A bionic camera system

Abstract

The present application relates to the technical field of photographic equipment, and in particular to a bionic camera system, wherein a conventional photosensitive chip and an event photosensitive chip are installed in parallel on a side of a sensor circuit substrate close to a semi-transparent mirror and a reflector for receiving light; a signal processing circuit substrate is located on a side of the sensor circuit substrate away from the conventional photosensitive chip and the event photosensitive chip; an event camera bus and a conventional camera bus are connected between the sensor circuit substrate and the signal processing circuit substrate; an image calibration system is added to the signal processing circuit substrate, and an external interface is installed on the side of the signal processing circuit substrate away from the image calibration system. The purpose of the present application is to make the two sensors in the camera share a common optical axis, synchronize the time of the two sensors, and align the pixel-by-pixel coordinates of the two sensors, thereby effectively simplifying the number of parameters when correcting the images of the two sensors and reducing the amount of image correction calculations.

Description

Technical Field

[0001] This patent relates to the field of visual sensing, and in particular to a bionic camera system. Background Art

[0002] Autonomous mobile robots need to use cameras to obtain image information of the visual object and the surrounding environment to assist in completing various tasks, as well as completing functions such as visual balance perception, visual hazard avoidance, and visual navigation and obstacle avoidance.

[0003] In the related technology, traditional cameras use CIS (CMOS Image Sensor) for imaging. Although this setting method can obtain high-definition color image quality and is suitable for shooting static images, it has limited ability to capture dynamic images. Event camera EVS (Event-Based Vision Sensors) refers to a photosensitive chip that detects changes in the brightness of each pixel, combines "coordinates" and "time information", and only outputs data corresponding to the changed pixels, thereby achieving high-efficiency, high-speed, low-latency data output, and high dynamic range response. The cone cells and rod cells in the bionic characteristics of the human eye have the characteristics of high color restoration of static images and high dynamic capture capabilities, and low data latency; based on this principle, it is necessary to merge traditional cameras and event cameras to realize the fusion of the two visual sensors. The use of two sensors to realize a bionic eye requires three technical requirements:

[0004] 1. Two sensors share the same optical axis

[0005] 2. Time synchronization of two sensors

[0006] 3. Pixel-by-pixel coordinate alignment of two sensors - image correction system

[0007] To this end, the main purpose of this patent is to design a bionic vision camera to meet the above three design requirements. Summary of the invention

[0008] The present application provides a bionic camera system, the purpose of which is to make two sensors in the camera share a common optical axis, synchronize the time of the two sensors, and align the pixel-by-pixel coordinates of the two sensors, thereby effectively simplifying the number of parameters when correcting the images of the two sensors and reducing the amount of calculation for image correction.

[0009] The present application provides a bionic camera system, which adopts the following technical solution:

[0010] A bionic camera system includes a conventional camera lens group, a semi-transparent mirror, a reflector, a conventional photosensitive chip, an event photosensitive chip, a sensor circuit substrate, a signal processing circuit substrate, an event camera bus and a conventional camera bus;

[0011] The conventional camera lens group and the semi-transparent mirror are sequentially installed in the camera along the light irradiation direction, and the reflector is installed directly above the semi-transparent mirror;

[0012] The sensor circuit substrate is located on a side of the semi-transparent mirror and the reflective mirror away from the conventional camera lens group;

[0013] The conventional photosensitive chip and the event photosensitive chip are installed in parallel on a side of the sensor circuit substrate close to the semi-transparent mirror and the reflector, and the conventional photosensitive chip and the event photosensitive chip are used to receive light transmitted through the semi-transparent mirror and the reflector;

[0014] The signal processing circuit substrate is located on a side of the sensor circuit substrate away from the conventional photosensitive chip and the event photosensitive chip;

[0015] The sensor circuit substrate and the signal processing circuit substrate acquire data under the drive of the same clock source;

[0016] The event camera bus and the conventional camera bus are connected between the sensor circuit substrate and the signal processing circuit substrate. An image calibration system is provided on the side of the signal processing circuit substrate close to the sensor circuit substrate. The event camera bus and the conventional camera bus input the images on the conventional photosensitive chip and the event photosensitive chip into the image calibration system for calibration.

