A process cartridge chip and a process cartridge

Abstract

The present application relates to a kind of processing box chip and processing box, the processing box chip is installed on processing box, the processing box is detachably installed on the body of image forming device, the processing box chip includes: first ground and the second ground electrically connected with first ground.The first ground is used to provide the reference ground providing component by being electrically connected with the first connecting component to access the body, to realize the potential reference point provided by accessing reference ground providing component;Second ground is used to access reference ground providing component by being electrically connected with the second connecting component, wherein, the first connecting component is different from the second connecting component, the second connecting component is not included in the first connecting component, and the first connecting component is not included in the second connecting component.In this way, the grounding stability of processing box chip can be improved.

Description

[0001] This application is a divisional application of the invention patent filed on November 14, 2022, with application number 202211431308.2 and invention title "A processing box chip, processing box, image forming apparatus and grounding inspection method". Technical Field

[0002] This application relates to the field of electronic imaging, and more specifically to a processing chip and a processing box. Background Technology

[0003] Currently, image forming apparatuses such as printers contain detachable processing cartridges for imaging. These cartridges house a processing chip, which needs to communicate with the image forming apparatus after installation. The processing chip typically has four contacts: a power contact (Volt Current Controller, VCC), a data signal contact (Serial Data, SDA), a clock signal contact (Clock, CLK), and a ground contact (GND). If the ground contact of the processing chip is unstable, it may damage the chip, thus affecting the operation of the image forming apparatus. Summary of the Invention

[0004] In view of this, this application provides a processing box chip and a processing box to solve the problem of processing box chip damage caused by unstable grounding in the prior art.

[0005] This application provides a processing box chip, which is mounted on a processing box. The processing box is detachably mounted on the image forming apparatus body. The processing box chip includes: a first grounding portion and a second grounding portion electrically connected to the first grounding portion.

[0006] The first grounding part is used to connect to the reference ground providing component provided in the main body by being electrically connected to the first connecting component, so as to realize the connection to the potential reference point provided by the reference ground providing component;

[0007] The second grounding portion is used to access the reference ground providing component by being electrically connected to the second connecting component, wherein the first connecting component is different from the second connecting component, the second connecting component is not included in the first connecting component and the first connecting component is not included in the second connecting component.

[0008] Secondly, embodiments of this application provide a processing box, which is detachably mounted on the image forming apparatus body. The processing box includes a processing box chip and a box body, and the processing box chip is the processing box chip described in any of the first aspects above.

[0009] Thirdly, embodiments of this application provide a processing box, which is detachably mounted on the image forming apparatus body. The processing box includes a processing box chip and a box body. The processing box chip includes a first grounding portion, and the box body includes a second grounding portion. The first grounding portion and the second grounding portion are electrically connected.

[0010] The first grounding part is used to connect to the reference ground providing component provided in the main body by being electrically connected to the first connecting component, so as to realize the connection to the potential reference point provided by the reference ground providing component;

[0011] The second grounding portion is used to access the reference ground providing component by being electrically connected to the third connecting component, wherein the first connecting component is different from the third connecting component, the third connecting component is not included in the first connecting component and the first connecting component is not included in the third connecting component.

[0012] Using the solution provided in this application embodiment, the processing cartridge chip provided in this application embodiment is mounted on a processing cartridge, which is detachably mounted on the image forming apparatus body. The processing cartridge chip includes: a first ground portion and a second ground portion electrically connected to the first ground portion. The first ground portion is used to connect to a reference ground providing component provided in the body through an electrical connection with a first connecting component, so as to access a potential reference point provided by the reference ground providing component; the second ground portion is used to connect to the reference ground providing component through an electrical connection with a second connecting component, wherein the first connecting component is different from the second connecting component, the second connecting component is not included in the first connecting component, and the first connecting component is not included in the second connecting component. That is, in the processing cartridge chip, two electrically connected ground portions, namely the first ground portion and the second ground portion, are provided, and the first ground portion can be connected to the reference ground providing component provided in the image forming apparatus body through the first connecting component, and the second ground portion can be connected to the reference ground providing component provided in the image forming apparatus body through the second connecting component. The first connecting component and the second connecting component are different and do not contain each other. That is, the grounding paths of the first grounding part and the second grounding part to the potential reference point are different, so that the processing box chip can be connected to the potential reference point through two grounding paths. Even if the first grounding part fails to stably connect to the potential reference point through the first connecting component, since the first grounding part and the second grounding part are electrically connected, the first grounding part can still connect to the potential reference point through the grounded second grounding part. This enables the processing box chip to stably connect to the potential reference point, improves the grounding stability of the processing box chip, and makes the processing box chip less prone to damage. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of a processing box chip provided in an embodiment of this application;

[0015] Figure 2 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0016] Figure 3 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0017] Figure 4 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0018] Figure 5 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0019] Figure 6 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0020] Figure 7 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0021] Figure 8 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0022] Figure 9 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0023] Figure 10 This is a schematic diagram of another processing box chip provided in an embodiment of this application;

[0024] Figure 11 This is a schematic diagram of the structure of a processing box provided in an embodiment of this application;

[0025] Figure 12 This is a schematic diagram of another processing box provided in an embodiment of this application;

[0026] Figure 13 This is a schematic diagram of another processing box provided in an embodiment of this application;

[0027] Figure 14This is a schematic diagram of the structure of an image forming apparatus provided in an embodiment of this application;

[0028] Figure 15 This is a schematic diagram of the structure of an image forming apparatus provided in an embodiment of this application;

[0029] Figure 16 This is a schematic diagram of another image forming apparatus provided in an embodiment of this application;

[0030] Figure 17 This is a schematic diagram of another image forming apparatus provided in an embodiment of this application;

[0031] Figure 18 This is a schematic diagram of another image forming apparatus provided in an embodiment of this application;

[0032] Figure 19 This is a schematic diagram of another image forming apparatus provided in an embodiment of this application;

[0033] Figure 20 A schematic flowchart of a grounding detection method provided in an embodiment of this application;

[0034] Figure 21 This is a schematic flowchart of another grounding detection method provided in an embodiment of this application. Detailed Implementation

[0035] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0036] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0037] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0038] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0039] Before detailing the embodiments of this application, the terms used or potentially used in these embodiments will be explained. Potential reference point: In a circuit, selecting a point A as the potential reference point means defining the potential at that point as zero. In circuits, the potential reference point is usually marked with the symbol "⊥". Conventionally, the earth's potential is often chosen as zero. In electronic circuits, a common point or the chassis is often chosen as the zero potential. It should be noted that although the potential of the potential reference point is defined as zero, the actual potential at this potential reference point may not necessarily be zero. For ease of explanation, the connection to the potential reference point may also be simply referred to as "grounding".

