Circuit board processing method and laser processing equipment

Abstract

The present invention discloses a circuit board processing method and laser processing equipment. The circuit board processing method is used to form a large blind hole on a circuit board. In the reading step of the circuit board processing method, each processing instruction in the processing file is read one by one, and it is determined whether the current aperture of the currently read processing instruction is larger than the preset aperture; if it is larger than the preset aperture, the conversion step and the processing step are executed. In the conversion step, the corresponding conversion information is found in the conversion database based on the current aperture using the hole-matching instruction conversion program. In the processing step, the laser processing device is controlled to form a combined large blind hole corresponding to the large blind hole on the circuit board based on the conversion information and the center coordinates in the processing instruction. The combined large blind hole is composed of multiple small blind holes.

Description

Technical Field

[0001] The present invention relates to a circuit board processing method and laser processing equipment, in particular to a circuit board processing method for forming large-sized blind holes on a circuit board and laser processing equipment capable of executing the circuit board processing method. Background Art

[0002] In the prior art, if a user wishes to form a large blind via (e.g., with a diameter exceeding 300 μm) on a circuit board, the physical limitations of laser processing equipment prevent the user from directly forming such a large blind via. Therefore, the prior art requires the user to use the laser processing equipment to form multiple small blind vias at the location where the large blind via is to be formed on the circuit board. These multiple small blind vias are then joined together to form the large blind via.

[0003] In the prior art, the number, diameter, and center coordinates of the multiple small blind vias used to connect the large blind vias must be set in CAM software. This requires knowledge of the physical limitations of the laser processing equipment to accurately determine the number, diameter, and center coordinates of the small blind vias. However, in practice, those designing hole positions on circuit boards using CAM software generally lack knowledge of the relevant parameters of the laser processing equipment. Instead, hole designers rely solely on past experience to determine the diameter, number, and center coordinates of the small blind vias used to connect the large blind vias, which can easily lead to errors.

[0004] Furthermore, since the settings for small blind vias are contained in the processing files output by the CAM software, which are primarily intended for reading by laser processing equipment, the processing files are essentially composed of multiple instructions. Consequently, when the laser processing equipment forms a blind via on a PCB based on the processing files and an error occurs, the relevant personnel must review the multiple instructions in the processing files to try to identify which instruction caused the error. Since the instructions in the processing files are designed to be read by the laser processing equipment, it is difficult for the relevant personnel to quickly identify the incorrect instruction that caused the blind via to be formed on the PCB. Summary of the Invention

[0005] The present invention discloses a circuit board processing method and laser processing equipment, which are primarily used to improve the existing technology, in which users must set the aperture, number, and center coordinates of multiple small blind vias used to splice together to form a large size in CAM software. Therefore, if an error occurs in the blind vias formed on the circuit board, the relevant personnel will have difficulty in quickly discovering the erroneous instructions in the CAM software.

[0006] One embodiment of the present invention discloses a circuit board processing method, which is used to form at least one large blind hole on a circuit board using a laser processing device. The circuit board processing method includes the following steps: a file receiving step: using a processor of the laser processing device to receive a processing file; a reading step: using the processor to read each processing instruction in the processing file one by one, and determine whether a current aperture contained in the currently read processing instruction is greater than a preset aperture; the preset aperture is the aperture of the largest blind hole that a laser processing device can form on a circuit board at a single time; if the currently read current aperture is greater than the preset aperture, the following steps are executed: a conversion step: using a hole-matching instruction conversion program executed in the laser processing device, according to the current aperture, find a corresponding conversion information in a conversion database, and according to the found conversion information The method comprises the steps of: calculating a center coordinate of each of the plurality of small blind holes corresponding to each other for splicing a combined large blind hole based on the conversion information and a center coordinate of the current aperture in the processing file; calculating a center coordinate of each of the plurality of small blind holes corresponding to each other for splicing a combined large blind hole; wherein each conversion information comprises laser processing information, a number of small blind holes, and an aperture of the small blind holes; and a processing step of: using a processor to control a laser processing device of a laser processing equipment to form a plurality of small blind holes on the circuit board based on the conversion information and the center coordinates of the plurality of small blind holes, wherein each small blind hole overlaps at least a portion of two adjacent small blind holes, and the plurality of small blind holes together constitute a combined large blind hole; wherein, in the conversion step, the hole splicing instruction conversion program can display a setting interface, in which at least the conversion information found in the conversion database can be displayed, and the setting interface can provide a user with the ability to modify at least one of the number of small blind holes and the aperture of the small blind holes displayed in the conversion information.

