A multifunctional wafer picosecond laser processing device and its use method

Abstract

The present invention belongs to the field of semiconductor processing technology, and in particular to a multifunctional wafer picosecond laser processing device and a method of using the same. In view of the problem that the existing one-time laser chamfering action can only chamfer the top of the wafer, and the chamfer at the bottom needs to be manually flipped, which reduces the processing efficiency and is inconvenient to chamfer the positioning notch of the wafer, the following scheme is proposed, which includes a workbench, and the four corners of the top of the workbench are all fixedly provided with a first electric push rod, and the tops of the four first electric push rods are fixedly provided with the same lifting platform, which integrates multiple functions such as wafer rotation, lifting, flipping, self-adjusting movement and precise positioning, thereby realizing the automation and continuity of the wafer processing process. Through the precise control of the first electric push rod and the second electric push rod, and the driving of the first motor and the second motor, the rotation, lifting, flipping and other operations of the wafer can be efficiently completed, which significantly improves the production efficiency and flexibility.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a multifunctional wafer picosecond laser processing device and a use method thereof. Background Art

[0002] In semiconductor production, the shape of the wafer is usually round, and the edge of the wafer is roughly at a right angle, resulting in sharp edges on the edge of the wafer, which can easily damage the edge of the wafer, causing quality problems such as edge collapse, marks, and scratches, affecting subsequent production processes and product quality. Therefore, in the semiconductor production process, the edges of the wafer are usually chamfered. The chamfering process not only makes the edge of the wafer smooth, reduces damage and marks, but also improves the stability and reliability of the chip. In order to improve the accuracy of the chamfer, some companies use lasers to cut and chamfer the edges. However, a laser chamfering action can only process the top of the wafer, and the chamfer below needs to be manually flipped, which reduces the processing efficiency and is not convenient for chamfering the positioning notch of the wafer. Summary of the invention

[0003] The purpose of the present invention is to solve the problem that a laser chamfering action exists in the prior art, which can only chamfer the top of the wafer, while the chamfer at the bottom requires manual flipping, which reduces the processing efficiency and is inconvenient to chamfer the positioning notch of the wafer. A multifunctional wafer picosecond laser processing device and its use method are proposed.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A multifunctional wafer picosecond laser processing device comprises a workbench, wherein first electric push rods are fixedly provided at the four corners of the top of the workbench, a same lifting platform is fixedly provided on the top of the four first electric push rods, a moving platform is slidably provided on the top of the lifting platform, two first rotating shafts are rotatably provided on the top of the moving platform, a material platform is fixedly provided on the top of the first rotating shaft, a plurality of first suction cups for fixing wafers are provided on the material platform, two sliding platforms are slidably provided on the top of the lifting platform, a first motor is fixedly provided on the top of the sliding platform, an output end of the first motor is fixedly connected to the corresponding first rotating shaft, and is used to drive the wafer to rotate and lift;

[0006] A support frame, the support frame is fixedly arranged on the top of the workbench, and two lasers are fixedly arranged on the bottom of the support frame for chamfering the wafer;

[0007] The flipping mechanism is arranged on the moving table and is used to flip the wafer on the right material table to the left material table to achieve chamfering of the front and back surfaces of the wafer;

[0008] Two sets of self-adjusting mechanisms are arranged on the lifting platform and used in conjunction with the corresponding first rotating shafts to drive the wafer to move and cooperate with the laser to chamfer the notch of the wafer;

[0009] The positioning component is arranged below the material table on the right side and is used for positioning the wafer.

[0010] In a possible design, the flipping mechanism includes a second electric push rod that is fixedly arranged on the top of the moving platform, a first guide rod is slidably arranged on the top of the moving platform, the output end of the second electric push rod and the top end of the first guide rod are fixedly provided with the same lifting frame, a second motor is fixedly provided at the bottom of the lifting frame, a rectangular hole corresponding to the lifting platform is provided on the top of the lifting platform, a rotating frame is rotatably provided on the top of the lifting frame, the output end of the second motor is fixedly connected to the rotating frame, a flipping frame is provided on one side of the rotating frame, an opening corresponding to the material table is provided on the top of the flipping frame, and a plurality of second suction cups for adsorbing wafers are provided on the front and back sides of the flipping frame, which are used to drive the flipping frame to rotate and move.

[0011] In a possible design, a fixed rod is rotatably provided through the top of the rotating frame, the top end of the fixed rod is slidably connected to the support frame, a second rotating shaft is rotatably provided through one side of the rotating frame, the flip frame is fixed on the second rotating shaft, and meshing bevel gears are fixedly sleeved on the second rotating shaft and the fixed rod. When the flip frame rotates around the second motor, it will rotate on its own, so as to flip the wafer.

