A single crystal silicon wafer inserting device and inserting method with a connection detection function

Abstract

The present application discloses a single crystal silicon wafer inserting device with a continuous wafer detection function, including a control unit, an alarm unit, a feed trough, a slicing unit, a conveying unit and a receiving unit. The slicing unit is used to slice the silicon wafers at the feed trough one by one to the conveying unit; the receiving unit includes a placement rack, a silicon wafer basket and a lifting drive unit. The silicon wafer basket can insert the silicon wafers into the silicon wafer basket in a row; the conveying unit is used to convey the silicon wafers at the conveying unit to the silicon wafer basket. The single crystal silicon wafer inserting device of the present application can well realize the slicing, conveying and inserting of single crystal silicon wafers, thereby improving production efficiency and product quality. It can also well realize the detection of whether the single crystal silicon wafers are continuous (two silicon wafers are stacked together for conveying), thereby avoiding the adverse consequences caused by continuous wafers, and the conveying unit is normally transported during the detection process, and in the case of no continuous wafers, the efficiency of inserting wafers is not affected.

Description

Technical Field

[0001] The present invention relates to the technical field of single crystal silicon wafer inserting, and more specifically, to a single crystal silicon wafer inserting device with a connected wafer detection function. Background Art

[0002] In the semiconductor manufacturing and solar photovoltaic industries, monocrystalline silicon wafers are key materials for manufacturing integrated circuits, solar cells and other products. After slicing and degumming, silicon rods need to be inserted into the silicon wafer basket one by one for subsequent cleaning, drying and sorting operations.

[0003] In general wafer insertion operation, the operator puts a stack of stacked silicon wafers into a feed trough containing water, and the wafer splitter transports the wafers one by one to the conveying unit and then inserts them into the wafer basket. Each time a wafer is inserted into the wafer basket, the wafer basket will rise one grid for inserting the next wafer. However, sometimes the wafer splitter transports two stacked silicon wafers to the conveying unit and eventually inserts them into the same grid of the wafer basket, which makes subsequent cleaning and sorting operations difficult, and also causes the final quality of the stacked silicon wafers to decline, causing great trouble and loss to production. Summary of the invention

[0004] The present invention aims to overcome the defects of the prior art and provide a single crystal silicon wafer inserting device with a connected wafer detection function.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a single crystal silicon wafer insertion device with a continuous wafer detection function, comprising a control unit, an alarm unit, a feed trough, a slicing unit installed at the feed trough, a conveying unit for conveying silicon wafers, and a receiving unit for receiving silicon wafers, wherein the slicing unit is used to slice the silicon wafers at the feed trough one by one to the conveying unit; the receiving unit comprises a placement rack, a silicon wafer basket installed at the placement rack, and a lifting drive unit for driving the placement rack to rise and fall, the silicon wafer basket can allow the silicon wafers to be inserted into the silicon wafer basket in a row; the conveying unit is used to convey the silicon wafers at the conveying unit to the silicon wafer basket.

[0006] The slicing unit and the receiving unit may be the slicing unit and the receiving unit commonly used in the prior art. The slicing unit can deliver the silicon wafers one by one to the delivery unit, and the receiving unit can collect the silicon wafers one by one.

[0007] Furthermore, the conveying unit includes two side plates, multiple conveying shafts and a rotating drive unit for driving the multiple conveying shafts to rotate synchronously, two conveyor belts are installed between two adjacent conveying shafts, and each conveying shaft has two rotating rollers for installing the conveyor belts; a first transverse plate and a second transverse plate are installed between the two side plates, a first mounting plate is installed at the first transverse plate, a first spray unit is installed at the first mounting plate, a second mounting plate is installed at the second transverse plate, and a second spray unit is installed at the second mounting plate; the conveying unit has two detection positions, each detection position has a collection mechanism and two lifting mechanisms, the collection mechanism includes a collection mounting frame and an image collection unit installed at the collection mounting frame; the lifting mechanism includes an inverted U-shaped frame fixedly connected to the side plate, an inverted U-shaped frame installed at the inverted U-shaped frame A lifting motor at the frame, a screw driven by the lifting motor, and a lifting plate matched with the screw, vertical slide rails are provided on both sides of the lifting plate, a mounting groove is provided at the side plate, a vertical slide groove matched with the vertical slide rails is provided at the mounting groove, a screw bearing matched with the screw is installed at the mounting groove, a rotating shaft is installed between the lifting plates of the two lifting mechanisms, a driving roller is installed at the rotating shaft, and a driving roller motor for driving the driving roller to rotate is installed at one of the lifting plates; a plurality of strip rubber protrusions are provided on the circumferential surface of the driving roller, and the cross-section of the strip rubber protrusions is semicircular; a first proximity switch mounting frame and a second proximity switch mounting frame are installed at the conveying unit, a first proximity switch is installed at the first proximity switch mounting frame, and a second proximity switch is installed at the second proximity switch mounting frame.

