Wafer level semiconductor device die bonder

Abstract

The application belongs to the technical field of electronic mounting and provides a wafer-level semiconductor device mounting device, which is suitable for high-precision mounting of wafer-level large-size chips. The operation process includes the steps of starting, feeding, sucking, taking, moving into a PCB, coarse alignment, fine alignment, mounting and releasing. By using a light splitting prism and a gradient microscope together, high-precision alignment and mounting of a large-size chip module and a printed circuit board are realized, long-range (≥10 cm) and multi-pad (≥1500) high-precision alignment between a chip pad and a printed circuit board pad is ensured, and the overall mounting precision is ≤10 μm. At the same time, a certain pressure value can be applied according to the needs of device mounting. The device not only improves the repeatability and reliability of operation, but also solves the problems of existing automatic mounting devices, such as the inability to meet the mounting needs of large-size chip modules and low mounting precision.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic mounting, in particular to a wafer-level semiconductor device mounting device. BACKGROUND

[0002] Pixel Array Detector (PAD) is a two-dimensional detector commonly used in advanced light source large scientific platform devices (such as synchrotron radiation source, X-ray free electron laser, etc.). PAD has excellent performance such as high spatial resolution, fast time response and strong radiation resistance, and is widely used in imaging, scattering and spectral scientific experiments, especially in frontier scientific researches such as small molecule chemical reaction, biological molecule structure and dynamic imaging.

[0003] The core unit of PAD is Front End Module (FEM), which is composed of chip module (including Sensor and ASIC), Printed Circuit Board (PCB) and mechanical support, etc. In order to meet the requirements of high spatial resolution and large detection area, the area of the front end module should be as large as possible. However, due to the limitations of integrated circuit processing and packaging technology, the detection panel usually adopts the way of tiling like ceramic tiles to obtain a large detection area.

[0004] In the manufacturing process, a key step is to mount the chip module on the PCB with high precision to ensure the high-precision alignment of nearly 2000 pads on the chip. Since the commercial mounter on the market is mainly aimed at the mounting of small chips, it cannot meet the mounting requirements of large-size chip modules, so a special mounter needs to be designed and invented. SUMMARY

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a wafer-level semiconductor device mounting device to solve the problems of high-precision mounting difficulty, and the existing automatic mounting equipment cannot meet the mounting requirements of large-size chip modules in the prior art.

[0006] To achieve the above object and other related objects, the present application provides a wafer-level semiconductor device patching device, which comprises a vacuum box and a patching machine body, wherein the patching machine body is arranged in the vacuum box; the patching machine body comprises a feeding unit, a conveying unit and a patching unit; the conveying unit comprises a first guide rail and a suction unit, wherein the suction unit is slidable relative to the first guide rail along the X-axis direction; the suction unit comprises a second guide rail and a suction nozzle, wherein the suction nozzle is slidable relative to the second guide rail along the Z-axis direction; the suction unit is used to transfer a chip module on the feeding unit to a PCB board on the patching unit; the patching unit comprises a third guide rail and a carrying unit, wherein the carrying unit is slidable relative to the third guide rail along the Y-axis direction; the carrying unit comprises a carrying table and a rotating unit, wherein the bottom of the carrying table is connected with the rotating unit; the device further comprises a light-splitting prism assembly and a gradient microscope assembly, which are used to align the chip module with the PCB board, and the gradient microscope assembly is connected with the second guide rail.

[0007] In some embodiments of the present application, a plurality of first positioning pins are arranged on the feeding unit, which are used to position and suck the middle region of the chip module by the suction nozzle.

[0008] In some embodiments of the present application, a plurality of second positioning pins are arranged on the carrying table, which are used to position the PCB board.

[0009] In some embodiments of the present application, the surface of the suction nozzle is provided with one or more vacuum suction holes, which are used to suck the chip module on the feeding unit.

[0010] In some embodiments of the present application, the surface of the carrying table is provided with one or more vacuum suction holes, which are used to adsorb and fix the PCB board.

[0011] In some embodiments of the present application, the light-splitting prism assembly comprises two light-splitting prisms and a first spacing adjusting unit, wherein the first spacing adjusting unit comprises a first ball screw, a first nut and a first adjusting frame, the first ball screw is arranged in the first adjusting frame and is rotatable relative to the first adjusting frame, the first nut is connected with one end of the first ball screw and is used to drive the first ball screw to rotate, and two opposite external threads are arranged on the first ball screw.

