Substrate processing device and substrate processing method

Abstract

The present invention provides a substrate processing device and a substrate processing method capable of reducing the number of times a substrate is transported and enters a standby state. A plurality of transport robots and a plurality of modules are arranged at an interface portion that connects a pre-processing portion that performs a pre-processing process on a substrate and a post-processing portion that performs a post-processing process with two exposure devices. The interface portion has a first transport path for transporting substrates to one exposure device and a second transport path for transporting substrates to another exposure device. The processing time of a substrate in a first temperature regulator included in the first transport path, which is a relatively short transport path, is extended by only a prescribed delay time. The time required to transport a substrate along the first transport path can be made roughly consistent with the time required to transport a substrate along the second transport path, thereby reducing the number of times a substrate is transported and enters a standby state in the first transport path.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and method for sequentially performing a pre-exposure process and a post-exposure process on a plurality of substrates included in a batch. The substrates to be processed include, for example, glass substrates for liquid crystal displays, glass substrates for organic EL displays, glass substrates for PDPs, and glass substrates for photomasks. Background Art

[0002] In the past, there has been known a substrate processing device that performs the following processes in sequence on a substrate brought in from a device having a loading table and a conveying device (also called a indexer device) and then unloads the substrate from the indexer device. The processes include: forming a photoresist coating film, a reduced pressure drying process, a heating drying process, bringing in an exposure device, bringing out an exposure device, developing the exposed photoresist film, a rinsing process, and a drying process, etc. The loading table carries a box for accommodating a plurality of substrates (for example, patent documents 1, 2, etc.).

[0003] In the substrate processing apparatus disclosed in Patent Documents 1 and 2, two exposure apparatuses are connected to the substrate processing apparatus to avoid the speed limitation of the exposure apparatus, which has a longer processing time. Providing two exposure apparatuses allows the substrate to be exposed even when one exposure apparatus is currently processing. This prevents unexposed substrates from being retained in the substrate processing apparatus.

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2006-24643

[0005] Patent Document 2: Japanese Patent Application Laid-Open No. 2006-24642

[0006] However, when connecting two exposure apparatuses, depending on the user's usage of the substrate processing apparatus, there are cases where two exposure apparatuses performing the same process (equipped with the same mask) are connected, or cases where two exposure apparatuses performing different processes (equipped with different masks) are connected. When connecting two exposure apparatuses performing different processes, the substrate is often transferred sequentially to the two exposure apparatuses, and two exposure processes are performed using different masks. On the other hand, when connecting two exposure apparatuses performing the same process, the substrate is transferred to only one exposure apparatus, and the exposure process is performed once.

[0007] When two exposure units performing the same process are connected, and substrates are transported to only one of them, the substrate transport path differs depending on the exposure unit used. Specifically, the interface for loading and unloading substrates to and from the exposure units has two transport paths. Typically, multiple substrates comprising a batch are transported alternately along one of the two transport paths. Typically, the interface prohibits substrates from "passing" and requires that multiple substrates be removed from the interface in the same order in which they were loaded.

[0008] However, the lengths of the two transport paths mentioned above often differ due to the layout of the interface. The time required to transport a substrate along a long transport path is inevitably longer than the time required to transport a substrate along a short transport path. In this way, if substrates are prohibited from "overtaking", the substrates transported along the short transport path will need to wait. If the substrates after exposure processing are put on standby, the time from exposure processing to development processing for each substrate will become inconsistent, and the processing results will deviate. In addition, if the substrates transported along the short transport path enter the standby state while being held by the transport robot, the transport robot will also be unable to transport the substrates transported along the long transport path, and the interface will experience transport stagnation. Summary of the Invention

[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can reduce the number of substrates that enter a standby state during transport.

[0010] In order to solve the above-mentioned problems, a first method of the present invention is a substrate processing device that sequentially performs a pre-exposure processing process on a plurality of substrates included in a batch, and performs a post-exposure processing process on a plurality of substrates included in a batch, wherein the substrate processing device comprises: a pre-processing unit that performs the pre-processing process; a post-processing unit that performs the post-processing process; an interface unit that connects the pre-processing unit and the post-processing unit to a first exposure device and a second exposure device, and has a plurality of transport robots and a plurality of modules for transporting substrates; and a control unit that controls the plurality of transport robots and the plurality of modules, wherein the second transport path from the pre-processing unit via the second exposure device to the post-processing unit is longer than the first transport path from the pre-processing unit via the first exposure device to the post-processing unit, the plurality of substrates included in the batch are alternately transported along the first transport path or the second transport path, and the control unit extends the processing time of the substrate in a specific module included in the first transport path by only a specified delay time.

[0011] Furthermore, a second aspect is the substrate processing apparatus according to the first aspect, wherein the delay time is set so that a time required to transport the substrate along the first transport path is equal to a time required to transport the substrate along the second transport path.

[0012] Furthermore, a third aspect is the substrate processing apparatus according to the first or second aspect, wherein the specific module is a temperature control module that controls the temperature of the substrate.

[0013] In addition, the fourth method is a substrate processing device according to any one of the first to third methods, wherein the plurality of modules include an input side buffer, the input side buffer is arranged upstream of the first exposure device and the second exposure device, the plurality of modules include a first output side buffer dedicated to the first exposure device, the first output side buffer is arranged downstream of the first exposure device in the first conveying path, the plurality of modules include a second output side buffer dedicated to the second exposure device, the second output side buffer is arranged downstream of the second exposure device in the second conveying path, and the control unit controls the plurality of conveying robots so that the number of substrates located downstream of the input side buffer in at least the first conveying path is less than or equal to the number of substrates that can be accommodated by the first output side buffer.

[0014] In addition, the fifth method is a substrate processing device according to any one of the first to third methods, wherein the plurality of modules include an input side buffer, and the input side buffer is arranged upstream of the first exposure device and the second exposure device. The plurality of modules include an output side buffer shared by the first exposure device and the second exposure device, and the output side buffer is arranged downstream of the first exposure device and the second exposure device. The control unit controls the plurality of transport robots so that the number of substrates located downstream of the input side buffer in at least the first transport path is less than or equal to the number obtained by subtracting one from the number of substrates that the output side buffer can accommodate.

[0015] Furthermore, a sixth aspect is the substrate processing apparatus according to any one of the first to fifth aspects, wherein the control unit controls the plurality of transport robots to transport the leading substrate of the batch along the second transport path.

[0016] In addition, the seventh method is a substrate processing method, in which a plurality of substrates included in a batch are sequentially processed by a pre-exposure process and a post-exposure process, wherein the substrate processing method includes: a conveying process, in which the substrate that has been subjected to the pre-exposure process is conveyed to the first exposure device and / or the second exposure device at an interface part, and the substrate that has been subjected to the exposure process is conveyed to the post-processing part, the interface part connects the pre-processing part that performs the pre-processing process and the post-processing part that performs the post-processing process with the first exposure device and the second exposure device, the interface part has a plurality of conveying robots and a plurality of modules for conveying substrates, the second conveying path from the pre-processing part via the second exposure device to the post-processing part is longer than the first conveying path from the pre-processing part via the first exposure device to the post-processing part, the plurality of substrates included in the batch are alternately conveyed along the first conveying path or the second conveying path, so that the processing time of the substrate in the specific module included in the first conveying path is extended only by a specified delay time.

[0017] Furthermore, an eighth aspect is the substrate processing method according to the seventh aspect, wherein the delay time is set so that a time required to transport the substrate along the first transport path is equal to a time required to transport the substrate along the second transport path.

[0018] Furthermore, a ninth aspect is the substrate processing method according to the eighth aspect, wherein the specific module is a temperature control module that controls the temperature of the substrate.

[0019] In addition, the tenth method is a substrate processing method according to any one of the seventh to ninth methods, wherein the plurality of modules include an input side buffer, the input side buffer is arranged upstream of the first exposure device and the second exposure device, the plurality of modules include a first output side buffer dedicated to the first exposure device, the first output side buffer is arranged downstream of the first exposure device in the first conveying path, the plurality of modules include a second output side buffer dedicated to the second exposure device, the second output side buffer is arranged downstream of the second exposure device in the second conveying path, and at least the number of substrates located downstream of the input side buffer in the first conveying path is set to be less than or equal to the number of substrates that can be accommodated by the first output side buffer.

[0020] In addition, the eleventh method is a substrate processing method according to any one of the seventh to ninth methods, wherein the plurality of modules include an input side buffer, and the input side buffer is arranged upstream of the first exposure device and the second exposure device; the plurality of modules include an output side buffer shared by the first exposure device and the second exposure device, and the output side buffer is arranged downstream of the first exposure device and the second exposure device; the number of substrates located downstream of the input side buffer in at least the first conveying path is less than or equal to the number obtained by subtracting one from the number of substrates that the output side buffer can accommodate.

[0021] Furthermore, a twelfth aspect is the substrate processing method according to any one of the seventh to eleventh aspects, wherein the leading substrate of the batch is conveyed along the second conveyance path.

[0022] However, “first” and “second” are only used for identification, and the first transport path indicates a transport path that is relatively shorter than the second transport path.

[0023] According to the substrate processing device of the first to sixth modes, since the processing time of the substrate in the specific module included in the relatively short first transport path is extended only by the prescribed delay time, the time required for transporting the substrate along the first transport path can be made roughly consistent with the time required for transporting the substrate along the second transport path, which can reduce the time for the substrate to enter the standby state when being transported in the first transport path.

[0024] In particular, according to the fourth embodiment of the substrate processing device, since the number of substrates located downstream of the input side buffer in the first transport path is less than or equal to the number of substrates that can be accommodated by the first output side buffer, the substrates that have completed the exposure process can be prevented from overflowing from the first output side buffer in the first transport path, and the transport of substrates entering the standby state can be reduced.