[0007] Preferably, the setting interface further includes at least two small blind hole shape setting options, and the two small blind hole shape setting options are used to determine the shape of each small blind hole formed on the circuit board by the laser processing device in the processing step.

[0008] Preferably, in the reading step, the current aperture determined to be larger than the preset aperture is defined as a large blind hole aperture; the large blind hole aperture can also be displayed in the setting interface.

[0009] Preferably, the conversion information further includes a small blind hole overlap ratio, which is the ratio of the area where a single small blind hole overlaps with another small blind hole to the total area of ​​the single small blind hole; the small blind hole overlap ratio can also be displayed in the setting interface.

[0010] Preferably, in the reading step, the current aperture that is determined to be larger than the preset aperture is defined as a large blind hole aperture; the conversion information also includes an edge excess value, which refers to the difference between the aperture of the combined large blind hole and the large blind hole aperture; the edge excess value can also be displayed in the setting interface.

[0011] Preferably, in the reading step, if it is determined that the current aperture contained in the currently read processing instruction is not larger than the preset aperture, the following steps are performed: a normal processing step: based on the current aperture and a center coordinate corresponding to the currently read processing instruction in the processing file, the laser processing device is controlled to form a blind hole at the corresponding position on the circuit board.

[0012] Preferably, the normal processing steps include the following steps: a query step: based on the current aperture, searching for corresponding laser processing information in a normal blind hole database; a processing step: forming a blind hole on the circuit board based on the found laser processing information, the current aperture and the corresponding center coordinates.

[0013] Preferably, the following steps are also included before the file receiving step: a processing instruction conversion step: if the processing file contains a processing instruction larger than the preset aperture, then a corresponding hole-stitching processing instruction is added to the processing file; the hole-stitching processing instruction contains the aperture in the corresponding processing instruction; wherein, in the reading step, each processing instruction in the processing file is read one by one, and it is determined whether the current aperture contained in the currently read processing instruction is larger than the preset aperture, and whether the currently read processing instruction is a hole-stitching processing instruction. If it is determined that the currently read processing instruction is a hole-stitching processing instruction, the conversion step is executed, otherwise the conversion step is not executed.

[0014] Preferably, in the processing instruction conversion step, a corresponding hole-matching processing instruction is searched in a preset conversion table according to the hole diameter included in the processing instruction that is larger than the preset hole diameter.

[0015] One embodiment of the present invention discloses a laser processing device, which includes a processor, a hole punching instruction conversion program and a laser processing device. The processor can execute the file receiving step, the reading step and the processing step in the circuit board processing method of the present invention.

[0016] In summary, the circuit board processing method and laser processing equipment of the present invention incorporate a hole-stitching instruction conversion program within the laser processing equipment, along with a design involving reading, conversion, and processing steps. This allows users to intuitively input the required large blind via diameters into CAM software. The hole-stitching instruction conversion program then automatically stitches together multiple small blind vias on the circuit board, creating the desired large blind via. This significantly increases the speed at which users can generate processing files using CAM software. Furthermore, the design of the setting interface of the circuit board processing method and laser processing equipment of the present invention allows personnel to quickly and easily adjust the parameters of the small blind vias.

[0017] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 1 is a flow chart of a first embodiment of a circuit board processing method according to the present invention.

[0019] Figure 2 FIG. 1 is a block diagram of a first embodiment of a circuit board processing method and a laser processing device according to the present invention.

[0020] Figure 3 Schematic diagram of calculating the center coordinates of a small blind hole in the first embodiment of the circuit board processing method of the present invention.

[0021] Figure 4 Schematic diagram of a combined large blind via formed by the first embodiment of the circuit board processing method of the present invention.

[0022] Figure 5 This is a schematic diagram of a setting interface of the circuit board processing method of the present invention.

