A method, device and storage medium for adjusting pad spacing

Abstract

The present application relates to a method, device and storage medium for adjusting the pad spacing. The method includes: obtaining a layout, determining a target area in the layout that includes at least two pads to be adjusted; obtaining a target adjustment value for the pad spacing; based on the arrangement positions of the pads to be adjusted in the target area, sequentially determining the target adjustment area in the target area, and moving the target structure in the target adjustment area to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all pads to be adjusted in the target area is completed; wherein, moving the target structure in the target adjustment area includes: iteratively moving the target structure multiple times with a preset moving step length based on the target adjustment value. The present application can improve the efficiency of pad spacing adjustment, and avoid overlapping of multiple image structures during the adjustment process, thereby reducing the error in the pad spacing adjustment process.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit technology, and in particular to a pad spacing adjustment method, device and storage medium. Background Art

[0002] The pads on a test chip usually refer to the pins or interfaces on the chip used to connect to a test probe card. These pads can have different designs and layouts to suit specific circuit testing needs. A test chip is an integrated circuit used to verify and evaluate new technologies and post-process design methods. It is usually used in the early stages of the IC design process to quickly verify and improve design solutions.

[0003] When designing test chips, it is sometimes necessary to change the pad pitch (i.e., the distance between the center points of two pads). However, the test structure and the winding pattern between the structure and the pad cannot be changed, that is, the width of the line, the spacing of the line, and the direction of the line cannot be changed. In other words, based on the change in the pad pitch, usually only the length of the winding can be changed.

[0004] In the related art, the existing layout is usually manually modified with the help of layout tools, the pad spacing is artificially enlarged or reduced, and the position of the test structure and the wiring between the test structure and the pad need to be manually adjusted. Obviously, this method is time-consuming and labor-intensive, inefficient, and has a high error rate.

[0005] Currently, no effective solution has been proposed for the problem of low efficiency in adjusting the pad spacing in related technologies. Summary of the invention

[0006] Based on this, it is necessary to provide a pad spacing adjustment method, device and storage medium to address the above technical problems.

[0007] In a first aspect, the present application provides a method for adjusting the pad spacing. The method comprises:

[0008] Acquire a layout, and determine a target area in the layout that includes at least two pads to be adjusted;

[0009] Get the target adjustment value of the pad spacing;

[0010] Based on the arrangement positions of the pads to be adjusted in the target area, a plurality of target adjustment areas in the target area are determined in sequence, and a target structure in at least one target adjustment area is moved to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed;

[0011] The target structure in the target adjustment area is moved, including: iteratively moving the target structure multiple times with a preset moving step length based on the target adjustment value.

[0012] In one embodiment, the target structure in the target adjustment region is moved to complete the spacing adjustment of the pads to be adjusted on both sides of the target adjustment region, including:

[0013] Based on the target adjustment value, a correction process is performed on the winding interconnection structure related to the target adjustment area;

[0014] The correction process includes an extension process or a shortening process.

[0015] In one embodiment, the moving step size is set based on the target adjustment value, the design grid size of the layout, and the minimum edge spacing between adjacent polygons in the layer of the layout.

[0016] In one embodiment, the target structure in the target adjustment region is moved, including:

[0017] When the target structure is moved iteratively multiple times with a preset moving step length, the target adjustment direction is adjusted based on the target adjustment value, and in each iterative movement, the first side of the polygon in the target structure is moved first, and then the second side of the polygon in the target structure is moved;

[0018] The method for determining the first side and the second side of the polygon in the target structure includes: taking the side located on the first side between the highest point / highest side and the lowest point / lowest side in the polygon as the first side, and taking the side located on the second side as the second side;

[0019] The methods for determining the highest point / highest side and the lowest point / lowest side in the polygon include:

[0020] If there is only one highest point in the polygon, then that point is defined as the highest point. If there are two highest points in the polygon, then the side between the two points is defined as the highest side.

[0021] If there is only one lowest point in the polygon, then that point is defined as the lowest point. If there are two lowest points in the polygon, then the side between the two points is defined as the lowest side.

[0022] In one of the embodiments, based on the arrangement positions of the pads to be adjusted in the target area, determining the target adjustment area in the target area in sequence includes:

[0023] Determine a first adjustment pad and a second adjustment pad among the pads to be adjusted, wherein the first adjustment pad is determined based on a preset pad reference point, and the second adjustment pad is adjacent to the first adjustment pad;

[0024] Determine a first initial adjustment region based on a first bounding box of the target region and a first pad frame of the first adjustment pad, determine a second initial adjustment region based on the first pad frame and a second pad frame of the second adjustment pad, and determine a third initial adjustment region based on the second pad frame and a second bounding box of the target region;

[0025] Among them, the first bounding box and the second bounding box are in relative positions; the target adjustment area includes a first initial adjustment area, a second initial adjustment area and a third initial adjustment area, the first initial adjustment area includes a first adjustment pad, the second initial adjustment area does not include an adjustment pad, and the third initial adjustment area includes a second adjustment pad.

[0026] In one of the embodiments, based on the arrangement positions of the pads to be adjusted in the target area, the target adjustment area in the target area is determined in sequence, and the target structure in the target adjustment area is moved to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed, including:

[0027] The target adjustment area includes a first target adjustment area, a second target adjustment area, ..., an i-th target adjustment area, ..., and an N-1-th target adjustment area; wherein the i-th target adjustment area represents the target adjustment area determined for the i-th time, and N represents the number of pads in the target area;

[0028] Step a: let i=1;

[0029] Step b: determining the i-th target adjustment region in the target region based on the arrangement positions of the pads to be adjusted in the current target region; wherein the i-th target adjustment region includes three initial adjustment regions;

[0030] Determine the corresponding target structures in each initial adjustment area respectively, move the target structures in at least one initial adjustment area according to the arrangement order of the initial adjustment areas, obtain an i-th pad spacing adjustment result, and correct the winding interconnection structure related to the i-th target adjustment area based on the first pad spacing adjustment result to obtain an i-th adjustment result;

[0031] Step c: Determine whether i is equal to N-1. If not, set i=i+1 and repeat step a. If yes, the spacing adjustment of all pads to be adjusted in the target area is completed.

