A fully automatic SMT production line

Abstract

The present invention discloses a fully automatic SMT production line, including a PCB board loading machine, an integrated board removal and implantation machine, a laser engraving machine, a cleaning machine, a printing machine, a placement machine, a general-purpose machine, an integration machine, a reflow oven, a splitter, a cooling buffer machine, a glue dispenser, and a board collection machine. The fully automatic SMT production line provided by the present invention integrates the traditional board removal and implantation processes into a single device by providing an integrated board removal and implantation machine, thereby reducing the number of devices and operation links and shortening the production cycle. Furthermore, by providing an integration machine, two PCB boards can be integrated together before entering the reflow oven, improving the space utilization efficiency of the reflow oven and thereby enhancing overall production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of SMT production, and in particular to an SMT fully automatic production line. Background Art

[0002] SMT, short for Surface Mount Technology, is currently the most popular technology and process in the electronics assembly industry. The SMT production line is a new generation of electronics assembly technology developed from hybrid integrated circuit technology. Characterized by the use of surface mount technology for components and reflow soldering, it has become a new generation of assembly technology in electronic product manufacturing.

[0003] In traditional SMT fully automatic production lines, key steps such as board removal and board implantation are usually performed by two different devices. This not only increases the number of devices, but also requires more operation links and a longer production cycle for the entire production process. More links mean more waiting time and manual intervention, which reduces production efficiency and requires a lot of manpower for the entire production process. At the same time, when the product passes through the reflow oven, the large distance between two adjacent products leads to low space utilization efficiency of the reflow oven, thereby reducing production efficiency. Summary of the Invention

[0004] In order to overcome the problems of low production efficiency, large amount of manpower required and low space utilization efficiency of reflow furnace in the existing SMT full-automatic production line, the present invention provides an SMT full-automatic production line.

[0005] The technical solution of the present invention is as follows:

[0006] A fully automatic SMT production line, including a PCB board loading machine, a board removal and placement machine, a laser engraving machine, a cleaning machine, a printing machine, a placement machine, a general-purpose machine, an integration machine, a reflow oven, a splitter, a cooling buffer machine, a glue dispenser, and a board collection machine;

[0007] The PCB board loading machine is used to provide PCB boards to the board removal and planting integrated machine;

[0008] The integrated PCB removal and re-planting machine is used to clamp the PCB board on the A-side jig and then transport it to the laser engraving machine; remove the PCB board that has been processed on the A-side from the A-side jig, turn it over, clamp it on the B-side jig, and then transport it to the laser engraving machine; and remove the PCB board that has been processed on the B-side from the B-side jig and then transport it to the PCB collection machine;

[0009] The laser engraving machine is used to engrave the A side / B side of the PCB board;

[0010] The cleaning machine is used to clean the surface of the PCB board after the A side / B side is engraved;

[0011] The printer is used to print solder paste on the cleaned PCB board A / B side;

[0012] The chip mounter is used to mount small components on the PCB board after solder paste is printed on the A side / B side;

[0013] The universal machine is used to mount large components on the PCB board after mounting small components on the A side / B side;

[0014] The integration machine is used to use magnets set at the ends of the A-side / B-side fixture to absorb and integrate two adjacent PCB boards with large components mounted on the A-side / B-side.

[0015] The reflow oven is used to perform reflow soldering on the two integrated PCB boards;

[0016] The splitter is used to split two PCB boards after reflow soldering;

[0017] The cooling buffer machine is used to cool and buffer the disassembled PCB board;

[0018] The glue dispensing machine is used to dispense glue on the corners of some components on the cooled PCB board, and transport the glue-dispensed PCB board back to the board removal and transplantation integrated machine.

[0019] As a preferred solution of the present invention, a pusher is provided on the upper plate end of the board removal and planting machine, and the pusher is used to cooperate with the PCB board loading machine to perform loading operations. When there is a lack of PCB boards inside the PCB board loading machine, the pusher replaces the PCB board loading machine to supply PCB boards to the board removal and planting machine.

[0020] As a preferred solution of the present invention, an aerial track is provided between the integrated plate removal and planting machine and the laser engraving machine;

[0021] The aerial track is used to connect the entire production line in series to form a closed-loop production from beginning to end;

[0022] The PCB board clamped on the A-side / B-side fixture output by the board removal and planting integrated machine passes through the aerial track and is then transported to the laser engraving machine.

