Active cooling systems, servers and vehicles

Abstract

The embodiment of the present invention provides an active heat dissipation system, a server and a vehicle, which are applied in the field of heat dissipation technology. The system includes: a thermoelectric power generation component, a thermoelectric cooling component, a heat dissipation component and a working component; the first end of the thermoelectric power generation component is connected to the heat dissipation component, and the second end of the thermoelectric power generation component is connected to the working component; the third end of the thermoelectric cooling component is connected to the working component, and the fourth end of the thermoelectric cooling component is connected to the heat dissipation component; the thermoelectric power generation component is connected to the thermoelectric cooling component; the thermoelectric power generation component is used to output electric energy to the thermoelectric cooling component when there is a temperature difference between the heat dissipation component and the working component; the thermoelectric cooling component is used to transfer the heat of the working component to the heat dissipation component under the drive of electric energy to dissipate the heat of the working component. The present invention can improve the adaptability of the heat dissipation process.

Description

Technical Field

[0001] The present disclosure relates to the field of heat dissipation technology, and in particular to an active heat dissipation system, a server and a vehicle. Background Art

[0002] With the development of information technology, the power density of equipment has been continuously improved, and the heat dissipation demand per unit volume has increased sharply, which has put forward higher heat dissipation requirements.

[0003] Currently, a heat dissipation component, such as a heat sink, is placed in close contact with a heat generating device so that the heat dissipation component can remove heat from the device.

[0004] However, the current heat dissipation method cannot be adjusted according to the heat generation of the equipment. It is a completely passive heat dissipation and cannot perform heat dissipation adaptively. Summary of the invention

[0005] The embodiments of the present disclosure provide an active heat dissipation system, a server, and a vehicle to solve the problem that adaptive heat dissipation cannot be performed in the prior art.

[0006] In a first aspect, an embodiment of the present disclosure provides an active heat dissipation system, comprising a temperature difference power generation component, a thermoelectric cooling component, a heat dissipation component and a working component; a first end of the temperature difference power generation component is connected to the heat dissipation component, and a second end of the temperature difference power generation component is connected to the working component; a third end of the thermoelectric cooling component is connected to the working component, and a fourth end of the thermoelectric cooling component is connected to the heat dissipation component; the temperature difference power generation component is connected to the thermoelectric cooling component;

[0007] The temperature difference power generation component is used to output electric energy to the thermoelectric cooling component when there is a temperature difference between the heat dissipation component and the working component;

[0008] The thermoelectric cooling component is used to transfer the heat of the working component to the heat dissipation component under the drive of the electric energy, so as to dissipate the heat of the working component.

[0009] Optionally, the system further comprises a monitoring and regulating component;

[0010] The monitoring and regulating component is used to obtain the temperature of the working component;

[0011] The monitoring and regulating component is used to control the working power of the thermoelectric cooling component when the temperature change rate is within a preset first rate range.

[0012] Optionally, the monitoring and control component is used to control the operating power of other refrigeration and heat dissipation components other than the thermoelectric refrigeration component when the temperature change rate is within a preset second rate range; the preset second rate range is greater than the preset first rate range.

[0013] Optionally, the monitoring and control component is used to generate an alarm message when the temperature change rate is within a preset third rate range; the preset third rate range is greater than the preset second rate range.

[0014] Optionally, the system further comprises a power supply component; the power supply component is connected to the thermoelectric cooling component;

[0015] The power supply component is used to receive the power control signal sent by the monitoring and regulating component, and adjust the working power of the thermoelectric cooling component based on the power control signal.

[0016] Optionally, the thermoelectric power generation component includes an N-type semiconductor and a P-type semiconductor; the N-type semiconductor is the positive electrode of the thermoelectric power generation component, and the P-type semiconductor is the negative electrode of the thermoelectric power generation component;

[0017] The temperature difference power generation component is used to output electric energy to the thermoelectric cooling component through the N-type semiconductor and the P-type semiconductor when there is a temperature difference between the heat dissipation component and the working component.

[0018] Optionally, at least one working assembly is stacked to form a stacked working assembly, and an outer working assembly of the stacked working assembly is connected to at least one temperature difference power generation assembly and at least one thermoelectric refrigeration assembly;

[0019] The at least one temperature difference power generation component and the at least one thermoelectric refrigeration component are connected in series.

[0020] Optionally, the temperature difference power generation component is used to determine the temperature difference between the heat dissipation component and the working component based on the internal voltage difference and the Seebeck coefficient.