[0032] In one embodiment, the target structures corresponding to the initial adjustment regions are determined respectively, and the target structures in at least one initial adjustment region are moved according to the arrangement order of the initial adjustment regions to obtain the i-th pad spacing adjustment result, including:

[0033] Determine a moving step length, wherein the target adjustment value is an integer multiple of the moving step length, and half of the target adjustment value is also an integer multiple of the moving step length; the moving step length is smaller than the minimum edge spacing between adjacent polygons in the layer of the layout, and the moving step length is an integer multiple of the design grid size in the layout;

[0034] The i-th target adjustment area includes the first initial adjustment area, the second initial adjustment area and the third initial adjustment area:

[0035] The target structure in the first initial adjustment area is not moved;

[0036] For the target structure in the third initial adjustment region, iteratively move the target structure multiple times with a preset moving step length until the target structure moves by a total target adjustment value;

[0037] The target structure in the second initial adjustment region is iteratively moved multiple times with a preset moving step length until the target structure moves a total of half of the target adjustment value.

[0038] In one of the embodiments, the target structure includes a graphic structure of a preset layer in the layout, and the preset layer includes at least a device layer, a winding layer, and a pad layer.

[0039] In a second aspect, the present application also provides a pad spacing adjustment device. The device comprises:

[0040] An acquisition module is used to acquire a layout, determine a target area in the layout that includes at least two pads to be adjusted, and acquire a target adjustment value of the pad spacing;

[0041] An adjustment module is used to determine multiple target adjustment areas in the target area in sequence based on the arrangement positions of the pads to be adjusted in the target area, and move the target structure in at least one target adjustment area to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed; wherein, the moving processing of the target structure in the target adjustment area includes: based on the target adjustment value, iteratively moving the target structure multiple times with a preset moving step size.

[0042] In a third aspect, the present application further provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the following steps are implemented:

[0043] Acquire a layout, and determine a target area in the layout that includes at least two pads to be adjusted;

[0044] Get the target adjustment value of the pad spacing;

[0045] Based on the arrangement positions of the pads to be adjusted in the target area, the target adjustment area in the target area is determined in sequence, and the target structure in the target adjustment area is moved to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed;

[0046] The target structure in the target adjustment area is moved, including: iteratively moving the target structure multiple times with a preset moving step length based on the target adjustment value.

[0047] The above-mentioned pad spacing adjustment method, device and storage medium determine the target area of ​​at least two pads to be adjusted included in the acquired layout, and obtain the target adjustment value of the pad spacing; based on the arrangement position of the pads to be adjusted in the target area, the target adjustment area in the target area is determined in turn, and the target structure in the target adjustment area is moved to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all pads to be adjusted in the target area is completed; wherein, the target structure is moved, including, based on the target adjustment value, with a preset moving step, iteratively moving the target structure multiple times. Through the present application, the adjustment of multiple pad spacings can be completed automatically and efficiently, and on this basis, the relative position between the test structures and the shape of the winding will not be changed, which effectively improves the work efficiency. Further, in the present application, by dividing the moving process of the target structure into multiple completions, it is avoided that multiple graphic structures overlap during the moving process, and the error in the pad spacing adjustment process is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 Schematic diagram of a process of adjusting the pad spacing in one embodiment;

[0049] Figure 2a is a schematic diagram of a winding interconnection structure to be shortened in one embodiment;

[0050] Figure 2b A schematic diagram of a wire-wrap interconnection structure to be shortened in another embodiment;

[0051] Figure 2c A schematic diagram of a wire-wrap interconnection structure to be shortened in another embodiment;

[0052] Figure 2d A schematic diagram of an overall wiring structure in an embodiment;

[0053] Figure 2e A schematic diagram of a winding interconnection structure after adjustment in one embodiment;

[0054] Figure 3a A schematic diagram of a target structure in an embodiment;

[0055] Figure 3b A schematic diagram of a target structure in another embodiment;

[0056] Figure 4 A schematic diagram of the distribution of pads to be adjusted in an embodiment;

[0057] Figure 5 is an original local GDS layout in one embodiment;

[0058] Figure 6 is a schematic diagram of dividing the first target adjustment area in one embodiment;

[0059] Figure 7 A local GDS layout after extending the wiring interconnect structure related to the first target adjustment area in one embodiment;

[0060] Figure 8 is a schematic diagram of dividing the second target adjustment area in one embodiment;

[0061] Fig. 9 A local GDS layout of a second adjustment result in one embodiment;

[0062] Fig.10 A local GDS layout after the pad spacing adjustment is completed in an embodiment;

[0063] Fig.11 FIG. 4 is a structural block diagram of a pad spacing adjustment device in an embodiment. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0065] In one embodiment, Figure 1 As shown, a pad spacing adjustment method is provided, comprising the following steps:

[0066] Step S110, acquiring a layout, and determining a target area in the layout that includes at least two pads to be adjusted.

[0067] Among them, the above-mentioned layout is mostly a preset integrated circuit layout, and the preset target area includes a plurality of pads to be adjusted. In some preferred embodiments, considering the efficiency of subsequent pad spacing adjustment, the pads to be adjusted are usually arranged in a row. In practical applications, if there are multiple initial pads with irregular arrangements, the multiple initial pads can be divided first to obtain multiple rows of pads to be adjusted. Furthermore, when there are multiple initial pads, some of the pads can be selected as pads to be adjusted according to actual needs. During the adjustment process, the positions of other initial pads remain unchanged.

