A heat dissipation system and electronic device

Abstract

This application provides a heat dissipation system and an electronic device. The heat dissipation system includes a heat-conducting component covering the surface of a heat source, with a heat-conducting medium filling the space between the heat-conducting component and the heat source; a cooling fan abutting against the portion of the heat-conducting component away from the heat source, with the air outlet of the cooling fan facing the heat-conducting component; and a bridge, with a first end connected to the housing of the cooling fan and a second end connected to the heat-conducting component. Both the housing of the cooling fan and the bridge are made of metal. The heat dissipation system provided in this application, in addition to using the cool airflow generated by the cooling fan to diffuse the heat from the heat-conducting component into the air, also utilizes the bridge to transfer a portion of the heat from the heat-conducting component to the housing of the cooling fan. This increases the pathways for heat exchange between the heat-conducting component and the outside environment, improving the speed of heat exchange and the utilization rate of the cool airflow. Therefore, the heat dissipation efficiency of the system is higher.

Description

[0001] This application is a divisional application. The original application has the application number 202310429372.5 and the original application date is April 21, 2023. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation system and electronic device. Background Technology

[0003] A computer is a machine with high-speed computing capabilities, encompassing various types including personal computers and embedded computers. Personal computers refer to multi-purpose computers of suitable size, price, and performance for personal use, such as desktops, laptops, and tablets. Thanks to advancements in integration technology, computers incorporate many highly integrated semiconductor chips, such as the central processing unit (CPU), graphics processing unit (GPU), and graphics double data rate (GDDR) memory. Due to the working principles of semiconductor chips, components like the CPU generate significant heat during computer operation. Additionally, computers contain other components prone to heat generation, such as capacitors, MOSFETs, and inductors. For high-performance personal computers, this heat generation is even more pronounced. Therefore, to ensure stable operation of personal computers, a reliable cooling solution is essential.

[0004] Computer cooling solutions typically involve equipping the computer with heat-conducting devices and fans. These devices include heat pipes, which transfer the heat generated by the heat-generating chips or devices to the location of the fan. The fan then drives the airflow around the chip or device, dissipating the heat into the external environment and thus cooling it down.

[0005] However, due to limitations in the heat transfer efficiency of heat-conducting devices, the heat generated by chips or devices tends to accumulate on these devices and cannot be dissipated to the external environment in a timely manner. This can lead to excessively high temperatures in chips or devices, affecting their performance and consequently degrading the overall performance of the computer, thus impacting the user experience. Summary of the Invention

[0006] This application provides a heat dissipation system and electronic device to solve the problem of poor heat dissipation effect of traditional heat dissipation solutions.

[0007] In a first aspect, embodiments of this application provide a heat dissipation system comprising: a heat-conducting component covering the surface of a heat source, wherein a heat-conducting medium is filled between the heat-conducting component and the heat source; a cooling fan abutting against the portion of the heat-conducting component away from the heat source, wherein the air outlet of the cooling fan faces the heat-conducting component; and a bridge, wherein a first end of the bridge is connected to the housing of the cooling fan, and a second end of the bridge is attached to the heat-conducting component; wherein the housing of the cooling fan and the bridge are both made of metal.

[0008] In this way, bridging can transfer heat between the heat-conducting component and the cooling fan housing, allowing the heat on the heat-conducting component to be quickly dissipated to the external environment. This can improve the heat exchange efficiency between the heat-conducting component and the external environment, alleviate the problem of heat accumulation on the heat-conducting component, and at the same time improve the utilization rate of the cold airflow generated by the cooling fan, thereby improving the efficiency of heat dissipation for the heat source.

[0009] In one feasible embodiment, the heat-conducting component includes: a heat-conducting plate covering the surface of a heat source, with a heat-conducting medium filling the space between the heat-conducting plate and the heat source; a cooling fan disposed adjacent to the heat-conducting plate; and a first end of a bridge connected to the housing of the cooling fan, with a second end of the bridge resting on the heat-conducting plate. In this way, heat from the heat-conducting plate can be transferred to the housing of the cooling fan via the bridge, and then dissipated to the external environment via a cool airflow.

[0010] In one feasible embodiment, the heat-conducting assembly further includes a first heat pipe and a first thermally conductive pad; the first heat pipe is attached to a heat-conducting plate; one end of the first heat pipe is located between the heat-conducting plate and the bridge; the first thermally conductive pad is pressed between the bridge, the heat-conducting plate, and the first heat pipe. This reduces the thermal resistance between the bridge, the heat-conducting plate, and the first heat pipe, thereby improving the efficiency of heat transfer.

[0011] In one feasible embodiment, the heat-conducting plate includes a first plate and a second plate connected to each other; both the first and second plates cover the surface of a heat source, and a thermally conductive medium is filled between the first and second plates and the heat source; a height difference exists between the first and second plates; a first heat pipe is located on the surface of the first plate away from the heat source, and the surface of the first heat pipe away from the heat source is in the same plane as the surface of the second plate away from the heat source. This facilitates the layout of heat sources with different thicknesses, improves the flatness of the device, and enhances the efficiency of heat transfer between the bridging and the heat-conducting plate.

[0012] In one feasible embodiment, the heat-conducting assembly further includes: at least one second heat pipe attached to the heat-conducting plate, the second heat pipe extending outward from the heat-conducting plate in at least one direction to form at least one condensation section away from the heat source; fins distributed in each condensation section and connected to the pipe wall of the condensation section; and at least one cooling fan, with each cooling fan corresponding to at least one condensation section, the air outlet of each cooling fan facing its corresponding condensation section and the fins connected to its corresponding condensation section. In this way, the heat from the heat-conducting plate can be dissipated to the external environment by the second heat pipes and fins.

[0013] In one feasible approach, when there are multiple second heat pipes, they are arranged side-by-side on the heat-conducting plate. Using multiple second heat pipes can improve the efficiency of heat exchange between the heat-conducting plate and the external environment, preventing excessive heat accumulation on the heat-conducting plate and thus avoiding affecting the heat dissipation efficiency of the heat source.

[0014] In one possible implementation, the thermally conductive assembly further includes a second thermally conductive pad pressed between the thermally conductive plate and the heat source; and / or, the thermally conductive assembly further includes thermally conductive grease filled between the thermally conductive plate and the heat source. This can reduce the thermal resistance between the thermally conductive plate and the heat source, and improve the efficiency of heat transfer between them.

[0015] In one feasible embodiment, the heat-conducting assembly further includes an elastic sheet; one end of the elastic sheet is fixed to the heat-conducting plate, and the other end is fixed to the printed circuit board where the heat source is located, so as to press the heat-conducting plate onto the heat source. In this way, the distance between the heat-conducting plate and the heat source can be reduced, so that the heat-conducting plate is tightly pressed onto the heat source, thereby reducing the thermal resistance between the heat-conducting plate and the heat source.

[0016] In one feasible approach, the housing of the cooling fan rests against the heated component, the heat of which is transferred from the heat source. In this way, the housing of the cooling fan can be used to dissipate heat from the heated component.

[0017] In one feasible embodiment, the thermally conductive component further includes a third thermally conductive pad, which is pressed between the cooling fan and the heated component. This reduces the thermal resistance between the cooling fan and the heated component, thereby improving the efficiency of heat transfer between them.

[0018] In one feasible approach, the bridge and cooling fan are integrated into a single structure. This reduces the thermal resistance between the bridge and the cooling fan, thereby improving the efficiency of heat transfer between them.

[0019] Secondly, embodiments of this application provide an electronic device, including: the heat dissipation system described in the first aspect and various implementations above.

[0020] As can be seen from the above technical solutions, the embodiments of this application provide a heat dissipation system and an electronic device. In addition to using the cold airflow generated by the cooling fan to diffuse the heat of the heat-conducting component into the air, the heat dissipation system also uses bridging to transfer a portion of the heat in the heat-conducting component to the cooling fan housing, thereby increasing the ways for the heat-conducting component to exchange heat with the outside world, improving the speed of heat exchange between the heat-conducting component and the outside world and the utilization rate of the cold airflow. Therefore, the heat dissipation efficiency of the heat dissipation system is higher. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a heat dissipation system;

[0022] Figure 2 This is an overall schematic diagram of a heat dissipation system provided in an embodiment of this application;

[0023] Figure 3 for Figure 2 A schematic diagram of direction A in the middle;

[0024] Figure 4 for Figure 2 A disassembly diagram of the heat dissipation system shown;

[0025] Figure 5 A diagram showing the positional relationship between the bridge, the heat-conducting plate, and the first heat pipe provided in an embodiment of this application;

[0026] Figure 6 for Figure 2 A schematic diagram of the B-direction;

[0027] Figure 7 This is a disassembly diagram of another heat dissipation system provided in an embodiment of this application;

[0028] Figure 8 for Figure 7 The diagram shows the heat transfer of the cooling system.

[0029] Figure 9 A diagram showing the positional relationship between the second bridge, the second heat-conducting plate, and the first heat pipe provided in an embodiment of this application;

[0030] Figure 10 A disassembly diagram of a laptop computer including a heat dissipation system, provided for an embodiment of this application;

[0031] Figure 11 for Figure 10 A magnified view of a portion of the image;

[0032] Figure 12 This is a schematic diagram showing the position of the third thermal pad provided in an embodiment of this application.