[0023] Figure 6 FIG. 1 is a flow chart of a second embodiment of a circuit board processing method according to the present invention.

[0024] Figure 7 FIG. 2 is a block diagram of a second embodiment of a circuit board processing method and a laser processing device according to the present invention.

[0025] Figure 8 Schematic diagram of changes in the processing file of the second embodiment of the circuit board processing method of the present invention. DETAILED DESCRIPTION

[0026] In the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the relevant content described in the subsequent description appears in the specific figure, but it does not limit the subsequent description to only referring to the specific figure.

[0027] Please also refer to Figures 1 to 4 , Figure 1 FIG1 is a flow chart of a first embodiment of a circuit board processing method according to the present invention. Figure 2 FIG1 is a block diagram of a first embodiment of a circuit board processing method and a laser processing device according to the present invention. Figure 3 Schematic diagram of calculating the center coordinates of a small blind hole in the first embodiment of the circuit board processing method of the present invention. Figure 4 Schematic diagram of a combined large blind via formed by the first embodiment of the circuit board processing method of the present invention.

[0028] The circuit board processing method of the present invention is used to form at least one large blind hole on a circuit board using a laser processing device 100. The circuit board processing method includes a file receiving step S1, a reading step S2, a conversion step S3, a processing step S4 and a normal processing step S5. The execution order of these steps is based on the following description and Figure 1 shown.

[0029] The file receiving step S1 involves receiving a processing file 200 using a processor 1 of the laser processing device 100. In practice, the processor 1 can receive the processing file 200 via various methods, such as a network, a USB (Universal Serial Bus), or wireless reception, without limitation. The processing file 200 may be generated by various commonly available CAM (Computer-Aided Manufacturing) software, such as AltiumDesigner, Ucamco, or UcamX.

[0030] The reading step S2 involves using a processor to read each processing instruction in the processing file 200 one by one and determining whether a current aperture included in the currently read processing instruction is greater than a predetermined aperture. The predetermined aperture is the maximum aperture of a blind via that can be formed on a circuit board by the laser processing device 100 in a single operation. For example, the predetermined aperture is 300 microns (μm), but this is not a limitation and can vary depending on the laser processing device.

[0031] If the current aperture included in the currently read processing instruction is larger than the preset aperture, the conversion step S3 and the processing step S4 are executed. In the reading step S2, the current aperture determined to be larger than the preset aperture is defined as a large blind hole aperture.

[0032] The conversion step S3 comprises: utilizing a hole stitching instruction conversion program 11 executed in the laser processing apparatus 100 to search for a corresponding conversion information 121 in a conversion database 12 based on the current aperture (the aperture of the large blind hole). Based on the searched conversion information 121 and a center coordinate corresponding to the current aperture in the processing file 200 (i.e., the center coordinate corresponding to the aperture of the large blind hole in the processing file 200), the center coordinates of the small blind holes corresponding to each of the plurality of small blind holes used to stitch together a combined large blind hole are calculated. Each piece of conversion information 121 may include, for example, laser processing information, the number of small blind holes, the aperture of the small blind holes, a small blind hole overlap ratio, and an edge excess value. The small blind hole overlap ratio is the ratio of the overlapping areas of two adjacent small blind holes, and the edge excess value is the difference between the aperture of the combined large blind hole and the aperture of the large blind hole. The laser processing information, small blind hole quantity, small blind hole diameter, small blind hole overlap rate and edge overrun value included in each conversion information 121 may be data pre-established by relevant personnel of the laser processing equipment based on past practical experience.

[0033] The specific number and format of processing instructions included in the processing file 200 can be designed based on specific needs. Since a laser processing device 2 of the laser processing equipment 100 performs blind hole processing at a specified location on the circuit board according to the processing file 200, the processing file 200 will include processing instructions including aperture diameters and center coordinates. In a typical processing file 200, if one processing instruction specifies a tool and aperture, another corresponding processing instruction will be included in the processing file 200 to indicate the corresponding center coordinates. When the laser processing device 2 reads the processing file 200, it will form a blind hole of the aperture diameter specified by these processing instructions at the location on the circuit board corresponding to the center coordinates according to these two processing instructions.

