Semi-in-ear headphones
Through modular design and flexible circuit connection, the problems of high production cost and high defect rate of semi-in-ear headphones are solved, efficient assembly and stable connection are achieved, and product quality and wearing comfort are improved.
Patent Information
- Application Number
- CN202411355597.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2044-09-27
AI Technical Summary
Existing semi-in-ear headphones have high production costs, high product defect rates, and cluttered internal circuit stacking, making automated operation difficult.
The conductive components adopt modular design, use flexible FPC circuit boards and terminal plugs for plug-in matching, combined with the specific structure of the rod and head, to simplify the circuit connection and assembly process and reduce manual welding steps.
It improves assembly efficiency and product yield, reduces production costs, simplifies the internal circuit layout of the headphones, and improves the stability of circuit connections and wearing comfort.
Smart Images

Figure CN118890577B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of earphone technology, and in particular to a semi-in-ear earphone. The electronic components inside the semi-in-ear earphone adopt a specific stacking arrangement, which rationally utilizes the limited space inside the earphone to simplify the product production process and reduce production costs. Background Art
[0002] Existing headphones are generally categorized by their sound transmission method: in-ear headphones, semi-in-ear headphones, and open-ear headphones. Semi-in-ear headphones, unlike in-ear headphones, have sound outlets located outside the ear canal. Unlike in-ear headphones, which have sound outlets inserted directly into the ear canal through silicone ear caps, thus shielding the ear from the outside world, they are relatively comfortable to wear and allow users to hear ambient sound.
[0003] Semi-in-ear headphones typically include: a mounting portion for mounting a circuit board, often designed to resemble a stem; and a head portion for mounting a sound unit, often designed to resemble an earplug. The processing method for the stem and head portion is currently mostly a three-shell method: the stem and head portion are integrally molded, the front end is then bonded to the head cover, and the rear end is bonded to the stem body's rear shell. This processing method requires the stem and head portion to be molded using a composite mold, which is relatively costly. For example, see announcement number:
[0004] Chinese utility model patent CN214101705U, titled "Wind-noise-blocking earphones." Of course, there are also dual-shell processing methods, which increase the production cost of the entire shell. For example, see Chinese utility model patent publication number CN211406246U, titled "A Bluetooth earphone."
[0005] Another key point in the design of semi-in-ear headphones is the stacking of electronic components, that is, how to arrange the relevant electronic components of the headphones, and how to reasonably distribute the circuit boards, batteries, speakers, and connecting lines inside the headphones. The current mainstream design scheme is that the circuit board is set in the stem, the battery and speaker are set in the head, and the connecting lines are usually directly connected by wires through welding. In addition, the circuit boards required for in-ear detection, touch control, etc. commonly used in headphones are also connected to the circuit board through wires. The circuit stacking inside the entire product is relatively messy. At the same time, the stem and head of the headphones have irregular shapes, which makes it difficult to achieve automated operations. They basically rely on manual work, resulting in product quality completely dependent on the staff, a high product defect rate, and the inability to further reduce the production cost of the product.
[0006] In view of this, the inventors propose the following technical solutions in combination with the shortcomings of the existing technology. Summary of the Invention
[0007] The technical problem to be solved by the present invention is to overcome the shortcomings of the existing technology and propose a semi-in-ear earphone, which utilizes the limited space inside the earphone to rationally arrange the internal circuit stack of the product, reduce assembly defects caused by manual work, thereby improving the production efficiency of the product and reducing the production cost of the product.
