A quality inspection method for RFID tag packaging

Abstract

The present application relates to a quality inspection method for RFID tag packaging, which is applied to a packaging inspection system for RFID tags; the system includes a reader / writer; a photoresistor is arranged adjacent to a light-incoming surface of the reader / writer; the RFID tag includes a chip, an antenna, and a laser diode connected between the chip and the antenna; the laser emission port of the laser diode is configured to be located directly opposite to the photoresistor when performing a read / write operation; the method includes: performing a read / write operation on the RFID tag through the reader / writer; outputting a fault prompt message in response to the failure to receive an optical signal through the photoresistor; obtaining the read / write result of the reader / writer, and outputting a type of fault prompt message if the read / write result is normal; the type of fault prompt message is used to indicate that a welding position of the antenna, the laser diode or the chip is offset; the method can effectively solve the problem of manually detecting structural defects in a large-scale RFID packaging process, thereby avoiding the problem of low efficiency in quality inspection of RFID tag packaging.

Description

Technical Field

[0001] The present application relates to the field of RFID technology, and in particular to a quality inspection method for RFID tag packaging. Background Art

[0002] RFID (Radio Frequency Identification) is a technology that uses radio waves to identify objects and exchange data; the quality inspection of its tag packaging is an important part of ensuring the effectiveness and reliability of the RFID system.

[0003] At present, the packaging quality inspection of RFID tags is mainly reflected in the inspection of their tag data, while the necessity of structural inspection is ignored. As a result, in the large-scale RFID packaging process, structural defects need to be manually inspected by manpower, and the quality inspection efficiency of RFID tag packaging is low. Summary of the invention

[0004] Based on this, it is necessary to provide a quality inspection method for RFID tag packaging in response to the above technical problems.

[0005] In a first aspect, the present application provides a quality inspection method for RFID tag packaging, which is applied to an RFID tag packaging inspection system; the system includes a reader / writer; a photoresistor is arranged adjacent to a light-incoming surface of the reader / writer; the RFID tag includes a chip, an antenna, and a laser diode connected between the chip and the antenna; the laser emission port of the laser diode is configured to be located directly opposite to the photoresistor when performing a read / write operation; the method includes the following steps:

[0006] Read and write RFID tags through the reader / writer;

[0007] In response to the failure of receiving the light signal through the photoresistor, outputting fault prompt information; the fault prompt information is used to indicate that the packaging quality of the RFID tag is unqualified;

[0008] The reading and writing results of the reader are obtained. If the reading and writing results are normal, a type of fault prompt information is output; the type of fault prompt information is used to indicate that the welding position of the antenna, laser diode or chip is offset.

[0009] In one embodiment, the system further includes a camera module disposed adjacent to the reader; the method further includes:

[0010] Based on a type of fault prompt information, a target image of a corresponding RFID tag is acquired through a camera module;

[0011] Preprocessing the target image; the preprocessing method includes removing noise and smoothing the image, and dividing it into multiple comparison areas; the comparison areas correspond to the chip, the laser diode and the welding position of the chip respectively;

[0012] Compare the image features of the preprocessed target image with the preset image; the preset image includes the RFID tag image of the standard welding position;

[0013] Extract edge features of the target image and the preset image respectively and perform feature comparison one by one according to the comparison area;

[0014] In response to the similarity of the feature comparison of any comparison area being less than a preset threshold, prompt information about a type of fault is output; the prompt information about a type of fault is used to indicate the corresponding comparison area.

[0015] In one embodiment, the method further comprises:

[0016] In response to receiving a discontinuous light signal through the photoresistor and the reading and writing results of the reader are normal, outputting the second type of fault prompt information; the second type of fault prompt information is used to indicate that the welding position is not connected;

[0017] Based on the preprocessed target image, the texture features of each welding position are extracted according to the comparison area;

[0018] Defect recognition is performed on texture features through a feature defect recognition model; the feature defect recognition model is trained based on the texture features of the defect; the types of defects include solder joint burrs, solder joint cracks, leaking solder joints and wrong solder joints;

[0019] In response to the presence of a characteristic defect in any comparison area, prompt information about the second type of fault is output; the prompt information about the second type of fault is used to indicate the type of defect and the corresponding comparison area.