[0068] Step S120, obtaining a target adjustment value of the pad spacing.

[0069] Among them, the target adjustment value is used to indicate the target relative distance that needs to be adjusted between adjacent pads. The target adjustment value is mostly set by relevant technical personnel based on process requirements or application scenarios.

[0070] Step S130, based on the arrangement positions of the pads to be adjusted in the target area, determine multiple target adjustment areas in the target area in turn, and move the target structure in at least one target adjustment area to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed; wherein, moving the target structure in the target adjustment area includes: based on the target adjustment value, iteratively moving the target structure multiple times with a preset moving step size.

[0071] Wherein, based on the arrangement position of the pad, the target adjustment area is determined. In practical applications, the target adjustment area includes multiple target structures, such as pads, devices to be tested, winding structures, etc. In order to ensure the efficiency of pad adjustment, when the pad position to be adjusted is moved, it is also necessary to ensure that the morphology of other devices of the target structure does not change, so that it moves synchronously with the pad, that is, in this application, the target structure in the target adjustment area is moved synchronously as a whole. In this embodiment, the method for moving the target structure in the target adjustment area is to set the moving step length based on the target adjustment value to achieve multiple iterations and multiple movements based on the preset moving step length, and finally complete the adjustment of the pad spacing. Through steps S110 to S130, it can be realized according to actual needs, flexibly determine the pad to be adjusted that needs to be adjusted, and in the process of moving the pad to be adjusted, the target structure in the target adjustment area is moved synchronously as a whole, and the morphology of the test structure in the target adjustment area and the morphology of the winding structure between the test structure and the pad will not be changed, and scripts and other means can be used for automation, batch processing can be achieved, and the efficiency of pad spacing adjustment is effectively improved. Furthermore, in the present application, the movement of the target structure is completed in multiple steps with a preset movement step, so as to avoid the overlap of structures during the movement and reduce the risk of structural errors in the integrated circuit layout. In summary, the pad spacing adjustment method provided in the present application is applicable to any process node and is not subject to excessive limitations on the scope of application.

[0072] In some embodiments, the target structure in the target adjustment region is moved to complete the spacing adjustment of the pads to be adjusted on both sides of the target adjustment region, including:

[0073] Based on the target adjustment value, a correction process is performed on the winding interconnection structure related to the target adjustment area;

[0074] The correction process includes an extension process or a shortening process.

[0075] Specifically, after completing the movement processing of the target structure in the target adjustment area, the winding interconnection structure related to the target adjustment area is determined, and the winding interconnection structure is the winding interconnection structure in the target adjustment area and / or the winding interconnection structure around the target adjustment area. Then the winding interconnection structure is adjusted according to the adjustment direction. It can be understood that when the pad spacing is extended, it is usually necessary to extend the winding interconnection structure to solve the disconnection of the winding interconnection structure caused by the pad spacing adjustment. Similarly, when the pad spacing is shortened, the winding interconnection structure may also need to be shortened. It should be noted that the shortening processing method of the winding interconnection structure is related to the shape of the routing structure itself. For example, when facing a routing structure with an inflection point, it is necessary to delete the extra routing structure after changing the pad spacing. Figure 2ais a winding interconnection structure to be shortened in an embodiment. The rectangular box on the right side of the figure is an adjustment area, and X is a preset target adjustment value. At this time, since there is no inflection point during the movement of the adjustment area, there is no need to adjust the winding interconnection structure after the movement of the winding interconnection structure is completed; similarly, Figure 2b The winding interconnection structure to be shortened in another embodiment is shown in the figure. As can be seen from the figure, there is an inflection point in the process of the adjustment area moving, but the moving distance X is less than the distance Y between the adjustment area and the inflection point. Therefore, after the winding interconnection structure moves, there is no need to adjust the winding interconnection structure. It should be noted that Figure 2c is a winding interconnection structure to be shortened in another embodiment. As can be seen from the figure, there is an inflection point in the process of moving the adjustment area, and the moving distance X> the distance Y between the adjustment area and the inflection point. Therefore, after the winding interconnection structure is moved and before the winding interconnection structure is adjusted, the overall routing structure is Figure 2d As shown in the figure, after the movement is completed, there will be areas 41 and 42, that is, there are redundant protruding points. Therefore, after the adjustment is completed, it is necessary to delete areas 41 and 42 to obtain Figure 2e Through the above method, after the adjustment of the target structure in the adjustment area is completed, the winding interconnection structure can be efficiently corrected, thereby avoiding short circuits and the like caused by the movement of the adjustment structure.

[0076] In one embodiment, the moving step size is set based on the target adjustment value, the design grid size of the layout, and the minimum edge spacing between adjacent polygons in the layer of the layout.

[0077] Specifically, the moving step length in this embodiment needs to meet the following conditions: 1. In order to improve the moving efficiency of the graphic structure, the moving step length in this embodiment needs to be an integer multiple of the design grid size of the layout; 2. The moving step length needs to be less than the minimum edge spacing of adjacent polygons in each layer (the distance between adjacent graphics, that is, the spacing between edges), so as to avoid overlapping between graphic structures during the movement process; 3. The target adjustment value needs to be an integer multiple of the moving step length, and half of the target adjustment value is also an integer multiple of the moving step length. By limiting the moving step length in this embodiment, while improving the moving efficiency of the graphic structure, it is ensured that there will be no overlapping between graphic structures during the movement of the graphic structure. In other embodiments, the moving step length can also be set according to different conditions based on the target adjustment value, the design grid size of the layout, and the minimum edge spacing between adjacent polygons in the layer of the layout according to different needs. This application does not limit the specific setting method.