[0025] In particular, according to the fifth embodiment of the substrate processing device, since the number of substrates located downstream of the input side buffer in the first conveying path is less than or equal to the number of substrates that the output side buffer can accommodate minus one, substrates that have completed the exposure process can be prevented from overflowing from the common output side buffer, and the conveying of substrates into the standby state can be reduced.

[0026] In particular, according to the substrate processing apparatus of the sixth aspect, since the leading substrate of a batch is conveyed along the relatively long second conveyance path, variations in the time taken from exposure processing to development processing for a plurality of substrates included in a batch can be suppressed.

[0027] According to the substrate processing methods of the seventh to twelfth methods, since the processing time of the substrate in the specific module included in the relatively short first transport path is extended only by the prescribed delay time, the time required for transporting the substrate along the first transport path can be made roughly consistent with the time required for transporting the substrate along the second transport path, which can reduce the time for the substrate to enter the standby state during transport in the first transport path.

[0028] In particular, according to the tenth embodiment of the substrate processing method, since the number of substrates located downstream of the input side buffer in the first transport path is less than or equal to the number of substrates that can be accommodated by the first output side buffer, substrates that have completed the exposure process can be prevented from overflowing from the first output side buffer in the first transport path, and the transport of substrates entering the standby state can be reduced.

[0029] In particular, according to the substrate processing method of the eleventh embodiment, since the number of substrates located downstream of the input side buffer in the first conveying path is less than or equal to the number obtained by subtracting one from the number of substrates that the output side buffer can accommodate, substrates that have completed the exposure processing can be prevented from overflowing from the common output side buffer, and the conveying of substrates into the standby state can be reduced.

[0030] In particular, according to the substrate processing method of the twelfth aspect, since the leading substrate of a batch is conveyed along the relatively long second conveyance path, variations in the time taken from exposure processing to development processing for a plurality of substrates included in a batch can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram showing an example of the overall structure of the substrate processing apparatus of the present invention.

[0032] Figure 2 It is a block diagram showing the structure of the control unit.

[0033] Figure 3 This is a diagram showing an example of the structure of the interface unit.

[0034] Figure 4 This is a diagram showing an example of a stacked configuration of modules.

[0035] Figure 5 It means in Figure 3 FIG2 is a diagram showing a transport path for transporting a substrate to both a first exposure device and a second exposure device through an interface portion.

[0036] Figure 6 It means in Figure 3 FIG2 is a diagram of a transport path in which the interface portion transports the substrate only to the first exposure device.

[0037] Figure 7 It means in Figure 3FIG2 is a diagram of a transport path in which the interface portion only transports the substrate to the second exposure device.

[0038] Figure 8 It is a diagram showing another example of the structure of the interface unit.

[0039] Figure 9 It means in Figure 8 FIG2 is a diagram showing a transport path for transporting a substrate to both a first exposure device and a second exposure device through an interface portion.

[0040] Figure 10 It means in Figure 8 FIG2 is a diagram of a transport path in which the interface portion transports the substrate only to the first exposure device.

[0041] Figure 11 It means in Figure 8 FIG2 is a diagram of a transport path in which the interface portion only transports the substrate to the second exposure device.

[0042] Figure 12 This is a diagram schematically showing that the processing time of modules included in a short transport path is prolonged.

[0043] Description of Reference Numerals

[0044] 1Substrate processing equipment

[0045] 2 Indexer device

[0046] 3a First exposure device

[0047] 3b Second exposure device

[0048] 11Pre-processing department

[0049] 12 Post-processing unit

[0050] 20a, 20b interface part

[0051] 31 First handling robot

[0052] 32 Second handling robot

[0053] 33 Third handling robot

[0054] 34 Fourth handling robot

[0055] 35 Fifth handling robot

[0056] 37 First Path

[0057] 38 Second Path

[0058] 39 The Third Path

[0059] 51 cooling plate

[0060] 52 edge exposure machine

[0061] 53 buffer

[0062] 55 First Thermostat

[0063] 56 Second thermostat

[0064] 57 output path

[0065] 58 first output path

[0066] 59 Second output path

[0067] 90 Control Department

[0068] 111 Cleaning Department

[0069] 112 coating department

[0070] 113 vacuum drying section

[0071] 114 Pre-baking section

[0072] 121 Development Department

[0073] 122 Post-baking department

[0074] 123 Cooling Department

[0075] G substrate DETAILED DESCRIPTION

[0076] Below, with reference to the accompanying drawings, embodiments of the present invention are described in detail. Below, unless otherwise specified, expressions representing relative or absolute positional relationships (e.g., "a direction," "along a direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) not only rigorously represent the positional relationship, but also represent the state in which the angle or distance is relatively displaced within a tolerance or the range in which the same degree of function can be obtained. In addition, unless otherwise specified, expressions representing equivalent states (e.g., "same," "equivalent," "homogeneous," etc.) not only quantitatively and rigorously represent equivalent states, but also represent the state in which there is a tolerance or a difference in the function to the same degree. In addition, unless otherwise specified, expressions representing shapes (e.g., "circular," "quadrilateral," "cylindrical," etc.) not only rigorously represent the geometric shape, but also represent shapes such as concave-convex or chamfered shapes within a range in which the same degree of effect can be obtained. In addition, expressions such as "having," "provided," "equipped," "including," and "having" structural members are not exclusive expressions that exclude the existence of other structural members. The expression “at least one of A, B, and C” includes “only A,” “only B,” “only C,” “any two of A, B, and C,” and “all of A, B, and C.”

[0077] <First embodiment>

[0078] <1-1. Overall Structure of Substrate Processing Apparatus>

[0079] Figure 1 It is a schematic diagram showing an example of the overall structure of the substrate processing device 1 of the present invention. The substrate processing device 1 is a device that performs a process before exposure processing on a substrate G and performs a process after exposure processing. The process before exposure processing includes, for example, cleaning, application of a processing liquid, drying of the processing liquid, forming a coating film by heating, etc. On the other hand, the process after exposure processing includes development, drying by heating after development, cooling, etc. The substrate G to be processed is, for example, a flat glass substrate. The substrate G has a first surface (also referred to as an upper surface) as a first principal surface and a second surface (also referred to as a lower surface) as a second principal surface opposite to the first surface. In addition, Figure 1 In the figures and subsequent drawings, the sizes and quantities of various parts are exaggerated or simplified as needed to facilitate understanding.

[0080] One end of the substrate processing apparatus 1 is connected to the indexer apparatus 2, and the other end is connected to the first exposure apparatus 3a and the second exposure apparatus 3b. That is, in this embodiment, two exposure apparatuses 3a and 3b are connected to the substrate processing apparatus 1 of a single production line. Furthermore, unless otherwise specified, the first exposure apparatus 3a and the second exposure apparatus 3b are collectively referred to as the exposure apparatus 3.

[0081] The substrate processing apparatus 1 comprises a pre-processing unit 11 for performing processes preceding the exposure process; a post-processing unit 12 for performing processes following the exposure process; and an interface unit 20. Within the entire transport path for substrates G in the substrate processing apparatus 1, the pre-processing unit 11 forms the outbound portion, from the indexer apparatus 2 to the interface unit 20. Meanwhile, the post-processing unit 12 forms the return portion, from the interface unit 20 to the indexer apparatus 2. The first interface unit 20a and the second interface unit 20b, described below, are collectively referred to as the interface unit 20.

[0082] The indexer device 2 includes a mounting table on which a cassette containing a plurality of substrates G is mounted, and a transfer mechanism for transferring the substrates G. The transfer mechanism can be, for example, a transfer robot that transfers the substrates G between the cassette on the mounting table and the pre-processing section 11 and the post-processing section 12. The transfer mechanism removes unprocessed substrates G from the cassette on the mounting table and transfers them to the pre-processing section 11. Furthermore, the transfer mechanism receives processed substrates G from the post-processing section 12 and stores them in a cassette.

[0083] The pre-processing unit 11 has a plurality of processing units: a cleaning unit 111, a coating unit 112, a reduced pressure drying unit 113, and a pre-baking unit 114. The processing units of the pre-processing unit 11 are arranged in the order described above. Figure 1As indicated by the arrows drawn with two-dot chain lines, the substrate G is conveyed to each processing unit in the order described above as the processing proceeds.

[0084] The cleaning section 111 cleans the substrate G brought in from the indexer device 2. This cleaning process includes, for example, removing organic contamination, typically fine particles, metal contamination, grease, and natural oxide films. In the cleaning section 111, for example, ultraviolet light is used to remove organic matter adhering to the surface of the substrate G. The surface of the substrate G is cleaned by supplying a cleaning liquid such as deionized water and cleaning components such as brushes. The substrate G is then dried using a blower or the like. Drying the substrate G using the blower or the like includes, for example, removing the cleaning liquid from the substrate G using an air knife.

[0085] The coating unit 112 coats the processing liquid on the substrate G after being cleaned by the cleaning unit 111. The coating unit 112 can be applied to a slit coater, for example. The slit coater moves the slit nozzle that sprays the processing liquid from the nozzle relative to the substrate G, thereby being able to coat the processing liquid on the substrate G. Here, in the coating unit 112, the area where the processing liquid is coated on the substrate G (also referred to as the coating area) is transported in a horizontal direction by a floating conveying mechanism, and the substrate G is in a posture with its upper and lower surfaces along the horizontal direction (also referred to as a horizontal posture). The floating conveying mechanism supports or holds the two end portions of the substrate G in the width direction perpendicular to the conveying direction of the substrate G (also referred to as the substrate conveying direction) from below, blows compressed air from below to the substrate G, thereby holding the substrate G in a state in which its upper and lower surfaces are along the horizontal direction, and moving the substrate G in the horizontal direction. In the coating section 112, for example, a conveyor is used to transport the substrate G in a portion located upstream of the coating area (also referred to as the input side portion) and a portion located downstream of the coating area (also referred to as the output side portion). The conveyor uses a drive mechanism (not shown) to rotate a plurality of rollers arranged along the substrate conveying direction of the substrate G, thereby moving the horizontally positioned substrate G in the horizontal direction. Coating devices using other coating methods may also be used in the coating section 112.