[0008] The silicon wafers are placed on the conveyor belts on both sides and are thus transported by the conveyor belts.

[0009] The first proximity switch and the second proximity switch can better determine the position of the silicon wafer conveyance.

[0010] Furthermore, both ends of each conveying shaft are mounted on the conveying shaft mounting seat through bearings.

[0011] Furthermore, the rotation driving unit is used to drive one of the multiple conveying shafts to rotate.

[0012] Thus, one conveying shaft is driven to rotate, and the remaining conveying shafts can rotate synchronously due to the transmission effect of the conveyor belt.

[0013] In some embodiments, the rotation drive unit can drive all the conveying shafts at the same time to achieve synchronous drive. For example, the rotation drive unit includes multiple motors, the number of motors is equal to the number of rotating shafts, and each motor drives one of the rotating shafts.

[0014] Furthermore, the two detection positions are respectively the first detection position and the second detection position, the first detection position is closer to the feed trough than the second detection position; the first liquid spraying unit is used to spray liquid on the silicon wafer at the first detection position, and the second liquid spraying unit is used to spray liquid on the silicon wafer at the second detection position; the first proximity switch mounting bracket is located between the feed trough and the first detection position, and the second proximity switch mounting bracket is located between the second liquid spraying unit and the receiving unit.

[0015] Furthermore, the first liquid spray unit has a plurality of first nozzles distributed in a row, and the first liquid spray unit is used to spray liquid on the front end edge of the silicon wafer at the first detection position; the second liquid spray unit has a plurality of second nozzles distributed in a row, and the second liquid spray unit is used to spray liquid on the upper surface of the silicon wafer at the second detection position.

[0016] Thus, the first liquid spraying unit sprays liquid toward the front end of the silicon wafer, mainly for separating the possible overlapping silicon wafers. The second liquid spraying unit sprays liquid mainly for cleaning the upper surface of the silicon wafer.

[0017] Further, the driving roller at the first detection position is a first driving roller, and the circumferential surface of the first driving roller has a plurality of first strip-shaped rubber protrusions, and the radii of the plurality of first strip-shaped rubber protrusions decrease in an arithmetic progression; the driving roller at the second detection position is a second driving roller, and the circumferential surface of the second driving roller has a plurality of second strip-shaped rubber protrusions, the diameter of the first driving roller is equal to the diameter of the second driving roller, the radii of the plurality of second strip-shaped rubber protrusions are equal, and are equal to the radius of the first strip-shaped rubber protrusion with the largest radius among the plurality of first strip-shaped rubber protrusions.

[0018] Furthermore, the difference between the radius of the first strip-shaped rubber protrusion with the largest radius and the first strip-shaped rubber protrusion with the smallest radius is greater than half the thickness of the silicon wafer and less than 1.5 times the thickness of the silicon wafer.

[0019] Furthermore, multiple first rubber protrusions are distributed in an arc shape with equal intervals, and in the circumferential surface of the first driving roller, at least half of the continuous circumferential surface does not have the first rubber protrusion; multiple second rubber protrusions are distributed in an arc shape with equal intervals, and in the circumferential surface of the second driving roller, at least half of the continuous circumferential surface does not have the second rubber protrusion.

[0020] Therefore, the circumferential surface without the strip-shaped rubber protrusions is used to face the silicon wafer, so that the first strip-shaped rubber protrusions and the second strip-shaped rubber protrusions can avoid the silicon wafer.

[0021] Furthermore, the number of the first strip-shaped rubber protrusions and the number of the second strip-shaped rubber protrusions are both greater than or equal to four.

[0022] Other quantities may also be selected as required. In extreme cases, both the first strip rubber protrusion and the second strip rubber protrusion may be selected to be two.

