Whole-satellite thermal vacuum test method based on thermistor temperature control

Abstract

The application provides a whole satellite thermal vacuum test method based on thermistor temperature control, which comprises the following steps: counting the acceptance temperature level and acceptance temperature margin of each thermistor monitoring unit on the satellite; dividing an infrared lamp array or an infrared cage into several temperature control sub-zones which are respectively controlled by closed-loop control current; determining the target temperature of each temperature control sub-zone; determining the target thermistor of each temperature control sub-zone according to preset rules and the real-time temperature of each thermistor in the temperature control sub-zone; determining the upper limit of the current of the infrared lamp array or the infrared cage; and automatically adjusting the current of the closed-loop control loop of each temperature control sub-zone within the temperature control period based on the real-time temperature of the target thermistor and the upper limit of the current by using a piecewise linear interpolation PID algorithm, so as to realize the closed-loop temperature control of each temperature control sub-zone. Thus, the temperature control process of the application does not depend on thermocouples, can effectively shorten the whole satellite development cycle and reduce the development cost, and can ensure the safety and accuracy of the whole satellite thermal vacuum test temperature control.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of spacecraft thermal vacuum test, and particularly relates to a whole-satellite thermal vacuum test method based on thermistor temperature control. BACKGROUND

[0002] The whole-satellite thermal vacuum test is an important system-level test project of a satellite, and during the test, the temperature of a satellite component is adjusted by adjusting the external heat flow and internal heat consumption of the satellite, so that the required test temperature is reached. Common temperature adjustment methods include external heat flow measures, on-satellite heater on-off and threshold adjustment, and device working mode adjustment, wherein the external heat flow measures include a heat sink, an infrared lamp array (or an infrared cage), and an external heat flow heater.

[0003] The external heat flow measure is the main temperature adjustment method, and at present, the infrared lamp array (or the infrared cage) has realized closed-loop temperature control with the heat pipe thermocouple temperature as the control point. However, a certain number of temperature measuring thermocouples need to be arranged at specific positions of the positive satellite before the thermal test, and all the thermocouples need to be removed after the test. The number of thermocouples generally reaches hundreds, and the arrangement and removal of the thermocouples need to occupy 3-5 days of whole-satellite development time, especially the removal of the in-satellite thermocouples needs to open the cabin plate, which consumes a large amount of manpower and material resources.

[0004] Therefore, there is an urgent need for a whole-satellite thermal vacuum test method capable of shortening the whole-satellite development cycle and reducing the whole-satellite development cost. SUMMARY

[0005] The present application aims to provide a whole-satellite thermal vacuum test method based on thermistor temperature control, which is used to reduce the development cycle and economic cost.

[0006] In order to achieve the above-mentioned purpose, the present application provides a whole-satellite thermal vacuum test method based on thermistor temperature control, comprising the steps of:

[0007] statistically obtaining the acceptance temperature level and the acceptance temperature margin of each thermistor monitoring single machine on the satellite; wherein the acceptance temperature level comprises the upper limit and the lower limit of the acceptance temperature of the thermistor monitoring single machine, and the acceptance temperature margin is the difference between the acceptance temperature limit and the specified temperature; the specified temperature is the thermal equilibrium test temperature or the on-orbit analysis predicted temperature;

[0008] dividing the temperature control device into several temperature control sub-zones according to the cabin plate, the heat pipe layout of the satellite, and the acceptance temperature level and the acceptance temperature margin of each thermistor monitoring single machine, and each temperature control sub-zone is controlled by a closed-loop control circuit; wherein the temperature control device is an infrared lamp array or an infrared cage;

[0009] According to the thermal resistance monitoring unit in each of the temperature control partition, the acceptance temperature margin and the specified temperature of the unit are determined, and the target temperature of each of the temperature control partition is determined;

[0010] According to the preset rule and the real-time temperature of each of the thermal resistance monitoring unit in the temperature control partition, the target thermal resistance of each of the temperature control partition is determined;

[0011] According to the heat consumption level of the starting equipment in the temperature control partition and the heat consumption of the starting equipment in the specified working condition, the upper limit of the current of the temperature control device is determined; the specified working condition is the thermal equilibrium test working condition or the on-orbit analysis prediction working condition;

[0012] Through the piecewise linear interpolation PID algorithm based on the real-time temperature of the target thermal resistance and the upper limit of the current, the current of the closed-loop control loop of each of the temperature control partition is automatically adjusted in the temperature control period, so as to realize the closed-loop temperature control of each of the temperature control partition.

[0013] Further, the target thermal resistance of each of the temperature control partition is determined according to the preset rule and the real-time temperature of each of the thermal resistance monitoring unit in the temperature control partition, which includes:

[0014] By normal value determination on the real-time temperature of a plurality of thermal resistances in the temperature control partition, the faulty thermal resistance is excluded;

[0015] In each of the temperature control partition, the thermal resistance corresponding to the highest temperature value in the normal value range is taken as the first target thermal resistance of the test high temperature working condition, and the thermal resistance corresponding to the lowest temperature value in the normal value range is taken as the second target thermal resistance of the test low temperature working condition.

