Display panel

Abstract

The present application discloses a display panel comprising a display area and a fan-out wiring area located on at least one side of the display area. The display panel comprises a substrate, a first inorganic encapsulation layer, an organic encapsulation layer, a second inorganic encapsulation layer, and a polarizer, which are stacked in sequence. The portion of the first inorganic layer located in the fan-out wiring area and the portion of the second inorganic layer located in the fan-out wiring area are stacked to form a double-layer structure. The double-layer structure includes an encapsulation portion and an edge portion. The edge portion is located on a side of the encapsulation portion away from the display area. The thickness of the edge portion decreases in a direction away from the encapsulation portion. The ratio of the thickness of the edge portion to the thickness of the encapsulation portion is less than or equal to 0.9. When the ambient temperature is within the range of 0°C to 45°C and 80°C to 100°C, the orthographic projection of the side surface of the polarizer on the substrate is located outside the orthographic projection of the edge portion on the substrate. The present application can improve the encapsulation effect of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel. Background Art

[0002] An organic light-emitting diode (OLED) display panel consists of a driver backplane, an organic light-emitting layer, an encapsulation layer, and a polarizer. Because the organic light-emitting layer's materials are highly susceptible to corrosion by water and oxygen, the encapsulation layer must be highly effective. Traditionally, the encapsulation layer has a three-layer structure: an inorganic encapsulation layer, an organic encapsulation layer, and an inorganic encapsulation layer. The inorganic encapsulation layer provides superior protection against water and oxygen.

[0003] However, in the actual process, the edge of the inorganic encapsulation layer has poor film quality. Under the action of external loads, the edge of the inorganic encapsulation layer is prone to cracks and peeling. The test results of the simulated stress cloud map show that the external load is mainly contributed by the boundary of the polarizer (POL). In the display panel, the boundary of the polarizer overlaps with the edge of the inorganic encapsulation layer. At this time, the structure of the display panel has a large mutation at the boundary of the polarizer, and the mutation is often accompanied by the generation of stress concentration. Therefore, when the large stress area overlaps with the edge area of ​​the inorganic encapsulation layer with poor film quality, the risk of cracks and peeling of the inorganic encapsulation layer will increase, resulting in a reduction in the encapsulation effect of the display panel.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a display panel to improve the packaging effect of the display panel.

[0006] To solve the above problems, the technical solutions of this application are as follows:

[0007] In a first aspect, the present application provides a display panel comprising a display area and a fan-out wiring area located on at least one side of the display area, the display panel comprising:

[0008] substrate;

[0009] a first inorganic encapsulation layer, disposed on one side of the substrate;

[0010] an organic encapsulation layer, disposed on a side of the first inorganic encapsulation layer away from the substrate;

[0011] a second inorganic encapsulation layer, disposed on a side of the first inorganic encapsulation layer away from the substrate and covering the organic encapsulation layer; and

[0012] a polarizer, disposed on a side of the second inorganic encapsulation layer away from the substrate;

[0013] wherein a portion of the first inorganic layer located in the fan-out wiring area and a portion of the second inorganic layer located in the fan-out wiring area are stacked to form a double-layer structure, the double-layer structure comprising an encapsulation portion and an edge portion, the edge portion being located on a side of the encapsulation portion away from the display area, the thickness of the edge portion decreasing in a direction away from the encapsulation portion, and a ratio of the thickness of the edge portion to the thickness of the encapsulation portion being less than or equal to 0.9;

[0014] When the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius and 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located outside the orthographic projection of the edge portion on the substrate.

[0015] In one embodiment of the present application, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side of the polarizer on the substrate is located on the side where the orthographic projection of the edge portion on the substrate is away from the orthographic projection of the packaging portion on the substrate.

[0016] In one embodiment of the present application, when the ambient temperature is in the range of 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side of the polarizer on the substrate is located on the side where the orthographic projection of the edge portion on the substrate is close to the orthographic projection of the packaging portion on the substrate.

[0017] In one embodiment of the present application, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located within the range of the orthographic projection of the packaging part on the substrate.

[0018] In one embodiment of the present application, the display panel further includes a retaining wall structure, the retaining wall structure is provided on the substrate and is located in the fan-out wiring area, and the packaging portion covers the retaining wall structure;

[0019] When the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located outside the orthographic projection of the retaining wall structure on the substrate.

[0020] In one embodiment of the present application, the retaining wall structure includes:

[0021] a first retaining wall, the first retaining wall being located between the packaging portion and the substrate; and

[0022] a second retaining wall, the second retaining wall being arranged at the same level as the first retaining wall and spaced apart from each other, the second retaining wall being located on a side of the first retaining wall close to the display area;

[0023] When the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located outside the orthographic projection of the first retaining wall on the substrate; the orthographic projection of the side surface of the polarizer on the substrate is located outside the orthographic projection of the second retaining wall on the substrate.

