A chip-based proximity sensor and methods of using the same

Abstract

The application relates to the technical field of sensors, in particular to a chip-based proximity sensor and a use method thereof, which adds an MCU and a software module in the circuit of the sensor, the MCU and the software module are used for calculating, comparing and storing the energy value of a signal generated by an LC oscillation circuit, the proximity sensor can be debugged for detecting the distance at any time during the production or use of the proximity sensor, especially after the glue is poured, and the accuracy of the debugging is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sensors, in particular to a chip-based proximity sensor and a use method thereof. BACKGROUND

[0002] With the popularity of automation, sensors are also used more and more, and proximity sensors are one of the commonly used sensors. There are two common technical solutions for implementing proximity sensors on the market: a separate piece technical solution and a chip technical solution. These two solutions have their own advantages and disadvantages, but they are both pure hardware solutions. The stability of the chip solution is superior, but the response frequency and cost of the separate piece solution are superior.

[0003] However, it is difficult to debug and detect the distance during the production or use of the existing sensor, especially for the sensor product after the glue is poured, and the accuracy of the existing sensor debugging is low.

[0004] Therefore, how to debug and detect the distance at any time during the production or use of the proximity sensor is a problem to be solved. SUMMARY

[0005] The present application provides a chip-based proximity sensor. By adding a high-speed chip and a software module in the circuit of the sensor, the distance can be debugged and detected at any time during the production or use of the proximity sensor, especially after the glue is poured, and the accuracy of the debugging is improved.

[0006] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0007] In a first aspect, the present application provides a chip-based proximity sensor, comprising:

[0008] The oscillation module 100 comprises an LC oscillation circuit, which is used to generate an oscillation signal when a metal object approaches the LC oscillation circuit.

[0009] The isolation module 200 comprises an isolation amplification circuit, which is used to isolate the oscillation signal to obtain a first signal.

[0010] The Hall module 300 comprises a Hall circuit, which is used to generate a second signal when a magnet approaches the Hall switch.

[0011] The chip module 400 comprises an MCU and a software unit, which is used to calculate the energy value of the first signal when the first signal is received, store the energy value in the Flash of the MCU when the second signal is received, and compare the currently stored energy value with the newly calculated energy value if a new first signal is received. If the newly calculated energy value is lower than the currently stored energy value, a third signal is generated and sent to the output module.

[0012] The output module 500 comprises an output circuit, which is used to turn on the output circuit after receiving the third signal.

[0013] In a preferred example of the present application, it can be further provided that the output module 500 further comprises:

[0014] The power module is used to generate 8V or 5V power supply for the oscillation module, the chip module and the isolation module.

[0015] In a preferred example of the present application, the model of the MCU can be further provided as CMS32L051.

[0016] In a preferred example of the present application, the Hall module can be further provided as comprising a chip with the model of HAL248.

[0017] In a preferred example of the present application, the software unit is used to calculate the first signal to obtain an energy value, and the calculation process comprises:

[0018] P = (X1+X2+…X 64 ) / 64;

[0019] M = (X1-P) 2 +(X2-P) 2 +…(X 64 -P) 2 ;

[0020]

[0021] wherein (X1+X2+…X 64 ) is a group of the first signal, P is the mean value, M is the square sum, and E is the energy value.

[0022] In a preferred example of the present application, it can be further provided that the output module 500 further comprises:

[0023] The protection circuit is connected between the chip module and the output module, and is used to protect the MCU and the output circuit.

[0024] In a preferred example of the present application, the LC oscillation circuit can be further provided as comprising electronic elements with the models of BCM847BV and BCM857BV.

[0025] In a preferred example of the present application, the isolation amplification circuit can be further provided as comprising an electronic element with the model of SGM8956.

[0026] In a preferred example of the present application, the output circuit can be further provided as comprising an electronic element with the model of BC817-25.

[0027] In a second aspect, the present application also provides a method for using the chip-based proximity sensor, based on any of the chip-based proximity sensors, comprising:

[0028] Step 100: presetting an energy value in the sensor;

[0029] Step 200: approaching the sensor with a metal or magnet object.

[0030] In summary, compared with the prior art, the technical scheme provided by the embodiments of the present application has at least the following beneficial effects:

[0031] The chip-based proximity sensor provided by the present application can calculate, compare and store the energy value of the signal generated by the LC oscillation circuit through the MCU and the software module added in the circuit of the sensor, so that the detection distance can be debugged at any time during the production or use of the proximity sensor, especially after the glue is poured, and the accuracy of the debugging is improved. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 A structural diagram of a chip-based proximity sensor is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0034] In an embodiment of the present application, a chip-based proximity sensor is provided, please refer to Figure 1 as shown, comprising:

[0035] The oscillation module comprises an LC oscillation circuit, which is used to generate an oscillation signal when a metal object approaches the LC oscillation circuit;

[0036] The isolation module comprises an isolation amplification circuit, which is used to isolate the oscillation signal to obtain a first signal;

[0037] The Hall module comprises a Hall circuit, which is used to generate a second signal when a magnet approaches the Hall switch;

[0038] The chip module comprises an MCU and a software unit, and is configured to calculate an energy value of the first signal when the first signal is received, store the energy value in a Flash of the MCU when the second signal is received, compare the currently stored energy value with a newly calculated energy value if a new first signal is received, and generate a third signal and send the third signal to the output module if the newly calculated energy value is lower than the currently stored energy value.