[0012] In some embodiments of the present application, the light-splitting prism assembly further comprises two pushing mechanisms, wherein each pushing mechanism comprises a cylinder-piston structure, the cylinder-piston structure is composed of a cylinder and a piston, the cylinder is arranged on the first adjusting frame, and the piston is connected with the light-splitting prism.

[0013] In some embodiments of the present application, the light-splitting prism assembly further comprises two first sliding blocks, each of which is connected to the two pushing mechanisms, and each of which is provided with an internal thread and is rotationally connected to two opposite external threads on the first ball screw.

[0014] In some embodiments of the present application, the gradient microscope assembly comprises two gradient microscopes and a second spacing adjustment unit, the second spacing adjustment unit comprises a second ball screw, a second nut and a second adjustment frame, the second ball screw is arranged in the second adjustment frame and can rotate relative to the second adjustment frame, the second nut is connected to one end of the second ball screw for driving the second ball screw to rotate, and the second ball screw is provided with two opposite external threads.

[0015] In some embodiments of the present application, the gradient microscope assembly further comprises two second sliding blocks, each of which is connected to the two gradient microscopes, and each of which is provided with an internal thread and is rotationally connected to two opposite external threads on the second ball screw.

[0016] In some embodiments of the present application, a vacuum generator is further included for converting compressed air into vacuum adsorption, and for providing vacuum adsorption for the material suction unit, the object carrying unit and / or for motion control of the light-splitting prism assembly.

[0017] In some embodiments of the present application, the material suction unit, the object carrying unit and the light-splitting prism assembly are each provided with an air pipe, and each of the air pipes is connected to the vacuum generator.

[0018] In some embodiments of the present application, the suction nozzle is connected to a pressure sensor for detecting the pressure during patching.

[0019] In some embodiments of the present application, the first guide rail is an X-axis electric displacement table for adjusting the position of the suction nozzle along the X-axis direction, with a stroke ≥200mm and a repeat positioning accuracy ≤5μm, and with a grating scale position feedback.

[0020] In some embodiments of the present application, the second guide rail is a Z-axis electric displacement table for realizing the downward pressing of the suction nozzle along the Z-axis direction, with a stroke ≥200mm and a load ≥5kg.

[0021] In some embodiments of the present application, the third guide rail is a Y-axis electric displacement table for adjusting the position of the object carrying table along the Y-axis direction, with a stroke ≥100mm and a repeat positioning accuracy ≤5μm, and with a grating scale position feedback.

[0022] In some embodiments of the present application, the rotating unit is a U-axis electric displacement table, which is used to adjust the horizontal angle of the object table, and the angular resolution is ≤5 angular seconds, and the 360° rotation is available.

[0023] As described above, the wafer-level semiconductor device patching device of the present application has the following beneficial effects:

[0024] 1. High-precision alignment: Through the design of the light-splitting prism and the gradient microscope, high-precision alignment between a chip with a size of ≥10 cm×3 cm and a printed circuit board is achieved, ensuring long-range (≥10 cm), multi-pad (≥1500) high-precision alignment between the chip pads and the printed circuit board pads, and the overall patching precision is ≤10 μm.

[0025] 2. Automatic pressure application: By adjusting the Z-direction height of the suction nozzle, a certain controllable pressure is applied to ensure the adhesion of the chip module on the PCB.

[0026] 3. The set parameters can be saved and called, facilitating the adjustment and positioning of multiple patches.

[0027] 4. Automatic operation: The device realizes a high-precision, automatic, and digital patching process, improving the repeatability and stability of the operation.

[0028] 5. Suitable for large-size chips: Designed for wafer-level scale and large-size chips, it can meet the patching needs of large-size chip modules in the development process of area detectors, solving the problem that existing commercial patching machines cannot meet.

[0029] 6. Improve production efficiency: The use of automatic equipment not only improves the patching precision, but also greatly improves the production efficiency, reduces the labor cost and the error rate. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 The overall schematic diagram of the wafer-level semiconductor device patching device disclosed in the embodiments of the present application is shown.