[0024] In one embodiment of the present application, the substrate includes a substrate and an inorganic film layer provided on the substrate;

[0025] The display panel further includes an organic film layer, the organic film layer being disposed on the inorganic film layer, the portion of the organic film layer located in the fan-out wiring area including the first retaining wall, the second retaining wall, and a flat portion, the flat portion being disposed on a side of the first retaining wall away from the second retaining wall, and the flat portion being spaced apart from the first retaining wall;

[0026] The packaging unit includes:

[0027] a first sub-portion, provided on the flat portion and connected to the edge portion;

[0028] a second sub-portion, disposed between the first retaining wall and the flat portion, wherein a side of the second sub-portion close to the edge portion is connected to the first sub-portion, and a bottom of the second sub-portion is connected to the inorganic film layer; and

[0029] a third sub-section connected to a side of the second sub-section away from the edge portion and covering the first retaining wall;

[0030] When the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located within the range of the orthographic projection of the first sub-portion on the substrate.

[0031] In one embodiment of the present application, when the ambient temperature is in the range of 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located within the range of the orthographic projection of the second sub-portion on the substrate.

[0032] In one embodiment of the present application, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius and 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side of the polarizer on the substrate is located on the side of the orthographic projection of the second retaining wall on the substrate away from the orthographic projection of the edge portion on the substrate.

[0033] In one embodiment of the present application, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius and 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side of the polarizer on the substrate is located between the orthographic projection of the second retaining wall on the substrate and the orthographic projection of the first retaining wall on the substrate.

[0034] In the present application, a double-layer stack is formed by stacking a portion of a first inorganic encapsulation layer located in the fan-out wiring area and a portion of a second inorganic encapsulation layer located in the fan-out wiring area. The double-layer stack includes a packaging portion and an edge portion. The packaging portion is used to encapsulate the fan-out wiring area. The edge portion is located on the side of the packaging portion away from the display area, and the thickness of the edge portion is relatively thin and the film quality is relatively poor. In traditional display panels, the boundary of the polarizer overlaps with the edge portion of the double-layer stack, resulting in stress concentration on the edge portion with poor film quality, making the edge portion very prone to cracks, affecting the packaging effect of traditional display panels. In the display panel of the present application, through structural adjustment, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius and 80 degrees Celsius to 100 degrees Celsius, the boundary of the polarizer is located outside the edge portion, so that the boundary of the polarizer does not overlap with the edge portion, avoiding stress concentration on the edge portion with poor film quality, thereby preventing cracks in the edge portion and improving the packaging effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic diagram of the first embodiment of the display panel of the present application when the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius;

[0036] Figure 2 is a schematic diagram of the first embodiment of the display panel of the present application when the ambient temperature is within the range of 80 degrees Celsius to 100 degrees Celsius;

[0037] Figure 3 is a schematic diagram of the second embodiment of the display panel of the present application when the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius;

[0038] Figure 4 is a schematic diagram of the second embodiment of the display panel of the present application when the ambient temperature is within the range of 80 degrees Celsius to 100 degrees Celsius;

[0039] Figure 5 is a schematic diagram of the third embodiment of the display panel of the present application when the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius;

[0040] Figure 6 FIG. 1 is a schematic diagram of the third embodiment of the display panel of the present application when the ambient temperature is within the range of 80 degrees Celsius to 100 degrees Celsius. DETAILED DESCRIPTION

[0041] The meanings of the terms used in this specification and claims correspond to those commonly understood by persons of ordinary skill in the art to which this application belongs. The terms used in this specification and claims are intended solely to facilitate the description and understanding of this application and are not intended to limit this application to the narrow interpretations of the specific terms used in the specification and claims.

[0042] See also Figure 1 The present application proposes a display panel 100 comprising a display area AA and a fan-out wiring area NA located on at least one side of the display area AA. The display panel 100 includes a substrate 10, a first inorganic encapsulation layer 21, an organic encapsulation layer 25, a second inorganic encapsulation layer 22, and a polarizer 30.

[0043] The first inorganic encapsulation layer 21 is disposed on one side of the substrate 10. The organic encapsulation layer 25 is disposed on the side of the first inorganic encapsulation layer 21 away from the substrate 10. The second inorganic encapsulation layer 22 is disposed on the side of the first inorganic encapsulation layer 21 away from the substrate 10 and covers the organic encapsulation layer 25. The polarizer 30 is disposed on the side of the second inorganic encapsulation layer 22 away from the substrate 10.

[0044] The portion of the first inorganic layer located in the fan-out wiring area NA and the portion of the second inorganic layer located in the fan-out wiring area NA are stacked to form a double-layer structure 20. Double-layer structure 20 includes an encapsulation portion 23 and an edge portion 24. Edge portion 24 is located on a side of encapsulation portion 23 away from display area AA. The thickness of edge portion 24 decreases as it moves away from encapsulation portion 23. The ratio of the thickness of edge portion 24 to the thickness of encapsulation portion 23 is less than or equal to 0.9.

[0045] When the ambient temperature is within the range of 0°C to 45°C and 80°C to 100°C, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located outside the orthographic projection of the edge portion 24 on the substrate 10 .