[0012] In a possible design, the self-adjusting mechanism includes a first rotating column rotatably arranged on the top of the movable platform, a waist-shaped hole is opened on the top of the movable platform, a second rotating column is arranged in the waist-shaped hole, a third rotating column is rotatably arranged on the top of the movable platform, a mold disk that conflicts with the first rotating shaft is fixedly arranged on the top of the third rotating column, the outer walls of the first rotating column, the second rotating column, the third rotating column and the first rotating shaft are all sleeved with synchronous wheels, and the outer walls of multiple synchronous wheels are transmission-connected with the same double-sided synchronous belt, a second tension spring is arranged in the waist-shaped hole, and the two ends of the second tension spring are respectively fixedly connected to the outer wall of the second rotating column and the inner wall of the waist-shaped hole to form a tensioning mechanism for driving the mold disk to rotate in the opposite direction. When the first rotating shaft rotates, the first rotating shaft can be driven to move through the mold disk, and the wafer above will move together, and the notch can be chamfered by the laser. A fixed bar is fixedly arranged on the top of the lifting platform, and multiple first tension springs are fixedly arranged between the fixed bar and the corresponding sliding platform to drive the first rotating shaft to conflict with the outer wall of the mold disk.

[0013] In a possible design, the positioning assembly includes a sleeve rod mounted on a first rotating shaft, the outer wall of the sleeve rod is sleeved with a ring, the ring is penetrated and rotatably mounted on a movable table, the outer wall of the ring is fixedly sleeved with a rotating disk, a plurality of first guide grooves are provided on the top of the rotating disk, a limit rod is provided in the first guide groove, a second guide groove corresponding to the limit rod is provided on the top of the movable table, the bottom end of the limit rod is slidably arranged in the second guide groove, and when the rotating disk rotates, the limit rod can move in the first guide groove and the second guide groove at the same time, so that the wafer can be positioned close to each other.

[0014] In a possible design, a torsion spring is sleeved on the outer wall of the collar, and two ends of the torsion spring are respectively fixedly connected to the mutually adjacent sides of the rotating disk and the moving platform, so as to drive the rotating disk to reset and rotate.

[0015] In a possible design, the first guide groove is set in an arc shape, and the second guide groove is set in a straight line.

[0016] In a possible design, a limiting plate corresponding to the wafer notch is fixedly provided on the outer wall of one of the limiting rods for positioning the notch direction.

[0017] In a possible design, a handle is provided on the rotating disk.

[0018] A method for using a multifunctional wafer picosecond laser processing device comprises the following steps:

[0019] S1. Wafer positioning and fixing:

[0020] Place the wafer on the right side of the material table with the notch corresponding to the limit plate.

[0021] The rotating disk is rotated and the limiting rod approaches the positioning wafer.

[0022] The first suction cup is activated to absorb and fix the wafer.

[0023] S2. Wafer rotation and chamfering:

[0024] Start the first electric push rod, the lifting platform rises, and the laser beam is aimed at the chamfering position.

[0025] The first motor is started, and the first rotating shaft rotates, driving the material table and the wafer to rotate.

[0026] The laser chamfers the rotating wafer.

[0027] S3, mold plate rotation and notch chamfering:

[0028] The first rotating shaft rotates, and drives the third rotating column to rotate in the opposite direction through the synchronous wheel and the double-sided synchronous belt.

[0029] The third rotating column drives the mold plate to rotate.

[0030] When the notch of the mold plate corresponds to the first rotation axis, the sliding table moves rightward under the action of the first tension spring, driving the notch of the wafer close to the laser light to perform notch chamfering.

[0031] S4. Wafer flipping and preparation:

[0032] After the chamfering is completed, the first electric push rod resets the lifting platform.

[0033] Start the second electric push rod and the lifting frame rises.

[0034] Start the second motor, the rotating frame rotates, and the flip frame is driven to rotate to the right material table through the second rotating shaft.

[0035] The flip rack rotates to turn the wafer over.

[0036] The second electric push rod retracts, and the second suction cup absorbs and fixes the wafer.

[0037] S5. Wafer position exchange and continued processing:

[0038] By using the S4 method, the chamfered wafer is moved to the left stage.

[0039] Place the unprocessed wafer on the right side of the material table and continue the chamfering process.