[0017] An external interface is installed on a side of the signal processing circuit substrate away from the image calibration system.

[0018] By adopting the above technical solution, the sensor circuit substrate and the signal processing circuit substrate are driven by the same clock source to acquire data, thereby effectively ensuring that the timestamps of the two output images are from the same source, and that the images output by the external interface are orderly on the time axis;

[0019] At the same time, the image calibration system is used to ensure that the angle of the image superposition of the two sensors is consistent and the pixel-by-pixel coordinates of the two sensors are aligned. At the same time, the image calibration system is synchronized with the timestamps on the two sensors, which helps to ensure the image quality;

[0020] The use of a half-mirror and a reflector can ensure that the event photosensitive chip and the conventional photosensitive chip perceive the image of the same scene, avoiding the image parallax caused by the misaligned installation of the sensor, thereby achieving the sensor circuit substrate and the signal processing circuit substrate to have a common optical axis;

[0021] Placing conventional photosensitive chips and event photosensitive chips on the same circuit substrate effectively simplifies the positional relationship calibration process of the two photosensitive chips, from the original seven-degree-of-freedom calibration (X, Y, Z translation, and Roll, Pitch, Yaw rotation angles, and a magnification U) to three-degree-of-freedom calibration (position translation of the two photosensitive chips (Y) and rotation angle (ROLL) on the plane of the sensor circuit board, and magnification (U)), greatly simplifying the calibration complexity.

[0022] Preferably, a thermoelectric cooler is provided on a side of the sensor circuit substrate close to the signal processing circuit substrate.

[0023] By adopting the above technical solution, the sensor inside the camera will generate a certain amount of heat when exposed for a long time. This heat will gradually cause a temperature difference inside the camera, and the temperature change will affect the color reproduction of the camera image. By using a thermoelectric cooler, the sensor temperature can be effectively kept stable, thereby ensuring the accuracy and consistency of the color, which is beneficial to ensuring the imaging quality of the camera. At the same time, stable temperature helps reduce the wear of electronic components, thereby extending the service life of the camera. In a high temperature environment, the thermoelectric cooler can help the camera maintain a normal operating temperature, ensuring that the camera can operate stably under extreme conditions.

[0024] Preferably, a socket is fixed in the horizontal direction on one side of the sensor circuit substrate close to the signal processing circuit substrate, and a plug is integrally formed on the side of the thermoelectric cooler connected to the sensor circuit substrate, and the plug is connected to the socket by plugging.

[0025] By adopting the above technical solution, when installing the thermoelectric cooler on the sensor circuit substrate, the plug pin can be plugged into the corresponding socket. The socket and the plug pin are used to set the thermoelectric cooler and the sensor circuit substrate in a plug-in assembly mode, which is convenient for installation and disassembly and maintenance.

[0026] Preferably, a first magnet is embedded at the inner bottom of the insertion table, and a second magnet is embedded at the end of the insertion column. After the insertion column is inserted into the insertion table, the first magnet is magnetically connected to the second magnet.

[0027] By adopting the above technical solution and further utilizing the first magnet and the second magnet, the stability of the connection between the sensor circuit substrate and the thermoelectric cooler can be further enhanced.

[0028] Preferably, a thermal pad is provided on a side of the thermoelectric cooler close to the sensor circuit substrate.

[0029] By adopting the above technical solution, the thermal pad can effectively increase the heat conduction between the sensor circuit substrate and the thermoelectric cooler, and the thermal pad can effectively ensure that the contact pressure between the thermoelectric cooler and the sensor circuit substrate is uniform, so as to achieve optimal heat transfer between the sensor circuit substrate and the thermoelectric cooler.

[0030] Preferably, an annular groove is formed on the thermoelectric cooler along its circumference, and a convex ring is integrally formed on a side of the thermal conductive pad close to the thermoelectric cooler, and the convex ring is embedded in the annular groove.