[0031] Figure 2 The structural schematic diagram of the patching machine body of the wafer-level semiconductor device patching device disclosed in the embodiments of the present application is shown.

[0032] Figure 3 The structural schematic diagram of the wafer-level semiconductor device patching device disclosed in the embodiments of the present application is shown.

[0033] Figure 4 The structural schematic diagram of the light-splitting prism assembly of the wafer-level semiconductor device patching device disclosed in the embodiments of the present application is shown.

[0034] Figure 5A structural schematic diagram of a gradient microscope assembly of a wafer-level semiconductor device patching device disclosed in embodiments of the present application.

[0035] Figure 6 An image diagram of fiducials and pads of a chip module and a PCB board of a wafer-level semiconductor device patching device disclosed in embodiments of the present application.

[0036] BRIEF DESCRIPTION OF DRAWINGS

[0037] 1 loading unit

[0038] 11 first positioning pin

[0039] 2 conveying unit

[0040] 21 first guide rail

[0041] 22 suction unit

[0042] 221 second guide rail

[0043] 222 suction nozzle

[0044] 3 patching unit

[0045] 31 third guide rail

[0046] 32 carrying unit

[0047] 321 carrying table

[0048] 3211 second positioning pin

[0049] 322 rotating unit

[0050] 4 light-splitting prism assembly

[0051] 41 light-splitting prism

[0052] 42 first distance adjusting unit

[0053] 421 first nut

[0054] 422 first ball screw

[0055] 423 first adjusting frame

[0056] 424 first sliding block

[0057] 5 gradient microscope assembly

[0058] 51 gradient microscope

[0059] 52 second distance adjusting unit

[0060] 521 second adjusting frame

[0061] 522 second nut

[0062] 523 second ball screw

[0063] 524 second slider

[0064] 6 vacuum box DETAILED DESCRIPTION

[0065] The wafer-level semiconductor device patching device provided by the application is suitable for high-precision patching of wafer-level large-size chips, and the operation process of the wafer-level semiconductor device patching device includes the following steps: starting, feeding, sucking, taking, moving into a PCB, coarse alignment, fine alignment, patching and releasing. By using the combination of a light splitting prism and a gradient microscope, high-precision alignment and patching of a large-size chip module and a printed circuit board are realized, long-range and multi-pad high-precision alignment between a chip pad and a printed circuit board pad is ensured, and the overall patching precision is ≤10 μm. The device not only improves the repeatability and reliability of the operation, but also solves the problem that the existing commercial patching machine cannot meet the demand, and significantly improves the performance and production efficiency of the area detector. On this basis, the application is completed.

[0066] Please refer to Figures 1-6 It should be noted that the structures, proportions, sizes and the like shown in the drawings attached to the present specification are only used to cooperate with the content disclosed in the specification, to enable those skilled in the art to understand and read, and are not used to limit the limiting conditions under which the application can be implemented, so they do not have technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect and purpose that the application can produce, should still fall within the scope covered by the disclosed technical content of the application. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" in the present specification are only for the convenience of clear description, and are not used to limit the scope in which the application can be implemented, the change or adjustment of the relative relationship, without substantially changing the technical content, is also regarded as the scope in which the application can be implemented.

[0067] As Figure 1 The wafer-level semiconductor device patching device provided by the application includes a vacuum box 6 and a patching machine body, the patching machine body is arranged in the vacuum box 6; the patching machine body includes a feeding unit 1, a conveying unit 2 and a patching unit 3; as Figure 2The conveying unit 2 comprises a first guide rail 21 and a suction unit 22, the suction unit 22 can slide along the X-axis direction relative to the first guide rail 21; the suction unit 22 comprises a second guide rail 221 and a suction nozzle 222, the suction nozzle 222 can slide along the Z-axis direction relative to the second guide rail 221; the suction unit 22 is used for transferring the chip module on the feeding unit 1 to the PCB on the patch unit 3; the patch unit 3 comprises a third guide rail 31 and a carrying unit 32, the carrying unit 32 can slide along the Y-axis direction relative to the third guide rail 31; the carrying unit 32 comprises a carrying table 321 and a rotating unit 322, the bottom of the carrying table 321 is connected with the rotating unit 322; the device further comprises a light splitting prism assembly 4 and a gradient microscope assembly 5, which are used for aligning the chip module and the PCB. For example, the light splitting prism assembly 4 and the gradient microscope assembly 5 are respectively arranged above the carrying table 321, and the gradient microscope assembly 5 is connected with the second guide rail 221.