[0040] Beneficial effects:

[0041] In the present invention, the multifunctional wafer picosecond laser processing device realizes efficient and accurate positioning of the wafer by designing a unique positioning component. The structural combination of the sleeve rod, the sleeve ring and the rotating disk enables the first guide groove on the rotating disk to cooperate with the second guide groove on the moving table during the wafer placement process to guide the precise movement of the limit rod, thereby ensuring the precise alignment of the wafer in the horizontal and vertical directions, and significantly improving the positioning accuracy and processing efficiency.

[0042] In the present invention, the multifunctional wafer picosecond laser processing device can perform directional positioning for a specific notch on the wafer through the additional limit plate design, thereby realizing intelligent identification and correction of the wafer placement direction, which is particularly important for laser processing processes that require strict control of the wafer direction, and can effectively avoid processing quality problems caused by directional errors, improve the product yield and consistency, and ensure the integrity of the chamfer to avoid not being able to process the notch;

[0043] In the present invention, the multifunctional wafer picosecond laser processing device realizes adaptive adjustment and precise positioning of the wafer during the processing process through a unique self-adjusting mechanism design. When the first rotating shaft drives the wafer to rotate, the mold plate can flexibly adjust the position of the wafer automatically according to the position and shape of the wafer through the transmission of the synchronous wheel and the double-sided synchronous belt, ensuring that the wafer notch is accurately aligned with the laser, thereby performing high-quality chamfering processing;

[0044] In the present invention, the multifunctional wafer picosecond laser processing device makes the front and back chamfering operations of the wafer simple and quick through the design of the flipping mechanism. The flipping frame is driven to rotate by the second motor, and the wafer is adsorbed and fixed by the second suction cup, so that the automatic flipping of the wafer is realized. This design not only reduces the labor intensity of the operator, but also improves the safety of the operation, and avoids the risk of misoperation and injury that may occur during the manual flipping process.

[0045] In the present invention, multiple functions such as wafer rotation, lifting, flipping, self-adjusting movement and precise positioning are integrated into one, realizing the automation and continuity of the wafer processing flow. Through the precise control of the first electric push rod and the second electric push rod, and the driving of the first motor and the second motor, the rotation, lifting, flipping and other operations of the wafer can be efficiently completed, which significantly improves the production efficiency and flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A schematic diagram of the three-dimensional structure of a multifunctional wafer picosecond laser processing device proposed by the present invention;

[0047] Figure 2 A schematic diagram of the three-dimensional structure of a multifunctional wafer picosecond laser processing device from another perspective proposed by the present invention;

[0048] Figure 3 This is a schematic cross-sectional structure diagram of a moving stage of a multifunctional wafer picosecond laser processing device proposed by the present invention;

[0049] Figure 4 A schematic diagram of the structure of a lifting rod platform of a multifunctional wafer picosecond laser processing device proposed by the present invention;

[0050] Figure 5 A schematic diagram of the rotating disk structure of a multifunctional wafer picosecond laser processing device proposed by the present invention;

[0051] Figure 6 A schematic diagram of the connection structure of the flip frame and the lifting frame of a multifunctional wafer picosecond laser processing device proposed by the present invention;

[0052] Figure 7 This is a schematic diagram of the flip frame structure of a multifunctional wafer picosecond laser processing device proposed in the present invention.

[0053] In the figure: 1, workbench; 2, first electric push rod; 3, lifting platform; 4, moving platform; 5, material platform; 6, first suction cup; 7, support frame; 8, laser; 9, rotating disk; 10, sliding platform; 11, first motor; 12, sleeve rod; 13, sleeve ring; 14, torsion spring; 15, first guide groove; 16, second guide groove; 17, limit rod; 18, limit plate; 19, first rotating column; 20, waist-shaped hole; 21, second rotating column ; 22. The third rotating column; 23. The fixing bar; 24. The first tension spring; 25. The mold plate; 26. The first rotating shaft; 27. The synchronous wheel; 28. The double-sided synchronous belt; 29. ​​The second tension spring; 30. The second electric push rod; 31. The first guide rod; 32. The lifting frame; 33. The second motor; 34. The rotating frame; 35. The second rotating shaft; 36. The flip frame; 37. The second suction cup; 38. The opening; 39. The fixing rod; 40. The bevel gear. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0055] Example 1

[0056] Reference Figure 1-Figure 7 A picosecond laser processing device comprises: a workbench 1, and four first electric push rods 2 are respectively fixedly installed at the four corners of the top of the workbench 1. The tops of the four first electric push rods are fixedly connected to a lifting platform 3 to ensure that the lifting platform can be lifted and lowered smoothly.

[0057] A slide rail system is designed on the top of the lifting platform 3, so that the moving platform 4 can slide freely on it. Two first rotating shafts 26 are installed on the top of the moving platform 4, and the top of each first rotating shaft is fixedly connected to a material platform 5. Multiple first suction cups 6 are evenly distributed on the material platform 5 to firmly absorb the wafer to prevent the wafer from moving during the processing.

