Solid-state drive and solid-state drive circuit board

Abstract

The present invention discloses a solid-state drive and a circuit board for the solid-state drive. The solid-state drive includes a circuit board and a flash memory. The circuit board includes multiple fixed memory areas. The circuit board includes four perforation groups and multiple first perforations. Each perforation group includes multiple second perforations. At least two second perforations in the same perforation group expose different areas of the same auxiliary connection structure. A portion of the auxiliary connection structure is covered by a protective layer of the circuit board. Each first perforation and each second perforation penetrates the protective layer. The four corners of the flash memory are connected to the auxiliary connection structure through a welding structure, thereby improving the connection strength between the two. The flash memory is connected to the electrical contact pads in each first perforation through the welding structure to electrically connect to the circuit board.

Description

Technical Field

[0001] The present invention relates to a hard disk and a circuit board of a hard disk, in particular to a solid state drive and a circuit board of a solid state drive. Background Art

[0002] In the existing common solid state drive (SSD) without a housing, when a user disassembles and assembles the solid state drive on a computer motherboard, the user will directly touch the flash memory of the solid state drive. Therefore, after the solid state drive is repeatedly disassembled and assembled for a long time, the problem of flash memory peeling may occur to the solid state drive. In addition, in the existing flash memory technology of the solid state drive, when it is collided or the solid state drive falls, the flash memory is prone to peeling problems. Summary of the Invention

[0003] The present invention discloses a solid state drive and a circuit board of a solid state drive, mainly for improving the existing solid state drive without a housing, in which the flash memory is easily affected by external forces and peeled off from the circuit board.

[0004] One embodiment of the present invention discloses a solid state drive, which includes: a circuit board having a plugging structure at one end for plugging into a slot of an electronic device. The circuit board includes multiple memory fixing areas. One side of the circuit board has a protective layer. The circuit board has multiple first through holes and four through hole groups in each memory fixing area. Each first through hole penetrates the protective layer, and an electrical contact pad is exposed on the circuit board at each first through hole. The four through hole groups are located at the four corners of the memory fixing area. Each through hole group includes N second through holes, and each second through hole penetrates the protective layer. Any one of the second through holes included in the same through hole group and at least one of the remaining second through holes in the same through hole group expose different areas of one of the auxiliary connection structures on the circuit board; the edge of any one of the auxiliary connection structures is not exposed by any second through hole, and the edges of all the auxiliary connection structures are not exposed from the protective layer, and any one of the auxiliary connection structures is not connected to any electrical contact pad; wherein, there are M auxiliary connection structures at the four corners of each memory fixing area of the circuit board, M < N, and M ≥ 1; multiple flash memories are respectively fixedly arranged on the circuit board. One side of each flash memory has multiple electrical contact parts and four fixing part groups. The four fixing part groups are located at the four corners of the flash memory. Each fixing part group includes multiple non-electrical fixing parts; when each flash memory is fixed to the circuit board, the multiple electrical contact parts are electrically connected to the multiple electrical contact pads, each non-electrical fixing part is connected to a part of one of the auxiliary connection structures, and any one of the non-electrical fixing parts in the same fixing part group is connected to one of the remaining non-electrical fixing parts to the same auxiliary connection structure.

[0005] Preferably, the inner diameter of each first through hole is greater than the outer diameter of each electrical contact pad, and a gap is formed between each electrical contact pad and the inner side of the first through hole. Each electrical contact pad and one of the electrical contact portions are connected by a welding structure, and a part of the welding structure is located in the gap, and the welding structure covers the periphery of the electrical contact pad.

[0006] Preferably, the circuit board has an auxiliary connection structure at the four corners of each flash memory fixing area respectively. Each second through hole in the same through hole group exposes different areas of the same auxiliary connection structure, and all non-electrical fixing portions in the same fixing portion group are connected to the same auxiliary connection structure.

[0007] Preferably, at least one second through hole respectively included in two adjacent through hole groups belonging to different memory fixing areas exposes different areas of the same auxiliary connection structure.