[0023] As a preferred solution of the present invention, a first docking platform, a first transfer machine, a first buffer machine and a first elevator are sequentially arranged between the panel removal and planting integrated machine and the aerial track;

[0024] The first docking station is used to receive and transfer the PCB boards clamped on the A-side / B-side fixture output by the board removal and implantation integrated machine;

[0025] The first transfer machine is used to transport the PCB board on the first docking station to the first buffer machine for buffering;

[0026] The first buffer is configured to transport the buffered PCBs to the first elevator according to a board request signal from the first elevator;

[0027] The first elevator is used to lift the PCB board from the production line height to the aerial track height and transport it to the aerial track.

[0028] As a preferred solution of the present invention, when the first transfer machine receives PCBs but the first elevator does not need them, the first buffer machine buffers the PCBs delivered by the first transfer machine into the hopper assembly;

[0029] When the first elevator requests boards but the first transfer machine does not receive any boards, the first buffer automatically supplies the PCB boards buffered in the silo assembly to the first elevator;

[0030] When the first transfer machine receives boards and the first elevator requests boards, the first buffer machine directly delivers the PCB boards delivered by the first transfer machine to the first elevator.

[0031] As a preferred solution of the present invention, a second elevator, a second transfer machine and a second docking platform are sequentially arranged between the aerial track and the laser engraving machine;

[0032] The second elevator is used to receive the PCB boards conveyed by the aerial track, lower the PCB boards from the height of the aerial track to the height of the production line, and convey them to the second transfer machine;

[0033] The second transfer machine is used to change the transmission direction of the PCB board at the turning point or intersection of the production line and transport it to the second docking station;

[0034] The second docking station is used to receive the PCB board delivered by the second transfer machine and deliver it to the laser engraving machine.

[0035] As a preferred solution of the present invention, an SPI detector and a second buffer are sequentially arranged between the printer and the placement machine;

[0036] The SPI inspection machine is used to inspect the solder paste printing quality of the PCB board after the solder paste is printed on the A side / B side, and transmit the solder paste to the second buffer machine;

[0037] The second buffer machine is used to transport the PCB board after solder paste inspection to the placement machine or NG station according to the OK / NG signal of the SPI inspection machine.

[0038] As a preferred solution of the present invention, a furnace front AOI inspection machine is provided between the placement machine and the general-purpose machine;

[0039] The furnace front AOI inspection machine is used to inspect the mounting status of the PCB board after small components are mounted on the A side / B side.

[0040] As a preferred solution of the present invention, a post-furnace AOI inspection machine is provided between the splitting machine and the cooling buffer machine;

[0041] The post-furnace AOI inspection machine is used to inspect the soldering condition of the PCB board after reflow soldering.

[0042] As a preferred solution of the present invention, a 3DAXI detector is provided between the cooling buffer machine and the dispensing machine;

[0043] The 3DAXI inspection machine is used to inspect the internal appearance of components on a PCB board.

[0044] Compared with the prior art, the present invention has the following beneficial effects:

[0045] The fully automatic SMT production line provided by the present invention has closely connected links, forming an efficient and continuous production process from PCB board loading to final board collection; by providing an all-in-one board removal and planting machine, the traditional board removal and planting processes are integrated into one device, reducing the number of equipment and operation links, and shortening the production cycle; by providing an integration machine, two PCB boards can be integrated together and enter the reflow furnace, improving the space utilization efficiency of the reflow furnace, and thus improving the overall production efficiency; by providing a splitter, the two PCB boards after reflow soldering are split, so that subsequent processes can operate normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0047] Figure 1 A schematic structural diagram of an embodiment of the present invention;

[0048] Figure 2 is a structural schematic diagram of another embodiment of the present invention;

[0049] Figure 3 This is a structural diagram of another embodiment of the present invention.

[0050] In the figure,

[0051] 1. PCB board loading machine; 2. PCB removal and implantation machine; 3. Laser engraving machine; 4. Cleaning machine; 5. Printing machine; 6. Mounting machine; 7. General-purpose machine; 8. Integration machine; 9. Reflow oven; 10. Splitting machine; 11. Cooling buffer machine; 12. Glue dispensing machine; 13. Board collecting machine; 14. Board pushing machine; 15. Aerial track; 16. First docking station; 17. First transfer machine; 18. First buffer machine; 19. First elevator; 20. Second elevator; 21. Second transfer machine; 22. Second docking station; 23. SPI inspection machine; 24. Second buffer machine; 25. Pre-furnace AOI inspection machine; 26. Post-furnace AOI inspection machine; 27. 3DAXI inspection machine. DETAILED DESCRIPTION

[0052] To make the technical problems, technical solutions, and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. It should also be noted that the embodiments described below are intended only to illustrate the present invention and are not intended to limit the present invention.