[0040] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper-clad laminate. In the manufacturing process of single-sided and double-sided PCBs, selective processing such as hole machining, chemical copper plating, electroplating, and etching are performed on the substrate material—the copper-clad laminate (CCL)—to obtain the desired circuit pattern. Another type of PCB, multilayer PCBs, also uses a thin copper-clad laminate as a base, and alternately laminates conductive pattern layers with prepreg in a single process to form interconnections between three or more conductive pattern layers. It has the functions of conductivity, insulation, and support. The performance, quality, processability, manufacturing cost, and manufacturing level of a PCB largely depend on the substrate material.

[0041] Currently, image forming apparatuses such as printers contain detachable processing cartridges for imaging. These cartridges house a processing chip, which needs to communicate with the image forming apparatus after installation. The processing chip typically has four contacts: a power contact (Volt Current Controller, VCC), a data signal contact (Serial Data, SDA), a clock signal contact (Clock, CLK), and a ground contact (GND). If the ground contact of the processing chip is unstable, it may damage the chip, thus affecting the operation of the image forming apparatus.

[0042] To address the aforementioned technical problems, this application provides a processing cartridge chip and a processing cartridge. The processing cartridge chip is mounted on the processing cartridge, and the processing cartridge is detachably mounted on the image forming apparatus body. The processing cartridge chip includes a first ground portion and a second ground portion electrically connected to the first ground portion. The first ground portion is used to connect to a reference ground providing component disposed on the body by being electrically connected to a first connecting component, thereby connecting to a potential reference point provided by the reference ground providing component. The second ground portion is used to connect to the reference ground providing component by being electrically connected to the second connecting component. The first connecting component is different from the second connecting component; the second connecting component is not included in the first connecting component, and the first connecting component is not included in the second connecting component. In other words, the aforementioned processing cartridge chip has two electrically connected grounding portions, namely a first grounding portion and a second grounding portion. The first grounding portion can be connected to a reference grounding component provided in the image forming apparatus body through a first connecting member, and the second grounding portion can be connected to the reference grounding component provided in the image forming apparatus body through a second connecting member. The first connecting member and the second connecting member are different and do not contain each other. That is, the grounding paths of the first grounding portion and the second grounding portion to the potential reference point are different, so that the processing cartridge chip can be connected to the potential reference point through two grounding paths. Even if the first grounding portion fails to stably connect to the potential reference point through the first connecting member, since the first grounding portion and the second grounding portion are electrically connected, the first grounding portion can still connect to the potential reference point through the grounded second grounding portion. This enables the processing cartridge chip to stably connect to the potential reference point, improves the grounding stability of the processing cartridge chip, and makes the processing cartridge chip less prone to damage.

[0043] Figure 1 This is a schematic diagram of a processing cartridge chip provided in an embodiment of this application. The processing cartridge chip is mounted on a processing cartridge, which is detachably mounted on the image forming apparatus body. The processing cartridge chip includes:

[0044] A first grounding part 101 and a second grounding part 102 electrically connected to the first grounding part 101;

[0045] The first grounding part 101 is used to connect to the reference ground providing component provided in the main body by being electrically connected to the first connecting component, so as to connect to the potential reference point provided by the reference ground providing component.

[0046] The second grounding part 102 is used to access the reference grounding component by being electrically connected to the second connecting part, wherein the first connecting part is different from the second connecting part, the second connecting part is not included in the first connecting part, and the first connecting part is not included in the second connecting part.

[0047] Specifically, to ensure stable grounding of the processing cartridge chip 100, two grounding portions are provided on the processing cartridge chip 100: a first grounding portion 101 and a second grounding portion 102 electrically connected to the first grounding portion 101. When the processing cartridge chip 100 is installed in a processing cartridge, and the processing cartridge is detachably installed on the image forming apparatus body, the first grounding portion 101 of the processing cartridge chip 100 can be electrically connected to a reference ground providing component through a first connecting member. For example, the reference ground providing component can be a data board, power board, or sheet metal provided on the image forming apparatus body. The second grounding portion 102 can be electrically connected to a reference ground providing component through a second connecting member, so that the first grounding portion and the second grounding portion can be respectively connected to a potential reference point, i.e., grounded. The first connecting member and the second connecting member are conductive connecting components, such as conductive contact springs, wires, and conductive springs.

[0048] It should be noted that the first grounding part 101 and the second grounding part 102 can be electrically connected inside the processing box chip 100 or outside the processing box chip 100 through conductive connectors such as wires. This application does not limit this.

[0049] It should be noted that the embodiments of this application do not limit the location of the first grounding portion 101 and the second grounding portion 102 on the processing cartridge chip 100, as long as it can be ensured that the first grounding portion 101 and the second grounding portion 102 can respectively provide a reference point for the component access potential through the reference ground. For example, a grounding contact is provided on the front and back of the processing cartridge chip 100, the first grounding portion 101 is the grounding contact provided on the front of the processing cartridge chip 100, and the second grounding portion 102 is the grounding contact provided on the back of the processing cartridge chip 100. The processing cartridge chip 100 is mounted on the processing cartridge via a chip holder. The chip holder has conductive components for electrical connection to the second grounding portion 102. The side of the chip holder closest to the processing cartridge chip 100 is the front side of the chip holder, and the side furthest from the processing cartridge chip 100 is the back side. The chip also has a side surface located between the front and back sides. The conductive components extend from the front side of the chip holder to the side surface. When the chip holder is mounted on the processing cartridge, and the processing cartridge is mounted on a drawer in the image forming apparatus, the conductive components on the side of the chip holder can overlap with the drawer. The drawer is electrically connected to the frame sheet metal within the image forming apparatus. Both are part of the sheet metal of the image forming apparatus and can act as reference grounding components, allowing the second grounding portion 102 to be connected to a potential reference point. Of course, the first grounding portion 101 and the second grounding portion 102 can also be located at other positions on the processing cartridge chip 100; this application does not impose any limitations on this.