[0031] By adopting the above technical solution, when the thermal pad is mounted on the thermoelectric cooler, the corresponding adhesive is filled into the annular groove on the thermoelectric cooler, and then the convex ring on the thermal pad is embedded in the annular groove. The convex ring is bonded into the annular groove, and the convex ring is further limited by the annular groove, so that the stability of the thermal pad mounted on the thermoelectric cooler can be further enhanced.

[0032] Preferably, a plurality of heat sinks are embedded on a side of the thermoelectric cooler away from the sensor circuit substrate, and the plurality of heat sinks are evenly distributed on the thermoelectric cooler at intervals.

[0033] By adopting the above technical solution, a heat sink is installed on the side of the thermoelectric cooler away from the thermal pad. The heat sink can quickly and effectively remove heat from the thermoelectric cooler, so as to effectively improve the efficiency of heat exchange between the sensor circuit substrate and the thermoelectric cooler.

[0034] Preferably, a positioning rod is provided between the sensor circuit substrate and the signal processing circuit substrate in a direction perpendicular to the two, and a plurality of the positioning rods are provided, and the plurality of the positioning rods are symmetrically distributed on the left and right sides of the sensor circuit substrate and the signal processing circuit substrate.

[0035] By adopting the above technical solution, the positioning rod can effectively enhance the stability of the connection between the sensor circuit substrate and the signal processing circuit substrate. At the same time, the positioning rod can set the sensor circuit substrate and the signal processing circuit substrate as a whole, which makes the sensor circuit substrate and the signal processing circuit substrate always parallel, that is, the two can always maintain the same light-sensing angle, which is beneficial to ensure the imaging quality of the camera.

[0036] In summary, the present application includes at least one of the following beneficial technical effects:

[0037] 1. The sensor circuit substrate and the signal processing circuit substrate are driven by the same clock source to acquire data, thereby effectively ensuring that the timestamps of the two output images are from the same source and that the images output by the external interface are orderly on the time axis;

[0038] At the same time, the image calibration system is used to ensure that the angle of the image superposition of the two sensors is consistent and the pixel-by-pixel coordinates of the two sensors are aligned. At the same time, the image calibration system is synchronized with the timestamps on the two sensors, which helps to ensure the image quality;

[0039] The use of a half-mirror and a reflector can ensure that the event photosensitive chip and the conventional photosensitive chip perceive the image of the same scene, avoiding the image parallax caused by the misaligned installation of the sensor, thereby achieving the sensor circuit substrate and the signal processing circuit substrate to have a common optical axis;

[0040] The conventional photosensitive chip and the event photosensitive chip are arranged on the same circuit substrate, which effectively simplifies the position relationship calibration process of the two photosensitive chips, from the original 7 degrees of freedom calibration (X, Y, Z translation, and Roll, Pitch, Yaw rotation angle, and a magnification U) to 3 degrees of freedom calibration (position translation (Y) of the two photosensitive chips and rotation angle (ROLL) on the plane of the sensor circuit board, and magnification (U)), which greatly simplifies the calibration complexity;

[0041] 2. The sensor inside the camera will generate a certain amount of heat when exposed for a long time. This heat will gradually cause a temperature difference inside the camera. The temperature change will affect the color reproduction of the camera image. By using a thermoelectric cooler, the sensor temperature can be effectively kept stable, thereby ensuring the accuracy and consistency of the color, which is beneficial to ensuring the image quality of the camera. At the same time, stable temperature helps reduce the wear of electronic components, thereby extending the service life of the camera. In a high temperature environment, the thermoelectric cooler can help the camera maintain a normal operating temperature, ensuring that the camera can operate stably under extreme conditions;

[0042] 3. The use of the positioning rod can effectively enhance the stability of the connection between the sensor circuit substrate and the signal processing circuit substrate. At the same time, the positioning rod can make the sensor circuit substrate and the signal processing circuit substrate into a whole, which makes the sensor circuit substrate and the signal processing circuit substrate always parallel, that is, the two can always maintain the same light-sensing angle, which is beneficial to ensure the imaging quality of the camera. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the overall structure of Example 1 of the present application;

[0044] Figure 2 This is a structural schematic diagram of Example 1 of the present application specifically showing the basic installation positions of a conventional photosensitive chip and an event photosensitive chip in a sensor circuit;