[0016] Further, the acceptance temperature margin includes an upper limit of the acceptance temperature margin and a lower limit of the acceptance temperature margin; the upper limit of the acceptance temperature margin and the lower limit of the acceptance temperature margin are calculated based on the following formula:

[0017] T ΔQH (n)=T QH (n)-T EH (n);

[0018] T ΔQL (n)=T QL (n)-T EL (n);

[0019] Wherein, n is the number of the thermal resistance, which is the nth thermal resistance monitoring unit; T ΔQH (n) represents the upper limit of the acceptance temperature margin of the nth thermal resistance monitoring unit; T QH(n) represents the upper limit of the acceptance temperature of the nth thermistor monitoring unit; T EH (n) represents the high temperature working condition temperature predicted by the heat balance test or on-orbit analysis; T ΔQL (n) represents the lower limit of the acceptance temperature of the nth thermistor monitoring unit; T QL (n) represents the lower limit of the acceptance temperature of the nth thermistor monitoring unit; T EL (n) represents the low temperature working condition temperature predicted by the heat balance test or on-orbit analysis.

[0020] Further, the step of determining the target temperature of each temperature control partition according to the acceptance temperature margin and the specified temperature of the thermistor monitoring unit in each temperature control partition comprises:

[0021] determining the high temperature control target temperature of each temperature control partition according to the high temperature working condition temperature corresponding to the upper limit of the acceptance temperature and the specified temperature of the thermistor monitoring unit in each temperature control partition; or

[0022] determining the low temperature control target temperature of each temperature control partition according to the low temperature working condition temperature corresponding to the lower limit of the acceptance temperature and the specified temperature of the thermistor monitoring unit in each temperature control partition.

[0023] Further, the step of dividing the temperature control device into several temperature control partitions according to the cabin plate, heat pipe layout of the satellite, and the acceptance temperature level and the acceptance temperature margin of each thermistor monitoring unit comprises:

[0024] dividing the temperature control device into several first temperature control partitions according to different cabin plates of the satellite;

[0025] dividing the temperature control device into several second temperature control partitions according to different heat pipe network regions of the satellite;

[0026] dividing the temperature control device into several third temperature control partitions according to the acceptance temperature level of each thermistor monitoring unit;

[0027] dividing the temperature control device into several fourth temperature control partitions according to the acceptance temperature margin of each thermistor monitoring unit;

[0028] de-duplicating the first temperature control partition, the second temperature control partition, the third temperature control partition, and the fourth temperature control partition to obtain the final temperature control partition.

[0029] Further, the step of automatically adjusting the current of the closed-loop control circuit of each of the temperature control zones based on the real-time temperature of the target thermistor and the current upper limit by the piecewise linear interpolation PID algorithm, after realizing the closed-loop temperature control of each of the temperature control zones, further comprises:

[0030] determining whether to perform an auxiliary temperature control measure according to a first difference between the target temperature and the temperature of the corresponding temperature control zone after the closed-loop temperature control; wherein the auxiliary temperature control measure is adjusting the switching state and threshold of the on-board heater and the external heat flow heater according to the first difference; and / or adjusting the working state of the thermistor monitoring unit. Further, the step of determining the target thermistor of each of the temperature control zones according to a preset rule and the real-time temperature of each of the thermistor monitoring units in the temperature control zone comprises:

[0031] dynamically determining the target thermistor of each of the temperature control zones according to a preset rule and the real-time temperature of each of the thermistor monitoring units in the temperature control zone.

[0032] Further, the step of automatically adjusting the current of the closed-loop control circuit of each of the temperature control zones based on the real-time temperature of the target thermistor and the current upper limit by the piecewise linear interpolation PID algorithm, after realizing the closed-loop temperature control of each of the temperature control zones, further comprises:

[0033] controlling each of the temperature control zones to perform a rewarming operation until each of the temperature control zones reaches the corresponding rewarming control target temperature at the end of the test.

[0034] Further, the step of controlling each of the temperature control zones to perform a rewarming operation comprises:

[0035] determining the rewarming control target temperature of each of the temperature control zones according to the acceptance temperature upper limit of the thermistor monitoring unit in each of the temperature control zones;

[0036] automatically adjusting the current of the closed-loop control circuit of each of the temperature control zones based on the real-time temperature of the target thermistor and the current upper limit by the piecewise linear interpolation PID algorithm until each of the temperature control zones reaches the corresponding rewarming control target temperature.

[0037] Further, the step of automatically adjusting the current of the closed-loop control circuit of each of the temperature control zones based on the real-time temperature of the target thermistor and the current upper limit by the piecewise linear interpolation PID algorithm until each of the temperature control zones reaches the corresponding rewarming control target temperature further comprises:

[0038] determine whether to perform an auxiliary rewarming measure according to a second difference between the rewarming control target temperature and a temperature of the temperature control subzone after the rewarming operation; wherein the auxiliary rewarming measure is to adjust the on-off state and threshold of the on-board heater and the external heat flow heater according to the second difference; and / or adjust the working state of the thermistor monitoring unit. The whole-satellite thermal vacuum test method based on thermistor temperature control provided by the present application takes the on-board thermistor temperature as the control point of closed-loop temperature control of the infrared lamp array (or infrared cage), takes the equipment acceptance temperature margin as the temperature control target, takes the piecewise linear interpolation PID algorithm as the temperature control strategy, and realizes automatic control of the temperature of the whole-satellite thermal vacuum test. In this way, the temperature control process of the present application does not depend on thermocouples, thereby supporting the cancellation of the whole-satellite thermocouple installation and removal process before and after the thermal test, which can effectively shorten the whole-satellite development cycle and reduce the whole-satellite development cost. Through regional division, the safety and accuracy of the whole-satellite thermal vacuum test temperature control can be ensured at the same time. The present application also automatically calculates the real-time current value of the infrared lamp array (or infrared cage) through the PID program, which can improve the temperature control accuracy, avoid overshoot, and reduce the demand for human resources at the same time. It has universal applicability and can be used for any spacecraft level thermal vacuum test. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 The step flowchart of the whole-satellite thermal vacuum test method based on thermistor temperature control provided by an embodiment of the present application is provided.

[0040] Figure 2 The specific process schematic diagram for dividing the temperature control subzone of the whole-satellite thermal vacuum test method based on thermistor temperature control provided by an embodiment of the present application is provided.

[0041] Figure 3 The test temperature change curve diagram of the whole-satellite thermal vacuum test method based on thermistor temperature control provided by an embodiment of the present application is provided. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0043] It should be noted that references to "an embodiment," "embodiment," "example embodiment," etc., in this specification refer to the described embodiment including specific features, structures, or characteristics, but not every embodiment must include these specific features, structures, or characteristics. Furthermore, such expressions do not refer to the same embodiment. Moreover, when describing specific features, structures, or characteristics in conjunction with embodiments, whether or not explicitly described, it is indicated that incorporating such features, structures, or characteristics into other embodiments is within the knowledge of those skilled in the art.

[0044] Furthermore, certain terms are used in the specification and subsequent claims to refer to specific components or parts. Those skilled in the art will understand that manufacturers may use different names or terms to refer to the same component or part. This specification and subsequent claims do not distinguish components or parts by differences in name, but rather by differences in function. The terms "comprising" and "including" used throughout the specification and subsequent claims are open-ended and should be interpreted as "including but not limited to." Additionally, the term "connection" here includes any direct and indirect electrical connection means. Indirect electrical connection means include connections made through other means.

[0045] Figure 1 This invention illustrates a method for whole-satellite thermal vacuum testing based on thermistor temperature control, comprising the following steps:

[0046] S101: Statistically determine the acceptance temperature level and acceptance temperature margin for each thermistor monitoring unit on the satellite. The acceptance temperature level includes the upper and lower limits of the acceptance temperature for each thermistor monitoring unit. For example, if the acceptance temperature level for a particular thermistor monitoring unit is -25℃ to +60℃, then its upper limit is +60℃ and its lower limit is -25℃. The acceptance temperature margin is the difference between the acceptance temperature limit and the specified temperature. The specified temperature is the thermal balance test temperature or the predicted temperature from on-orbit analysis. The entire satellite includes several thermistors. From these thermistors, determine the thermistors required for the monitoring units in this embodiment, and then statistically determine the acceptance temperature level and acceptance temperature margin for each thermistor monitoring unit.

[0047] Specifically, the acceptance temperature margin in this embodiment includes an upper acceptance temperature margin and a lower acceptance temperature margin; the upper acceptance temperature margin and the lower acceptance temperature margin are calculated based on the following formula:

[0048] T ΔQH (n)=T QH (n)-T EH (n);

[0049] TΔQL (n) = T QL (n) - T EL (n);

[0050] wherein n is the number of the thermistor, representing the nth thermistor monitoring unit; T ΔQH (n) represents the upper limit of the acceptance temperature of the nth thermistor monitoring unit; T QH (n) represents the upper limit of the acceptance temperature of the nth thermistor monitoring unit; T EH (n) represents the high temperature working condition temperature predicted by the heat balance test or on-orbit analysis; T ΔQL (n) represents the lower limit of the acceptance temperature of the nth thermistor monitoring unit; T QL (n) represents the lower limit of the acceptance temperature of the nth thermistor monitoring unit; T EL (n) represents the low temperature working condition temperature predicted by the heat balance test or on-orbit analysis.

[0051] In this embodiment, the upper and lower limits of the acceptance temperature of each thermistor monitoring unit can be determined from the acceptance temperature level, i.e. QH (n) and T QL (n).

[0052] The high temperature working condition temperature refers to the highest value of temperature rise in the test condition, and the low temperature working condition temperature refers to the lowest value of temperature drop in the test condition.

[0053] S102: According to the cabin plate, heat pipe layout of the satellite, and the acceptance temperature level and acceptance temperature margin of each thermistor monitoring unit, the temperature control device is divided into a plurality of temperature control zones, and each temperature control zone is controlled by a closed loop control circuit; wherein the temperature control device is an infrared lamp array or an infrared cage.