[0008] Preferably, all the second through holes respectively included in two adjacent through hole groups belonging to different memory fixing areas expose different areas of the same auxiliary connection structure.

[0009] One embodiment of the present invention discloses a circuit board of a solid-state drive, one end of which has a plug-in structure for plugging into a slot of an electronic device. The circuit board of the solid-state drive includes multiple memory fixing areas. One side of the circuit board of the solid-state drive has a protective layer. The circuit board of the solid-state drive has multiple first through holes and four through hole groups in each memory fixing area. Each first through hole penetrates the protective layer, and an electrical contact pad is exposed at each first through hole of the circuit board of the solid-state drive. The four through hole groups are located at the four corners of the memory fixing area. Each through hole group includes N second through holes. Each second through hole penetrates the protective layer. Any one of the second through holes included in the same through hole group exposes a part of one of the auxiliary connection structures of the circuit board of the solid-state drive, and the part is connected to at least a part of the other second through holes exposed; the edge of any one of the auxiliary connection structures is not exposed by any second through hole, and the edges of all the auxiliary connection structures are not exposed from the protective layer, and any one of the auxiliary connection structures is not connected to any electrical contact pad; wherein, each memory fixing area is used to set a flash memory, and the multiple electrical contact pads and the multiple auxiliary connection structures included in each memory fixing area are used to connect to the multiple electrical contact portions and the multiple non-electrical fixing portions of the flash memory; wherein, the circuit board of the solid-state drive has M auxiliary connection structures at the four corners of each memory fixing area respectively, M < N, and M ≥ 1.

[0010] Preferably, the inner diameter of each first through-hole is larger than the outer diameter of each electrical contact pad, and a gap is formed between each electrical contact pad and the inner side of the first through-hole, and the gap is used to provide a part of a welding structure, and the welding structure is used to connect one of the electrical contact pads and one of the electrical contact parts.

[0011] Preferably, the circuit board of the solid-state drive has four auxiliary connection structures in each flash memory fixed area, each second perforation of the same perforation group exposes different areas of the same auxiliary connection structure, and all non-electrical fixed parts of the same fixed part group are connected to the same auxiliary connection structure.

[0012] Preferably, at least one second through-hole respectively included in two adjacent through-hole groups belonging to different memory fixed areas exposes different areas of the same auxiliary connection structure.

[0013] Preferably, all second through-holes respectively included in two adjacent through-hole groups belonging to different memory fixed areas expose different areas of the same auxiliary connection structure.

[0014] In summary, the solid-state drive and the circuit board of the solid-state drive of the present invention, through the design of the four perforation groups and auxiliary connection structures of the circuit board, combined with the design that any second perforation included in the same perforation group exposes a portion of one of the auxiliary connection structures of the circuit board and is partially connected to the portion exposed by at least one other second perforation, can effectively strengthen the connection strength between the flash memory and the circuit board, thereby improving the problem that the flash memory of the existing solid-state drive is easily peeled off due to external force.

[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of a solid state drive of the present invention.

[0017] Figure 2 A schematic diagram of a partial circuit board and flash memory of a solid-state drive of the present invention.

[0018] Figure 3 FIG. 1 is a partial top view of a circuit board of a first embodiment of a solid-state drive according to the present invention.

[0019] Figure 4 FIG2 is a schematic three-dimensional cross-sectional view of a partial circuit board of a first embodiment of a solid state drive according to the present invention.

[0020] Figure 5 The solid state hard disk of the present invention is Figure 1 Schematic diagram of a partial cross section along section line VV.

[0021] Figure 6 FIG. 1 is a partial top view of a circuit board of a second embodiment of a solid-state drive according to the present invention.

[0022] Figure 7 FIG. 1 is a partial top view of a circuit board of a third embodiment of a solid-state drive according to the present invention.

[0023] Figure 8 FIG. 1 is a partial top view of a circuit board of a fourth embodiment of a solid-state drive according to the present invention.