[0050] It should be noted that when the first grounding part 101 and the second grounding part 102 are respectively connected to the potential reference point, since the first grounding part 101 and the second grounding part 102 are connected to the potential reference point through different paths, although both the first grounding part and the second grounding part are connected to the potential reference point, it does not mean that the potentials of the first grounding part and the second grounding part are exactly the same. There may still be a certain potential difference between the first grounding part 101 and the second grounding part 102, but this potential difference is small and will not affect the communication between the processing box chip 100 and the image forming apparatus body.

[0051] As one possible implementation, the second connector may include a preset analog circuit, that is, the second grounding part 102 is connected to a potential reference point through the preset analog circuit, which is used to generate a preset electrical signal.

[0052] Specifically, when the second grounding part 102 is electrically connected to the preset analog circuit, the preset analog circuit can provide a voltage that is the same as or similar to the potential reference point, so that the potential difference between the second grounding part 102 and the first grounding part 101 is 0 or small.

[0053] Furthermore, this preset analog circuit also includes a power supply, which is used to provide power to the preset analog circuit. The power supply can be a power supply component such as a battery, or an energy storage component such as a capacitor, as long as it can provide power to the preset analog circuit, and there is no limitation here.

[0054] Optionally, the power supply and the reference ground providing component are electrically connected, but the power supply and the reference ground providing component may be at the same potential or have a certain potential difference.

[0055] In one possible implementation, the second grounding portion 102 is electrically connected or disconnected from the data signal contact (Serial Data, SDA) or the clock signal contact (Clock, CLK) via a switching circuit. Specifically, the switching circuit is configured to electrically connect or disconnect the second grounding portion 102 from the data signal contact or the clock signal contact. In the operating state, the switching circuit is configured to disconnect the second grounding portion 102 from the data signal contact or the clock signal contact. In the detection state, the switching circuit is configured to electrically connect the second grounding portion 102 to the data signal contact or the clock signal contact. The switching circuit includes a switching switch configured to electrically connect or disconnect the second grounding portion 102 from the data signal contact or the clock signal contact. Furthermore, the switching circuit also includes a power supply component for supplying power to the switching switch, enabling the switching switch to be controlled on and off.

[0056] Furthermore, the second grounding part 102 can also be electrically connected to the data signal contact or clock signal contact through the aforementioned preset analog circuit.

[0057] As one possible implementation, the main body is provided with an electrical contact portion that is electrically connected to a reference ground providing component. The first grounding portion is used to electrically connect to the reference ground providing component by electrically connecting to the electrical contact portion provided on the main body, so as to realize the access potential reference point. The first connecting component is the electrical contact portion.

[0058] Specifically, the image forming apparatus body is provided with an electrical contact portion that is electrically connected to a reference ground providing component. A first grounding portion 101 is used to electrically connect to the reference ground providing component via the electrical contact portion, thereby achieving access to a potential reference point. In other words, the first grounding portion 101 is directly electrically connected to the reference ground providing component via the electrical contact portion; in this case, the first connecting component is the electrical contact portion. For example, as... Figure 2 As shown, a first ground portion 101 is provided on the processing cartridge chip 100, and a second ground portion 102 is provided on the back side of the processing cartridge chip. When the processing cartridge chip 100 is mounted on the processing cartridge 201, and the processing cartridge 201 is detachably mounted on the image forming apparatus body 202, the first ground portion 101 of the processing cartridge chip 100 will be electrically connected to the reference ground providing component 204 through an electrical contact portion 203 provided on the image forming apparatus body 202.

[0059] As one possible implementation, such as Figure 3 As shown, the main body 202 is also provided with a transition circuit board 205. The transition circuit board 205 is electrically connected to the electrical contact 203 and the reference ground providing component 204 respectively. The first grounding part 101 is used to be electrically connected to the reference ground providing component 204 by being electrically connected to the electrical contact 203 and the transition circuit board 205, so as to realize the access potential reference point. The first connection component 101 includes the electrical contact 203 and the transition circuit board 205.

[0060] Specifically, in the image forming apparatus, the processing cartridge chip is typically electrically connected to the data board via an adapter circuit board. Therefore, the image forming apparatus body also includes an adapter circuit board 205. When the processing cartridge chip 100 is mounted on the processing cartridge 201, and the processing cartridge 201 is detachably mounted on the image forming apparatus body 202, the first ground portion 101 of the processing cartridge chip 100 is electrically connected to the electrical contact portion 203. The electrical contact portion 203 is electrically connected to the adapter circuit board 205, thereby making the first ground portion 101 electrically connected to the reference ground providing component 204. At this time, the reference ground providing component 204 is the data board. Since the data board can provide a potential reference point, the first ground portion 101 can be regarded as grounded. That is to say, the first connecting component 101 includes the electrical contact portion 203 and the adapter circuit board 205, and the first ground portion 101 is connected to the potential reference point through the electrical contact portion 203 and the adapter circuit board 205.

[0061] It should be further explained that the image forming apparatus includes an image forming control unit, which can be a SoC (System on Chip). An SoC is a miniature system composed of components from multiple systems and is configured to control the imaging processing operations of the image forming apparatus, such as performing linear correction, noise reduction, bad pixel removal, and detail enhancement on image data to improve the quality of the image output. The image forming control unit is also used to perform data transmission and reception, command transmission and reception, and processing operations related to the printing engine control of the image. For example, it can transmit and receive data, print engine control commands, and status through interface units (including but not limited to USB ports, wired network ports, wireless network ports, or other interfaces). The image forming control unit can be a data board.

[0062] As one possible implementation, component 204 is provided with reference to include an image forming control unit and / or a power supply unit.

[0063] Specifically, the reference ground providing component 204 includes an image forming control unit and / or a power supply unit. The power supply unit supplies power to the image forming control unit, which controls the image forming apparatus to form an image. Both the image forming control unit and the power supply unit can provide a potential reference point.

[0064] As one possible implementation, the reference ground provided component 204 includes a first sheet metal part on the body, a second grounding part for electrically connecting to the reference ground provided component by electrically connecting to the first sheet metal part on the body, and a second connecting component including a first conductor for electrically connecting the second grounding part and the first sheet metal part.