[0068] As Figure 3 The feeding unit 1 is provided with a plurality of first positioning pins 11, which are used for positioning and sucking the middle area of the chip module in cooperation with the suction nozzle 222, reducing the subsequent adjustment and alignment operations during patching, and ensuring the uniformity of the pressure during pressing.

[0069] The surface of the suction nozzle 222 is provided with one or more vacuum suction holes, which are used for sucking the chip module on the feeding unit 1.

[0070] The suction nozzle 222 is made of anti-static bakelite, and the size can be customized according to the size of the chip module.

[0071] The suction nozzle 222 is connected with a pressure sensor, which is used for detecting the pressure when the suction nozzle 222 is pressed down, so as to monitor the pressure during patching and automatically stop the pressing of the suction nozzle 222 to avoid damage to the chip module.

[0072] As Figure 3 The carrying table 321 is provided with a plurality of second positioning pins 3211, which are used for positioning the PCB.

[0073] The surface of the carrying table 321 is provided with one or more vacuum suction holes, which are used for sucking and fixing the PCB.

[0074] As Figure 4The wafer-level semiconductor device patching device provided by the application, the beam splitter prism assembly 4 comprises two beam splitter prisms 41 and a first spacing adjustment unit 42, the spacing of the two beam splitter prisms 41 is adjusted along the X-axis direction through the first spacing adjustment unit 42, and different specifications of patch samples can be matched.

[0075] The wafer-level semiconductor device patching device provided by the application, the beam splitter prism assembly 4 further comprises two first sliding blocks 424, the beam splitter prism assembly 4 further comprises two push mechanisms 43, the two first sliding blocks 424 are connected with the two push mechanisms 43 respectively, the two first sliding blocks 424 are respectively provided with internal threads, and the two first sliding blocks 424 are rotationally connected with the two opposite external threads on the first ball screw 422.

[0076] As Figure 5 The wafer-level semiconductor device patching device provided by the application, the push mechanism 43 comprises a cylinder-piston structure, the cylinder-piston structure is composed of a cylinder and a piston, the cylinder is arranged on the first adjusting frame 423, and the piston is connected with the beam splitter prism 41. The piston is controlled to pop up and retract through the cylinder, so that the beam splitter prism 41 is driven to pop up and retract. When the beam splitter prism 41 needs to be used, the push mechanism 43 is controlled to pop up the beam splitter prism 41 from an initial position to a working position through software, at this time, the beam splitter prism 41 enters an optical path and starts to perform a beam splitting task; when the beam splitter prism 41 does not need to be used, the push mechanism 43 is controlled to retract the beam splitter prism 41 from the working position to the initial position through software, so that the beam splitter prism 41 does not interfere with other operations. The application protects the hardware structure, and the part controlled through software can be realized through the prior art.

[0077] The wafer-level semiconductor device patching device provided by the application, the beam splitter prism assembly 4 is used for coarse alignment of a chip module and a PCB board, the position of the chip module and the PCB board is adjusted through the image of the chip module and the PCB board on the display, so that the reference points of the chip module and the PCB board are aligned at both ends of the same long side, and the chip pads and the PCB pads are aligned as a whole.

[0078] The wafer-level semiconductor device patching device provided by the application comprises a wafer carrier 1, a wafer carrier moving unit 2, a wafer carrier positioning unit 3, a material suction unit 22, a wafer carrier 32, a light splitting prism assembly 4 and a gradient microscope assembly 5. Figure 5 The gradient microscope assembly 5 comprises two gradient microscopes 51 and a second spacing adjustment unit 52, the two gradient microscopes 51 are adjusted in spacing along the X-axis direction through the second spacing adjustment unit 52, and different specifications of patch samples can be matched.

[0079] The gradient microscope assembly 5 further comprises two second sliders 524, the two second sliders 524 are respectively connected with the two gradient microscopes 51, the two second sliders 524 are respectively provided with internal threads, and the two second sliders 524 are respectively rotationally connected with the two opposite external threads on the second ball screw 523.