[0024] Figure 9 FIG. 1 is a partial top view of a circuit board of a fifth embodiment of a solid-state drive according to the present invention. DETAILED DESCRIPTION

[0025] In the following description, if it is indicated to refer to a specific figure or as described in a specific figure, it is only used to emphasize that most of the related content described in the subsequent description appears in the specific figure, but it does not limit the subsequent description to only referring to the specific figure.

[0026] Please also refer to Figures 1 to 5 , Figure 1 is a schematic diagram of a solid-state hard disk of the present invention, Figure 2 is a schematic diagram of a local circuit board and flash memory of a solid-state hard disk of the present invention, Figure 3 FIG. 1 is a partial top view of the circuit board of the first embodiment of the solid-state hard disk of the present invention. Figure 4 is a three-dimensional cross-sectional diagram of a partial circuit board of a first embodiment of a solid state drive of the present invention, Figure 5 The solid state hard disk of the present invention is Figure 1 Schematic diagram of a partial cross section along section line VV.

[0027] The solid-state drive 100 of the present invention includes a circuit board 1, a processing module 2 and two flash memories 3. One end of the circuit board 1 has a plug-in structure 11, and the plug-in structure 11 is used to be inserted into a slot of an electronic device (such as a computer motherboard). The style of the plug-in structure 11 is not limited to that shown in the figure. The processing module 2 includes, for example, related electronic components such as a processing chip 21. The number of flash memories 3 included in the solid-state drive 100 and their positions on the circuit board 1 are not limited to those shown in the figure. In different embodiments, the solid-state drive 100 may also include more than three flash memories 3.

[0028] The circuit board 1 includes two fixed memory areas 1A. The two fixed memory areas 1A can be arranged side by side. Two flash memories 3 are fixed to the circuit board 1 , and each flash memory 3 is located in one of the fixed memory areas 1A.

[0029] The circuit board 1 includes a protective layer 12, a plurality of first through-holes 13, eight through-hole groups 14, a plurality of electrical contact pads 15, a plurality of auxiliary connection structures 16, and a bottom structure 17. The electrical contact pads 15 and the auxiliary connection structures 16 are formed on one side of the bottom structure 17.

[0030] The protective layer 12 is formed on one side of the bottom structure 17 where the electrical contact pad 15 and the auxiliary connection structure 16 are formed, and part of the protective layer 12 covers the auxiliary connection structure 16. The protective layer 12 is, for example, an insulating layered structure (Solder-Mask) such as green paint, which is not limited here. The circuit board 1 has a plurality of first through-holes 13 and four through-hole groups 14 in each memory fixed area 1A. In actual applications, the circuit board 1 can be a multi-layer board structure such as a four-layer board or a six-layer board according to actual needs. The bottom structure 17 in this embodiment is only a simple schematic diagram, and the bottom structure 17 can actually be a multi-layer structure.

[0031] Each first through-hole 13 passes through the protective layer 12, and the circuit board 1 exposes an electrical contact pad 15 in each first through-hole 13. Each electrical contact pad 15 is commonly known as a PAD. In actual applications, the inner diameter of each first through-hole 13 may be larger than the outer diameter of each electrical contact pad 15, and a gap S1 is formed between each electrical contact pad 15 and the inner side of the first through-hole 13. In other words, any part of each electrical contact pad 15 is not covered by the protective layer 12, and the outer edge of the electrical contact pad 15 can be seen through any first through-hole 13. It should be noted that in actual applications, part of the electrical contact pad 15 may also be connected to other circuit structures (commonly known as circuits, wiring) on ​​the underlying structure 17, and the electrical contact pad 15 is not limited to being individually (similar to an island) arranged on the underlying structure 17.

[0032] Each of the four perforation clusters 14 included in the fixed memory area 1A is located at the four corners of the fixed memory area 1A. Each perforation cluster 14 may include six second perforations 141. The number of second perforations 141 included in a single perforation cluster 14 and the arrangement of these second perforations 141 are not limited to those shown in the figure. In different embodiments, a single perforation cluster 14 may also include four or eight second perforations 141, depending on the needs.

