Flexible circuit board assembly device

Abstract

The present invention discloses a flexible circuit board assembly device, which relates to the technical field of flexible circuit boards, and includes a shell, wherein the bottom of the shell is rotatably connected to a base plate, the top of the shell is fixedly connected to a desktop, the upper surface of the desktop is fixedly connected to steps on both sides of the edges, the inside of the steps is slidably connected to a second slide rail, and the inside of the second slide rail is slidably connected to a second slider. The flexible circuit board assembly device disclosed by the present invention presses the dielectric layer on the flexible circuit board on the top of the adsorption disk, and the adsorption disk slides downward to squeeze the auxiliary spring. Since the dielectric layer blocks the air intake hole, the air inside the adsorption cylinder is discharged downward, thereby pushing the airtight ball to squeeze the airtight spring, loosening the dielectric layer, and the auxiliary spring rebounds. The airtight spring rebounds to make the airtight ball block the air outlet, generating negative pressure inside the adsorption cylinder, adsorbing the dielectric layer on the surface of the flexible circuit board, thereby achieving the effect of fixing the position of the flexible circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit boards, and in particular to a flexible circuit board assembly device. Background Art

[0002] Flexible circuit boards, also known as soft circuit boards and flexible circuit boards, are highly favored for their excellent properties such as light weight, thin thickness, and free bending and folding. However, domestic quality inspection of FPCs still mainly relies on manual visual inspection, which is costly and inefficient. With the rapid development of the electronics industry, circuit board design is becoming more and more high-precision and high-density. Traditional manual inspection methods can no longer meet production needs. Automated detection of FPC defects has become an inevitable trend in industrial development.

[0003] The insulating film forms the dielectric layer of the circuit, and the adhesive bonds the copper foil to the insulating layer. In a multi-layer design, it is bonded to the inner layer. They are also used as protective covers to isolate the circuit from dust and moisture. The general flexible circuit board assembly device absorbs the flexible circuit board through an air pump, and the operation needs to cooperate with the air pump, which makes the operation complicated, reduces the efficiency of flexible circuit board assembly, and cannot meet actual needs. Summary of the invention

[0004] The invention discloses a flexible circuit board assembly device, aiming to solve the technical problem that a general flexible circuit board assembly device needs to cooperate with the air pump when adsorbing the flexible circuit board through an air pump, which makes the operation complicated and reduces the efficiency of flexible circuit board assembly.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A flexible circuit board assembly device comprises a housing, wherein the bottom of the housing is rotatably connected to a bottom plate, the top of the housing is fixedly connected to a desktop, the edges of both sides of the upper surface of the desktop are fixedly connected to steps, the inside of the steps is slidably connected to a second slide rail, the inside of the second slide rail is slidably connected to a second slider, and the upper surface of the second slider is fixedly connected to a sliding frame;

[0007] An adjustment mechanism is installed on the upper surface of the bottom plate, and the adjustment mechanism is used to adjust the inclination angle of the shell;

[0008] A sliding mechanism is installed on the upper surface of the step, and the sliding mechanism is used to adjust the size of the gap;

[0009] A pressing mechanism is installed at the bottom of the sliding frame, and the pressing mechanism is used to fix the position of the flexible circuit board.

[0010] The adjustment mechanism includes two support plates fixedly connected to the upper surface of the base plate, a connecting ring is rotatably connected to one side edge of the upper surface of the base plate, an adjusting threaded rod is rotatably connected to one side of the connecting ring, one end of the adjusting threaded rod is threadedly connected to an internal threaded ring, the top inner wall of the outer shell is rotatably connected to a rotating ring, and one end of the adjusting threaded rod is fixedly connected to a handle.