[0008] In order to solve the above technical problems, the present invention adopts the following technical solution: the semi-in-ear earphones include: a rod with a built-in main control circuit board, a head with a built-in speaker, a battery, and a conductive component that electrically connects the main control circuit board, the speaker and the battery, the conductive component including: a conductive circuit board located between the battery and the speaker, a front FPC circuit board located on the inner wall of the head, a terminal seat located at the top of the rod, and a terminal circuit board located above the terminal seat and electrically connected to the terminal seat; the front FPC circuit board is electrically connected to the conductive circuit board through a flexible front connecting part, and the terminal circuit board is electrically connected to the conductive circuit board through a flexible rear connecting part; a terminal plug is provided at the top of the main control circuit board, and the electrical connection between the conductive component and the main control circuit board is achieved by docking the terminal plug with the terminal seat; a top through hole is opened at the top of the rod, a touch head is provided at the top through hole, and a touch electrode is provided below the touch head to contact the electrode area on the terminal circuit board.
[0009] Furthermore, in the above technical solution, the speaker, the conductive circuit board, and the battery are distributed in sequence from front to back along a transverse direction perpendicular to the rod.
[0010] Furthermore, in the above technical solution, the rod portion includes an upper rod tube and a lower rod tube that are fixed together; the head portion includes a rear cover and a front cover that are interlocked with each other, the upper rod tube and the rear cover are integrally formed, and a sound hole is provided on one side of the front cover; a conducting hole is formed at the joint position between the upper rod tube and the rear cover; a rear end portion that is adapted to the conducting hole is formed at the rear end of the battery, and the rear end portion is inserted into the conducting hole, and the rear connecting portion passes through the conducting hole to connect the conducting circuit board with the terminal circuit board.
[0011] Furthermore, in the above technical solution, the lower end of the upper rod tube is provided with an insertion end docking with the lower rod tube, a snap portion is provided on the insertion end, and the inner wall of the port of the lower rod tube is provided with a positioning portion that cooperates with the snap portion on the insertion end.
[0012] Furthermore, in the above technical solution, a plastic plug that cooperates with the lower rod barrel is fixed to the bottom of the main control circuit board, and the main control circuit board is fixed in the rod part through the interference fit between the plastic plug and the lower rod barrel.
[0013] Furthermore, in the above technical solution, the front FPC circuit board is attached to the inner wall of the front cover, and the front FPC circuit board is positioned by the positioning protrusions on the inner wall of the front cover; the front connecting part is distributed from front to back along the outer edge of the speaker and is connected to the conductive circuit board.
[0014] Furthermore, in the above technical solution, the conductive circuit board is located at the port of the back cover, and the space inside the head is divided into a front cavity and a rear cavity by the conductive circuit board, and the speaker is located in the front cavity.
[0015] Furthermore, in the above technical solution, a positioning portion for positioning the speaker is formed on the inner wall of the front cover, and the speaker located at the positioning portion divides the front cavity into a front sound cavity and a rear sound cavity.
[0016] Furthermore, in the above technical solution, a magnet slot is formed on the inner wall of the lower side of the back cover, and a magnet is embedded and fixed in the magnet slot; an avoidance groove is formed at the position corresponding to the magnet under the conductive circuit board; a partition is provided between the battery and the conductive circuit board, and a notch is provided on the partition, and the position corresponding to the notch on the conductive circuit board is set at the power electrode of the battery conductor.
[0017] Furthermore, in the above technical solution, the assembly method of the semi-in-ear earphone is as follows:
[0018] The first step is to electrically connect the speaker and battery to the conductive circuit board in the conductive component respectively to form a whole; the second step is to first pass the terminal seat in the conductive component through the conductive hole from the side of the back cover and place it in the upper rod tube, then insert the rear end of the battery into the conductive hole from the side of the back cover, place the conductive circuit board in the conductive component at the port of the back cover, and the conductive circuit board is located in front of the battery; the third step is to position and fix the front FPC circuit board in the conductive component on the inner wall of the front cover, then place the speaker in the front cover, and finally fix the front cover to the back cover; the fourth step is to insert the lower part of the main control circuit board into the lower rod tube, and fix the main control circuit board by the interference fit between the plastic barrel plug at the bottom of the main control circuit board and the lower rod tube; then dock the upper rod tube with the lower rod tube, and during the docking process, dock the terminal plug on the top of the main control circuit board with the terminal seat to realize the electrical connection between the conductive component and the main circuit board, thereby completing the assembly of the earphones.