[0058] Two sliding tables 10 are fixedly mounted on the top of the lifting platform 3, and a first motor 11 is fixed on the top of each sliding table. The output end of the first motor is fixedly connected to the corresponding first rotating shaft 26 through a coupling, so as to drive the wafer to rotate and lift.

[0059] A support frame 7 is fixedly installed on the top of the workbench 1, and two lasers 8 are fixedly installed on the bottom of the support frame. The two lasers are used to chamfer the wafer. The laser 8 is composed of a laser, an optical path system, a focusing mechanism, a computer system, an electrical control system and operating software in the patent document CN106552996A. A rotating mechanism and a swinging mechanism are also installed between the optical path system and the focusing mechanism. The rotating axis of the rotating mechanism is concentric with the optical axis passing through it and is perpendicular to the upper surface of the workbench. There is a reflector in the swinging mechanism. The angle between the reflector and the incident light is adjusted to change the angle of emission of the reflected light. The swinging mechanism is installed between the rotating mechanism and the focusing mechanism. A rotating mechanism and a swinging mechanism are installed between the optical path system and the focusing mechanism. The rotating axis of the rotating mechanism is concentric with the optical axis passing through it and is perpendicular to the upper surface of the workbench. There is a reflector in the swinging mechanism. The angle of the reflected light is changed by adjusting the angle between the reflector and the incident light. The swinging mechanism is installed between the rotating mechanism and the focusing mechanism. During the wafer processing, the laser beam output from the focusing mechanism is focused on the chamfer of the wafer. The laser focus instantly generates high temperature. The laser focus has a certain depth. The high temperature causes the glass at the chamfer to expand. When it is cooled, it will crack along the path of the laser to form a chamfer.

[0060] The rotation of the rotating mechanism is driven by a motor. The angle between the mirror plane of the reflector in the swing mechanism and the upper surface of the adsorption platform can be adjusted in the range of 45-90 degrees. The laser is a gas laser or a solid laser.

[0061] The flipping mechanism is arranged on the moving table 4 and is used to flip the wafer on the right material table 5 to the left material table 5 to achieve chamfering of the front and back surfaces of the wafer.

[0062] It includes a second electric push rod 30 fixedly installed at the top center of the moving platform 4, and a first guide rod 31 slidably installed on the moving platform 4. The output end of the second electric push rod 30 and the top end of the first guide rod 31 are fixedly connected to the lifting frame 32 to ensure that the lifting frame can be lifted and lowered smoothly and maintain a stable direction.

[0063] A second motor 33 is fixedly installed at the bottom of the lifting frame 32, and a rectangular hole corresponding to the lifting frame 32 is opened on the top of the lifting platform 3 so that the lifting frame 32 can pass through. A rotating frame 34 is rotatably installed on the top of the lifting frame 32, and the output end of the second motor 33 is fixedly connected to the rotating frame 34, so as to drive the rotating frame 34 to rotate.

[0064] On one side of the rotating frame 34, a flip frame 36 is fixedly installed, and an opening 38 corresponding to the material table 5 is provided on the top of the flip frame. A plurality of second suction cups 37 are installed on both the front and back sides of the flip frame for adsorbing wafers. In addition, a rotating fixed rod 39 is passed through the top of the rotating frame, and the top end of the fixed rod is slidably connected to the support frame 7 to increase stability.

[0065] On one side of the flip frame 36, the second rotating shaft 35 is connected to the rotating frame 34. Bevel gears 40 that mesh with each other are fixedly mounted on the second rotating shaft 35 and the fixed rod 39. When the second motor 33 drives the rotating frame 34 to rotate, the flip frame 36 will also rotate around its own axis through the transmission of the bevel gear 40 to achieve the flipping of the wafer.

[0066] The self-adjusting mechanism can be arranged on the lifting platform and used in conjunction with the first rotating shaft to achieve precise movement of the wafer in the horizontal direction, so as to cooperate with the laser to perform precise chamfering on the notch of the wafer.

[0067] It includes a first rotating column 19 rotatably installed through a bearing on the top of the movable platform 4, and a waist-shaped hole 20 is opened on the top of the movable platform 4. The design of the hole allows a second rotating column 21 to move laterally to a certain extent inside it to realize the adjustment function of the tensioning mechanism. The second rotating column 21 is rotatably installed in the waist-shaped hole 20 through a bearing to ensure that it can rotate smoothly.