[0023] The present application also discloses a wafer insertion method based on the above-mentioned single crystal silicon wafer insertion device, the wafer insertion method includes a connected wafer detection step, and the connected wafer detection step includes the following steps: when the silicon wafer passes through the first detection position, the first liquid spraying unit continues to spray liquid, and the first driving roller rotates one circle, and after the rotation is completed, the image acquisition unit of the first detection position collects a first image; when it is judged that there is a connected wafer according to the first image, when the silicon wafer at the first detection position is transported to the second detection position, the second driving roller rotates one circle, and after the rotation is completed, the image acquisition unit of the second detection position collects a second image, and when it is judged that there is a connected wafer according to the second image, the control unit controls the alarm unit to alarm.

[0024] Further, when it is determined according to the first image that there is no connected piece, when the silicon wafer at the first detection position is transported to the second detection position, the second liquid spraying unit sprays liquid, and the second driving roller does not rotate.

[0025] Furthermore, when it is determined that there is a connection according to the first image, but it is determined that there is no connection according to the second image, it is considered that there is a misjudgment in the first image, and there is no need to stop the machine, and the insertion operation continues.

[0026] During the inspection process, ideally, when the wafers are not connected, the first rubber protrusion will not contact the upper surface of the silicon wafer. However, in non-ideal situations, the first rubber protrusion may cause the unconnected silicon wafer to move slightly backward. However, since the contact time between the rubber protrusion and the silicon wafer is short and slight, it does not affect the normal transportation of the silicon wafer. In addition, with the use of a high-speed camera, when the first and second drive rollers rotate, the entire process does not require the conveying unit to stop conveying, and the conveying process is continuous, which does not affect the efficiency of inserting the wafer.

[0027] The present application also discloses a wafer insertion method based on the above-mentioned single crystal silicon wafer insertion device, the wafer insertion method includes an adjustment step, and the adjustment step includes the following steps: controlling the conveying unit to stop conveying, placing two overlapping silicon wafers at a first detection position, driving the first driving roller to rotate so that the first strip rubber protrusion with the smallest diameter to the first strip rubber protrusion with the largest diameter pass through the two overlapping silicon wafers in sequence, and the image acquisition unit of the first detection position acquires images so that each first strip rubber protrusion has at least one image before and after passing through the two overlapping silicon wafers, when the first strip rubber protrusion with the smallest diameter passes through the two overlapping silicon wafers, the positions of the two overlapping silicon wafers remain unchanged, and when the first strip rubber protrusion with the largest diameter passes through the two overlapping silicon wafers, the positions of the two overlapping silicon wafers change, it is judged to be qualified, the two lifting mechanisms of the first detection position are driven to make the first driving roller reach a qualified state, and the two lifting mechanisms of the second detection position are driven to make the axis of the second driving roller and the axis of the first driving roller be at the same horizontal height.

[0028] Furthermore, when the first driving roller is driven to rotate so that the first strip rubber protrusion with the smallest diameter to the first strip rubber protrusion with the largest diameter pass through the two overlapping silicon wafers in sequence, an image is captured before the first strip rubber protrusion with the smallest diameter passes through the two overlapping silicon wafers, and an image is captured after each first strip rubber protrusion passes through the two overlapping silicon wafers; the number of images captured is one more than the number of first strip rubber protrusions.

[0029] Therefore, the positions of the first and second driving rollers can be adjusted well, so as to better detect whether the sheets are connected.

[0030] The present application also discloses a conveying device, including two side plates, a plurality of conveying shafts and a rotating drive unit for driving the plurality of conveying shafts to rotate synchronously, two conveying belts are installed between two adjacent conveying shafts, and each conveying shaft has two rotating rollers for installing the conveying belts; a first transverse plate and a second transverse plate are installed between the two side plates, a first mounting plate is installed at the first transverse plate, a first liquid spraying unit is installed at the first mounting plate, a second mounting plate is installed at the second transverse plate, and a second liquid spraying unit is installed at the second mounting plate; the conveying device has two detection positions, each detection position has a collection mechanism and two lifting mechanisms, the collection mechanism includes a collection mounting frame and an image collection unit installed at the collection mounting frame; the lifting mechanism includes an inverted U-shaped frame fixedly connected to the side plate, an inverted U-shaped frame installed at the inverted A lifting motor at the U-shaped frame, a screw driven by the lifting motor, and a lifting plate matched with the screw, vertical slide rails are provided on both sides of the lifting plate, a mounting groove is provided at the side plate, a vertical slide groove matched with the vertical slide rails is provided at the mounting groove, a screw bearing matched with the screw is installed at the mounting groove, a rotating shaft is installed between the lifting plates of the two lifting mechanisms, a driving roller is installed at the rotating shaft, a driving roller motor for driving the driving roller to rotate is installed at one of the lifting plates; a plurality of strip rubber protrusions are provided on the circumferential surface of the driving roller, and the cross-section of the strip rubber protrusions is semicircular; a first proximity switch mounting frame and a second proximity switch mounting frame are installed at the conveying device, a first proximity switch is installed at the first proximity switch mounting frame, and a second proximity switch is installed at the second proximity switch mounting frame.