[0019] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art:
[0020] First, the present invention modularizes the conductive components. During the assembly process of the earphones, the conductive components are first connected to the speaker and the battery. In the subsequent assembly process, there is no need to use manual wire welding. In other words, there is no need to perform manual soldering in the narrow earphone space. Instead, each component only needs to be assembled to the designated position, which greatly improves the assembly efficiency and the product yield.
[0021] Secondly, the conductive component of the present invention uses a flexible FPC circuit board to achieve electrical connection, and its flexible texture is used to distribute it in the internal cavity of the earphone. At the same time, the battery and the main control circuit board also directly use terminal seats and terminal plugs for plug-in cooperation, which reduces soldering operations and improves the stability of the circuit connection.
[0022] Finally, the rod part of the present invention directly adopts a cylindrical shape, and the rod part is plugged into the upper rod tube and the lower rod tube. The main control circuit board is directly fixed in the space inside the rod part by plugging, which is simple to assemble. The touch head is set at the top of the rod part to avoid accidental touch by the user. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 is a perspective view of the present invention;
[0024] Figure 2 It is a schematic diagram of the horizontal decomposition of the present invention;
[0025] Figure 3 It is an exploded perspective view of the present invention;
[0026] Figure 4 It is a three-dimensional exploded view of the internal components of the present invention;
[0027] Figure 5 This is a three-dimensional diagram of the front cover of the rod and the front FPC circuit board in the present invention;
[0028] Figure 6 It is an assembly sectional view of the present invention. DETAILED DESCRIPTION
[0029] The present invention will be further described below with reference to specific embodiments and accompanying drawings.
[0030] The present invention is a semi-in-ear earphone. Figures 1 to 6 As shown, it includes: a rod 1, a head 2, a speaker 3, a battery 4, a main control circuit board 5, a conductive component 6, a touch head 7 and a magnet 8.
[0031] The rod portion 1 comprises an upper rod tube 11 and a lower rod tube 12. The entire rod portion 1 is cylindrical in shape. The upper rod tube 11 and the lower rod tube 12 are fixed by upper and lower docking.
[0032] The upper rod tube 11 has a top through-hole 112 at its top for mounting the touch head 7. The lower end of the upper rod tube 11 has an insertion end 111 that docks with the lower rod tube 12. A snap-fit portion is provided on the insertion end 111. Specifically, the snap-fit portion is a snap-fit protrusion 1111 provided on the surface of the insertion portion 111, and an expansion slot 1112 is provided on the insertion portion 111.
[0033] The lower rod barrel 12 is provided with a positioning portion that cooperates with the snap portion on the insertion end 111. Specifically, the positioning portion is a snap groove 121 formed on the inner wall of the lower rod barrel 12. The upper rod barrel 11 and the lower rod barrel 12 are positioned by snapping together the snap protrusion 1111 and the snap groove 121. The bottom of the lower rod barrel 12 is provided with an electrode hole, and the charging electrode 53 in the main control circuit board 5 is disposed in the electrode hole for charging the battery 4.
[0034] When the upper rod tube 11 and the lower rod tube 12 are docked, the expansion groove 1112 is contracted to smoothly insert the insertion end 111 into the opening of the lower rod tube 12, and the upper rod tube 11 and the lower rod tube 12 are positioned by the snap fit between the snap protrusion 1111 and the snap groove 121. In addition, a decorative metal ring 13 and a sealing ring for sealing can also be provided on the insertion end 111.
[0035] The head 2 comprises a rear cover 21 and a front cover 22 that interlock with each other. The rear cover 21 is located on the side of the upper rod barrel 11, and the upper rod barrel 11 and the rear cover 21 are integrally formed. A through hole 10 is formed at the junction of the upper rod barrel 11 and the rear cover 21, which connects the internal space of the rod portion 1 with the internal space of the head 2.