[0078] In one embodiment, the target structure in the target adjustment region is moved, including:

[0079] When the target structure is moved iteratively multiple times with a preset moving step length, the target adjustment direction is adjusted based on the target adjustment value, and in each iterative movement, the first side of the polygon in the target structure is moved first, and then the second side of the polygon in the target structure is moved;

[0080] The method for determining the first side and the second side of the polygon in the target structure includes: taking the side located on the first side between the highest point / highest side and the lowest point / lowest side in the polygon as the first side, and taking the side located on the second side as the second side;

[0081] The methods for determining the highest point / highest side and the lowest point / lowest side in the polygon include:

[0082] If there is only one highest point in the polygon, then that point is defined as the highest point. If there are two highest points in the polygon, then the side between the two points is defined as the highest side.

[0083] If there is only one lowest point in the polygon, then that point is defined as the lowest point. If there are two lowest points in the polygon, then the side between the two points is defined as the lowest side.

[0084] Specifically, Figure 3a and Figure 3b : is a schematic diagram of a target structure in an embodiment. Specifically, if there is only one highest point in the target structure, this point is determined as the highest point TOP point; if there are two highest points in the target structure, the edge between the two points is determined as the highest edge TOP edge; if there is only one lowest point in the target structure, this point is determined as the lowest point BOTTOM point; if there are two lowest points in the target structure, the edge between the two points is determined as the lowest edge BOTTOM edge, so that the edge on the right side of the TOP point / TOP edge in the target structure and the BOTTOM point / BOTTOM edge can be used as the right side edge, and the edge on the left side between the TOP point / TOP edge in the target structure and the BOTTOM point / BOTTOM edge can be used as the above-mentioned left side edge. Figure 3a In the figure, C and D are the right edges (can be determined as the first edge or the second edge), A and F are the left edges (can be determined as the second edge or the first edge), E is the TOP edge, and B is the BOTTOM edge. Similarly, Figure 3b a, b, c are the left sides, and f, e, d are the right sides. It can be understood that the first side is one of the left side and the right side, and the second side is also one of the left side and the right side, and the first side is different from the second side. When determining the left side and the right side of the target structure, the left side and the right side corresponding to all the target structures in the adjustment area are usually determined uniformly.

[0085] After the distinction between the first side and the second side is completed, the first side to be moved first can be determined based on the preset target adjustment direction. For example, if the target adjustment direction is to adjust to the right, the side on the right is determined as the first side. If the target adjustment direction is to adjust to the left, the side on the left is determined as the first side. Then, when moving the target structure, first move the first side of all target structures by the preset moving step, and then move the second side of all target structures by the preset moving step. Repeat the above steps until the target structure is moved by the target adjustment value based on the number of adjustments and the preset moving step. Through the above method, all target structures can be moved in an orderly manner to avoid overlap between structures, and also ensure that the morphology of each structure remains unchanged.

[0086] In some embodiments, based on the arrangement positions of the pads to be adjusted in the target area, determining the target adjustment area in the target area in sequence includes:

[0087] Determine a first adjustment pad and a second adjustment pad among the pads to be adjusted, wherein the first adjustment pad is determined based on a preset pad reference point, and the second adjustment pad is adjacent to the first adjustment pad;

[0088] Determine a first initial adjustment region based on a first bounding box of the target region and a first pad frame of the first adjustment pad, determine a second initial adjustment region based on the first pad frame and a second pad frame of the second adjustment pad, and determine a third initial adjustment region based on the second pad frame and a second bounding box of the target region;

[0089] Among them, the first bounding box and the second bounding box are in relative positions; the target adjustment area includes a first initial adjustment area, a second initial adjustment area and a third initial adjustment area, the first initial adjustment area includes a first adjustment pad, the second initial adjustment area does not include an adjustment pad, and the third initial adjustment area includes a second adjustment pad.

[0090] Specifically, the above-mentioned first adjustment pad is usually determined by a pad reference point, and the pad reference point can be set by relevant technical personnel according to actual needs and based on the pad position. In some preferred embodiments, the pad reference point is generally at the boundary of the adjustment area, and the second adjustment pad is adjacent to the first adjustment pad. Figure 441 is a schematic diagram of the distribution of pads to be adjusted in an embodiment, in which 42 is a first adjustment pad, 43 is a first initial adjustment area, 44 is a second initial adjustment area, and 45 is a third initial adjustment area. Furthermore, in this embodiment, the first boundary box and the second boundary box are borders on the integrated circuit layout. It can be understood that the first boundary box is not equal to the second boundary box. The first boundary box is determined to be the left / right border and the second boundary box is determined to be the right / left border according to actual needs. In some embodiments, the setting of the first boundary box and the second boundary box is based on the division of the target area, and it is not necessarily the case that the boundary boxes are borders of the integrated circuit layout in every embodiment.

[0091] Furthermore, the target adjustment area in the present embodiment is divided into three sub-areas, namely, the first initial adjustment area, the second initial adjustment area and the third initial adjustment area. When the target structure is moved, the graphic structures in the three initial adjustment areas are moved in sequence, and wherein, according to the division rule of the initial adjustment areas in the present application, the first initial adjustment area includes the first adjustment pad, the second initial adjustment area does not include the adjustment pad, and the second initial adjustment area includes the second adjustment pad, so that when the graphic structures in the three initial adjustment areas are moved in sequence, the spacing between adjacent adjustment pads can be adjusted. In the present embodiment, the corresponding adjustment area can be divided based on the pad to be adjusted, so as to better determine the subsequent target structure according to the adjustment area.