[0080] The wafer-level semiconductor device patching device provided by the application, the gradient microscope assembly 5 is used for fine alignment of a chip module and a PCB board, after coarse alignment of the chip module and the PCB board is completed, the LED lamp on the gradient microscope 51 is turned on, the image of the chip module and the PCB board on the display is further observed, the pad alignment condition, the pad spacing and the wire bonding feasibility are confirmed, and fine alignment is completed.

[0081] The wafer-level semiconductor device patching device provided by the application further comprises a vacuum generator, which is used for converting compressed air into vacuum adsorption, providing vacuum adsorption for the material suction unit 22 and the wafer carrier 32 and / or controlling the air cylinder piston structure in the light splitting prism assembly 4, so as to control the ejection and retraction of the light splitting prism 41.

[0082] The wafer-level semiconductor device patching device provided by the application, the material suction unit 22, the wafer carrier 32 and the light splitting prism assembly 4 are respectively provided with air pipes, and the air pipes are respectively connected with the vacuum generator.

[0083] The wafer-level semiconductor device patching device provided by the application further comprises a control module, which realizes control of movement along the X-axis, the Y-axis and the Z-axis, rotation of the rotating unit 322 (along the U-axis), start and stop of the vacuum generator, light control of the light splitting prism assembly 4 and the gradient microscope assembly 5.

[0084] The wafer-level semiconductor device patching device provided by the application further comprises a camera system, wherein the camera system comprises four sets of large field of view cameras, and each of the camera systems can be arranged on a light splitting prism 41 or a gradient microscope 51.

[0085] The wafer-level semiconductor device patching device provided by the application can operate a device with a size of 12 cm*3 cm.

[0086] The wafer-level semiconductor device patching device provided by the application comprises an X-axis electric displacement table as the first guide rail 21, which is used to adjust the position of the suction nozzle 222 along the X-axis, has a stroke of 200 mm, a repeat positioning accuracy of 5 microns and a grating scale position feedback.

[0087] The wafer-level semiconductor device patching device provided by the application comprises a Z-axis electric displacement table as the second guide rail 221, which is used to realize the downward pressing of the suction nozzle 222 along the Z-axis, has a stroke of 200 mm and a load capacity of 5 kg.

[0088] The wafer-level semiconductor device patching device provided by the application comprises a Y-axis electric displacement table as the third guide rail 31, which is used to adjust the position of the object table 321 along the Y-axis, has a stroke of 100 mm, a repeat positioning accuracy of 5 microns and a grating scale position feedback.

[0089] The wafer-level semiconductor device patching device provided by the application comprises a U-axis electric displacement table as the rotating unit 322, which is used to adjust the horizontal angle of the object table 321, has an angular resolution of 5 angular seconds, an accuracy of 0.01 and a 360° rotation.

[0090] The working principle of the application is as follows:

[0091] (1) Start: Turn on the compressed air, turn on the power supply, start the computer and turn on the operation software.

[0092] (2) Feeding: Place the chip module on the feeding unit 2 by using the anti-static vacuum tweezers, so that the long side and the short side of the chip module are respectively close to the first positioning pin 11. Place the PCB board (actually a sample module with a mechanical support) on the object table 321, so that the long side and the short side of the PCB board are respectively close to the second positioning pin 3211, and then turn on the vacuum generator to adsorb the PCB board.

[0093] (3) Suction: Control the suction nozzle 222 to move to the upper side of the feeding unit 1 along the first guide rail 21 (X-axis), and then press the suction nozzle 222 downward along the second guide rail 221 (Z-axis) to adsorb the chip module on the feeding unit 1. In general, the suction nozzle 222 is stopped when it is close to the surface of the chip module, and then slowly pressed onto the chip module to prevent damage to the chip module caused by overshoot.

[0094] (4) Taking: After the suction nozzle 222 adsorbs the chip module along the second guide rail 221 (Z axis) to be lifted, the chip module is moved to the position of the object table 321 along the first guide rail 21 (X axis).

[0095] (5) Moving in the PCB: The position of the object table 321 on the third guide rail 31 (Y axis) is adjusted so that the PCB is roughly aligned with the chip module.

[0096] (6) Moving in the light splitting prism: The piston structure of the operating cylinder is adjusted so that the piston pops out the two light splitting prisms 41 to the working position, and the LED lamps at the upper and lower ends of the two light splitting prisms 41 are turned on.