[0053] It should be noted that the indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the application product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, or the orientation or position relationship in which the application product is usually placed when in use. It is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0054] See also Figure 1 This embodiment provides an SMT fully automatic production line, including a PCB board loading machine 1, a board removal and planting machine 2, a laser engraving machine 3, a cleaning machine 4, a printing machine 5, a placement machine 6, a general-purpose machine 7, an integration machine 8, a reflow oven 9, a disassembly machine 10, a cooling buffer machine 11, a dispensing machine 12 and a board receiving machine 13.

[0055] PCB board feeder 1 is used to supply PCB boards to integrated board removal and implantation machine 2. PCB board feeder 1 receives materials through an AGV or manual feeding. PCB board feeder 1 uses a magazine frame for loading, which can hold hundreds of PCB boards at a time, saving time wasted by repeated loading.

[0056] The integrated machine for disassembling and planting PCBs 2 is used to clamp the PCB board on the A-side jig and then transport it to the laser engraving machine 3; remove the PCB board that has been processed on the A-side that has been returned from the A-side jig, turn it over, clamp it on the B-side jig, and then transport it to the laser engraving machine 3; and remove the PCB board that has been processed on the B-side that has been returned from the B-side jig, and then transport it to the board collecting machine 13 to concentrate the finished products, thereby avoiding unnecessary board blockage, line stoppage, and other problems. The A-side jig storage station and the B-side jig storage station on the integrated machine for disassembling and planting PCBs 2 can both store dozens of A-side jigs and dozens of B-side jigs, and the A-side jigs and B-side jigs can be recycled and buffered after being removed. The integrated machine for disassembling and planting PCBs 2 combines the three machines, namely, the board planting machine, the board disassembling machine, and the jig buffer machine, into one device, which occupies a small space and has a fast production pace.

[0057] Laser engraving machine 3 is used to engrave the A side / B side of the PCB board using high-power laser rays, mainly used for engraving QR codes and bar codes.

[0058] The cleaning machine 4 is used to clean the surface of the PCB board after the A side / B side is engraved using a silicone roller and a sticky roller.

[0059] The printer 5 is used to print solder paste on the cleaned A-side / B-side PCB board.

[0060] Chip mounter 6, used to mount small components on PCB boards after solder paste printing on side A / side B;

[0061] General-purpose machine 7, used to mount large components such as chips and shielding covers on PCB boards after mounting small components on the A / B side;

[0062] The integration machine 8 is used to use magnets set at the ends of the A-side / B-side fixture to absorb and integrate two adjacent PCB boards with large components mounted on the A-side / B-side, so as to save space in the reflow oven 9 and improve the space utilization efficiency of the reflow oven 9.

[0063] The reflow oven 9 is used for reflow soldering the two integrated PCB boards. During operation, the high temperature generated in the reflow oven 9 melts the solder paste on the surface of the PCB, so that the pins of the components mounted on the surface are soldered to the PCB board.

[0064] The splitter 10 is used to split two PCB boards after reflow soldering so that subsequent processes can operate normally.

[0065] The cooling buffer 11 is used to cool and buffer the disassembled PCB boards. Since the overall temperature of the PCB boards is very high after passing through the reflow oven 9, they cannot directly proceed to the next step. The cooling buffer 11 can not only temporarily store the PCB boards, but also cool the temporarily stored PCB boards, thereby improving cooling efficiency.

[0066] The glue dispenser 12 is used to apply curing glue, thermal conductive silicone, etc. to the corners of some components on the cooled PCB board, and then transport the glue-applied PCB board back to the integrated board removal and reassembly machine 2. The glue dispenser 12 can accurately apply curing glue or thermal conductive silicone to the corners of some components on the PCB board, ensuring that these critical locations are properly protected and fixed, reducing failures caused by loose or damaged components.