[0021] Optionally, the system further comprises an air cooling component and a broadband modulation component;

[0022] The air cooling component is used to dissipate heat from the working component;

[0023] The broadband modulation component is used to control the working power of the air cooling component.

[0024] Optionally, the heat dissipation component is a liquid cooling component, and the liquid cooling component includes a liquid cooling medium;

[0025] The liquid cooling component is used to dissipate heat from the working component based on the liquid cooling medium;

[0026] The monitoring and regulating component is used to control the temperature and / or flow rate of the liquid-cooling medium in the liquid-cooling component.

[0027] Optionally, the system further comprises a power generation control component;

[0028] The power generation control component is used to control the amount of electric energy output by the temperature difference power generation component to the thermoelectric refrigeration component.

[0029] Optionally, the system further comprises an external power supply, an extended temperature difference power generation component, and an extended thermoelectric refrigeration component; the connection circuit of the external power supply, the extended temperature difference power generation component, the extended thermoelectric refrigeration component, the temperature difference power generation component, and the thermoelectric refrigeration component comprises a first switch and a second switch;

[0030] The temperature difference power generation component is used to output electric energy to the thermoelectric refrigeration component when the first switch and the second switch are both in the first state;

[0031] The extended temperature difference power generation component and the extended temperature difference power generation component are used to work simultaneously with the temperature difference power generation component and the thermoelectric refrigeration component when the first switch is in the second state and the second switch is in the first state;

[0032] The external power supply is used to output electric energy to the thermoelectric cooling component when the first switch and the second switch are both in the second state.

[0033] Optionally, the thermoelectric cooling component is composed of a first semiconductor of a first type of material and a second semiconductor of a second type of material, and the first semiconductor and the second semiconductor are connected in series;

[0034] The thermoelectric power generation component is composed of a third semiconductor of a third type of material and a fourth semiconductor of a fourth type of material, and the third semiconductor and the fourth semiconductor are connected in series.

[0035] In a second aspect, an embodiment of the present disclosure provides a server, comprising the active heat dissipation system described in the first aspect.

[0036] In a third aspect, an embodiment of the present disclosure provides a vehicle, comprising the active cooling system described in the first aspect above.

[0037] Compared with the prior art, the present invention has the following advantages:

[0038] In the disclosed embodiment, the first end of the thermoelectric power generation component is connected to the heat dissipation component, and the second end of the thermoelectric power generation component is connected to the working component; the third end of the thermoelectric cooling component is connected to the working component, and the fourth end of the thermoelectric cooling component is connected to the heat dissipation component; the thermoelectric power generation component is connected to the thermoelectric cooling component; the thermoelectric power generation component is used to output electric energy to the thermoelectric cooling component when there is a temperature difference between the heat dissipation component and the working component; the thermoelectric cooling component is used to transfer the heat of the working component to the heat dissipation component under the drive of electric energy to dissipate the heat of the working component. Without the need for external power supply, the thermoelectric power generation component can generate electric energy and supply power to the thermoelectric cooling component based on the temperature difference between the heat dissipation component and the working component. Since the temperature difference is greater when the temperature of the working component is higher, the electric energy generated by the thermoelectric power generation component is greater, and the thermoelectric cooling component can cool with higher power. The active heat dissipation system based on the thermoelectric power generation component and the thermoelectric cooling component can adaptively perform cooling and heat dissipation according to the temperature difference change, realizing adaptive heat dissipation.

[0039] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for describing the embodiments are briefly introduced below.

[0041] Figure 1 A schematic diagram of the structure of an existing heat dissipation system provided in an embodiment of the present disclosure;

[0042] Figure 2 A schematic diagram of the structure of an active heat dissipation system provided in an embodiment of the present disclosure;

[0043] Figure 3 A schematic diagram of the structure of another active heat dissipation system provided in an embodiment of the present disclosure;

[0044] Figure 4 A schematic diagram of the structure of a thermoelectric power generation assembly provided in an embodiment of the present disclosure;

[0045] Figure 5 A schematic diagram of the structure of a thermoelectric cooling assembly provided in an embodiment of the present disclosure;

[0046] Figure 6 A front view of an active heat dissipation system provided by an embodiment of the present disclosure;

[0047] Figure 7 A top view of an active heat dissipation system provided by an embodiment of the present disclosure;

[0048] Figure 8 A schematic diagram of the series connection of a temperature difference power generation component and a thermoelectric cooling component provided in an embodiment of the present disclosure.