[0086] The treatment liquid applied by the coating unit 112 can be, for example, a resist solution or a coating liquid (also referred to as a coating liquid) containing a polyimide precursor and a solvent (also referred to as a PI solution). Examples of the polyimide precursor include polyamic acid. Examples of the solvent include NMP (N-Methyl-2-Pyrrolidone).

[0087] The reduced pressure drying unit 113 performs a process (also referred to as reduced pressure drying process) of drying the processing liquid applied to the substrate G by reducing pressure. Here, the solvent of the processing liquid applied to the surface of the substrate G is vaporized (evaporated) by reducing pressure, thereby drying the substrate G.

[0088] The pre-baking section 114 heats the substrate G after drying in the reduced-pressure drying section 113, solidifying the components of the treatment liquid on the surface of the substrate G. This forms a film of the treatment liquid on the substrate G. For example, if the treatment liquid is a resist, the resist coating is heat-treated to form a resist film. For example, if the treatment liquid is a polyimide precursor, the polyimide precursor coating is heat-treated to form a polyimide film through imidization of the polyimide precursor. The pre-baking section 114 can be a single-sheet heat treatment section that heats a single substrate G, or a batch heat treatment section that heats multiple substrates G simultaneously. The processing time for the reduced-pressure drying process in the reduced-pressure drying section 113 is significantly different from the processing time for the heating process in the pre-baking section 114. Assuming that the pre-baking section 114 is a single-sheet heat treatment section, in this case, the pre-baking section 114 can include, for example, multiple single-sheet heat treatment sections that perform the heating process in parallel. The plurality of heat treatment units are arranged in a vertically stacked state, for example.

[0089] The interface unit 20 connects the pre-processing unit 11 and the post-processing unit 12 to the first exposure unit 3a and the second exposure unit 3b. The interface unit 20 transports substrates G received from the pre-processing unit 11 to the first exposure unit 3a and / or the second exposure unit 3b. Furthermore, the interface unit 20 transports exposed substrates G received from the first exposure unit 3a and / or the second exposure unit 3b to the post-processing unit 12. The interface unit 20 includes a plurality of transport robots and a plurality of modules for transporting substrates G. The detailed structure of the interface unit 20 will be described later.

[0090] The first exposure device 3a and the second exposure device 3b perform an exposure process on the film of the treatment liquid formed on the substrate G in the pre-processing unit 11. Specifically, the exposure device 3 irradiates light of a specific wavelength, such as extreme ultraviolet light, through a mask depicting a circuit pattern, transferring the pattern to the film of the treatment liquid. The exposure device 3 may include, for example, a peripheral exposure unit and a code printer. The peripheral exposure unit performs an exposure process to remove the peripheral edge of the film of the treatment liquid on the substrate G. The code printer, for example, writes specified information onto the substrate G. The peripheral exposure unit and the code printer may include a rotation mechanism to change the orientation of the substrate G.

[0091] The post-processing unit 12 has a plurality of processing units: a developing unit 121, a post-baking unit 122, and a cooling unit 123. The processing units of the post-processing unit 12 are arranged in the order described above. Figure 1 As indicated by the arrows drawn with two-dot chain lines, the substrate G is conveyed to each processing unit in the order described above as the processing proceeds.

[0092] The developing section 121 performs a development process on the film of the treatment liquid formed in the pre-processing section 11. This development process includes, for example, developing the film of the treatment liquid; rinsing the developer liquid; and drying the substrate G. The developing section 121 performs, for example, immersing the film of the treatment liquid on the substrate G, which has been exposed to a pattern by the exposure device 3, in the developer liquid; rinsing the developer liquid from the substrate G with a cleaning solution such as deionized water; and drying the substrate G using a blower or the like. Drying the substrate G using a blower or the like includes, for example, removing the cleaning solution from the substrate G using an air knife.

[0093] The post-bake section 122 heats the substrate G and vaporizes the cleaning liquid attached to the substrate G in the developing section 121 , thereby drying the substrate G.

[0094] The cooling unit 123 cools the substrate G heated in the post-bake unit 122. For example, the cooling unit 123 can employ a structure in which the substrate G is transported by a conveyor and air-cooled, or a structure in which the substrate G is placed on a shelf-like portion and cooled by blowing air or other gas. The substrate G cooled in the cooling unit 123 is unloaded from the post-processing unit 12 to the outside of the substrate processing apparatus 1 by the indexer device 2.

[0095] The operation of each unit of the substrate processing apparatus 1 is controlled by the control unit 90 . Figure 2 This is a block diagram showing the structure of the control unit 90. The hardware structure of the control unit 90 is similar to that of a conventional computer. Specifically, the control unit 90 includes a CPU, which performs various calculations; a ROM, which stores basic programs; a RAM, which stores various information; and a storage unit 94 (e.g., a magnetic disk or SSD (solid-state drive)) that stores control software and data. The CPU of the control unit 90 executes a predetermined processing program to perform processing in the substrate processing apparatus 1.

[0096] The storage unit 94 of the control unit 90 stores a processing procedure 95 that defines the order and conditions for processing the substrate G. The processing procedure 95 is input by, for example, an operator of the apparatus using an input unit 92 (described later) and stored in the storage unit 94, thereby being retrieved by the substrate processing apparatus 1. Alternatively, the processing procedure 95 may be transmitted from a host computer that manages a plurality of substrate processing apparatuses 1 to the substrate processing apparatus 1 via communication and stored in the storage unit 94.

[0097] Components such as a transport robot provided in the interface unit 20 described later are electrically connected to the control unit 90. The control unit 90 controls the transport robot and the like according to the content of the processing rule 95, for example.

[0098] In addition, the display unit 93 and the input unit 92 are connected to the control unit 90. The display unit 93 and the input unit 92 serve as a user interface of the substrate processing apparatus 1. The control unit 90 displays various information on the display unit 93. The operator of the substrate processing apparatus 1 can confirm the information displayed on the display unit 93 and input various instructions and parameters from the input unit 92. The input unit 92 can use, for example, a keyboard or a mouse. The display unit 93 can use, for example, a liquid crystal display. In this embodiment, a liquid crystal touch panel provided on the outer wall of the substrate processing apparatus 1 is used as the display unit 93 and the input unit 92, realizing the functions of both.

[0099] <1-2. Structure of the First Interface Section>

[0100] Figure 3 1 is a diagram showing the structure of the first interface unit 20a. The interface unit 20a includes a conveying mechanism for conveying substrates G and a plurality of modules. Figure 3 The interface portion 20 a includes five transport robots (a first transport robot 31 , a second transport robot 32 , a third transport robot 33 , a fourth transport robot 34 , and a fifth transport robot 35 ) as a transport mechanism.

[0101] The first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 are all capable of moving the arms holding the substrates G forward and backward, rotating, and lifting. Thus, the first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 are all capable of transferring substrates G to surrounding modules.

[0102] The first transport robot 31, the third transport robot 33, and the fourth transport robot 34 are single-handed robots that transport substrates G with one hand. Meanwhile, the second transport robot 32, which loads substrates G into and out of the first exposure unit 3a, and the fifth transport robot 35, which loads substrates G into and out of the second exposure unit 3b, are two-handed robots. Thus, the second transport robot 32 and the fifth transport robot 35 can exchange unexposed substrates G with exposed substrates G with the first exposure unit 3a and the second exposure unit 3b, respectively.

[0103] The interface unit 20a also includes, as modules, the following: a cooling plate 51; an edge exposure unit 52; a buffer 53; a first temperature regulator 55; a second temperature regulator 56; a first path 37; a second path 38; a third path 39; a first output path 58; and a second output path 59. A module is a component within the interface unit 20a that does not carry substrates G and is the smallest control unit for transport control within the interface unit 20a. Furthermore, strictly speaking, the interface unit 20a does not control the cooling plate 51 and edge exposure unit 52 (the pre-bake unit 114 controls the cooling plate 51).

[0104] The cooling plate 51 is a plate equipped with a cooling mechanism such as a cooling water circulation mechanism or a Peltier element. The heated substrate G is placed on the cooling plate 51 to cool the substrate G. The edge exposure device 52 irradiates light onto the peripheral edge of the substrate G on which the resist film is formed, thereby exposing the peripheral edge.

[0105] The buffer 53 has multiple layers (e.g., sixteen layers) of stacked shelves capable of accommodating one substrate G. Thus, the buffer 53 can accommodate more than one substrate G. The buffer 53 functions as an input-side buffer provided upstream of the first exposure device 3 a and the second exposure device 3 b in the transport path of the substrate G.

[0106] The first temperature controller 55 supplies gas regulated to a predetermined temperature to the substrate G to regulate the temperature of the substrate G. The second temperature controller 56 has the same structure as the first temperature controller 55. The first and second temperature controllers 55 and 56 regulate the temperature of the substrate G to, for example, 23°C, which is the standard temperature of the clean room.

[0107] The first path 37, the second path 38, and the third path 39 each stack, for example, two layers of loading tables capable of holding a single substrate G. The first and second delivery paths 58 and 59 each stack, for example, five layers of loading tables capable of holding a single substrate G. The first path 37, the second path 38, the third path 39, the first and second delivery paths 58 and 59 are all components for transferring substrates G between two transport robots. Furthermore, the first and second delivery paths 58 and 59 function as output-side buffers, located downstream of the first and second exposure devices 3a and 3b, respectively, in the transport path for substrates G.

[0108] In the plurality of modules provided in the interface portion 20 a , the first temperature regulator 55 , the first path 37 , and the first output path 58 are stacked in three layers in the vertical direction. Figure 4 This is a diagram showing an example of a stacked configuration of modules. Figure 4 In the stacked structure, the first temperature regulator 55 is arranged in the upper layer, the first path 37 is arranged in the middle layer, and the first output path 58 is arranged in the lower layer.

