A compact, high-heat-dissipation motor controller drive module structure

Abstract

This invention discloses a compact, high-heat-dissipation motor controller drive module structure, relating to the field of drive motor controller technology. It includes a water-cooled radiator with a mounting cavity containing a thin-film capacitor. Cooling channels are arranged around the outer ring of the mounting cavity on the water-cooled radiator. A ceramic heat-conducting sheet for improving heat transfer efficiency is fixedly mounted on the upper surface of a heat-conducting cover plate. A three-phase output copper busbar is fixedly mounted on the upper end of the thin-film capacitor. The beneficial effect of this invention is that the thin-film capacitor is mounted in the middle of the water-cooled radiator, while cooling channels are arranged around it. The water-cooled radiator shell and the channels on its surrounding sides carry away heat, improving the heat dissipation effect of the thin-film capacitor, reducing the overall capacitor cost, and reducing the assembly of the thin-film capacitor. The IGBT single tube is positioned directly above the water channels, facilitating the direct removal of heat generated by the IGBT single tube through the heat dissipation teeth below, forming highly efficient heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of drive motor controller technology, specifically to a compact, high-heat-dissipation motor controller drive module structure. Background Technology

[0002] As one of the core components of an electric vehicle, the motor controller obtains the vehicle's requirements from the vehicle controller and electrical energy from the battery pack. Through its own inverter modulation, it obtains the current and voltage needed to control the motor, supplying it to the motor so that its speed and torque meet the vehicle's requirements. Its performance directly affects the vehicle's range, power response, driving comfort, and safety. With continuous technological advancements, the design of motor controllers is constantly being optimized to adapt to higher efficiency requirements and more complex driving environments.

[0003] The technological development of automotive motor controllers is moving towards high power density, high efficiency, high voltage, high integration, and high safety. Traditional motor controllers occupy a large space in automobiles, resulting in a large total weight and a large amount of heat dissipation. Their heat dissipation performance is inadequate, and their large size makes installation inconvenient. Summary of the Invention

[0004] The purpose of this invention is to provide a compact, high-heat-dissipation motor controller drive module structure that is compact in size, high in power, and has efficient heat dissipation, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a compact, high-heat-dissipation motor controller drive module structure, including a water-cooled radiator, a mounting cavity in the water-cooled radiator, a thin-film capacitor mounted in the mounting cavity, cooling water channels surrounding the outer ring of the mounting cavity on the water-cooled radiator, a heat-conducting cover plate for heat dissipation and cooling fixedly mounted on the upper end face of the cooling water channels, a ceramic heat-conducting sheet for improving heat conduction efficiency fixedly mounted on the upper end face of the heat-conducting cover plate, an IGBT single tube fixedly mounted on the upper end face of the ceramic heat-conducting sheet, a three-phase output copper busbar fixedly mounted on the upper end of the thin-film capacitor, and a drive board provided on the upper end face of the three-phase output copper busbar.

[0006] Preferably, the upper surface of the heat-conducting cover plate is provided with a concave cavity, and groove openings are distributed in the concave cavity. Heat dissipation teeth are fixedly distributed on the lower surface of the heat-conducting cover plate, and each heat dissipation tooth corresponds to one of the groove openings.

[0007] Preferably, the lower end face of the ceramic heat-conducting sheet is fixedly provided with an outward protrusion, and the lower end face of the outward protrusion is provided with protruding posts corresponding to the groove opening. The outward protrusion is embedded in the inner concave cavity, and the protruding posts are fixedly embedded in the corresponding groove opening.

[0008] Preferably, the inner wall of the cooling water channel is provided with protrusions at equal intervals, and the lower end face of the water-cooled radiator is provided with an inlet and an outlet, both of which are connected to the cooling water channel.

[0009] Preferably, the thin-film capacitor is connected to a copper busbar, and the finished product of the copper busbar for the capacitor core is filled into the cavity of the mounting cavity with epoxy resin.

[0010] Preferably, the copper busbars inside the three-phase output copper busbars are welded together, and the three-phase output copper busbars outside are connected by plastic coating.

[0011] Preferably, the three-phase output copper busbar includes a V-phase output copper busbar, a U-phase output copper busbar, and a W-phase output copper busbar, which are distributed in three directions and arranged side by side at their board ends. The board ends of the V-phase output copper busbar, the U-phase output copper busbar, and the W-phase output copper busbar all pass through the drive board.

[0012] Preferably, the V-phase output copper busbar, the U-phase output copper busbar, and the W-phase output copper busbar are each provided with upper and lower bridge arms in the same direction.