[0034] In the conversion step S3, after the hole-stitching instruction conversion program 11 finds the corresponding conversion information 121, the hole-stitching instruction conversion program 11 can use the center coordinates of the large blind hole, the number of small blind holes in the conversion information 121, the aperture of the small blind holes, the small blind hole overlap rate and the edge excess value to calculate the center coordinates of each small blind hole according to a pre-set calculation method. The pre-set calculation method can be designed according to actual needs and is not limited here. Figure 3For example, the logic of the pre-set calculation method may be as follows: a virtual circle C1 is established using the center coordinates (X0, Y0) of the large blind hole and the aperture R of the large blind hole, and the center coordinates (X1, Y1), (X2, Y2), etc. of the multiple virtual small blind holes C2 are all located on the virtual circle C1, and the centers of the multiple virtual small blind holes C2 are located at equally divided positions of the virtual circle C1, and the area overlap ratio between adjacent virtual small blind holes C2 is equal to the small blind hole overlap ratio in the conversion information 121. The small blind hole overlap ratio = the area of ​​the area A where a single small blind hole overlaps with another small blind hole / the total area of ​​a single small blind hole.

[0035] Processing step S4 involves using a processor to control a laser processing device 2 of the laser processing apparatus 100 to form a plurality of small blind vias B1 on the circuit board B based on the laser processing information 131 and the center coordinates of the plurality of small blind vias. Each small blind via B1 overlaps at least partially with two adjacent small blind vias B1, and the plurality of small blind vias B1 collectively form the combined large blind via B2. The combined large blind via B2 has a larger diameter than the large blind via. The specific data included in the laser processing information 131 can be designed based on the adjustable parameters of the laser processing device 2 and actual needs, and is not limited herein.

[0036] In other words, when the processing instructions included in the processing file 200 are for forming a large-sized blind via on the circuit board that cannot be directly formed by the laser processing device 2, the processor 1 will execute the above-mentioned conversion step S3 and processing step S4. Then, the laser processing device 2 will form a plurality of interconnected small blind vias on the circuit board to form a combined large blind via B2, thereby achieving the large-sized blind via required by the original processing instructions.

[0037] It is worth mentioning that Figure 4 As shown in one specific embodiment, the edge overhang value P in the processing information is calculated as (diameter BD of the combined large blind via B2 - diameter R of the large blind via in the processing instruction) / 2. Because manufacturing tolerances may occur during the process of forming blind vias on a circuit board using a laser processing device, the edge overhang value can be set to significantly reduce the diameter of the combined large blind via to a value smaller than the diameter of the large blind via in the original processing instruction.

[0038] Please also refer to Figure 1 、 Figure 2 and Figure 5 , Figure 5FIG2 is a schematic diagram of a setting interface for the circuit board processing method of the present invention. In conversion step S3, the hole-stitching instruction conversion program 11 can also display a setting interface 111. Setting interface 111 can, for example, display the hole-stitching processing instructions (described later), the large blind hole diameter, and the conversion information retrieved from the conversion database (e.g., the total number of small blind holes, the small blind hole diameter, the small blind hole overlap ratio, and the edge overhang value). Setting interface 111 can also allow the user to modify the displayed information, such as at least one of the total number of small blind holes, the small blind hole diameter, the small blind hole overlap ratio, and the edge overhang value in the conversion information.

[0039] like Figure 5 As shown, in one embodiment, the setting interface 111 may further include at least two small blind hole shape setting options. The two small blind hole shape setting options are used to determine the shape of each small blind hole B1 formed by the laser processing device 2 on the circuit board B in the processing step S4. The parameters and data displayed in the setting interface 111 can be designed according to actual needs and are not limited to the above description and Figure 5 For example, the setting interface 111 may also display center coordinates, laser processing information, etc.