[0020] In one embodiment, the method further comprises:

[0021] In response to the fact that no light signal is received through the photoresistor and the reader / writer cannot obtain the reading / writing result, a pre-processed target image is obtained and feature defect recognition is performed;

[0022] If it is found that no characteristic defects exist in the comparison area, three types of fault prompt information are output; the three types of fault prompt information are used to indicate component failure; component failure includes chip failure, laser diode failure or antenna failure.

[0023] In one embodiment, the method further comprises:

[0024] Obtaining a unique identification code of the RFID tag corresponding to the first-class fault prompt information or the second-class fault prompt information, and determining the production batch of each RFID tag according to the production rhythm of the RFID tag and the unique identification code;

[0025] If the number of the first type of fault prompt information or the second type of fault prompt information of the same production batch exceeds the first number threshold, determine the production node corresponding to the corresponding comparison area, and call the corresponding equipment parameters of the production equipment of the production node;

[0026] If any device parameter does not correspond to the preset parameter, an alarm message will be output.

[0027] In one embodiment, the method further comprises:

[0028] In response to the number of type I fault prompt information or type II fault prompt information of the same production batch exceeding a second quantity threshold, an identity ID and corresponding contact information of the on-duty personnel are obtained based on the production batch; the second quantity threshold is greater than the first quantity threshold.

[0029] A short message reminder is sent to the contact information corresponding to the identity ID when the quantity of the corresponding first-category fault prompt information or second-category fault prompt information exceeds a second quantity threshold.

[0030] In a second aspect, the present application provides a quality inspection device for RFID tag packaging, which is applied to an RFID tag packaging inspection system; the system includes a reader / writer; a photoresistor is arranged adjacent to a light-incoming surface of the reader / writer; the RFID tag includes a chip, an antenna, and a laser diode connected between the chip and the antenna; the laser emission port of the laser diode is configured to be located directly opposite to the photoresistor when performing a read / write operation; the device includes:

[0031] A read / write module, used to read and write RFID tags through a reader / writer;

[0032] A prompt information output module, in response to not receiving the light signal through the photoresistor, outputs fault prompt information; the fault prompt information is used to indicate that the packaging quality of the RFID tag is unqualified;

[0033] The prompt information output module is also used to obtain the reading and writing results of the reader / writer. If the reading and writing results are normal, a type of fault prompt information is output; a type of fault prompt information is used to indicate that the welding position of the antenna, laser diode or chip is offset.

[0034] In a third aspect, the present application provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of the method provided in the first aspect of the present application are implemented.

[0035] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method provided in the first aspect of the present application.

[0036] In a fifth aspect, the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the steps of the method provided in the first aspect of the present application.

[0037] The above-mentioned quality inspection method for RFID tag packaging can be configured to set a photoresistor on the light-incoming surface of the reader / writer and a laser diode between the antenna and the chip of each electronic tag, so that during each reading and writing process, the fault of the electronic tag and the fault type can be determined by the light signal received by the photoresistor at the same time; when the reading and writing of the electronic tag is normal, but the photoresistor does not receive the light signal, it is determined that the position of the laser diode is offset, and then it is inferred that the welding position of the antenna, laser diode or chip may be offset, and a corresponding type of fault prompt information is output; thereby effectively solving the problem of manual detection of structural defects by manpower in large-scale RFID packaging processes and avoiding the problem of low efficiency in quality inspection of RFID tag packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 A flow chart of the overall steps of a quality inspection method for an RFID tag package in one embodiment;

[0040] Figure 2 A flowchart of the steps of identifying a displaced welding position through a target image in one embodiment;

[0041] Figure 3 A flowchart of steps for identifying a virtual joint welding position through a target image in one embodiment;

[0042] Figure 4 A flowchart of the steps of component fault identification in one embodiment;

[0043] Figure 5 A flowchart of the steps of corresponding identification of device parameters in one embodiment;

[0044] Figure 6A flowchart of the steps of providing a short message reminder to a duty person in one embodiment;

[0045] Figure 7 A framework diagram of a quality inspection device for RFID tag packaging in one embodiment. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0047] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0049] In this application, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element, or connected to the other element through an intermediate element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if there is transmission of electrical signals or data between the connected objects.

[0051] In an exemplary embodiment, a quality inspection method for RFID tag packaging is provided, which is applied to an RFID tag packaging inspection system; the system includes a reader / writer; a photoresistor is arranged adjacent to a light-incoming surface of the reader / writer; the RFID tag includes a chip, an antenna, and a laser diode connected between the chip and the antenna; the laser emission port of the laser diode is configured to be located directly opposite to the photoresistor when performing a read / write operation.