[0011] In a preferred solution, the sliding mechanism includes two third slide rails fixedly connected to the edges of both sides of the upper surface of the step, a plurality of third sliders are slidably connected inside the third slide rails, a connecting rod is fixedly connected to one side of the third slider, a plurality of mounting plates are fixedly connected to the upper surface of the connecting rod, a pushing frame is fixedly connected to the upper surface of one end of the connecting rod, a pushing shaft is fixedly connected to the top of the pushing frame, and a fixed threaded rod is threadedly connected to one side of the pushing frame;

[0012] A plurality of adsorption mechanisms are installed on the top of the mounting plate, and the adsorption mechanisms are used for the flexible circuit board.

[0013] In a preferred solution, the adsorption mechanism comprises an adsorption cylinder rotatably connected to the top of the mounting plate, the top of the adsorption cylinder is slidably connected to an adsorption disk, the top of the adsorption disk is provided with an air suction hole, an air guide channel is provided inside the adsorption disk, a piston is fixedly connected to the bottom of the adsorption disk, a sliding rod is slidably connected to the bottom of the adsorption cylinder, an airtight spring is sleeved on one end of the sliding rod, an airtight ball is fixedly connected to the top of the sliding rod, a connecting plate is fixedly connected to one side of the sliding rod, a sliding groove is provided on one side of the connecting plate, a plurality of air holes are provided on the bottom outer wall of the adsorption cylinder, and an auxiliary spring is provided at the bottom of the piston;

[0014] A plurality of release mechanisms are installed on one side of the adsorption cylinder, and the release mechanisms are used to release the flexible circuit board.

[0015] The release mechanism includes a release cylinder rotatably connected to one side of the adsorption cylinder, a pressing shaft is slidably connected inside the release cylinder, a return spring is sleeved on one end of the pressing shaft, a release disk is fixedly connected to the top of the pressing shaft, the bottom end of the pressing shaft is rotatably connected to a linkage rod, one end of the linkage rod is fixedly connected to a sliding shaft, and a side block is provided at the bottom end of the pressing shaft.

[0016] In a preferred embodiment, the pressing mechanism comprises a first slide rail fixedly connected to the bottom of a sliding frame, a first slider slidably connected to the inside of the first slide rail, a rotating seat fixedly connected to the bottom of the first slider, a mounting frame rotatably connected to the bottom of the rotating seat, and a pressing rod rotatably connected to one side of the mounting frame;

[0017] A pre-tightening mechanism is installed on one side of the mounting frame, and the pre-tightening mechanism is used to adjust the pressure of pressing the flexible circuit board;

[0018] A contact mechanism is installed at one end of the pressing rod, and the contact mechanism is used to contact the flexible circuit board.

[0019] The pre-tightening mechanism includes an operating threaded rod fixedly connected to the bottom surface of the top of the mounting frame, one end of the operating threaded rod is threadedly connected to a rotating cylinder, the top of the rotating cylinder is rotatably connected to a lifting plate, one end of the lifting plate is rotatably connected to a support ring, the interior of the support ring is slidably connected to a first plug rod, one end of the first plug rod is sleeved with an extrusion spring, and the bottom end of the first plug rod is rotatably connected to a base.

[0020] In a preferred embodiment, the contact mechanism includes two fixed plates fixedly connected to one end of the pressing rod, one side of the fixed plate is rotatably connected to a vertical base, the internal thread of the vertical base is connected to a contact threaded rod, and a contact air cushion is provided at the bottom end of the contact threaded rod.

[0021] As can be seen from the above, the flexible circuit board assembly device provided by the present invention has the following technical effects.

[0022] First: by pressing the dielectric layer on the flexible circuit board on the top of the adsorption disk, the adsorption disk slides downward to squeeze the auxiliary spring. Since the dielectric layer blocks the air intake hole, the air inside the adsorption cylinder is discharged downward, thereby pushing the airtight ball to squeeze the airtight spring, loosening the dielectric layer, and the auxiliary spring rebounds. The airtight spring rebounds to make the airtight ball block the air outlet, generating negative pressure inside the adsorption cylinder, adsorbing the dielectric layer on the surface of the flexible circuit board, thereby fixing the position of the flexible circuit board.