[0054] In this embodiment, the infrared lamp array or the infrared cage is controlled by a closed loop control in a partitioned manner. Each divided temperature control zone forms a closed loop control circuit, and the current value of the infrared lamp array or the infrared cage in each temperature control zone is the same value, which is automatically given by the closed loop control program. The closed loop control circuit is used to control the working state of the corresponding infrared lamp array or infrared cage related region in the temperature control zone, and the infrared lamp array or infrared cage in the temperature control zone executes the corresponding heating work by outputting the corresponding current value through the closed loop control circuit.

[0055] Referring to Figure 2 In an alternative embodiment, step S102 comprises:

[0056] S1021: According to different cabin plates of the satellite, the temperature control device is divided into a plurality of first temperature control zones.

[0057] S1022: According to the different heat pipe network areas of the satellite, the temperature control device is divided into several second temperature control partitions.

[0058] S1023: According to the acceptance temperature level of each thermistor monitoring unit, the temperature control device is divided into several third temperature control partitions.

[0059] S1024: According to the acceptance temperature margin of each thermistor monitoring unit, the temperature control device is divided into several fourth temperature control partitions.

[0060] S1025: The first temperature control partition, the second temperature control partition, the third temperature control partition, and the fourth temperature control partition are de-duplicated to obtain a final temperature control partition.

[0061] After completing the temperature control area division of the infrared lamp array or the infrared cage, further corresponding temperature control operations need to be performed for each temperature control partition, so that the infrared lamp array or the infrared cage composed of all the temperature control partitions controls the temperature of the whole satellite at the required temperature for the test.

[0062] S103: According to the acceptance temperature margin of the thermistor monitoring unit in each temperature control partition and the specified temperature, the target temperature of each temperature control partition is determined.

[0063] The embodiment can be applied to high-temperature working conditions and low-temperature working conditions of the test.

[0064] Further, in an embodiment, step S103 includes:

[0065] According to the upper limit of the acceptance temperature of the thermistor monitoring unit in each temperature control partition and the high-temperature working condition temperature corresponding to the specified temperature, the high-temperature control target temperature of each temperature control partition is determined. That is, when the embodiment is applied to the high-temperature working condition of the test, in step S103, according to the upper limit of the acceptance temperature of the thermistor monitoring unit in each temperature control partition and the high-temperature working condition temperature of the thermal balance test (or in-orbit analysis prediction), the high-temperature control target temperature of each temperature control partition is determined, which is denoted as T VH .

[0066] In another embodiment, step S103 includes: according to the lower limit of the acceptance temperature of the thermistor monitoring unit in each temperature control partition and the low-temperature working condition temperature corresponding to the specified temperature, the low-temperature control target temperature of each temperature control partition is determined. That is, when the embodiment is applied to the low-temperature working condition of the test, in step S103, according to the lower limit of the acceptance temperature of the thermistor monitoring unit in each temperature control partition and the low-temperature working condition temperature of the thermal balance test (or in-orbit analysis prediction), the low-temperature control target temperature of each temperature control partition is determined, which is denoted as T VL .

[0067] The two embodiments correspond to high-temperature working condition test and low-temperature working condition test respectively.

[0068] S104: According to the preset rule and the real-time temperature of each thermistor monitoring unit in the temperature control partition, the target thermistor of each temperature control partition is determined respectively. The target thermistor determined in this step will be the temperature control point of the closed-loop temperature control mode; the preset rule is determined based on test requirements.

[0069] Step S104 specifically includes: excluding the faulty thermistor by performing normal value judgment on the real-time temperature of the several thermistor monitoring units in the temperature control partition; in each temperature control partition, the thermistor corresponding to the highest temperature value within the normal value range is taken as the first target thermistor of the high-temperature working condition test, and the thermistor corresponding to the lowest temperature value within the normal value range is taken as the second target thermistor of the low-temperature working condition test.

[0070] In specific implementation, the temperatures of the several thermistor monitoring units in the partition are taken as the control points, and in each temperature control period, firstly, the temperature of the temperature measuring point (i.e. the thermistor) is subjected to normal value judgment to exclude the faulty temperature measuring point; the thermistor fault is automatically diagnosed by software, and only refers to the open circuit or short circuit of the thermistor measurement path, and the criterion for the fault is that the thermistor original code is greater than or equal to F8 (which needs to be processed by calibration) or less than or equal to 07 (which needs to be processed by calibration); subsequently, for the high-temperature working condition, the maximum value control method is adopted, i.e. the highest temperature value T max in the temperature measuring point within the normal value range is taken as the temperature control point; for the low-temperature working condition, the minimum value control method is adopted, i.e. the lowest temperature value T min in the temperature measuring point within the normal value range is taken as the temperature control point; in this way, the temperature measuring points corresponding to the high-temperature and low-temperature working conditions determined respectively serve as the main basis for the closed-loop temperature control current calculation in the subsequent steps.

[0071] Further, step S104 includes: dynamically determining the target thermistor of each temperature control partition according to the preset rule and the real-time temperature of each thermistor monitoring unit in the temperature control partition. For example, the dynamic determination of the temperature control point is performed in a loop in the temperature control period, i.e. the temperature control point is in a state of dynamic adjustment.