[0052] Among them, the reader-writer can be set at the quality inspection node of the RFID tag production line. By fixing the reader-writer above the RFID tag finished product inspection conveyor belt and setting the reading and writing interval, the packaging quality of the RFID tags is inspected in turn.

[0053] On the other hand, the structure of the RFID tag including the chip and the antenna is schematic. In the specific implementation process, specific additional structures can be provided according to the implementation method to realize corresponding functions.

[0054] Specifically, the photoresistor may be connected to the terminal to obtain the detection result of the optical signal in a timely manner.

[0055] like Figure 1 As shown, the method includes the following steps S202 to S206. Among them:

[0056] S202, performing read and write operations on the RFID tag through a reader / writer.

[0057] Specifically, the RFID tag in the embodiment of the present application can be a passive RFID tag. During the reading and writing process through the reader / writer, the electromagnetic wave signal enters through the antenna and is converted into an electrical signal by the antenna. When the electrical signal passes through the laser diode, the laser diode will be lit. Therefore, by judging whether the laser diode is lit, it is possible to judge whether the circuit is normal.

[0058] S204, in response to the failure to receive the light signal through the photoresistor, outputting fault prompt information; the fault prompt information is used to indicate that the packaging quality of the RFID tag is unqualified.

[0059] Specifically, when the laser diode is on, the photoresistor can receive the light beam emitted by the laser diode because the laser diode and the photoresistor are facing each other during the reading and writing process. However, if the welding position is offset so that the laser diode is not facing the photoresistor, or if the laser diode does not emit light due to a circuit fault, the photoresistor cannot receive the light signal. Therefore, whether the photoresistor receives the light signal can be used to determine whether a fault has occurred.

[0060] S206, obtaining the reading and writing results of the reader / writer, and if the reading and writing results are normal, outputting a type of fault prompt information; the type of fault prompt information is used to indicate that the welding position of the antenna, laser diode or chip is offset.

[0061] Specifically, if the photoresistor does not receive the light signal emitted by the laser diode, but the reading and writing results are normal, it indicates that the laser diode is not aligned with the photoresistor, and a type of fault related to the offset of the welding position may occur.

[0062] An RFID tag packaging quality inspection method provided in an embodiment of the present application can be configured to set a photoresistor on the light-incoming surface of a reader / writer and to set a laser diode between the antenna and the chip of each electronic tag, so that during each reading and writing process, the fault of the electronic tag and the type of fault can be determined by the optical signal received by the photoresistor at the same time; when the reading and writing of the electronic tag is normal, but the photoresistor does not receive the optical signal, it is determined that the position of the laser diode is offset, and it is further inferred that the welding position of the antenna, laser diode or chip may be offset, and a corresponding type of fault prompt information is output; thereby effectively solving the problem of manually detecting structural defects in large-scale RFID packaging processes and avoiding the problem of low efficiency in quality inspection of RFID tag packaging.

[0063] In an exemplary embodiment, the system further includes a camera module disposed adjacent to the reader; Figure 2 As shown, a quality inspection method for RFID tag packaging also includes the following steps S302 to S310. Among them:

[0064] S302, based on a type of fault prompt information, obtaining a target image of a corresponding RFID tag through a camera module.

[0065] In the event of a type I fault, the image information of the faulty label captured by the camera module can be used to determine the label morphology and whether there is welding offset in the label.

[0066] S304, preprocessing the target image; the preprocessing method includes noise removal and image smoothing, and dividing into a plurality of comparison areas; the comparison areas correspond to the chip, the laser diode and the welding position of the chip respectively.

[0067] Exemplarily, smoothing the image may include reducing noise and details in the image, and bilateral filtering may be used to determine that the image is smoothed in combination with spatial distance and pixel value difference, so that edges can be effectively preserved.

[0068] S306, performing image feature comparison between the preprocessed target image and a preset image; the preset image includes an RFID tag image of a standard welding position.

[0069] Specifically, the RFID tag image of the standard welding position can be obtained by photographing the RFID tag that meets the production accuracy in advance.

[0070] S308, extracting edge features of the target image and the preset image respectively and performing feature comparison one by one according to the comparison areas.