[0023] Second: After the assembly of the flexible circuit board is completed, the flexible circuit board needs to be removed. By pressing the release disk, the pressing rod slides downward to squeeze the return spring, and the connecting plate and the sliding rod are driven downward through the block and the linkage rod, so that the airtight ball slides downward, and the negative pressure of air circulation inside the adsorption cylinder disappears, thereby loosening the flexible circuit board.

[0024] Third: Due to the design of the sliding groove and the sliding shaft, when the sliding rod slides downward, it will not drive the pressing rod to slide downward, thereby ensuring the airtightness inside the adsorption cylinder. The release cylinder and the adsorption cylinder are rotationally connected, so that there is a certain degree of freedom between multiple release cylinders and adsorption cylinders, which can protect the flexible circuit board when pressing the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the front structure of a flexible circuit board assembly device proposed by the present invention.

[0026] Figure 2 The figure is a partial structural schematic diagram of a flexible circuit board assembly device proposed by the present invention.

[0027] Figure 3 This is a schematic structural diagram of a second slider of a flexible circuit board assembly device proposed by the present invention.

[0028] Figure 4 This is a schematic diagram of the mounting plate structure of a flexible circuit board assembly device proposed by the present invention.

[0029] Figure 5 This is a schematic diagram of the structure of an operating threaded rod of a flexible circuit board assembly device proposed by the present invention.

[0030] Figure 6 This is a schematic diagram of the structure of a push frame of a flexible circuit board assembly device proposed by the present invention.

[0031] Figure 7 This is a schematic diagram of the contact threaded rod structure of a flexible circuit board assembly device proposed by the present invention.

[0032] Figure 8 This is a schematic diagram of the structure of an adsorption cylinder of a flexible circuit board assembly device proposed by the present invention.

[0033] In the figure: 1, housing; 2, tabletop; 3, first slide rail; 4, step; 5, bottom plate; 6, connecting ring; 7, handle; 8, rotating ring; 9, support plate; 10, adjusting threaded rod; 11, second slide rail; 12, second slider; 13, third slide rail; 14, sliding frame; 15, connecting rod; 16, mounting plate; 17, release cylinder; 18, adsorption cylinder; 19, pushing frame; 20, rotating seat; 21, first slider; 22, first plug rod; 23, extrusion spring; 24, support ring; 25, mounting frame; 26, operating threaded rod; 27, press Pressure rod; 28. Rotating cylinder; 29. ​​Lifting plate; 30. Pushing shaft; 31. Fixed threaded rod; 32. Third slider; 33. Fixed plate; 34. Contact threaded rod; 35. Vertical base; 36. Contact air cushion; 37. Release disk; 38. Adsorption disk; 39. Air suction hole; 40. Air guide channel; 41. Piston; 42. Air-tight ball; 43. Air vent; 44. Air-tight spring; 45. Sliding rod; 46. Connecting plate; 47. Sliding groove; 48. Sliding shaft; 49. Linking rod; 50. Block; 51. Pressing shaft; 52. Return spring. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0035] A flexible circuit board assembly device disclosed in the present invention is mainly used in scenarios where a general flexible circuit board assembly device adsorbs a flexible circuit board through an air pump and the operation needs to be coordinated with the air pump, which makes the operation complicated and reduces the efficiency of flexible circuit board assembly.

[0036] Reference Figure 1-Figure 8 A flexible circuit board assembly device comprises a housing 1, a bottom plate 5 is rotatably connected to the bottom of the housing 1, a tabletop 2 is fixedly connected to the top of the housing 1, steps 4 are fixedly connected to the edges of both sides of the upper surface of the tabletop 2, a second slide rail 11 is slidably connected to the inside of the step 4, a second slider 12 is slidably connected to the inside of the second slide rail 11, and a sliding frame 14 is fixedly connected to the upper surface of the second slider 12;

[0037] An adjustment mechanism is installed on the upper surface of the bottom plate 5, and the adjustment mechanism is used to adjust the tilt angle of the housing 1;

[0038] A sliding mechanism is installed on the upper surface of the step 4, and the sliding mechanism is used to adjust the size of the gap;

[0039] A pressing mechanism is installed at the bottom of the sliding frame 14, and the pressing mechanism is used to fix the position of the flexible circuit board.