[0072] S105: According to the heat consumption level of the started equipment in the temperature control partition and the heat consumption of the started equipment in the specified working condition, the current upper limit of the temperature control device is determined; the temperature control device is an infrared lamp array (or an infrared cage), and the specified working condition is a thermal balance test (or in-orbit analysis prediction) working condition. Specifically, the current upper limit of the temperature control device is determined by the difference between the heat consumption level of the started equipment in each partition and the heat consumption of the started equipment in the high-temperature and low-temperature working conditions of the thermal balance test (or in-orbit analysis prediction); wherein, the current upper limit respectively corresponds to the high-temperature working condition and the low-temperature working condition.

[0073] S106: automatically adjusting the current of the closed-loop control loop of each temperature control subzone in a temperature control period based on the real-time temperature of the target thermistor and the upper limit of the current, so as to realize the closed-loop temperature control of each temperature control subzone. That is, using the PID program to automatically calculate the real-time current value of the infrared lamp array (or infrared cage) based on the real-time temperature of the target thermistor in step S104 and the upper limit of the current in step S105, and the infrared lamp array (or infrared cage) works under the driving of the real-time current value to achieve the target temperature of each temperature control subzone.

[0074] In actual application, different PID control parameters are selected for the infrared lamp array and the infrared cage, which are obtained through star-level test debugging.

[0075] During the test, the current of the infrared lamp array (or infrared cage) is automatically adjusted according to the temperature of the temperature control point; in order to ensure that the temperature of the instrument and equipment meets the high-temperature or low-temperature control target temperature requirement, after step S106, it further includes:

[0076] determining whether to perform an auxiliary temperature control measure according to a first difference between the target temperature and the temperature of the corresponding temperature control subzone after closed-loop temperature control; wherein the auxiliary temperature control measure is to adjust the on-off state and threshold value of the on-board heater and the external heat flow heater according to the first difference; and / or adjust the working state of the device; that is, according to the first difference to determine whether to adjust the on-off state and threshold value of the on-board heater and the external heat flow heater; and adjust the working state of the thermistor monitoring unit; so as to achieve the high-temperature auxiliary temperature control effect or the low-temperature auxiliary temperature control effect.

[0077] The high-temperature control working procedure and the low-temperature control working procedure of the test will be introduced respectively; in the high-temperature control working procedure:

[0078] Firstly, the high-temperature control target temperature T VH of each subzone is determined according to the acceptance temperature upper limit margin of the thermistor monitoring unit in each temperature control subzone and the high-temperature working condition temperature of the heat balance test (or on-orbit analysis prediction); secondly, the number of temperature control points is determined according to the maximum value control method; the upper limit of the current of the infrared lamp array (or infrared cage) is determined according to the heat consumption level of the on-board equipment in each subzone and the difference between the heat consumption of the on-board equipment in the heat balance test (or on-orbit analysis prediction) high-temperature working condition; finally, the closed-loop temperature control program automatically adjusts the current of the infrared lamp array (or infrared cage) according to the temperature of the temperature control point; in this process, the on-off state and threshold value of the on-board heater and the external heat flow heater are set as needed; the working state of the thermistor monitoring unit is adjusted as needed and set as required. The determination criterion of the high-temperature control target temperature is:

[0079] 1) high-temperature temperature margin T ΔVH = T QH -T VH = 3-5℃;

[0080] 2) high-temperature temperature margin T ΔH = T VH -T EH = 5-10℃.

[0081] In the low-temperature control operation program:

[0082] First, according to the acceptance temperature lower limit margin of the thermistor monitoring unit in each temperature control partition and the low-temperature working condition temperature determined by the heat balance test (or in-orbit analysis prediction), the low-temperature control target temperature T of each partition is determined. VL Second, the minimum value control method is used to determine the temperature control point number. The heat consumption level of the equipment in each partition and the difference between the heat consumption of the equipment in the low-temperature working condition and the heat balance test (or in-orbit analysis prediction) are used to determine the upper limit of the infrared lamp array (or infrared cage) current. Finally, the closed-loop temperature control program automatically adjusts the infrared lamp array (or infrared cage) current according to the temperature of the temperature control point. In this process, the on-orbit heater and external heat flow heater switch state and threshold value are set as needed. The working state of the thermistor monitoring unit is adjusted as needed and set as required. The determination criteria for the low-temperature control target temperature are:

[0083] 1) low-temperature temperature margin T ΔVL = T QL -T VL = 3-5℃;

[0084] 2) low-temperature temperature margin T ΔL = T VL -T EL = 5-10℃.

[0085] Optionally, after step S106 of the embodiment, the method further includes: at the end of the test, controlling each temperature control partition to perform a warming operation until each temperature control partition reaches the corresponding warming control target temperature.

[0086] In specific implementation, the control of each temperature control partition to perform a warming operation includes:

[0087] According to the acceptance temperature upper limit of the thermistor monitoring unit in each temperature control partition, the warming control target temperature of each temperature control partition is determined. Through a piecewise linear interpolation PID algorithm, the current of the closed-loop control loop of each temperature control partition is automatically adjusted based on the real-time temperature of the target thermistor and the current upper limit until each temperature control partition reaches the corresponding warming control target temperature.