[0049] Reference numerals

[0050] 11. Heat dissipation component; 12. Working component; 13. Thermoelectric component; 131. Temperature difference power generation component; 132. Thermoelectric refrigeration component; 14. Monitoring and control component; 141. Broadband modulation component; 142. Temperature monitoring component; 143. Heat dissipation and control component; 15. Fan; 16. Power supply component; 171. First expansion area; 172. Second expansion area; 18. First switch; 19. Second switch. DETAILED DESCRIPTION

[0051] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can also be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0052] Currently, the heat dissipation component can be placed in close contact with the working component so that the heat on the working component can be directly transferred to the heat dissipation component. Figure 1 is a structural schematic diagram of an existing heat dissipation system provided by an embodiment of the present disclosure; Figure 1 The heat dissipation assembly 11 and a plurality of working assemblies 12 are included. The plurality of working assemblies 12 can be stacked, and then the uppermost working assembly 12 directly contacts the heat dissipation assembly 11 to dissipate heat.

[0053] Figure 2 1 is a structural schematic diagram of an active heat dissipation system provided by an embodiment of the present disclosure, wherein the active heat dissipation system comprises a temperature difference power generation component 131, a thermoelectric cooling component 132, a heat dissipation component 11 and a working component 12; a first end of the temperature difference power generation component 131 is connected to the heat dissipation component 11, and a second end of the temperature difference power generation component 131 is connected to the working component 12; a third end of the thermoelectric cooling component 132 is connected to the working component 12, and a fourth end of the thermoelectric cooling component 132 is connected to the heat dissipation component 11; the temperature difference power generation component 131 is connected to the thermoelectric cooling component 132;

[0054] The temperature difference power generation component 131 is used to output electric energy to the thermoelectric cooling component 132 when there is a temperature difference between the heat dissipation component 11 and the working component 12;

[0055] The thermoelectric cooling component 132 is used to transfer the heat of the working component 12 to the heat dissipation component 11 under the drive of the electric energy, so as to dissipate the heat of the working component 12 .

[0056] In the embodiment of the present disclosure, the heat dissipation component 11 may be made of aluminum alloy or brass, and the structure of the heat dissipation component 11 may be plate-shaped or sheet-shaped, so that the heat dissipation component 11 has good thermal conductivity, and the material and structure of the heat dissipation component 11 are not specifically limited herein. The working component 12 refers to a component that generates heat when working, such as an unpackaged bare chip, a chiplet (i.e., a pre-manufactured chip with a specific function that can be combined and integrated), a three-dimensional integrated circuit, various heat-generating components in a server, and various heat-generating components in a vehicle.

[0057] Thermoelectric power generation component 131 can be a component that converts thermal energy into electrical energy based on the Seebeck effect. The main principle of thermoelectric power generation component 131 is that the temperature of the two nodes of a thermocouple made of semiconductor is different, and carriers migrate from the hot end to the cold end under the temperature gradient, which can form an induced electromotive force, which can be used as a power supply to provide direct current after being connected to the working circuit. When the Seebeck coefficient of the internal material of the thermoelectric power generation component 131 remains unchanged, the induced electromotive force is proportional to the temperature difference.

[0058] Thermoelectric cooling component 132 can be a component that realizes direct cooling based on the Peltier effect. The main principle of thermoelectric cooling component 132 is: under the action of an external electric field, the carriers in the semiconductor migrate from the cooling end to the heating end, and the heat is transferred from the cold end to the hot end. The cold end is connected to the heating component, i.e., the working component 12, and the hot end is connected to the heat dissipation component 11, thereby realizing heat transfer and heat dissipation. When the Peltier coefficient of the internal material of the thermoelectric cooling component 132 remains unchanged, the amount of heat absorbed or released is proportional to the current intensity.

[0059] The first end (cold end) of the thermoelectric power generation component 131 can be connected to the heat dissipation component 11, and the second end (hot end) of the thermoelectric power generation component 131 can be connected to the working component 12, so that power can be generated based on the temperature difference between the heat dissipation component 11 (relatively low temperature) and the working component 12 (relatively high temperature). The thermoelectric power generation component 131 needs to be connected to the thermoelectric cooling component 132 to form a loop, so that the thermoelectric power generation component 131 can transmit the generated electrical energy to the thermoelectric cooling component 132.