[0031] Preferably, the two detection positions are respectively the first detection position and the second detection position, the first detection position is closer to the feed trough than the second detection position; the first liquid spraying unit is used to spray liquid on the silicon wafer at the first detection position, and the second liquid spraying unit is used to spray liquid on the silicon wafer at the second detection position; the first proximity switch mounting bracket is located between the feed trough and the first detection position, and the second proximity switch mounting bracket is located between the second liquid spraying unit and the receiving unit.

[0032] Preferably, the first liquid spray unit has a plurality of first nozzles distributed in a row, and the first liquid spray unit is used to spray liquid on the front end edge of the silicon wafer at the first inspection position; the second liquid spray unit has a plurality of second nozzles distributed in a row, and the second liquid spray unit is used to spray liquid on the upper surface of the silicon wafer at the second inspection position.

[0033] Preferably, the driving roller at the first detection position is a first driving roller, and the circumferential surface of the first driving roller has a plurality of first strip-shaped rubber protrusions, and the radii of the plurality of first strip-shaped rubber protrusions decrease in an arithmetic progression; the driving roller at the second detection position is a second driving roller, and the circumferential surface of the second driving roller has a plurality of second strip-shaped rubber protrusions, the diameter of the first driving roller is equal to the diameter of the second driving roller, the radii of the plurality of second strip-shaped rubber protrusions are equal, and are equal to the radius of the first strip-shaped rubber protrusion with the largest radius among the plurality of first strip-shaped rubber protrusions.

[0034] Preferably, multiple first strip rubber protrusions are distributed in an arc shape with equal intervals, and in the circumferential surface of the first driving roller, at least half of the continuous circumferential surface does not have the first strip rubber protrusion; multiple second strip rubber protrusions are distributed in an arc shape with equal intervals, and in the circumferential surface of the second driving roller, at least half of the continuous circumferential surface does not have the second strip rubber protrusion.

[0035] Preferably, the number of the first strip-shaped rubber protrusions and the number of the second strip-shaped rubber protrusions are both greater than or equal to four.

[0036] Beneficial effects:

[0037] 1. The single crystal silicon wafer inserting device of the present application can well realize the slicing, transportation and inserting of single crystal silicon wafers, thereby improving production efficiency and product quality.

[0038] 2. The single crystal silicon wafer insertion device of the present application can well realize the detection of whether the single crystal silicon wafers are connected (two silicon wafers are stacked together for transportation), thereby avoiding the adverse consequences caused by connected wafers, and the conveying unit transports normally during the detection process, and when there is no connected wafer, the efficiency of insertion is not affected.

[0039] 3. The single crystal silicon wafer inserting device of the present application can well realize the adjustment of the positions of the first and second driving rollers, so as to better detect whether the wafers are connected, thereby improving the accuracy of the detection of connected wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a schematic diagram of the insert device from a first-person perspective;

[0041] Figure 2 This is an enlarged view of area A;

[0042] Figure 3 is a schematic diagram of the inserting device from a second viewing angle;

[0043] Figure 4 This is an enlarged view of area B;

[0044] Figure 5 It is a schematic diagram of the insert device from the third perspective.