[0040] The adjustment mechanism includes two support plates 9 fixedly connected to the upper surface of the base plate 5, a connecting ring 6 is rotatably connected to one side edge of the upper surface of the base plate 5, an adjusting threaded rod 10 is rotatably connected to one side of the connecting ring 6, one end of the adjusting threaded rod 10 is threadedly connected to an internal threaded ring, a rotating ring 8 is rotatably connected to the top inner wall of the outer shell 1, and a handle 7 is fixedly connected to one end of the adjusting threaded rod 10.

[0041] In this embodiment, by rotating the handle 7, the adjusting threaded rod 10 and the internal threaded ring are relatively moved, thereby changing the inclination angle of the step 4, which makes it more convenient to assemble the flexible circuit board.

[0042] Reference Figure 1 , Figure 2 , Figure 3 and Figure 6 In a preferred embodiment, the sliding mechanism includes two third slide rails 13 fixedly connected to the edges of both sides of the upper surface of the step 4, a plurality of third sliders 32 are slidably connected inside the third slide rails 13, a connecting rod 15 is fixedly connected to one side of the third slider 32, a plurality of mounting plates 16 are fixedly connected to the upper surface of the connecting rod 15, a pushing frame 19 is fixedly connected to the upper surface of one end of the connecting rod 15, a pushing shaft 30 is fixedly connected to the top of the pushing frame 19, and a fixed threaded rod 31 is threadedly connected to one side of the pushing frame 19;

[0043] A plurality of adsorption mechanisms are mounted on the top of the mounting plate 16 , and the adsorption mechanisms are used for the flexible circuit board.

[0044] In this embodiment, the distance between the multiple connecting rods 15 can be selected according to the size of the flexible circuit board. If the area of ​​the flexible circuit board is relatively large, the pushing shaft 30 can be pushed to slide the pushing frame 19 and the connecting rod 15, thereby adjusting the distance between the multiple connecting rods 15 so that the multiple connecting rods 15 can be sufficient to support the flexible circuit board. The fixed threaded rod 31 is rotated so that one end of the fixed threaded rod 31 is against the third slide rail 13, which can play a role in fixing the position of the connecting rod 15.

[0045] Reference Figure 1 , Figure 2 , Figure 3 and Figure 8 In a preferred embodiment, the adsorption mechanism includes an adsorption cylinder 18 rotatably connected to the top of the mounting plate 16, a suction plate 38 is slidably connected to the top of the adsorption cylinder 18, a suction hole 39 is provided on the top of the adsorption plate 38, an air guide channel 40 is provided inside the adsorption plate 38, a piston 41 is fixedly connected to the bottom of the adsorption plate 38, a sliding rod 45 is slidably connected to the bottom of the adsorption cylinder 18, an airtight spring 44 is sleeved on one end of the sliding rod 45, an airtight ball 42 is fixedly connected to the top of the sliding rod 45, a connecting plate 46 is fixedly connected to one side of the sliding rod 45, a sliding groove 47 is provided on one side of the connecting plate 46, a plurality of vent holes 43 are provided on the bottom outer wall of the adsorption cylinder 18, and an auxiliary spring is provided at the bottom of the piston 41;

[0046] A plurality of release mechanisms are installed on one side of the adsorption cylinder 18, and the release mechanisms are used to release the flexible circuit board.

[0047] The release mechanism includes a release cylinder 17 rotatably connected to one side of the adsorption cylinder 18, a pressing shaft 51 is slidably connected inside the release cylinder 17, a return spring 52 is sleeved on one end of the pressing shaft 51, a release disk 37 is fixedly connected to the top of the pressing shaft 51, a linkage rod 49 is rotatably connected to the bottom end of the pressing shaft 51, one end of the linkage rod 49 is fixedly connected to the sliding shaft 48, and a stopper 50 is provided on one side of the bottom end of the pressing shaft 51.