[0033] Among them, 01-Heat-generating components; 02-Copper plate; 03-Heat pipe; 04-Heat dissipation fins; 05-Fan; 10-Screen back cover; 20-Screen front bezel; 30-Top cover of the main unit; 40-Bottom cover of the main unit; 51-Motherboard; 511-Hole mounting; 52-CPU; 53-GPU; 54-GDDR; 55-CPU VR; 56-GPU VR; 57 - Charge; 100 - Thermal conductive component; 101 - Thermal plate; 1011 - First plate; 1012 - Second plate; 1014 - First thermal plate; 1015 - Second thermal plate; 102 - First heat pipe; 103 - First thermal pad; 104, 104A, 104B - Second heat pipe; 1041 - Condensation section; 10411, 10411A, 10411B - First condensation section; 10412, 10412A, 10412B - Second Condensation section; 105-Fin; 1051-First fin; 1052-Second fin; 106-Second thermal pad; 107-Thermal grease; 108-Elastic sheet; 109-Third thermal pad; 200-Heat source; 300-Cooling fan; 301-Air inlet; 302-First cooling fan; 3021-First screw seat; 303-Second cooling fan; 3031-Second screw seat; 400-Bridge; 401-First bridge; 402-Second bridge; 500-Heated component. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings.

[0035] In the description of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B. The "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Furthermore, "at least one" means one or more, and "multiple" means two or more. The terms "first," "second," etc., do not limit the quantity or order of execution, and "first," "second," etc., do not necessarily imply differences.

[0036] It should be noted that, in this application, the terms "exemplary" or "for example" are used to indicate that something is being described as an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0037] The application scenarios of the embodiments of this application will be described below with reference to the accompanying drawings.

[0038] A computer is a machine with high-speed computing capabilities, encompassing various types including personal computers and embedded computers. Personal computers refer to multi-purpose computers of suitable size, price, and performance for personal use, such as desktops, laptops, and tablets. Thanks to advancements in integration technology, computers incorporate many highly integrated semiconductor chips, such as the central processing unit (CPU), graphics processing unit (GPU), and graphics double data rate (GDDR) memory. Due to the working principles of semiconductor chips, components like the CPU generate significant heat during computer operation. Additionally, computers contain other components prone to heat generation, such as capacitors, MOSFETs, and inductors. For high-performance personal computers, this heat generation is even more pronounced. Therefore, to ensure stable operation of personal computers, a reliable cooling solution is essential.

[0039] Computer cooling solutions typically involve equipping the computer with heat-conducting devices and fans. These devices include heat pipes, which transfer the heat generated by the heat-generating chips or devices to the location of the fan. The fan then drives the airflow around the chip or device, dissipating the heat into the external environment and thus cooling it down.

[0040] However, due to limitations in the heat transfer efficiency of thermal conductive devices, the heat generated by the chip or device tends to accumulate on the device and cannot be dissipated to the external environment in a timely manner. This can lead to excessively high temperatures in the chip or device, affecting its performance and consequently degrading the overall performance of the computer, thus impacting the user experience.

[0041] The heat dissipation scheme is illustrated below with reference to the accompanying drawings.

[0042] Figure 1 This is a schematic diagram of a heat dissipation system.

[0043] like Figure 1 As shown, the heat dissipation system can be applied to a laptop computer. The heat dissipation system includes a heat-generating device 01, a copper plate 02, a heat pipe 03, heat dissipation fins 04, and a fan 05. The copper plate 02 covers the heat-generating device 01. One end of the heat pipe 03 is fixed to the copper plate 02, and the other end extends away from the heat-generating device 01. The heat dissipation fins 04 abut against the end of the heat pipe 03 away from the heat-generating device 01. The fan 05 includes an air outlet that faces the heat dissipation fins 04.

[0044] Furthermore, copper is a material with high thermal conductivity. Therefore, when a copper plate 02, made of copper, covers the heating element 01, the copper plate 02 can collect the heat generated by the heating element 01. Furthermore, the heat pipe 03 is a heat transfer element that relies on the phase change of its internal working fluid to achieve heat transfer. It can absorb heat from the relatively high-temperature end and then transfer the heat to the relatively low-temperature end. Specifically, the heat pipe 03 can absorb heat from the copper plate 02 and transfer the heat to the heat dissipation fins 04. Furthermore, the air outlet of the fan 05 faces the heat dissipation fins 04, and by directly blowing air onto the heat dissipation fins 04, it can remove the heat from the heat dissipation fins 04. In this way, the heat generated by the heating element 01 can be dissipated into the external environment.

[0045] However, there is thermal resistance between the copper plate 02 and the heat pipe 03. This thermal resistance affects the heat transfer efficiency between the copper plate 02 and the heat pipe 03, resulting in a lower amount of heat absorbed by the heat pipe 03 from the copper plate 02. Consequently, the heat generated by the heating device 01 accumulates on the copper plate 02 and is difficult to dissipate, affecting the heat dissipation effect of the heat dissipation system on the heating device 01. This can easily lead to an abnormal increase in the temperature of the heating device 01 or cause the heating device 01 to reduce its frequency, thus affecting the user experience.

[0046] To address the aforementioned issues, this application provides a heat dissipation system that fully utilizes the temperature difference between the cooling fan and the heat-conducting components, allowing the fan housing to participate in the heat dissipation process. This further improves the efficiency of the heat dissipation system in cooling heat-generating devices and enhances the user experience.

[0047] The heat dissipation system provided in this application embodiment can be applied to electronic devices with heat dissipation requirements, such as desktop computers, laptops, mini-laptops, tablets, and ultrabooks. It can also be applied to workstation devices, servers, switches, network node devices, large-screen devices (e.g., smart screens, smart TVs), handheld game consoles, home game consoles, virtual reality devices, augmented reality devices, mixed reality devices, and in-vehicle smart terminals.

[0048] The heat dissipation system provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0049] Figure 2 This is a schematic diagram of the overall heat dissipation system provided in an embodiment of this application.

[0050] Figure 3 for Figure 2 A schematic diagram of direction A in the middle.

[0051] Figure 4 for Figure 2 The diagram shows a disassembly diagram of the heat dissipation system.

[0052] like Figures 2-4 As shown, the heat dissipation system provided in this application embodiment can be applied to electronic devices to dissipate heat from various heat sources, such as heat source 200. There can be multiple heat sources 200. Heat sources 200 can be the CPU, GPU, or GDDR of the electronic device, or capacitors, MOSFETs, or inductors configured for the CPU or GPU, or any device that generates heat, such as when charging the electronic device.

[0053] In this embodiment, the heat dissipation system includes a heat-conducting component 100, a cooling fan 300, and a bridging element 400. The heat-conducting component 100 covers the surface of the heat source 200, and a thermally conductive medium, such as thermal grease or a thermally conductive pad, may be filled between the heat-conducting component 100 and the heat source 200. Thus, the heat-conducting component 100 can collect the heat generated by the heat source 200 during operation and transfer the collected heat away from the heat source 200. The cooling fan 300 abuts against the portion of the heat-conducting component 100 away from the heat source 200, and the air outlet of the cooling fan 300 faces the heat-conducting component 100.

[0054] The cooling fan 300 can be, for example, a centrifugal fan. The housing of the cooling fan 300 may have an air inlet and an air outlet. The cooling fan 300 internally includes components such as an impeller and a rotating shaft. The impeller forms a flow channel connecting the air inlet and the air outlet. As the cooling fan 300 rotates, airflow can flow axially from outside the electronic device through the air inlet into the flow channel. Under centrifugal force, it is thrown towards the edge of the impeller and then discharged from the air outlet, finally blowing onto the heat-conducting component 100. The airflow on the heat-conducting component 100 can blow the heat on the heat-conducting component 100 to the outside of the electronic device. In this way, the heat generated by the heat source 200 can be dissipated to the external environment, achieving the purpose of cooling the heat source 200.

[0055] See also Figures 2-4 The first end of the bridge 400 can be connected to the housing of the cooling fan 300, and the second end of the bridge 400 can be attached to the heat-conducting component 100. In this embodiment, the bridge 400 can be a plate structure made of a material with excellent thermal conductivity. The bridge 400 is disposed between the housing of the cooling fan 300 and the heat-conducting component 100, and can play a role in heat transfer between the cooling fan 300 and the heat-conducting component 100.

[0056] The heat transfer process of the bridge 400 is described in further detail below.

[0057] In this embodiment, the cooling fan 300 is a device connecting the outside and inside of the electronic device. The airflow inside its casing is drawn in from the external environment through the air inlet on the casing. Since the electronic device contains heat sources such as the heat source 200, the temperature of the external environment is significantly lower than the temperature inside the electronic device. Therefore, the airflow entering the casing of the cooling fan 300 from the outside is a cooler airflow relative to the heat-conducting component 100. Furthermore, the continuous flow of this cool airflow creates a significant temperature difference between the casing of the cooling fan 300 and the heat-conducting component 100. In practical applications, the temperature of the heat-conducting component 100 is approximately 60°C, while the temperature of the casing of the cooling fan 300, due to the effect of the cool airflow, is below 40°C. Thus, a significant temperature difference exists between the heat-conducting component 100 and the casing of the cooling fan 300; in some cases, this temperature difference can reach 30°C.

[0058] The bridging 400 provided in this embodiment can be connected between the housing of the cooling fan 300 and the heat-conducting component 100, so that heat can flow from the high-temperature area of ​​the heat-conducting component 100 to the low-temperature area of ​​the cooling fan 300. Furthermore, after the heat on the heat-conducting component 100 is transferred to the housing of the cooling fan 300 with a lower temperature, as the cold air flows inside the cooling fan 300, the heat on the housing of the cooling fan 300 can gradually dissipate to the external environment with the cold air flow, thereby achieving the effect of reducing the temperature of the heat-conducting component 100.

[0059] As can be seen, in this embodiment, two heat dissipation paths are provided for the heat-conducting component 100. The first is a direct airflow from the cooling fan 300, which uses cold airflow to directly remove heat from the heat-conducting component 100. The second is a new path provided by the bridge 400, which can transfer heat from the heat-conducting component 100 to the housing of the cooling fan 300, which has a lower temperature. Then, the heat on the housing of the cooling fan 300 can be dissipated to the external environment through the flow of cold air, thereby reducing the temperature of the heat-conducting component 100.