[0045] Figure 3 is a structural schematic diagram of Example 2 of the present application specifically showing the installation positions of the thermoelectric cooler and the thermal pad;

[0046] Figure 4 is a structural schematic diagram of Embodiment 2 of the present application specifically showing the positional relationship between the inserting platform, the first magnet, the thermal pad and the convex ring;

[0047] Figure 5 is a structural schematic diagram of Embodiment 2 of the present application specifically showing the positional relationship between the plug post, the second magnet and the annular groove;

[0048] Figure 6 is a structural schematic diagram of Embodiment 2 of the present application specifically showing the position relationship of the heat sink;

[0049] Figure 7 It is a structural schematic diagram of Example 2 of the present application that specifically shows the position relationship of the positioning rods.

[0050] Figure numerals: 1. conventional camera lens group; 2. semi-transparent mirror; 3. reflector; 4. conventional photosensitive chip; 5. event photosensitive chip; 6. sensor circuit substrate; 7. signal processing circuit substrate; 8. event camera bus; 9. conventional camera bus; 10. image calibration system; 11. external interface; 12. thermoelectric cooler; 13. socket; 14. plug post; 15. first magnet; 16. second magnet; 17. thermal pad; 18. ring groove; 19. convex ring; 20. heat sink; 21. positioning rod. DETAILED DESCRIPTION

[0051] The following is combined with Figure 1 -Attached Figure 7 , further details of this application are given.

[0052] Embodiment 1:

[0053] The present application embodiment discloses a bionic camera system, referring to Figure 1 , Figure 2 as well as Figure 3 , including a conventional camera lens group 1, a semi-transparent mirror 2, a reflector 3, a conventional photosensitive chip 4, an event photosensitive chip 5, a sensor circuit substrate 6, a signal processing circuit substrate 7, an event camera bus 8, a conventional camera bus 9 and an external interface 11.

[0054] The conventional camera lens group 1 and the semi-transparent mirror 2 are sequentially installed in the camera along the direction of light irradiation, and the reflector 3 is installed directly above the semi-transparent mirror 2. The 90° refractor is usually realized by a prism or a pentaprism, and the 90° refractor refracts through the long side, and the semi-transparent mirror 2 is installed vertically at 45°.

[0055] The splitting ratio of the semi-transparent mirror 2 can be adjusted accordingly according to the requirements of the application scenario. Conventionally, the event camera has a high dynamic range, so the splitting ratio can be low.

[0056] The sensor circuit substrate 6 is located on the side of the semi-transparent mirror 2 and the reflector 3 away from the conventional camera lens group 1, and is installed in the camera along the vertical direction. The event photosensitive chip 5 and the conventional photosensitive chip 4 are installed in parallel on the side of the sensor circuit substrate 6 close to the semi-transparent mirror 2 and the reflector 3, and the conventional photosensitive chip 4 and the event photosensitive chip 5 correspond to the semi-transparent mirror 2 and the reflector 3 respectively.

[0057] The specific installation positions of the conventional photosensitive chip 4 and the event photosensitive chip 5 on the sensor circuit substrate 6 can be exchanged according to specific installation requirements. The two chips are arranged in parallel left and right or up and down and are located on the same circuit substrate.

[0058] The signal processing circuit substrate 7 is located on the side of the sensor circuit substrate 6 away from the conventional photosensitive chip 4 and the event photosensitive chip 5, and the signal processing circuit substrate 7 is kept parallel to the sensor circuit substrate 6, and is also installed in the camera in the vertical direction. The event camera bus 8 and the conventional camera bus 9 are connected between the sensor circuit substrate 6 and the signal processing circuit substrate 7. The event camera bus 8 is used to connect the event camera to the signal processing circuit substrate 7, and the conventional camera bus 9 is used to connect the conventional camera to the signal processing circuit substrate 7.

