A boost inductor and a manufacturing method thereof

Abstract

The application discloses a boost inductor and a preparation method thereof, relates to the technical field of inductors, and the preparation method comprises the following steps: assembling a coil on a plastic framework; bonding an U-shaped magnetic core, a strip-shaped magnetic core and a ceramic sheet through glue to form an initial magnetic core body, the material of the U-shaped magnetic core and the strip-shaped magnetic core comprises one or more of iron-silicon powder, iron-silicon-aluminum powder and carbonyl iron powder; sleeving the initial magnetic core body in the plastic framework, bonding another U-shaped magnetic core on the initial magnetic core body to form a magnetic core body framework; baking and solidifying the magnetic core body framework; placing the solidified magnetic core body framework in an injection molding machine, inserting a nut, and integrally injection molding through the injection molding machine; after cooling, performing bus welding on the injection-molded magnetic core body framework to obtain a copper bar inductor assembly; performing ultrasonic cleaning on the copper bar inductor assembly, drying, and installing an NTC temperature sensor to obtain the boost inductor. The application can solve the technical problems of poor temperature rise performance and poor voltage resistance performance of a boost voltage in the prior art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of inductance, in particular to a boost inductance and a preparation method thereof. BACKGROUND

[0002] The boost inductance plays a role of a gearbox in an automobile, and has two main functions. First, it can change the direction of current to realize forward and reverse movement of the vehicle. Second, it can increase the output current through electronic control to accelerate the driving motor. Therefore, the boost inductance is crucial in the field of automobiles.

[0003] At present, the boost inductance generates a large amount of heat as the voltage increases. In a high-temperature environment, the magnetic element is prone to lose magnetism. Moreover, the boost inductance is generally prepared by a potting glue process. Although the potting glue process is simple and feasible, it also has some disadvantages, such as being prone to generate bubbles, which causes great hidden dangers in the insulation safety performance and voltage resistance performance of the boost inductance. SUMMARY

[0004] In view of the deficiencies of the prior art, the present application aims to provide a boost inductance and a preparation method thereof, and aims to solve the technical problem of poor temperature rise performance and voltage resistance performance of the boost voltage in the prior art.

[0005] In one aspect, the present application provides a preparation method of a boost inductance, which comprises the following steps:

[0006] Assembling by winding a coil on a plastic framework;

[0007] Preparing a U-shaped magnetic core, a strip-shaped magnetic core and a ceramic sheet, bonding the U-shaped magnetic core, the strip-shaped magnetic core and the ceramic sheet by glue to form an initial magnetic core body, and the material of the U-shaped magnetic core and the strip-shaped magnetic core comprises one or more of iron-silicon powder, iron-silicon-aluminum powder and carbonyl iron powder;

[0008] Sleeving the initial magnetic core body in the plastic framework, and bonding another U-shaped magnetic core to form a complete magnetic core body framework;

[0009] Placing the magnetic core body framework in a first preset temperature for a first preset time to solidify the glue;

[0010] Placing the solidified magnetic core body framework in an injection molding machine, inserting a nut, and integrally injection molding the nut at a second preset temperature, a first preset pressure for a second preset time, and cooling, wherein the insulating body glue of the injection molding comprises one or more of PBS resin, phenolic resin, epoxy resin, polyimide resin, polytetrafluoroethylene or B-triazene resin;

[0011] After cooling, the injection-molded magnetic core body framework is subjected to bus welding to obtain a copper bar inductance assembly.

[0012] The copper bar inductance assembly is ultrasonically cleaned for a third preset time, dried at a third preset temperature for a fourth preset time, and an NTC temperature sensor is installed to obtain a boost inductance.

[0013] Compared with the prior art, the boost inductance prepared by the preparation method of the boost inductance provided by the application can effectively improve the temperature rise performance and voltage resistance performance, specifically, low-loss U-shaped magnetic cores and strip-shaped magnetic cores are selected to reduce the temperature rise performance and inductance of the boost inductance, and an integral injection molding technology is used to reduce the generation of bubbles, so that the formed insulation layer is more compact and has smaller porosity, thereby improving the temperature rise performance and voltage resistance performance, thereby solving the technical problems of poor temperature rise performance and voltage resistance performance of the boost voltage in the prior art.

[0014] According to an aspect of the above technical solution, the magnetic permeability of the U-shaped magnetic core and the strip-shaped magnetic core is 25H / m-90H / m, and the magnetic loss is 3000kw / m 3 -4000kw / m 3 .