[0060] This improves the heat exchange efficiency between the heat-conducting component 100 and the external environment, alleviating the problem of heat accumulation on the heat-conducting component 100 and increasing the utilization rate of cold airflow. Furthermore, it improves the heat exchange efficiency between the heat-conducting component 100 and the heat source 200, enhancing the efficiency of heat dissipation for the heat source 200 and preventing abnormal overheating or frequency reduction of the heat source 200 due to poor heat dissipation.

[0061] In this embodiment, as heat is continuously transferred between the housing of the cooling fan 300 and the heat-conducting component 100, the temperature of the cooling fan 300 housing will increase slightly, while the temperature of the heat-conducting component 100 will not become excessively high. This evens out the temperature between the heat-conducting component 100 and the cooling fan 300 housing, preventing localized overheating of the electronic device and improving the user experience.

[0062] In this embodiment, the housing of the cooling fan 300 and the bridge 400 can be made of metal, such as aluminum alloy or copper. Metals have high thermal conductivity; for example, aluminum alloy has a thermal conductivity of approximately 236 W / (m*K). Therefore, the cooling fan 300 and bridge 400 made of metal can quickly remove heat from the heat-conducting component 100, exhibiting excellent performance in heat transfer. Furthermore, metals have a large specific heat capacity, especially aluminum alloy, which can reach 902 J / (kg·K). Therefore, the cooling fan 300 and bridge 400 made of metal have stronger heat absorption and dissipation capabilities, improving the efficiency of heat exchange with the heat-conducting component 100.

[0063] In some embodiments, the cooling fan 300 and the bridge 400 can be an integral structure. This reduces the thermal resistance between the bridge 400 and the housing of the cooling fan 300, allowing heat to be smoothly transferred from the bridge 400 to the housing of the cooling fan 300. The cooling fan 300 and the bridge 400 can be manufactured by die casting. When manufacturing the cooling fan 300, the bridge 400 can be directly integrally formed onto the housing of the cooling fan 300.

[0064] See also Figure 4 The heat-conducting component 100 provided in this embodiment may include a heat-conducting plate 101, which covers the surface of the heat source 200, and a heat-conducting medium is filled between the heat-conducting plate 101 and the heat source 200. Thus, the heat-conducting plate 101 can absorb heat from the heat source 200, and the heat generated when the heat source 200 is working can be transferred to the heat-conducting plate 101. Furthermore, a cooling fan 300 is disposed adjacent to the heat-conducting plate 101, a first end of a bridge 400 is connected to the housing of the cooling fan 300, and a second end of the bridge 400 overlaps the heat-conducting plate 101.

[0065] In this embodiment, the bridge 400 can transfer heat from the heat-conducting plate 101 to the housing of the cooling fan 300. When the cooling fan 300 rotates, it generates a cool airflow. This cool airflow enters the cooling fan 300 from the external environment and then flows out of the cooling fan 300's outlet to the external environment. Therefore, with the flow of the cool airflow, the heat on the cooling fan 300 housing can be dissipated to the external environment. This achieves the goal of rapidly dissipating the heat from the heat-conducting plate 101 to the external environment.

[0066] It should be further noted that the air outlet of the cooling fan 300 does not face the heat conduction plate 101. The specific orientation of the air outlet of the cooling fan 300 can be determined by the actual layout, and this embodiment does not impose specific limitations on it. The specific positional relationship between the cooling fan 300 and the heat conduction plate 101, such as the distance between them, can also be determined based on the actual layout, and this embodiment does not impose specific limitations on it.

[0067] In some implementations, the heat-conducting plate 101 can be made of copper. Since copper has a high thermal conductivity, approximately 401 W / (m·K), the heat-conducting plate 101 made of copper has high thermal conductivity and can absorb heat from the heat source 200 relatively quickly.

[0068] See also Figure 4 The heat-conducting component 100 may further include a first heat pipe 102 and a first heat-conducting pad 103, wherein the first heat pipe 102 is attached to the heat-conducting plate 101, one end of the first heat pipe 102 is located between the heat-conducting plate 101 and the bridge 400, and the first heat-conducting pad 103 can be pressed between the bridge 400 and the heat-conducting plate 101 and the first heat pipe 102.

[0069] It is understandable that the bridge 400 can be connected to both the heat-conducting plate 101 and the first heat pipe 102. The positional relationship between the bridge 400 and the heat-conducting plate 101 and the first heat pipe 102 will be described in detail below, and will not be repeated here.

[0070] A heat pipe is a heat transfer element that relies on the phase change of its internal working liquid to achieve heat transfer, possessing excellent thermal conductivity. In practical applications, heat pipes can be laid on a heat source. Furthermore, the heat pipe can extend from the surface of the heat source away from it, thus creating a temperature difference along the entire length of the heat pipe. The heat pipe is filled with liquid; during operation, the portion of the heat pipe overlapping with the heat source absorbs heat. This heat absorption manifests as the liquid inside the heat pipe evaporating and vaporizing. The vapor then flows under the slight pressure difference within the heat pipe, gradually moving towards the cooler end (the end away from the heat source), where it condenses back into liquid, releasing heat. The liquid can then flow back to the portion of the heat pipe overlapping with the heat source, continuing the cycle. Therefore, heat pipes can be used for heat transfer. Based on the working process of a heat pipe, it can be divided into an evaporation section and a condensation section.

[0071] As can be seen, the first heat pipe 102 has excellent thermal conductivity, thus it can quickly transfer heat from the heat-conducting plate 101 to the bridge 400, improving the efficiency of heat transfer between the heat-conducting plate 101 and the bridge 400. This, in turn, allows for rapid transfer of the heat accumulated on the heat-conducting plate 101 to the housing of the cooling fan 300, resulting in high heat dissipation efficiency.

[0072] In this embodiment, the first thermally conductive pad 103 can be, for example, silicone rubber, glass fiber, or polyester substrate. When subjected to pressure, the first thermally conductive pad 103 can fill the gaps between the heat-conducting plate 101 and the bridge 400, and between the first heat pipe 102 and the bridge 400 as much as possible, squeezing out air from the contact surfaces of the heat-conducting plate 101 and the bridge 400, and the first heat pipe 102 and the bridge 400. This reduces the contact thermal resistance between the contact surfaces and improves the efficiency of heat transfer.

[0073] Figure 5 A diagram showing the positional relationship between the bridging element, the heat-conducting plate, and the first heat pipe provided in an embodiment of this application.

[0074] like Figure 5 As shown, the heat-conducting plate 101 may include a first plate 1011 and a second plate 1012 connected to each other. Both the first plate 1011 and the second plate 1012 cover the surface of the heat source 200. A thermally conductive medium may be filled between the first plate 1011 and the second plate 1012 and the heat source 200. The thermally conductive medium may be, for example, thermally conductive silicone grease or a thermally conductive pad. The first plate 1011 and the second plate 1012 may be an integral structure, and there is a height difference between the first plate 1011 and the second plate 1012.

[0075] In the layout of electronic devices, there are cases where different heat sources 200 have different thicknesses. For example, the thicknesses of various components such as capacitors, MOSFETs, or inductors configured for the CPU or GPU are different. Furthermore, since the heat sources 200 are fixed to other components of the electronic device, such as the motherboard, it is necessary to ensure the flatness of the surface of each heat source 200 away from the heat-conducting plate 101. This makes the surface of the heat source 200 close to the heat-conducting plate 101 less flat.

[0076] The first plate 1011 and the second plate 1012 provided in this embodiment have a height difference, which allows the first plate 1011 and the second plate 1012 to tightly cover the heat sources 200 of different thicknesses. In this way, heat sources 200 of different thicknesses can dissipate heat smoothly.

[0077] In practical applications, the dimensions of the first plate 1011 and the second plate 1012 can be determined by the actual layout, and this application embodiment does not impose specific limitations on this. In this application embodiment, the heat-conducting plate 101 is not limited to only the first plate 1011 and the second plate 1012; the heat-conducting plate 101 can include multiple plate structures, and there can be height differences between the multiple plate structures. The specific structure of the heat-conducting plate 101 can be determined by the actual layout of the heat source 200, and this application embodiment does not impose specific limitations on this.

[0078] It is understood that in this embodiment, the first plate 1011 is suitable for a heat source 200 with a smaller thickness, and the second plate 1012 is suitable for a heat source 200 with a larger thickness. After covering the heat source 200, the distance between the first plate 1011 and the bridge 400 is greater than the distance between the second plate 1012 and the bridge 400, and the difference in distance is the height difference between the first plate 1011 and the second plate 1012.

[0079] In this embodiment, to improve the speed of heat transfer between the heat-conducting plate 101 and the housing of the cooling fan 300, a feasible approach is to increase the cross-sectional area of ​​the bridge 400 to increase the contact area between the bridge 400 and the heat-conducting plate 101. Since electronic devices are generally small in size and their internal components are compactly arranged, increasing the cross-sectional area of ​​the bridge 400 may result in the bridge 400's orthogonal projection onto the heat-conducting plate 101 covering both the first plate 1011 and the second plate 1012.

[0080] At this point, the height difference between the first plate 1011 and the second plate 1012 will affect the overlap of the bridge 400. This embodiment utilizes the first heat pipe 102 to compensate for this height difference. Specifically, the first heat pipe 102 is attached to the surface of the first plate 1011 away from the heat source 200, and the thickness of the first heat pipe 102 is equal to the height difference between the first plate 1011 and the second plate 1012. Thus, the surface of the first heat pipe 102 away from the heat source 200 and the second plate 1012 can be on the same plane, allowing the bridge 400 to overlap both the second plate 1012 and the first heat pipe 102 simultaneously. This effectively increases the total contact area between the bridge 400 and the heat-conducting plate 101, and the heat transfer between the bridge 400 and the heat-conducting plate 101 via the first heat pipe 102 increases the heat flux between them, thereby improving the efficiency of heat transfer.