[0046] In the present application, the double-layer stack 20 is formed by stacking the portion of the first inorganic encapsulation layer 21 located in the fan-out wiring area NA and the portion of the second inorganic encapsulation layer 22 located in the fan-out wiring area NA. The double-layer stack 20 includes a packaging portion 23 and an edge portion 24. The packaging portion 23 is used to encapsulate the fan-out wiring area NA. The edge portion 24 is located on the side of the packaging portion 23 away from the display area AA, and the thickness of the edge portion 24 is relatively thin and the film quality is poor. In traditional display panels, the boundary of the polarizer 30 overlaps with the edge portion 24 of the double-layer stack 20, resulting in stress concentration on the edge portion 24 with poor film quality, making the edge portion 24 very prone to cracks, affecting the packaging effect of traditional display panels. In the display panel 100 of the present application, through structural adjustment, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius and 80 degrees Celsius to 100 degrees Celsius, the boundary of the polarizer 30 is located outside the edge portion 24, so that the boundary of the polarizer 30 and the edge portion 24 do not overlap, avoiding stress concentration on the edge portion 24 with poor film quality, thereby preventing cracks from occurring in the edge portion 24 and improving the packaging effect of the display panel 100.

[0047] Optionally, an optical adhesive 26 is filled between the polarizer 30 and the second inorganic encapsulation layer 22 .

[0048] Optionally, a touch layer may be provided between the optical adhesive 26 and the second inorganic encapsulation layer 22 to provide the display panel with a touch function.

[0049] In the process of the display panel 100, the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 are formed by chemical vapor deposition. The main part of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 formed by chemical vapor deposition has a uniform thickness, but the thickness of the peripheral part located outside the main part gradually decreases in the direction away from the main part, resulting in poor film quality of the peripheral part of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22. In the present application, the edge portion 24 of the double-layer stack 20 is the peripheral portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22. The encapsulation portion 23 of the double-layer stack is the main part of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 located in the fan-out wiring area NA. The thickness of the edge portion 24 of the double-layer stack 20 decreases in the direction away from the encapsulation portion 23, and the ratio of the thickness of the edge portion 24 to the thickness of the encapsulation portion 23 is less than 0.9. Optionally, the ratio of the thickness of the edge portion 24 close to the packaging portion 23 to the thickness of the packaging portion 23 is in the range of 0.9 to 0.8. The thickness of the edge portion 24 away from the packaging portion 23 is less than 0.3.

[0050] It should be understood that the polarizers of the present application mainly include two types: iodine-based polarizers 30 and dye-based polarizers 30. Among them, the iodine-based polarizers 30 are made by stretching polyvinyl alcohol doped with iodine molecules, and the dye-based polarizers 30 are made by stretching polyvinyl alcohol doped with dichroic organic dyes.

[0051] However, polarizers are easily affected by ambient temperature and humidity. In high temperature and high humidity environments, polarizers will shrink.

[0052] After the display panel 100 is manufactured, it undergoes several tests. One of these tests is a high-temperature, high-humidity test. The test environment parameters for this test are a temperature of 85 degrees Celsius and a humidity of 85%. In this high-temperature, high-humidity environment, the polarizer 30 shrinks compared to normal temperature. The specific amount of shrinkage depends on the material and dimensions of the polarizer 30.

[0053] Optional, see Figure 1 In the first embodiment, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located on the side of the orthographic projection of the edge portion 24 on the substrate 10 away from the orthographic projection of the packaging portion 23 on the substrate 10.

[0054] When the ambient temperature is between 0 degrees Celsius and 45 degrees Celsius, the shrinkage of the polarizer 30 is small. At this time, the polarizer 30 completely covers the double-layer stack 20, and the orthographic projection of the side 31 of the polarizer 30 on the substrate 10 does not overlap with the orthographic projection of the edge 24 on the substrate 10. Since the side 31 of the polarizer 30 is a large stress area, this embodiment avoids stress concentration on the edge 24 with lower film strength by staggering the large stress area and the edge 24 with poor film quality of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22, thereby preventing cracks from occurring in the edge 24 with lower film strength. This embodiment can reduce the risk of cracks in the edge 24, prevent external water and oxygen from invading the interior of the display panel 100 through the cracks generated by the edge 24, and improve the encapsulation effect of the display panel 100.

[0055] Optional, see Figure 1 , section a is the length of the second retaining wall 42 along the cross-sectional direction, section b is the spacing between the first retaining wall 41 and the second retaining wall 42 along the cross-sectional direction, section c is the length of the first retaining wall 41 along the cross-sectional direction, section d is the spacing between the first retaining wall 41 and the flat portion 43 along the cross-sectional direction, section e is the length of the first sub-portion along the cross-sectional direction, section f is the length of the edge portion 24 along the cross-sectional direction, and section g is the length of the side surface 31 of the polarizer 30 protruding from the packaging portion 23 along the cross-sectional direction.

[0056] Optionally, since the side surface 31 of the polarizer 30 shrinks toward the display area AA as the ambient temperature rises, to prevent the orthographic projection of the side surface 31 of the polarizer 30 on the substrate from overlapping with the orthographic projection of the edge portion 24 on the substrate after the polarizer 30 shrinks, the length of at least one of the segments a, b, c, d, e, f, and g can be adjusted, thereby further improving the packaging effect of the display panel 100.