[0088] Further, the segmented linear interpolation PID algorithm automatically adjusts the current of the closed-loop control loop of each temperature control zone based on the real-time temperature of the target thermistor and the upper limit of the current until each temperature control zone reaches the corresponding temperature recovery control target temperature, and further comprises: determining whether to perform an auxiliary temperature recovery measure according to a second difference between the temperature recovery control target temperature and the temperature of the corresponding temperature control zone after the temperature recovery operation; wherein the auxiliary temperature recovery measure is to adjust the switching state and threshold of the on-board heater and the external heat flow heater according to the second difference; and / or adjust the working state of the thermistor monitoring unit.

[0089] The following will take the whole-satellite thermal vacuum test method based on thermistor temperature control described in the present embodiment as a specific example to be described.

[0090] A certain satellite has a total of 202 thermistors, of which 178 are thermistors of monitoring units, so in step S101, the acceptance temperature level and the acceptance temperature margin of each thermistor monitoring unit on board are calculated by the above formula.

[0091] According to the cabin plates, heat pipe layout of the satellite and the acceptance temperature level and the acceptance temperature margin of each thermistor monitoring unit, the corresponding infrared cage is divided into 17 zones: +X cabin plate, -X cabin plate each 1, +Y cabin plate, -Y cabin plate, -Z cabin plate each 3, +Z cabin plate 6. Among them, +X, -X, +Y1, +Y3, -Y1, -Y3, +Z1, +Z2, etc. 8 zones are closed-loop temperature controlled. The closed-loop temperature control zones are shown in Table 1 below.

[0092] Table 1:

[0093]

[0094] The infrared cage closed-loop temperature control program is designed, and the infrared cage closed-loop temperature control adopts a segmented linear interpolation PID algorithm; the infrared cage current value of each zone is the same value, which is automatically given by the closed-loop temperature control program; but each infrared cage loop in each zone has the function of being able to be adjusted individually at any time. In high-temperature working conditions, temperature control uses the maximum value control method described above; in low-temperature working conditions, temperature control uses the minimum value control method described above.

[0095] In the high-temperature control program of the present example, the high-temperature control target temperature of each zone and the upper limit of the infrared cage current are shown in Table 2 below.

[0096] Table 2:

[0097]

[0098]

[0099] Among them, the highest temperature control value in Table 2 is a tentative value, which can be adjusted according to the temperature during the thermal vacuum test.

[0100] The temperature control of high temperature working condition adopts maximum value control method, with 1 min as the temperature control period, dynamically determining the temperature control point number, and calculating the real-time current value; the heater of the active temperature control equipment is automatically adjusted within the temperature threshold range. Turn on the +Z1 area 3-way +Z plate heater, +Z2 area 2-way +Z plate heater, and cooperate with the corresponding area temperature rise.

[0101] During the test, the infrared cage current is automatically adjusted according to the control point temperature. When high temperature auxiliary temperature control is needed for testing, the heater of the active temperature control equipment is automatically adjusted within the temperature threshold range; when the +Z1 area large heat consumption equipment is turned on for testing, the +Z1 area 3-way heater is turned off.

[0102] In the low temperature control working procedure of the present example, the low temperature control target temperature and the upper limit of the infrared cage current of each subarea are shown in Table 3 as follows.

[0103] Table 3:

[0104]

[0105]

[0106] Among them, the lowest temperature control value in Table 3 is a tentative value, which can be adjusted according to the temperature during the thermal vacuum test.

[0107] The temperature control of low temperature working condition adopts minimum value control method, with 1 min as the temperature control period, dynamically determining the temperature control point number, and calculating the real-time current value. The heater of the active temperature control equipment is automatically adjusted within the temperature threshold range, and other heaters are turned off. At the same time, in order to cooperate with the temperature drop, the +X plate large heat consumption equipment is turned off after completing the necessary performance monitoring task.

[0108] During the test, the infrared cage current is automatically adjusted according to the control point temperature. When low temperature auxiliary temperature control is needed for testing, the heater of the active temperature control equipment is automatically adjusted within the temperature threshold range, and other heaters are turned off.

[0109] As shown in Figure 3 At the end of the preset temperature cycle times (4 times in the present example), the temperature is turned back to the pressure. The temperature control target temperature and the upper limit of the infrared cage current of each temperature control subarea are shown in Table 4 as follows.

[0110] Table 4:

[0111]

[0112]

[0113] The highest temperature control value in Table 4 is a tentative value, which can be adjusted according to the temperature during the heat vacuum test.

[0114] The working procedure of the temperature recovery and pressure recovery of the present example is as follows:

[0115] 1) The infrared cage adopts closed-loop temperature control, and the temperature control parameters are as shown in the above table. The maximum value control method is adopted for temperature control, and the control period is 1 min. The temperature control point number is dynamically determined, and the real-time current value is calculated;

[0116] 2) The heater of the active temperature control equipment is self-controlled and adjusted within the temperature threshold range, and other heaters are turned off;

[0117] 3) The load equipment is turned off, the liquid nitrogen pump is stopped, and the liquid nitrogen of each heat sink is recovered;

[0118] 4) The anti-pollution plate maintains the liquid nitrogen;

[0119] 5) The vacuum system continues to use the cryogenic pump to pump, and the vacuum degree is maintained to be better than 1.3x10 -2 Pa;