[0060] The third end (cold end) of the thermoelectric cooling component 132 is connected to the working component 12 (relatively high temperature), and the fourth end (hot end) of the thermoelectric cooling component 132 is connected to the heat dissipation component 11 (relatively low temperature), so that under the drive of the electric energy provided by the temperature difference power generation component 131, the heat of the working component 12 can be transferred to the heat dissipation component 11.

[0061] Optionally, the system further comprises a monitoring and regulating component 14;

[0062] The monitoring and regulating component 14 is used to obtain the temperature of the working component 12;

[0063] The monitoring and regulating component 14 is used to control the working power of the thermoelectric cooling component 132 when the temperature change rate is within a preset first rate range.

[0064] Figure 3 is a structural schematic diagram of another active heat dissipation system provided by an embodiment of the present disclosure; Figure 3 The thermoelectric component 13 includes a thermoelectric component 13, which includes a temperature difference power generation component 131 and a thermoelectric cooling component 132. The temperature difference power generation component 131 and the thermoelectric cooling component 132 are both connected to the heat dissipation component 11. The thermoelectric component 13 is also connected to the monitoring and control component 14, which includes a broadband modulation component 141, a temperature monitoring component 142 and a heat dissipation control component 143. The broadband modulation component 141 is connected to the fan 15, and the wind force generated by the fan 15 acts on the working component 12. In addition, a power supply component 16 is included, and the power supply component 16 is connected to the thermoelectric cooling component 132.

[0065] The monitoring and regulating component 14 may be a baseboard management controller, and the baseboard management controller may obtain the temperature of the working component 12. It is understandable that when the server includes the active heat dissipation system of the present invention, the temperature monitoring component 142 in the baseboard management controller in the server may obtain the temperature of each component in the server, such as the temperature of the central processing unit, memory, and motherboard.

[0066] Among them, the monitoring and regulating component 14 can continuously obtain the temperature of the working component 12 and calculate the rate of change of the temperature. It can be understood that the rate of change of the temperature can be a heating rate or a cooling rate. The preset first rate range can refer to a range less than a specific threshold value. When the rate of change is within the preset first rate range, the monitoring and regulating component 14 controls the working power of the thermoelectric cooling component 132 through the heat dissipation regulating component 143, which can refer to keeping the current power of the thermoelectric cooling component 132 unchanged or changing the power.

[0067] The preset first rate range can be further divided. For example, the first rate range can include less than rate A and rate A to rate B. When the rate of change is less than rate A, it can be determined that the temperature change is small, and the current power of the thermoelectric cooling component 132 can be kept unchanged. When the heating rate is in the range of rate A to rate B, it can be determined that the temperature change is not large, and the working power of the thermoelectric cooling component 132 can be increased. The thermoelectric cooling component 132 is sufficient to control the temperature of the working component 12. When the cooling rate is in the range of rate A to rate B, it can also be determined that the temperature change is not large, but the working power of the thermoelectric cooling component 132 needs to be reduced.

[0068] Optionally, the monitoring and control component 14 is used to control the operating power of other refrigeration and heat dissipation components other than the thermoelectric refrigeration component 132 when the temperature change rate is within a preset second rate range; the preset second rate range is greater than the preset first rate range.

[0069] In the embodiment of the present disclosure, when the preset second rate range is greater than the preset first rate range and the temperature change rate is within the preset second rate range, the monitoring and control component 14 controls the working power of other refrigeration and heat dissipation components other than the thermoelectric refrigeration component 132. The principle of other refrigeration and heat dissipation components may be direct refrigeration and heat dissipation, or auxiliary heat dissipation, for example, the fan 15 does not refrigerate but only increases the air flow rate. Similarly, the temperature change rate may be a heating rate or a cooling rate. When the temperature rises and the heating rate is within the preset second rate range, the working power of other refrigeration and heat dissipation components may be increased. The other refrigeration and heat dissipation components may be the fan 15. When the temperature drops and the cooling rate is within the preset second rate range, the working power of other refrigeration and heat dissipation components is reduced.

[0070] Optionally, the monitoring and regulating component 14 is used to generate an alarm message when the temperature change rate is within a preset third rate range; the preset third rate range is greater than the preset second rate range.

[0071] In the embodiment of the present disclosure, the preset third rate range is greater than the preset second rate range. When the temperature change rate is within the preset third rate range, it can be considered that the purpose of power and heat dissipation matching and cooling cannot be achieved by regulating each refrigeration and heat dissipation component, and the server may be overloaded, so the monitoring and regulation component 14 can generate an alarm message to inform the user of the temperature abnormality. In general, the preset first rate range, the preset second rate range and the preset third rate range can be represented by the change rate thresholds A, B and C. The first rate range can be less than B, the second rate range can be within the range of B to C, and the third rate range can be greater than C.