[0057] Optional, see Figure 1 In the first embodiment of the present application, when the ambient temperature is between 0 degrees Celsius and 45 degrees Celsius, the length of segment f is adjusted so that the length of segment f is less than the length of segment e. Since the length of segment f is the length of the edge portion 24 along the cross-sectional direction. The reduction in the length of segment f can prevent the side 31 of the polarizer 30 from overlapping with the edge portion 24 in a direction perpendicular to the plane of the substrate 10 after shrinkage during the process of rising ambient temperature, thereby avoiding stress concentration on the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, preventing cracks from occurring in the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, and improving the encapsulation effect of the display panel 100.

[0058] Optional, see Figure 1In the first embodiment of the present application, when the ambient temperature is between 0 degrees Celsius and 45 degrees Celsius, the length of the g segment is adjusted so that the length of the g segment is greater than the length of the f segment. Since the g segment is the length of the side surface 31 of the polarizer 30 protruding from the encapsulation portion 23 along the cross-sectional direction. The increase in the length of the g segment can prevent the side surface 31 of the polarizer 30 from overlapping with the edge portion 24 in a direction perpendicular to the plane of the substrate 10 after shrinkage during the process of rising ambient temperature, thereby avoiding stress concentration on the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, preventing cracks from occurring in the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, and improving the encapsulation effect of the display panel 100.

[0059] Optional, see Figure 1 In the first embodiment of the present application, when the ambient temperature is within the range of 0°C to 45°C, while the length of segment f remains unchanged, the length of at least one of segments b, d, and e is shortened, thereby relatively increasing the length of segment g. Due to the relatively increased length of segment g, as the ambient temperature rises, the side surface 31 of the polarizer 30 is prevented from overlapping with the edge portion 24 in a direction perpendicular to the plane of the substrate 10 after shrinkage, thereby avoiding stress concentration on the poorer film quality portions of the first and second inorganic encapsulation layers 21 and 22, preventing cracks from forming in the poorer film quality portions of the first and second inorganic encapsulation layers 21 and 22, and improving the encapsulation effect of the display panel 100.

[0060] Optional, see Figure 2 In the first embodiment, when the ambient temperature is in the range of 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located on the side of the orthographic projection of the edge portion 24 on the substrate 10 close to the orthographic projection of the packaging portion 23 on the substrate 10.

[0061] In a high temperature and high humidity test environment, the ambient temperature is in the range of 80 degrees Celsius to 100 degrees Celsius, and the humidity is in the range of 80% to 100%, and the polarizer 30 shrinks significantly. At this time, the polarizer 30 cannot cover the double-layer stack 20, and the side 31 of the polarizer 30 shrinks to overlap with the encapsulation portion 23 in a direction perpendicular to the plane where the substrate 10 is located. At this time, the orthographic projection of the side 31 of the polarizer 30 on the substrate 10 does not overlap with the orthographic projection of the edge portion 24 on the substrate 10. Since the side 31 of the polarizer 30 is a large stress area, this embodiment avoids stress concentration on the edge portion 24 with lower film strength by staggering the large stress area with the edge portion 24 of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, thereby preventing cracks from occurring in the edge portion 24 with lower film strength. This embodiment can reduce the risk of cracks in the edge portion 24 , prevent external water and oxygen from invading the interior of the display panel 100 through the cracks in the edge portion 24 , and improve the packaging effect of the display panel 100 .

[0062] Understandably, see Figure 2 , segment h is the length of the side surface 31 of the polarizer 30 that is retracted into one side of the packaging portion 23 along the cross-sectional direction.

[0063] Optional, see Figure 2 In the second embodiment of the present application, when the ambient temperature is within the range of 80 degrees Celsius to 100 degrees Celsius, the length of segment e is adjusted so that the length of segment e is greater than the length of segment h. Since the film quality of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 located in segment e is relatively strong, during the process of rising ambient temperature, the side surface 31 of the polarizer 30 can be prevented from overlapping with the first retaining wall 41 or the second retaining wall 42 in a direction perpendicular to the plane where the substrate 10 is located after shrinkage, thereby avoiding stress concentration on the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, preventing cracks from occurring in the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, and improving the encapsulation effect of the display panel 100.

[0064] Optionally, when the total length of segments a, b, c, d, and e remains unchanged, the length of at least one of segments b and d can be relatively reduced, and the length of segment e can be relatively increased to achieve the adjustment of the above embodiment.

[0065] Optional, see Figure 3 In the second embodiment, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located within the range of the orthographic projection of the packaging portion 23 on the substrate 10 .

[0066] When the ambient temperature is between 0 degrees Celsius and 45 degrees Celsius, the shrinkage of the polarizer 30 is small. At this time, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 overlaps with the orthographic projection of the encapsulation portion 23 on the substrate 10, and the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 does not overlap with the orthographic projection of the edge portion 24 on the substrate 10. Since the side surface 31 of the polarizer 30 is a large stress area, this embodiment avoids stress concentration on the edge portion 24 with lower film strength by staggering the large stress area with the edge portion 24 of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, thereby preventing cracks from occurring in the edge portion 24 with lower film strength. This embodiment can reduce the risk of cracks in the edge portion 24, prevent external water and oxygen from invading the interior of the display panel 100 through cracks generated by the edge portion 24, and improve the encapsulation effect of the display panel 100.