[0045] Explanation of the reference numerals: 1 silicon wafer; 2 feeding trough; 3.1 side plate; 3.2 conveying shaft; 3.3 conveyor belt; 3.4 rotating roller; 4 placing rack; 5 silicon wafer basket; 6 first horizontal plate; 6.1 first mounting plate; 6.2 first spray unit; 7 second horizontal plate; 7.1 second mounting plate; 7.2 second spray unit; 8.1 acquisition mounting frame; 8.2 image acquisition unit; 9.1 inverted U-shaped frame; 9.2 lifting motor; 9.3 screw rod; 9.4 lifting plate; 9.5 rotating shaft; 9.6 first driving roller; 9.6.1 first strip rubber protrusion; 9.7 second driving roller; 9.7.1 second strip rubber protrusion; 9.8 driving roller motor; 10 first proximity switch mounting frame; 10.1 first proximity switch; 11 second proximity switch mounting frame; 11.1 second proximity switch. DETAILED DESCRIPTION

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0047] As shown in the figure, a single crystal silicon wafer inserting device with a continuous wafer detection function includes a control unit, an alarm unit, a feed trough 2, a slicing unit installed at the feed trough 2 (not shown in the figure), a conveying unit for conveying silicon wafers 1, and a receiving unit for receiving silicon wafers. The slicing unit is used to slice the silicon wafers at the feed trough 2 one by one to the conveying unit; the receiving unit includes a placement rack 4, a silicon wafer basket 5 installed at the placement rack 4, and a lifting drive unit (not shown in the figure) for driving the placement rack 4 to rise and fall, and the silicon wafer basket 5 can insert the silicon wafers into the silicon wafer basket 5 in a row; the conveying unit is used to convey the silicon wafers at the conveying unit to the silicon wafer basket 5. The conveying unit includes two side plates 3.1, a plurality of conveying shafts 3.2 and a rotation driving unit for driving the plurality of conveying shafts 3.2 to rotate synchronously, two conveying belts 3.3 are installed between two adjacent conveying shafts 3.2, and each conveying shaft 3.2 has two rotating rollers 3.4 for installing the conveying belts 3.3; a first transverse plate 6 and a second transverse plate 7 are installed between the two side plates 3.1, a first mounting plate 6.1 is installed at the first transverse plate 6, a first liquid spraying unit 6.2 is installed at the first mounting plate 6.1, a second mounting plate 7.1 is installed at the second transverse plate 7, and a second liquid spraying unit 7.2 is installed at the second mounting plate 7.1; the conveying unit has two detection positions, each detection position has a collection mechanism and two lifting mechanisms, the collection mechanism includes a collection mounting frame 8.1 and an image collection unit 8.2 installed at the collection mounting frame 8.1; the lifting mechanism includes an inverted U-shaped frame 9.1 fixedly connected to the side plate 3.1, an inverted U-shaped frame 9.1 installed at the inverted U A lifting motor 9.2 at the frame 9.1, a screw rod 9.3 driven by the lifting motor 9.2, and a lifting plate 9.4 matched with the screw rod 9.3, vertical slide rails are provided on both sides of the lifting plate 9.4, a mounting groove is provided at the side plate 3.1, a vertical slide groove matched with the vertical slide rail is provided at the mounting groove, a screw bearing matched with the screw rod 9.3 is installed at the mounting groove, a rotating shaft 9.5 is installed between the lifting plates 9.4 of the two lifting mechanisms, a driving roller is installed at the rotating shaft 9.5, and a driving roller motor 9.8 for driving the driving roller to rotate is installed at one of the lifting plates 9.4; a plurality of strip-shaped rubber protrusions are provided at the circumferential surface of the driving roller, and the cross-section of the strip-shaped rubber protrusion is semicircular; a first proximity switch mounting frame 10 and a second proximity switch mounting frame 11 are installed at the conveying unit, a first proximity switch 10.1 is installed at the first proximity switch mounting frame 10, and a second proximity switch 11.1 is installed at the second proximity switch mounting frame 11.