[0036] The rear cover 21 is roughly shaped like a trumpet, with a magnet slot 211 formed on its lower inner wall. This slot 211 is used to lock and position the magnet 8. When the earphones are placed in the charging compartment for charging, the magnet 8 magnetically positions the entire earphones, ensuring that the charging electrodes 53 of the earphones are accurately aligned with the electrodes in the charging compartment and preventing the earphones from falling out of the charging compartment.
[0037] A limit block 212 is also formed on the inner wall of the rear cover 21. The limit block 212 is used to limit the conductive circuit board 61 in the conductive component 6, so that the conductive circuit board 61 is located at the port of the rear cover 21, and the limit block 212 is used to limit the conductive circuit board 61.
[0038] The front cover 22 and the rear cover 21 are fixedly connected by snaps, threads, or glue. A sound outlet 20 is provided on one side of the front cover 22. The sound generated by the speaker 3 is ultimately transmitted through the sound outlet 20, and a sound mesh 201 can be provided at the sound outlet 20.
[0039] The inner wall of the front cover 22 is formed with a stepped positioning portion 220 for positioning the speaker 3. The speaker 3 is positioned at the positioning portion 220. Positioning bumps 221 are also formed on the inner wall of the front cover 22. Furthermore, a tuning hole 222 is formed on the surface of the front cover 22.
[0040] The battery 4 is a lithium battery pack, the main body of which is cylindrical. Figure 6 As shown, the rear end of the battery 4 is formed with a rear end portion 41 adapted to the conductive hole 10, and the rear end portion 41 is inserted into the conductive hole 10. In this way, not only can the battery 4 be positioned through the conductive hole 10, but the center of gravity of the battery can also be shifted toward the stem 1. For semi-in-ear headphones, the main weight is concentrated in the battery part. When wearing traditional headphones, the head of the headphone is located in the concha of the ear. If the battery is entirely located in the head, the weight of the head will be unbalanced, and the concha will bear a greater weight. Shifting the center of gravity of the headphone toward the stem can reduce the weight of the concha and improve wearing comfort.
[0041] The main control circuit board 5 integrates the headphone control circuit. A terminal plug 51 is provided on the top of the main control circuit board 5. The electrical connection between the conductive component 6 and the main control circuit board 5 is achieved by docking the terminal plug 51 with the terminal seat 63. A plastic plug 52 is fixed to the bottom of the main control circuit board 5 to cooperate with the lower rod barrel 12. The main control circuit board 5 is fixed in the rod portion 1 by the interference fit between the plastic plug 52 and the lower rod barrel 12. The charging electrode 53 of the headphone passes through the plastic plug 52 from bottom to top and is then connected to the main control circuit board 5.
[0042] The main control circuit board 5 adopts a PCB (printed circuit board), and its main body is in the shape of a long strip. During installation, the lower end is directly inserted into the lower rod tube 12, and the main control circuit board 5 is fixed in the rod part 1 through the interference fit between the plastic tube plug 52 and the lower rod tube 12. Then the upper rod tube 11 is inserted and sleeved on the upper end of the main control circuit board 5, so that the terminal plug 51 on the top of the main control circuit board 5 is docked with the terminal seat 63.
[0043] The conductive component 6 includes: a conductive circuit board 61 , a front FPC circuit board 62 , a terminal seat 63 and a terminal circuit board 64 .
[0044] The conductive circuit board 61 is a PCB (printed circuit board), and its main body is circular and matches the inner wall of the rear cover 21. The conductive circuit board 61 is located at the port of the rear cover 21, and the conductive circuit board 61 is limited by the limit block 212. In addition, an avoidance groove 612 is formed below the conductive circuit board 61 at the position corresponding to the magnet 8. Figure 6As shown, the space inside the head 2 is divided into a front cavity 201 and a rear cavity 202 by a conductive circuit board 61 , the speaker 3 is located in the front cavity 201 , and the battery 4 is located in the rear cavity 202 .