[0015] According to an aspect of the above technical solution, the first preset temperature is 140℃-160℃, and the first preset time is 10min-20min.

[0016] According to an aspect of the above technical solution, the second preset temperature is 160℃-260℃, and the second preset time is 12s-18s.

[0017] According to an aspect of the above technical solution, the first preset pressure is 55Mpa-90Mpa.

[0018] According to an aspect of the above technical solution, before the step of integrally injection molding for a second preset time at the second preset temperature and the first preset pressure by the injection molding machine, the method further comprises:

[0019] The preheating temperature of the injection molding machine is set to preheat the solidified magnetic core body framework, and the preheating temperature is 120℃-140℃.

[0020] According to an aspect of the above technical solution, the bus welding is copper welding, argon arc welding technology is used, and the welding depth is 1mm-3mm.

[0021] According to an aspect of the above technical solution, the third preset time is 3min-5min.

[0022] According to an aspect of the above technical solution, the third preset temperature is 70℃-90℃, and the fourth preset time is 25min-35min.

[0023] Another aspect of the present invention is to provide a boost inductor, which is prepared by the above-described method for preparing a boost inductor. Attached Figure Description

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a flowchart of the method for preparing the boost inductor of the present invention;

[0026] Figure 2 This is a cross-sectional view of the boost inductor of the present invention;

[0027] The above figures include the following reference numerals:

[0028] 10 plastic frame, 20 magnetic core, 21 U-shaped magnetic core, 22 bar magnetic core, 30 coil, 40 nut, 50 insulating resin. Detailed Implementation

[0029] To make the objectives, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Several embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be more thorough and complete.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and similar expressions used herein are for illustrative purposes only and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0031] In this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0032] Referring to Figure 1 , a preparation method of a boost inductor is provided, and the preparation method comprises steps S10-S16,

[0033] Step S10, assembling by winding a coil on a plastic framework;

[0034] Wherein, the coil adopts flat copper wire.

[0035] Step S11, preparing a U-shaped magnetic core, a bar-shaped magnetic core and a ceramic sheet, bonding the U-shaped magnetic core, the bar-shaped magnetic core and the ceramic sheet by glue to form an initial magnetic core body, and the materials of the U-shaped magnetic core and the bar-shaped magnetic core include one or more materials of iron-silicon powder, iron-silicon-aluminum powder and carbonyl iron powder;

[0036] Wherein, the permeability of the U-shaped magnetic core and the bar-shaped magnetic core is 25H / m-90H / m, and the magnetic loss is 3000kw / m 3 -4000kw / m 3 .

[0037] It should be noted that the material of the U-shaped magnetic core and the bar-shaped magnetic core will affect the permeability and magnetic loss, resulting in differences in temperature rise coefficient of the boost inductor. Selecting a U-shaped magnetic core and a bar-shaped magnetic core with low loss can effectively reduce the working temperature of the boost inductor.

[0038] Step S12, sleeving the initial magnetic core body in the plastic framework and bonding another U-shaped magnetic core to form a complete magnetic core body framework;

[0039] Step S13, baking the magnetic core body framework at a first preset temperature for a first preset time to cure the glue;

[0040] Preferably, the first preset temperature is 140℃-160℃, for example, it can be 140℃, 145℃, 150℃, 155℃ or 160℃, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0041] Preferably, the first preset time is 10min-20min, for example, it can be 10min, 12min, 15min, 17min or 20min, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0042] Step S14, after the solidification of the magnetic core body framework is placed in the injection molding machine, and the nut is inserted, and the injection molding machine is used to integrally injection mold the second preset time at the second preset temperature and the first preset pressure, and then cooled, the injection molding insulating body is made of one or more of PBS resin, phenolic resin, epoxy resin, polyimide resin, polytetrafluoroethylene or B-triazene resin;

[0043] Wherein, by integrally injection molding, the generation of bubbles is reduced, which can make the boost inductance show certain advantages in inductance value and temperature rise, so that the insulation of the boost inductance is better, the gap between the magnetic core and the coil is small, the insulation layer formed by injection molding is more compact, and the porosity is smaller, so the voltage resistance is more excellent. In addition, the temperature rise is lower than that of the boost inductance using potting glue, because the integrality of the inductance using injection molding is better, and the water cooling setting is more conducive to heat dissipation and heat transfer.

[0044] Preferably, the second preset temperature is 160-260℃, for example, it can be 160℃, 170℃, 180℃, 19℃, 200℃, 210℃, 220℃, 230℃, 240℃, 250℃ or 260℃, but not limited to the listed values, other values not listed in the value range are also applicable.