[0068] On the top of the moving platform 4, the third rotating column 22 is again rotatably mounted through the bearing. On the top of the third rotating column 22, a mold plate 25 is fixedly mounted, and the design of the mold plate needs to match the shape and size of the wafer to ensure that the first rotating shaft 26 and the wafer thereon can be driven to move when in contact.

[0069] Synchronous wheels 27 are sleeved on the outer walls of the first rotating column 19, the second rotating column 21, the third rotating column 22 and the first rotating shaft 26. Subsequently, these synchronous wheels are connected by a double-sided synchronous belt 28 to ensure that each rotating column and the first rotating shaft can rotate synchronously.

[0070] A second tension spring 29 is installed in the waist-shaped hole 20, and its two ends are respectively fixedly connected to the outer wall of the second rotating column 21 and the inner wall of the waist-shaped hole 20. In this way, when the second rotating column 21 moves in the waist-shaped hole 20, the second tension spring 29 will provide continuous tension to ensure that the double-sided synchronous belt 28 maintains an appropriate tension state, thereby achieving stable transmission.

[0071] A fixing bar 23 is fixedly installed on the top of the lifting platform 3. A plurality of first tension springs 24 are installed between the fixing bar 23 and the corresponding sliding platform 10. One end of the first tension springs 24 is fixed to the fixing bar 23, and the other end is connected to the sliding platform 10, so as to provide a thrust to the sliding platform 10 and the first rotating shaft 26 toward the mold plate 25, and ensure that the first rotating shaft 26 can always be tightly pressed against the outer wall of the mold plate 25.

[0072] When the first motor 11 is started and drives the first rotating shaft 26 to rotate, the first rotating column 19, the second rotating column 21 and the third rotating column 22 will also rotate synchronously due to the transmission effect of the double-sided synchronous belt 28. At this time, the interference between the mold plate 25 and the first rotating shaft 26 enables the mold plate 25 to drive the first rotating shaft 26 to move in the horizontal direction, thereby driving the wafer notch to move to the processing position of the laser. At the same time, due to the effect of the first tension spring 24, the close contact between the first rotating shaft 26 and the mold plate 25 is ensured, thereby improving the stability and accuracy of the transmission.

[0073] During the processing, the laser 8 performs chamfering on the wafer according to a preset program, especially accurately processing the notch of the wafer. Due to the existence of the self-adjusting mechanism, the wafer can maintain stable movement during the processing, thereby ensuring the consistency and efficiency of the processing quality.

[0074] Positioning component: located below the right side material table 5, it is used to clamp and position the wafer, and to precisely position it to ensure processing accuracy.

[0075] It includes a sleeve rod 12, which is sleeved on the first rotating shaft 26 to ensure the rotation of the first rotating shaft 26. Subsequently, a sleeve ring 13 is sleeved on the outer wall of the sleeve rod 12, and the sleeve ring 13 is rotatably installed on the moving platform 4 through a bearing or other rotating device, so that the sleeve ring can rotate freely relative to the moving platform.

[0076] The rotating disk 9 is fixedly mounted on the outer wall of the collar 13. A plurality of first guide grooves 15 are provided on the top of the rotating disk 9, and each first guide groove is designed to be arc-shaped to adapt to the moving track of the limiting rod 17 during the rotation process. At the same time, a second guide groove 16 corresponding to the limiting rod 17 is provided on the top of the moving platform 4, and the second guide groove is designed to be linear to ensure the stable movement of the limiting rod in the vertical direction.

[0077] The limiting rod 17 is installed in the first guide groove 15, and its bottom end is ensured to be slidably arranged in the second guide groove 16. In this way, when the rotating disk 9 rotates, the limiting rod 17 can move in the first guide groove 15 and the second guide groove 16 at the same time, realizing the function of approaching each other to position the wafer.

[0078] A torsion spring 14 is sleeved on the outer wall of the collar 13. The two ends of the torsion spring are respectively fixedly connected to the mutually adjacent sides of the rotating disk 9 and the moving platform 4. In this way, when the rotating disk 9 is rotated by external force, the torsion spring can generate a reset torque, and when released, it can drive the rotating disk 9 to automatically reset and rotate, which is convenient for the next positioning operation.

[0079] A limiting plate 18 corresponding to the wafer notch is fixedly arranged on the outer wall of one of the limiting rods 17. The limiting plate 18 is designed to accurately match the notch shape and position of the wafer to ensure that the wafer notch can be accurately positioned in the orientation during the positioning process.

[0080] The present application can be used in the field of semiconductor processing, and can also be used in other fields applicable to the present application.