[0013] Preferably, a pressure plate is connected to the i GBT single tube, and the pressure plate is directly fixed to the water-cooled radiator by bolts.

[0014] In summary, the beneficial effects of this invention are:

[0015] 1. The film capacitor is installed in the middle of the water-cooled heat sink, and cooling water channels are set around it. With the help of the water-cooled heat sink shell, the finished product of the copper busbar of the capacitor core is directly filled into the aluminum heat sink shell. Water channels are set on all four sides to carry away the heat, which improves the heat dissipation effect of the film capacitor, reduces the overall capacitor cost, and reduces the assembly of film capacitors. The IGBT single tube is placed directly above the water channel, which facilitates the heat generated by the IGBT single tube to be directly carried away through the heat dissipation tooth column directly below, forming efficient heat dissipation.

[0016] 2. The three-phase output copper busbar adopts a plastic-coated integrated design. The internal copper busbar welding ensures that the current input to each pin has a basically consistent path, which ensures the current sharing effect and also improves the assembly efficiency.

[0017] 3. The upper and lower bridge arms on each side of the three phases are set in the same direction, which makes it easier to arrange the internal current output to the board end in a consistent path, reduce the entire current loop path, and reduce the overall inductance.

[0018] 4. The overall structure makes full use of the surrounding volume, presenting a square structure that is compact, thereby reducing the size and weight of the controller, lowering costs, and facilitating its installation inside other housings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of a compact, high-heat-dissipation motor controller drive module according to the present invention.

[0021] Figure 2 This is a schematic diagram of the overall unfolded structure of a compact, high-heat-dissipation motor controller drive module according to the present invention.

[0022] Figure 3 This is a partial unfolded structural diagram of the heat-conducting cover plate in a compact, high-heat-dissipation motor controller drive module structure according to the present invention.

[0023] Figure 4 This is a partial unfolded structural diagram of the heat-conducting cover plate in the compact, high-heat-dissipation motor controller drive module structure of the present invention, viewed from below.

[0024] Figure 5 This is a top view of the water-cooled radiator structure in a compact, high-heat-dissipation motor controller drive module structure according to the present invention.

[0025] Figure 6 This is a schematic diagram of the water-cooled radiator structure in a compact, high-heat-dissipation motor controller drive module structure according to the present invention.

[0026] Figure 7 This is a schematic diagram of the three-phase output copper busbar structure in a compact, high-heat-dissipation motor controller drive module structure of the present invention.

[0027] The markings in the attached diagram are described as follows: Water-cooled radiator 10; Mounting cavity 11; Cooling water channel 12; Protrusion 13; Inlet 14; Outlet 15; Film capacitor 20; Capacitor copper busbar 21; Epoxy resin 22; Thermal conductive cover plate 30; Concave cavity 31; Groove 32; Heat dissipation tooth column 33; Ceramic heat-conducting sheet 40; Pressure plate 41; IGBT single tube 42; Outer protrusion 43; Protruding column 44; Three-phase output copper busbar 50; Plastic coating 51; V-phase output copper busbar 52; U-phase output copper busbar 53; W-phase output copper busbar 54; Driver board 60. Detailed Implementation

[0028] All features disclosed in this specification, or all steps in all disclosed methods or processes, may be combined in any way, except for mutually exclusive features and / or steps.

[0029] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0030] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of at least two elements or the interaction relationship of at least two elements, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0031] The following is combined Figure 1-7 The present invention will be described in detail below. For ease of description, the directions referred to below are defined as follows: the directions of up, down, left, right, front, and back mentioned below are the same as... Figure 1 The directions of front, back, left, right, up, and down in the view are consistent. Figure 1 The directions shown are consistent with the front-to-back, left-to-right, up-down directions of the device of the present invention when viewed from the front.