[0040] It should be noted that, in actual applications, the timing of displaying the setting interface 111 can be designed based on actual needs. For example, the laser processing equipment 100 includes a display and operating software. When the processor executes the operating software, the display will display a primary control interface. The primary control interface may include, for example, an option for forcing the setting interface to be displayed. If the user selects the option for forcing the setting interface to be displayed, the processor 1 will display the setting interface 111 on the display when executing conversion step S3 for the user to view and operate. When the setting interface 111 is displayed on the display, the processor 1 may proceed to process step S4, or the processor 1 may wait for the user to select a specific option in the setting interface 111 before proceeding to process step S4. Conversely, if the user does not select the option for forcing the setting interface to be displayed, the processor 1 will not control the display to display the setting interface 111 when executing conversion step S3, and the processor 1 will automatically proceed to process step S4 after executing conversion step S3. In different application scenarios, relevant personnel can, for example, only click a specific option in the main control interface after the laser processing device 2 completes the blind hole operation on the circuit board, so that the setting interface 111 corresponding to the specific combination large blind hole on the circuit board is displayed on the display.

[0041] Please refer back Figure 1 and Figure 2 In the reading step S2, if it is determined that the current aperture included in the currently read processing instruction is not larger than the preset aperture, the following steps are performed:

[0042] A normal processing step S5: Based on the current aperture and a center coordinate corresponding to the currently read processing instruction in the processing file 200, the laser processing device 2 is controlled to form a blind hole at a corresponding position on the circuit board. In actual application, the normal processing step S5 may include the following steps:

[0043] A query step: searching for corresponding laser processing information 131 in a normal blind hole database 13 according to the current aperture;

[0044] A processing step: forming a blind hole on the circuit board according to the found laser processing information 131 , the current aperture and the corresponding center coordinates.

[0045] In practical applications, the conversion database 12 and the normal blind hole database 13 can be stored in a storage device within the laser processing apparatus 100. The storage device can be, for example, a memory or hard disk, and is not limited thereto. In special applications, the conversion database 12 and the normal blind hole database 13 can also be stored in a remote server.

[0046] As described above, for example, assuming that the maximum diameter of a blind via that a laser processing device can form on a circuit board in a single pass is 300 microns (μm), and a customer of a circuit board processing manufacturer requires a 400 μm blind via and a 200 μm blind via to be formed on the circuit board, then after the processing file generation step S1, the generated processing file may contain, for example, four processing instructions, two of which represent a blind via diameter of 400 μm and its center coordinates, and two of which represent a blind via diameter of 200 μm and its center coordinates. When the processor reads the processing instruction for forming a blind via with a diameter of 400 μm, the processor 1 will proceed to execute the conversion step S3 and the processing step S4. As a result, the laser processing device 2 will form a plurality of interconnected small blind vias on the circuit board, thereby forming a large blind via with a diameter of 400 μm. In contrast, when the processor 1 reads the processing instruction for forming a hole with a diameter of 200 microns, the processor will continue to execute the normal processing step S5, and the processor 1 will control the laser processing device 2 to directly form a blind hole with a diameter of 200 microns on the circuit board.

[0047] Continuing with the above, after the laser processing equipment 100 receives the processing file 200, a relevant person can, for example, operate the laser processing equipment 100 to view relevant data corresponding to the 400-micron large blind via (e.g., the aforementioned hole-matching processing instruction (described later), the large blind via diameter, the total number of small blind vias, the small blind via diameter, the small blind via overlap ratio, and the edge overhang value) through the setting interface 111 before the laser processing device 2 forms the 400-micron large blind via on the circuit board. Alternatively, if the size of the combined large blind via formed on the circuit board is incorrect, the relevant person can operate the laser processing equipment 100 to view relevant data corresponding to the combined large blind via through the setting interface 111 to conduct error detection.

[0048] Please also refer to Figures 6 to 8 , Figure 6 FIG2 is a flow chart of a second embodiment of a circuit board processing method according to the present invention. Figure 7 FIG2 is a block diagram of a second embodiment of the circuit board processing method and laser processing equipment of the present invention. Figure 8 Schematic diagram of changes in the processing file of the second embodiment of the circuit board processing method of the present invention.

[0049] The circuit board processing method of this embodiment includes: a processing instruction conversion step SX, a file receiving step S1, a reading step S2X, a conversion step S3, a processing step S4, and a normal processing step S5. For a description of the file receiving step S1, the conversion step S3, the processing step S4, and the normal processing step S5, please refer to the previous description and will not be repeated here.