[0120] 6) The temperature of each heat sink returns to 0℃, the whole satellite is powered off, and the measurement and control system is powered off;

[0121] 7) The vacuum system is stopped, and high-purity nitrogen is filled into the vacuum container;

[0122] 8) When the vacuum degree of the container reaches 1000 Pa, the measurement and control system is powered on, and the infrared cage is controlled at 1.5 A current in open-loop control;

[0123] 9) When the vacuum degree of the container reaches 5000 Pa, the anti-pollution plate is ventilated with nitrogen;

[0124] 10) When the temperature of each heat sink returns to 25℃, the measurement and control system and the vacuum system are powered off and stopped;

[0125] 11) The heat sink is evenly heated for 12 hours;

[0126] 12) After the temperature of the heat sink is higher than the dew point temperature, clean filtered air is put into the vacuum container until it returns to atmospheric pressure.

[0127] The heat vacuum test result is evaluated: the temperature change range of the high and low temperature working condition satellite equipment is counted, and the temperature change range of the measuring point greater than 32℃ accounts for 100%, which meets the requirement that the temperature change range of 80% single machine temperature measuring point is greater than 32℃.

[0128] In summary, the whole satellite thermal vacuum test method based on thermistor temperature control of the application takes the satellite thermistor temperature as the control point of the closed-loop temperature control of the infrared lamp array (or infrared cage), takes the equipment acceptance temperature margin as the temperature control target, and takes the segmented linear interpolation PID algorithm as the temperature control strategy to realize the automatic control of the whole satellite thermal vacuum test temperature. In this way, the temperature control process of the application does not depend on the thermocouple, thereby supporting the cancellation of the whole satellite thermocouple mounting and dismounting process before and after the thermal test, which can effectively shorten the whole satellite development cycle and reduce the whole satellite development cost. According to the equipment and the internal heat pipe layout of the cabin plate, the acceptance temperature level and the margin, the corresponding infrared lamp array (or infrared cage) is divided into different partitions, which can ensure the safety and accuracy of the whole satellite thermal vacuum test temperature control. The maximum (minimum) control method is used for high temperature (low temperature) working condition temperature control, the real-time current value of the infrared lamp array (or infrared cage) is automatically calculated through the PID program, which can improve the temperature control accuracy, avoid overshoot, and reduce the demand for human resources. The application also proposes a high and low temperature control work program and a target temperature determination criterion, which has universal applicability and can be used for any spacecraft level thermal vacuum test.

[0129] Of course, the application can have other various embodiments, and those skilled in the art can make various corresponding changes and modifications according to the application without departing from the spirit and essence of the application. However, these corresponding changes and modifications should all belong to the protection scope of the claims attached to the application.

Claims

1. A method for whole-satellite thermal vacuum testing based on thermistor temperature control, characterized in that, Including the following steps: The acceptance temperature level and acceptance temperature margin of each thermistor monitoring unit on the satellite are statistically analyzed. The acceptance temperature level includes the upper limit and lower limit of the acceptance temperature of the thermistor monitoring unit, and the acceptance temperature margin is the difference between the acceptance temperature limit and the specified temperature. The specified temperature is the thermal balance test temperature or the temperature predicted by on-orbit analysis. Based on the satellite's cabin and heat pipe layout, as well as the acceptance temperature level and acceptance temperature margin of each thermistor monitoring unit, the temperature control device is divided into several temperature control zones, and each temperature control zone is temperature-controlled by a closed-loop control circuit; wherein, the temperature control device is an infrared lamp array or an infrared cage. The target temperature of each temperature control zone is determined based on the acceptance temperature margin and the specified temperature of the thermistor monitoring unit in each temperature control zone. Based on preset rules and the real-time temperature of each thermistor monitoring unit within the temperature control zone, the target thermistor for each temperature control zone is determined. Based on the heat consumption level of the equipment in the temperature control zone and the heat consumption of the equipment under the specified operating conditions, the upper limit of the current of the temperature control device is determined; the specified operating conditions are the thermal balance test conditions or the on-orbit analysis prediction conditions. Based on the real-time temperature of the target thermistor and the upper limit of the current, the piecewise linear interpolation PID algorithm automatically adjusts the current of the closed-loop control loop of each temperature control zone within the temperature control cycle to achieve closed-loop temperature control of each temperature control zone. The step of determining the target thermistor for each temperature control zone based on preset rules and the real-time temperature of each thermistor monitoring unit within the temperature control zone includes: By determining the normal value of the real-time temperature of several thermistor monitoring units within the temperature control zone, faulty thermistors can be eliminated. In each temperature control zone, the thermistor corresponding to the highest temperature value within the normal range is used as the first target thermistor for the high-temperature test condition, and the thermistor corresponding to the lowest temperature value within the normal range is used as the second target thermistor for the low-temperature test condition.