[0065] Specifically, since the first sheet metal part on the image forming apparatus body is grounded, the reference grounding component 204 includes the first sheet metal part on the body. When the processing cartridge chip is mounted on the processing cartridge, and the processing cartridge is detachably mounted on the image forming apparatus body, the second grounding part 102 is used to connect to a potential reference point by electrically connecting to the first sheet metal part on the body. The second grounding part 102 is electrically connected to the first sheet metal part on the body via a first conductor to achieve grounding. At this time, the second connection component includes a first conductor for electrically connecting the second grounding part and the first sheet metal part.

[0066] As one possible implementation, the reference-provided component 204 includes a first sheet metal part on the body, a mounting base detachably mounted on the body, the mounting base including a plurality of receptacles for mounting a processing box, the mounting base including a second sheet metal part, a second grounding part for electrically connecting the second sheet metal part to the reference-provided component when the second sheet metal part is electrically connected to the first sheet metal part, and a second connecting component including a second conductor for electrically connecting the second grounding part and the second sheet metal part.

[0067] Specifically, if a processing cartridge containing the processing cartridge chip 100 is installed in the image forming apparatus body, a mounting base is typically detachably mounted on the image forming apparatus body. The mounting base includes multiple receiving portions for mounting the processing cartridge, and the processing cartridge can be directly mounted on the mounting base. The image forming apparatus body has a first sheet metal component, and the mounting base includes a second sheet metal component. When the processing cartridge containing the processing cartridge chip 100 is mounted on the mounting base, and the mounting base is mounted on the image forming apparatus body, the second sheet metal component and the first sheet metal component are electrically connected and thus conduct to each other. Since the first sheet metal component is grounded, the second sheet metal component can be grounded through the first sheet metal component. At this time, the second connection portion 102 of the processing cartridge chip 100 can be electrically connected to the second sheet metal component, thereby being electrically connected to the reference ground providing component 204 (the first sheet metal component), so that the second connection portion 102 of the processing cartridge chip 100 is connected to a potential reference point. The second connection component includes a second conductor for electrically connecting the second ground portion and the second sheet metal component.

[0068] For example, suppose the processing cartridge chip 100 is as follows: Figure 4 The processing chip shown has four electrical contacts on its front side: a power contact (Volt Current Contact, VCC), a data signal contact (Serial Data, SDA), a clock signal contact (Clock, CLK), and a first ground contact GND1. A second ground contact GND2 is located on the back side. The first ground contact GND1 and the second ground contact GND2 are electrically connected internally within the chip. That is, the first ground portion 101 is the first ground contact GND1, and the second ground portion 102 is the second ground contact GND2. Figure 5 As shown, the image forming apparatus body is provided with chip contact springs, among which the contact springs used for grounding are electrical contacts. When the processing cartridge chip 100 is mounted on the processing cartridge, and the processing cartridge is mounted on the mounting base and inserted into the image forming apparatus body, the chip contact springs 501 provided on the image forming apparatus body are electrically connected to the four electrical contacts 502 on the front side of the processing cartridge chip 100. The chip contact springs 501 are electrically connected to the reference ground providing component (image forming control unit) through the adapter circuit board. At this time, the image forming control unit can be a data board, which is fixed to the frame sheet metal of the image forming apparatus by screws. Since the frame sheet metal of the image forming apparatus is grounded, the data board can be grounded through the frame sheet metal of the image forming apparatus. Therefore, the grounding contact GND1 on the front side of the processing cartridge chip 100 can be grounded through the data board. Figure 6As shown, the grounding contact GND2 on the back of the processing cartridge chip 100 is electrically connected to one end of the conductive component 601, and the other end of the conductive component 601 is electrically connected to the drawer sheet metal 602. In this case, the drawer sheet metal is the aforementioned second sheet metal component. Since the drawer sheet metal 602 contacts the frame sheet metal to achieve electrical connection when mounted on the image forming apparatus body, the drawer sheet metal 602 is grounded through the frame sheet metal. The frame sheet metal is the first sheet metal component, and the conductive component 601 is the second conductor. Therefore, the second grounding contact GND2 on the back of the processing cartridge chip 100 can be grounded through its electrical connection to the drawer sheet metal 602. In this way, the first grounding contact GND1 on the front of the processing cartridge chip 100 can be grounded, and when the first grounding contact GND1 is unstable due to grounding via the data board, it can be grounded through the second grounding contact GND2, which is electrically connected to it, thereby achieving stable grounding of the processing cartridge chip.

[0069] As one possible implementation, the processing chip 100 further includes: a first ground contact and a substrate, wherein the first ground contact is disposed on the substrate, and the first ground portion is a part of the first ground contact.

[0070] Specifically, to facilitate the configuration of the first grounding portion 101 and the second grounding portion 102, a first grounding contact and a substrate can be provided on the processing chip 100, such as... Figure 7 As shown, a first grounding contact 702 is provided on the substrate 701, and the first grounding portion 101 is a part of the first grounding contact 702.

[0071] As one possible implementation, the second grounding part 102 is another part of the first grounding contact 702.

[0072] Specifically, such as Figure 7 As shown, a substrate 701 can be provided on the processing chip 100, and a first ground contact 702 is provided on the substrate 701. The first ground part 101 is a part of the first ground contact 702, and the second ground part 102 is another part of the first ground contact 702. In this way, the first ground part 101 can be electrically connected to the second ground part 102 without the need for additional conductive lines.

[0073] As one possible implementation, the second grounding portion 102 and the first grounding portion 101 are located on different surfaces of the substrate 701.

[0074] Specifically, depending on actual needs, the second grounding part 102 and the first grounding part 101 can be located on different surfaces of the substrate 701, and this application does not limit this.

[0075] For example, such as Figure 8As shown, to facilitate electrical connection with other components, the first ground contact 702 of the processing box chip has a relatively large area. For example... Figure 9 As shown, a conductive contact spring 901 (electrical contact portion) and a conductive spring 902 are provided on the image forming apparatus body. When the processing cartridge chip is mounted on the processing cartridge and the processing cartridge is mounted on the image forming apparatus body, the conductive contact spring 901 contacts a portion of the first grounding contact 702, thereby making the processing cartridge chip electrically connected to the image forming apparatus control unit provided in the body through the first grounding contact 702, thus achieving grounding. The conductive spring 902 is electrically connected to the other portion of the first grounding contact 702, and because the conductive spring 902 is in contact with the sheet metal of the body and thus grounded, the processing cartridge chip is electrically connected to the conductive spring 902 through the first grounding contact 702, thereby achieving grounding.