[0050] The biggest difference between this embodiment and the previous embodiment is that it further includes the following steps before the file receiving step S1:

[0051] A processing instruction conversion step SX: If the processing file includes a processing instruction 201 with a hole diameter larger than the preset hole diameter, a corresponding hole-matching processing instruction 201A is added to the processing file 200; the hole-matching processing instruction 201A includes the hole diameter in the corresponding processing instruction 201.

[0052] In the reading step S2X, each processing instruction in the processing file is read one by one, and it is determined whether the current aperture contained in the currently read processing instruction is larger than the preset aperture, and whether the currently read processing instruction is a stitching processing instruction. If it is determined that the current aperture contained in the currently read processing instruction is larger than the preset aperture, and it is determined that the currently read processing instruction is a stitching processing instruction 201A, then the conversion step S3 is executed, otherwise the conversion step S3 is not executed.

[0053] In practical applications, in the machining instruction conversion step SX, for example, the corresponding hole-matching machining instruction 201A can be searched in a preset conversion table 500 according to the hole diameter greater than the preset hole diameter included in the machining instruction.

[0054] like Figure 7 As shown, in one embodiment, the processing instruction conversion step SX is executed by, for example, a computer 300 that executes CAM software 400, and the preset conversion table 500 is stored in a storage 301, which is connected to the processor 1. The storage 301 is, for example, a data storage device such as a memory or a hard disk. More specifically, the processing instruction conversion step SX can be executed by, for example, a custom program developed by the user and embedded in the CAM software 400. The user can first use the CAM software 400 to generate the original processing file, and then execute the custom program to make the custom program execute the processing instruction conversion step SX. The custom program will selectively add the hole-stitching processing instructions to the original processing file.

[0055] In various embodiments, the processing instruction conversion step SX may be performed by a custom program independent of the CAM software 400. The custom program may read the original processing file and selectively add the hole-matching processing instructions to the original processing file to generate a new processing file. In various embodiments, the processing instruction conversion step SX may also be performed by a processor of the laser processing equipment.

[0056] According to the above, for example, Figure 8As shown, the left figure shows the processing instructions contained in the original processing file 200, and the right figure shows the processing instructions contained in the modified processing file 200A after the processing instruction conversion step SX. Assume that the maximum diameter of a blind hole that the laser processing equipment 100 can form on a circuit board at a single time is 300um (i.e., the preset aperture is 300um), and one of the processing instructions in the original processing file 200 is T01C0.014, and the processing instruction represents "using the T01 tool to form a blind hole with a diameter of 14 mil (approximately 355.6um) on the circuit board." Then, in the above-mentioned processing instruction conversion step SX, since the aperture (approximately 355.6um) of the processing instruction is larger than the preset aperture (300um), the processor will use the aperture (14 mil) contained in the processing instruction to find the corresponding hole-stitching processing instruction 201A: T514 in the preset conversion table 500 shown in the table below, and add the hole-stitching processing instruction 201A to the original processing file 200 to form a modified processing file 200A. The original processing instructions T01C0.014, T01C0.016, T01C0.018, and T01C0.020 shown in the table below may represent using tool T01 to form blind holes with apertures of 14 mil, 16 mil, 18 mil, and 20 mil, respectively.

[0057] Original processing instructions Hole processing instructions T01C0.014 T514 T01C0.016 T516 T01C0.018 T518 T01C0.020 T520

[0058] As above, after the processing instruction conversion step SX, the final output processing file 200A (such as Figure 8 (as shown in the right figure), the processing instruction 201A of "T514" will appear. In one of the actual applications, the hole-matching processing instruction can include the corresponding hole diameter in the original processing instruction. That is, if the original processing instruction is T01C0.014, the hole-matching processing instruction can be T514, where the "14" in "T514" can correspond to a hole diameter of 14 mil, and the "5" in "T514" can represent a small blind hole with a hole diameter of 5 mil. Of course, the specific format and value of the hole-matching processing instruction can be designed according to actual needs. In practice, the original processing instruction (T01C0.014) corresponding to "T514" can be retained in the final processing file. Such a design can facilitate the subsequent error troubleshooting work of relevant personnel.