[0092] In some embodiments, based on the arrangement positions of the pads to be adjusted in the target area, the target adjustment area in the target area is determined in sequence, and the target structure in the target adjustment area is moved to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed, including:

[0093] The target adjustment area includes a first target adjustment area, a second target adjustment area, ..., an i-th target adjustment area, ..., and an N-1-th target adjustment area; wherein the i-th target adjustment area represents the target adjustment area determined for the i-th time, and N represents the number of pads in the target area;

[0094] Step a: let i=1;

[0095] Step b: determining the i-th target adjustment region in the target region based on the arrangement positions of the pads to be adjusted in the current target region; wherein the i-th target adjustment region includes three initial adjustment regions;

[0096] Determine the corresponding target structures in each initial adjustment area respectively, move the target structures in at least one initial adjustment area according to the arrangement order of the initial adjustment areas, obtain an i-th pad spacing adjustment result, and correct the winding interconnection structure related to the i-th target adjustment area based on the first pad spacing adjustment result to obtain an i-th adjustment result;

[0097] Step c: Determine whether i is equal to N-1. If not, set i=i+1 and repeat step a. If yes, the spacing adjustment of all pads to be adjusted in the target area is completed.

[0098] Specifically, the target adjustment area includes a first target adjustment area, a second target adjustment area and even the N-1th target adjustment area. In this embodiment, the first target adjustment area to the N-1th target adjustment area are obtained by dividing the target area based on different division methods, and each target adjustment area includes three initial adjustment areas. In a preferred embodiment, the division method of the first target adjustment area, that is, the division of the three initial adjustment areas in the first target adjustment area can be: based on the leftmost boundary of the circuit layout and the right tangent of the first leftmost pad to be adjusted, the first initial adjustment area is determined; based on the right tangent of the first leftmost pad to be adjusted and the left tangent of the second pad to be adjusted, the second initial adjustment area is determined; based on the left tangent of the second pad to be adjusted and the rightmost boundary of the circuit layout, the third initial adjustment area is determined. Similarly, the division method of the second target adjustment area, that is, the division of the three initial adjustment areas in the second target adjustment area can be: determine the first initial adjustment area in the second target adjustment area based on the leftmost boundary of the circuit layout and the right tangent of the second pad to be adjusted from the left; determine the second initial adjustment area based on the right tangent of the second pad to be adjusted from the left and the left tangent of the third pad to be adjusted from the left; determine the above-mentioned third initial adjustment area based on the left tangent of the third pad to be adjusted from the left and the rightmost boundary of the circuit layout. In summary, the division method of N-1 target adjustment areas and their corresponding initial adjustment areas can be determined by analogy.

[0099] After obtaining multiple divided target adjustment areas, the corresponding target structures in each initial adjustment area are determined. Specifically, the target structure in the initial adjustment area is selected. In practical applications, it can be understood as performing a Boolean AND operation on all layers in the initial adjustment area to select all graphics of all layers in the initial adjustment area. If half of a graphic is in the initial adjustment area and the other half is outside the initial adjustment area, only the half of the graphic in the initial adjustment area is selected. And according to the arrangement order of the initial adjustment areas, the target structure in at least one initial adjustment area is moved respectively, wherein the moving direction can be determined by actual needs, such as being set to move left or right.

[0100] According to the above, in this embodiment, it is necessary to determine whether i is equal to N-1, that is, it is necessary to determine whether the pads to be adjusted in the target area have been moved. If i is not equal to N-1, then i=i+1 is set, and the above steps a to c are repeated until i=N-1, that is, all the pads to be adjusted in the target area are moved. Taking i equal to 1 as an example, the first target adjustment area in the target area is first determined, that is, the three initial adjustment areas in the first target adjustment area are determined (the division of the first target adjustment area can be seen above), and then according to the arrangement order of the initial adjustment areas, the target structure in at least one initial adjustment area is moved in sequence to obtain the first pad spacing adjustment result, and the winding interconnection structure related to the first target adjustment area is corrected to obtain the first adjustment result. When it is detected that i=1 and i≠N-1, i is increased by 1, and the above steps are repeated, that is, the second target adjustment area in the target area is determined, the three initial adjustment areas in the second target adjustment area are determined, and then according to the arrangement order of the initial adjustment areas, the target structure in the initial adjustment area is moved in sequence to obtain the second adjustment result, and the winding interconnection structure is corrected. Similarly, at this time, i=2, if i≠N-1, then i is increased by 1, and the above steps are repeated until i=N-1, thereby completing the spacing adjustment of all pads to be adjusted in the target area. Through this embodiment, the pad spacing can be adjusted, and on this basis, the relative position and winding shape of the test structure in the target area are not changed.

[0101] In some embodiments, the target structures corresponding to the initial adjustment regions are determined respectively, and the target structures in at least one initial adjustment region are moved according to the arrangement order of the initial adjustment regions to obtain the i-th pad spacing adjustment result, including:

[0102] Determine a moving step length, wherein the target adjustment value is an integer multiple of the moving step length, and half of the target adjustment value is also an integer multiple of the moving step length; the moving step length is smaller than the minimum edge spacing between adjacent polygons in the layer of the layout, and the moving step length is an integer multiple of the design grid size in the layout;

[0103] The i-th target adjustment area includes the first initial adjustment area, the second initial adjustment area and the third initial adjustment area:

[0104] The target structure in the first initial adjustment area is not moved;

[0105] For the target structure in the third initial adjustment region, iteratively move the target structure multiple times with a preset moving step length until the target structure moves by a total target adjustment value;

[0106] The target structure in the second initial adjustment region is iteratively moved multiple times with a preset moving step length until the target structure moves a total of half of the target adjustment value.