[0109] The first temperature regulator 55 on the upper layer has an air supply unit 61, a mounting table 62 and a driving mechanism 63. A plurality of support pins 65 are erected on the upper surface of the mounting table 62. The mounting table 62 can carry a substrate G. The driving mechanism 63 moves the mounting table 62 up and down in the vertical direction and rotates the mounting table 62 around an axis in the vertical direction. That is, the first temperature regulator 55 controls the temperature of the substrate G and acts as a turntable for rotating the substrate G in a horizontal plane. The air supply unit 61 blows gas, for example, which is controlled to 23°C, to the substrate G that is placed on the mounting table 62 and raised to a specified temperature control position by the driving mechanism 63. An opening 64 is provided on the first temperature regulator 55 for the first transport robot 31 to enter and exit. In addition, along the first temperature regulator 55, a gas is provided. Figure 4 An opening for the second transport robot 32 to enter and exit is also provided on the front side in a direction perpendicular to the paper surface.

[0110] The middle first path 37 is stacked with two stages, each capable of holding a single substrate G. The lower first delivery path 58 is stacked with five stages, each capable of holding a single substrate G. Openings (not shown) are also provided in the first path 37 and the first delivery path 58 for adjacent transport robots to enter and exit.

[0111] return Figure 3 The second output path 59 and the second path 38 are stacked in two layers vertically. The second output path 59 is arranged in the upper layer, and the second path 38 is arranged in the lower layer. Furthermore, the second temperature regulator 56 and the third path 39 are also stacked in two layers vertically. The second temperature regulator 56 is arranged in the upper layer, and the third path 39 is arranged in the lower layer. The second temperature regulator 56 has the same structure as the first temperature regulator 55 described above, controls the temperature of the substrate G, and also functions as a turntable for rotating the substrate G in a horizontal plane.

[0112] like Figure 3 As shown, the first transport robot 31 is surrounded by a stacked structure comprising a cooling plate 51, a buffer 53, a first temperature regulator 55, a first path 37, and a first output path 58. The first transport robot 31 receives and delivers substrates G from the cooling plate 51, the buffer 53, the first temperature regulator 55, and the first path 37. The first transport robot 31 can receive and deliver substrates G from any of the multiple shelves provided in the buffer 53. The first transport robot 31 is primarily responsible for transporting substrates on the input side of the interface unit 20a.

[0113] A stacked structure of a first temperature regulator 55, a first path 37, and a first output path 58 is arranged around the second transport robot 32. The second transport robot 32 receives and delivers substrates G from the first temperature regulator 55, the first path 37, the first output path 58, and the first exposure device 3a. The second transport robot 32 is primarily responsible for receiving and delivering substrates G from the first exposure device 3a.

[0114] Around the third transport robot 33 are located a stacked structure of a first temperature controller 55, a first path 37, and a first output path 58; a stacked structure of a second output path 59 and a second path 38; and an edge exposure machine 52. The third transport robot 33 transfers substrates G to and from the first path 37, the first output path 58, the second output path 59, the second path 38, and the edge exposure machine 52. The third transport robot 33 is primarily responsible for transporting substrates on the output side of the interface unit 20a.

[0115] The fourth transport robot 34 is surrounded by a stacked structure of the second output path 59 and the second path 38, and a stacked structure of the second temperature controller 56 and the third path 39. The fourth transport robot 34 transfers substrates G to and from the second output path 59, the second path 38, the second temperature controller 56, and the third path 39. The fourth transport robot 34 is responsible for transferring substrates within the interface 20a.

[0116] A stacked structure of a second temperature regulator 56 and a third path 39 is arranged around the fifth transport robot 35. The fifth transport robot 35 transfers substrates G to and from the second temperature regulator 56, the third path 39, and the second exposure device 3b. The fifth transport robot 35 is primarily responsible for transferring substrates G to and from the second exposure device 3b.

[0117] <1-3. Substrate Processing Procedure>

[0118] Next, a description will be given of a processing procedure for the substrate G in the substrate processing apparatus 1. First, the entire processing flow of the substrate G in the substrate processing apparatus 1 will be briefly described.

[0119] The indexer device 2 removes the unprocessed substrate G stored in the cassette and places it in the cleaning section 111 of the pre-processing section 11. The cleaning section 111 supplies a cleaning liquid, for example, to clean the surface of the substrate G and dries the cleaning liquid after cleaning. After cleaning in the cleaning section 111, the substrate G is conveyed to the coating section 112. In this embodiment, the coating section 112 applies a resist liquid to the surface of the cleaned substrate G after cleaning.

[0120] The substrate G coated with the resist liquid is conveyed from the coating section 112 to the reduced pressure drying section 113. The reduced pressure drying section 113 dries the resist liquid applied to the substrate G under a reduced pressure environment. The substrate G is then conveyed from the reduced pressure drying section 113 to the pre-baking section 114. The pre-baking section 114 heats the substrate G to bake the resist film on the surface of the substrate G.

[0121] The substrate G, after being coated with a resist film in the pre-processing section 11, is transported to the first exposure unit 3a and / or the second exposure unit 3b via the interface section 20 for exposure processing. After exposure processing, the substrate G is transported to the post-processing section 12 via the interface section 20. The transport of the substrate G in the interface section 20 will be described in more detail later.

[0122] The developing unit 121 of the post-processing unit 12 supplies a developing solution to the substrate G after the exposure process to develop the resist film. The developing unit 121 also rinses the developing solution from the substrate G and dries the substrate G.

[0123] The substrate G after development is transferred from the developing section 121 to the post-baking section 122. The post-baking section 122 heats the substrate G, evaporating and removing any remaining developer or cleaning solution on the substrate G. The substrate G is then transferred from the post-baking section 122 to the cooling section 123. The cooling section 123 cools the substrate G heated by the post-baking section 122. After cooling in the cooling section 123, the substrate G returns to the indexer device 2 and is stored in a cassette.

[0124] <1-4. Substrate Transport at the First Interface>

[0125] Then Figure 3 The following describes the conveyance of the substrate G through the interface unit 20a. As conveyance modes for the substrate G through the first interface unit 20a, a double exposure processing mode and a single exposure processing mode are provided. In the double exposure processing mode, each of the plurality of substrates G is conveyed sequentially to both the first exposure unit 3a and the second exposure unit 3b, and exposure processing is performed twice in an overlapping manner. In the single exposure processing mode, the plurality of substrates G is conveyed to either the first exposure unit 3a or the second exposure unit 3b, and exposure processing is performed once.

[0126] The control unit 90 selects either the double exposure processing mode or the single exposure processing mode. Specifically, the operator of the device specifies the double exposure processing mode or the single exposure processing mode through the input unit 92, and the control unit 90 selects the mode. Alternatively, the control unit 90 may also select the mode according to the processing procedure 95 ( Figure 2 ) is used to select a mode. Furthermore, the control unit 90 can select a mode based on an instruction from a higher-level host computer or the like. The dual exposure processing mode is used, for example, when the first exposure unit 3a and the second exposure unit 3b use different types of masks to perform multiple exposure processes on the same substrate G. On the other hand, the single exposure processing mode is used, for example, when the first exposure unit 3a and the second exposure unit 3b use the same type of mask to perform high-throughput exposure processing. In the single exposure processing mode, multiple substrates G can be alternately transported to the first exposure unit 3a and the second exposure unit 3b.

[0127] First, the conveyance of the substrate G when the control unit 90 selects the double exposure processing mode will be described. Figure 5 It means in Figure 3 FIG2 is a diagram showing a transport path for transporting a substrate G to both the first exposure device 3a and the second exposure device 3b by the interface 20a. The transport of the substrate G described below is achieved by the control unit 90 controlling the plurality of transport robots of the interface 20a.

[0128] The substrate G, heated by the pre-bake section 114 of the pre-processing section 11, is initially moved to the cooling plate 51 for cooling. The first transport robot 31 removes the cooled substrate G from the cooling plate 51 and moves it to the buffer 53. The first transport robot 31 then removes the substrate G from the buffer 53 and moves it to the first temperature regulator 55. Loading the substrate into the buffer 53 is not mandatory; if the first temperature regulator 55 is unused, the first transport robot 31 can directly move the substrate G removed from the cooling plate 51 into the first temperature regulator 55.

[0129] In the dual exposure processing mode, the buffer 53 serves to eliminate variations in the processing time of the first exposure unit 3a and the second exposure unit 3b. The processing time of the first exposure unit 3a and the second exposure unit 3b is not necessarily constant. For example, the first exposure unit 3a and the second exposure unit 3b may undergo maintenance from time to time, which may increase the processing time. In addition, the first exposure unit 3a and the second exposure unit 3b require a long time to align the first substrate G of a batch, which can increase the processing time. When the processing time of the first exposure unit 3a or the second exposure unit 3b increases, the substrates G that have been coated with a resist film in the pre-processing unit 11 are temporarily stored in the buffer 53, thereby preventing processing in the pre-processing unit 11 from being stalled. The buffer 53 has shelves that can accommodate all the layers of substrates G that have undergone coating processing in the pre-processing unit 11, even if the first exposure unit 3a or the second exposure unit 3b is stopped for a long time.

[0130] The first temperature controller 55 accurately controls the temperature of the substrate G to a predetermined temperature (e.g., 23°C) immediately prior to exposure. The first temperature controller 55 not only controls the temperature of the substrate G but also allows the substrate G to be rotated within a horizontal plane as needed. The second transport robot 32 removes the temperature-controlled substrate G from the first temperature controller 55 and loads it into the first exposure unit 3a. At this point, the second transport robot 32 removes the previously exposed substrate G from the first exposure unit 3a and loads an unexposed substrate G into the first exposure unit 3a for substrate exchange.

[0131] The first exposure unit 3a performs an exposure process on the substrate G, transferring a pattern onto the resist film. The second transport robot 32 unloads the exposed substrate G from the first exposure unit 3a and carries it into the first path 37. Next, the third transport robot 33 unloads the substrate G from the first path 37 and carries it into the second path 38. Finally, the fourth transport robot 34 unloads the substrate G from the second path 38 and carries it into the second temperature controller 56.