[0081] It should be further noted that the bridge 400 simultaneously connects to the first heat pipe 102 and the second plate 1012, which is one example of the position of the bridge 400 provided in the embodiments of this application. The bridge 400 can also connect to other positions of the heat-conducting plate 101. For example, the bridge 400 can completely connect to the first heat pipe 102 without direct contact with the heat-conducting plate 101. The specific positional relationship between the bridge 400, the first heat pipe 102, and the heat-conducting plate 101 can be determined by the actual layout, and the embodiments of this application do not impose specific limitations on this.

[0082] It should be further noted that, in this embodiment, along the thickness direction of the heat source 200, the first end of the bridge 400 can be fixed to the surface of the cooling fan 300 away from the heat source 200. The bridge 400 can also be fixed to the side of the cooling fan 300. The specific fixing position of the bridge 400 can be determined according to the actual situation, as long as the second end of the bridge 400 can overlap the heat-conducting plate 101.

[0083] In some implementations, the area where the first heat pipe 102 contacts the first plate 1011 can be welded together. In this way, the first heat pipe 102 can be tightly attached to the first plate 1011, which can reduce the thermal resistance between the two and improve the heat dissipation efficiency.

[0084] See also Figure 4 and Figure 5 The second end of the bridge 400 can be close to the edge of the heat-conducting plate 101, and the first heat pipe 102 can be located at the edge of the heat-conducting plate 101. Furthermore, the edge of the heat-conducting plate 101 is far from the second heat pipe 104. In this way, the locations where heat is transferred outward from the heat-conducting plate 101 are distributed more evenly, resulting in a more uniform temperature distribution and preventing localized overheating of the electronic device, thus improving the user experience.

[0085] The first end of the bridge 400 is fixed to the housing of the cooling fan 300, and the fixed position is close to the edge of the heat conduction plate 101. In this way, the distance of heat transfer between the heat conduction plate 101 and the cooling fan 300 can be shortened, so that heat can be quickly transferred from the heat conduction plate 101 to the housing of the cooling fan 300, avoiding excessive heat accumulation on the heat conduction plate 101 and affecting the working performance of the heat source 200.

[0086] In the actual layout process, the extension direction of the first heat pipe 102 on the heat-conducting plate 101 can follow the layout changes of the heat source 200, and is not limited to the first heat pipe 102 being flush with the edge of the heat-conducting plate 101. The edge of the heat-conducting plate 101 away from the second heat pipe 104 can protrude from the first heat pipe 102.

[0087] In some implementations, the number of first heat pipes 102 is not limited to one. One or more first heat pipes 102 can be set according to the layout of heat source 200, cooling fan 300 and bridge 400. This application embodiment does not make specific limitations in this regard.

[0088] See also Figure 3 In this embodiment, the heat-conducting component 100 may further include at least one second heat pipe 104, which is attached to the heat-conducting plate 101. Thus, the second heat pipe 104 can absorb heat from the heat-conducting plate 101. Furthermore, the second heat pipe 104 may extend outward from the heat-conducting plate 101 in at least one direction to form at least one condensation portion 1041 away from the heat source 200.

[0089] It is understood that the second heat pipe 104 partially overlaps with the heat-conducting plate 101, and the second heat pipe 104 can extend outward from the heat-conducting plate 101 to form a condenser section 1041. Therefore, the second heat pipe 104 can absorb heat from the heat-conducting plate 101 and transfer the heat to the condenser section 1041. In this way, the heat on the heat-conducting plate 101 can be transferred by the second heat pipe 104 to a location away from the heat source 200, thereby achieving heat dissipation from the heat source 200.

[0090] It should be noted that for at least one second heat pipe 104, it can extend outward from the heat-conducting plate 101 in different directions to form multiple condensation portions 1041 away from the heat source 200. These multiple condensation portions 1041 are equivalent to multiple portions of the heat-conducting component 100 away from the heat source 200. The specific extension direction of the second heat pipe 104 can be determined by the actual heat dissipation requirements and layout. This application embodiment does not specifically limit this.

[0091] Figure 3 The diagram schematically shows that the middle position of the second heat pipe 104 coincides with the heat-conducting plate 101, and its two ends extend to both sides of the heat-conducting plate 101 respectively, forming a condensation section 1041 on each side of the heat-conducting plate 101. This is only an exemplary case provided by the embodiment of this application and does not impose a specific limitation on the extension direction of the second heat pipe 104.

[0092] It is understandable that inside electronic devices, the heat source 200 is generally small in size and densely packed, making it difficult for the heat pipe to make sufficient contact with it. Directly attaching the heat pipe to the heat source 200 would affect its heat dissipation efficiency. In this embodiment, the second heat pipe 104 is attached to the heat-conducting plate 101, and the heat-conducting plate 101 has a plate-like structure. This allows the heat-conducting plate 101 to make sufficient contact with the heat source 200, enabling it to fully absorb the heat generated by the heat source 200. This not only improves the heat dissipation efficiency of the cooling system but also increases the utilization rate of the second heat pipe 104.

[0093] In some implementations, the area where the second heat pipe 104 contacts the heat-conducting plate 101 can be welded together. In this way, the second heat pipe 104 can fit tightly against the heat-conducting plate 101, which can reduce the thermal resistance between the two and improve heat dissipation efficiency.

[0094] See also Figure 3 The heat-conducting component 100 may further include fins 105, which are distributed in each condenser section 1041 and connected to the tube wall of the condenser section 1041. When vapor inside the second heat pipe 104 flows to the condenser section 1041, the vapor condenses into liquid and releases heat. Since the fins 105 are connected to the tube wall of the condenser section 1041, the fins 105 absorb the heat released by the condenser section 1041.

[0095] In some implementations, the area where the fins 105 contact the condenser section 1041 can be welded together. This allows the condenser section 1041 to fit tightly against the fins 105, reducing thermal resistance and improving heat dissipation efficiency.

[0096] In this embodiment, the number of cooling fans 300 is at least one, and at least one cooling fan 300 is provided in a one-to-one correspondence with at least one condenser section 1041. The air outlet of each cooling fan 300 faces its corresponding condenser section 1041 and the fins 105 connected to its corresponding condenser section 1041. In some implementations, the air outlet of the cooling fan 300 may abut against the condenser section 1041 and the fins 105.

[0097] As can be seen, there can be a one-to-one correspondence between the cooling fan 300 and the condenser section 1041. Each extension of the second heat pipe 104 outward from the heat-conducting plate 101 in one direction forms a condenser section 1041. Each condenser section 1041 is provided with fins 105, and each condenser section 1041 includes a corresponding cooling fan 300. In this way, the cooling fan 300 can directly blow on the fins 105 connected to its corresponding condenser section 1041, and remove heat from the fins 105 through the cool airflow. Furthermore, the cooling fan 300 can directly blow on its corresponding condenser section 1041, which improves heat dissipation efficiency and also improves the flatness between the second heat pipe 104 and the cooling fan 300 housing, facilitating installation.

[0098] In some implementations, the size of the contact area between the fin 105 and the cold airflow can be determined by the actual layout, and this application embodiment does not specifically limit this.

[0099] It should be noted that the specific direction in which the second heat pipe 104 extends can be determined by the actual situation, and this application embodiment does not make specific limitations on this.

[0100] It should be noted that each cooling fan 300 and the heat conduction plate 101 can be connected by a bridge 400, and the number of bridges 400 between each cooling fan 300 and the heat conduction plate 101 is not limited to one; the specific number can be determined according to the actual situation.

[0101] As can be seen from the above, this application embodiment provides two paths for transferring heat from the heat-conducting plate 101 to the external environment:

[0102] The first path is as follows: the second heat pipe 104 absorbs heat from the heat conduction plate 101 and transfers the heat to the fins 105. Then the cooling fan 300 can rotate and form a cool airflow to blow directly onto the fins 105, so as to dissipate the heat on the fins 105 to the external environment.

[0103] The second path is as follows: the bridge 400 transfers the heat from the heat-conducting plate 101 to the housing of the cooling fan 300. Then, as the cool air flows inside the cooling fan 300, the cool air can dissipate the heat from the housing of the cooling fan 300 to the external environment through the fins 105.

[0104] It is understandable that the flow of cold air creates a temperature difference between the cooling fan 300 and other components. The location of the cooling fan 300 forms a low-temperature region, while the location of the heat-conducting plate 101 is a high-temperature region relative to this low-temperature region. This embodiment takes into account the availability of the low-temperature region, therefore, a bridge 400 is used to transfer heat from the heat-conducting plate 101 to the housing of the cooling fan 300. Then, the cold airflow dissipates the heat from the housing of the cooling fan 300 to the external environment via the fins 105. This embodiment provides a new path for heat dissipation of the heat-conducting plate 101.

[0105] As can be seen, the embodiments of this application make full use of the temperature difference between the low temperature region and the high temperature region, balance the heat of the high temperature region to the low temperature region, accelerate the dissipation of the heat accumulated on the heat conduction plate 101 to the external environment, avoid the large accumulation of heat on the heat conduction plate 101, avoid the problem of the heat source 200 failing to work properly due to poor heat dissipation effect, and have high heat dissipation efficiency.

[0106] Figure 6 for Figure 2 A schematic diagram of direction B (where heat source 200 is not shown).

[0107] like Figure 6As shown, the thermally conductive medium can be a second thermally conductive pad 106, which can be pressed between the heat-conducting plate 101 and the heat source 200. The second thermally conductive pad 106 can be, for example, silicone rubber, glass fiber, or polyester substrate. Under pressure, the second thermally conductive pad 106 can fill the gap between the heat-conducting plate 101 and the heat source 200 as much as possible, squeezing out air from the contact surface between the heat-conducting plate 101 and the heat source 200. This reduces the contact thermal resistance between the contact surfaces and improves the efficiency of heat transfer.