2. The whole-satellite thermal vacuum test method based on thermistor temperature control according to claim 1, characterized in that, The acceptance temperature margin includes an upper limit acceptance temperature margin and a lower limit acceptance temperature margin; the upper limit acceptance temperature margin and the lower limit acceptance temperature margin are calculated based on the following formula: T ΔQH (n)=T QH (n)-T EH (n); T ΔQL (n)=T QL (n)-T EL (n); Wherein, n is the thermistor number, indicating the nth thermistor monitoring unit; T ΔQH (n) represents the upper limit margin of the acceptance temperature for the nth thermistor monitoring unit; T QH (n) represents the upper limit of the acceptance temperature of the nth thermistor monitoring unit; T EH (n) represents the high-temperature operating condition predicted by thermal balance tests or on-orbit analysis; T ΔQL (n) represents the lower limit margin of the acceptance temperature of the nth thermistor monitoring unit; T QL (n) represents the lower limit of the acceptance temperature of the nth thermistor monitoring unit; T EL (n) represents the low-temperature operating condition predicted by thermal balance test or on-orbit analysis.

3. The whole-satellite thermal vacuum test method based on thermistor temperature control according to claim 2, characterized in that, The step of determining the target temperature for each temperature control zone based on the acceptance temperature margin and the specified temperature of the thermistor monitoring unit in each temperature control zone includes: Based on the acceptance temperature upper limit margin of the thermistor monitoring unit in each temperature control zone and the high-temperature operating temperature corresponding to the specified temperature, the high-temperature control target temperature for each temperature control zone is determined; or Based on the lower limit margin of the acceptance temperature of the thermistor monitoring unit in each temperature control zone and the low-temperature operating temperature corresponding to the specified temperature, the low-temperature control target temperature of each temperature control zone is determined.

4. The whole-satellite thermal vacuum test method based on thermistor temperature control according to claim 1, characterized in that, Based on the satellite's cabin panel, heat pipe layout, and the acceptance temperature level and acceptance temperature margin of each thermistor monitoring unit, the temperature control device is divided into several temperature control zones, including: Based on the different cabins of the satellite, the temperature control device is divided into several first temperature control zones; Based on the different heat pipe network regions of the satellite, the temperature control device is divided into several second temperature control zones; Based on the acceptance temperature level of each of the thermistor monitoring units, the temperature control device is divided into several third temperature control zones. Based on the acceptance temperature margin of each of the thermistor monitoring units, the temperature control device is divided into several fourth temperature control zones. The first temperature control zone, the second temperature control zone, the third temperature control zone, and the fourth temperature control zone are deduplicated to obtain the final temperature control zone.

5. The whole-satellite thermal vacuum test method based on thermistor temperature control according to claim 1, characterized in that, After the step of automatically adjusting the current of the closed-loop control loop of each temperature control zone within the temperature control cycle based on the real-time temperature of the target thermistor and the upper limit of the current using a piecewise linear interpolation PID algorithm to achieve closed-loop temperature control of each temperature control zone, the method further includes: Based on the first difference between the target temperature and the temperature of the corresponding temperature control zone after closed-loop temperature control, it is determined whether to implement auxiliary temperature control measures; wherein, the auxiliary temperature control measures are to adjust the on-board heater and the external heat flow heater according to the first difference; and / or adjust the working status of the thermistor monitoring unit.

6. The whole-satellite thermal vacuum test method based on thermistor temperature control according to claim 1, characterized in that, The step of determining the target thermistor for each temperature control zone based on preset rules and the real-time temperature of each thermistor monitoring unit within the temperature control zone includes: Based on preset rules and the real-time temperature of each thermistor monitoring unit within the temperature control zone, the target thermistor for each temperature control zone is dynamically determined.

7. The whole-satellite thermal vacuum test method based on thermistor temperature control according to any one of claims 1 to 6, characterized in that, After the step of automatically adjusting the current of the closed-loop control loop of each temperature control zone within the temperature control cycle based on the real-time temperature of the target thermistor and the upper limit of the current using a piecewise linear interpolation PID algorithm to achieve closed-loop temperature control of each temperature control zone, the method further includes: At the end of the test, each of the temperature control zones is controlled to perform a temperature recovery operation until each of the temperature control zones reaches the corresponding temperature recovery control target temperature.

8. The whole-satellite thermal vacuum test method based on thermistor temperature control according to claim 7, characterized in that, The control of each of the temperature-controlled zones to perform a temperature recovery operation includes: Based on the upper limit of the acceptance temperature of the thermistor monitoring unit in each temperature control zone, the target temperature for temperature recovery control of each temperature control zone is determined. Based on the real-time temperature of the target thermistor and the upper limit of the current, the piecewise linear interpolation PID algorithm automatically adjusts the current of the closed-loop control loop of each temperature control zone until each temperature control zone reaches the corresponding return temperature control target temperature.

9. The whole-satellite thermal vacuum test method based on thermistor temperature control according to claim 8, characterized in that, The step of automatically adjusting the current of the closed-loop control loop of each temperature control zone based on the real-time temperature of the target thermistor and the upper limit of the current using a piecewise linear interpolation PID algorithm until each temperature control zone reaches the corresponding return temperature control target temperature also includes: Based on the second difference between the target temperature for temperature recovery control and the temperature of the corresponding temperature control zone after the temperature recovery operation, it is determined whether to implement auxiliary temperature recovery measures; wherein, the auxiliary temperature recovery measures are to adjust the on-board heater and the external heat flow heater according to the second difference; and / or adjust the working status of the thermistor monitoring unit.

Images