[0097] (7) Rough alignment: The positioning marks (Mark, a pair of upper and lower corners) of the chip module and the PCB on the display are observed, and the positions of the chip module and the PCB are adjusted through the first guide rail 21 (X axis), the third guide rail 31 (Y axis) and the rotating unit (U axis) so that the reference points of the chip module and the PCB are aligned at both ends of the same long side, thereby realizing the overall alignment of the chip pads and the PCB pads.

[0098] (8) Moving out the light splitting prism: The piston structure of the operating cylinder is adjusted to retract the piston and drive the light splitting prism 41 to retract.

[0099] (9) Pressing down: The suction nozzle 222 is pressed down to the position set on the second guide rail 221 (Z axis) through the software end.

[0100] (10) Fine alignment: After the rough alignment of the chip module and the PCB is completed, the LED lamp on the gradient microscope 51 is turned on, the image of the chip module and the PCB on the display is further observed, and the positions of the chip module and the PCB are adjusted through the first guide rail 21 (X axis), the third guide rail 31 (Y axis) and the rotating unit (U axis) so that the reference points of the chip module and the PCB are aligned at the positioning marks at the two opposite corners of the long side, the pad alignment, the pad spacing and the wireability are confirmed, and the fine alignment is completed.

[0101] (11) Pasting: The suction nozzle 222 is pressed down along the second guide rail 221 (Z axis) through the control module, and the suction nozzle 222 is pressed down to the chip module and the PCB to be pasted tightly. When the suction nozzle 222 is pressed down, the pressure sensor of the suction nozzle 222 detects the pressure when the suction nozzle 222 is pressed down, and when the monitoring pressure is reached, the pressing down of the suction nozzle 222 is automatically stopped to avoid damage to the chip module.

[0102] (12) Releasing: After the pasting is completed, the vacuum generator is turned off, the sample is taken out and placed in an oven to dry the glue.

[0103] The above embodiments are preferred cases of the present application and do not limit the protection scope of the present application.

[0104] Applicant states that the wafer-level semiconductor device patching apparatus of the present application is illustrated by the above-mentioned embodiments, but the present application is not limited to the above-mentioned embodiments, i.e. the present application does not necessarily depend on the above-mentioned embodiments to be implemented. It should be understood by those skilled in the art that any improvement on the present application, equivalent replacement of each raw material of the product of the present application, addition of auxiliary ingredients, selection of specific modes, etc. all fall within the protection scope and disclosure scope of the present application.

[0105] The above-mentioned embodiments are preferred cases of the present application, and are not used to limit the protection scope of the present application. However, the present application is not limited to the specific details in the above-mentioned embodiments, and various simple modifications can be made to the technical solutions of the present application within the technical concept of the present application, and these simple modifications all belong to the protection scope of the present application.

[0106] In addition, it should be noted that each specific technical feature described in the above-mentioned specific embodiments can be combined by any suitable manner without contradiction, and in order to avoid unnecessary repetition, the present application will not further describe various possible combination manners.

Claims

1. A wafer-level semiconductor device mounting apparatus, characterized in that, The device comprises a vacuum box (6) and a patch machine body arranged in the vacuum box (6); the patch machine body comprises a feeding unit (1), a conveying unit (2) and a patching unit (3); the conveying unit (2) comprises a first guide rail (21) and a suction unit (22), the suction unit (22) can slide along the X-axis direction relative to the first guide rail (21); the suction unit (22) comprises a second guide rail (221) and a suction nozzle (222), the suction nozzle (222) can slide along the Z-axis direction relative to the second guide rail (221); the suction unit (22) is used to transfer the chip module on the feeding unit (1) to the PCB board on the patching unit (3); the patching unit (3) comprises a third guide rail (31) and a carrying unit (32), the carrying unit (32) can slide along the Y-axis direction relative to the third guide rail (31); the carrying unit (32) comprises a carrying table (321) and a rotating unit (322), the bottom of the carrying table (321) is connected with the rotating unit (322); the device further comprises a light splitting prism assembly (4) and a gradient microscope assembly (5) for aligning the chip module with the PCB board, the gradient microscope assembly (5) is connected with the second guide rail (221); the light splitting prism assembly (4) comprises two light splitting prisms (41) and a first spacing adjusting unit (42), the first spacing adjusting unit (42) comprises a first ball screw (422), a first nut (421) and a first adjusting frame (423), the first ball screw (422) is arranged in the first adjusting frame (423) and can rotate relative to the first adjusting frame (423), the first nut (421) is connected with one end of the first ball screw (422) and is used to drive the first ball screw (422) to rotate, and two opposite external threads are arranged on the first ball screw (422).