[0108] The second thermally conductive pad 106 can be fixed on the heat-conducting plate 101. There can be multiple second thermally conductive pads 106, each distributed at a corresponding position of the heat source 200 on the heat-conducting plate 101. The specific shape of the second thermally conductive pad 106 can depend on the shape of the heat source 200; this embodiment does not specifically limit this.

[0109] It should be noted that, Figure 6 Only a portion of the second thermally conductive pads 106 are shown in the illustration. The specific number of the second thermally conductive pads 106 can be determined by the actual layout of the heat source 200, and this embodiment does not impose a specific limitation on this. The specific distribution position of the second thermally conductive pads 106 can also be determined by the actual layout of the heat source 200, and this embodiment does not impose a specific limitation on this.

[0110] See also Figure 6 The thermally conductive medium can be thermal grease 107, which can be filled between the heat-conducting plate 101 and the heat source 200. The thermal grease 107 can be used to reduce the thermal resistance between the heat-conducting plate 101 and the heat source 200, thereby improving the efficiency of heat transfer.

[0111] In some implementations, the thermal grease 107 may be composed of zinc oxide (ZnO) or silver (Ag), etc., but this application does not specifically limit this.

[0112] In practical applications, the specific distribution of the second thermal pad 106 and the thermal grease 107 between the heat-conducting plate 101 and the heat source 200 can be determined by the actual situation, and this application embodiment does not make specific limitations on this.

[0113] See also Figure 6 An air inlet 301 can be provided on the cooling fan 300. In this way, the cool air can enter the housing of the cooling fan 300 through the air inlet 301.

[0114] See also Figure 4In this embodiment, the heat-conducting component 100 may further include an elastic sheet 108. One end of the elastic sheet 108 may be fixed to the heat-conducting plate 101, and the other end may be fixed to the printed circuit board where the heat source 200 is located, so as to press the heat-conducting plate 101 onto the heat source 200. When the heat dissipation system provided in this embodiment is applied to an electronic device such as a laptop computer, the printed circuit board where the heat source 200 is located may be the motherboard of the laptop computer. In this way, one end of the elastic sheet 108 may be fixed to the heat-conducting plate 101, and the other end may be fixed to the motherboard.

[0115] In practical applications, the elastic sheet 108 can be in a stretched state. This allows the elastic sheet 108 to apply a force to the heat-conducting plate 101 close to the printed circuit board where the heat source 200 is located, ensuring the heat-conducting plate 101 is tightly pressed onto the printed circuit board. This reduces the thermal resistance between the heat-conducting plate 101 and the heat source 200. Furthermore, the elastic sheet 108 securely fixes the heat-conducting plate 101 to the printed circuit board where the heat source 200 is located, preventing the heat-conducting plate 101 from shifting.

[0116] In this embodiment, there can be multiple elastic sheets 108, which can be distributed at various positions on the heat-conducting plate 101. The specific distribution position can be determined by the actual layout, and this embodiment does not impose any specific limitations on this.

[0117] In some implementations, when the heat dissipation system provided in this application is applied to an electronic device, the heat source 200 of the electronic device can transfer the heat it generates to devices that are in direct or indirect contact with it, and the heat dissipation system is in contact with the aforementioned components, for example, the cooling fan 300 is in contact with the aforementioned devices. The heat dissipation system provided in this application can provide a thermally conductive pad at the position where the cooling fan 300 contacts the aforementioned devices, so as to utilize the housing of the cooling fan 300 to dissipate heat from the aforementioned devices. The specific placement of the thermally conductive pad will be detailed below and will not be repeated here.

[0118] The following description, in conjunction with the accompanying drawings, illustrates the case where the two ends of the second heat pipe 104 extend to both sides of the heat-conducting plate 101, respectively, forming a condensation section 1041 on each side of the heat-conducting plate 101.

[0119] Figure 7 This is a disassembly diagram of another heat dissipation system provided in an embodiment of this application.

[0120] like Figure 7As shown in the embodiments of this application, the heat-conducting component 100 may include a heat-conducting plate 101, a second heat pipe 104, a first fin 1051, and a second fin 1052. The heat-conducting plate 101 covers the surface of the heat source 200, and a thermally conductive medium may be filled between the heat-conducting plate 101 and the heat source 200. This thermally conductive medium may be, for example, a thermally conductive pad or thermally conductive silicone grease. In this way, the heat-conducting plate 101 can absorb heat from the heat source 200.

[0121] The second heat pipe 104 is attached to the heat-conducting plate 101, specifically to the surface of the heat-conducting plate 101 away from the heat source 200. This allows the second heat pipe 104 to absorb heat from the heat-conducting plate 101. The middle of the second heat pipe 104 partially overlaps with the heat-conducting plate 101, and its two ends extend to both sides of the heat-conducting plate 101, forming a first condensation section 10411 and a second condensation section 10412 away from the heat source 200. The first condensation section 10411 is located on one side of the heat-conducting plate 101, and the second condensation section 10412 is located on the other side. In this way, heat from the heat-conducting plate 101 can be transferred to the location away from the heat source 200 via the second heat pipe 104, achieving heat dissipation from the heat source 200.

[0122] See also Figure 7 The first fin 1051 can be connected to the wall of the first condenser section 10411, specifically by welding. In this way, the second heat pipe 104 can transfer heat to the first fin 1051 through the first condenser section 10411. The second fin 1052 can be connected to the wall of the second condenser section 10412, specifically by welding. In this way, the second heat pipe 104 can transfer heat to the second fin 1052 through the second condenser section 10412. In this embodiment, the contact area between the first fin 1051 and the second fin 1052 and the cold airflow can be determined by the actual layout, and this embodiment does not impose specific limitations on this.

[0123] See also Figure 7 The heat dissipation system provided in this application embodiment may include a first cooling fan 302 and a second cooling fan 303. The first cooling fan 302 is correspondingly disposed with the first condenser 10411, and the air outlet of the first cooling fan 302 faces the corresponding first condenser 10411 and the first fin 1051 connected to the corresponding first condenser 10411. Thus, when the first cooling fan 302 rotates, it can form a cold airflow that blows toward the first fin 1051. When the cold airflow passes through the first fin 1051, it can carry away the heat on the first fin 1051.

[0124] The second cooling fan 303 is correspondingly disposed to the second condenser 10412. The air outlet of the second cooling fan 303 faces the corresponding second condenser 10412 and the second fin 1052 connected to the corresponding second condenser 10412. In this way, the second cooling fan 303 can generate a cool airflow that blows directly onto the second fin 1052. As the cool airflow passes through the second fin 1052, it can carry away the heat on the second fin 1052.

[0125] In this way, the first fin 1051 and the second fin 1052 can continuously absorb heat from the second heat pipe 104, which can ensure the stable operation of the heat dissipation system.

[0126] In this embodiment, the first fin 1051 can have its side facing the air outlet of the first cooling fan 302. The size of the first fin 1051 can be matched with the size of the air outlet of the first cooling fan 302, so that the first fin 1051 and the cool airflow blown out by the first cooling fan 302 can make full contact, thereby improving the heat dissipation effect. The second fin 1052 can also have its side facing the air outlet of the second cooling fan 303. The size of the second fin 1052 can be matched with the size of the air outlet of the second cooling fan 303, so that the second fin 1052 and the cool airflow blown out by the second cooling fan 303 can make full contact, thereby improving the heat dissipation effect.

[0127] It should be further noted that the first condenser 10411 can cover the top of the first fin 1051, and the length of the first condenser 10411 can match the length of the first fin 1051. In this way, the first condenser 10411 can quickly transfer heat to the first fin 1051. The second condenser 10412 can cover the top of the second fin 1052, and the length of the second condenser 10412 can match the length of the second fin 1052. In this way, the second condenser 10412 can quickly transfer heat to the second fin 1052.

[0128] See also Figure 7 In this embodiment of the application, the number of second heat pipes 104 can be multiple. When there are multiple second heat pipes 104, the multiple second heat pipes 104 can be arranged side by side on the heat-conducting plate 101, and the multiple second heat pipes 104 can extend outward from the heat-conducting plate 101 in the same or different directions.

[0129] For example, see continue. Figure 7There can be two second heat pipes 104, namely second heat pipe 104A and second heat pipe 104B. The second heat pipe 104A and the second heat pipe 104B can be arranged side by side on the heat-conducting plate 101, and the second heat pipe 104A and the second heat pipe 104B extend outward from the heat-conducting plate 101 in the same direction. At this time, the second heat pipe 104A and the second heat pipe 104B can form a heat pipe group.

[0130] The two ends of the second heat pipe 104A extend to both sides of the heat-conducting plate 101, respectively, forming a first condensing section 10411A and a second condensing section 10412A away from the heat source 200. The two ends of the second heat pipe 104B extend to both sides of the heat-conducting plate 101, respectively, forming a first condensing section 10411B and a second condensing section 10412B away from the heat source 200. Since the second heat pipes 104A and 104B extend in the same direction, the first condensing sections 10411A and 10411B are arranged side-by-side, and can both correspond to the first cooling fan 302. The second condensing sections 10412A and 10412B are also arranged side-by-side, and can both correspond to the second cooling fan 303. It can be seen that when the extension directions of each second heat pipe 104 in the heat pipe group are the same, each condenser section 1041 in the same extension direction can correspond to the same cooling fan 300.

[0131] It should be noted that when there are multiple second heat pipes 104, the dimensions of the first fin 1051 and the second fin 1052 can be designed based on the number of second heat pipes 104.

[0132] Setting up multiple second heat pipes 104 can improve the efficiency of heat exchange between the heat-conducting plate 101 and the external environment, and can prevent excessive heat accumulation on the heat-conducting plate 101, thereby avoiding affecting the heat dissipation efficiency of the heat source 200.