[0081] Example 2

[0082] refer to Figure 1-Figure 7 , improved on the basis of Example 1: A multifunctional wafer picosecond laser processing device is applied to the field of semiconductor processing. In order to facilitate manual operation of the rotating disk 9, a handle is added to the edge of the rotating disk 9. The design of the handle should conform to the principle of ergonomics, so that the operator can easily and stably rotate the rotating disk.

[0083] When the wafer needs to be positioned, the operator first rotates the rotating disk 9 by the handle. As the rotating disk rotates, the limiting rod 17 gradually approaches each other under the joint action of the first guide groove 15 and the second guide groove 16 until it contacts the edge of the wafer and produces a positioning effect. At the same time, the matching design of the limiting plate 18 and the wafer notch ensures the directional consistency of the wafer during rotation and movement.

[0084] After positioning is completed, the laser 8 can perform precise picosecond laser processing on the wafer according to the preset program. Due to the precision and stability of the positioning component, the accuracy and efficiency of the processing are ensured. And when the rotating disk 9 is released, the torsion spring 14 drives the rotating disk 9 to automatically reset, preparing for the next positioning operation.

[0085] A method for using a multifunctional wafer picosecond laser processing device comprises the following steps:

[0086] S1. First, place the wafer on the right side of the material table 5 so that the notch corresponds to the limit plate 18, and rotate the rotating disk 9 to drive the multiple limit rods 17 to approach each other to position the wafer, and start the first suction cup 6 to adsorb and fix the wafer;

[0087] S2, then start the first electric push rod 2 to extend and drive the lifting platform 3 to move upward until the light of the laser 8 is located at the chamfering position, and then start the first motor 11 to drive the first rotating shaft 26 to rotate, which can drive the material table 5 to rotate and drive the wafer to rotate. During the rotation, the laser 8 can be used to perform chamfering;

[0088] S3, the rotation of the first rotating shaft 26 can drive the third rotating column 22 to rotate in the opposite direction through the synchronous wheel 27 and the double-sided synchronous belt 28, and drive the mold plate 25 to rotate. When the notch of the mold plate 25 corresponds to the first rotating shaft 26, the sliding table 10 can move to the right under the action of the multiple first tension springs 24, and can drive the notch of the wafer close to the light emitted by the laser 8, and chamfer the notch;

[0089] S4, after the chamfering is completed, the first electric push rod 2 is started to drive the lifting platform 3 to reset, and the second electric push rod 30 is started to extend to drive the lifting frame 32 to move upward, and then the second motor 33 is started to drive the rotating frame 34 to rotate. The rotation of the rotating frame 34 can drive the flip frame 36 to rotate through the second rotating shaft 35, so that the flip frame 36 moves to the right side of the material table 5. At the same time, due to the engagement of the two second rotating shafts 35, the flip frame 36 can rotate around the second motor 33 to turn over, and finally the second electric push rod 30 is started to retract, and the wafer is adsorbed by the second suction cup 37;

[0090] S5. Finally, the wafer with the chamfered upper surface is moved to the left material table 5 by the method in S4, and the unprocessed wafer is placed on the right material table 5 to continue the chamfering process.

[0091] In the present application, first, the wafer is placed on the right side of the material table 5 so that the notch corresponds to the limit plate 18, and the rotating disk 9 is rotated. During the rotation of the rotating disk 9, the limit rod 17 is driven to move in the second guide groove 16 through the first guide groove 15, which can drive multiple limit rods 17 to approach each other to position the wafer, and start the first suction cup 6 to adsorb and fix the wafer. Finally, the rotating disk 9 is released, and the rotating disk 9 can be reset and rotated under the action of the torsion spring 14, driving multiple limit rods 17 away from the wafer;

[0092] Then, the first electric push rod 2 is started to extend and drive the lifting platform 3 to move upward until the light of the laser 8 is located at the chamfering position, and then the first motor 11 is started to drive the first rotating shaft 26 to rotate, which can drive the material table 5 to rotate and drive the wafer to rotate. During the rotation, the laser 8 can be used to perform chamfering;

[0093] The rotation of the first rotating shaft 26 can drive the third rotating column 22 to rotate in the opposite direction through the synchronous wheel 27 and the double-sided synchronous belt 28, and drive the mold plate 25 to rotate. When the notch of the mold plate 25 corresponds to the first rotating shaft 26, the sliding table 10 can move to the right under the action of the multiple first tension springs 24, and the second rotating column 21 can move in the waist-shaped hole 20 under the action of the second tension spring 29, stretching the double-sided synchronous belt 28, which can drive the notch of the wafer close to the light emitted by the laser 8, and chamfer the notch;