[0045] The front FPC circuit board 62 is used for ear detection and is located on the inner wall of the front cover 22. When the user wears the earphones, the surface of the front cover 22 comes into contact with the skin of the ear. The front FPC circuit board 62 detects the induced current, confirming that the earphones are in the ear. The front FPC circuit board 62 is positioned using the positioning bumps 221 on the inner wall of the front cover 22. The front FPC circuit board 62 is electrically connected to the conductive circuit board 61 via a flexible front connection portion 621. The front connection portion 621 is formed by an FPC extending integrally from one side of the front FPC circuit board 62. Leveraging the flexibility of the FPC (flexible printed circuit board), the front connection portion 621 is distributed along the outer edge of the speaker 3 from front to back, connecting to the conductive circuit board 61.
[0046] The terminal block 63 is fixed below the terminal circuit board 64, and the terminals in the terminal block 63 are electrically connected to the terminal circuit board 64. The terminal circuit board 64 is electrically connected to the conductive circuit board 61 via a flexible rear connector 631. Similarly to the front connector 621, the rear connector 631 utilizes a PFC circuit board, one end of which is connected to the conductive circuit board 61 and the other end to the terminal circuit board 64. Leveraging the flexibility of the FPC, the rear connector 631 is distributed along the outer edge of the battery 4 from front to back, connecting to the terminal circuit board 64.
[0047] In order to achieve the positioning of the terminal seat 63, a positioning edge 631 is extended downward on one side of the terminal seat 63, and the positioning edge 631 cooperates with the corresponding positioning groove on the inner wall of the upper rod tube 11 to achieve the positioning of the terminal seat 63.
[0048] The terminal circuit board 64 is provided with an electrode area. Touch electrodes 71 are located below the touch head 7, which is mounted in the through-hole 112 at the top of the stem 1. These electrodes 71 contact the electrode area on the terminal circuit board 64. The touch head 7 serves as the touch control unit, allowing the user to issue commands to the earphones, such as tuning. When a user's finger touches the touch head 7, an induced electrical signal is generated, prompting the main control circuit board 5 to respond.
[0049] Specifically, the touch head 7 comprises an end cap 70, with extensions 72 extending downwardly from both sides of the end cap 70. Slots 113 corresponding to the extensions 72 are defined adjacent to the through-hole 112 at the top of the upper rod barrel 11. When the touch head 7 is mounted on the top of the upper rod barrel 11, the extensions 72 fit into the corresponding slots 113, forming a fixed connection.
[0050] A partition 40 is disposed between the battery 4 and the conductive circuit board 61. A notch 400 is defined in the partition 40. A power supply electrode 611 for conducting to the battery 4 is located on the conductive circuit board 61 at a position corresponding to the notch 400. A speaker electrode 613 electrically connected to the speaker 3 is also disposed on the conductive circuit board 61.
[0051] For ease of assembly, the speaker 3, the conductive circuit board 61, the partition 40, and the battery 4 are sequentially distributed from front to back along a transverse direction perpendicular to the rod 1. The specific assembly method of the present invention is as follows:
[0052] The first step is to electrically connect the speaker 3 and battery 4 to the conductive circuit board 61 in the conductive assembly 6, forming a single unit. During this process, the lead wires from the speaker 3 are electrically connected to the speaker electrode 613 by soldering, and the lead wires from the battery 4 are also connected to the power electrode 611 by soldering. Separator 40 is also placed between the battery 4 and the conductive circuit board 61.
[0053] In the second step, first, pass the terminal seat 63 in the conductive component 6 through the conductive hole 10 from the side of the rear cover 21 and place it in the upper rod tube 11, then insert the rear end 41 of the battery 4 into the conductive hole 10 from the side of the rear cover, and place the conductive circuit board 61 in the conductive component 6 at the port of the rear cover 21, and the conductive circuit board 61 is located in front of the battery 4.