[0067] In the SMT fully automatic production line of the above embodiment, each link is closely connected, from PCB board loading to final board collection, forming an efficient and continuous production process; by setting up an integrated board removal and planting machine 2, the traditional board removal and planting processes are integrated into one device, reducing the number of equipment and operation links, and shortening the production cycle; by setting up an integration machine 8, the two PCB boards can be integrated together and enter the reflow furnace 9, which improves the space utilization efficiency of the reflow furnace 9 and thus improves the overall production efficiency; by setting up a splitter 10, the two PCB boards after reflow soldering are split, so that the subsequent processes can operate normally.

[0068] See also Figure 2 In one embodiment, a plate pusher 14 is provided on the upper plate end of the board removal and planting machine 2. The plate pusher 14 is used to cooperate with the PCB board feeder 1 to perform loading operations. When there is a lack of PCB boards inside the PCB board feeder 1, the plate pusher 14 replaces the PCB board feeder 1 to supply PCB boards to the board removal and planting machine 2. The material input method of the plate pusher 14 is AGV feeding, and manual feeding can also be used. The plate pusher 14 can also use a magazine frame to load materials. The magazine frame can be loaded with hundreds of PCB boards at a time, saving the time wasted by repeated loading. The use of the plate pusher 14 can reduce unnecessary line stops on the production line to improve production efficiency.

[0069] See also Figure 2 In one embodiment, an aerial track 15 is provided between the integrated board removal and implantation machine 2 and the laser engraving machine 3. PCBs clamped in the A-side / B-side fixtures output by the integrated board removal and implantation machine 2 pass through the aerial track 15 before being transported to the laser engraving machine 3. The aerial track 15 connects the entire production line in series, forming a closed-loop production loop from beginning to end, avoiding interference and collision risks from ground traffic, and improving production line safety.

[0070] See also Figure 3 In one embodiment, a first docking platform 16, a first transfer machine 17, a first cache machine 18 and a first elevator 19 are sequentially arranged between the board removal and transplanting machine 2 and the aerial track 15, and a second elevator 20, a second transfer machine 21 and a second docking platform 22 are sequentially arranged between the aerial track 15 and the laser engraving machine 3.

[0071] The first docking station 16 is used to receive and transfer the PCB boards clamped on the A-side / B-side fixtures output by the board removal and implantation integrated machine 2, and transport them to the first transfer machine 17. The first docking station 16 plays the role of adding a work station and transition.

[0072] The first transfer machine 17 is used to transport the PCB boards on the first docking station 16 to the first buffer machine 18 for buffering.

[0073] The first buffer 18 is used to deliver the cached PCB boards to the first elevator 19 in response to the request signal from the first elevator 19, ensuring that the PCB boards are delivered to the required location in a timely and accurate manner. Specifically, when the first transfer machine 17 receives a board but the first elevator 19 does not need one, the first buffer 18 buffers the PCB boards delivered by the first transfer machine 17 into the hopper assembly. When the first elevator 19 requests a board but the first transfer machine 17 does not receive one, the first buffer 18 automatically supplies the PCB boards cached in the hopper assembly to the first elevator 19. When the first transfer machine 17 receives a board but the first elevator 19 requests one, the first buffer 18 directly delivers the PCB boards delivered by the first transfer machine 17 to the first elevator 19. This caching mechanism of the first buffer 18 improves the smoothness and production efficiency of the entire production line.

[0074] The first elevator 19 is used to lift the PCB board from the production line height to the height of the aerial track 15 and transport it to the aerial track 15 to achieve the aerial reflow function.

[0075] The second elevator 20 is used to receive the PCB boards conveyed by the aerial track 15, lower the PCB boards from the height of the aerial track 15 to the height of the production line, and convey them to the second transfer machine 21 to realize the function of aerial reflow.

[0076] The second transfer machine 21 is used to change the transmission direction of the PCB board at the turning point or intersection of the production line (such as changing the PCB board conveyed to the left to convey it to the right, or changing the PCB board conveyed to the right to convey it to the left), and transport it to the second docking station 22.

[0077] The second docking station 22 is used to receive the PCB board delivered by the second transfer machine 21 and deliver it to the laser engraving machine 3. The second docking station 22 plays the role of adding a work station and transition.