[0033] Each of the second vias 141 penetrates through the protective layer 12, and any one of the second vias 141 included in the same via group 14 and at least one of the remaining second vias 141 expose different regions of one of the auxiliary connection structures 16 of the circuit board 1. That is to say, the circuit board 1 has at least one auxiliary connection structure 16 at the four corners of each memory fixing area 1A, and a part of each auxiliary connection structure 16 is exposed through at least one of the second vias 141 of one of the via groups 14. Among them, the circuit board 1 has N second vias 141 and M auxiliary connection structures 16 at the four corners of each memory fixing area 1A, M < N, and M ≥ 1. In this embodiment, N = 6 and M = 1 are taken as an example, but it is not limited thereto.

[0034] As Figure 3 and Figure 4 shown, the circuit board 1 may have one auxiliary connection structure 16 at the four corners of each memory fixing area 1A, and the circuit board has four auxiliary connection structures 16 in each memory fixing area 1A. All the second vias 141 included in each via group 14 of the circuit board 1 in each memory fixing area 1A expose different regions of the same auxiliary connection structure 16; that is, the user will view the same auxiliary connection structure 16 through any one of the second vias 141 included in any one of the via groups 14 of the circuit board 1.

[0035] In practical applications, each of the auxiliary connection structures 16 may be made of the same material as each of the electrical contact pads 15 (such as copper foil), and in the manufacturing process of the circuit board 1, all the auxiliary connection structures 16 and all the electrical contact pads 15 may be completed in the same process step.

[0036] Regarding the number of the auxiliary connection structures 16 respectively provided at the four corners of the circuit board 1 in each memory fixing area 1A and the shape of each auxiliary connection structure 16, they are not limited to those shown in the figure, and can be designed according to the number of the non-electrical fixing parts 321 included at the four corners of the flash memory 3 and their arrangement.

[0037] As Figure 1 、 Figure 2 and Figure 5 shown, each flash memory 3 is fixedly arranged in the memory fixing area 1A of the circuit board 1, and one side of each flash memory 3 has a plurality of electrical contact parts 31 and four fixing part groups 32. The four fixing part groups 32 are located at the four corners of the flash memory 3, and each fixing part group 32 includes a plurality of non-electrical fixing parts 321.

[0038] When each flash memory 3 is secured to the circuit board 1, the plurality of electrical contact portions 31 are electrically connected to the plurality of electrical contact pads 15. In this embodiment, the circuit board 1 has a single auxiliary connection structure 16 at each of the four corners of the memory securing area 1A. All non-electrical securing portions 321 included in each securing portion group 32 at the four corners of the flash memory 3 are connected to the same auxiliary connection structure 16 of the circuit board 1.

[0039] like Figure 2 and Figure 5 As shown, in actual application, the relevant equipment can be to first implant solder balls into each first through-hole 13 and each second through-hole 141 of the circuit board 1, and then place each flash memory 3 in each memory fixed area 1A, so that each electrical contact portion 31 is connected to each electrical contact pad 15 through the solder ball, and the non-electrical fixed portion 321 of the same fixed portion group 32 and the same auxiliary connection structure 16 are connected to each other through multiple solder balls arranged in multiple second through-holes 141. Finally, a relevant curing process is performed to solidify each solder ball into a welding structure 4.

[0040] Continuing from the above, it should be particularly emphasized that if the circuit board 1 has six auxiliary connection structures 16 at each corner of each memory fixed area 1A, and the auxiliary connection structures 16 are not connected to each other, and each second through-hole 141 exposes an auxiliary connection structure 16, then with such a design, when the flash memory 3 is subjected to external force, it will be easy for the auxiliary connection structures 16 to move with the flash memory 3 and peel off the circuit board 1; on the contrary, if the auxiliary connection structure 16 and the second through-hole 141 are designed according to the above-mentioned present invention, when the flash memory 3 is subjected to the same external force, the flash memory 3 will be relatively less likely to peel off the circuit board 1.