[0059] The event camera bus 8 and the conventional camera bus 9 contain data lines and trigger lines. The two trigger lines are connected through the sensor circuit substrate 6 and the signal processing circuit substrate 7. A clock generator is installed on the sensor circuit substrate 7. The clock generator can effectively ensure that the sensor circuit substrate 6 and the signal processing circuit substrate 7 are driven by the same clock source to acquire data. The same clock source is responsible for giving the output images on the sensor circuit substrate 6 and the signal processing circuit substrate 7 a timestamp under the same clock source, which facilitates the alignment of the image time axis, and can effectively ensure the time synchronization of the sensor circuit substrate 6 and the signal processing circuit substrate 7. At the same time, the clock signal generated by the clock generator needs to have high stability to ensure reliable operation of the system.

[0060] Reference Figure 1 At the same time, an image calibration system 10 is added to the side of the signal processing circuit substrate 7 close to the sensor circuit substrate 6. The image calibration system 10 ensures that the angle of superposition of the two sensor images remains consistent and the pixel-by-pixel coordinates of the two sensors are aligned. At the same time, the image calibration system 10 is synchronized with the timestamps on the two sensors, which is beneficial to ensure the imaging quality of the image.

[0061] An external interface 11 is installed on a side of the signal processing circuit substrate 7 away from the image calibration system 10 , and is responsible for outputting the calibrated image to the external system.

[0062] When used specifically, after the incident light enters the camera, it is directed to the semi-transparent mirror 2 through the conventional camera lens group 1, part of the light passes through the semi-transparent mirror 2 and directly directed to the conventional photosensitive chip 4, and part of the light is vertically reflected upward by the semi-transparent mirror 2 to the reflector 3, and then reflected by the reflector 3 to the event photosensitive chip 5. The event photosensitive chip 5 and the conventional photosensitive chip 4 transmit signals through the corresponding bus, and after correction by the image calibration system 10, the signals are transmitted to the signal processing circuit substrate 7.

[0063] This optical path design method, using the semi-transparent mirror 2 and the reflector 3, can ensure that the event photosensitive chip 5 and the conventional photosensitive chip 4 perceive the image of the same scene, avoiding the image parallax caused by the misaligned installation of the sensors, and thus achieving the sensor circuit substrate 6 and the signal processing circuit substrate 7 to share the same optical axis.

[0064] By using the semi-transparent mirror 2 and the reflector 3, the light path is divided into two equal light paths, which can effectively ensure that the conventional photosensitive chip 4 and the event photosensitive chip 5 obtain images at the same time and on the same optical axis;

[0065] At the same time, the conventional photosensitive chip 4 and the event photosensitive chip 5 are arranged on the same circuit substrate, that is, the direction of light travel and the Z-axis direction remain consistent, which also effectively guarantees the SMT patch position relationship of the two photosensitive chips, thereby providing favorable conditions for the subsequent image alignment, correction, and matching of the two images, which is beneficial to ensuring the imaging quality of the subsequent two images.

[0066] Moreover, the conventional photosensitive chip 4 and the event photosensitive chip 5 are arranged on the same circuit substrate. Even if the circuit substrate is offset, the two photosensitive chips can still maintain the same imaging angle. This can effectively avoid the angle deviation between the conventional photosensitive chip 4 and the event photosensitive chip 5, and further ensure that the imaging quality will be better.

[0067] In summary:

[0068] The sensor circuit substrate 6 and the signal processing circuit substrate 7 are driven by the same clock source to acquire data, thereby effectively ensuring that the timestamps of the two output images are of the same source, and that the images output by the external interface are orderly on the time axis;

[0069] At the same time, the image calibration system 10 ensures that the angle of the superposition of the two sensor images is consistent and the pixel-by-pixel coordinates of the two sensors are aligned. At the same time, the image calibration system 10 is synchronized with the timestamps on the two sensors, which is beneficial to ensure the imaging quality of the image;

[0070] The use of the semi-transparent mirror 2 and the reflector 3 can ensure that the event photosensitive chip 5 and the conventional photosensitive chip 4 perceive the image of the same scene, thereby avoiding the image parallax caused by the misaligned installation of the sensors, and thus achieving the sensor circuit substrate 6 and the signal processing circuit substrate 7 to share the same optical axis;

[0071] Placing the conventional photosensitive chip 4 and the event photosensitive chip 5 on the same circuit substrate effectively simplifies the positional relationship calibration process of the conventional photosensitive chip 4 and the event photosensitive chip 5, from the original seven degrees of freedom calibration (X, Y, Z translation, and Roll, Pitch, Yaw rotation angles, and a magnification U) to three degrees of freedom calibration (position translation of the two photosensitive chips (Y) and rotation angle (ROLL) on the plane of the sensor circuit board, and magnification (U)), greatly simplifying the calibration complexity.