[0133] See also Figure 7In this embodiment, the heat-conducting plate 101 may include a first heat-conducting plate 1013 and a second heat-conducting plate 1014. Along the length of the second heat pipe 104, the first heat-conducting plate 1013 and the second heat-conducting plate 1014 may be arranged side-by-side, with the first heat-conducting plate 1013 close to the first cooling fan 302 and the second heat-conducting plate 1014 close to the second cooling fan 303. It is understood that the first cooling fan 302 and a first fin 1051 corresponding to the first cooling fan 302 are disposed on the side of the first heat-conducting plate 1013 away from the second heat-conducting plate 1014, and the first condensation portion 10411 of the second heat pipe 104 covers the first fin 1051. The second cooling fan 303 and a second fin 1052 corresponding to the second cooling fan 303 are disposed on the side of the second heat-conducting plate 1014 away from the first heat-conducting plate 1013, and the second condensation portion 10412 of the second heat pipe 104 covers the second fin 1052.

[0134] In some embodiments, the first heat-conducting plate 1013 and the second heat-conducting plate 1014 can be flexibly covered on different heat sources 200, which is beneficial for the layout of the heat sources 200. Part of the heat from the heat source 200 can be absorbed by the first heat-conducting plate 1013, and the remaining heat from the heat source 200 can be absorbed by the second heat-conducting plate 1014.

[0135] In this embodiment, the first heat-conducting plate 1013 and the second heat-conducting plate 1014 are plate-shaped structures. The shape and size of the first heat-conducting plate 1013 and the second heat-conducting plate 1014 can be the same or different; the specific shape and size can be determined by the actual layout and heat dissipation requirements, and this embodiment does not impose specific limitations on this. Due to the influence of device layout, both the first heat-conducting plate 1013 and the second heat-conducting plate 1014 can be composed of multiple plate structures, and there can be height differences between the multiple plate structures; this embodiment does not impose specific limitations on this.

[0136] It should be further noted that, in the embodiments of this application, the heat-conducting plate 101 is not limited to including the first heat-conducting plate 1013 and the second heat-conducting plate 1014, and the arrangement of the first heat-conducting plate 1013 and the second heat-conducting plate 1014 is not limited to being arranged side by side along the length direction of the second heat pipe 104. It can be determined by the actual layout. The embodiments of this application do not make specific limitations in this regard.

[0137] See also Figure 7The heat dissipation system provided in this application embodiment may include a first bridge 401 and a second bridge 402. A first end of the first bridge 401 can be connected to the housing of the first cooling fan 302, and a second end of the first bridge 401 can be attached to the first heat-conducting plate 1013. Thus, the first bridge 401 can facilitate heat transfer between the first heat-conducting plate 1013 and the first cooling fan 302. Heat on the first heat-conducting plate 1013 can be transferred to the housing of the first cooling fan 302 through the first bridge 401, and then the heat on the housing of the first cooling fan 302 can be dissipated to the external environment through a cool airflow.

[0138] The first end of the second bridge 402 can be connected to the housing of the second cooling fan 303, and the second end of the second bridge 402 can be attached to the second heat-conducting plate 1014. In this way, the second bridge 402 can facilitate heat transfer between the second heat-conducting plates 1014. Heat on the second heat-conducting plate 1014 can be transferred to the housing of the second cooling fan 303 through the second bridge 402, and then the heat on the housing of the second cooling fan 303 can be dissipated to the external environment through cool airflow.

[0139] In some implementations, the first bridge 401 can be an integral structure with the first cooling fan 302, and a die-casting process can be used to integrally mold the first bridge 401 onto the housing of the first cooling fan 302. The second bridge 402 can also be an integral structure with the second cooling fan 303, and a die-casting process can be used to integrally mold the second bridge 402 onto the housing of the second cooling fan 303.

[0140] Due to the influence of device layout, the shape, length, etc. of the first bridge 401 and the second bridge 402 may be the same or different. This application embodiment does not make specific limitations on this.

[0141] See also Figure 7 The heat-conducting component 100 also includes a first heat pipe 102, which can be attached to the first heat-conducting plate 1013 and the second heat-conducting plate 1014, specifically to the surface of the first heat-conducting plate 1013 and the second heat-conducting plate 1014 away from the heat source 200. Therefore, the first heat pipe 102 can span across the first heat-conducting plate 1013 and the second heat-conducting plate 1014.

[0142] One end of the first heat pipe 102 can extend between the first heat-conducting plate 1013 and the first bridge 401. In this way, the first heat pipe 102 can absorb heat from the first heat-conducting plate 1013 and transfer the heat to the first bridge 401. Furthermore, the heat can be transferred to the housing of the first cooling fan 302 through the first bridge 401. Because the first heat pipe 102 has excellent thermal conductivity, it can quickly transfer heat between the first bridge 401 and the first heat-conducting plate 1013, improving the efficiency of heat transfer between them. This allows for the rapid transfer of heat accumulated on the first heat-conducting plate 1013 to the outside, resulting in high heat dissipation efficiency.

[0143] See also Figure 7 The other end of the first heat pipe 102 can extend between the second heat-conducting plate 1014 and the second bridge 402. In this way, the second heat pipe 104 can absorb heat from the second heat-conducting plate 1014 and transfer the heat to the second bridge 402. Furthermore, the heat can be transferred to the housing of the second cooling fan 303 through the second bridge 402. Because the first heat pipe 102 has excellent thermal conductivity, it can also quickly transfer heat between the second bridge 402 and the second heat-conducting plate 1014, improving the efficiency of heat transfer between them. Furthermore, it can quickly transfer the heat accumulated on the second heat-conducting plate 1014 to the outside, resulting in high heat dissipation efficiency.

[0144] In some implementations, the second heat pipe 104 can be welded to the first heat-conducting plate 1013 and the second heat-conducting plate 1014. This reduces the thermal resistance between the second heat pipe 104 and the first heat-conducting plate 1013 and the second heat-conducting plate 1014, while also ensuring that the second heat pipe 104 is securely fixed to the first heat-conducting plate 1013 and the second heat-conducting plate 1014.

[0145] Figure 8 for Figure 7 The diagram shows the heat transfer of the cooling system.

[0146] Figure 8 The heat source 200 in the diagram is only shown as an example in the form of a dashed box and does not represent the actual structure of the heat source 200.

[0147] like Figure 8 As shown, this embodiment of the application provides two paths for transferring heat from the first heat-conducting plate 1013 and the second heat-conducting plate 1014 to the external environment:

[0148] The first heat pipe 102 absorbs heat from the first heat-conducting plate 1013 and transfers the heat to the first fin 1051. Then, the first cooling fan 302 rotates and generates a cool airflow that blows directly onto the first fin 1051, dissipating the heat from the first fin 1051 to the external environment. The first heat pipe 102 can also absorb heat from the second heat-conducting plate 1014 and transfer the heat to the second fin 1052. Then, the second cooling fan 303 rotates and generates a cool airflow that blows directly onto the second fin 1052, dissipating the heat from the second fin 1052 to the external environment.

[0149] The second pathway is as follows: The first bridge 401 transfers heat from the first heat-conducting plate 1013 to the housing of the first cooling fan 302. Then, as cool air flows inside the first cooling fan 302, the cool air dissipates the heat from the housing of the first cooling fan 302 to the external environment via the first fins 1051. The second bridge 402 transfers heat from the second heat-conducting plate 1014 to the housing of the second cooling fan 303. Then, as cool air flows inside the second cooling fan 303, the cool air dissipates the heat from the housing of the second cooling fan 303 to the external environment via the second fins 1052.

[0150] Figure 9 A diagram showing the positional relationship between the second bridge, the second heat-conducting plate, and the first heat pipe, provided for an embodiment of this application.

[0151] like Figure 8 and Figure 9 As shown, the second end of the second bridge 402 can be close to the edge of the second heat-conducting plate 1014, and the first heat pipe 102 can be located at the edge of the second heat-conducting plate 1014. Furthermore, the edge of the first heat-conducting plate 1013 is far from the second heat pipe 104. In this way, the locations where the second heat-conducting plate 1014 transfers heat outward are distributed evenly across the second heat-conducting plate 1014, resulting in a more uniform temperature distribution. This helps prevent localized overheating of the electronic device and improves the user experience.

[0152] The first end of the second bridge 402 is fixed to the housing of the second cooling fan 303, and the fixed position is close to the edge of the second heat-conducting plate 1014. In this way, the distance of heat transfer between the second heat-conducting plate 1014 and the second cooling fan 303 can be shortened, so that heat can be quickly transferred from the second heat-conducting plate 1014 to the housing of the second cooling fan 303, avoiding excessive heat accumulation on the second heat-conducting plate 1014 and affecting the working performance of the heat source 200.

[0153] In the actual layout process, the extension direction of the first heat pipe 102 on the second heat-conducting plate 1014 can follow the layout changes of the heat source 200, and is not limited to the first heat pipe 102 being flush with the edge of the second heat-conducting plate 1014. The edge of the second heat-conducting plate 1014 away from the second heat pipe 104 can protrude from the first heat pipe 102.

[0154] The other positional relationships between the first bridge 401, the first heat-conducting plate 1013 and the first heat pipe 102 can be referred to the above description of the positions of the second bridge 402, the second heat-conducting plate 1014 and the first heat pipe 102, and will not be repeated here.

[0155] See also Figure 7 The heat-conducting component 100 also includes a plurality of first heat-conducting pads 103. The first heat-conducting pads 103 can be pressed between the first bridge 401 and the first heat-conducting plate 1013 and the first heat pipe 102, and the first heat-conducting pads 103 can also be pressed between the second bridge 402 and the second heat-conducting plate 1014 and the first heat pipe 102. In this way, the efficiency of heat transfer can be improved.

[0156] The thermal conductivity of the first bridge 401 and the second bridge 402 is described below as an example.