[0132] The second temperature controller 56 accurately adjusts the temperature of the substrate G to a predetermined temperature before the second exposure process. The second temperature controller 56 not only controls the temperature of the substrate G but also allows the substrate G to be rotated horizontally as needed. The fifth transport robot 35 removes the temperature-controlled substrate G from the second temperature controller 56 and loads it into the second exposure unit 3b. At this point, the fifth transport robot 35 removes the previously exposed substrate G from the second exposure unit 3b and loads an unexposed substrate G into the second exposure unit 3b for substrate exchange.

[0133] The second exposure device 3b uses a mask different from that of the first exposure device 3a to perform exposure processing on the substrate G and transfer a pattern to the resist film. That is, in the double exposure processing mode, different patterns are transferred to the substrate G in an overlapping manner. The fifth transport robot 35 unloads the substrate G after exposure processing from the second exposure device 3b and moves it into the third path 39. Next, the fourth transport robot 34 unloads the substrate G from the third path 39 and moves it into the second output path 59. Then, the third transport robot 33 unloads the substrate G from the second output path 59 and moves it into the edge exposure machine 52. The second output path 59 also serves as a buffer when the substrate G after exposure processing by the second exposure device 3b is unloaded from the interface part 20a. The edge exposure machine 52 performs exposure processing on the peripheral portion of the substrate G. Thereafter, the substrate G is unloaded to the developing section 121 of the post-processing section 12.

[0134] As described above, when the double exposure processing mode is selected, all substrates G are transported along the same transport path and in the same order. Furthermore, in the double exposure processing mode, each of the plurality of substrates G with resist films formed thereon is sequentially transported to both the first exposure unit 3a and the second exposure unit 3b for double exposure processing.

[0135] Next, the transport of substrates G when the control unit 90 selects the single exposure processing mode will be described. In the single exposure processing mode, in which multiple substrates G are transported to only one of the first exposure device 3a and the second exposure device 3b, the path for transporting the substrates G to the first exposure device 3a and the path for transporting the substrates G to the second exposure device 3b are different. Therefore, the path for transporting the substrates G to the first exposure device 3a will be described first. Figure 6 It means in Figure 3FIG 2 is a diagram showing a transport path for the interface unit 20a to transport the substrate G only to the first exposure device 3a. Similar to the double exposure processing mode, transport of the substrate G in the single exposure processing mode is also achieved by the control unit 90 controlling the transport mechanism of the interface unit 20a.

[0136] The substrate G, heated by the pre-bake section 114 of the pre-processing section 11, is initially moved onto the cooling plate 51 for cooling. The first transport robot 31 removes the cooled substrate G from the cooling plate 51 and moves it into the buffer 53. The first transport robot 31 then removes the substrate G from the buffer 53 and moves it into the first temperature regulator 55. Similarly to the above description, if the first temperature regulator 55 is idle, the first transport robot 31 can also move the substrate G directly from the cooling plate 51 into the first temperature regulator 55.

[0137] Even in the single exposure processing mode, the buffer 53 serves to eliminate variations in the processing time between the first exposure unit 3a and the second exposure unit 3b. Specifically, when the processing time of the first exposure unit 3a and the second exposure unit 3b increases, the buffer 53 temporarily stores the substrates G with the resist film formed thereon to prevent processing in the pre-processing unit 11 from stalling.

[0138] The first temperature controller 55 accurately controls the temperature of the substrate G immediately before the exposure process to a predetermined temperature. The second transport robot 32 carries out the temperature-controlled substrate G from the first temperature controller 55 and carries it into the first exposure device 3 a.

[0139] The first exposure device 3a performs an exposure process on the substrate G, transferring a pattern onto the resist film. The second transport robot 32 removes the exposed substrate G from the first exposure device 3a and moves it into the first output path 58. Then, the third transport robot 33 removes the substrate G from the first output path 58 and moves it into the edge exposure machine 52. The first output path 58 also serves as a buffer when the substrate G, which has been exposed by the first exposure device 3a, is removed from the interface unit 20a. The edge exposure machine 52 performs an exposure process on the peripheral edge of the substrate G. The substrate G is then removed to the developing unit 121 of the post-processing unit 12.

[0140] Next, a path for conveying the substrate G to the second exposure device 3 b will be described. Figure 7 It means in Figure 3 FIG. 2 is a diagram showing a transport path in which the interface portion 20a transports the substrate G only to the second exposure device 3b.

[0141] The substrate G, heated by the pre-bake section 114 of the pre-processing section 11, is first transferred to the cooling plate 51 for cooling. The first transport robot 31 removes the cooled substrate G from the cooling plate 51 and transfers it to the buffer 53. The first transport robot 31 then removes the substrate G from the buffer 53 and transfers it to the first path 37.

[0142] Next, the third transport robot 33 unloads the substrate G from the first path 37 and carries it into the second path 38 . Then, the fourth transport robot 34 unloads the substrate G from the second path 38 and carries it into the second temperature controller 56 .

[0143] The second temperature controller 56 accurately controls the temperature of the substrate G before the exposure process to a predetermined temperature. The fifth transport robot 35 carries out the temperature-controlled substrate G from the second temperature controller 56 and carries it into the second exposure device 3 b.

[0144] The second exposure device 3b performs exposure processing on the substrate G and transfers the pattern onto the resist film. The fifth transport robot 35 unloads the substrate G after exposure processing from the second exposure device 3b and moves it into the third path 39. Next, the fourth transport robot 34 unloads the substrate G from the third path 39 and moves it into the second output path 59. Then, the third transport robot 33 unloads the substrate G from the second output path 59 and moves it into the edge exposure machine 52. The second output path 59 also serves as a buffer when the substrate G after exposure processing by the second exposure device 3b is unloaded from the interface part 20a. The edge exposure machine 52 performs exposure processing on the peripheral portion of the substrate G. Then, the substrate G is unloaded to the developing part 121 of the post-processing part 12.

[0145] As described above, when the single exposure processing mode is selected, the transport path ( Figure 6 ) and the transport path ( Figure 7 ) are different. In the single exposure processing mode, each of a plurality of substrates G with a resist film formed thereon is transported to either the first exposure unit 3a or the second exposure unit 3b for a single exposure process. By using the same mask in the first exposure unit 3a and the second exposure unit 3b, and alternately transporting the plurality of substrates G to the first exposure unit 3a and the second exposure unit 3b, throughput can be improved.

[0146] <1-5. Structure of the Second Interface>

[0147] Figure 8 This figure shows the structure of the second interface part 20b. Figure 3 The same components are denoted by the same reference numerals. The second interface unit 20b includes a conveying mechanism for conveying the substrate G and a plurality of modules. Figure 8The interface portion 20 b includes five transport robots (a first transport robot 31 , a second transport robot 32 , a third transport robot 33 , a fourth transport robot 34 , and a fifth transport robot 35 ) as a transport mechanism.

[0148] The first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 are identical to the transport robots of the first embodiment. Therefore, the first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 are all capable of transferring substrates G to and from surrounding modules. Furthermore, the first transport robot 31, the third transport robot 33, and the fourth transport robot 34 are single-handed robots with one hand. On the other hand, the second transport robot 32, which loads substrates G into and out of the first exposure unit 3a, and the fifth transport robot 35, which loads substrates G into and out of the second exposure unit 3b, are two-handed robots with two hands.

[0149] In addition, the interface part 20b has as a module: cooling plate 51; edge exposure machine 52; buffer 53; first temperature regulator 55; second temperature regulator 56; first path 37; second path 38; output path 57. Figure 3 Modules with the same reference numerals are the same as those in the first interface section 20a. Figure 3 Similar to the first output path 58 (or second output path 59), the output path 57 is a stack of, for example, five stages capable of holding a single substrate G, used to transfer substrates G between two transport robots. The output path 57 also functions as an output-side buffer, located downstream of the first exposure device 3a and the second exposure device 3b in the transport path for the substrate G. Furthermore, similar to the first interface unit 20a, strictly speaking, the interface unit 20b does not control the cooling plate 51 or the edge exposure device 52.

[0150] In the plurality of modules provided in the interface portion 20b, the first thermostat 55 and the first path 37 are stacked in two vertical layers. The first thermostat 55 is arranged in the upper layer, and the first path 37 is arranged in the lower layer. Furthermore, the second thermostat 56 and the second path 38 are also stacked in two vertical layers. The second thermostat 56 is arranged in the upper layer, and the second path 38 is arranged in the lower layer.

[0151] Thus, the second interface part 20b also has substantially the same components (transport robot and module) as the first interface part 20a. Figure 8 As shown, in the second interface portion 20b, the layout of the components is different from that of the first interface portion 20a. Figure 3 In the embodiment, the first exposure device 3a and the second exposure device 3b are arranged laterally, and Figure 8In the embodiment, the first exposure device 3a and the second exposure device 3b are separated from each other. Then, the layout of each component of the second interface part 20b is also the same as Figure 3 different.

[0152] When a plurality of substrate processing apparatuses 1 are arranged in a row in a factory, it is preferable to arrange them alternately. Figure 3 The first interface portion 20a and Figure 8 The second interface portion 20b shown. In this case, Figure 8 The first exposure device 3a in the layout is arranged between the pre-processing unit 11 of a substrate processing device 1 and the post-processing unit 12 of the substrate processing device 1 arranged adjacent thereto. In addition, by using the idle space PA ( Figure 3 ) and the idle space PB ( Figure 8 ) are arranged so that the interfaces of the two interfaces are intermeshed, thereby effectively utilizing the space within the factory without waste. That is, by arranging the interfaces of the two interfaces so that the fifth transfer robot 35 of the first interface 20a is located in space PB and the second transfer robot 32 of the second interface 20b is located in space PA, the space utilization efficiency can be improved.