[0072] After meeting the above four technical requirements, the embodiment of the present application can realize a bionic human eye camera image imaging system, so that the camera has the characteristics of high color restoration of static images, high dynamic capture capability and low data delay.

[0073] Embodiment 2:

[0074] Further, refer to Figure 3 A thermoelectric cooler 12 is provided on one side of the sensor circuit substrate 6 close to the signal processing circuit substrate 7. When the sensor inside the camera is exposed for a long time, it will generate a certain amount of heat, which will gradually cause a temperature difference inside the camera. The temperature change will affect the color reproduction of the camera image. By using the thermoelectric cooler 12, the sensor temperature can be effectively kept stable, thereby ensuring the accuracy and consistency of the color, which is beneficial to ensuring the imaging quality of the camera. At the same time, a stable temperature helps reduce the wear of electronic components, thereby extending the service life of the camera. In a high temperature environment, the thermoelectric cooler 12 can help the camera maintain a normal operating temperature, ensuring that the camera can operate stably under extreme conditions.

[0075] Before installing the thermoelectric cooler 12, the size, shape and corresponding power of the thermoelectric cooler 12 must be determined to fit the internal space of the camera and meet the heat dissipation requirements. The thermoelectric cooler 12 needs to be connected to the power supply and control system of the camera through wires. Specifically, during installation, the thermoelectric cooler 12 is connected to the power supply and control system of the camera through corresponding wires.

[0076] Specifically, refer to Figure 4 and Figure 5, a plug-in platform 13 is welded in the horizontal direction on one side of the sensor circuit substrate 6 close to the signal processing circuit substrate 7. The plug-in platform 13 is in the shape of a rectangular parallelepiped, the inside of the plug-in platform 13 is hollow, and the side of the plug-in platform 13 away from the sensor circuit substrate 6 is open. A plug-in column 14 is integrally formed on the side of the thermoelectric cooler 12 connected to the sensor circuit substrate 6, and the plug-in column 14 is adapted to the plug-in platform 13. Specifically, when the thermoelectric cooler 12 is installed on the sensor circuit substrate 6, the plug-in column 14 can be plugged into the corresponding plug-in platform 13. The plug-in platform 13 and the plug-in column 14 are used to set the thermoelectric cooler 12 and the sensor circuit substrate 6 to a plug-in assembly mode, which is convenient for installation and disassembly and maintenance.

[0077] Further, refer to Figure 4 and Figure 5 A first magnet 15 is embedded at the inner bottom of the plug-in platform 13, and a second magnet 16 is embedded at the end of the plug-in column 14. Specifically, when the plug-in column 14 is plugged into the corresponding plug-in platform 13, the first magnet 15 at the inner bottom of the plug-in platform 13 is magnetically connected to the second magnet 16 at the end of the plug-in column 14. The first magnet 15 and the second magnet 16 can further enhance the stability of the connection between the sensor circuit substrate 6 and the thermoelectric cooler 12.

[0078] In this embodiment, the number of the sockets 13 and the number of the pins 14 are both multiple, and the multiple sockets 13 are evenly distributed on the sensor circuit substrate 6. The number of the pins 14 is consistent with that of the sockets 13, and the multiple pins 14 are evenly distributed on the thermoelectric cooler 12. The number of the sockets 13 and the number of the pins 14 is multiple, which is conducive to further ensuring the stability of the connection between the sensor circuit substrate 6 and the thermoelectric cooler 12.

[0079] Further, refer to Figure 4 and Figure 5 A thermal pad 17 is bonded to one side of the thermoelectric cooler 12 close to the sensor circuit substrate 6 through a corresponding adhesive. The thermal pad 17 can effectively increase the heat conduction between the sensor circuit substrate 6 and the thermoelectric cooler, and the thermal pad 17 can effectively ensure that the contact pressure between the thermoelectric cooler 12 and the sensor circuit substrate 6 is uniform, so as to achieve optimal heat transfer between the sensor circuit substrate 6 and the thermoelectric cooler 12.