[0054] In the third step, the front FPC circuit board 62 in the conductive component 6 is positioned and fixed on the inner wall of the front cover 22 by utilizing the flexibility of the material, and then the speaker 3 is placed on the positioning portion 220 opened on the inner wall of the front cover 22, and finally the front cover 22 of the head 2 is fixed to the back cover 21.
[0055] In this step, when the speaker 3 is located at the positioning portion 220 , the speaker 3 will separate the front cavity 201 into a front sound cavity 203 and a rear sound cavity 204 , and the sound outlet hole 20 and the tuning hole 222 are connected to the front sound cavity 203 .
[0056] The fourth step is to insert the lower part of the main control circuit board 5 into the lower rod barrel 12, and fix the main control circuit board 5 through the interference fit between the plastic tube plug 52 at the bottom of the main control circuit board 5 and the lower rod barrel 12; then dock the upper rod barrel 11 with the lower rod barrel 12. During the docking process, dock the terminal plug 51 on the top of the main control circuit board 5 with the terminal seat 63 to realize the electrical connection between the conductive component 6 and the main control circuit board 5, and thus complete the assembly of the earphones.
[0057] During the assembly process of the present invention, soldering is not required except for the first step, which involves electrically connecting the speaker 3 and battery 4 to the conductive circuit board 61. Furthermore, in the first step, the entire conductive assembly 6 has not yet been mated with the stem 1 and head 2, making soldering unobstructed and easy, without the risk of cold solder joints. Subsequent assembly requires only the individual components to be installed in their designated positions, simplifying the process, significantly improving assembly efficiency, and reducing defect rates.
[0058] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Any equivalent changes or modifications made based on the structure, features and principles described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.
Claims
1. Semi-in-ear headphones, including: A rod portion (1) with a built-in main control circuit board (5), a head portion (2) with a built-in speaker (3), a battery (4), and a conductive component (6) electrically connecting the main control circuit board (5), the speaker (3) and the battery (4), characterized in that: The conductive component (6) includes: a conductive circuit board (61) located between the battery (4) and the speaker (3), a front FPC circuit board (62) located on the inner wall of the head (2), a terminal seat (63) located at the top of the rod (1), and a terminal circuit board (64) located above the terminal seat (63) and electrically connected to the terminal seat (63); The front FPC circuit board (62) is electrically connected to the conductive circuit board (61) via a flexible front connecting portion (621), and the terminal circuit board (64) is electrically connected to the conductive circuit board (61) via a flexible rear connecting portion (631). The front FPC circuit board (62) for in-ear detection is attached to the inner wall of the front cover (22); the front connecting portion (621) is distributed from front to rear along the outer edge of the speaker (3) and is connected to the conductive circuit board (61); A terminal plug (51) is provided on the top of the main control circuit board (5), and the electrical connection between the conductive component (6) and the main control circuit board (5) is achieved by docking the terminal plug (51) with the terminal seat (63); A top through hole (112) is provided at the top of the rod portion (1), a touch head (7) is provided at the top through hole (112), and a touch electrode (71) is provided below the touch head (7) for contacting an electrode area on the terminal circuit board (64); The rod portion (1) includes an upper rod tube (11) and a lower rod tube (12) that are fixedly connected to each other; the head portion (2) includes a rear cover (21) and a front cover (22) that are buckled together, and the upper rod tube (11) and the rear cover (21) are integrally formed; a conducting hole (10) is formed at the joint position of the upper rod tube (11) and the rear cover (21); a rear end portion (41) adapted to the conducting hole (10) is formed at the rear end of the battery (4), and the rear end portion (41) is inserted into the conducting hole (10) to shift the center of gravity of the battery toward the rod portion (1); the rear connecting portion (631) passes through