[0045] Preferably, the second preset time is 12-18s, for example, it can be 12s, 13s, 14s, 15s, 16s, 17s or 18s, but not limited to the listed values, other values not listed in the value range are also applicable.

[0046] Preferably, the first preset pressure is 55-90Mpa, for example, it can be 55Mpa, 60Mpa, 65Mpa, 70Mpa, 75Mpa, 80Mpa, 85Mpa or 90Mpa, but not limited to the listed values, other values not listed in the value range are also applicable.

[0047] In addition, before the step of integrally injection molding the second preset time at the second preset temperature and the first preset pressure by the injection molding machine, it further comprises:

[0048] The preheating temperature of the injection molding machine is set to preheat the solidified magnetic core body framework, and the preheating temperature is 120-140℃.

[0049] Step S15, after cooling, the injection molded magnetic core body framework is subjected to bus welding to obtain a copper bar inductance assembly;

[0050] Wherein, the bus welding is copper bar welding, and argon arc welding technology is used, and the welding depth is 1-3mm.

[0051] It should be noted that the argon arc welding technology will achieve the effects of bright and burr-free welding surface, no black spots on the welding site, no blackening on the unpainted pin, and improved performance of the boost inductor.

[0052] Step S16, ultrasonic cleaning the copper bar inductor assembly for a third preset time, drying at a third preset temperature for a fourth preset time, installing an NTC temperature sensor, and obtaining a boost inductor.

[0053] The third preset time is 3min-5min, for example, it can be 3min, 4min or 5min, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0054] Preferably, the third preset temperature is 70℃-90℃, for example, it can be 70℃, 75℃, 80℃, 85℃ or 90℃, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0055] Preferably, the fourth preset time is 25min-35min, for example, it can be 25min, 27min, 30min, 32min or 35min, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0056] Between ultrasonic cleaning and drying, it also includes blowing for a fifth preset time, and the fifth preset time is 0.5min-2min, for example, it can be 0.5min, 0.7min, 1min, 1.2min or 1.5min, but is not limited to the listed values, and other values not listed in the value range are also applicable.

[0057] Correspondingly, the application provides a boost inductor prepared by the preparation method of the boost inductor.

[0058] Please refer to Figure 2 , the boost inductor includes a plastic framework 10, a magnetic core body 20 arranged in the plastic framework, and a coil 30 wound on the plastic framework.

[0059] Further, the magnetic core body 20 includes two oppositely arranged U-shaped magnetic cores 21, and a strip-shaped magnetic core 22 wrapped in the two U-shaped magnetic cores 21, forming a complete racetrack shape.

[0060] Further, the nut 40 is inserted into both ends of the plastic framework 10, and the insulating body glue 50 is injection molded between the plastic framework 10 and the magnetic core body 20.

[0061] The application will be further described below with specific examples:

[0062] Example 1

[0063] The first embodiment of the present application provides a preparation method of a boost inductance, comprising steps S10-S16,

[0064] Step S10, assembling by winding the coil on the plastic framework;

[0065] Wherein, the coil adopts flat copper wire.

[0066] Step S11, preparing a U-shaped magnetic core, a strip-shaped magnetic core and a ceramic sheet, bonding the U-shaped magnetic core, the strip-shaped magnetic core and the ceramic sheet by glue to form an initial magnetic core body, the material of the U-shaped magnetic core and the strip-shaped magnetic core includes one or more materials of iron-silicon powder, iron-silicon aluminum powder and carbonyl iron powder;

[0067] The material of the U-shaped magnetic core and the strip-shaped magnetic core is iron-silicon.

[0068] Wherein, the magnetic permeability of the U-shaped magnetic core and the strip-shaped magnetic core is 25H / m-90H / m, and the magnetic loss is 3000kw / m 3 -4000kw / m 3 .

[0069] Step S12, sleeving the initial magnetic core body in the plastic framework and bonding another U-shaped magnetic core to form a complete magnetic core body framework;

[0070] Step S13, baking the magnetic core body framework at a first preset temperature for a first preset time to make the glue solidify;

[0071] Preferably, the first preset temperature is 150℃, and the first preset time is 15min.

[0072] Step S14, placing the solidified magnetic core body framework in an injection molding machine, inserting a nut, and integrally injection molding by the injection molding machine at a second preset temperature, a first preset pressure for a second preset time, and cooling, the injection molding insulating body gum includes one or more of PBS resin, phenolic resin, epoxy resin, polyimide resin, polytetrafluoroethylene or B-triazene resin;

[0073] Wherein, the second preset temperature is 200℃, and the second preset time is 15s.