[0157] According to the heat conduction theory formula, the heat transfer rate between the first heat-conducting plate 1013 and the first bridge 401 is:

[0158] Q1 = (K·S·△T) / L (Formula 1)

[0159] Wherein, Q1 is the heat transfer rate when heat is transferred between the first heat-conducting plate 1013 and the first bridge 401, K is the thermal conductivity of the first heat-conducting pad 103, S is the contact area between the first bridge 401 and the first heat-conducting plate 1013, ΔT is the temperature difference between the first bridge 401 and the first heat-conducting plate 1013, and L is the thickness of the first heat-conducting pad 103.

[0160] Taking an example where the length and width of the first bridge 401 and the second bridge 402 are approximately 10mm*10mm, the thickness of the first thermally conductive pad 103 after compression is approximately 0.25mm, the thermal conductivity of the first thermally conductive pad 103 is approximately 4W / (m*℃), the temperature difference between the first bridge 401 and the first thermally conductive plate 1013 is approximately 5℃, and the temperature difference between the second bridge 402 and the second thermally conductive plate 1014 is also approximately 5℃, the heat transfer rate Q1 when transferring heat between the first thermally conductive plate 1013 and the first bridge 401 can be calculated based on Formula 1 as follows: Q1 = 4 * 0.1 * 5 / 0.25 = 8W. Correspondingly, the heat transfer rate Q2 when transferring heat between the second thermally conductive plate 1014 and the second bridge 402 is 8W. Therefore, the heat transfer rate Q = Q1 + Q2 = 16W when transferring heat between the bridge 400 structure and the thermally conductive plate 101.

[0161] In summary, the heat dissipation system provided in this application embodiment adds a bridging structure 400, which increases the heat transfer rate of the heat dissipation system by at least 16W. This can accelerate the heat dissipation efficiency of the heat source 200, allowing the temperature of the heat source 200 to be maintained at a lower value, reducing heat loss during operation of the heat source 200, and increasing the operating power of the heat source 200.

[0162] In some embodiments, the heat dissipation system provided in this application can be applied to personal computers, such as laptops. The specific process of the heat dissipation system for laptops is described in detail below with reference to the accompanying drawings.

[0163] Figure 10 This is a disassembly diagram of a laptop computer including a heat dissipation system, provided for an embodiment of this application.

[0164] Figure 11 for Figure 10 A magnified view of a portion of the image.

[0165] like Figure 10 and Figure 11As shown, the laptop computer includes a rear screen cover (shell A) 10, a front screen bezel (shell B) 20, and a screen assembly located between the rear screen cover 10 and the front screen bezel 20. It also includes a top cover (shell C) 30, a keyboard located on the top cover 30, and a bottom cover (shell D) 40. A motherboard 51 is disposed between the top cover 30 and the bottom cover 40. The motherboard 51 can be a printed circuit board (PCB) laid on the back of the keyboard. The motherboard 51 houses the main circuitry of the computer, such as a BIOS chip, I / O control chip, key and panel control switch interfaces, indicator light connectors, expansion slots, and DC power supply connectors for the motherboard and expansion cards. The area between the top cover 30 and the bottom cover 40 may also include heat-generating components, such as a CPU 52, a GPU 53, and GDDR54. The heat-generating devices may also include capacitors, MOSFETs, or inductors configured for the CPU. In this embodiment, these devices are collectively referred to as CPU VR 55. The heat-generating devices may also include capacitors, MOSFETs, or inductors configured for the GPU. In this embodiment, these devices are collectively referred to as GPU VR 56. The heat-generating devices may also include any device that generates heat, such as when charging electronic devices. In this embodiment, this device is referred to as Charge 57. Furthermore, CPU 52, GPU 53, GDDR 54, CPU VR 55, GPU VR 56, and Charge 57 can be arranged on the motherboard 51. The specific distribution of each device can be determined by actual needs, and this embodiment does not impose specific limitations on this. It is understood that CPU 52, GPU 53, GDDR 54, CPU VR 55, GPU VR 56, and Charge 57 are the heat sources 200 described in this embodiment.

[0166] In this embodiment, the first heatsink 1013 covers the GPU 53, GDDR 54, and GPU VR 56, and the second heatsink 1014 covers the CPU 52, CPU VR 55, and Charge 57. Furthermore, the first heat pipe 102 and the second heat pipe 104 are attached to the surfaces of the first heatsink 1013 and the second heatsink 1014 away from the CPU 52.

[0167] Since the CPU 52 and GPU 53 are devices that generate significant heat, in this embodiment, the orthographic projection of the second heat pipe 104 in the thickness direction of the heat source 200 can cover the CPU 52 and GPU 53. This allows the second heat pipe 104 to quickly dissipate heat from the CPU 52 and GPU 53, enabling them to maintain high-performance operation. The orthographic projection of the first heat pipe 102 in the thickness direction of the CPU 52 can cover or partially cover CPU VR 55, GPU VR 56, and Charge 57. This increases the speed at which the second heat pipe 104 dissipates heat from the CPU VR 55, GPU VR 56, and Charge 57, quickly balancing the heat generated by these components during operation.

[0168] In practical applications, the heat generated by the CPU 52, GPU 53, GDDR 54, CPU VR 55, GPU VR 56, and Charge 57 can be absorbed by the first heat-conducting plate 1013 and the second heat-conducting plate 1014. Then, the heat on the first heat-conducting plate 1013 can be transferred to the first fin 1051 by the second heat pipe 104. Furthermore, the heat on the first fin 1051 can be blown to the outside of the laptop by the cool airflow generated by the first cooling fan 302. Similarly, the heat on the second heat-conducting plate 1014 can be transferred to the second fin 1052 by the second heat pipe 104. Finally, the heat on the second fin 1052 can be blown to the outside of the laptop by the cool airflow generated by the second cooling fan 303. Furthermore, the heat on the first heat-conducting plate 1013 can also be transferred to the housing of the first cooling fan 302 through the first bridge 401. The heat can then be dissipated to the outside of the laptop by the cool airflow generated by the first cooling fan 302. Similarly, the heat on the second heat-conducting plate 1014 can be transferred to the housing of the second cooling fan 303 through the second bridge 402. The heat can then be dissipated to the outside of the laptop by the cool airflow generated by the second cooling fan 303. Therefore, the cooling system provided in this embodiment can dissipate heat from the laptop with high efficiency, improving laptop performance and enhancing the user experience.

[0169] See also Figure 10 and Figure 11The heat dissipation system provided in this embodiment may further include multiple elastic sheets 108. One end of each elastic sheet 108 may be fixed to the first heat-conducting plate 1013 or the second heat-conducting plate 1014, and the other end may be fixed to the motherboard 51. In this way, the first heat-conducting plate 1013 or the second heat-conducting plate 1014 can be pressed onto the heat source 200. This can reduce the thermal resistance between the first heat-conducting plate 1013 or the second heat-conducting plate 1014 and the heat source 200, and can also prevent the first heat-conducting plate 1013 or the second heat-conducting plate 1014 from shifting.

[0170] See also Figure 10 and Figure 11 The motherboard 51 may have a receiving hole 511, and the first cooling fan 302 and the second cooling fan 303 are located in the receiving hole 511.

[0171] It can be understood that the laptop has ventilation holes for the intake and exhaust of the cooling fan 300.

[0172] In some implementations, the heat source 200 can transfer the heat it generates to devices that are in direct or indirect contact with it; these devices can be referred to as heat-receiving components 500. For example, the heat source 200 may transfer some heat to the motherboard 51, so the component located on the side of the motherboard 51 away from the heat source 200 will become the heat-receiving component 500. In practical applications, the heat-receiving component 500 is generally a keyboard component. In this embodiment, the cooling fan 300 may abut against the heat-receiving component 500, or there may be a small gap of approximately 1 mm between the cooling fan 300 and the heat-receiving component 500.

[0173] Figure 12 This is a schematic diagram showing the position of the third thermal pad provided in an embodiment of this application.

[0174] like Figures 10-12 As shown, the heat-conducting component 100 may further include a third heat-conducting pad 109, which is pressed between the cooling fan 300 and the heated component 500. This reduces the contact thermal resistance between the heated component 500 and the cooling fan 300, thereby improving heat transfer efficiency.

[0175] The third thermal pad 109 can be made of materials such as silicone rubber, glass fiber, or polyester substrate. Under pressure, the third thermal pad 109 can compress and exhibits good thermal conductivity. Therefore, the third thermal pad 109 can be used to reduce the contact thermal resistance between the cooling fan 300 and the heated component 500, thereby improving the efficiency of heat transfer.

[0176] In this way, the heat on the heated component 500 can be absorbed by the housings of the first cooling fan 302 and the second cooling fan 303, and then the heat on the housings of the first cooling fan 302 and the second cooling fan 303 can be dissipated to the external environment by the cool airflow. Therefore, the embodiments of this application can effectively dissipate heat from the heated component 500. Furthermore, it can prevent the heat on the heated component 500 from being transferred to the C-shell 30, thereby reducing the surface temperature of the C-shell 30 and avoiding the problem of excessively high surface temperature of the C-shell 30 affecting the user experience.

[0177] See also Figure 12 A portion of the third thermal pad 109 may be disposed on the edge of the first cooling fan 302, and the third thermal pad 109 may be exposed through the receiving hole 511. A portion of the third thermal pad 109 may be disposed on the edge of the second cooling fan 303, and the third thermal pad 109 may be exposed through the receiving hole 511. This embodiment does not limit the number of third thermal pads 109; the specific number can be determined based on actual circumstances.