[0080] Specifically, when the thermoelectric cooler 12 is plugged into the sensor circuit substrate 6 , the thermal pad 17 on the thermoelectric cooler 12 is pressed against the sensor circuit substrate 6 .

[0081] Specifically, refer to Figure 4 and Figure 5The thermoelectric cooler 12 is provided with an annular groove 18 along its circumference, and a convex ring 19 is integrally formed on the side of the thermal pad 17 close to the thermoelectric cooler 12. Specifically, when the thermal pad 17 is installed on the thermoelectric cooler 12, a corresponding adhesive is filled into the annular groove 18 on the thermoelectric cooler 12, and then the convex ring 19 on the thermal pad 17 is embedded in the annular groove 18. The convex ring 19 is bonded into the annular groove 18, and the convex ring 19 is further limited by the annular groove 18, so that the stability of the thermal pad 17 installed on the thermoelectric cooler 12 can be further enhanced.

[0082] At the same time, refer to Figure 4 , Figure 5 as well as Figure 6 A plurality of heat sinks 20 are embedded on the side of the signal processing circuit substrate 7 away from the sensor circuit substrate 6, and the heat sinks 20 are evenly spaced and distributed on the thermoelectric cooler 12. The heat sink 20 is installed on the side of the thermoelectric cooler 12 away from the thermal pad 17, and the heat sink 20 can quickly and effectively take away the heat from the thermoelectric cooler 12, so as to effectively improve the efficiency of heat exchange between the sensor circuit substrate 6 and the thermoelectric cooler 12.

[0083] Further, refer to Figure 7 A positioning rod 21 is provided between the sensor circuit substrate 6 and the signal processing circuit substrate 7 in a direction perpendicular to the two. A plurality of positioning rods 21 are provided, and the plurality of positioning rods 21 are symmetrically distributed on the left and right sides of the sensor circuit substrate 6 and the signal processing circuit substrate 7. The positioning rods 21 can effectively enhance the stability of the connection between the sensor circuit substrate 6 and the signal processing circuit substrate 7. At the same time, the positioning rods 21 can make the sensor circuit substrate 6 and the signal processing circuit substrate 7 as a whole, which enables the sensor circuit substrate 6 and the signal processing circuit substrate 7 to always remain parallel, that is, the two can always maintain the same light-sensing angle, which is beneficial to ensure the imaging quality of the camera.

[0084] The implementation principle of a bionic camera system in the embodiment of the present application is as follows:

[0085] The sensor circuit substrate 6 and the signal processing circuit substrate 7 are driven by the same clock source to acquire data, thereby effectively ensuring the time synchronization of the sensor circuit substrate 6 and the signal processing circuit substrate 7;

[0086] At the same time, the image calibration system 10 ensures that the angle of the superposition of the two sensor images is consistent and the pixel-by-pixel coordinates of the two sensors are aligned. At the same time, the image calibration system 10 is synchronized with the timestamps on the two sensors, which is beneficial to ensure the imaging quality of the image;

[0087] The use of the semi-transparent mirror 2 and the reflector 3 can ensure that the event photosensitive chip 5 and the conventional photosensitive chip 4 sense the same light source, thereby achieving that the sensor circuit substrate 6 and the signal processing circuit substrate 7 can share the same optical axis;

[0088] The conventional photosensitive chip 4 and the event photosensitive chip 5 are arranged on the same circuit substrate, which effectively ensures that the optical path is equal, that is, the direction of light travel and the Z-axis direction remain consistent, and also effectively ensures the SMT patch position relationship of the two photosensitive chips, thereby providing favorable conditions for the subsequent image alignment, correction, and matching of the two-way images, which is conducive to ensuring the imaging quality of the subsequent two-way images. And the conventional photosensitive chip 4 and the event photosensitive chip 5 are arranged on the same circuit substrate, even if the circuit substrate is offset, the two photosensitive chips can still maintain the same imaging angle, which can effectively avoid the angle deviation between the conventional photosensitive chip 4 and the event photosensitive chip 5, and further ensure that the imaging quality will be better.