[0074] Preferably, the first preset pressure is 70Mpa.

[0075] In addition, before the step of integrally injection molding by the injection molding machine at a second preset temperature, a first preset pressure for a second preset time, it further comprises:

[0076] Preheat temperature of the injection molding machine is set to preheat the solidified magnetic core body framework, and the preheat temperature is 130 DEG C.

[0077] After cooling, the injection molded magnetic core body framework is busbar welded to obtain a copper bar inductor assembly.

[0078] The busbar welding is copper bar welding, and argon arc welding technology is used, and the welding depth is 1mm-3mm.

[0079] The copper bar inductor assembly is ultrasonically cleaned for a third preset time, dried at a third preset temperature for a fourth preset time, and an NTC temperature sensor is installed to obtain a boost inductor.

[0080] The third preset time is 3min-5min, the third preset temperature is 80 DEG C, and the fourth preset time is 30min.

[0081] Between ultrasonic cleaning and drying, blowing for a fifth preset time is further included, and the fifth preset time is 1min.

[0082] Embodiment Two

[0083] The second embodiment of the application provides a preparation method of a boost inductor, and the preparation method of the boost inductor in the embodiment is different from the preparation method of the boost inductor in the first embodiment in that:

[0084] The materials of the U-shaped magnetic core and the strip-shaped magnetic core are both iron-silicon-chromium.

[0085] Embodiment Three

[0086] The third embodiment of the application provides a preparation method of a boost inductor, and the preparation method of the boost inductor in the embodiment is different from the preparation method of the boost inductor in the first embodiment in that:

[0087] The materials of the U-shaped magnetic core and the strip-shaped magnetic core are both iron-silicon-aluminum.

[0088] Embodiment Four

[0089] The fourth embodiment of the application provides a preparation method of a boost inductor, and the preparation method of the boost inductor in the embodiment is different from the preparation method of the boost inductor in the first embodiment in that:

[0090] The materials of the U-shaped magnetic core and the strip-shaped magnetic core are both carbonyl iron powder.

[0091] Embodiment Five

[0092] The fifth embodiment of the present application provides a preparation method of the boost inductor, and the preparation method of the boost inductor in the embodiment is different from the preparation method of the boost inductor in the first embodiment in that:

[0093] The second preset temperature is 160 DEG C.

[0094] Embodiment six

[0095] The sixth embodiment of the present application provides a preparation method of the boost inductor, and the preparation method of the boost inductor in the embodiment is different from the preparation method of the boost inductor in the first embodiment in that:

[0096] The second preset temperature is 260 DEG C.

[0097] Embodiment seven

[0098] The seventh embodiment of the present application provides a preparation method of the boost inductor, and the preparation method of the boost inductor in the embodiment is different from the preparation method of the boost inductor in the first embodiment in that:

[0099] The first preset pressure is 55 Mpa.

[0100] Embodiment eight

[0101] The eighth embodiment of the present application provides a preparation method of the boost inductor, and the preparation method of the boost inductor in the embodiment is different from the preparation method of the boost inductor in the first embodiment in that:

[0102] The first preset pressure is 90 Mpa.

[0103] Comparative example one

[0104] The first comparative example of the present application provides a preparation method of the boost inductor, and the preparation method of the boost inductor in the embodiment is different from the preparation method of the boost inductor in the first embodiment in that:

[0105] The traditional potting technology replaces the injection molding technology.

[0106] Comparative example two

[0107] The second comparative example of the present application provides a preparation method of the boost inductor, and the preparation method of the boost inductor in the comparative example is different from the preparation method of the boost inductor in the first embodiment in that:

[0108] The first preset pressure is 45 Mpa.

[0109] Comparative example three

[0110] The third comparative example of the present application provides a preparation method of a boost inductor, and the difference between the preparation method of the boost inductor in the third comparative example and the preparation method of the boost inductor in the first embodiment is that:

[0111] The second preset temperature is 140 DEG C.

[0112] Please refer to Table 1 below, which shows the parameters corresponding to the above-mentioned embodiments 1 to 8 and comparative examples 1 to 3 of the present application.

[0113] Table 1

[0114]

[0115]

[0116] It should be noted that the insulation withstand voltage is tested under the condition of 3000v pressure for 30s, and the inductor temperature is tested at an ambient temperature of 65 DEG C.