[0048] In this embodiment, the flexible circuit board is placed on the top of the adsorption disk 38 and the release disk 37, and the adsorption disk 38 and the release disk 37 play a supporting role. Since the flexible circuit board is relatively soft, it is inconvenient to use physical clamping. Since the surface of the flexible circuit board is an extremely thin dielectric layer, by pressing the dielectric layer on the flexible circuit board on the top of the adsorption disk 38, the adsorption disk 38 slides downward to squeeze the auxiliary spring, so that the piston 41 pushes the air inside the adsorption cylinder 18 downward. Since the dielectric layer blocks the air intake hole 39, the air inside the adsorption cylinder 18 is discharged downward, thereby pushing the airtight ball 42 to squeeze the airtight spring 44, and the air inside the adsorption cylinder 18 is discharged through the vent 43, and the dielectric layer is released, and the auxiliary spring rebounds. Since the air intake hole 39 is blocked, the airtight spring 44 rebounds to make the airtight ball 42 block the air outlet, thereby generating negative pressure inside the adsorption cylinder 18, adsorbing the dielectric layer on the surface of the flexible circuit board, thereby fixing the position of the flexible circuit board.

[0049] Furthermore, after the assembly of the flexible circuit board is completed, it is necessary to remove the flexible circuit board. By pressing the release disk 37, the pressing shaft 51 slides downward to squeeze the return spring 52, and the connecting plate 46 and the sliding rod 45 are driven to slide downward through the block 50 and the linkage rod 49, so that the airtight ball 42 slides downward, and the negative pressure of the air circulation inside the adsorption cylinder 18 disappears, thereby achieving the effect of loosening the flexible circuit board.

[0050] It is also necessary to explain that due to the design of the sliding groove 47 and the sliding shaft 48, when the sliding rod 45 slides downward, it will not drive the pressing shaft 51 to slide downward, thereby ensuring the airtightness inside the adsorption cylinder 18. The release cylinder 17 and the adsorption cylinder 18 are rotationally connected, so that there is a certain degree of freedom between the multiple release cylinders 17 and the adsorption cylinders 18, which can protect the flexible circuit board when pressing the flexible circuit board.

[0051] Reference Figure 1 , Figure 2 , Figure 5 and Figure 7 In a preferred embodiment, the pressing mechanism includes a first slide rail 3 fixedly connected to the bottom of the sliding frame 14, a first slider 21 slidably connected inside the first slide rail 3, a rotating seat 20 fixedly connected to the bottom of the first slider 21, a mounting frame 25 rotatably connected to the bottom of the rotating seat 20, and a pressing rod 27 rotatably connected to one side of the mounting frame 25;

[0052] A pre-tightening mechanism is installed on one side of the mounting frame 25, and the pre-tightening mechanism is used to adjust the pressure of pressing the flexible circuit board;

[0053] A contact mechanism is installed at one end of the pressing rod 27, and the contact mechanism is used to contact the flexible circuit board.

[0054] The pre-tightening mechanism includes an operating threaded rod 26 fixedly connected to the bottom surface of the top of the mounting frame 25, one end of the operating threaded rod 26 is threadedly connected to a rotating cylinder 28, the top of the rotating cylinder 28 is rotatably connected to a lifting plate 29, one end of the lifting plate 29 is rotatably connected to a support ring 24, the interior of the support ring 24 is slidably connected to a first plug rod 22, one end of the first plug rod 22 is sleeved with an extrusion spring 23, and the bottom end of the first plug rod 22 is rotatably connected to a base.