[0041] When flash memory 3 is secured to circuit board 1 via the plurality of solder structures 4, signal transmission between flash memory 3 and circuit board 1 occurs via electrical contact pads 15 and electrical contact portions 31. The plurality of non-electrical fixing portions 321 and auxiliary connection structures 16 do not transmit any signals. The plurality of non-electrical fixing portions 321 and auxiliary connection structures 16 serve only to strengthen the connection between flash memory 3 and circuit board 1.

[0042] It is worth noting that, in a preferred embodiment, the edge of any auxiliary connection structure 16 is not exposed through any second through-hole 141 , and the edges of all auxiliary connection structures 16 are not exposed from the protective layer 12 . In other words, the edge of any auxiliary connection structure 16 cannot be seen through any second through-hole 141 of the circuit board 1 , and the edges of the auxiliary connection structures 16 are covered by the protective layer 12 .

[0043] Furthermore, in general, the connection strength between the welding structure 4 and the auxiliary connection structure 16 is better than the connection strength between the welding structure 4 and the underlying structure 17 of the circuit board 1 that forms the auxiliary connection structure 16. Therefore, if the edges of the auxiliary connection structure 16 do not protrude from the second through holes 141, the welding structure 4 located between the non-electrical fixing part 321 and the auxiliary connection structure 16 will not be connected to the underlying structure 17 of the circuit board 1, thereby further enhancing the connection strength between the flash memory 3 and the circuit board 1.

[0044] In other words, if the edges of the auxiliary connection structure 16 protrude from some of the second through holes 141, a part of the welding structure 4 located between the non-electrical fixing part 321 and the auxiliary connection structure 16 will be connected to the underlying structure 17. In this way, when the flash memory 3 is pulled by an external force, cracks are likely to occur at the position where the welding structure 4 is connected to the underlying structure 17; after cracks appear at the position where the welding structure 4 is connected to the underlying structure 17, if the flash memory 3 is still pulled by an external force, stress concentration will occur at the crack, resulting in the separation of the auxiliary connection structure 16 and the underlying structure 17 from each other.

[0045] As Figure 4 and Figure 5 shown, each non-electrical fixing part 321 of the flash memory 3 is connected to a part of one of the auxiliary connection structures 16 (for example, through the aforementioned welding structure 4), and any non-electrical fixing part 321 of the same fixing part group 32 is connected to the remaining non-electrical fixing parts 321 to the same auxiliary connection structure 16.

[0046] As described above, by designing the circuit board 1 of the solid-state drive 100 of the present invention to have through hole groups 14 and auxiliary connection structures 16 at the four corners of each memory fixing area 1A respectively, the connection strength between the flash memory 3 and the circuit board 1 can be effectively enhanced. Thereby, during the process of the user repeatedly disassembling and assembling the solid-state drive , the flash memory 3 is still not easily peeled off from the circuit board 1, and in the drop test of the solid-state drive 100, the flash memory 3 is also relatively not easily peeled off from the circuit board 1.

[0047] Please refer to Figure 6 , which is a partial top view of the circuit board of the second embodiment of the solid-state drive of the present invention. The circuit board 1 of the solid-state drive 100 of the present invention has N second through holes 141 and M auxiliary connection structures 16 at the four corners of each memory fixing area 1A respectively, M < N, and M ≥ 1. In this embodiment, N = 6 and M = 2.

[0048] That is to say, the circuit board 1 has two auxiliary connection structures 16 at the four corners of each memory fixed area 1A respectively, and each through-hole group 14 of the circuit board 1 includes six second through-holes 141, where three second through-holes 141 expose different areas of the same auxiliary connection structure 16, and the other three second through-holes 141 expose different areas of another auxiliary connection structure 16.

[0049] From the perspective of the flash memory 3, some non-electrically fixed parts 321 of the same fixed part group 32 are connected to the same auxiliary connection structure 16 (for example, through the aforementioned welding structure 4), while another part of the non-electrically fixed parts 321 of the same fixed part group 32 are connected to another auxiliary connection structure 16.