[0117] According to the data of embodiments 1 to 8 and comparative examples 1 to 3, compared with the potting glue technology, the use of one-piece injection molding technology can effectively improve the withstand voltage and temperature rise performance.

[0118] According to the data of embodiments 1 to 4, by setting the material of the U-shaped magnetic core and the strip-shaped magnetic core, the temperature rise performance and inductance of the boost inductor can be changed.

[0119] According to the data of embodiments 1, 5, 6 and comparative example 3, the temperature of injection molding will affect the compactness of the insulator glue after injection molding. If the temperature is too low, it will affect the molding effect of the insulator glue, directly leading to the compactness of the insulator glue structure after cooling, and poor insulation effect. If the temperature is too high, it will damage the copper wire insulation paint film.

[0120] According to the data of embodiments 1, 7, 8 and comparative example 2, the pressure of injection molding will affect the overall structure of the product. If the pressure is too high, it will cause the coil to deform, and if the pressure is too low, the filling effect will be poor, the skeleton strength of the insulator glue will be low, and in severe cases, the insulation performance of the product will be poor.

[0121] In summary, by adjusting the material of the U-shaped magnetic core and the strip-shaped magnetic core and the injection molding technology, the inductance, temperature rise performance and pressure resistance of the boost inductor are more excellent.

[0122] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0123] The above-described embodiments only express several implementation manners of the present application, which are described in a more specific and detailed manner, but cannot be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A method for fabricating a boost inductor, characterized in that, The preparation method comprises: Assembling by winding the coil on a plastic framework; Preparing a U-shaped magnetic core, a strip-shaped magnetic core and a ceramic sheet, bonding the U-shaped magnetic core, the strip-shaped magnetic core and the ceramic sheet by glue to form an initial magnetic core body, the material of the U-shaped magnetic core and the strip-shaped magnetic core comprising one or more of iron-silicon powder, iron-silicon-aluminum powder and carbonyl iron powder; Sleeving the initial magnetic core body in the plastic framework and bonding another U-shaped magnetic core to form a complete magnetic core body framework; Baking the magnetic core body framework at a first preset temperature for a first preset time to solidify the glue; Placing the solidified magnetic core body framework in an injection molding machine, inserting a nut, and performing integrated injection molding on the injection molding machine at a second preset temperature, a first preset pressure for a second preset time, and cooling, the injection molding insulating body gum comprising one or more of PBS resin, phenolic resin, epoxy resin, polyimide resin, polytetrafluoroethylene or B-triazene resin; After cooling, the injection-molded magnetic core body framework is subjected to bus welding to obtain a copper bar inductor assembly; The copper bar inductor assembly is subjected to ultrasonic cleaning for a third preset time, dried at a third preset temperature for a fourth preset time, and an NTC temperature sensor is installed to obtain a boost inductor.

2. The method of claim 1, wherein the step of forming the boost inductance comprises the step of: The magnetic permeability of the U-shaped magnetic core and the bar-shaped magnetic core is 25H / m-90H / m, and the magnetic loss is 3000kw / m 3 -4000kw / m 3 . ​ 3. The method of claim 1, wherein the step of forming the boost inductance comprises the step of: The first preset temperature is 140-160℃, and the first preset time is 10-20min. ​ 4. The method of claim 1, wherein the step of forming the boost inductance comprises the step of: The second preset temperature is 160-260℃, and the second preset time is 12-18s. ​ 5. The method of claim 4, wherein the step of forming the boost inductance comprises the step of: The first preset pressure is 55-90Mpa. ​ 6. The method of claim 1, wherein the step of forming the boost inductance comprises the step of: Before the step of performing integrated injection molding on the injection molding machine at a second preset temperature, a first preset pressure for a second preset time, it further comprises: ​ Setting the preheating temperature of the injection molding machine to preheat the solidified magnetic core body framework, and the preheating temperature is 120-140℃.

7. The method of claim 1, wherein the step of forming the boost inductance comprises the step of: The bus welding is copper bar welding, using argon arc welding technology, and the welding depth is 1-3mm. ​ 8. The method of claim 1, wherein the step of forming the boost inductance comprises the step of: The third preset time is 3-5min. ​ 9. The method of claim 1, wherein the step of forming the boost inductance comprises the step of: The third preset temperature is 70-90℃, and the fourth preset time is 25-35min. ​ 10. A boost inductor, comprising: The boost inductor is prepared by the preparation method of the boost inductor according to any one of claims 1-9.

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