[0067] Optional, see Figure 3 In the second embodiment of the present application, the display panel 100 further includes a retaining wall structure. The retaining wall structure is disposed on the substrate 10 and is located in the fan-out wiring area NA. The encapsulation portion 23 covers the retaining wall structure. When the ambient temperature is within the range of 0°C to 45°C, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate is located outside the orthographic projection of the retaining wall structure on the substrate.

[0068] Since the organic encapsulation layer 25 of the present application is made by inkjet printing (IJP), the retaining wall structure provided in the fan-out wiring area NA is used to prevent the organic ink in the organic encapsulation layer 25 from overflowing, thereby improving the encapsulation effect. However, due to the provision of the retaining wall structure, the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 will have a slope on the surface of the retaining wall structure, resulting in the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 covering the surface of the retaining wall structure. The film quality of the portion of the film covering the retaining wall structure of the encapsulation portion 23 of the double-layer stack 20 is relatively low. Since the side 31 of the polarizer 30 is a large stress area, this embodiment avoids stress concentration on the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with lower film strength by staggering the large stress area with the encapsulation portion 23 covering the retaining wall structure, thereby preventing cracks from occurring in the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with lower film strength. This embodiment can reduce the risk of cracks in the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 , prevent external water and oxygen from invading the interior of the display panel 100 through the cracks generated in the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 , and improve the encapsulation effect of the display panel 100 .

[0069] Optional, see Figure 3In the second embodiment of the present application, the retaining wall structure includes a first retaining wall 41 and a second retaining wall 42. The first retaining wall 41 is located between the encapsulation portion 23 and the substrate 10. The second retaining wall 42 is arranged on the same layer as the first retaining wall 41 and is spaced apart from the first retaining wall 41. The second retaining wall 42 is located on the side of the first retaining wall 41 close to the display area AA.

[0070] Optionally, when the ambient temperature is within a range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located outside the orthographic projection of the first retaining wall 41 on the substrate 10. The orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located outside the orthographic projection of the second retaining wall 42 on the substrate 10.

[0071] To further prevent overflow of the organic ink in the organic encapsulation layer 25, the retaining wall structure includes a first retaining wall 41 and a second retaining wall 42 spaced apart. Similarly, the first and second inorganic encapsulation layers 21 and 22 slope along the surfaces of the first and second retaining walls 41 and 42, resulting in poor film quality in the portions of the first and second inorganic encapsulation layers 21 and 22 covering the surfaces of the first and second retaining walls 41 and 42. Consequently, the film strength of the portions of the encapsulation portion 23 of the double-layer stack 20 covering the first and second retaining walls 41 and 42 is low. Because the side surface 31 of the polarizer 30 is a high-stress area, this embodiment avoids stress concentration on the portions of the first and second inorganic encapsulation layers 21 and 22 with lower film strength by staggering the high-stress area with the encapsulation portion 23 covering the first and second retaining walls 41 and 42, thereby preventing cracks in these portions. This embodiment can reduce the risk of cracks in the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 , prevent external water and oxygen from invading the interior of the display panel 100 through the cracks generated in the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 , and improve the encapsulation effect of the display panel 100 .

[0072] Optional, see Figure 3 In a second embodiment of the present application, the substrate includes a substrate and an inorganic film layer provided on the substrate.

[0073] Optionally, the substrate is a hard substrate, and the material of the substrate includes glass.

[0074] Optionally, the substrate is a flexible substrate, and the material of the substrate includes polyimide.

[0075] Optionally, the inorganic film layer is a wiring, and the wiring may be a data line or a power line, and the material of the wiring includes at least one of metal, alloy or transparent indium tin oxide.

[0076] Optionally, the inorganic film layer is an insulating layer, and the material of the insulating layer includes at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0077] Optionally, the display panel further includes an organic film layer. The organic film layer is disposed on the inorganic film layer. The portion of the organic film layer located in the fan-out routing area includes a first retaining wall, a second retaining wall, and a flat portion. The flat portion is disposed on a side of the first retaining wall away from the second retaining wall and is spaced apart from the first retaining wall.

[0078] Optionally, the material of the organic film layer is an organic material.

[0079] Optionally, the encapsulation portion includes a first sub-portion, a second sub-portion, and a third sub-portion. The first sub-portion is disposed on the flat portion and connected to the edge portion. The second sub-portion is disposed between the first retaining wall and the flat portion. The side of the second sub-portion close to the edge portion is connected to the first sub-portion, and the bottom of the second sub-portion is connected to the inorganic film layer. The third sub-portion is connected to the side of the second sub-portion away from the edge portion and covers the first retaining wall.

[0080] When the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located within the range of the orthographic projection of the first sub-portion on the substrate.