[0107] Specifically, the requirements for the moving step length in this embodiment are that the target adjustment value is an integer multiple of the moving step length, and half of the target adjustment value is also an integer multiple of the moving step length, and the moving step length is an integer multiple of the design grid size in the layout, so that the movement of the graphic structure can be facilitated and the efficiency of graphic movement can be improved. In addition, the moving step length needs to be smaller than the minimum edge spacing of adjacent polygons in the layout layer, so as to avoid overlapping of several graphic structures during the movement process.

[0108] In this embodiment, which side is the third initial adjustment area is determined by the preset adjustment direction. If the adjustment direction is to move to the right, the rightmost adjustment area is the third initial adjustment area, the left side of the third initial adjustment area is the second initial adjustment area, and the leftmost area is the first initial adjustment area. Similarly, if the adjustment direction is to move to the left, the leftmost area is the third initial adjustment area. The first target structure is selected based on the first initial adjustment area, and the first target structure is not moved. The second target structure is selected based on the second initial adjustment area. After the third target structure is selected based on the third initial adjustment area, the third target structure is first moved iteratively multiple times with a moving step length according to the preset adjustment direction until the target structure moves a total of half of the target adjustment value. Then the second target structure is moved along the adjustment direction, and similarly, it is moved iteratively multiple times with a moving step length until the target structure moves a total of half of the target adjustment value. It can be understood that since the structures in the second initial adjustment area are all test structures and winding interconnection structures, it is necessary to ensure that the ratio of the relative distances between the moved test structures and the left and right pads is the same, that is, in order to ensure that the relative position and winding shape of the test structure do not change, the third initial adjustment distance is twice the second initial adjustment distance.

[0109] In some of the embodiments, the target structure includes a graphic structure of a preset layer in the layout, and the preset layer includes at least a device layer (front-end middle layer), a winding layer (back-end winding interconnect layer), and a pad layer.

[0110] This embodiment also provides a preferred embodiment of a pad spacing adjustment method.

[0111] First, based on the DRC (Design Rule Check) script, determine the smallest space among all layers in the existing initial GDS layout, that is, S1. This space is the distance between the target structures (the spacing between the edges). After determining S1, it is necessary to determine the step size S2 for each move. This step size is the moving step size mentioned above. It can be understood that in order to prevent overlap between structures or excessive calculation costs, the setting of the moving step size S2 needs to meet the following requirements: the target adjustment value X and X / 2 are integer multiples of S2; S2 is the design grid of DRC, that is, an integer multiple of the design grid size; S2 < S1. It can be understood that considering the calculation cost, the value X / 2 is set. In theory, X / 4, X / 8, etc. can also be set, but too small a value will result in too many subsequent moves and too redundant steps. Figure 5 This is the original GDS in a specific embodiment, where the three blue square structures in the figure are the above-mentioned pad structures, the rectangle with red and blue lines between the second pad and the third pad is the test structure, and the blue line between the pad structure and the test structure is the winding interconnect structure, whose design grid is set to 0.001μm, and the spacing (pad pitch) between the pads to be adjusted is 111.11μm. In this embodiment, the target pad pitch is 116.96μm, so X=5.85μm, X / 2=2.925μm. And further based on DRC, it can be known that S1=0.05μm, preferably, S2 can be set to 0.045μm, which meets the above-mentioned setting conditions of S2 after inspection.

[0112] Secondly, assuming that the pad reference point is the pad on the far left of the pad to be adjusted, the preset moving direction is to move to the right, such as Figure 6 As shown, first use the script to generate a rectangular frame B11 between the leftmost border of the module and the rightmost edge of the first pad to be adjusted ( Figure 6 The rightmost side of the first pad to be adjusted means that the border is tangent to the rightmost boundary point of the first pad to be adjusted; a rectangular frame B21 ( Figure 6 The green border in the middle indicates the second initial adjustment area of ​​the first target adjustment area mentioned above. A rectangular frame B31 is generated from the leftmost side of the second pad to be adjusted to the rightmost side of the entire module. Figure 6The third initial adjustment area of ​​the first target adjustment area mentioned above is indicated by a black border, wherein the heights of B11, B21, and B31 are all the height Y of the module, wherein the boundary of the module can be understood as a target area or a local target area. There is usually a layer of the module outline in the integrated circuit layout, thereby determining an area containing the module. Figure 6 FIG. 1 is a schematic diagram of dividing the adjustment area in an embodiment. The red figure in the figure is the pad to be adjusted. There are 22 pads to be adjusted. The yellow figure is the test structure. There is also a winding interconnection structure between the test structure and the pad. For the convenience of display, Figure 6 Not all lines in the actual layout are shown.

[0113] Then, a Boolean AND operation is performed on all the layers in the adjustment area B11. However, it should be noted that since the adjustment direction is to the right, the layers selected in B11 are not changed and are directly output for subsequent processing. The "Boolean AND operation on all layers" mentioned above means that all target structures of all layers in the B11 area are selected. If there is a situation where half of the structure is in the B11 area and half of the structure is outside the B11 area, only the half structure in B11 is selected.

[0114] Furthermore, a Boolean AND operation is performed on all layers in the initial adjustment area B21. All target structures in B21 need to be moved to the right by a distance of X / 2. Similarly, all right edges in B21 are first determined, and all right edges are uniformly moved to the right by a distance of S2. Then all left edges are uniformly moved to the right by a distance of S2. The above steps are repeated a total of (X / 2) / S2 times, so that all target structures in B21 are moved to the right by a distance of X / 2.