[0072] Optionally, the system further includes a power supply component 16; the power supply component 16 is connected to the thermoelectric cooling component 132;

[0073] The power supply component 16 is used to receive the power control signal sent by the monitoring and regulating component 14, and adjust the working power of the thermoelectric cooling component 132 based on the power control signal.

[0074] Continue to refer Figure 3 As shown, the power supply component 16 may be a power supply component in a server. The power supply component 16 is connected to the thermoelectric cooling component 132. When the power supply component 16 receives the power control signal sent by the monitoring and regulating component 14, it may adjust the current input to the thermoelectric cooling component 132 based on the power control signal, thereby adjusting the working power of the thermoelectric cooling component 132. For example, when the temperature change rate is in the range of rate A to rate B, the power supply component 16 may provide additional electrical energy to the thermoelectric cooling component 132, thereby increasing the working power of the thermoelectric cooling component 132.

[0075] By implementing the embodiments of the present disclosure, the monitoring and regulating component 14 sends a power control signal to the power supply component 16, and then the working power of the thermoelectric cooling component 132 can be further adjusted based on the temperature difference power generation component 131, thereby improving the flexibility of heat dissipation.

[0076] Optionally, the thermoelectric power generation component 131 includes an N-type semiconductor and a P-type semiconductor; the N-type semiconductor is the positive electrode of the thermoelectric power generation component 131, and the P-type semiconductor is the negative electrode of the thermoelectric power generation component 131;

[0077] The temperature difference power generation component 131 is used to output electric energy to the thermoelectric cooling component 132 through the N-type semiconductor and the P-type semiconductor when there is a temperature difference between the heat dissipation component 11 and the working component 12 .

[0078] In the embodiment of the present disclosure, the thermoelectric power generation component 131 may include multiple N-type semiconductors and multiple P-type semiconductors, and the multiple N-type semiconductors and multiple P-type semiconductors may be connected in series. The N-type semiconductors at both ends of the first terminal are the positive electrodes of the thermoelectric power generation component 131, and the P-type semiconductors are the negative electrodes of the thermoelectric power generation component 131.

[0079] Figure 4 It is a structural schematic diagram of a thermoelectric power generation component provided in an embodiment of the present disclosure; the thermoelectric power generation component includes a plurality of N-type semiconductors 401 and a plurality of P-type semiconductors 402, and the plurality of N-type semiconductors 401 and the plurality of P-type semiconductors 402 are connected in series through metal, and the hot end and the cold end of the thermoelectric power generation component 131 both have an insulating layer.

[0080] Optionally, at least one working assembly 12 is stacked to form a stacked working assembly, and the outer working assembly 12 of the stacked working assembly is connected to at least one temperature difference power generation assembly 131 and at least one thermoelectric cooling assembly 132;

[0081] The at least one temperature difference power generation component 131 and the at least one thermoelectric cooling component 132 are connected in series.

[0082] In the embodiments of the present disclosure, reference Figure 1 As shown, at least one working component 12 is stacked to form a stacked working component. It should be noted that the stacking of working components here refers to the relative positional relationship between working components and does not limit how the internal stacking design of a single working component is, that is, it does not limit the internal structure of a single working component. Figure 5 is a schematic diagram of the structure of a thermoelectric cooling assembly provided in an embodiment of the present disclosure; Figure 5 The thermoelectric cooling component includes multiple N-type semiconductors 501 and multiple P-type semiconductors 502, and the multiple N-type semiconductors 501 and the multiple P-type semiconductors 502 are connected in series through metal. The cold end and the hot end of the thermoelectric cooling component have an insulating layer.

[0083] Figure 6 is a front view of the active heat dissipation system provided by an embodiment of the present disclosure; Figure 6 The active heat dissipation system may include two thermoelectric cooling components 132 and two temperature difference power generation components 131. The two thermoelectric cooling components 132 and the two temperature difference power generation components 131 are arranged in parallel in the top working component among the three working components 12, so only one thermoelectric cooling component 132 can be seen in the front view.

[0084] Figure 7 is a top view of an active heat dissipation system provided by an embodiment of the present disclosure; Figure 7 In the active heat dissipation system, in the top view, two thermoelectric cooling components 132 and two temperature difference power generation components 131 arranged in parallel can be seen. Above the two thermoelectric cooling components 132 and the two temperature difference power generation components 131 is the heat dissipation component 11.