[0050] It should be noted that as long as the conditions of M < N and M ≥ 1 are met, the number of second through-holes 141 and the number of auxiliary connection structures 16 at the four corners of each memory fixed area 1A of the circuit board 1 are not limited to the examples in this embodiment and the previous embodiments. For example, in another different embodiment, it can also be N = 8 and M = 4, that is, each through-hole group 14 includes 8 second through-holes 141, and every two second through-holes 141 correspondingly expose different areas of the same auxiliary connection structure 16.

[0051] In addition, in the embodiment where M ≥ 2, the appearance and arrangement of the auxiliary connection structures 16 respectively provided at the four corners of each memory fixed area 1A of the circuit board 1 can be changed according to requirements.

[0052] As Figure 3 and Figure 6 shown, there is a gap S2 between the two auxiliary connection structures 16 included at each corner of each memory fixed area 1A of the circuit board 1 in this embodiment, while in the aforementioned first embodiment shown in Figure 3 there is no such gap S2. Therefore, compared with the solid-state drive 100 in the previous first embodiment, the solid-state drive 100 in this embodiment has a smaller material consumption of the auxiliary connection structure 16, and in the case of mass production, the solid-state drive 100 in this embodiment can save some production costs compared with the previous first embodiment.

[0053] Please refer to Figure 7 , which is a partial top view of the circuit board of the third embodiment of the solid-state drive of the present invention. The biggest difference between this embodiment and the previous embodiments is that all the second through-holes respectively included in two adjacent through-hole groups belonging to different memory fixed areas expose different areas of the same auxiliary connection structure.

[0054] More specifically, one memory fixed area 1A of the circuit board 1 has four through-hole groups 14A, 14B, 14C, and 14D at each of its four corners, while another memory fixed area 1A of the circuit board 1 has four through-hole groups 14E, 14F, 14G, and 14H at each of its four corners. The two through-hole groups 14A and 14C included in one memory fixed area 1A are adjacent to the two through-hole groups 14F and 14H included in the other memory fixed area 1A. All second through-holes 141 in through-hole group 14A and all second through-holes 141 in through-hole group 14F expose different areas of the same auxiliary connecting structure 16, while all second through-holes 141 in through-hole group 14C and all second through-holes 141 in through-hole group 14H expose different areas of the same auxiliary connecting structure 16.

[0055] That is to say, in Figure 3 In the first embodiment shown above, the circuit board 1 has eight auxiliary connection structures 16 in the two memory fixing areas 1A; Figure 7 In the drawings of this embodiment, the two memory fixing areas 1A of the circuit board 1 only have six auxiliary connection structures 16 .

[0056] Through the design of this embodiment, some non-electrically fixed parts of the two flash memories included in the solid-state drive can be connected to the same auxiliary connection structure 16 through a welding structure, thereby further improving the connection strength between the flash memories and the circuit board 1.

[0057] See also Figure 8 , which is a partial top view of the circuit board of the fourth embodiment of the solid-state drive of the present invention. The major difference between this embodiment and the aforementioned third embodiment is that two adjacent perforation groups, belonging to different memory fixed areas, respectively contain portions of the second perforations that expose different areas of the same auxiliary connection structure. The circuit board 1 of this embodiment includes a total of eight auxiliary connection structures.

[0058] More specifically, the three (not limited to this value) second perforations 141 included in the perforation group 14A of one memory fixed area 1A and the three (not limited to this value) second perforations 141 included in the perforation group 14F of another memory fixed area 1A expose different areas of the same auxiliary connection structure 16A; the other three (not limited to this value) second perforations 141 included in the perforation group 14A of one memory fixed area 1A and the other three (not limited to this value) second perforations 141 included in the perforation group 14F of another memory fixed area 1A expose different areas of the same auxiliary connection structure 16B.