[0039] The output module comprises an output circuit, and is configured to turn on the output circuit after receiving the third signal.

[0040] In a specific implementation, the working principle of the sensor is as follows:

[0041] When a metal object approaches, the oscillation signal generated by the LC oscillation circuit becomes smaller, and the first signal is generated. The first signal is input to the MCU (Microcontroller Unit) after being isolated by the isolation circuit. The energy value is obtained through calculation of the software unit. Then, when a magnet approaches the Hall circuit, the MCU stores the energy value in the built-in Flash (Flash memory) of the MCU. When the next time the device is powered on, the energy value is read from the MCU and compared with a new energy value. When the new energy value is smaller than the energy value, it indicates that a metal object approaches, and the MCU outputs the third signal to the output module. In addition, a specific distance corresponding to an energy value can be calibrated in the MCU. When the detected object is smaller than the energy value, the MCU outputs the third signal to the output module.

[0042] In this embodiment, the MCU and the software module are added to the circuit of the sensor. The MCU and the software module are configured to calculate, compare, and store the energy value of the signal generated by the LC oscillation circuit. The detection distance can be debugged at any time during the production or use of the sensor, especially after the sensor is filled with glue. The accuracy of the debugging is improved.

[0043] The application further provides a use method of the chip-based proximity sensor, and the method comprises the following steps:

[0044] Step 100: presetting an energy value in the sensor;

[0045] Step 200: approaching a metal or magnet object to the sensor.

[0046] Each step in the use method of the chip-based proximity sensor realizes the function module of the use method of the chip-based proximity sensor according to any one of the above embodiments, and the execution process is not described here again.

[0047] Any technical features in the above embodiments can be combined, and for the sake of brevity, not all possible combinations are described, however, any combination of the technical features is considered to be within the scope of the present disclosure. The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that, for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A chip-based proximity sensor, characterized by, The chip-based proximity sensor comprises: a vibration module comprising an LC vibration circuit, which generates a vibration signal when a metal object approaches the LC vibration circuit; an isolation module comprising an isolation amplification circuit, which isolates the vibration signal to obtain a first signal; a Hall module comprising a Hall circuit, which generates a second signal when a magnet approaches the Hall switch; a chip module comprising an MCU and a software unit, wherein the MCU is configured to calculate an energy value of the first signal when the first signal is received, and store the energy value in the Flash of the MCU when the second signal is received; the MCU is further configured to compare the currently stored energy value with the energy value calculated from the first signal received again when the first signal is received again, and generate a third signal and send it to an output module if the energy value of the first signal received again is lower than the currently stored energy value; the software unit is configured to calculate the energy value of the first signal, and the calculation process is as follows: P = (X1+ X2+... X 64 ) / 64; M = (X1 - P) 2 + (X2 - P) 2 +... (X 64 - P) 2 ; wherein (X1+X2+…X 64 ) is a set of the first signals, P is a mean value, M is a square sum, and E is an energy value. an output module comprising an output circuit, which is turned on after receiving the third signal.

2. The chip-based proximity sensor of claim 1, wherein, Further comprising: a power module configured to generate a power supply of 8V or 5V to supply power to the vibration module, the chip module and the isolation module.

3. The chip-based proximity sensor of claim 1, wherein, The model of the MCU is CMS32L051.

4. The chip-based proximity sensor of claim 1, wherein, The Hall module comprises a chip with the model of HAL248.

5. The chip-based proximity sensor of claim 4, wherein, Further comprising: a protection circuit connected between the chip module and the output module, which is configured to protect the MCU and the output circuit.

6. The chip-based proximity sensor of claim 5, wherein, The LC vibration circuit comprises electronic elements with the models of BCM847BV and BCM857BV.

7. The chip-based proximity sensor of claim 6, wherein, The isolation amplification circuit comprises an electronic element with the model of SGM8956.

8. The chip-based proximity sensor of claim 7, wherein, The output circuit comprises an electronic element with the model of BC817-25.

9. A method of using a chip-based proximity sensor, characterized by, The chip-based proximity sensor based on any one of claims 1-8 comprises: Step 100: presetting an energy value in the sensor; Step 200: approaching a metal or magnet object to the sensor.

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