[0048] The two detection positions are respectively the first detection position and the second detection position, the first detection position is closer to the feed slot 2 than the second detection position; the first liquid spraying unit 6.2 is used to spray liquid on the silicon wafer at the first detection position, and the second liquid spraying unit 7.2 is used to spray liquid on the silicon wafer at the second detection position; the first proximity switch mounting frame 10 is located between the feed slot and the first detection position, and the second proximity switch mounting frame 11 is located between the second liquid spraying unit 7.2 and the receiving unit. The first liquid spraying unit 6.2 has a plurality of first nozzles distributed in a row, and the first liquid spraying unit 6.2 is used to spray liquid on the front edge of the silicon wafer at the first detection position; the second liquid spraying unit 7.2 has a plurality of second nozzles distributed in a row, and the second liquid spraying unit 7.2 is used to spray liquid on the upper surface of the silicon wafer at the second detection position. The driving roller at the first detection position is the first driving roller 9.6, and the circumferential surface of the first driving roller 9.6 is provided with a plurality of first strip-shaped rubber protrusions 9.6.1, and the radii of the plurality of first strip-shaped rubber protrusions 9.6.1 decrease in an arithmetic progression; the driving roller at the second detection position is the second driving roller 9.7, and the circumferential surface of the second driving roller 9.7 is provided with a plurality of second strip-shaped rubber protrusions 9.7.1, the diameter of the first driving roller 9.6 is equal to the diameter of the second driving roller 9.7, and the radii of the plurality of second strip-shaped rubber protrusions 9.7.1 are equal, and are equal to the radius of the first strip-shaped rubber protrusion with the largest radius among the plurality of first strip-shaped rubber protrusions. A plurality of first strip rubber protrusions 9.6.1 are distributed in an arc shape with equal spacing, and at least half of the circumference of the first driving roller 9.6 is free of the first strip rubber protrusions 9.6.1; a plurality of second strip rubber protrusions 9.7.1 are distributed in an arc shape with equal spacing, and at least half of the circumference of the second driving roller 9.7 is free of the second strip rubber protrusions 9.7.1. The number of the first strip rubber protrusions 9.6.1 and the number of the second strip rubber protrusions 9.7.1 are both greater than or equal to 4.

[0049] The main working process of the wafer insertion device of the present application is similar to that of the conventional wafer insertion machine in the prior art. The wafer splitter splits the silicon wafers one by one and conveys them to the conveying unit, and the conveying unit then conveys them one by one to the receiving unit. When the receiving unit receives the wafers, the silicon wafer basket will rise one by one, so as to realize the wafer insertion one by one. The two proximity switches can accurately sense the position of the silicon wafer, thereby providing a basis for the rising operation of the basket. Different from the prior art, the silicon wafer of the present application will pass through the first detection position and the second detection position at the conveying unit. When the first detection position detects the possible existence of connected wafers, it will be further detected at the second detection position. If the second detection position still detects connected wafers, the alarm will be stopped to remind maintenance, and the connected wafers will not be carried out in the subsequent steps. If the first detection position does not detect connected wafers, it will directly pass through the second detection position, and the second detection position will not be detected. The details are as follows: when the silicon wafer passes through the first detection position, the first liquid spraying unit continues to spray liquid (if there is a connected piece at this time, spraying liquid at the front edge of the silicon wafer can better promote the separation of the two silicon wafers), and the first driving roller rotates one circle, and after the rotation is completed, the image acquisition unit of the first detection position acquires a first image (due to the first liquid spraying unit and the first driving roller, the first driving roller will drive the upper silicon wafer to move backward, and the conveyor belt will drive the lower silicon wafer to move forward, so that the two are misaligned, which can be easily recognized through the image); when it is determined according to the first image that there is a connected piece, when the silicon wafer at the first detection position is conveyed to the second detection position, the second driving roller rotates one circle (because each of the second strip rubber protrusions will contact the upper silicon wafer, so that the misalignment of the two silicon wafers is larger and easier to identify), after the rotation is completed, the image acquisition unit of the second detection position acquires a second image, and when it is determined according to the second image that there is a connected piece, the control unit controls the alarm unit to alarm. In addition, when it is determined that there is no connected piece according to the first image, when the silicon wafer at the first detection position is transported to the second detection position, the second liquid spraying unit sprays liquid (mainly for cleaning the upper surface of the silicon wafer), and the second driving roller does not rotate. In addition, when it is determined that there is a connected piece according to the first image, but it is determined that there is no connected piece according to the second image, it is considered that the first image has been misjudged, and there is no need to stop the machine, and the inserting operation continues.