[0094] After the chamfering is completed, the first electric push rod 2 is started to drive the lifting platform 3 to reset, and the second electric push rod 30 is started to extend to drive the lifting frame 32 to move upward, and then the second motor 33 is started to drive the rotating frame 34 to rotate. The rotation of the rotating frame 34 can drive the flip frame 36 to rotate through the second rotating shaft 35, so that the flip frame 36 moves to the right side of the material table 5. At the same time, due to the engagement of the two second rotating shafts 35, the flip frame 36 can rotate around the second motor 33 to turn over, and finally the second electric push rod 30 is started to retract, and the wafer is adsorbed by the second suction cup 37;

[0095] Finally, the wafer with the chamfered upper surface is moved to the left material table 5 by the above method, and the unprocessed wafer is placed on the right material table 5 to continue the chamfering process.

[0096] However, as is well known to those skilled in the art, the working principles and wiring methods of the first electric push rod 2, the laser 8, the first motor 11, the second electric push rod 30 and the second motor 33 are commonplace, and are conventional means or common knowledge, and will not be elaborated here. Those skilled in the art may make any optional selections according to their needs or convenience.

[0097] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A multifunctional wafer picosecond laser processing device, characterized in that: The invention comprises a workbench (1), wherein first electric push rods (2) are fixedly provided at the four corners of the top of the workbench (1), a lifting platform (3) is fixedly provided on the top of the four first electric push rods (2), a moving platform (4) is slidably provided on the top of the lifting platform (3), two first rotating shafts (26) are rotatably provided on the top of the moving platform (4), a material platform (5) is fixedly provided on the top of the first rotating shaft (26), a plurality of first suction cups (6) for fixing wafers are provided on the material platform (5), two sliding tables (10) are slidably provided on the top of the lifting platform (3), a first motor (11) is fixedly provided on the top of the sliding table (10), an output end of the first motor (11) is fixedly connected to the corresponding first rotating shaft (26) for driving the wafer to rotate and rise and fall; A support frame (7), the support frame (7) being fixedly arranged on the top of the workbench (1), and two lasers (8) being fixedly arranged on the bottom of the support frame (7) for chamfering wafers; A flipping mechanism, arranged on the moving table (4), is used to flip the wafer on the right material table (5) to the left material table (5), thereby chamfering the front and back surfaces of the wafer; Two sets of self-adjusting mechanisms are arranged on the lifting platform (3) and are used in conjunction with the corresponding first rotating shafts (26) to drive the wafer to move and cooperate with the laser (8) to chamfer the notch of the wafer; A positioning component, arranged below the material table (5) on the right side, and used for positioning the wafer; The self-adjusting mechanism comprises a first rotating column (19) rotatably arranged on the top of the movable platform (4), a waist-shaped hole (20) is opened on the top of the movable platform (4), a second rotating column (21) is arranged inside the waist-shaped hole (20), a third rotating column (22) is rotatably arranged on the top of the movable platform (4), a mold plate (25) abutting against the first rotating shaft (26) is fixedly arranged on the top of the third rotating column (22), the outer walls of the first rotating column (19), the second rotating column (21), the third rotating column (22) and the first rotating shaft (26) are all sleeved with synchronous wheels (27), the outer walls of the plurality of synchronous wheels (27) are transmission-connected with the same double-sided synchronous belt (28), the waist-shaped hole ( A second tension spring (29) is provided inside the lifting platform (3), and the two ends of the second tension spring (29) are respectively fixedly connected to the outer wall of the second rotating column (21) and the inner wall of the waist-shaped hole (20), so as to form a tensioning mechanism for driving the mold plate (25) to rotate in the opposite direction. When the first rotating shaft (26) rotates, the mold plate (25) can drive the first rotating shaft (26) to move, and the wafer above will move together, so as to cooperate with the laser (8) to chamfer the notch. A fixing bar (23) is fixedly provided on the top of the lifting platform (3), and a plurality of first tension springs (24) are fixedly provided between the fixing bar (23) and the corresponding sliding platform (10), so as to drive the first rotating shaft (26) to contact the outer wall of the mold plate (25).

2. The multifunctional wafer picosecond laser processing device according to claim 1, characterized in that: The flip mechanism comprises a second electric push rod (30) which is fixedly arranged on the top of the moving platform (4); a first guide rod (31) is slidably arranged on the top of the moving platform (4); the output end of the second electric push rod (30) and the top end of the first guide rod (31) are fixedly provided with a lifting frame (32); a second motor (33) is fixedly arranged on the bottom of the lifting frame (32); a rectangular hole corresponding to the lifting platform (3) is provided on the top of the lifting platform (3); a rotating frame (34) is rotatably arranged on the top of the lifting frame (32); the output end of the second motor (33) is fixedly connected to the rotating frame (34); a flip frame (36) is provided on one side of the rotating frame (34); an opening (38) corresponding to the material platform (5) is provided on the top of the flip frame (36); a plurality of second suction cups (37) for adsorbing wafers are provided on the front and back sides of the flip frame (36) for driving the flip frame (36) to rotate and move.