the conducting hole (10) to connect the conducting circuit board (61) with the terminal circuit board (64); The conducting circuit board (61) is located at the port of the rear cover (21), and the space in the head (2) is divided into a front cavity (201) and a rear cavity (202) by the conducting circuit board (61). The speaker (3) is located in the front cavity (201). A partition (40) is provided between the battery (4) and the conducting circuit board (61), and a notch (400) is provided on the partition (40). A power supply electrode (611) connected to the battery (4) is provided at a position corresponding to the notch (400) on the conducting circuit board (61). A magnet slot (211) is formed on the inner wall of the lower side of the rear cover (21), and a magnet (8) for magnetically positioning the entire earphone during charging is embedded and fixed in the magnet slot (211); a relief slot (612) is formed below the conductive circuit board (61) at a position corresponding to the magnet (8); The assembly method of the semi-in-ear earphone is as follows: The first step is to electrically connect the speaker (3) and the battery (4) to the conductive circuit board (61) in the conductive component (6) to form a whole; In the second step, the terminal seat (63) in the conductive component (6) is first passed through the conductive hole (10) from the side of the rear cover (21) and placed in the upper rod tube (11), and then the rear end portion (41) of the battery (4) is inserted into the through hole (10) from the side of the rear cover (21), and the conductive circuit board (61) in the conductive component (6) is placed at the port of the rear cover (21), and the conductive circuit board (61) is limited by the limit block (212), and the conductive circuit board (61) is located in front of the battery (4); The third step is to position and fix the front FPC circuit board (62) in the conductive component (6) on the inner wall of the front cover (22), then place the speaker (3) in the front cover (22), and finally fix the front cover (22) and the rear cover (21) together; The fourth step is to insert the lower part of the main control circuit board (5) into the lower rod tube (12), and fix the main control circuit board (5) through the interference fit between the plastic tube plug (52) at the bottom of the main control circuit board (5) and the lower rod (12); then dock the upper rod tube (11) with the lower rod tube (12), and during the docking process, dock the terminal plug (51) at the top of the main control circuit board (5) with the terminal seat (63), thereby realizing the electrical connection between the conductive component (6) and the main control circuit board (5), and thus completing the assembly of the earphones.
2. The semi-in-ear earphone according to claim 1, characterized in that: The loudspeaker (3), the conductive circuit board (61), and the battery (4) are distributed in sequence from front to back along a transverse direction perpendicular to the rod (1).
3. The semi-in-ear earphone according to claim 2, characterized in that: A sound outlet hole (20) is provided on one side of the front cover (22).
4. The semi-in-ear earphone according to claim 3, characterized in that: The lower end of the upper rod tube (11) is provided with an insertion end (111) docking with the lower rod tube (12), and a buckle portion is provided on the insertion end (111). The inner wall of the port of the lower rod tube (12) is provided with a positioning portion that cooperates with the buckle portion of the insertion end (111).
5. The semi-in-ear earphone according to claim 3, characterized in that: A plastic plug (52) that matches the lower rod tube (12) is fixed to the bottom of the main control circuit board (5), and the main control circuit board (5) is fixed in the rod part (1) through the interference fit between the plastic plug (52) and the lower rod tube (12).
6. The semi-in-ear earphone according to claim 3, characterized in that: The front FPC circuit board (62) is positioned by positioning protrusions (221) on the inner wall of the front cover (22).
7. The semi-in-ear earphone according to claim 1, wherein: A positioning portion (220) for positioning the loudspeaker (3) is formed on the inner wall of the front cover (22), and the loudspeaker (3) located at the positioning portion (220) divides the front cavity (201) into a front sound cavity (203) and a rear sound cavity (204).
Citation Information
Patent Citations
Bluetooth earphone
CN211406246U
Earphone, earphone module and earphone control method
CN114189782A
Wireless Bluetooth earphone structure
CN215345004U