[0085] Optionally, the temperature difference power generation component 131 is used to determine the temperature difference between the heat dissipation component 11 and the working component 12 based on the internal voltage difference and the Seebeck coefficient.

[0086] In the disclosed embodiment, the thermoelectric power generation component 131 works based on the Seebeck effect. The Seebeck coefficient is a physical quantity that describes the potential difference generated by a material under a temperature gradient, also known as the thermoelectric potential rate or the Seebeck coefficient, which can measure the thermovoltage generated by a material under a certain temperature difference. The Seebeck coefficient of the thermoelectric power generation component 131 is constant, and the temperature difference can be obtained by dividing the voltage difference by the Seebeck coefficient. The thermoelectric power generation component 131 can send the determined temperature difference result to the monitoring and control component 14, and the monitoring and control component 14 can determine the heat dissipation effect based on the temperature difference result. The smaller the temperature difference, the better the heat dissipation effect. It should be noted that the smaller the temperature difference, the better the heat dissipation effect may be only applicable to general situations, that is, when the overall heating situation is within the working capacity of the thermoelectric component 13, the smaller the temperature difference, the better the heat dissipation effect.

[0087] Optionally, the system further includes an air cooling component and a broadband modulation component 141;

[0088] The air cooling component is used to dissipate heat from the working component 12;

[0089] The broadband modulation component 141 is used to control the working power of the air cooling component.

[0090] In the embodiment of the present disclosure, the air cooling component may refer to Figure 3 The fan 15 in the fan 15 can dissipate heat for the working component 12 when the fan 15 is running. The broadband modulation component 141 can be a component based on pulse width modulation (PWM, Pulse-width modulation), that is, Figure 3 The broadband modulation component 141 in the embodiment can be used to adjust the power of the fan 15 through the broadband modulation component 141, thereby achieving wind cooling intensity adjustment.

[0091] Optionally, the heat dissipation component 11 is a liquid cooling component, and the liquid cooling component includes a liquid cooling medium;

[0092] The liquid cooling component is used to dissipate heat from the working component 12 based on the liquid cooling medium;

[0093] The monitoring and regulating component 14 is used to control the temperature and / or flow rate of the liquid cooling medium in the liquid cooling component.

[0094] In the disclosed embodiment, the heat dissipation component 11 may be a liquid cooling component, which includes a liquid cooling medium. The liquid cooling medium is a liquid used to transfer heat, and has characteristics such as high thermal conductivity, high specific heat, and high boiling point. The monitoring and control component 14 may control the temperature and / or flow rate of the liquid cooling medium in the liquid cooling component, for example, by controlling the working power of the pump that transports the liquid cooling medium to change the flow rate, and the temperature of the liquid cooling medium may be controlled by other temperature control components.

[0095] Optionally, the system further comprises a power generation control component;

[0096] The power generation control component is used to control the amount of electric energy output by the temperature difference power generation component 131 to the thermoelectric cooling component 132 .

[0097] A power generation control component can be set for the temperature difference power generation component 131 to control the amount of electric energy output by the temperature difference power generation component 131 to the thermoelectric cooling component 132. The power generation control component can include a resistor to achieve the function of voltage division and current limiting through the resistor, thereby controlling the amount of electric energy output by the temperature difference power generation component 131 to the thermoelectric cooling component 132.

[0098] In the embodiments of the present disclosure, a power generation control component is provided for the temperature difference power generation component 131, which can individually control the electric energy output by the temperature difference power generation component 131 to the thermoelectric cooling component 132, so that the working power of the thermoelectric cooling component 132 is more controllable and accurate, thereby improving the flexibility and accuracy of the heat dissipation process.

[0099] Optionally, the system further includes an external power supply, an extended temperature difference power generation component, and an extended thermoelectric refrigeration component; the connection circuit of the external power supply, the extended temperature difference power generation component, the extended thermoelectric refrigeration component, the temperature difference power generation component 131, and the thermoelectric refrigeration component 132 includes a first switch 18 and a second switch 19;

[0100] The temperature difference power generation component 131 is used to output electric energy to the thermoelectric cooling component 132 when the first switch 18 and the second switch 19 are both in the first state;

[0101] The extended temperature difference power generation component and the extended temperature difference power generation component are used to work simultaneously with the temperature difference power generation component 131 and the thermoelectric cooling component 132 when the first switch 18 is in the second state and the second switch 19 is in the first state;

[0102] The external power supply is used to output electric energy to the thermoelectric cooling component 132 when the first switch 18 and the second switch 19 are both in the second state.