[0071] Specifically, the set comparison area is compared with the welding method of the standard image to find the difference in welding offset.

[0072] S310, in response to the similarity of the feature comparison of any comparison area being less than a preset threshold, outputting prompt information about a type of fault; the prompt information about a type of fault is used to indicate the corresponding comparison area.

[0073] Specifically, a type of fault information is output to indicate the comparison area where there is a problem, so as to provide a reference for workers to quickly determine the offset position.

[0074] In an exemplary embodiment, Figure 3 As shown, a quality inspection method for RFID tag packaging also includes the following steps S402 to S408. Among them:

[0075] S402, in response to receiving a discontinuous light signal through the photoresistor and the reading and writing results of the reader are normal, outputting second-type fault prompt information; the second-type fault prompt information is used to indicate that the welding position is poorly connected.

[0076] It is understandable that when a virtual connection occurs, the laser diode emits intermittent light due to discontinuous current, so the continuity of the light signal is judged by the photoresistor to determine the virtual connection.

[0077] S404, based on the preprocessed target image, respectively extracting texture features of each welding position according to the comparison area.

[0078] Specifically, the texture features may include structural features of welding lines and welding spots in the image.

[0079] S406, performing defect recognition on the texture features through a feature defect recognition model; the feature defect recognition model is trained based on the texture features of the defects; the types of defects include solder joint burrs, solder joint cracks, missed soldering and wrong soldering.

[0080] Specifically, the images corresponding to preset defects such as weld burrs, welding cracks, weld leaks and wrong welds can be input into the defect recognition model to train the defect model and mark the corresponding defects respectively; then, the target image can be identified according to the trained defect recognition model to find the defect type corresponding to the mark.

[0081] In an exemplary embodiment, the presence of excess solder or excessive solder temperature can be determined through solder burrs; thus, the solder burr situation is corrected by acquiring and adjusting equipment parameters corresponding to the soldering node.

[0082] S408, in response to the presence of a characteristic defect in any comparison area, outputting prompt information about the second type of fault; the prompt information about the second type of fault is used to indicate the type of defect and the corresponding comparison area.

[0083] Specifically, the second type of fault includes a virtual connection, and the second type of fault prompt information is used to reveal the specific type of the virtual connection to prompt the staff to find the defect location.

[0084] In an exemplary embodiment, Figure 4 As shown, a quality inspection method for RFID tag packaging also includes the following steps S502 to S504. Among them:

[0085] S502, in response to the fact that no light signal is received through the photoresistor and the reader / writer cannot obtain the reading and writing result, a pre-processed target image is obtained and feature defect recognition is performed.

[0086] It is understandable that if the photoresistor does not receive the light signal and the reader does not read and write normally, the corresponding label may have a welding problem, or the chip, antenna or diode itself may be faulty, because feature defect identification is first used to determine whether the fault comes from welding.

[0087] Furthermore, the characteristic defect recognition includes a recognition method as the method for recognizing virtual joint defects in the aforementioned embodiment.

[0088] S504, if it is obtained that there is no characteristic defect in the comparison area, three types of fault prompt information are output; the three types of fault prompt information are used to indicate component failure; component failure includes chip failure, laser diode failure or antenna failure.

[0089] As mentioned above, when no characteristic defect is identified in the comparison area, it indicates that there may be a chip failure, a laser diode failure or an antenna failure, and thus prompt information about the three types of failures is output.

[0090] In an exemplary embodiment, Figure 5 As shown, a quality inspection method for RFID tag packaging also includes the following steps S602 to S606. Among them:

[0091] S602, obtaining a unique identification code of the RFID tag corresponding to the first-class fault prompt information or the second-class fault prompt information, and determining the production batch of each RFID tag according to the production rhythm of the RFID tag and the unique identification code.

[0092] Specifically, each RFID tag is configured with a unique identification code for distinguishing each tag; when the unique identification code is determined and the tag corresponding to the unique identification code is detected and outputs a type of fault prompt information or a type of fault prompt information, the fault location and fault time of the fault type corresponding to the type of fault prompt information or the type of fault prompt information can be determined according to the production rhythm; wherein the production rhythm can be the output corresponding to the unit production cycle determined according to the order time.

[0093] S604: If the number of type I fault prompt information or type II fault prompt information of the same production batch exceeds a first quantity threshold, determine a production node corresponding to the corresponding comparison area, and call corresponding equipment parameters of the production equipment of the production node.