[0081] Since the edge portion 24 and the third sub-portion covering the surface of the first retaining wall 41 are the portions of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with relatively poor film quality. The first sub-portion is located between the edge portion 24 and the third sub-portion, and the first sub-portion is the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer with relatively strong film quality. In this embodiment, when the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius, in a direction perpendicular to the plane where the substrate 10 is located, by overlapping the side surface 31 of the polarizer 30 with the first sub-portion, the high stress area and the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with relatively poor film quality are offset, thereby avoiding stress concentration on the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with relatively low film strength, and preventing cracks from occurring in the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with relatively low film strength. This embodiment can reduce the risk of cracks in the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 , prevent external water and oxygen from invading the interior of the display panel 100 through cracks generated by the encapsulation portion 23 and cracks generated by the edge portion 24 , and improve the encapsulation effect of the display panel 100 .

[0082] In this embodiment, the flat portion 43 is used to improve the flatness of the film layer above it. Since external moisture and oxygen can penetrate the interior of the display panel 100 through the organic film layer, to improve the sealing effect of the display panel 100, the flat portion 43 of the organic film layer needs to be separated from the first barrier wall 41, and the first inorganic encapsulation layer 21 is connected to the inorganic film layer at the separation point. This prevents external moisture and oxygen from penetrating the interior of the display panel 100 through the continuous path formed by the flat portion 43 and the first barrier wall 41.

[0083] In this embodiment, a margin is provided for shrinkage of the polarizer 30 due to rising ambient temperature. As the ambient temperature increases from 0°C to 45°C and then to 80°C to 100°C, the side surface 31 of the polarizer 30 shrinks toward the display area AA. The orthographic projection of the shrinking side surface 31 of the polarizer 30 on the substrate 10 overlaps with the second sub-section with a higher film quality, thereby preventing the shrinking side surface 31 of the polarizer 30 from overlapping with the third sub-section with a lower film quality. This prevents stress concentration on the third sub-section with a lower film quality, which covers the first retaining wall 41, prevents cracks in the encapsulation portion 23, and improves the encapsulation performance of the display panel 100.

[0084] Optional, see Figure 3 In the second embodiment of the present application, the length of segment e is adjusted to be greater than that of segment h. Since the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 located in segment e have relatively strong film quality, the side surface 31 of the polarizer 30 can be prevented from overlapping with the first retaining wall 41 or the second retaining wall 42 in a direction perpendicular to the plane of the substrate 10, thereby avoiding stress concentration on the poorly filmed portions of the first and second inorganic encapsulation layers 21, 22, preventing cracks from forming in the poorly filmed portions of the first and second inorganic encapsulation layers 21, 22, and improving the encapsulation effect of the display panel 100.

[0085] Optionally, when the total length of segments a, b, c, d, and e remains unchanged, the length of at least one of segments b and d can be relatively reduced, and the length of segment e can be relatively increased to achieve the adjustment of the above embodiment.

[0086] Optional, see Figure 4 In the second embodiment of the present application, when the ambient temperature is in the range of 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is within the range of the orthographic projection of the second sub-portion on the substrate 10.

[0087] In a high temperature and high humidity test environment, the ambient temperature is in the range of 80 degrees Celsius to 100 degrees Celsius, and the humidity is in the range of 80% to 100%, and the polarizer 30 shrinks significantly. In the packaging portion, the first sub-section and the second sub-section are covered on a flat surface, so the film quality of the first sub-section and the second sub-section is relatively strong. The third sub-section slopes on the surface of the first retaining wall, so the film quality of the third sub-section is relatively poor. In this embodiment, the orthographic projection of the side surface 31 of the shrunk polarizer 30 on the substrate 10 does not overlap with the orthographic projection of the edge portion 24 on the substrate 10, and the orthographic projection of the side surface 31 of the shrunk polarizer 30 on the substrate 10 does not overlap with the orthographic projection of the third sub-section covered on the first retaining wall 41. Because the side surface 31 of the polarizer 30 is a high-stress area, this embodiment offsets the high-stress area from the edge portion 24 and the third sub-portion of the first and second inorganic encapsulation layers 21 and 22, where the film quality is relatively poor. This prevents stress concentration on the poor-quality portions of the first and second inorganic encapsulation layers 21 and 22, and prevents cracks from forming in the lower-strength portions of the first and second inorganic encapsulation layers 21 and 22. This embodiment reduces the risk of cracks forming in the portions of the first and second inorganic encapsulation layers 21 and 22 located in the fan-out routing area NA, prevents external water and oxygen from invading the interior of the display panel 100 through the cracks, and improves the encapsulation effect of the display panel 100.

[0088] Optional, see Figure 4 In the second embodiment of the present application, by adjusting the length of at least one of the e segment and the d segment, the sum of the length of the e segment and the length of the d segment (e+d) is greater than the length of the h segment. Since the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 located in the e segment and the d segment have a strong film quality, during the temperature rise process, the side surface 31 of the polarizer 30 can be prevented from overlapping with the first retaining wall 41 or the second retaining wall 42 in a direction perpendicular to the plane where the substrate 10 is located, thereby avoiding stress concentration on the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, preventing cracks from occurring in the portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, and improving the encapsulation effect of the display panel 100.

[0089] Optionally, when the total length of segments a, b, c, d, and e remains unchanged, the length of segment b can be relatively reduced, and the length of at least one of segments e and d can be relatively increased to achieve the adjustment of the above embodiment.