[0050] The above detection operation is very dependent on the distance between the first driving roller and the second driving roller and the surface of the silicon wafer. The best situation is that when the first driving roller rotates, when there is no connected wafer, the first driving roller does not contact the silicon wafer, or the contact is very small (because the conveyor belt has a certain elasticity, even if the strip rubber protrusion contacts the silicon wafer, the silicon wafer will not be crushed). Therefore, the height of the first and second driving rollers can be adjusted. The specific adjustment steps include the following steps: controlling the conveying unit to stop conveying, placing two overlapping silicon wafers at the first detection position, driving the first driving roller to rotate so that the first strip rubber protrusion with the smallest diameter to the first strip rubber protrusion with the largest diameter pass through the two strip rubber protrusions in sequence. The first detection position is a silicon wafer with two overlapping parts, and the image acquisition unit at the first detection position acquires images so that each first strip rubber protrusion has at least one image before and after passing through the two overlapping silicon wafers. When the first strip rubber protrusion with the smallest diameter passes through the two overlapping silicon wafers, the positions of the two overlapping silicon wafers remain unchanged, and the first strip rubber protrusion with the largest diameter passes through the two overlapping silicon wafers, and the positions of the two overlapping silicon wafers change, it is judged to be qualified, and the two lifting mechanisms at the first detection position are driven to make the first driving roller reach a qualified state, and the two lifting mechanisms at the second detection position are driven to make the axis of the second driving roller and the axis of the first driving roller be at the same horizontal height. The specific method of acquiring images can be as follows: when the first driving roller is driven to rotate so that the first strip rubber protrusion with the smallest diameter to the first strip rubber protrusion with the largest diameter pass through the two overlapping silicon wafers in sequence, an image is acquired before the first strip rubber protrusion with the smallest diameter passes through the two overlapping silicon wafers, and an image is acquired after each first strip rubber protrusion passes through the two overlapping silicon wafers; the number of images acquired is one more than the number of first strip rubber protrusions. Through such an arrangement, it can be basically ensured that when there is a connection, it can be contacted by the largest first rubber protrusion, but when there is no connection, the largest first rubber protrusion does not contact or only contacts the silicon wafer very little.

[0051] Although the present invention has been illustrated and described with respect to the preferred embodiments, it will be appreciated by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A single crystal silicon wafer inserting device with a connection detection function, characterized in that: It includes a control unit, an alarm unit, a feed trough, a slicing unit installed at the feed trough, a conveying unit for conveying silicon wafers, and a receiving unit for receiving silicon wafers. The slicing unit is used to slice the silicon wafers at the feed trough one by one to the conveying unit; the receiving unit includes a placement rack, a silicon wafer basket installed at the placement rack, and a lifting drive unit for driving the placement rack to rise and fall. The silicon wafer basket can allow the silicon wafers to be inserted into the silicon wafer basket in a row; the conveying unit is used to convey the silicon wafers at the conveying unit to the silicon wafer basket; The conveying unit includes two side plates, multiple conveying shafts and a rotating drive unit for driving the multiple conveying shafts to rotate synchronously, two conveyor belts are installed between two adjacent conveying shafts, and each conveying shaft has two rotating rollers for installing the conveyor belts; a first transverse plate and a second transverse plate are installed between the two side plates, a first mounting plate is installed at the first transverse plate, a first spray unit is installed at the first mounting plate, a second mounting plate is installed at the second transverse plate, and a second spray unit is installed at the second mounting plate; the conveying unit has two detection positions, each detection position has a collection mechanism and two lifting mechanisms, the collection mechanism includes a collection mounting frame and an image collection unit installed at the collection mounting frame; the lifting mechanism includes an inverted U-shaped frame fixedly connected to the side plate, a frame installed at the inverted U-shaped frame A lifting motor, a screw driven by the lifting motor, and a lifting plate matched with the screw, the lifting plate has vertical slide rails on both sides, the side plate has a mounting groove, the mounting groove has a vertical slide groove matched with the vertical slide rail, the mounting groove is installed with a screw bearing matched with the screw, a rotating shaft is installed between the lifting plates of the two lifting mechanisms, a driving roller is installed on the rotating shaft, and a driving roller motor for driving the driving roller to rotate is installed on one of the lifting plates; a plurality of strip-shaped rubber protrusions are provided on the circumferential surface of the driving roller, and the cross-section of the strip-shaped rubber protrusions is semicircular; a first proximity switch mounting frame and a second proximity switch mounting frame are installed on the conveying unit, a first proximity switch is installed on the first proximity switch mounting frame, and a second proximity switch is installed on the second proximity switch mounting frame; The two detection positions are respectively a first detection position and a second detection position, the first detection position is closer to the feed slot than the second detection position; the first liquid spraying unit is used to spray liquid on the silicon wafer at the first detection position, and the second liquid spraying unit is used to spray liquid on the silicon wafer at the second detection position; the first proximity switch mounting frame is located between the feed slot and the first detection position, and the second proximity switch mounting frame is located between the second liquid spraying unit and the receiving unit; The driving roller at the first detection position is a first driving roller, and a plurality of first strip-shaped rubber protrusions are provided on the circumferential surface of the first driving roller, and the radii of the plurality of first strip-shaped rubber protrusions decrease in an arithmetic progression; the driving roller at the second detection position is a second driving roller, and a plurality of second strip-shaped rubber protrusions are provided on the circumferential surface of the second driving roller, and the diameter of the first driving roller is equal to the diameter of the second driving roller, and the radii of the plurality of second strip-shaped rubber protrusions are equal, and are equal to the radius of the first strip-shaped rubber protrusion with the largest radius among the plurality of first strip-shaped rubber protrusions; A plurality of first rubber protrusions are distributed in an arc shape with equal intervals, and in the circumferential surface of the first driving roller, at least half of the continuous circumferential surface does not have the first rubber protrusions; a plurality of second rubber protrusions are distributed in an arc shape with equal intervals, and in the circumferential surface of the second driving roller, at least half of the continuous circumferential surface does not have the second rubber protrusions.