[0089] After meeting the above four technical requirements, the embodiment of the present application can realize a bionic human eye camera image imaging system, so that the camera has the characteristics of high color restoration of static images, high dynamic capture capability and low data delay.

[0090] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A bionic camera system, characterized in that: It comprises a conventional camera lens group (1), a semi-transparent mirror (2), a reflector (3), a conventional photosensitive chip (4), an event photosensitive chip (5), a sensor circuit substrate (6), a signal processing circuit substrate (7), an event camera bus (8) and a conventional camera bus (9); The conventional camera lens group (1) and the semi-transparent mirror (2) are sequentially installed in the camera along the direction of light irradiation, and the reflector (3) is installed directly above the semi-transparent mirror (2); The sensor circuit substrate (6) is located on a side of the semi-transparent mirror (2) and the reflective mirror (3) away from the conventional camera lens group (1); The conventional photosensitive chip (4) and the event photosensitive chip (5) are mounted in parallel on a side of the sensor circuit substrate (6) close to the semi-transparent mirror (2) and the reflector (3), and the conventional photosensitive chip (4) and the event photosensitive chip (5) are used to receive light transmitted through the semi-transparent mirror (2) and the reflector (3); The signal processing circuit substrate (7) is located on a side of the sensor circuit substrate (6) away from the conventional photosensitive chip (4) and the event photosensitive chip (5); The sensor circuit substrate (6) and the signal processing circuit substrate (7) are driven by the same clock source to acquire data; The event camera bus (8) and the conventional camera bus (9) are connected between the sensor circuit substrate (6) and the signal processing circuit substrate (7); the signal processing circuit substrate (7) is provided with an image calibration system (10); the event camera bus (8) and the conventional camera bus (9) are used to input images on the conventional photosensitive chip (4) and the event photosensitive chip (5) into the image calibration system (10) for calibration; An external interface (11) is installed on a side of the signal processing circuit substrate (7) away from the image calibration system (10).

2. A bionic camera system according to claim 1, characterized in that: A thermoelectric cooler (12) is provided on one side of the sensor circuit substrate (6) close to the signal processing circuit substrate (7).

3. A bionic camera system according to claim 2, characterized in that: A plug-in platform (13) is fixed in the horizontal direction on one side of the sensor circuit substrate (6) close to the signal processing circuit substrate (7), and a plug-in column (14) is integrally formed on the side of the thermoelectric cooler (12) connected to the sensor circuit substrate (6), and the plug-in column (14) is plug-connected to the plug-in platform (13).

4. A bionic camera system according to claim 3, characterized in that: A first magnet (15) is embedded at the inner bottom of the insertion platform (13), and a second magnet (16) is embedded at the end of the insertion column (14); after the insertion column (14) is inserted into the insertion platform (13), the first magnet (15) and the second magnet (16) are connected by magnetic attraction.

5. The bionic camera system according to claim 2, characterized in that: A heat-conducting pad (17) is provided on one side of the thermoelectric cooler (12) close to the sensor circuit substrate (6).

6. A bionic camera system according to claim 5, characterized in that: The thermoelectric cooler (12) is provided with an annular groove (18) along its circumference, and a convex ring (19) is integrally formed on a side of the thermal pad (17) close to the thermoelectric cooler (12), and the convex ring (19) is embedded in the annular groove (18).

7. The bionic camera system according to claim 6, characterized in that: A plurality of heat sinks (20) are embedded on a side of the thermoelectric cooler (12) away from the sensor circuit substrate (6), and the plurality of heat sinks (20) are evenly distributed on the thermoelectric cooler (12) at intervals.

8. The bionic camera system according to claim 1, characterized in that: A positioning rod (21) is provided between the sensor circuit substrate (6) and the signal processing circuit substrate (7) in a direction perpendicular to the two. The positioning rod (21) is provided in plurality and the plurality of positioning rods (21) are symmetrically distributed on the left and right sides of the sensor circuit substrate (6) and the signal processing circuit substrate (7).

Images