[0059] Following the above example, Figure 8As shown in the left figure, if one of the processing instructions in the original processing file 200 is T21C0.005, this processing instruction represents "using the T21 tool to form a blind hole with a diameter of 5 mil (127 μm) on the circuit board", then in the above-mentioned processing instruction conversion step SX, since the hole diameter (127 μm) of the processing instruction is smaller than the preset hole diameter (300 μm), the final processing file 200A will not be added with the matching hole processing instruction 201A corresponding to the processing instruction T21C0.005.

[0060] Following the above example, Figure 8 As shown in the right figure, in the reading step S2X, when the processor reads the processing instruction of T01C0.014, the processor will determine that the aperture contained in the currently read processing instruction: 14 mil (about 355.6 um), is larger than the preset aperture (300 um), and the processor will not control the laser processing device 2 to process the circuit board according to the processing instruction; Conversely, when the processor reads the hole-matching processing instruction 201A of T514, the processor will execute the conversion step S3, and control the laser processing device 2 to form a plurality of small blind holes on the circuit board, so as to form a combined blind hole with an aperture slightly larger than 14 mil through the plurality of small blind holes.

[0061] Please also refer to Figure 2 and Figure 7 , which respectively show block diagrams of the first and second embodiments of the laser processing apparatus of the present invention. The laser processing apparatus 100 of the present invention comprises a processor 1, a hole-stitching instruction conversion program 11, a conversion database 12, a normal blind hole database 13, and a laser processing apparatus 2. The processor 1 is capable of executing the file receiving step S1 and the file conversion step S3 of the aforementioned circuit board processing method. The detailed description of the processor 1, hole-stitching instruction conversion program 11, conversion database 12, normal blind hole database 13, and laser processing apparatus 2 is the same as that described above and will not be repeated here.

[0062] In summary, the circuit board processing method and laser processing equipment of the present invention, through the design of the hole-stitching instruction conversion program, reading steps, conversion steps, processing steps, etc., allow the user to intuitively input the aperture of the large blind hole according to the requirements in the CAM software. Then, the hole-stitching instruction conversion program cooperates with the corresponding process steps to automatically stitch together multiple small blind holes on the circuit board to form the large blind hole required by the user. In other words, the user does not need to enter the data of the related small blind holes (such as the aperture of the small blind holes and the center coordinates of each small blind hole) used to stitch together the large blind holes in the CAM software. Therefore, the speed at which the user generates processing files using the CAM software can be greatly improved.

[0063] Furthermore, through the design of the setting interface, when an error occurs in the formation of a large blind via on a circuit board, relevant personnel can clearly understand the relevant parameters used by the laser processing device when forming the large blind via on the circuit board through the setting interface, and relevant personnel can quickly conduct error troubleshooting; moreover, because the processing instructions in the processing file directly use the aperture of the large blind via, relevant personnel basically do not need to review the processing instructions in the processing file during the error troubleshooting process.

[0064] After the blind vias are formed on a circuit board, they are typically electroplated. The electroplating equipment obtains the locations of the blind vias on the circuit board based on the processing file 200 and performs the electroplating operation accordingly. In the circuit board processing method of the present invention, the processing instructions in the processing file 200 directly include the large blind via diameter. Therefore, when the electroplating equipment reads the processing instructions from the processing file, it directly performs the electroplating operation based on the large blind via diameter and its corresponding center coordinates. In contrast, if the processing instructions in the processing file 200 include the diameters and center coordinates of multiple small blind vias used to form the large blind via, the electroplating equipment will perform the electroplating operation based on the diameters and center coordinates of the multiple small blind vias. However, since adjacent small blind vias at least partially overlap, if the electroplating equipment performs the electroplating operation based on the diameters and center coordinates of the multiple small blind vias, the plating area will be affected.

[0065] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the description and drawings of the present invention are included in the protection scope of the present invention.