2. The wafer level semiconductor device die bonder apparatus of claim 1, wherein, Any one or more of the following features are also included: A1) A plurality of first positioning pins (11) are arranged on the feeding unit (1) to cooperate with the suction nozzle (222) to position and suck the middle region of the chip module; A2) A plurality of second positioning pins (3211) are arranged on the carrying table (321) to position the PCB board; A3) One or more vacuum suction holes are arranged on the surface of the suction nozzle (222) to suck the chip module on the feeding unit (1); A4) One or more vacuum suction holes are arranged on the surface of the carrying table (321) to adsorb and fix the PCB board.

3. The wafer level semiconductor device die bonder apparatus of claim 2, wherein, The light splitting prism assembly (4) further comprises two pushing mechanisms (43), the pushing mechanism (43) comprises a cylinder piston structure composed of a cylinder and a piston, the cylinder is arranged on the first adjusting frame (423), and the piston is connected with the light splitting prism (41).

4. The wafer level semiconductor device die bonder apparatus of claim 3, wherein, The spectrometer prism assembly (4) further comprises two first sliding blocks (424) respectively connected with the two pushing mechanisms (43), and the two first sliding blocks (424) are respectively provided with internal threads and are respectively rotationally connected with two opposite external threads on the first ball screw (422).

5. The wafer level semiconductor device die attach apparatus of claim 1, wherein, The gradient microscope assembly (5) comprises two gradient microscopes (51) and a second distance adjusting unit (52), the second distance adjusting unit (52) comprises a second ball screw (523), a second nut (522) and a second adjusting frame (521), the second ball screw (523) is arranged in the second adjusting frame (521) and can rotate relative to the second adjusting frame (521), the second nut (522) is connected with one end of the second ball screw (523) and is used to drive the second ball screw (523) to rotate, and the second ball screw (523) is provided with two opposite external threads.

6. The wafer level semiconductor device die attach apparatus of claim 5, wherein, The gradient microscope assembly (5) further comprises two second sliding blocks (524) respectively connected with the two gradient microscopes (51), and the two second sliding blocks (524) are respectively provided with internal threads and are respectively rotationally connected with two opposite external threads on the second ball screw (523).

7. The wafer level semiconductor device die attach apparatus of claim 1, wherein, A vacuum generator is further included, which is used to convert compressed air into vacuum adsorption, and provides vacuum adsorption for the material suction unit (22) and the object carrier unit (32) and / or controls the movement of the spectrometer prism assembly (4).

8. The wafer level semiconductor device die bonder apparatus of claim 7, wherein, The material suction unit (22), the object carrier unit (32) and the spectrometer prism assembly (4) are respectively provided with air pipes, and each air pipe is connected with the vacuum generator.

9. The wafer level semiconductor device die patch apparatus of claim 1, wherein, Any one or more of the following features are included: A1) The suction nozzle (222) is connected with a pressure sensor, which is used to detect the pressure during patching; A2) The first guide rail (21) is an X-axis electric displacement table, which is used to adjust the position of the suction nozzle (222) along the X-axis direction, and the stroke is ≥200mm, and the repeat positioning accuracy is ≤5μm, and the position feedback is provided by a grating ruler; A3) The second guide rail (221) is a Z-axis electric displacement table, which is used to realize the downward pressing of the suction nozzle (222) along the Z-axis direction, and the stroke is ≥200mm, and the load is ≥5kg; A4) The third guide rail (31) is a Y-axis electric displacement table, which is used to adjust the position of the object carrier (321) along the Y-axis direction, and the stroke is ≥100mm, and the repeat positioning accuracy is ≤5μm, and the position feedback is provided by a grating ruler; A5) The rotating unit (322) is a U-axis electric displacement table, which is used to adjust the horizontal angle of the object carrier (321), and the angular resolution is ≤5 angular seconds, and the object carrier (321) can be rotated by 360°.

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