[0076] It could also be, such as Figure 10 As shown, a conductive component 1002 is installed on the chip mounting bracket 1001 of the processing box. One end of the conductive component 1002 is in contact with the first grounding contact 702 of the processing box chip 1003. The chip contact spring 1004 (electrical contact part) on the main body is in contact with one end of the conductive component 1002, thereby realizing the electrical connection between the processing box chip 1003 and the image forming apparatus control unit set in the main body, thereby realizing grounding. When the chip 1003 is installed, the other end of the conductive component is in contact with the drawer sheet metal 1005, thereby enabling the processing box chip to be grounded through the drawer sheet metal 1005.

[0077] Corresponding to the above embodiments, this application also provides a processing box, which is detachably mounted on an image forming apparatus, including a processing box chip and a box body, wherein the processing box chip is the processing box chip described in any of the above embodiments.

[0078] Corresponding to the above embodiments, this application also provides a processing box. For example... Figure 11 As shown, the above-mentioned processing box includes a processing box chip 1101 and a box body 1102. The processing box chip 1101 includes a first grounding portion 1103, and the box body 1102 includes a second grounding portion 1104. The first grounding portion 1103 and the second grounding portion 1104 are electrically connected.

[0079] The first grounding part 1103 is used to connect to the reference ground providing component provided on the main body by electrically connecting to the first connecting component, so as to connect to the potential reference point provided by the reference ground providing component.

[0080] The second grounding part 1104 is used to access the reference grounding component by being electrically connected to the third connecting component, wherein the first connecting component is different from the third connecting component, the third connecting component is not included in the first connecting component, and the first connecting component is not included in the third connecting component.

[0081] Specifically, besides setting the second grounding portion on the processing box chip, since the processing box chip needs to be installed in the processing box for use, the second grounding portion can also be set on the box body. Based on this, the processing box provided in this application embodiment includes a processing box chip 1101 and a box body 1102, wherein the processing box chip 1101 includes a first grounding portion 1103, and the box body 1102 includes a second grounding portion 1104; the first grounding portion 1103 and the second grounding portion 1104 are electrically connected. Since the first grounding portion 1103 can be connected to a potential reference point through a first connecting component, and the second grounding portion 1104 can be connected to a potential reference point through a third connecting component, and the first grounding portion 1103 and the second grounding portion 1104 are electrically connected, when the first grounding portion 1103 fails to stably connect to the potential reference point, the first grounding portion 1103 can also connect to the potential reference point through the second grounding portion 1104 connected to the potential reference point, thereby making the grounding of the processing box chip 1101 stable.

[0082] As one possible implementation, the main body is provided with an electrical contact portion that is electrically connected to a reference ground providing component. The first grounding portion is used to electrically connect to the reference ground providing component by electrically connecting to the electrical contact portion provided on the main body, so as to realize the access potential reference point. The first connecting component is the electrical contact portion.

[0083] Specifically, such as Figure 12 As shown, the image forming apparatus body 1105 is provided with an electrical contact 1107 that is electrically connected to the reference ground providing component 1106. A first grounding portion 1103 is used to connect to the reference ground providing component via the electrical contact to achieve access to a potential reference point. In other words, the first grounding portion 1103 is directly electrically connected to the reference ground providing component via the electrical contact. In this case, the first connecting component is the electrical contact. The first grounding portion 1103 of the processing cartridge chip 1101 is electrically connected to the reference ground providing component 1106 via the electrical contact 1107 provided on the image forming apparatus body 1105.

[0084] As one possible implementation, such as Figure 13 As shown, the main body 1105 is also provided with a transition circuit board 1108. The transition circuit board 1108 is electrically connected to the electrical contact 1107 and the reference ground providing component 1106 respectively. The first grounding part 1103 is used to be electrically connected to the reference ground providing component 1106 by being electrically connected to the electrical contact 1107 and the transition circuit board 1108, so as to realize the access potential reference point. The first connection component 1103 includes the electrical contact 1107 and the transition circuit board 1108.

[0085] Specifically, in the image forming apparatus, the processing cartridge chip is typically electrically connected to the data board via an adapter circuit board. Therefore, the image forming apparatus body 1105 also includes an adapter circuit board 1108. When the processing cartridge chip 1101 is mounted on the processing cartridge, and the processing cartridge is detachably mounted on the image forming apparatus body 1105, the first ground portion 1103 of the processing cartridge chip 1101 is electrically connected to the electrical contact portion 1107. The electrical contact portion 1107 is electrically connected to the adapter circuit board 1108, thereby making the first ground portion 1103 electrically connected to the reference ground providing component 1106 to achieve access to a potential reference point. In other words, the first connecting component 101 includes the electrical contact portion 1107 and the adapter circuit board 1108, and the first ground portion 1103 is connected to the reference ground providing component 1106 via the electrical contact portion 1107 and the adapter circuit board 1108 to access the potential reference point.

[0086] As one possible implementation, components are provided for reference, including an image forming control unit and / or a power supply unit.

[0087] Specifically, such as Figure 14 As shown, the reference ground providing component 1106 includes an image forming control unit 1401 and / or a power supply unit 1402. The power supply unit 1402 supplies power to the image forming control unit 1401, which controls the image formed by the image forming apparatus. Both the image forming control unit 1401 and the power supply unit 1402 can provide a potential reference point.

[0088] As one possible implementation, the reference ground component includes a first sheet metal part on the body, a second grounding part for electrically connecting to the reference ground component by electrically connecting to the first sheet metal part on the body, and a third connecting part including a third conductor for electrically connecting the second grounding part and the first sheet metal part.

[0089] Specifically, since the first sheet metal part on the image forming apparatus body is grounded, the reference grounding component 1106 includes the first sheet metal part on the body. When the processing cartridge is detachably mounted on the image forming apparatus body, the second grounding portion 1104 on the cartridge 1102 is used to connect to a potential reference point by electrically connecting to the first sheet metal part on the body. The second grounding portion 1104 is electrically connected to the first sheet metal part on the body via a first conductor to achieve grounding. At this time, the third connecting component includes a third conductor for electrically connecting the second grounding portion and the first sheet metal part.