[0059] Similarly, the three second through-holes 141 included in the through-hole group 14C and the three second through-holes 141 included in the through-hole group 14H expose different areas of the same auxiliary connection structure 16C; the other three second through-holes 141 included in the through-hole group 14C and the other three second through-holes 141 included in the through-hole group 14H expose different areas of the same auxiliary connection structure 16D.

[0060] See also Figure 9 , which shows a partial top view of the circuit board of the fifth embodiment of the solid-state drive of the present invention. This embodiment differs from the aforementioned fourth embodiment in that two adjacent groups of through-holes, belonging to different fixed memory areas, respectively include portions of the second through-holes that expose different areas of the same auxiliary connection structure, and another portion of the second through-holes included in each fixed memory area also exposes different areas of the same auxiliary connection structure.

[0061] More specifically, the circuit board 1 of this embodiment includes a total of 10 auxiliary connection structures. The four (not limited to this number) second through-holes 141 of the through-hole group 14A and the four (not limited to this number) second through-holes 141 of the through-hole group 14F expose different areas of the same auxiliary connection structure 16E; the other two (not limited to this number) second through-holes 141 of the through-hole group 14A expose different areas of another auxiliary connection structure 16F; and the other two (not limited to this number) second through-holes 141 of the through-hole group 14F expose another auxiliary connection structure 16G.

[0062] Similarly, the four second through-holes 141 of the through-hole group 14C and the four second through-holes 141 of the through-hole group 14H expose different areas of the same auxiliary connection structure 16H; the other two second through-holes 141 of the through-hole group 14C expose different areas of another auxiliary connection structure 16K; and the other two second through-holes 141 of the through-hole group 14H expose another auxiliary connection structure 16M.

[0063] It should be noted that the circuit board 1 of the solid state drive 100 described in any of the above embodiments can be manufactured, implemented, and sold independently, and the circuit board 1 is not limited to being sold in the form of a solid state drive 100.

[0064] In summary, the solid-state drive and the circuit board of the solid-state drive of the present invention can effectively increase the connection strength between the flash memory and the circuit board by providing a perforation group and at least one auxiliary connection structure at the four corners of each memory fixed area of ​​the circuit board, and making part of the second perforation of each perforation group expose different areas of the same auxiliary connection structure, thereby effectively reducing the possibility of the flash memory of the solid-state drive being peeled off due to external forces.

[0065] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the description and drawings of the present invention are included in the protection scope of the present invention.

Claims

1. A solid state drive, characterized in that: The solid-state drive includes: A circuit board having a plug-in structure at one end for plugging into a slot of an electronic device. The circuit board includes a plurality of memory fixing areas. One side of the circuit board has a protective layer. The circuit board has a plurality of first through-holes and four through-hole groups in each of the memory fixing areas. Each of the first through-holes penetrates the protective layer, and an electrical contact pad is exposed on the circuit board at each of the first through-holes. The four through-hole groups are located at the four corners of the memory fixing area. Each through-hole group includes N second through-holes. Each of the second through-holes penetrates the protective layer. Any one of the second through-holes included in the same through-hole group and at least one of the remaining second through-holes in the same through-hole group expose different areas of one of the auxiliary connection structures of the circuit board; the edge of any one of the auxiliary connection structures is not exposed by any of the second through-holes, and the edges of all the auxiliary connection structures are not exposed from the protective layer, and any one of the auxiliary connection structures is not connected to any of the electrical contact pads; wherein, the circuit board has M of the auxiliary connection structures at the four corners of each of the memory fixing areas, M < N, and M ≥ 1; A plurality of flash memories respectively fixedly arranged on the circuit board. One side of each flash memory has a plurality of electrical contact parts and four fixing part groups. The four fixing part groups are located at the four corners of the flash memory. Each fixing part group includes a plurality of non-electrical fixing parts; when each flash memory is fixed to the circuit board, the plurality of electrical contact parts are electrically connected to the plurality of electrical contact pads, each of the non-electrical fixing parts is connected to a part of one of the auxiliary connection structures, and any one of the non-electrical fixing parts in the same fixing part group is connected to one of the remaining non-electrical fixing parts to the same auxiliary connection structure.