[0090] Optional, see Figure 5 In the third embodiment of the present application, when the ambient temperature is between 0 degrees Celsius and 45 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located on the side of the orthographic projection of the second retaining wall 42 on the substrate 10 away from the orthographic projection of the edge portion 24 on the substrate 10.

[0091] Because the side surface 31 of the polarizer 30 is a high-stress area, when the ambient temperature is between 0°C and 45°C, this embodiment staggers the high-stress area with the encapsulation portion 23 covering the second retaining wall 42 to avoid stress concentration on the portion of the encapsulation portion 23 with lower film strength, thereby preventing cracks from forming in the portion of the encapsulation portion 23 with lower film strength. This embodiment reduces the risk of cracks in the encapsulation portion 23, prevents external water and oxygen from invading the interior of the display panel 100 through cracks in the encapsulation portion 23, and improves the encapsulation effect of the display panel 100.

[0092] Optional, see Figure 5 By adjusting the length of at least one of segments a, b, c, d, and e, the sum of the lengths of segments a, b, c, d, and e (a+b+c+d+e) is made less than the length of segment h. Since the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 located on the side of segment a away from segment b have a stronger film quality, the side surface 31 of the polarizer 30 can be prevented from overlapping with the first retaining wall 41 or the second retaining wall 42 in a direction perpendicular to the plane of the substrate 10, thereby avoiding stress concentration on the poorer film quality portions of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22, preventing cracks from forming in the poorer film quality portions of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22, and improving the encapsulation effect of the display panel 100.

[0093] Optionally, the adjustment of the above embodiment can be achieved by reducing the length of at least one of segments b, d and e so that the sum of the lengths of segments a, b, c, d and e (a+b+c+d+e) is less than the length of segment h.

[0094] Optional, see Figure 6 In the third embodiment of the present application, when the ambient temperature is between 80 degrees Celsius and 100 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located on the side of the orthographic projection of the second retaining wall 42 on the substrate 10 away from the orthographic projection of the edge portion 24 on the substrate 10.

[0095] Because the side surface 31 of the polarizer 30 is a high-stress area, when the ambient temperature is between 80°C and 100°C, this embodiment staggers the high-stress area with the encapsulation portion 23 covering the second retaining wall 42 to avoid stress concentration on the portion of the encapsulation portion 23 with lower film strength, thereby preventing cracks from forming in the portion of the encapsulation portion 23 with lower film strength. This embodiment reduces the risk of cracks in the encapsulation portion 23, prevents external water and oxygen from invading the interior of the display panel 100 through cracks in the encapsulation portion 23, and improves the encapsulation effect of the display panel 100.

[0096] As the ambient temperature rises, the side surface of the polarizer 30 shrinks toward the display area AA, so the side surface 31 of the polarizer 30 always overlaps with the stronger portions of the first and second inorganic encapsulation layers 21, 22. This embodiment staggers the high-stress regions with the weaker portions of the first and second inorganic encapsulation layers 21, 22, thereby avoiding stress concentration on the weaker portions of the first and second inorganic encapsulation layers 21, 22 and preventing cracks from forming in the weaker portions of the encapsulation portion 23. This embodiment reduces the risk of cracks in the encapsulation portion 23, prevents external water and oxygen from invading the interior of the display panel 100 through cracks created by the encapsulation portion 23, and improves the encapsulation effect of the display panel 100.

[0097] Optional, see Figure 6 By adjusting the length of at least one of segments a, b, c, d, and e, the sum of the lengths of segments a, b, c, d, and e (a+b+c+d+e) is made less than the length of segment h. Since the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 located on the side of segment a away from segment b have a stronger film quality, during the process of rising ambient temperature, the side surface 31 of the polarizer 30 can be prevented from overlapping with the first retaining wall 41 or the second retaining wall 42 in a direction perpendicular to the plane of the substrate 10, thereby avoiding stress concentration on the poor film quality portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22, preventing cracks from occurring in the poor film quality portion of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22, and improving the encapsulation effect of the display panel 100.

[0098] Optionally, the adjustment of the above embodiment can be achieved by reducing the length of at least one of segments b, d and e so that the sum of the lengths of segments a, b, c, d and e (a+b+c+d+e) is less than the length of segment h.

[0099] At room temperatures between 0 and 45 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located on the side of the orthographic projection of the second retaining wall 42 on the substrate 10 that is away from the orthographic projection of the edge portion 24 on the substrate 10. At high temperatures between 80 and 100 degrees Celsius, the polarizer 30 shrinks, and the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 remains located on the side of the orthographic projection of the second retaining wall 42 on the substrate 10 that is away from the orthographic projection of the edge portion 24 on the substrate 10. Whether at high or room temperatures, the side surface 31 of the polarizer 30 does not overlap with the poorly-quality portions of the first and second inorganic encapsulation layers 21 and 22, thereby preventing cracks in the first and second inorganic encapsulation layers 21 and 22.