[0115] Furthermore, a Boolean AND operation is performed on all layers in the initial adjustment area B31, and the target structure in B31 needs to be moved to the right by a distance of X as a whole. The specific moving method is: first determine the right edges of all target structures, and uniformly move all right edges to the right by a distance of S2, then uniformly move all left edges to the right by a distance of S2, repeat the above operation, repeat X / S2 times in total, so that all target structures included in B31 are moved to the right by a distance of X. It should be noted that if the step size of a movement is too large, it is possible to overlap with the previous structure. In order to avoid this situation, S2 < S1 is set, and it is necessary to move S2 distance at a time, and repeat the movement multiple times.

[0116] In summary, in a specific embodiment, all structures in the B11 region remain unchanged, all corresponding target structures in the B21 region move to the right after 65 moves, each with a step size of 0.045 μm, and all corresponding target structures in the B13 region move to the right after 130 moves, each with a step size of 0.045 μm. It should be noted that this application does not limit the processing order of the initial adjustment regions B11, B21, and B31, and the processing order can be adjusted according to application requirements.

[0117] After the target structures corresponding to the B11, B21, and B31 regions have adjusted their target adjustment values, the windings associated with the initial adjustment region of B11 are extended as needed to resolve the disconnection of some winding interconnection structures; see Figure 7 After extending the metal winding, some of the layout can be referred to Figure 7 The red box in the figure indicates the metal winding extension in progress.

[0118] In summary, the pitch between the first pad and the second pad can be changed to 116.96μm through the above method, and the 2.925um windings on both sides of the winding have been extended to fill the gap (the winding interconnection is disconnected). In the figure, dx is the pitch between the first pad and the second pad, that is, the relative length between the two points marked in the figure on the x-axis. Similarly, dy is the relative height between the two points marked in the figure on the y-axis, and dist is the distance between the two points marked.

[0119] Similarly, the division of the three initial adjustment areas B12, B22, and B32 in the target adjustment area determined for the second time can refer to Figure 8 ,get Fig. 9 The local second adjustment result is shown in FIG. Similarly, the target adjustment area is determined 21 times to adjust the pad spacing until all 22 pads are adjusted based on the above method, and the following is obtained: Fig.10 The final pad spacing adjustment result is shown. Fig.10 The green pad in the middle is the test structure in red. There is also a blue wire-wrap interconnect structure between the test structure and the pad for easy display. Fig.10 Not all lines in the actual layout are shown.

[0120] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0121] Based on the same inventive concept, the embodiment of the present application also provides a pad spacing adjustment device for implementing the pad spacing adjustment method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more pad spacing adjustment device embodiments provided below can refer to the limitations of the pad spacing adjustment method above, and will not be repeated here.

[0122] In one embodiment, Fig.11 As shown, a pad spacing adjustment device is provided, comprising: an acquisition module 81 and an adjustment module 82, wherein:

[0123] An acquisition module 81 is used to acquire a layout, determine a target area in the layout that includes at least two pads to be adjusted, and acquire a target adjustment value of the pad spacing;

[0124] The adjustment module 82 is used to determine the target adjustment area in the target area in sequence based on the arrangement position of the pads to be adjusted in the target area, and move the target structure in the target adjustment area to complete the spacing adjustment of the pads to be adjusted in the target adjustment area until the spacing adjustment of all the pads to be adjusted in the target area is completed; wherein, the moving processing of the target structure in the target adjustment area includes: based on the target adjustment value, iteratively moving the target structure multiple times with a preset moving step size.

[0125] Specifically, the acquisition module 81 acquires the layout, and determines in the layout a target area including at least two pads to be adjusted and a target adjustment value of the pad spacing; then the adjustment module 82 determines the target adjustment area in the target area in turn based on the arrangement positions of the pads to be adjusted in the target area, and performs a moving process on the target structure in the target adjustment area, and completes the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all pads to be adjusted in the target area is completed. The moving process of the target structure in the target adjustment area includes, based on the target adjustment value, iteratively moving the target structure multiple times with a preset moving step length.

[0126] Each module in the above-mentioned pad spacing adjustment device can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned modules can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute the operations corresponding to each of the above modules.

[0127] In one embodiment, a computer readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented:

[0128] Acquire a layout, and determine a target area in the layout that includes at least two pads to be adjusted;

[0129] Get the target adjustment value of the pad spacing;

[0130] Based on the arrangement positions of the pads to be adjusted in the target area, the target adjustment area in the target area is determined in sequence, and the target structure in the target adjustment area is moved to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed;

[0131] The target structure in the target adjustment area is moved, including: iteratively moving the target structure multiple times with a preset moving step length based on the target adjustment value.

[0132] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0133] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0134] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0135] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A pad spacing adjustment method, characterized in that: The method comprises: Acquire a layout, and determine a target area in the layout that includes at least two pads to be adjusted; Get the target adjustment value of the pad spacing; Based on the arrangement positions of the pads to be adjusted in the target area, a plurality of target adjustment areas in the target area are sequentially determined, and a target structure in at least one of the target adjustment areas is moved to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed; comprising: Determine the pad to be adjusted this time: the adjacent first adjustment pad and the second adjustment pad; determine the current target adjustment area and three initial adjustment areas in the current target adjustment area based on the bounding box of the target area, the positions of the first adjustment pad and the second adjustment pad; Determine the target structure corresponding to each of the initial adjustment areas, and move the target structure in at least one of the initial adjustment areas according to the arrangement order of the initial adjustment areas, obtain the pad spacing adjustment result, and complete the spacing adjustment of the first adjustment pad and the second adjustment pad; Repeating the process of determining the pads to be adjusted and the target adjustment area to adjust the pad spacing until the spacing adjustment of all the pads to be adjusted in the target area is completed; The moving process of the target structure in the target adjustment area includes: iteratively moving the target structure multiple times with a preset moving step length based on the target adjustment value.