[0090] As one possible implementation, the reference-provided component includes a first sheet metal part on the body, a mounting base detachably mounted on the body, the mounting base including a plurality of receiving portions for processing boxes, the mounting base including a second sheet metal part, a second grounding portion for electrically connecting the second sheet metal part to the reference-provided component when the second sheet metal part is electrically connected to the first sheet metal part, and a third connecting component including a fourth conductor for electrically connecting the second grounding portion and the second sheet metal part.

[0091] Specifically, if the processing cartridge is installed in the image forming apparatus body, a mounting base is typically detachably mounted on the image forming apparatus body. The mounting base includes multiple receiving portions for mounting the processing cartridge, and the processing cartridge can be directly installed on the mounting base. The image forming apparatus body has a first sheet metal component, and the mounting base includes a second sheet metal component. When the processing cartridge is installed on the mounting base on the image forming apparatus body, the second sheet metal component and the first sheet metal component are electrically connected and thus conduct to each other. Since the first sheet metal component is grounded, the second sheet metal component can be grounded through the first sheet metal component. At this time, the second connection portion 1104 of the processing cartridge chip 1101 in the processing cartridge can be electrically connected to the second sheet metal component through a second conductor, thereby electrically connecting to the reference ground providing component 1106 (the first sheet metal component), so that the second connection portion 1104 of the processing cartridge chip 1101 is connected to a potential reference point. The second connection component includes a fourth conductor for electrically connecting the second ground portion and the second sheet metal component.

[0092] Corresponding to the above embodiments, this application provides an image forming apparatus, including a main body and a processing box, wherein the processing box is the one described above. Figures 11 to 14 The processing box described above in any embodiment.

[0093] Corresponding to the above embodiments, this application provides another image forming apparatus, such as... Figure 15 As shown, it includes:

[0094] Ontology 1501;

[0095] Reference ground component 1502 is used to provide a potential reference point;

[0096] Electrical contact 1503 is used to electrically connect electrical contacts provided on the processing box, wherein the processing box is the aforementioned... Figures 11 to 14 The processing box described above in any embodiment;

[0097] The switch module 1504 has one end electrically connected to the reference ground providing component 1502 to access the potential reference point provided by the reference ground providing component 1502; the other end of the switch module 1504 is electrically connected to the power supply unit 1505 and the other end of the switch module 1504 is electrically connected to the electrical contact part 1503.

[0098] Optionally, the electrical contact 1503 is electrically connected to the first grounding portion 1103 on the processing box, whereby the first grounding portion 1103 is the aforementioned electrical contact. Of course, the electrical contact can also be any other part used for electrical connection with the image forming apparatus.

[0099] Specifically, such as Figure 15 As shown, the image forming apparatus includes a body 1501, a reference ground providing component 1502, an electrical contact 1503, and a switch module 1504. One end of the switch module 1504 is electrically connected to the reference ground providing component 1502 to access the potential reference point provided by the reference ground providing component 1502; the other end of the switch module 1504 is electrically connected to the power supply unit 1505, and the other end of the switch module 1504 is electrically connected to the electrical contact 1503. Through the above image forming apparatus, it is possible to detect whether the processing box meets expectations, as detailed below.

[0100] It should be noted that the power supply unit 1505 can be an external power supply or can be installed inside the image forming apparatus; this application does not impose any restrictions on this.

[0101] As one possible implementation, component 1502 is provided with an image forming control unit, which is used to acquire an electrical signal from an electrical contact and determine whether the electrical signal meets expectations when the switch module 1504 is in an open state. When the electrical signal generated by the electrical contact meets expectations, it is determined that the processing box meets expectations.

[0102] Specifically, in an image forming apparatus, an image forming control unit is used to control the image forming apparatus to form an image. Furthermore, since the image forming control unit can be grounded through a sheet metal component of the image forming apparatus body, therefore, as... Figure 16As shown, the components provided for reference may include an image forming control unit 1502. The image forming control unit 1502 is used to acquire an electrical signal from the electrical contact 1503 and determine whether the electrical signal meets expectations when the switch module 1504 is in the off state. If the electrical signal generated by the electrical contact 1503 meets expectations, it is determined that the processing unit meets expectations. For example, the image forming control unit 1502 can disconnect the switch module 1504 to disconnect the electrical connection between the electrical contact 1503 and the image forming control unit. Since the electrical contact 1503 is electrically connected to the first ground portion of the processing unit chip on the processing unit when the processing unit is mounted on the image forming apparatus in any of the above embodiments, if the first ground portion is stably grounded, the potential of the electrical contact 1503 should be low even if the switch module is disconnected. That is, when the switch module 1504 is disconnected, the electrical signal from the electrical contact 1503 can be acquired, and based on the electrical signal from the electrical contact 1503, it can be determined whether the electrical signal meets expectations, i.e., whether the electrical signal is low. When the electrical signal generated by the electrical contact 1503 meets expectations, it is determined that the processing box meets expectations. That is, when it is determined that the electrical signal generated by the electrical contact 1503 is a low-level signal, it is determined that the grounding of the processing box is stable.

[0103] As one possible implementation, such as Figure 17 As shown, the image forming apparatus also includes a detection unit 1506, which is electrically connected to the electrical contact portion 1503 and is used to detect the electrical signal of the electrical contact portion 1503.

[0104] Specifically, to facilitate the detection of electrical signals from the electrical contact 1503, the image forming apparatus may be equipped with a detection unit 1506. For example... Figure 17 As shown, the detection unit 1506 is electrically connected to the electrical contact 1503. After the image forming control unit 1502 disconnects the switch module 1504, the detection unit 1506 can detect the electrical signal of the electrical contact 1503.

[0105] As one possible implementation, both the switch module 1504 and the detection unit 1506 are included in the image forming control unit 1502.

[0106] Specifically, to save space, such as Figure 18 As shown, the switch module 1504 and the detection unit 1506 can be integrated into the image forming control unit 1502. In this case, both the switch module 1504 and the detection unit 1506 are included in the image forming control unit 1502.

[0107] As one possible implementation, the main body 1501 is also provided with a transition circuit board 1507, which is electrically connected to the electrical contact part 1503 and the image forming control unit 1502 respectively. The switch module 1504 and the detection unit 1506 are included in the transition circuit board 1507.