[0094] Specifically, if the number of type one fault prompt messages exceeds the first number threshold, or the number of type two fault prompt messages exceeds the first number threshold, it indicates that the equipment parameter debugging is wrong or the equipment itself has a fault. Therefore, it is necessary to locate the production node associated with the production in the comparison area and retrieve the parameters of the production node to determine whether the production node has a fault.

[0095] S606: If any device parameter does not correspond to the preset parameter, an alarm message is output.

[0096] If any equipment parameter of a production node does not correspond to the preset parameter, indicating that the parameter debugging error or equipment failure causes the parameter change, an alarm message is output to avoid an increase in the failure rate of RFID tag production.

[0097] In an exemplary embodiment, Figure 6 As shown, a quality inspection method for RFID tag packaging also includes the following steps S702 to S704. Among them:

[0098] S702, in response to the number of type I fault prompt information or type II fault prompt information of the same production batch exceeding a second quantity threshold, obtaining the identity ID and corresponding contact information of the on-duty personnel based on the production batch; the second quantity threshold is greater than the first quantity threshold.

[0099] Specifically, if the number of type 1 fault prompt messages exceeds the second number threshold, or the number of type 2 fault prompt messages exceeds the second number threshold, it indicates that the staff has not promptly intervened in the fault corresponding to the alarm message. Therefore, the on-duty personnel of the production batch are directly notified by obtaining their contact information.

[0100] Furthermore, the unique identification code of the RFID tag can be obtained by scanning it, and the production batch can be determined based on the unique identification code, thereby corresponding to the production batch of the identity ID retained by the on-duty personnel during the production duty sign-in process, so as to quickly lock the on-duty personnel.

[0101] S704: Send a short message reminder that the number of corresponding first-category fault prompt information or second-category fault prompt information exceeds a second number threshold to the contact information corresponding to the identity ID.

[0102] Specifically, the on-duty personnel may also be reminded by telephone.

[0103] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0104] Based on the same inventive concept, the embodiment of the present application also provides a quality inspection device for an RFID tag package for implementing the quality inspection method for an RFID tag package involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more embodiments of the quality inspection device for an RFID tag package provided below can refer to the limitations of the quality inspection method for an RFID tag package above, and will not be repeated here.

[0105] Second, as Figure 7 As shown, the present application provides a quality inspection device 700 for RFID tag packaging, which is applied to the packaging inspection system of RFID tags; the system includes a reader / writer; a photoresistor is arranged adjacent to the light-incoming surface of the reader / writer; the RFID tag includes a chip, an antenna, and a laser diode connected between the chip and the antenna; the laser emission port of the laser diode is configured to be located directly opposite to the photoresistor when performing a reading and writing operation; the device includes:

[0106] The read / write module 701 is used to read and write RFID tags through a reader / writer;

[0107] The prompt information output module 702 is used to output fault prompt information in response to the failure of receiving the light signal through the photoresistor; the fault prompt information is used to indicate that the packaging quality of the RFID tag is unqualified;

[0108] The prompt information output module 702 is also used to obtain the reading and writing results of the reader / writer. If the reading and writing results are normal, a type of fault prompt information is output; a type of fault prompt information is used to indicate that the welding position of the antenna, laser diode or chip is offset.

[0109] Each module in the above-mentioned RFID tag package quality inspection device can be implemented in whole or in part by software, hardware, or a combination thereof. Each module can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute the operations corresponding to each module.

[0110] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of the method provided in the first aspect of the present application are implemented.

[0111] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method provided in the first aspect of the present application.

[0112] In a fifth aspect, the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the steps of the method provided in the first aspect of the present application.