[0055] In this embodiment, if there are too many electronic devices on the flexible circuit board and the flexible circuit board cannot be effectively adsorbed, the sliding frame 14 can be slid to make the mounting frame 25 close to the flexible circuit board, and the position of the mounting frame 25 can be adjusted by the first slider 21 to make the mounting frame 25 closer to the flexible circuit board. The mounting frame 25 is rotated so that one end of the pressing rod 27 is located directly above the flexible circuit board. The position of the lifting plate 29 is raised by rotating the rotating cylinder 28, so that the extrusion spring 23 is in a compressed state. The extrusion spring 23 squeezes the first insertion rod 22, so that one end of the pressing rod 27 on which the base and the first insertion rod 22 are installed is tilted, and the other end of the pressing rod 27 moves downward.

[0056] Reference Figure 1 , Figure 2 , Figure 3 and Figure 7 In a preferred embodiment, the contact mechanism includes two fixed plates 33 fixedly connected to one end of the pressing rod 27, one side of the fixed plate 33 is rotatably connected to a vertical base 35, the internal thread of the vertical base 35 is connected to a contact threaded rod 34, and the bottom end of the contact threaded rod 34 is provided with a contact air cushion 36, the adjusting threaded rod 10 is rotatably connected to the rotating ring 8, the base is rotatably connected to one end of the pressing rod 27, the suction hole 39 is connected to the air guide channel 40, the piston 41 is in close contact with the inner wall of the adsorption cylinder 18 to ensure the air tightness inside the adsorption cylinder 18, and the sliding shaft 48 slides in the sliding groove 47.

[0057] In this embodiment, since the center of the vertical base 35 is low, the contact threaded rod 34 is always in a vertical state. By rotating the contact threaded rod 34, the contact air cushion 36 presses the flexible circuit board downward, and the contact air cushion 36 contacts the flexible circuit board. Due to the hollow design of the contact air cushion 36, when the flexible circuit board is squeezed, the surface of the contact air cushion 36 will collapse, thereby protecting the flexible circuit board.

[0058] Working principle: When in use, place the flexible circuit board on the top of the adsorption plate 38 and the release plate 37. The adsorption plate 38 and the release plate 37 play a supporting role. Since the flexible circuit board is relatively soft, it is inconvenient to use physical clamping. Since the surface of the flexible circuit board is an extremely thin dielectric layer, by pressing the dielectric layer on the flexible circuit board on the top of the adsorption plate 38, the adsorption plate 38 slides downward to squeeze the auxiliary spring, so that the piston 41 pushes the air inside the adsorption cylinder 18 downward. Since the dielectric layer blocks the air intake hole 39,The air inside the adsorption cylinder 18 is discharged downward, thereby pushing the airtight ball 42 to squeeze the airtight spring 44. The air inside the adsorption cylinder 18 is discharged through the vent hole 43, loosening the dielectric layer and assisting the spring to rebound. Since the air suction hole 39 is blocked, the airtight spring 44 rebounds to make the airtight ball 42 block the air outlet, generating negative pressure inside the adsorption cylinder 18, adsorbing the dielectric layer on the surface of the flexible circuit board, thereby fixing the position of the flexible circuit board. After the flexible circuit board is assembled, it is necessary to remove the flexible circuit board, and by pressing the release disk 37, the pressing shaft 51 slides downward to squeeze the return spring 52, and the connecting plate 46 and the sliding rod 45 slide downward through the stopper 50 and the linkage rod 49, so that the airtight ball 42 slides downward. The negative pressure of the air circulation inside the adsorption cylinder 18 disappears, which has the effect of loosening the flexible circuit board. Due to the design of the sliding groove 47 and the sliding shaft 48, when the sliding rod 45 slides downward, it will not drive the pressing shaft 51 to slide downward, thereby ensuring the airtightness inside the adsorption cylinder 18. The release cylinder 17 and the adsorption cylinder 18 are rotatably connected, so that there is a certain degree of freedom between the multiple release cylinders 17 and the adsorption cylinders 18. When pressing the flexible circuit board, it can protect the flexible circuit board. The distance between the multiple connecting rods 15 can be selected according to the size of the flexible circuit board. If the area of ​​the flexible circuit board is relatively large, the pushing shaft 30 can be pushed to make the pushing frame 19 and the connecting rod 15 slide, thereby adjusting the distance between the multiple connecting rods 15. , so that the multiple connecting rods 15 are sufficient to support the flexible circuit board, and the fixed threaded rod 31 is rotated so that one end of the fixed threaded rod 31 is against the third slide rail 13, which can play a role in fixing the position of the connecting rod 15. If there are too many electronic devices on the flexible circuit board and the flexible circuit board cannot be effectively adsorbed, the sliding frame 14 can be used to make the mounting frame 25 close to the flexible circuit board, and the position of the mounting frame 25 can be adjusted by the first slider 21 to make the mounting frame 25 closer to the flexible circuit board. The mounting frame 25 is rotated so that one end of the pressing rod 27 is located directly above the flexible circuit board, and the position of the lifting plate 29 is raised by rotating the rotating cylinder 28, so that the extrusion spring 23 is in a compressed state, and the extrusion spring 23 squeezes the first insertion rod 22 so that the pressing rod 27 is pressed. The base and one end of the first plug rod 22 installed on the pressure rod 27 are tilted, so that the other end of the pressure rod 27 moves downward. Since the center of the vertical base 35 is lower, the contact threaded rod 34 is always in a vertical state. By rotating the contact threaded rod 34, the contact air cushion 36 presses the flexible circuit board downward, and the contact air cushion 36 contacts the flexible circuit board. Due to the hollow design of the contact air cushion 36, when the flexible circuit board is squeezed, the surface of the contact air cushion 36 will collapse, which plays a role in protecting the flexible circuit board. When it is difficult to assemble the flexible circuit board at the position of the step 4, by rotating the handle 7, the relative movement between the adjustment threaded rod 10 and the internal threaded ring is changed, thereby changing the inclination angle of the step 4, which makes it more convenient to assemble the flexible circuit board.