[0178] See also Figure 11 The first cooling fan 302 may have multiple first screw seats 3021 on its side, with through holes formed on the first screw seats 3021 along the thickness direction of the heat source 200. In practical applications, screws can be inserted into the through holes from the side of the first cooling fan 302 away from the heated component 500, and then threadedly connected to the heated component 500, which can be the keyboard metal part of a laptop computer. In this way, the first cooling fan 302 can be locked onto the heated component. At the same time, the screws can apply a force to the first cooling fan 302 in the direction close to the heated component 500, so that the first bridge 401 can fit tightly against the first heat-conducting plate 1013 and the first heat pipe 102, minimizing the thermal resistance between the first bridge 401 and the first heat-conducting plate 1013 and the first heat pipe 102.

[0179] Correspondingly, the side of the second cooling fan 303 can also be provided with multiple second screw seats 3031, with through holes opened on the second screw seats 3031 along the thickness direction of the heat source 200. In practical applications, screws can be inserted into the through holes from the side of the second cooling fan 303 away from the heated component 500, and then threadedly connected to the heated component 500, which can be the keyboard metal part of a laptop computer. In this way, the second cooling fan 303 can be locked onto the heated component 500. At the same time, the screws can apply a force to the second cooling fan 303 in the direction close to the heated component 500. The second bridge 402 can be tightly attached to the second heat-conducting plate 1014 and the heated component 500, which can minimize the thermal resistance between the second bridge 402 and the second heat-conducting plate 1014 and the first heat pipe 102.

[0180] In some implementations, the number of first bridges 401 between the first cooling fan 302 and the first heat-conducting plate 1013 is not limited to one. In order to quickly dissipate the heat on the first heat-conducting plate 1013 to the external environment and prevent heat accumulation on the first heat-conducting plate 1013, the number of first bridges 401 can be increased. For example, there can be two first bridges 401, and the two first bridges 401 can be erected at different positions on the first heat-conducting plate 1013. This application embodiment does not specifically limit this. Correspondingly, the number of second bridges 402 between the second cooling fan 303 and the second heat-conducting plate 1014 is also not limited to one. In order to quickly dissipate the heat on the second heat-conducting plate 1014 to the external environment and prevent heat accumulation on the second heat-conducting plate 1014, the number of second bridges 402 can be increased. For example, there can be two second bridges 402, and the two second bridges 402 can be erected at different positions on the second heat-conducting plate 1014. This application embodiment does not specifically limit this.

[0181] It should be noted that, in this embodiment, heat transfer via the second heat pipe 104 can be considered as in-plane heat transfer. Furthermore, heat transfer via the bridge 400 with the heat-conducting plate 101 and the first heat pipe 102 occurs between the plane of the heat-conducting plate 101 and the first heat pipe 102 and the plane of the bridge 400, achieving spatial heat transfer. Furthermore, in this embodiment, heat transfer can also occur between the plane of the heated component 500 and the plane of the cooling fan 400. The three-dimensional structure of the cooling fan 400 can be applied to the heat dissipation process, similarly achieving spatial heat transfer. Therefore, this embodiment can utilize the temperature differences existing in space between different parts inside the electronic device to achieve three-dimensional heat dissipation, resulting in a significant heat dissipation effect.

[0182] In this embodiment, the heat-conducting component 100 can be designed to form multiple portions that are far from the heat source 200. Furthermore, each of these portions can be equipped with a cooling fan 300, and each cooling fan 300 has a bridging 400 that connects to the heat-conducting component 100. This improves the efficiency of heat dissipation from the heat-conducting component 100 and prevents heat from accumulating on it.

[0183] In some embodiments, a heat pipe assembly may be provided, which includes a plurality of second heat pipes 104. The plurality of second heat pipes 104 may extend outward of the heat conduction plate 101 in different directions to form a plurality of condensation sections 1041, and each condensation section 1041 may be correspondingly connected to a fin 105. In this case, the plurality of condensation sections 1041 correspond to a plurality of portions of the heat conduction assembly 100 that are away from the heat source 200.

[0184] For example, multiple second heat pipes 104 can extend in three directions to form three condensation sections 1041. Furthermore, each condensation section 1041 can be connected to a corresponding fin 105, and each condensation section 1041 is equipped with a corresponding cooling fan 300. The air outlet of the cooling fan 300 faces its corresponding condensation section 1041 and the fin 105 connected to it. Furthermore, each cooling fan 300 can be provided with a bridge 400, and the bridges 400 corresponding to the three cooling fans 300 can be respectively connected to the heat-conducting plate 101. The heat pipe assembly can also extend to form more than three condensation sections 1041, which will not be elaborated here.

[0185] In some implementations, the first heat pipe 102 and the second heat pipe 104 provided in this application embodiment also include capillary porous materials and insulating parts, etc., which are not specifically limited in this application embodiment.

[0186] In some implementations, the first heat pipe 102 and the second heat pipe 104 can be replaced with a vacuum chamber (VC) heat dissipation plate. The specific shape of the VC plate can be determined by the actual situation, and this application embodiment does not specifically limit it.

[0187] In some implementations, a Mylar sheet may be provided on the surface of the heat-conducting plate 101 near the heat source 200 to make the heat-conducting plate 101 electrically insulated from other components, so as to prevent the heat-conducting plate 101 from conducting electricity and affecting the normal operation of the electronic equipment.

[0188] In some implementations, when the orthographic projection of the screw seat of the cooling fan 300 along the thickness direction of the heat source 200 lies on the bridge 400, the bridge 400 may be provided with a through hole corresponding to the screw seat, so that the cooling fan 300 can be installed normally. Whether the orthographic projection of the screw seat along the thickness direction of the heat source 200 lies on the bridge 400 can be determined by the actual layout, and this application embodiment does not specifically limit this.

[0189] This application also provides an electronic device equipped with the heat dissipation system provided in the above embodiments. In this electronic device, the heat source 200 can be, for example, the CPU, GPU, or GDDR of the electronic device; it can also be a capacitor, MOSFET, or inductor coil configured for the CPU or GPU; or any device that generates heat, such as one used for charging the electronic device. The electronic device can be, for example, a laptop computer, and this application does not specifically limit its application. With the heat dissipation system, the heat dissipation efficiency of the heat source 200 in the electronic device is improved, preventing abnormal overheating of the heat source 200 due to poor heat dissipation or reducing the frequency of the heat source 200. This improves the user experience.

[0190] The above detailed embodiments further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A heat dissipation system, characterized by, The heat dissipation system comprises: a heat conduction assembly (100) comprising a heat conduction plate (101) covering the surface of a heat source (200); a heat dissipation fan (300) with an air outlet facing the heat conduction assembly (100); a bridge (400) with a first end connected to the housing of the heat dissipation fan (300) and a second end connected to the heat conduction plate (101); wherein the housing of the heat dissipation fan (300) and the bridge (400) are both made of metal; the heat conduction assembly (100) further comprises a first heat pipe (102) attached to the heat conduction plate (101), and one end of the first heat pipe (102) is located between the heat conduction plate (101) and the bridge (400) and is attached to the second end of the bridge (400).

2. The heat dissipation system according to claim 1, wherein: the heat conduction plate (101) and the heat source (200) are filled with a heat conduction medium.

3. The heat dissipation system according to claim 2, wherein: the heat conduction assembly (100) further comprises a first heat conduction gasket (103) crimped between the bridge (400) and the heat conduction plate (101) and the first heat pipe (102).

4. The heat dissipation system according to claim 3, wherein: the heat conduction plate (101) comprises a first flat plate (1011) and a second flat plate (1012) connected to each other; the first flat plate (1011) and the second flat plate (1012) both cover the surface of the heat source (200), and the first flat plate (1011) and the second flat plate (1012) are both filled with the heat conduction medium; there is a height difference between the first flat plate (1011) and the second flat plate (1012); the first heat pipe (102) is located on the surface of the first flat plate (1011) away from the heat source (200), and the surface of the first heat pipe (102) away from the heat source (200) is in the same plane as the surface of the second flat plate (1012) away from the heat source (200).

5. The heat dissipation system according to claim 3, wherein: the heat conduction assembly (100) further comprises: at least one second heat pipe (104) attached to the heat conduction plate (101), the second heat pipe (104) extending outward from the heat conduction plate (101) in at least one direction to form at least one condensing portion (1041) away from the heat source (200); a fin (105) distributed on each condensing portion (1041) and connected to the pipe wall of the condensing portion (1041). The number of the heat dissipation fans (300) is at least one, at least one of the heat dissipation fans (300) is arranged one-to-one with at least one of the condensing parts (1041), the air outlet of each of the heat dissipation fans (300) faces the corresponding condensing part (1041), and faces the fin (105) connected with the corresponding condensing part (1041).

6. The heat dissipation system according to claim 5, characterized in that, When the number of the second heat pipes (104) is multiple, the multiple second heat pipes (104) are arranged side by side on the heat conduction plate (101).

7. The heat dissipation system according to claim 2, characterized in that, The heat conduction medium comprises a second heat conduction gasket (106) which is crimped between the heat conduction plate (101) and the heat source (200); and / or, The heat conduction medium comprises a heat conduction silicone grease (107) which is filled between the heat conduction plate (101) and the heat source (200).

8. The heat dissipation system according to claim 2, characterized in that, The heat conduction assembly (100) further comprises an elastic sheet (108); One end of the elastic sheet (108) is fixed on the heat conduction plate (101), and the other end is fixed on a printed circuit board where the heat source (200) is located, so as to press the heat conduction plate (101) on the heat source (200).

9. The heat dissipation system according to claim 1, characterized in that, The shell of the heat dissipation fan (300) abuts against a heated part (500), and the heat of the heated part (500) is transferred from the heat source (200).

10. The heat dissipation system according to claim 9, characterized in that, The heat conduction assembly (100) further comprises a third heat conduction gasket (109) which is crimped between the heat dissipation fan (300) and the heated part (500).

11. The heat dissipation system according to claim 1, characterized in that, The bridge (400) and the heat dissipation fan (300) are an integral structure.

12. An electronic device, comprising: Comprise: The heat dissipation system according to any one of claims 1-11.

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