[0153] like Figure 8 As shown, in the second interface portion 20b, the following are arranged around the first transport robot 31: a cooling plate 51; a buffer 53; a stacked structure of a first temperature regulator 55 and a first path 37; and a stacked structure of a second temperature regulator 56 and a second path 38. The first transport robot 31 transfers the substrate G to and from the cooling plate 51, the buffer 53, the first temperature regulator 55, and the second temperature regulator 56.

[0154] A stacked structure of the first temperature regulator 55 and the first path 37 is arranged around the second transport robot 32. The second transport robot 32 delivers the substrate G to the first temperature regulator 55, the first path 37, and the first exposure device 3a.

[0155] A buffer 53, a delivery path 57, and an edge exposure machine 52 are arranged around the third transport robot 33. The third transport robot 33 transfers the substrate G to and from the delivery path 57 and the edge exposure machine 52.

[0156] A stacked structure of a first temperature regulator 55 and a first path 37 and a stacked structure of a second temperature regulator 56 and a second path 38 are arranged around the fourth transport robot 34 . The fourth transport robot 34 delivers substrates G to the first path 37 , the second temperature regulator 56 , and the second path 38 .

[0157] A stacked structure of a second temperature regulator 56 and a second path 38, a buffer 53, and a delivery path 57 are arranged around the fifth transport robot 35. The fifth transport robot 35 delivers the substrate G to the second temperature regulator 56, the second path 38, the delivery path 57, and the second exposure device 3b.

[0158] <1-6. Substrate Transport at the Second Interface>

[0159] Then Figure 8 The following describes the transport of substrates G through the interface unit 20b. The second interface unit 20b also provides two modes for transporting substrates G: a double exposure mode and a single exposure mode. In the double exposure mode, each of the plurality of substrates G is sequentially transported to both the first exposure unit 3a and the second exposure unit 3b for double exposure. In the single exposure mode, each of the plurality of substrates G is transported to either the first exposure unit 3a or the second exposure unit 3b for single exposure. Similarly to the above, the control unit 90 selects either the double exposure mode or the single exposure mode.

[0160] Figure 9 It means in Figure 8 FIG. 1 shows a transport path for transporting substrates G to both the first exposure device 3a and the second exposure device 3b by the interface unit 20b (i.e., the transport path when the dual exposure processing mode is selected). The transport of substrates G described below is also achieved by the control unit 90 controlling the multiple transport robots of the interface unit 20b.

[0161] The substrate G, heated by the pre-bake section 114 of the pre-processing unit 11, is initially moved onto the cooling plate 51 for cooling. The first transport robot 31 removes the cooled substrate G from the cooling plate 51 and places it in the buffer 53. The first transport robot 31 then removes the substrate G from the buffer 53 and places it in the first temperature regulator 55. As previously mentioned, in the dual exposure processing mode, the buffer 53 serves to eliminate any discrepancies in the processing times of the first exposure unit 3a and the second exposure unit 3b. Furthermore, if the first temperature regulator 55 is idle, the first transport robot 31 can directly place the substrate G removed from the cooling plate 51 into the first temperature regulator 55.

[0162] The first temperature controller 55 accurately adjusts the temperature of the substrate G to a predetermined temperature immediately prior to exposure. The first temperature controller 55 not only regulates the temperature of the substrate G but also allows the substrate G to be rotated horizontally as needed. The second transport robot 32 removes the temperature-controlled substrate G from the first temperature controller 55 and loads it into the first exposure unit 3a. At this point, the second transport robot 32 removes the previously exposed substrate G from the first exposure unit 3a and loads an unexposed substrate G into the first exposure unit 3a for substrate exchange.

[0163] The first exposure device 3a performs an exposure process on the substrate G, transferring a pattern onto the resist film. The second transport robot 32 unloads the exposed substrate G from the first exposure device 3a and carries it into the first path 37. Next, the fourth transport robot 34 unloads the substrate G from the first path 37 and carries it into the second temperature controller 56.

[0164] The second temperature controller 56 accurately adjusts the temperature of the substrate G to a predetermined temperature before the second exposure process. The second temperature controller 56 not only controls the temperature of the substrate G but also allows the substrate G to be rotated horizontally as needed. The fifth transport robot 35 removes the temperature-controlled substrate G from the second temperature controller 56 and loads it into the second exposure unit 3b. At this point, the fifth transport robot 35 removes the previously exposed substrate G from the second exposure unit 3b and loads an unexposed substrate G into the second exposure unit 3b for substrate exchange.

[0165] The second exposure unit 3b uses a different mask from the first exposure unit 3a to expose the substrate G, transferring a pattern onto the resist film. The fifth transport robot 35 removes the exposed substrate G from the second exposure unit 3b and places it on the output path 57. The third transport robot 33 then removes the substrate G from the output path 57 and places it on the edge exposure unit 52. The edge exposure unit 52 exposes the periphery of the substrate G. The substrate G is then transported to the developing unit 121 of the post-processing unit 12.

[0166] As described above, when the double exposure processing mode is selected in the second interface unit 20b, all substrates G are transported along the same transport path and in the same order. Furthermore, in the double exposure processing mode, each of the plurality of substrates G on which a resist film has been formed is sequentially transported to both the first exposure unit 3a and the second exposure unit 3b for double exposure processing.

[0167] Next, the transport of substrates G when the control unit 90 selects the single exposure processing mode will be described. In the single exposure processing mode, in which a plurality of substrates G are transported to only one of the first exposure unit 3a and the second exposure unit 3b, the path for transporting substrates G to the first exposure unit 3a and the path for transporting substrates G to the second exposure unit 3b are different. Therefore, the path for transporting substrates G to the first exposure unit 3a will be described first. Figure 10 It means in Figure 8 FIG 2 is a diagram showing a transport path for the interface unit 20b to transport the substrate G only to the first exposure device 3a. Similar to the double exposure processing mode, the transport of the substrate G in the single exposure processing mode is also achieved by the control unit 90 controlling the transport mechanism of the interface unit 20b.

[0168] The substrate G, heated by the pre-bake section 114 of the pre-processing section 11, is initially transferred to the cooling plate 51 for cooling. The first transport robot 31 removes the cooled substrate G from the cooling plate 51 and transfers it to the buffer 53. The first transport robot 31 then removes the substrate G from the buffer 53 and transfers it to the first temperature regulator 55. Similarly to the above description, if the first temperature regulator 55 is idle, the first transport robot 31 can directly transfer the substrate G removed from the cooling plate 51 to the first temperature regulator 55.

[0169] In the single exposure processing mode, the buffer 53 also serves to eliminate variations in the processing time between the first exposure unit 3a and the second exposure unit 3b. Specifically, when the processing time of the first exposure unit 3a and the second exposure unit 3b increases, the buffer 53 temporarily stores the substrates G on which the resist film has been formed in order to prevent processing in the pre-processing unit 11 from stalling.

[0170] The first temperature controller 55 accurately controls the temperature of the substrate G immediately before the exposure process to a predetermined temperature. The second transport robot 32 carries out the temperature-controlled substrate G from the first temperature controller 55 and carries it into the first exposure device 3 a.

[0171] The first exposure device 3a performs an exposure process on the substrate G, transferring a pattern onto the resist film. The second transport robot 32 removes the exposed substrate G from the first exposure device 3a and moves it into the first path 37. Next, the fourth transport robot 34 removes the substrate G from the first path 37 and moves it into the second path 38. Next, the fifth transport robot 35 removes the substrate G from the second path 38 and moves it into the output path 57. The third transport robot 33 then removes the substrate G from the output path 57 and moves it into the edge exposure device 52. The edge exposure device 52 performs an exposure process on the periphery of the substrate G. The substrate G is then transported to the developing unit 121 of the post-processing unit 12.

[0172] Next, a path for conveying the substrate to the second exposure device 3 b will be described. Figure 11 It means in Figure 8 FIG. 2 is a diagram showing a transport path in which the interface portion 20b transports the substrate G only to the second exposure device 3b.

[0173] The substrate G, heated by the pre-bake section 114 of the pre-processing section 11, is initially transferred to the cooling plate 51 for cooling. The first transport robot 31 removes the cooled substrate G from the cooling plate 51 and transfers it to the buffer 53. The first transport robot 31 then removes the substrate G from the buffer 53 and transfers it to the second temperature regulator 56. Similarly to the above description, if the second temperature regulator 56 is idle, the first transport robot 31 can directly transfer the substrate G removed from the cooling plate 51 to the second temperature regulator 56.

[0174] The second temperature controller 56 accurately controls the temperature of the substrate G immediately before the exposure process to a predetermined temperature. The fifth transport robot 35 carries out the temperature-controlled substrate G from the second temperature controller 56 and carries it into the second exposure device 3 b.

[0175] The second exposure unit 3b performs an exposure process on the substrate G, transferring a pattern onto the resist film. The fifth transport robot 35 removes the exposed substrate G from the second exposure unit 3b and places it into the output path 57. The third transport robot 33 then removes the substrate G from the output path 57 and places it into the edge exposure unit 52. The edge exposure unit 52 performs an exposure process on the periphery of the substrate G. The substrate G is then transported to the developing unit 121 of the post-processing unit 12.

[0176] As described above, in the second interface unit 20b, when the single exposure processing mode is selected, the transport path ( Figure 10 ) and the transport path ( Figure 11 In the single exposure processing mode, each of the plurality of substrates G on which a resist film has been formed is conveyed to either the first exposure device 3a or the second exposure device 3b for a single exposure process.

[0177] <1-7. Transport Control>

[0178] In the first interface section 20a, a second transport path ( Figure 7 The transport path shown in FIG. 1 is a first transport path ( FIG. 2 ) that transports the substrate G from the pre-processing section 11 to the post-processing section 12 via the first exposure device 3a. Figure 6 The first transport path (shown in FIG. 2 ) is longer. That is, the first transport path through the first exposure device 3a is a short transport path, and the second transport path through the second exposure device 3b is a long transport path. Therefore, in the first interface unit 20a, the time required to transport the substrate G along the second transport path is longer than the time required to transport the substrate G along the first transport path.