2. The solid-state drive according to claim 1, wherein: The inner diameter of each of the first through-holes is larger than the outer diameter of each of the electrical contact pads, and a gap is formed between each of the electrical contact pads and the inner side of the first through-hole. Each of the electrical contact pads and one of the electrical contact parts are connected by a welding structure. A part of the welding structure is located in the gap, and the welding structure wraps around the periphery of the electrical contact pad.

3. The solid-state drive according to claim 1, wherein: The circuit board has one of the auxiliary connection structures at the four corners of each of the flash memory fixing areas respectively. Each of the second through-holes in the same through-hole group exposes different areas of the same auxiliary connection structure. All of the non-electrical fixing parts in the same fixing part group are connected to the same auxiliary connection structure.

4. The solid-state drive according to claim 1, wherein: At least one of the second through-holes respectively included in two adjacent through-hole groups belonging to different memory fixing areas exposes different areas of the same auxiliary connection structure.

5. The solid-state drive according to claim 1, wherein: All of the second through-holes respectively included in two adjacent through-hole groups belonging to different memory fixing areas expose different areas of the same auxiliary connection structure.

6. A circuit board for a solid state drive, characterized in that: One end of the circuit board of the solid-state drive has a plug-in structure for plugging into a slot of an electronic device. The circuit board of the solid-state drive includes multiple memory fixing areas. One side of the circuit board of the solid-state drive has a protective layer. The circuit board of the solid-state drive has multiple first through-holes and four through-hole groups in each of the memory fixing areas. Each of the first through-holes penetrates the protective layer, and an electrical contact pad is exposed on the circuit board of the solid-state drive at each of the first through-holes. The four through-hole groups are located at the four corners of the memory fixing area. Each through-hole group includes N second through-holes. Each of the second through-holes penetrates the protective layer. Any one of the second through-holes included in the same through-hole group exposes a part of one of the auxiliary connection structures of the circuit board of the solid-state drive, and the part is connected to at least a part of the other second through-holes exposed; the edge of any one of the auxiliary connection structures is not exposed by any of the second through-holes, and the edges of all the auxiliary connection structures are not exposed from the protective layer, and any one of the auxiliary connection structures is not connected to any one of the electrical contact pads; wherein, each of the memory fixing areas is used to set a flash memory, and the multiple electrical contact pads and the multiple auxiliary connection structures included in each of the memory fixing areas are used to connect to the multiple electrical contact parts and the multiple non-electrical fixing parts of the flash memory; wherein, the circuit board of the solid-state drive has M auxiliary connection structures at the four corners of each of the memory fixing areas, M < N, and M ≥ 1.

7. The circuit board of the solid state drive according to claim 6, wherein: The inner diameter of each of the first through-holes is larger than the outer diameter of each of the electrical contact pads, and a gap is formed between each of the electrical contact pads and the inner side of the first through-hole. The gap is used to provide a part of a welding structure for connecting one of the electrical contact pads and one of the electrical contact parts.

8. The circuit board of the solid state drive according to claim 6, wherein: One side of each of the flash memories has multiple electrical contact parts and four fixing part groups. The four fixing part groups are located at the four corners of the flash memory. Each fixing part group includes multiple non-electrical fixing parts. The circuit board of the solid-state drive has four auxiliary connection structures in each of the flash memory fixing areas. Each of the second through-holes in the same through-hole group exposes different areas of the same auxiliary connection structure. All the non-electrical fixing parts in the same fixing part group are connected to the same auxiliary connection structure.

9. The circuit board of the solid state drive according to claim 6, wherein: At least one of the second through-holes included in two adjacent through-hole groups belonging to different memory fixing areas exposes different areas of the same auxiliary connection structure.

10. The circuit board of the solid state drive according to claim 6, wherein: All the second through-holes included in two adjacent through-hole groups belonging to different memory fixing areas expose different areas of the same auxiliary connection structure.

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