image; screening one or more target field images from the plurality of field images according to a preset screening rule, comprising: screening the field image with the most pores from the plurality of field images; taking the field image with the most pores as the target field image; further comprising: screening the field image with the most pores and the field image with the least pores from the plurality of field images and removing them; taking the remaining field images as target field images; determining the porosity of the target binderless hard alloy according to the porosity of one or more target field images.

2. A method of determining the microporosity of a binderless cemented carbide according to claim 1, characterized in that The method comprises: acquiring the shape of the target binderless hard alloy; when the target binderless hard alloy is a square, a plurality of field images are sequentially and equidistantly acquired on the diagonal lines of the target binderless hard alloy.

3. A method of determining the microporosity of a binderless cemented carbide according to claim 2, c h a r a c t e r i s e d in that The method comprises: when the target binderless hard alloy is a circle, a plurality of field images are sequentially and equidistantly acquired on any diameter of the target binderless hard alloy.

4. A method of determining the microporosity of a binderless cemented carbide according to claim 1, characterized in that Before the vibration polishing of the target binderless hard alloy, the method further comprises: coarse polishing of the target binderless hard alloy, comprising: placing chromium oxide polishing liquid, aluminum oxide polishing liquid or magnesium oxide polishing liquid on the surface of the target binderless hard alloy; controlling the polishing disc to perform radial reciprocating motion and applying a first constant pressure; after the coarse polishing, fine polishing of the target binderless hard alloy, comprising: placing soft wool fabric on the surface of the target binderless hard alloy; controlling the polishing disc to perform radial reciprocating motion and applying a second constant pressure, the second constant pressure being lower than the first constant pressure; ending the fine polishing.

5. A binder phase free cemented carbide micro porosity determining device, characterized by The device is applied to the binderless hard alloy microporosity determination method of any one of claims 1-4, and the device comprises: The polishing module is configured to perform vibration polishing on the target binderless hard alloy, so that a surface roughness of the target binderless hard alloy is lower than a preset roughness threshold. The image acquisition module is configured to acquire a plurality of field-of-view images on the surface of the target binderless hard alloy according to a preset acquisition rule. The determination module is configured to determine a porosity corresponding to each field-of-view image of the target binderless hard alloy based on a binary method, wherein each field-of-view image includes a plurality of pores. The screening module is configured to screen one or more target field-of-view images from the plurality of field-of-view images according to a preset screening rule. The porosity determination module is configured to determine the porosity of the target binderless hard alloy according to the porosities of the one or more target field-of-view images.

6. An electronic device, comprising: comprise: a processor; a memory for storing instructions executable by the processor; wherein the processor is configured to execute to implement a method for determining the micro-porosity of a binderless hard alloy according to any one of claims 1 to 5.

7. A non-transitory computer-readable storage medium, when instructions in the storage medium are executed by a processor of an electronic device, the electronic device is enabled to implement a method for determining the micro-porosity of a binderless hard alloy according to any one of claims 1 to 5.

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