[0179] On the other hand, in the second interface section 20b, a second transport path ( Figure 11 The transport path shown in FIG. 1 is a first transport path ( FIG. 2 ) that transports the substrate G from the pre-processing section 11 to the post-processing section 12 via the first exposure device 3a. Figure 10 The transport path shown in FIG. 3 is shorter. That is, the first transport path through the first exposure device 3a is a long transport path, and the second transport path through the second exposure device 3b is a short transport path. Therefore, at the second interface portion 20b, the time required to transport the substrate G along the second transport path is shorter than the time required to transport the substrate G along the first transport path.

[0180] In the first embodiment, a plurality of substrates G included in a batch are transported alternately along the first transport path or the second transport path. The plurality of substrates G are sequentially fed into the interface 20 from the pre-processing unit 11 at regular intervals. However, because the time required to transport a substrate G along the first transport path differs from the time required to transport a substrate G along the second transport path, the plurality of substrates G fed into the interface 20 at regular intervals are not discharged from the interface 20 at the same intervals as the feeding intervals. If the processing time of the first exposure unit 3a or the second exposure unit 3b does not vary significantly, substrates G fed along the short transport path can generally be discharged from the interface 20 in a shorter time than substrates G fed along the long transport path. However, the interface 20 prohibits substrates G from "overtaking." That is, a substrate G fed into the interface 20 later and transported along the short transport path is not allowed to be discharged from the interface 20 before a preceding substrate G fed along the long transport path. As a result, in the short transport path (the first transport path of the first interface part 20a, the second transport path of the second interface part 20b), the transport of the substrate G may enter a standby state because it has to wait for the preceding substrate G transported along the long transport path.

[0181] If a substrate G transported along the short transport path enters a transport standby state after exposure processing, the time from exposure processing to development processing becomes inconsistent for each substrate, resulting in variations in processing results. Furthermore, for example, if a substrate G transported along the first transport path (the short transport path) at the first interface 20a enters a standby state while being held by the third transport robot 33, the third transport robot 33 will also be unable to transport a substrate G transported along the second transport path. In other words, the transport of the substrate G at the interface 20 becomes stalled.

[0182] Therefore, in the first embodiment, the control unit 90 extends the processing time of the substrate G in any module included in the short transport path by a predetermined delay time. For example, in the case of the first interface unit 20a, the processing time of the substrate G in the first temperature regulator 55 included in the first transport path, which is the short transport path, is extended. Figure 12 The timing diagram schematically shows the extension of the processing time of the modules included in the short transport path. In the first interface unit 20a, the control unit 90 controls so that the processing time of the substrate G in the first temperature controller 55 is extended by only the predetermined delay time ( Figure 12 Furthermore, because the first temperature controller 55 supplies temperature-controlled gas to the substrate G and controls the temperature of the substrate G, even if the processing time is prolonged, it will not adversely affect the processing result (instead, it is expected that the entire substrate G will be uniformly temperature-controlled).

[0183] By extending the processing time of the substrate G in the first temperature controller 55 by a predetermined delay time, the timing of the substrate G transported along the first transport path being loaded into the first exposure device 3a is delayed, and thus the timing of the substrate G arriving at the first output path 58 is also delayed. This allows the time from when a substrate G transported along the first transport path, which is the short transport path, enters the first interface 20a to when it exits the first interface 20a to be substantially the same as the time from when a substrate G transported along the second transport path, which is the long transport path, enters the interface 20a to when it exits the interface 20a. As a result, the number of substrates G transported along the first transport path, which is the short transport path, entering a standby state while waiting for the previous substrate G transported along the second transport path, which is the long transport path, can be reduced.

[0184] In other words, the predetermined delay time is preferably set so that the time required to transport the substrate G along the first transport path, which is the short transport path, is equal to the time required to transport the substrate G along the second transport path, which is the long transport path. Furthermore, since the processing times of the first exposure device 3 a and the second exposure device 3 b frequently fluctuate, the time required to transport the substrate G along the short transport path is not necessarily the same as the time required to transport the substrate G along the long transport path.

[0185] In the first embodiment, the first interface 20a extends the processing time of substrates G in the first temperature regulator 55, included in the first transport path (a short transport path), by a predetermined delay time. This delays the time it takes to load substrates G into the first exposure device 3a, and also makes the time required to transport substrates G along the first transport path roughly the same as the time required to transport substrates G along the second transport path. This reduces the number of times substrates G enter a standby state while being transported along the first transport path. Furthermore, by making the time required to transport substrates G along the first transport path roughly the same as the time required to transport substrates G along the second transport path and delaying the timing of loading substrates G into the first exposure device 3a, the time it takes for multiple substrates G to undergo exposure and development processing can be roughly the same. Similarly, in the second interface 20b, the processing time of substrates G in the second temperature regulator 56, included in the second transport path (a short transport path), can be extended by a predetermined delay time. This achieves the same advantages as described above.

[0186] <Second embodiment>

[0187] Next, the second embodiment of the present invention will be described. The structures of the substrate processing apparatus 1 and the interface unit 20 of the second embodiment are the same as those of the first embodiment. Furthermore, the order in which a single substrate G is processed in the substrate processing apparatus 1 and the interface unit 20 of the second embodiment is also the same as in the first embodiment. In the second embodiment, multiple substrates G included in a batch are also transported alternately along the first transport path or the second transport path. Furthermore, the definitions of the first transport path and the second transport path are the same as in the first embodiment.

[0188] In both the first interface 20a and the second interface 20b, the buffer 53 functions as an input-side buffer, located upstream of the first exposure unit 3a and the second exposure unit 3b along the transport path for the substrate G. Meanwhile, in the first interface 20a, the first output path 58 is located downstream of the first exposure unit 3a along the first transport path and functions as a first output-side buffer dedicated to the first exposure unit 3a. Furthermore, the second output path 59 is located downstream of the second exposure unit 3b along the second transport path and functions as a second output-side buffer dedicated to the second exposure unit 3b. Furthermore, in the second interface 20b, the output path 57 is located downstream of the first exposure unit 3a and the second exposure unit 3b along both the first transport path and the second transport path and functions as a common output-side buffer for the first and second exposure units 3a and 3b.

[0189] When multiple substrates G are alternately fed into the first or second transport path at the first interface 20a, for example, even if the second exposure unit 3b on the longer transport path begins a lengthy alignment process and enters standby mode on the second transport path, substrate G transport continues along the first transport path. However, as described above, the first interface 20a prohibits substrates G from "overtaking." Consequently, exposed substrates G overflow from the first output path 58 of the first transport path, leaving no standby locations for substrates G that have already been exposed by the first exposure unit 3a. If exposed substrates G overflow from the first output path 58 and enter a standby state while being held by the second transport robot 32, transport of substrates G along the first transport path also enters a standby state.

[0190] Therefore, in the second embodiment, the control unit 90 controls the first transport robot 31 so that the number of substrates G located downstream of the buffer 53, which serves as the input buffer, in the first transport path is less than or equal to the number of substrates G that can be accommodated by the first output path 58, which serves as the first output buffer. Specifically, if the first output path 58 has, for example, five stacked stages, the number of substrates G that can be accommodated by the first output path 58 is five. In this case, the control unit 90 controls the first transport robot 31 to limit the removal of substrates G from the buffer 53 so that the number of substrates G located between the buffer 53 and the first output path 58 in the first transport path is less than or equal to five.

[0191] In this way, even if the second transport path enters a standby state, substrates G that have completed exposure processing can be prevented from overflowing from the first output path 58 in the first transport path, thereby reducing the number of substrates G transported into the standby state. Furthermore, in addition to the above, the control unit 90 can control the first transport robot 31 to limit the removal of substrates G from the buffer 53 so that the number of substrates G located between the buffer 53 and the second output path 59 in the second transport path is less than or equal to the number of substrates that the second output path 59 can accommodate. However, in the second transport path, which is longer than the first transport path, overflow of substrates G from the output buffer, causing transport to stop, is less likely to occur. Therefore, the control unit 90 can simply control the first transport robot 31 to limit the removal of substrates G from the buffer 53 so that at least the number of substrates G located between the buffer 53 and the first output path 58 in the first transport path is less than or equal to the number of substrates that the first output path 58 can accommodate.

[0192] On the other hand, when multiple substrates G are alternately fed into the first or second transport path at the second interface 20b, even if the first exposure unit 3a on the longer transport path is in standby mode on the first transport path, for example, due to a lengthy alignment process, the substrates G continue to be transported along the second transport path. This can cause substrates G exposed by the second exposure unit 3b to overflow from the output buffer 57, a common output buffer for both the first and second transport paths. Consequently, substrates G exposed by the first exposure unit 3a lose their storage position. If substrates G exposed by the first exposure unit 3a, having lost their storage position, remain in standby mode while being held by the fifth transport robot 35, the fifth transport robot 35 is unable to remove substrates G exposed by the second exposure unit 3b. In other words, transport of substrates G enters a standby mode on both the first and second transport paths.

[0193] Therefore, in the second embodiment, the control unit 90 controls the first transport robot 31 so that the number of substrates G located downstream of the buffer 53 (the input-side buffer) in the second transport path, which is the short transport path, is less than or equal to the number of substrates G that can be accommodated by the output path 57 (the output-side buffer) minus one. Specifically, if the output path 57 has, for example, five stacked stages, the number of substrates that can be accommodated by the output path 57 is five, and the number obtained by subtracting one from this is four. Therefore, the control unit 90 controls the first transport robot 31 to limit the removal of substrates G from the buffer 53 so that the number of substrates G located between the buffer 53 and the output path 57 in the second transport path is less than or equal to four.