[0100] In the first, second, and third embodiments of the present application, the polarizer 30 of the first embodiment has a larger coverage area, which is conducive to encapsulating the film layer below the polarizer 30. The polarizer 30 of the third embodiment has a smaller coverage area, but the third embodiment is less affected by the ambient temperature, that is, the side surface 31 of the polarizer 30 will never overlap with the poorer film quality portions of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22. The second embodiment combines the advantages of the first and third embodiments, which can not only improve the encapsulation effect, but also reduce the degree to which the encapsulation effect of the display panel 100 is affected by the ambient temperature.

[0101] Optionally, in a fourth embodiment of the present application, when the ambient temperature is between 0 degrees Celsius and 45 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located between the orthographic projection of the second retaining wall 42 on the substrate 10 and the orthographic projection of the first retaining wall 41 on the substrate 10.

[0102] Optionally, in a fourth embodiment of the present application, when the ambient temperature is between 80 degrees Celsius and 100 degrees Celsius, the orthographic projection of the side surface 31 of the polarizer 30 on the substrate 10 is located between the orthographic projection of the second retaining wall 42 on the substrate 10 and the orthographic projection of the first retaining wall 41 on the substrate 10.

[0103] For display panels with non-narrow borders (for example, products such as laptop computers), in order to prevent overflow of the organic encapsulation layer 25, the distance between the first retaining wall 41 and the second retaining wall 42 can be increased. After the distance between the first retaining wall 41 and the second retaining wall 42 is increased, for certain polarizers 30 that have a low shrinkage amount with temperature changes, the positive projection of their side surface 31 on the substrate is always located between the first retaining wall 41 and the second retaining wall 42. Since the encapsulation portion 23 located between the first retaining wall 41 and the second retaining wall 42 is connected to the inorganic film layer below, the encapsulation portion 23 in this part does not climb and has better film quality. This can avoid stress concentration on the part of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, thereby preventing cracks from occurring in the part of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 22 with poor film quality, thereby improving the encapsulation effect of the display panel.

[0104] The above describes in detail the specific embodiments of the present application. The above embodiments disclosed in this application are merely preferred embodiments of the present application. Those skilled in the art will appreciate that many variations and improvements can be made without departing from the spirit of the present application. These variations and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display panel comprising a display area and a fan-out wiring area located on at least one side of the display area, characterized in that: include: A substrate, comprising a base and an inorganic film layer provided on the base; an organic film layer, the organic film layer being disposed on the inorganic film layer, the portion of the organic film layer located in the fan-out routing area comprising a first retaining wall, a second retaining wall, and a flat portion, the second retaining wall being spaced apart from the first retaining wall, the second retaining wall being located on a side of the first retaining wall close to the display area, the flat portion being located on a side of the first retaining wall away from the second retaining wall, and the flat portion being spaced apart from the first retaining wall; a first inorganic encapsulation layer, disposed on one side of the substrate; an organic encapsulation layer, disposed on a side of the first inorganic encapsulation layer away from the substrate; a second inorganic encapsulation layer, disposed on a side of the first inorganic encapsulation layer away from the substrate and covering the organic encapsulation layer; as well as a polarizer, disposed on a side of the second inorganic encapsulation layer away from the substrate; wherein a portion of the first inorganic encapsulation layer located in the fan-out wiring area and a portion of the second inorganic encapsulation layer located in the fan-out wiring area are stacked to form a double-layer structure, the double-layer structure comprising an encapsulation portion and an edge portion, the edge portion being located on a side of the encapsulation portion away from the display area, the thickness of the edge portion decreasing in a direction away from the encapsulation portion, the ratio of the thickness of the edge portion to the thickness of the encapsulation portion being less than or equal to 0.9, the encapsulation portion comprising at least a first sub-portion and a second sub-portion, the first sub-portion being provided on the flat portion and connected to the edge portion, the second sub-portion being provided between the first retaining wall and the flat portion, the side of the second sub-portion close to the edge portion being connected to the first sub-portion, and the bottom of the second sub-portion being connected to the inorganic film layer; When the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius and 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located outside the orthographic projection of the edge portion on the substrate, and one of the orthographic projection of the first sub-portion on the substrate, the orthographic projection of the second sub-portion on the substrate, the orthographic projection of the first retaining wall on the substrate, and the orthographic projection of the second retaining wall on the substrate overlaps with the orthographic projection of the side surface of the polarizer on the substrate.

2. The display panel according to claim 1, wherein When the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located within the range of the orthographic projection of the packaging portion on the substrate.

3. The display panel according to claim 1, wherein The packaging portion covers the first retaining wall and the second retaining wall; When the ambient temperature is in the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located outside the orthographic projection of the first retaining wall on the substrate; the orthographic projection of the side surface of the polarizer on the substrate is located outside the orthographic projection of the second retaining wall on the substrate.

4. The display panel according to claim 1, wherein: The second retaining wall is arranged on the same layer as the first retaining wall.

5. The display panel according to claim 1, wherein When the ambient temperature is within the range of 0 degrees Celsius to 45 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located within the range of the orthographic projection of the first sub-portion on the substrate.

6. The display panel according to claim 5, wherein: When the ambient temperature is within the range of 80 degrees Celsius to 100 degrees Celsius, the orthographic projection of the side surface of the polarizer on the substrate is located within the range of the orthographic projection of the second sub-section on the substrate.

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