[0032] Please see Figure 1-7This invention provides an embodiment of a compact, high-heat-dissipation motor controller drive module structure, comprising a water-cooled radiator 10, a thin-film capacitor 20, an IGBT single-tube connection assembly, a three-phase output copper busbar 50, and a drive board 60. A mounting cavity 11 is provided in the middle of the water-cooled radiator 10, and the thin-film capacitor 20 is mounted in the mounting cavity 11. The capacitor copper busbar 21 on the thin-film capacitor 20 extends laterally to the outside, while the surrounding capacitor core copper busbars are welded and filled with epoxy resin 22 within the mounting cavity 11. Simultaneously, the water-cooled radiator 10 has cooling water channels 12 around the mounting cavity 11. An inlet 14 and an outlet 15 are mounted on the lower end face of the water-cooled radiator 10. The inlet 14... The outlet 15 is interconnected with the cooling water channel 12. Protrusions 13 are evenly distributed on the inner wall of the cooling water channel 12, surrounding the thin-film capacitor 20 and thus carrying away the heat generated by the thin-film capacitor 20, improving its heat dissipation effect, reducing overall capacitor cost, and simplifying assembly. A heat-conducting cover 30 for heat dissipation is fixedly installed on the upper surface of the cooling water channel 12. The upper surface of the heat-conducting cover 30 is in contact with and fixed to the ceramic heat-conducting sheet 40. The ceramic heat-conducting sheet 40 has high heat conduction efficiency, and the iGBT single-pipe connection assembly... The IGBT single tube 42 is directly mounted on the ceramic heat-conducting plate 40, allowing the heat generated by the IGBT single tube 42 to be directly carried away by the heat-conducting cover plate 30 directly below. The IGBT single tube 42 is fixed to the water-cooled radiator 10 by bolts through the pressure plate 41, improving the reliability of the press-fit. After the epoxy resin 22 is used to fill the gaps, a layer of epoxy resin 22 is formed on the upper surface of the epoxy resin 22, and the three-phase output copper busbar 50 is fixedly mounted on it. The copper busbars inside the three-phase output copper busbar 50 are welded together, and the outside of the three-phase output copper busbar 50 is connected by plastic coating 51, making the entire... The three-phase output copper busbar 50 adopts a plastic-coated integrated design. The internal copper busbar welding ensures that the current input to each pin has a basically consistent path, which ensures the current sharing effect and improves the assembly efficiency. It should be noted that the V-phase output copper busbar 52, U-phase output copper busbar 53 and W-phase output copper busbar 54 are distributed in three directions, and the board ends of the three are arranged side by side through the drive board 60. Moreover, the upper and lower bridge arms in the corresponding copper busbars are in the same direction, which facilitates the internal arrangement of the current output to the board end to be consistent, reduces the entire current loop path, and reduces the overall inductance. The drive board 60 is fixedly mounted on the water-cooled radiator 10 by bolts.

[0033] refer to Figure 3 and Figure 4It is worth mentioning that, in order to further improve the heat dissipation performance of the IGBT single tube and maximize its heat dissipation performance in a limited area, this embodiment differs from the above embodiment in that the upper end face of the heat-conducting cover plate 30 is provided with a concave cavity 31, and groove openings 32 are distributed in the concave cavity 31. Heat dissipation teeth 33 are fixedly distributed on the lower end face of the heat-conducting cover plate 30, with each heat dissipation tooth 33 corresponding to one of the groove openings 32. Simultaneously, an outward protrusion 43 is fixedly provided on the lower end face of the ceramic heat-conducting sheet 40, and the lower end face of the outward protrusion 43 is provided with... The protruding post 44 corresponding to the groove 32, the outer protrusion 43 is embedded in the inner cavity 31, and the protruding post 44 is fixedly embedded in the corresponding groove 32. When the outer protrusion 43 is embedded in the inner cavity 31, the protruding post 44 will be embedded in the inner cavity 31, which greatly shortens the distance between the protruding post 44 and the bottom heat dissipation tooth post 33, thereby making the heat conduction efficiency higher and also improving the stability of the ceramic heat-conducting plate 40 on the heat-conducting cover plate 30. The heat dissipation tooth post 33 is inserted into the cooling water channel 12 and is in direct contact with the cooling water in the cooling water channel 12.

[0034] In actual operation, cooling water first enters through the inlet 14 and flows out from the outlet 15 along the cooling water channel 12. The continuous flow first removes the heat generated in the epoxy resin 22 in the mounting cavity 11, improving the heat dissipation effect of the film capacitor, reducing the overall capacitor cost, reducing the assembly of the film capacitor, and ensuring the heat dissipation performance of the epoxy resin 22. The heat dissipation tooth column 33 is inserted into the cooling water channel 12 and is in direct contact with the cooling water in the cooling water channel 12. During the circulation of the cooling water, it continuously removes the heat conducted down from the heat dissipation tooth column 33. The three-phase output copper busbar 50 is located in the middle position, surrounded by IGBT single tubes, and covered by the top drive plate 60, so that the overall structure makes full use of the surrounding volume, forming a square structure. The structure is compact and easy to install inside other housings.