[0194] This prevents substrates G that have completed exposure processing in the second exposure unit 3b from overflowing from the output path 57 even if a standby state occurs in the first transport path, thereby reducing the number of substrates G transported into the standby state. In the first interface 20a, the number of substrates G unloaded from the buffer 53 is set to be less than or equal to the number of substrates that can be accommodated in the first output path 58. In contrast, in the second interface 20b, the number of substrates G unloaded from the buffer 53 is set to be less than or equal to the number of substrates that can be accommodated in the output path 57 minus one, for the following reason. This is because the first output path 58 is an output-side buffer dedicated to the first exposure unit 3a, while the output path 57 is a shared output buffer for both the first exposure unit 3a and the second exposure unit 3b. Therefore, one substrate must always be available to accommodate substrates G that have completed exposure processing in the first exposure unit 3a. Furthermore, the control unit 90 can control the first transport robot 31 to limit the removal of substrates G from the buffer 53 so that the number of substrates G between the buffer 53 and the output path 57 in the first transport path is less than or equal to the number of substrates that can be accommodated in the output path 57 minus one. That is, as long as the control unit 90 controls the first transport robot 31 to limit the removal of the substrate G from the buffer 53, so that the number of substrates G located between the buffer 53 and the output path 57 in at least the second transport path is less than or equal to the number obtained by subtracting one from the number of substrates that the output path 57 can accommodate, it will be sufficient.

[0195] <Third embodiment>

[0196] Next, the third embodiment of the present invention will be described. The structures of the substrate processing apparatus 1 and the interface unit 20 of the third embodiment are the same as those of the first embodiment. Furthermore, the order in which a single substrate G is processed in the substrate processing apparatus 1 and the interface unit 20 of the third embodiment is also the same as that of the first embodiment. In the third embodiment, multiple substrates G included in a batch are also transported alternately along the first transport path or the second transport path. Furthermore, the definitions of the first transport path and the second transport path are the same as those of the first embodiment.

[0197] In both the first interface 20a and the second interface 20b, there is a difference in length between the first and second transport paths. If the first substrate G in a batch is simply assigned to the first transport path, the second substrate G to the second transport path, and the third substrate G to the first transport path, the first interface 20a will transport the leading substrate G along the short first transport path, while the second substrate G will be transported along the long second transport path. This will cause the leading substrate G to be transported to the post-processing unit 12 too quickly, increasing the difference in elapsed time between the exposure process and the development process of subsequent substrates G.

[0198] Therefore, in the third embodiment, the control unit 90 controls the first to fifth transport robots 31 to 35 to transport the leading substrate G of a batch along the long transport path. Specifically, at the first interface 20a, the control unit 90 controls the leading substrate G of a batch to be transported along the second transport path, which serves as the long transport path. That is, at the first interface 20a, the leading substrate G of a batch is transported along the second transport path, while the second substrate G is transported along the first transport path. Furthermore, at the second interface 20b, the control unit 90 controls the leading substrate G of a batch to be transported along the first transport path, which serves as the long transport path. That is, at the second interface 20b, the leading substrate G of a batch is transported along the first transport path, while the second substrate G is transported along the second transport path.

[0199] In this way, the second substrate G is unloaded to the post-processing section 12 in a short time after the first substrate G of a batch is unloaded to the post-processing section 12, thereby suppressing the occurrence of variations in the time from exposure processing to development processing of the plurality of substrates G included in a batch.

[0200] Modifications

[0201] The above describes the embodiments of the present invention. Various modifications other than those described above are possible without departing from the main purpose of the present invention. For example, in the first embodiment, the processing time of substrate G in the first temperature regulator 55 (or second temperature regulator 56) included in the short transport path is extended by only a predetermined delay time. However, this is not limited to this. The processing time of substrate G in other modules included in the short transport path can also be extended by only a predetermined delay time. In this way, the time required to transport substrate G along the short transport path can be made roughly the same as the time required to transport substrate G along the long transport path, which can reduce the number of substrates G entering the standby state during transport along the short transport path.

[0202] In addition, the layout of the transport mechanism and modules in the interface is not limited to Figure 3 and Figure 8The example shown in the figure suffices to arrange multiple transport robots and multiple modules in the interface. These multiple modules preferably include an input buffer located upstream of the first exposure unit 3a or the second exposure unit 3b, and an output buffer located downstream. Furthermore, to save space, it is preferable to stack some of the multiple modules. The layout of the interface can be modified appropriately depending on the installation locations of the first exposure unit 3a and the second exposure unit 3b.

[0203] In addition, the structures of the pre-processing unit 11 and the post-processing unit 12 are not limited to Figure 1 For example, an inspection unit or the like may be disposed between the cooling unit 123 and the indexer device 2. The inspection unit is a unit that inspects the substrate G using optical components such as a camera. Furthermore, for example, a dehydration and baking unit may be disposed between the cleaning unit 111 and the coating unit 112. The dehydration and baking unit is a unit that heats and removes moisture from the cleaned substrate G. Alternatively, the post-baking unit 122 and the cooling unit 123 may be omitted.

[0204] Furthermore, as the substrate G to be processed, other substrates for precision electronic devices such as semiconductor wafers, optical filter substrates, recording disk substrates, or solar cell substrates, which are different from glass substrates, can be used.

[0205] Furthermore, in each of the above-described embodiments, the substrate processing apparatus 1 may include the indexer apparatus 2 , and may also include the first exposure apparatus 3 a and the second exposure apparatus 3 b .

Claims

1. A substrate processing apparatus for sequentially performing a pre-exposure process and a post-exposure process on a plurality of substrates included in a batch, wherein: The substrate processing device comprises: A pre-processing unit, which performs the processing of the pre-process; A post-processing unit, performing the post-processing; An interface unit connects the pre-processing unit and the post-processing unit to the first exposure device and the second exposure device, and has a plurality of transport robots and a plurality of modules for transporting substrates; as well as A control unit controls the plurality of transport robots and the plurality of modules, The second transport path from the pre-processing section through the second exposure device to the post-processing section is longer than the first transport path from the pre-processing section through the first exposure device to the post-processing section. The plurality of substrates included in the batch are transported alternately along the first transport path or the second transport path. The control unit extends the processing time of the substrate in a specific module included in the first transport path by a predetermined delay time, the specific module being a temperature control module that controls the temperature of the substrate.

2. The substrate processing apparatus according to claim 1, wherein: The delay time is set so that the elapsed time required to transport the substrate along the first transport path becomes equal to the elapsed time required to transport the substrate along the second transport path.

3. The substrate processing apparatus according to claim 1, wherein: The plurality of modules include an input side buffer, the input side buffer being arranged upstream of the first exposure device and the second exposure device, The plurality of modules include a first output side buffer dedicated to the first exposure device, the first output side buffer being disposed downstream of the first exposure device in the first transport path, The plurality of modules include a second output side buffer used by the second exposure device, the second output side buffer being arranged downstream of the second exposure device in the second transport path, The control unit controls the plurality of transport robots so that the number of substrates located downstream of the input buffer in at least the first transport path is less than or equal to the number of substrates that can be accommodated by the first output buffer.

4. The substrate processing apparatus according to claim 1, wherein: The plurality of modules include an input side buffer, the input side buffer being arranged upstream of the first exposure device and the second exposure device, The plurality of modules include an output side buffer shared by the first exposure device and the second exposure device, wherein the output side buffer is arranged downstream of the first exposure device and the second exposure device. The control unit controls the plurality of transport robots so that the number of substrates located downstream of the input buffer in at least the first transport path is less than or equal to a number obtained by subtracting one from the number of substrates that the output buffer can accommodate.

5. The substrate processing apparatus according to claim 1, wherein: The control unit controls the plurality of transport robots to transport the leading substrate of the batch along the second transport path.

6. A substrate processing method, wherein a plurality of substrates included in a batch are sequentially subjected to a pre-exposure process and a post-exposure process, wherein: The substrate processing method comprises: In a transporting step, the substrate that has been subjected to the pre-processing process is transported to the first exposure device and / or the second exposure device at an interface unit, and the substrate that has been subjected to the exposure process is transported to a post-processing unit. The interface unit connects the pre-processing unit that performs the pre-processing process and the post-processing unit that performs the post-processing process to the first exposure device and the second exposure device. The interface unit includes a plurality of transport robots and a plurality of modules for transporting substrates. The second transport path from the pre-processing section through the second exposure device to the post-processing section is longer than the first transport path from the pre-processing section through the first exposure device to the post-processing section. The plurality of substrates included in the batch are transported alternately along the first transport path or the second transport path. The processing time of the substrate in the specific module included in the first transport path is extended by a predetermined delay time, the specific module being a temperature control module for controlling the temperature of the substrate.

7. The substrate processing method according to claim 6, wherein: The delay time is set so that the elapsed time required to transport the substrate along the first transport path becomes equal to the elapsed time required to transport the substrate along the second transport path.

8. The substrate processing method according to claim 6, wherein: The plurality of modules include an input side buffer, the input side buffer being arranged upstream of the first exposure device and the second exposure device, The plurality of modules include a first output side buffer dedicated to the first exposure device, the first output side buffer being disposed downstream of the first exposure device in the first transport path, The plurality of modules include a second output side buffer dedicated to the second exposure device, the second output side buffer being arranged downstream of the second exposure device in the second transport path, The number of substrates located downstream of the input-side buffer in at least the first transport path is less than or equal to the number of substrates that can be accommodated by the first output-side buffer.

9. The substrate processing method according to claim 6, wherein: The plurality of modules include an input side buffer, the input side buffer being arranged upstream of the first exposure device and the second exposure device, The plurality of modules include an output side buffer shared by the first exposure device and the second exposure device, wherein the output side buffer is arranged downstream of the first exposure device and the second exposure device. The number of substrates located downstream of the input-side buffer in at least the first transport path is less than or equal to the number of substrates that can be accommodated by the output-side buffer minus one.

10. The substrate processing method according to claim 6, wherein: The leading substrate of the batch is conveyed along the second conveyance path.

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