[0108] Specifically, such as Figure 19 As shown, the main body 1501 is also provided with a transition circuit board 1507. The switch module 1504 and the detection unit 1506 can be integrated on the transition circuit board 1507. The transition circuit board 1507 is electrically connected to the image forming control unit 1502, thereby controlling the on and off of the switch module 1504 in the transition circuit board 1507.

[0109] Corresponding to the above embodiments, Figure 20 This is a schematic flowchart illustrating a grounding detection method provided in an embodiment of this application. The grounding detection method is applied to the image forming apparatus described in any of the above embodiments, and the method includes:

[0110] Step S2001: Control the switching module in the image forming apparatus to be in the off state, so that the first ground portion of the processing box chip of the processing box installed on the image forming apparatus is disconnected from the potential reference point provided by the reference ground providing component provided on the image forming apparatus.

[0111] Specifically, during chip grounding detection, the image forming apparatus controls its internal switching module to disconnect. When the switching module is disconnected, the first grounding portion of the processing chip in the processing box mounted on the image forming apparatus will disconnect from the potential reference point provided by the reference ground providing component provided on the image forming apparatus.

[0112] It should be noted that the above-mentioned processing box chip can be any of the above-described embodiments of the processing box chip, and the above-described processing box can be any of the above-described embodiments of the processing box.

[0113] Step S2002: Obtain potential detection information of the electrical contact portion on the image forming apparatus used for electrical connection with the first ground portion.

[0114] Specifically, because the switch module is disconnected, the electrical contact on the image forming apparatus is disconnected from the potential reference point provided by the reference ground providing component. At this time, the electrical contact is still electrically connected to the first ground part of the processing cartridge chip, and the potential detection information of the electrical contact can be obtained.

[0115] Step S2003: Based on the potential detection information, determine whether the processing box meets expectations.

[0116] Specifically, since the electrical contact is electrically connected to the first ground portion of the processing cartridge chip, although the first ground portion of the processing cartridge chip cannot be grounded by being electrically connected to the reference grounding component through the electrical contact, the second ground portion is grounded through the sheet metal within the image forming apparatus. The first ground portion and the second ground portion are electrically connected. Therefore, if the processing cartridge chip within the processing cartridge is stably grounded, the first ground portion of the processing cartridge chip can still be grounded through the second ground portion of the processing cartridge chip. In this case, the electrical contact can still be grounded through the first contact. Based on this, according to the potential detection information, it can be determined whether the processing cartridge meets expectations, as follows.

[0117] Furthermore, determining whether the processing box meets expectations based on the potential detection information includes:

[0118] If the potential detection information is high, it indicates that the processing box does not meet expectations;

[0119] If the potential detection information is low, it is determined that the processing box meets expectations.

[0120] Specifically, if the detected potential information is high, it indicates that the electrical connection between the first and second contacts of the processing chip inside the processing box is unstable, or the second contact is not grounded stably, or other grounding instability occurs. In this case, the processing box is determined not to meet expectations. If the detected potential information is low, it indicates that the first and second contacts of the processing chip inside the processing box are grounded stably. In this case, the processing box is determined to meet expectations. In this way, the grounding stability of the processing box can be detected by the above grounding detection method.

[0121] Figure 21 This is a schematic flowchart illustrating another grounding detection method provided in an embodiment of this application. The above grounding detection method is applied to an image forming apparatus, and the method includes:

[0122] Step S2101: Control the switching module in the image forming apparatus to be in the off state, so that the first ground portion of the processing box chip of the processing box installed on the image forming apparatus is disconnected from the potential reference point provided by the reference ground providing component provided on the image forming apparatus.

[0123] For details, please refer to step S2001 above, which will not be repeated here.

[0124] Step S2102: Interrupt the power supply provided to the processing box chip.

[0125] Specifically, to improve the safety of the detection process, the power supply to the processing chip is interrupted before acquiring the potential detection information of the electrical contact.

[0126] Step S2103: Turn on the power supply to the electrical contact.

[0127] Specifically, to improve the accuracy of detection, the power supply to the electrical contact is turned on before acquiring the potential detection information of the electrical contact, providing a high-level signal to the electrical contact. However, if the processing box is grounded stably, the electrical contact will still be at a low level, thereby improving the accuracy of detection.

[0128] It should be noted that step S2102 can be executed first, followed by step S2103, or step S2103 can be executed first, followed by step S2102.

[0129] Step S2104: Obtain potential detection information of the electrical contact portion on the image forming apparatus used for electrical connection with the first ground portion.

[0130] For details, please refer to step S2002 above, which will not be repeated here.

[0131] Step S2105: Based on the potential detection results, determine whether the processing box meets expectations.

[0132] For details, please refer to step S2003 above, which will not be repeated here.

[0133] Corresponding to the above embodiments, this application provides an image forming control device, including:

[0134] The image forming control unit is used to perform the above... Figure 20 or Figure 21 The steps of the grounding detection method described above in any embodiment.

[0135] Corresponding to the above embodiments, this application provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the above-described... Figure 20 or Figure 21 The steps of the grounding detection method described above in any embodiment are described above. The computer-readable storage medium described above may be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM), etc.

[0136] Those skilled in the art will clearly understand that the techniques in the embodiments of the present invention can be implemented using software plus necessary general-purpose hardware platforms. Based on this understanding, the technical solutions in the embodiments of the present invention, or the parts that contribute to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer server or a network device, etc.) to execute the methods described above in various embodiments or some parts of the embodiments of the present invention.

[0137] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

Claims

1. A processing cartridge chip, said processing cartridge chip being mounted on a processing cartridge, said processing cartridge being detachably mounted on an image forming apparatus body, characterized in that, The processing chip includes: a first grounding portion and a second grounding portion electrically connected to the first grounding portion; The first grounding part is used to connect to the reference ground providing component provided on the main body by electrically connecting to the first connecting component, so as to connect to the potential reference point provided by the reference ground providing component. The main body is provided with an electrical contact part that is electrically connected to the reference ground providing component. The first grounding part is used to connect to the reference ground providing component by electrically connecting to the electrical contact part provided on the main body, so as to connect to the potential reference point. The first connecting component is the electrical contact part. The reference ground providing component includes an image forming control unit. The image forming control unit is a data board. The first grounding part can be grounded through the data board. The second grounding portion is used to connect to the reference ground providing component by being electrically connected to the second connecting component, wherein the first connecting component is different from the second connecting component, the second connecting component is not included in the first connecting component, and the first connecting component is not included in the second connecting component; The reference ground providing component includes a first sheet metal part on the body, and the second grounding part is used to be electrically connected to the reference ground providing component by being electrically connected to the first sheet metal part on the body.