[0113] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0114] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0115] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A quality inspection method for RFID tag packaging, It is characterized in that A packaging detection system for RFID tags; the system comprises a reader and a camera module arranged adjacent to the reader; a photoresistor is arranged adjacent to a light-incoming surface of the reader; the RFID tag comprises a chip, an antenna, and a laser diode connected between the chip and the antenna; the laser emission port of the laser diode is configured to be located directly opposite to the photoresistor when performing a read / write operation; the method comprises the following steps: Performing reading and writing operations on the RFID tag through the reader / writer; In response to the failure of the photoresistor to receive the light signal, outputting fault prompt information; the fault prompt information is used to indicate that the packaging quality of the RFID tag is unqualified; Obtaining the reading and writing results of the reader / writer, and if the reading and writing results are normal, outputting a type of fault prompt information; the type of fault prompt information is used to indicate that the welding position of the antenna, the laser diode or the chip is offset; Based on the type of fault prompt information, acquiring a target image of the corresponding RFID tag through the camera module; Preprocessing the target image; the preprocessing method includes removing noise and smoothing the image, and dividing it into a plurality of comparison areas; the comparison areas respectively correspond to the chip, the laser diode and the welding position of the chip; Comparing the image features of the preprocessed target image with a preset image; the preset image includes an RFID tag image of a standard welding position; Extracting edge features of the target image and the preset image respectively and performing feature comparison one by one according to the comparison area; In response to the similarity of the feature comparison of any of the comparison areas being less than a preset threshold, outputting prompt information about the type of fault; the prompt information about the type of fault is used to indicate the corresponding comparison area; In response to receiving a discontinuous light signal through the photoresistor and the reading and writing results of the reader / writer are normal, outputting second-type fault prompt information; the second-type fault prompt information is used to indicate that the welding position is not connected properly; Based on the preprocessed target image, respectively extracting texture features of each welding position according to the comparison area; Defect recognition is performed on the texture features through a feature defect recognition model; the feature defect recognition model is trained based on the texture features of the defects; the types of defects include solder joint burrs, solder joint cracks, leaking solder joints and wrong solder joints; In response to the presence of a characteristic defect in any of the comparison areas, prompt information about the second type of fault is output; the prompt information about the second type of fault is used to indicate the type of the defect and the corresponding comparison area.

2. The method according to claim 1, It is characterized in that The method further comprises: In response to the photoresistor not receiving the light signal and the reader / writer being unable to obtain the reading / writing result, acquiring the preprocessed target image and performing feature defect recognition; If it is obtained that there is no characteristic defect in the comparison area, three types of fault prompt information are output; the three types of fault prompt information are used to indicate component failure; the component failure includes chip failure, laser diode failure or antenna failure.

3. The method according to claim 2, It is characterized in that The method further comprises: Obtaining a unique identification code of the RFID tag corresponding to the first type of fault prompt information or the second type of fault prompt information, and determining a production batch of each of the RFID tags according to the production rhythm of the RFID tags and the unique identification code; If the number of the first type of fault prompt information or the second type of fault prompt information of the same production batch exceeds a first quantity threshold, determining a production node corresponding to the corresponding comparison area, and calling a corresponding equipment parameter of a production equipment of the production node; If any of the device parameters does not correspond to the preset parameters, an alarm message is output.

4. The method according to claim 3, It is characterized in that The method further comprises: In response to the number of the first type of fault prompt information or the second type of fault prompt information of the same production batch exceeding a second number threshold, obtaining an identity ID and corresponding contact information of a duty personnel based on the production batch; the second number threshold is greater than the first number threshold; Sending a short message reminder indicating that the quantity of the first type of fault prompt information or the second type of fault prompt information exceeds a second quantity threshold to the contact information corresponding to the identity ID.

5. A quality inspection device for RFID tag packaging, applied to the method according to any one of claims 1 to 4, It is characterized in that A packaging detection system for RFID tags; the system includes a reader / writer; a photoresistor is arranged adjacent to a light-incoming surface of the reader / writer; the RFID tag includes a chip, an antenna, and a laser diode connected between the chip and the antenna; The laser emitting port of the laser diode is configured to be located directly opposite to the photoresistor when performing a read / write operation; the device comprises: A read / write module, used to read and write the RFID tag through the reader / writer; A prompt information output module, in response to the failure of the photoresistor to receive the light signal, outputs fault prompt information; the fault prompt information is used to indicate that the packaging quality of the RFID tag is unqualified; The prompt information output module is also used to obtain the reading and writing results of the reader / writer. If the reading and writing results are normal, a type of fault prompt information is output; the type of fault prompt information is used to indicate that the welding position of the antenna, the laser diode or the chip is offset.

6. A computer device comprising a memory and a processor, wherein the memory stores a computer program, It is characterized in that When the processor executes the computer program, the steps of the method according to any one of claims 1 to 4 are implemented.

7. A computer-readable storage medium having a computer program stored thereon, It is characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

8. A computer program product comprising a computer program, It is characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

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