2. The method according to claim 1, characterized in that: The moving process of the target structure in the target adjustment area to complete the spacing adjustment of the pads to be adjusted on two adjacent sides of the target adjustment area includes: Based on the target adjustment value, modifying the winding interconnection structure related to the target adjustment area; The correction process includes an extension process or a shortening process.

3. The method according to claim 1, characterized in that The moving step size is set based on the target adjustment value, the design grid size of the layout, and the minimum edge spacing between adjacent polygons in a layer of the layout.

4. The method according to claim 1, characterized in that The target structure in the target adjustment region is moved, including: When the target structure is iteratively moved multiple times with a preset moving step length, based on the target adjustment direction of the target adjustment value, in each iterative movement, the first side of the polygon in the target structure is moved first, and then the second side of the polygon in the target structure is moved; The method for determining the first side and the second side of the polygon in the target structure includes: taking the side located on the first side between the highest point / highest side and the lowest point / lowest side in the polygon as the first side, and taking the side located on the second side as the second side; The method for determining the highest point / highest side and the lowest point / lowest side in the polygon includes: If there is only one highest point in the polygon, then this point is defined as the highest point; if there are two highest points in the polygon, then the side between the two points is defined as the highest side; If there is only one lowest point in the polygon, this point is defined as the lowest point; if there are two lowest points in the polygon, the side between the two points is defined as the lowest side.

5. The method according to claim 3, characterized in that: Based on the arrangement positions of the pads to be adjusted in the target area, sequentially determining the target adjustment area in the target area includes: Determine a first adjustment pad and a second adjustment pad among the pads to be adjusted, wherein the first adjustment pad is determined based on a preset pad reference point, and the second adjustment pad is adjacent to the first adjustment pad; Determine a first initial adjustment area based on a first bounding box of the target area and a first pad frame of the first adjustment pad, determine a second initial adjustment area based on the first pad frame and a second pad frame of the second adjustment pad, and determine a third initial adjustment area based on the second pad frame and a second bounding box of the target area; Among them, the first bounding box and the second bounding box are in relative positions; the target adjustment area includes the first initial adjustment area, the second initial adjustment area and the third initial adjustment area, the first initial adjustment area includes the first adjustment pad, the second initial adjustment area does not include the adjustment pad, and the third initial adjustment area includes the second adjustment pad.

6. The method according to claim 5, characterized in that Based on the arrangement positions of the pads to be adjusted in the target area, the target adjustment area in the target area is determined in sequence, and the target structure in the target adjustment area is moved to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed, including: The target adjustment area includes a first target adjustment area, a second target adjustment area, ..., an i-th target adjustment area, ..., and an N-1-th target adjustment area; wherein the i-th target adjustment area represents the target adjustment area determined for the i-th time, and N represents the number of pads in the target area; Step a: let i=1; Step b: determining the i-th target adjustment region in the target region based on the arrangement positions of the pads to be adjusted in the current target region; wherein the i-th target adjustment region includes three initial adjustment regions: a first initial adjustment region, a second initial adjustment region and a third initial adjustment region; Determine the corresponding target structures in each of the initial adjustment areas respectively, move the target structures in at least one of the initial adjustment areas according to the arrangement order of the initial adjustment areas, obtain an i-th pad spacing adjustment result, and correct the winding interconnection structure related to the i-th target adjustment area based on the i-th pad spacing adjustment result to obtain an i-th adjustment result; The moving process of the target structure in at least one of the initial adjustment regions comprises: The target structure in the first initial adjustment area is not moved; For the target structure in the third initial adjustment region, iteratively move it multiple times with a preset moving step length until the target structure moves by the target adjustment value; The target structure in the second initial adjustment area is moved iteratively multiple times with a preset moving step length until the target structure moves a total of half of the target adjustment value; Step c: determine whether i is equal to N-1, if not, set i=i+1, and repeat step a, if yes, complete the spacing adjustment of all the pads to be adjusted in the target area.

7. The method according to claim 6, characterized in that The method further comprises: Determine a moving step length, wherein the target adjustment value is an integer multiple of the moving step length, and half of the target adjustment value is also an integer multiple of the moving step length; the moving step length is smaller than a minimum edge spacing between adjacent polygons in a layer of the layout, and the moving step length is an integer multiple of a design grid size in the layout.

8. The method according to claim 1, characterized in that The target structure includes a graphic structure of a preset layer in the layout, and the preset layer includes at least a device layer, a winding layer, and a pad layer.

9. A pad spacing adjustment device, characterized in that: The device comprises: An acquisition module is used to acquire a layout, determine a target area in the layout that includes at least two pads to be adjusted, and acquire a target adjustment value of the pad spacing; An adjustment module, for determining, based on the arrangement positions of the pads to be adjusted in the target area, a plurality of target adjustment areas in the target area in sequence, and performing a moving process on a target structure in at least one of the target adjustment areas to complete the spacing adjustment of the pads to be adjusted in the target adjustment area, until the spacing adjustment of all the pads to be adjusted in the target area is completed; comprising: Determine the pad to be adjusted this time: the adjacent first adjustment pad and the second adjustment pad; determine the current target adjustment area and three initial adjustment areas in the current target adjustment area based on the bounding box of the target area, the positions of the first adjustment pad and the second adjustment pad; Determine the target structure corresponding to each of the initial adjustment areas, and move the target structure in at least one of the initial adjustment areas according to the arrangement order of the initial adjustment areas, obtain the pad spacing adjustment result, and complete the spacing adjustment of the first adjustment pad and the second adjustment pad; Repeating the process of determining the pads to be adjusted and the target adjustment area to adjust the pad spacing until the spacing adjustment of all the pads to be adjusted in the target area is completed; The moving process of the target structure in the target adjustment area includes: iteratively moving the target structure multiple times with a preset moving step length based on the target adjustment value.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 8 are implemented.

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