[0078] The arrangement of the first elevator 19 and the second elevator 20 realizes the conversion of PCB boards from the production line height to the aerial track 15 height and vice versa, forming an aerial reflux material flow mode, reducing the ground space occupied and improving the flexibility of material flow; by setting the second transfer machine 21, the transmission direction of the PCB boards can be changed at the turning points or intersections of the production line, making the material flow more flexible and meeting the needs of complex production lines; the arrangement of the first docking station 16 and the second docking station 22 provides additional workstations and transition space for PCB boards, so that there is more buffer time in the process of transferring PCB boards from one device to another, reducing production interruptions caused by equipment failure or shutdown.

[0079] See also Figure 3 In one embodiment, an SPI inspection machine 23 and a second buffer 24 are sequentially positioned between the printer 5 and the placement machine 6. The SPI inspection machine 23 is used to inspect the solder paste printing quality of the PCB board after solder paste is printed on side A and side B, and then deliver the printed solder paste to the second buffer 24. The second buffer 24 is used to deliver the inspected PCB board to the placement machine 6 or the NG station based on the OK / NG signal from the SPI inspection machine 23. When the second buffer 24 receives the OK signal from the SPI inspection machine 23, it delivers the PCB board that has passed the solder paste inspection to the placement machine 6, ensuring continuous operation of the production line. When the second buffer 24 receives the NG signal from the SPI inspection machine 23, it delivers the PCB board that has failed the solder paste inspection to the NG station and issues an alarm for manual review, thus avoiding production line interruptions. The provision of the SPI inspection machine 23 and the second buffer 24 ensure that only PCB boards with qualified solder paste are delivered to the placement machine 6 for the next step, significantly reducing the production defect rate caused by poor solder paste printing and improving product quality.

[0080] See also Figure 3In one embodiment, a pre-processing AOI inspection machine 25 is located between the placement machine 6 and the general-purpose machine 7, and a post-processing AOI inspection machine 26 is located between the splitter 10 and the cooling buffer machine 11. The pre-processing AOI inspection machine 25 is used to inspect the placement of small components on the PCB board after mounting them on the A-side and B-side, ensuring the correct placement and quantity of components, thereby avoiding subsequent production problems caused by poor component placement. The post-processing AOI inspection machine 26 is used to inspect the soldering condition of the PCB board after reflow soldering, including whether there are any unqualified phenomena such as missing parts, warped legs, and tilting, to ensure that the soldering quality meets standards, thereby improving the overall quality and reliability of the product. Through the inspection of the AOI inspection machine 25 before the furnace, problems in the mounting process can be discovered and handled in time, avoiding the flow of defective products into subsequent production links, thereby reducing the cost losses caused by rework and repair of defective products; and the AOI inspection machine 26 after the furnace performs inspection immediately after reflow soldering, which can discover welding problems in time and repair them, avoiding the problem of discovering problems after further processing or assembling defective products into complete machines, thereby reducing the additional costs caused by disassembly and repair.

[0081] See also Figure 3 In one embodiment, a 3DAXI inspection machine 27 is provided between the cooling buffer machine 11 and the dispensing machine 12. The 3DAXI inspection machine 27 is used to inspect the appearance of small components on the PCB board and the internal appearance of large components such as chips and shielding covers to ensure that all components meet the quality requirements before the dispensing machine 12 performs the next operation, thereby avoiding the flow of defective products into subsequent processes and improving the overall quality of the product.

[0082] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the appended claims of the present invention.

[0083] The above is an exemplary description of the patent of the present invention in conjunction with the accompanying drawings. It is obvious that the implementation of the patent of the present invention is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the patent of the present invention, or the concept and technical solution of the patent of the present invention are directly applied to other occasions without improvement, they are all within the scope of protection of the present invention.