[0035] In summary, this invention 1 involves installing a thin-film capacitor in the middle of a water-cooled radiator, with cooling water channels surrounding it. The capacitor core copper busbar is welded directly into the aluminum heat sink shell using the water-cooled radiator housing. Water channels on the surrounding sides carry away heat, improving the heat dissipation effect of the thin-film capacitor, reducing the overall capacitor cost, and simplifying the assembly process. The IGBT tube is positioned directly above the water channels, facilitating the direct removal of heat generated by the IGBT tube through the heat dissipation teeth below, resulting in highly efficient heat dissipation.

[0036] 2. The three-phase output copper busbar adopts a plastic-coated integrated design. The internal copper busbar welding ensures that the current input to each pin has a basically consistent path, which ensures the current sharing effect and also improves the assembly efficiency.

[0037] 3. The upper and lower bridge arms on each side of the three phases are set in the same direction, which makes it easier to arrange the internal current output to the board end in a consistent path, reduce the entire current loop path, and reduce the overall inductance.

[0038] 4. The overall structure makes full use of the surrounding volume, presenting a square structure that is compact and easy to install inside other shells.

[0039] The above description is merely a specific embodiment of the invention, but the scope of protection of the invention is not limited thereto. Any variations or substitutions conceived without inventive effort should be included within the scope of protection of the invention. Therefore, the scope of protection of the invention should be determined by the scope defined in the claims.

Claims

1. A compact, high-heat-dissipation motor controller drive module structure, comprising a water-cooled radiator (10), characterized in that: The water-cooled radiator (10) is provided with an installation cavity (11), in which a thin-film capacitor (20) is installed. A cooling water channel (12) is provided around the outer ring of the installation cavity (11) on the water-cooled radiator (10). A heat-conducting cover plate (30) for heat dissipation and cooling is fixedly installed on the upper end face of the cooling water channel (12). An inner cavity (31) is provided on the upper end face of the heat-conducting cover plate (30), and groove openings (32) are distributed in the inner cavity (31). Heat dissipation teeth (33) are fixedly distributed on the lower end face of the heat-conducting cover plate (30), with each heat dissipation tooth (33) corresponding to one of the groove openings (32). A ceramic heat-conducting sheet (40) for improving heat conduction efficiency is fixedly installed on the upper end face of the plate (30). An outward protrusion (43) is fixedly provided on the lower end face of the ceramic heat-conducting sheet (40). A protruding post (44) corresponding to the groove opening (32) is distributed on the lower end face of the outward protrusion (43). The outward protrusion (43) is embedded in the inner cavity (31). The protruding post (44) is fixedly embedded in the corresponding groove opening (32). An IGBT single tube (42) is fixedly installed on the upper end face of the ceramic heat-conducting sheet (40). A three-phase output copper busbar (50) is fixedly installed on the upper end of the film capacitor (20). A drive plate (60) is provided on the upper end face of the three-phase output copper busbar (50).

2. The compact, high-heat-dissipation motor controller drive module structure according to claim 1, characterized in that: The inner wall of the cooling water channel (12) is provided with protrusions (13) evenly distributed. The lower end face of the water-cooled radiator (10) is provided with an inlet (14) and an outlet (15). The inlet (14) and the outlet (15) are both connected to the cooling water channel (12).

3. The compact, high-heat-dissipation motor controller drive module structure according to claim 1, characterized in that: The thin-film capacitor (20) is connected to a capacitor copper busbar (21), and the finished product of the capacitor core copper busbar in the capacitor copper busbar (21) is filled in the inner cavity of the mounting cavity (11) with epoxy resin (22).

4. The compact, high-heat-dissipation motor controller drive module structure according to claim 1, characterized in that: The copper busbars inside the three-phase output copper busbar (50) are welded together, and the outside of the three-phase output copper busbar (50) is connected by plastic coating (51).

5. The compact, high-heat-dissipation motor controller drive module structure according to claim 4, characterized in that: The three-phase output copper busbar (50) includes a V-phase output copper busbar (52), a U-phase output copper busbar (53) and a W-phase output copper busbar (54), which are distributed in three directions and are arranged side by side at their ends. The ends of the V-phase output copper busbar (52), the U-phase output copper busbar (53) and the W-phase output copper busbar (54) all pass through the drive board (60).

6. The compact, high-heat-dissipation motor controller drive module structure according to claim 5, characterized in that: The V-phase output copper busbar (52), the U-phase output copper busbar (53), and the W-phase output copper busbar (54) are respectively provided with upper and lower bridge arms in the same direction.

7. The compact, high-heat-dissipation motor controller drive module structure according to claim 1, characterized in that: A pressure plate (41) is connected to the IGBT single tube (42), and the pressure plate (41) is directly fixed to the water-cooled radiator (10) by bolts.

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