[0059] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A flexible circuit board assembly device, comprising a housing (1), characterized in that: The bottom of the shell (1) is rotatably connected to a bottom plate (5), the top of the shell (1) is fixedly connected to a tabletop (2), the edges of both sides of the upper surface of the tabletop (2) are fixedly connected to steps (4), the inside of the steps (4) is slidably connected to a second slide rail (11), the inside of the second slide rail (11) is slidably connected to a second slider (12), and the upper surface of the second slider (12) is fixedly connected to a sliding frame (14); An adjustment mechanism is installed on the upper surface of the bottom plate (5), and the adjustment mechanism is used to adjust the inclination angle of the housing (1); The upper surface of the step (4) is provided with a sliding mechanism, and the sliding mechanism is used to adjust the size of the gap; A pressing mechanism is installed at the bottom of the sliding frame (14), and the pressing mechanism is used to fix the position of the flexible circuit board; The sliding mechanism comprises two third slide rails (13) fixedly connected to the edges of both sides of the upper surface of the step (4); a plurality of third sliders (32) are slidably connected inside the third slide rails (13); a connecting rod (15) is fixedly connected to one side of the third slider (32); a plurality of mounting plates (16) are fixedly connected to the upper surface of the connecting rod (15); a pushing frame (19) is fixedly connected to the upper surface of one end of the connecting rod (15); a pushing shaft (30) is fixedly connected to the top of the pushing frame (19); and a fixed threaded rod (31) is threadedly connected to one side of the pushing frame (19); A plurality of adsorption mechanisms are installed on the top of the mounting plate (16), and the adsorption mechanisms are used for the flexible circuit board; The adsorption mechanism comprises an adsorption cylinder (18) rotatably connected to the top of the mounting plate (16); the top of the adsorption cylinder (18) is slidably connected with an adsorption disk (38); the top of the adsorption disk (38) is provided with an air suction hole (39); the interior of the adsorption disk (38) is provided with an air guide channel (40); the bottom of the adsorption disk (38) is fixedly connected with a piston (41); the bottom of the adsorption cylinder (18) is slidably connected with a sliding rod (45); one end of the sliding rod (45) is sleeved with an airtight spring (44); the top of the sliding rod (45) is fixedly connected with an airtight ball (42); one side of the sliding rod (45) is fixedly connected with a connecting plate (46); one side of the connecting plate (46) is provided with a sliding groove (47); a plurality of air vents (43) are provided on the bottom outer wall of the adsorption cylinder (18); and the bottom of the piston (41) is provided with an auxiliary spring; A plurality of release mechanisms are installed on one side of the adsorption cylinder (18), and the release mechanisms are used to release the flexible circuit board; The release mechanism comprises a release cylinder (17) rotatably connected to one side of the adsorption cylinder (18); a pressing shaft (51) is slidably connected inside the release cylinder (17); one end of the pressing shaft (51) is sleeved with a return spring (52); the top end of the pressing shaft (51) is fixedly connected to a release disk (37); the bottom end of the pressing shaft (51) is rotatably connected to a linkage rod (49); one end of the linkage rod (49) is fixedly connected to a sliding shaft (48); and a stopper (50) is provided on one side of the bottom end of the pressing shaft (51).