[0103] In the disclosed embodiment, Figure 8 is a schematic diagram of the series connection of a temperature difference power generation component and a thermoelectric refrigeration component provided in an embodiment of the present disclosure; Figure 8 It includes two temperature difference power generation components 131 and two thermoelectric cooling components 132 (existing before expansion). Figure 8 It also includes a first switch 18 and a second switch 19, Figure 8 The arrow direction in the figure indicates the direction of the current in the circuit. The extended temperature difference power generation component and the extended thermoelectric cooling component can be located at Figure 8The number of the first expansion area 171 is unlimited. The external power supply is located in the second expansion area 172. It is understandable that, according to the needs, the first expansion area 171 and the second expansion area 172 can expand the thermoelectric component 13 (thermoelectric power generation component 131, thermoelectric cooling component 132), the power supply component 16 and the necessary logic circuit to enhance the scalability of the heat dissipation system and improve the adaptive cooling and heat dissipation capabilities.

[0104] When the first switch 18 and the second switch 19 are both in the first state (closed state), the thermoelectric power generation component 131 that existed before the expansion outputs electric energy to the thermoelectric cooling component 132 that existed before the expansion. Figure 8 The expanded thermoelectric power generation component and the expanded thermoelectric cooling component in the first expansion area 171 work simultaneously with the existing thermoelectric power generation component 131 and the existing thermoelectric cooling component 132 before the expansion. When the first switch 18 and the second switch 19 are both in the second state, the external power supply in the second expansion area 172 outputs electric energy to the existing thermoelectric cooling component 132 before the expansion.

[0105] It is understandable that the power supply assembly 16 can also be used as an external power supply here to replace Figure 8 For an external power supply in the circuit structure, the power supply component 16 can also execute the power supply strategy corresponding to the external power supply based on the switching states of the first switch 18 and the second switch 19.

[0106] In implementing the embodiments of the present disclosure, by providing a switch and an external power supply in the series circuit of the temperature difference power generation component 131 and the thermoelectric cooling component 132, the power source of the thermoelectric cooling component 132 can be flexibly switched, thereby improving the flexibility and fault tolerance of the heat dissipation process.

[0107] Optionally, the thermoelectric cooling component 132 is composed of a first semiconductor of a first type of material and a second semiconductor of a second type of material, and the first semiconductor and the second semiconductor are connected in series;

[0108] The temperature difference power generation component 131 is composed of a third semiconductor of a third type of material and a fourth semiconductor of a fourth type of material, and the third semiconductor and the fourth semiconductor are connected in series.

[0109] In the embodiments of the present disclosure, reference Figure 4 The N-type semiconductor 401 and the P-type semiconductor 402 of the thermoelectric power generation component 131 are made of different semiconductor materials, and the first semiconductor and the second semiconductor are connected in series. Figure 5The N-type semiconductor 501 and the P-type semiconductor 502 of the thermoelectric cooling component 132 are made of different semiconductor materials, and the third semiconductor and the fourth semiconductor are connected in series.

[0110] The active heat dissipation system in the present invention can use waste heat to generate electricity and drive the refrigeration components to work, so that the working components can achieve active heat dissipation. The refrigeration capacity is positively correlated with the heat generated by the working components, that is, when more heat is generated and the temperature difference is large, the induced electromotive force becomes larger, and the thermoelectric refrigeration capacity is improved. Therefore, the invention has the ability of adaptive active regulation and control, and can be used in the temperature monitoring and heat dissipation regulation system of the server, which can improve the heat dissipation efficiency of the server and achieve balanced heat dissipation. At the same time, real-time monitoring of the heat dissipation efficiency of the components can prevent the risks of overload and component failure. When related risks occur, issuing alarm information can ensure the safe operation of the server.

[0111] The present invention provides a server, which comprises the above-mentioned active heat dissipation system.

[0112] The present invention provides a vehicle, which comprises the above-mentioned active heat dissipation system.

[0113] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0114] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. For the embodiments of the system, electronic device, computer-readable storage medium and computer program products containing instructions, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiments.

[0115] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the protection scope of the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure are included in the protection scope of the present disclosure.