Claims

1. A circuit board processing method, characterized in that: The circuit board processing method is used to form at least one large blind hole on a circuit board using a laser processing device. The circuit board processing method includes the following steps: A file receiving step: using a processor of the laser processing equipment to receive a processing file; A reading step: using the processor to read each processing instruction in the processing file one by one, and determining whether a current aperture included in the currently read processing instruction is larger than a preset aperture; the preset aperture is the aperture of the largest blind hole that can be formed on a circuit board by a laser processing device in a single operation; If the currently read aperture is larger than the preset aperture, the following steps are performed: a conversion step of searching a conversion database for corresponding conversion information based on the current aperture using a hole stitching instruction conversion program executed in the laser processing equipment, and calculating the center coordinates of each of the plurality of small blind holes used to stitch together a combined large blind hole based on the conversion information and a center coordinate corresponding to the current aperture in the processing file; wherein each conversion information includes laser processing information, the number of small blind holes, and the diameter of the small blind holes; A processing step: using the processor to control a laser processing device of the laser processing equipment to form a plurality of small blind holes on the circuit board according to the conversion information and the center coordinates of the plurality of small blind holes, wherein each small blind hole overlaps at least a portion of two adjacent small blind holes, and the plurality of small blind holes together constitute the combined large blind hole; Among them, in the conversion step, the hole-stitching instruction conversion program can display a setting interface, in which at least the conversion information found in the conversion database can be displayed, and the setting interface can provide the user with the ability to modify at least one of the number of small blind holes and the aperture of the small blind holes displayed in the conversion information.

2. The circuit board processing method according to claim 1, wherein: The setting interface also includes at least two small blind hole shape setting options, which are used to determine the shape of each small blind hole formed by the laser processing device on the circuit board in the processing step.

3. The circuit board processing method according to claim 1, wherein: In the reading step, the current aperture determined to be larger than the preset aperture is defined as a large blind hole aperture; the large blind hole aperture can also be displayed in the setting interface.

4. The circuit board processing method according to claim 1, wherein: The conversion information also includes a small blind hole overlap ratio, which is the ratio of the area where a single small blind hole overlaps with another small blind hole to the total area of ​​the single small blind hole; the small blind hole overlap ratio can also be displayed in the setting interface.

5. The circuit board processing method according to claim 1, wherein: In the reading step, the current aperture determined to be larger than the preset aperture is defined as a large blind hole aperture; the conversion information further includes an edge excess value, which refers to the difference between the aperture of the combined large blind hole and the large blind hole aperture; the edge excess value can also be displayed in the setting interface.

6. The circuit board processing method according to claim 1, wherein: In the reading step, if it is determined that the current aperture included in the currently read processing instruction is not larger than the preset aperture, the following steps are performed: A normal processing step: controlling the laser processing device to form a blind hole at a corresponding position on the circuit board according to the current aperture and a center coordinate corresponding to the processing instruction currently read in the processing file.

7. The circuit board processing method according to claim 6, characterized in that: The normal processing steps include the following steps: A query step: searching for corresponding laser processing information in a normal blind hole database according to the current aperture; A processing step: forming a blind hole on the circuit board according to the found laser processing information, the current aperture and the corresponding center coordinates.

8. The circuit board processing method according to claim 1, wherein: Before the file receiving step, the following steps are also included: A processing instruction conversion step: if the processing file contains the processing instruction with a hole diameter larger than the preset hole diameter, then a corresponding hole-matching processing instruction is added to the processing file; the hole-matching processing instruction contains the hole diameter corresponding to the processing instruction; Among them, in the reading step, each processing instruction in the processing file is read one by one, and it is determined whether the current aperture contained in the processing instruction currently read is greater than the preset aperture, and it is determined whether the processing instruction currently read is the hole-matching processing instruction. If it is determined that the processing instruction currently read is the hole-matching processing instruction, the conversion step is executed, otherwise the conversion step is not executed.

9. The circuit board processing method according to claim 8, characterized in that: In the processing instruction conversion step, according to the hole diameter included in the processing instruction that is larger than the preset hole diameter, the corresponding hole-matching processing instruction is searched in a preset conversion table.

10. A laser processing device, characterized in that: The laser processing equipment includes a processor, a hole-punching instruction conversion program and a laser processing device. The processor can execute the file receiving step, the reading step and the processing step in the circuit board processing method according to any one of claims 1 to 9.

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