2. A flexible circuit board assembly device according to claim 1, characterized in that: The adjustment mechanism comprises two support plates (9) fixedly connected to the upper surface of the base plate (5); a connecting ring (6) is rotatably connected to one side edge of the upper surface of the base plate (5); an adjusting threaded rod (10) is rotatably connected to one side of the connecting ring (6); one end of the adjusting threaded rod (10) is threadedly connected to an internal threaded ring; a rotating ring (8) is rotatably connected to the top inner wall of the housing (1); and one end of the adjusting threaded rod (10) is fixedly connected to a handle (7).

3. A flexible circuit board assembly device according to claim 2, characterized in that: The pressing mechanism comprises a first slide rail (3) fixedly connected to the bottom of a sliding frame (14), a first slider (21) slidably connected inside the first slide rail (3), a rotating seat (20) fixedly connected to the bottom of the first slider (21), a mounting frame (25) rotatably connected to the bottom of the rotating seat (20), and a pressing rod (27) rotatably connected to one side of the mounting frame (25); A pre-tightening mechanism is installed on one side of the mounting frame (25), and the pre-tightening mechanism is used to adjust the pressure of pressing the flexible circuit board; A contact mechanism is installed at one end of the pressing rod (27), and the contact mechanism is used to contact the flexible circuit board.

4. A flexible circuit board assembly device according to claim 3, characterized in that: The pre-tightening mechanism comprises an operating threaded rod (26) fixedly connected to the bottom surface of the top of the mounting frame (25); one end of the operating threaded rod (26) is threadedly connected to a rotating cylinder (28); the top end of the rotating cylinder (28) is rotatably connected to a lifting plate (29); one end of the lifting plate (29) is rotatably connected to a supporting ring (24); the interior of the supporting ring (24) is slidably connected to a first plug rod (22); one end of the first plug rod (22) is sleeved with a compression spring (23); the bottom end of the first plug rod (22) is rotatably connected to a base.

5. A flexible circuit board assembly device according to claim 4, characterized in that: The contact mechanism comprises two fixed plates (33) fixedly connected to one end of a pressing rod (27); one side of the fixed plate (33) is rotatably connected to a vertical base (35); the internal thread of the vertical base (35) is connected to a contact threaded rod (34); and a contact air cushion (36) is provided at the bottom end of the contact threaded rod (34).

6. A flexible circuit board assembly device according to claim 5, characterized in that: The adjusting threaded rod (10) is rotatably connected to the rotating ring (8), and the base is rotatably connected to one end of the pressing rod (27).

7. A flexible circuit board assembly device according to claim 6, characterized in that: The air suction hole (39) is connected to the air guide channel (40), the piston (41) is in close contact with the inner wall of the adsorption cylinder (18) to ensure the air tightness inside the adsorption cylinder (18), and the sliding shaft (48) slides in the sliding groove (47).

Images