Claims

1. An active heat dissipation system, characterized in that: It includes a temperature difference power generation component, a thermoelectric cooling component, a heat dissipation component and a working component; the first end of the temperature difference power generation component is connected to the heat dissipation component, and the second end of the temperature difference power generation component is connected to the working component; the third end of the thermoelectric cooling component is connected to the working component, and the fourth end of the thermoelectric cooling component is connected to the heat dissipation component; the temperature difference power generation component is connected to the thermoelectric cooling component; The temperature difference power generation component is used to output electric energy to the thermoelectric cooling component when there is a temperature difference between the heat dissipation component and the working component; The thermoelectric cooling component is used to transfer the heat of the working component to the heat dissipation component under the drive of the electric energy, so as to dissipate the heat of the working component; The system further comprises an external power supply, an extended temperature difference power generation component, and an extended thermoelectric refrigeration component; the connection circuit of the external power supply, the extended temperature difference power generation component, the extended thermoelectric refrigeration component, the temperature difference power generation component, and the thermoelectric refrigeration component comprises a first switch and a second switch; The temperature difference power generation component is used to output electric energy to the thermoelectric refrigeration component when the first switch and the second switch are both in the first state; The extended temperature difference power generation component and the extended temperature difference power generation component are used to work simultaneously with the temperature difference power generation component and the thermoelectric refrigeration component when the first switch is in the second state and the second switch is in the first state; The external power supply is used to output electric energy to the thermoelectric cooling component when the first switch and the second switch are both in the second state; The system also includes a monitoring and control component; The monitoring and regulating component is used to obtain the temperature of the working component; The monitoring and regulating component is used to control the working power of the thermoelectric cooling component when the temperature change rate is within a preset first rate range; The monitoring and regulating component is used to control the working power of other refrigeration and heat dissipation components other than the thermoelectric refrigeration component when the temperature change rate is within a preset second rate range; The preset second rate range is greater than the preset first rate range; The monitoring and regulating component is used to generate an alarm message when the temperature change rate is within a preset third rate range; The preset third rate range is greater than the preset second rate range.

2. The system according to claim 1, characterized in that The system also includes a power supply component; the power supply component is connected to the thermoelectric cooling component; The power supply component is used to receive the power control signal sent by the monitoring and regulating component, and adjust the working power of the thermoelectric cooling component based on the power control signal.

3. The system according to claim 1, characterized in that The thermoelectric power generation component includes an N-type semiconductor and a P-type semiconductor; the N-type semiconductor is the positive electrode of the thermoelectric power generation component, and the P-type semiconductor is the negative electrode of the thermoelectric power generation component; The temperature difference power generation component is used to output electric energy to the thermoelectric cooling component through the N-type semiconductor and the P-type semiconductor when there is a temperature difference between the heat dissipation component and the working component.

4. The system according to claim 1, characterized in that At least one working assembly is stacked to form a stacked working assembly, and an outer working assembly of the stacked working assembly is connected to at least one temperature difference power generation assembly and at least one thermoelectric refrigeration assembly; The at least one temperature difference power generation component and the at least one thermoelectric refrigeration component are connected in series.

5. The system according to claim 1, characterized in that The temperature difference power generation component is used to determine the temperature difference between the heat dissipation component and the working component based on the internal voltage difference and the Seebeck coefficient.

6. The system according to claim 1, characterized in that The system also includes an air cooling component and a broadband modulation component; The air cooling component is used to dissipate heat from the working component; The broadband modulation component is used to control the working power of the air cooling component.

7. The system according to claim 1, characterized in that The heat dissipation component is a liquid cooling component, and the liquid cooling component includes a liquid cooling medium; The liquid cooling component is used to dissipate heat from the working component based on the liquid cooling medium; The monitoring and regulating component is used to control the temperature and / or flow rate of the liquid-cooling medium in the liquid-cooling component.

8. The system according to claim 1, characterized in that The system also includes a power generation control component; The power generation control component is used to control the amount of electric energy output by the temperature difference power generation component to the thermoelectric refrigeration component.

9. The system according to claim 1, characterized in that The thermoelectric cooling component is composed of a first semiconductor of a first type of material and a second semiconductor of a second type of material, wherein the first semiconductor and the second semiconductor are connected in series; The thermoelectric power generation component is composed of a third semiconductor of a third type of material and a fourth semiconductor of a fourth type of material, and the third semiconductor and the fourth semiconductor are connected in series.

10. A server, characterized in that: An active heat dissipation system comprising any one of claims 1-9.

11. A vehicle, characterized in that: An active heat dissipation system comprising any one of claims 1-9.

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