2. The processing cartridge chip according to claim 1, characterized in that, The image forming apparatus includes a switching module, one end of which is electrically connected to a reference ground providing component to enable access to a potential reference point provided by the reference ground providing component, and the other end of which is electrically connected to an electrical contact. When the processing box is installed in the image forming apparatus, when the switch module is in the closed state, the first grounding part is grounded through the first connecting member and the second grounding part respectively, and when the switch module is in the open state, the first grounding part is grounded through the second grounding part.

3. The processing cartridge chip according to claim 2, characterized in that, The main body is also provided with an adapter circuit board, which is electrically connected to the electrical contact and the reference ground providing component respectively. The first grounding part is used to electrically connect to the reference ground providing component by electrically connecting to the electrical contact and the adapter circuit board, so as to realize access to the potential reference point. The first connecting component includes the electrical contact and the adapter circuit board.

4. The processing cartridge chip according to claim 1, characterized in that, The processing chip also includes a power contact, a data signal contact, and a clock signal contact, with the first grounding portion located between the data signal contact and the clock signal contact; The power contact, the data signal contact, the first grounding portion, and the clock signal contact are arranged sequentially at intervals along the same direction.

5. The processing cartridge chip according to any one of claims 1-4, characterized in that, The second connecting component includes a first conductor for electrically connecting the second grounding portion and the first sheet metal part.

6. The processing cartridge chip according to any one of claims 1-4, characterized in that, The reference ground providing component includes a first sheet metal part on the body, a mounting base detachably mounted on the body, the mounting base including a plurality of receiving portions for mounting a processing box, the mounting base including a second sheet metal part, a second grounding portion for electrically connecting the second sheet metal part to the reference ground providing component when the second sheet metal part is electrically connected to the first sheet metal part, and the second connecting component including a second conductor for electrically connecting the second grounding portion and the second sheet metal part.

7. The processing cartridge chip according to any one of claims 1-4, characterized in that, The processing box chip further includes: a first ground contact and a substrate, wherein the first ground contact is disposed on the substrate, and the first grounding portion is a part of the first ground contact.

8. The processing cartridge chip according to claim 7, characterized in that, The second grounding part is another part of the first grounding contact.

9. The processing cartridge chip according to claim 7, characterized in that, The processing chip also includes a second ground contact that is different from the first ground contact. The second ground contact is disposed on the substrate, and the second ground portion is a part of the second ground contact.

10. The processing cartridge chip according to claim 9, characterized in that, The second grounding portion and the first grounding portion are located on different surfaces of the substrate.

11. A processing box, said processing box being detachably mounted on the body of an image forming apparatus, characterized in that, The processing box includes a processing box chip and a box body, wherein the processing box chip is the processing box chip described in any one of claims 1-10.

12. A processing box, said processing box being detachably mounted on the body of an image forming apparatus, characterized in that, The processing box includes a processing box chip and a box body. The processing box chip includes a first grounding portion, and the box body includes a second grounding portion. The first grounding portion and the second grounding portion are electrically connected. The first grounding part is used to connect to the reference ground providing component provided on the main body by electrically connecting to the first connecting component, so as to connect to the potential reference point provided by the reference ground providing component. The main body is provided with an electrical contact part that is electrically connected to the reference ground providing component. The first grounding part is used to connect to the reference ground providing component by electrically connecting to the electrical contact part provided on the main body, so as to connect to the potential reference point. The first connecting component is the electrical contact part. The reference ground providing component includes an image forming control unit. The image forming control unit is a data board. The first grounding part can be grounded through the data board. The second grounding portion is used to connect to the reference ground providing component by being electrically connected to the third connecting component, wherein the first connecting component is different from the third connecting component, the third connecting component is not included in the first connecting component, and the first connecting component is not included in the third connecting component; The reference ground providing component includes a first sheet metal part disposed on the body, and the second grounding portion is used to be electrically connected to the reference ground providing component by being electrically connected to the first sheet metal part on the body.

13. The processing box according to claim 12, characterized in that, The image forming apparatus includes a switching module, one end of which is electrically connected to a reference ground providing component to enable access to a potential reference point provided by the reference ground providing component, and the other end of which is electrically connected to an electrical contact. When the processing box is installed in the image forming apparatus, when the switch module is in the closed state, the first grounding part is grounded through the first connecting member and the second grounding part respectively, and when the switch module is in the open state, the first grounding part is grounded through the second grounding part.

14. The processing box according to claim 13, characterized in that, The main body is also provided with an adapter circuit board, which is electrically connected to the electrical contact and the reference ground providing component respectively. The first grounding part is used to electrically connect to the reference ground providing component by electrically connecting to the electrical contact and the adapter circuit board, so as to realize access to the potential reference point. The first connecting component includes the electrical contact and the adapter circuit board.

15. The processing box according to claim 12, characterized in that, The reference ground providing component includes an image forming control unit and / or a power supply unit; the processing cartridge chip also includes a power contact, a data signal contact and a clock signal contact, and the first ground portion is located between the data signal contact and the clock signal contact; The power contact, the data signal contact, the first grounding portion, and the clock signal contact are arranged sequentially at intervals along the same direction.

16. The processing box according to any one of claims 12-15, characterized in that, The third connecting component includes a third conductor for electrically connecting the second grounding portion and the first sheet metal part.

17. The processing box according to any one of claims 12-15, characterized in that, The reference ground providing component includes a first sheet metal part disposed on the body, a mounting base detachably mounted on the body, the mounting base including a plurality of receiving portions for mounting the processing box, the mounting base including a second sheet metal part, the second grounding portion being used to electrically connect the second sheet metal part to the reference ground providing component when the second sheet metal part is electrically connected to the first sheet metal part, and the third connecting component including a fourth conductor for electrically connecting the second grounding portion and the second sheet metal part.

Images