3. The multifunctional wafer picosecond laser processing device according to claim 2, characterized in that: A fixing rod (39) is rotatably provided through the top of the rotating frame (34), and the top end of the fixing rod (39) is slidably connected to the support frame (7). A second rotating shaft (35) is rotatably provided through one side of the rotating frame (34), and the flip frame (36) is fixedly provided on the second rotating shaft (35). The second rotating shaft (35) and the fixing rod (39) are both fixedly sleeved with meshing bevel gears (40). When the flip frame (36) rotates around the second motor (33), it will rotate on its own, so that the wafer can be flipped.

4. The multifunctional wafer picosecond laser processing device according to claim 3, characterized in that: The positioning assembly comprises a sleeve rod (12) sleeved on a first rotating shaft (26); the outer wall of the sleeve rod (12) is sleeved with a sleeve ring (13); the sleeve ring (13) penetrates and is rotatably arranged on the movable platform (4); the outer wall of the sleeve ring (13) is fixedly sleeved with a rotating disk (9); a plurality of first guide grooves (15) are provided on the top of the rotating disk (9); a limiting rod (17) is provided in the first guide groove (15); a second guide groove (16) corresponding to the limiting rod (17) is provided on the top of the movable platform (4); the bottom end of the limiting rod (17) is slidably arranged in the second guide groove (16); when the rotating disk (9) rotates, the limiting rod (17) can move in the first guide groove (15) and the second guide groove (16) at the same time, so that the wafer can be positioned close to each other.

5. The multifunctional wafer picosecond laser processing device according to claim 4, characterized in that: The outer wall of the sleeve ring (13) is sleeved with a torsion spring (14), and the two ends of the torsion spring (14) are respectively fixedly connected to the rotating disk (9) and the side of the moving platform (4) close to each other, so as to drive the rotating disk (9) to reset and rotate.

6. The multifunctional wafer picosecond laser processing device according to claim 5, characterized in that: The first guide groove (15) is set in an arc shape, and the second guide groove (16) is set in a straight line.

7. The multifunctional wafer picosecond laser processing device according to claim 6, characterized in that: A limiting plate (18) corresponding to the wafer notch is fixedly provided on the outer wall of one of the limiting rods (17) and is used to position the direction of the notch.

8. The multifunctional wafer picosecond laser processing device according to claim 7, characterized in that: The rotating disk (9) is provided with a handle.

9. The method for using the multifunctional wafer picosecond laser processing device according to claim 8, characterized in that: The following steps are involved: S1, wafer positioning and fixing: placing the wafer on the right side of the material table (5), with the notch corresponding to the limit plate (18), rotating the rotating disk (9), the limit rod (17) close to the positioning wafer, and starting the first suction cup (6) to absorb and fix the wafer; S2, wafer rotation and chamfering: start the first electric push rod (2), the lifting platform (3) rises, the laser (8) is aimed at the chamfering position, the first motor (11) is started, the first rotating shaft (26) rotates, driving the material table (5) and the wafer to rotate, and the laser (8) performs chamfering on the rotating wafer; S3, mold plate rotation and notch chamfering: the first rotating shaft (26) rotates, and the third rotating column (22) is driven to rotate in the opposite direction through the synchronous wheel (27) and the double-sided synchronous belt (28), and the third rotating column (22) drives the mold plate (25) to rotate. When the notch of the mold plate (25) corresponds to the first rotating shaft (26), the sliding table (10) moves rightward under the action of the first tension spring (24), driving the wafer notch close to the laser (8) light, and performing notch chamfering; S4, wafer flipping and preparation: after chamfering is completed, the first electric push rod (2) resets the lifting platform (3), the second electric push rod (30) is started, the lifting frame (32) rises, the second motor (33) is started, the rotating frame (34) rotates, and the flip frame (36) is driven to rotate to the right side of the material table (5) through the second rotating shaft (35), the flip frame (36) rotates to realize wafer flipping, the second electric push rod (30) is retracted, and the second suction cup (37) adsorbs and fixes the wafer; S5, wafer position exchange and continued processing: through the S4 method, the chamfered wafer is moved to the left material table (5), and the unprocessed wafer is placed on the right material table (5) to continue the chamfering process.

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