Claims

1. A fully automatic SMT production line, characterized in that: Including PCB board loading machine, board removal and planting machine, laser engraving machine, cleaning machine, printing machine, placement machine, general machine, integration machine, reflow oven, splitter, cooling buffer machine, glue dispensing machine and board collection machine; The PCB board loading machine is used to provide PCB boards to the board removal and planting integrated machine; The integrated PCB removal and re-planting machine is used to clamp the PCB board on the A-side jig and then transport it to the laser engraving machine; remove the PCB board that has been processed on the A-side from the A-side jig, turn it over, clamp it on the B-side jig, and then transport it to the laser engraving machine; and remove the PCB board that has been processed on the B-side from the B-side jig and then transport it to the PCB collection machine; The laser engraving machine is used to engrave the A side / B side of the PCB board; The cleaning machine is used to clean the surface of the PCB board after the A side / B side is engraved; The printer is used to print solder paste on the cleaned PCB board A / B side; The chip mounter is used to mount small components on the PCB board after solder paste is printed on the A side / B side; The universal machine is used to mount large components on the PCB board after mounting small components on the A side / B side; The integration machine is used to use magnets set at the ends of the A-side / B-side fixture to absorb and integrate two adjacent PCB boards with large components mounted on the A-side / B-side. The reflow oven is used to perform reflow soldering on the two integrated PCB boards; The splitter is used to split two PCB boards after reflow soldering; The cooling buffer machine is used to cool and buffer the disassembled PCB board; The glue dispensing machine is used to dispense glue on the corners of some components on the PCB board after cooling, and transport the glue-dispensed PCB board back to the board removal and transplanting integrated machine; Among them, an aerial track is provided between the said plate removal and planting integrated machine and the laser engraving machine; The aerial track is used to connect the entire production line in series to form a closed-loop production from beginning to end; The PCB board clamped on the A-side / B-side fixture output by the board removal and implantation integrated machine passes through the aerial track and is then transported to the laser engraving machine; A first docking platform, a first transfer machine, a first buffer machine and a first elevator are sequentially arranged between the panel removal and planting integrated machine and the aerial track; The first docking station is used to receive and transfer the PCB boards clamped on the A-side / B-side fixture output by the board removal and implantation integrated machine; The first transfer machine is used to transport the PCB board on the first docking station to the first buffer machine for buffering; The first buffer is configured to transport the buffered PCBs to the first elevator according to a board request signal from the first elevator; The first elevator is used to lift the PCB board from the production line height to the aerial track height and transport it to the aerial track; When the first transfer machine receives PCBs but the first elevator does not need them, the first buffer caches the PCBs delivered by the first transfer machine into the hopper assembly; When the first elevator requests boards but the first transfer machine does not receive any boards, the first buffer automatically supplies the PCB boards buffered in the silo assembly to the first elevator; When the first transfer machine receives boards and the first elevator requests boards, the first buffer machine directly delivers the PCB boards delivered by the first transfer machine to the first elevator.

2. The fully automatic SMT production line according to claim 1, characterized in that: A pusher is provided on the upper plate end of the board removal and planting machine, and the pusher is used to cooperate with the PCB board loading machine to perform loading operations. When there is a lack of PCB boards inside the PCB board loading machine, the pusher replaces the PCB board loading machine to supply PCB boards to the board removal and planting machine.

3. The fully automatic SMT production line according to claim 1, characterized in that: A second elevator, a second transfer machine and a second docking platform are sequentially arranged between the aerial track and the laser engraving machine; The second elevator is used to receive the PCB boards conveyed by the aerial track, lower the PCB boards from the height of the aerial track to the height of the production line, and convey them to the second transfer machine; The second transfer machine is used to change the transmission direction of the PCB board at the turning point or intersection of the production line and transport it to the second docking station; The second docking station is used to receive the PCB board delivered by the second transfer machine and deliver it to the laser engraving machine.

4. The fully automatic SMT production line according to claim 1, characterized in that: An SPI detector and a second buffer are sequentially arranged between the printing machine and the placement machine; The SPI inspection machine is used to inspect the solder paste printing quality of the PCB board after the solder paste is printed on the A side / B side, and transmit the solder paste to the second buffer machine; The second buffer machine is used to transport the PCB board after solder paste inspection to the placement machine or NG station according to the OK / NG signal of the SPI inspection machine.

5. The fully automatic SMT production line according to claim 1, characterized in that: A furnace front AOI inspection machine is provided between the placement machine and the general-purpose machine; The furnace front AOI inspection machine is used to inspect the mounting status of the PCB board after small components are mounted on the A side / B side.

6. The fully automatic SMT production line according to claim 1, characterized in that: A post-furnace AOI inspection machine is provided between the splitting machine and the cooling buffer machine; The post-furnace AOI inspection machine is used to inspect the soldering condition of the PCB board after reflow soldering.

7. The fully automatic SMT production line according to claim 1, characterized in that: A 3DAXI detector is provided between the cooling buffer machine and the dispensing machine; The 3DAXI inspection machine is used to inspect the internal appearance of components on a PCB board.

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