2. The single crystal silicon wafer inserting device with a connection detection function according to claim 1, characterized in that: The first liquid spray unit has a plurality of first nozzles distributed in a row, and the first liquid spray unit is used to spray liquid on the front end edge of the silicon wafer at the first detection position; the second liquid spray unit has a plurality of second nozzles distributed in a row, and the second liquid spray unit is used to spray liquid on the upper surface of the silicon wafer at the second detection position.

3. A method for inserting single crystal silicon wafers based on the single crystal silicon wafer inserting device with a connection detection function according to claim 1, characterized in that: The wafer insertion method includes a continuous wafer detection step, which includes the following steps: when the silicon wafer passes through the first detection position, the first liquid spraying unit continues to spray liquid, and the first driving roller rotates one circle, and after the rotation is completed, the image acquisition unit of the first detection position collects a first image; when it is determined that there is a continuous wafer according to the first image, when the silicon wafer at the first detection position is transported to the second detection position, the second driving roller rotates one circle, and after the rotation is completed, the image acquisition unit of the second detection position collects a second image, and when it is determined that there is a continuous wafer according to the second image, the control unit controls the alarm unit to alarm.

4. The method for inserting a single crystal silicon wafer using a wafer inserting device with a wafer connection detection function according to claim 3, characterized in that: When it is determined according to the first image that there is no connected piece, when the silicon wafer at the first detection position is transported to the second detection position, the second liquid spraying unit sprays liquid, and the second driving roller does not rotate.

5. A method for inserting single crystal silicon wafers based on the single crystal silicon wafer inserting device with a connection detection function according to claim 1, characterized in that: The inserting method comprises an adjustment step, which comprises the following steps: controlling the conveying unit to stop conveying, placing two overlapping silicon wafers at a first detection position, driving the first driving roller to rotate so that a first strip-shaped rubber protrusion with a smallest diameter to a first strip-shaped rubber protrusion with a largest diameter sequentially pass through the two overlapping silicon wafers, and an image acquisition unit at the first detection position acquires images so that each first strip-shaped rubber protrusion has at least one image before and after passing through the two overlapping silicon wafers, when the first strip-shaped rubber protrusion with a smallest diameter passes through the two overlapping silicon wafers, the positions of the two overlapping silicon wafers remain unchanged, and when the first strip-shaped rubber protrusion with a largest diameter passes through the two overlapping silicon wafers, the positions of the two overlapping silicon wafers change, judging that the silicon wafers are qualified, driving the two lifting mechanisms at the first detection position so that the first driving roller reaches a qualified state, and driving the two lifting mechanisms at the second detection position so that the axis of the second driving roller and the axis of the first driving roller are at the same horizontal height.

6. The method for inserting a single crystal silicon wafer using a wafer inserting device with a connected wafer detection function according to claim 5, characterized in that: The first driving roller is driven to rotate so that when the first rubber protrusion with the smallest diameter to the first rubber protrusion with the largest diameter sequentially pass through the two overlapping silicon wafers, an image is collected before the first rubber protrusion with the smallest diameter passes through the two overlapping silicon wafers, and an image is collected after each first rubber protrusion passes through the two overlapping silicon wafers; the number of images collected is one more than the number of the first rubber protrusions.

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