A laser slicing and separation device for solar cell sheets
Through the coordination of the upper and lower laser slicers synchronous cutting and surface detection components, the problems of slow cutting speed and poor adaptability of traditional lasers are solved, and efficient and stable silicon wafer cutting is achieved, reducing maintenance costs.
Patent Information
- Application Number
- CN202411378146.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2044-09-30
AI Technical Summary
The traditional single-sided laser cutting method has a slow cutting speed, making it difficult to adapt to silicon wafers of different thicknesses, the cutting quality is unstable, and the laser slicer is susceptible to contamination and wear, which increases maintenance costs.
The upper and lower laser slicers are used to cut simultaneously, combining high-precision displacement platform and surface detection components to automatically detect the surface condition of the silicon wafer and adjust the cutting parameters. The distance of the laser slicer is adjusted through the ball screw mechanism, and a spring sleeve is set to stabilize the laser slicer. , use dust storage compartment and vacuum cleaner to clean up pollution.
It significantly improves cutting speed and quality, enhances the scope of application of the equipment, ensures the stability and accuracy of the cutting process, and reduces maintenance costs.
Smart Images
Figure CN118893330B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of laser slicing, and in particular to a laser slicing and separation device for solar cell sheets. Background Art
[0002] In the manufacturing process of solar cells, it is necessary to cut larger silicon wafers into smaller standard sizes. Traditional cutting methods usually use mechanical tools, but this method is prone to produce silicon chips and heat damage areas, affecting the photoelectric conversion efficiency of the cells. With the development of technology, laser cutting technology has been widely used in the cutting process of solar cells due to its advantages such as high cutting accuracy and small heat-affected zone.
[0003] However, there are the following problems in the prior art:
[0004] (1) The cutting speed of traditional single-sided laser cutting is relatively slow, which affects production efficiency.
[0005] (2) Existing laser cutting devices often have difficulty adapting to silicon wafers of different thicknesses, which limits their scope of application.
[0006] (3) The cutting quality is unstable. For silicon wafers with different thicknesses or surface defects, if there are no appropriate adjustment measures, the cutting quality may deteriorate.
[0007] (4) Laser slicers exposed to the elements for long periods of time are susceptible to contamination and wear, increasing maintenance costs. Summary of the invention
[0008] In order to solve the above technical problems, the present invention provides a laser slicing and separation device for solar cell wafers, which adopts upper and lower laser slicers for synchronous cutting, significantly improving the cutting speed. The surface detection component can automatically detect the surface condition of the silicon wafer and adjust the cutting parameters according to the results to ensure the cutting quality.
[0009] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a laser slicing and separation device for solar cell sheets, comprising a slicing frame and a high-precision displacement platform installed on the top of the slicing frame, a lifting control compartment is provided on the slicing frame located on one side of the high-precision displacement platform, and an upper slicing compartment is provided on the side of the lifting control compartment facing the high-precision displacement platform;
[0010] The upper slicing bin is provided with a slicing assembly;
[0011] The slicing assembly includes a slide rail installed in an upper slicing bin, a slider sliding on the slide rail is provided on the slide rail, an upper laser slicer is provided on one side of the slider, the upper laser slicer is connected to the slider by a wedge frame, an upper electric-controlled gas rod is provided in the upper slicing bin, the output end of the upper electric-controlled gas rod is connected to the wedge frame at the position of the upper laser slicer, the upper laser slicer is driven to perform lateral horizontal displacement on the slide rail by the upper electric-controlled gas rod, a lower electric-controlled gas rod is provided in the slicing frame below the upper electric-controlled gas rod, the output end of the lower electric-controlled gas rod is connected to the lower laser slicer through another wedge frame, the laser emitting ends of the upper laser slicer and the lower laser slicer are arranged in a positive symmetrical state, and the upper and lower laser slicers can simultaneously perform upper and lower synchronous cutting on the silicon wafer, which can shorten the cutting time and increase the daily production capacity of each device.
[0012] Preferably, a ball screw arranged in a vertical state is provided in the lifting control bin, and a forward screw pair and a reverse screw pair are provided on the ball screw, which are respectively connected to the lower electric control gas rod and the upper electric control gas rod, and the threads in the forward screw pair and the reverse screw pair are arranged in opposite structures, and a fixed shaft sleeve is provided at the top of the ball screw, and the fixed shaft sleeve is fixedly installed on the inner wall of the lifting control bin, and a servo motor for driving the ball screw to rotate is provided at the bottom of the ball screw, and the servo motor is fixedly installed on the slicing frame, and the servo motor can drive the ball screw to rotate, so that the forward screw pair and the reverse screw are close to or away from each other on the ball screw, so as to adjust the distance between the upper laser slicer and the lower laser slicer to adapt to silicon wafers of different thicknesses, and at the same time, the silicon wafer can be recovered into the bin when there is no need to cut the silicon wafer, so as to avoid damage to the upper laser slicer and the lower laser slicer due to long-term exposure to the external environment.
[0013] Preferably, spring frames are provided at the positions of the upper and lower electric control gas rods, the spring frames comprising an upper sleeve body and a lower fixed seat, the lower fixed seat of the spring frame is connected to the nearest frame body, a telescopic spring is installed in the lower fixed seat, the top of the telescopic spring is connected to the upper sleeve body, the fixed ends of the upper and lower electric control gas rods respectively pass through the spring frames at corresponding positions, when the forward screw pair and the reverse screw pair respectively drive the lower and upper electric control gas rods to rise and fall, the springs of the spring frames can be stretched, thereby avoiding limiting the displacement of the lower and upper electric control gas rods, and when the upper and lower electric control gas rods are kept in a fixed state, the spring frames at corresponding positions can avoid lateral vibration and slight longitudinal vibration of the upper and lower electric control gas rods, thereby ensuring the stability of the upper and lower laser slicers in the working state.
[0014] Preferably, the high-precision displacement platform includes two transverse guide rails installed on the upper surface of the slicer frame, the extension direction of the transverse guide rails is consistent with the moving direction of the upper laser slicer, the two transverse guide rails are provided with a sliding transverse displacement frame, the transverse displacement frame is provided with two longitudinal guide rails arranged at intervals, the extension direction of the two longitudinal guide rails is perpendicular to the extension direction of the transverse guide rails, the two longitudinal guide rails are provided with a longitudinal displacement frame, the two side ends of the longitudinal displacement frame are provided with a placement platform for placing silicon wafers, the transverse guide rail can drive the transverse displacement frame to perform transverse displacement when driven by an external motor, and the longitudinal guide rail can drive the longitudinal displacement frame to perform longitudinal displacement on the transverse displacement frame when driven by an external motor.
[0015] Preferably, a surface detection component is provided above the placement platform, and the surface detection component includes an adjustment frame located on a transverse guide rail outside the placement platform, an electric telescopic rod is provided inside the adjustment frame, a detection track is provided on the top of the electric telescopic rod, and a plurality of distance sensors are distributed at the bottom of the detection track, and the distance sensors can detect a certain area to identify the height of the current silicon wafer surface and whether there are contaminants, etc.;
[0016] The distance detected by the preset distance sensor, when it is lower than the threshold, indicates that the height of the area detected by the silicon wafer is low and there are depressions, etc. At this time, the parameters of the upper laser slicer and the lower laser slicer can be lowered to adapt to silicon wafers of different thicknesses, thereby avoiding the problem of cracks and damage to thinner silicon wafers caused by excessive cutting power of the upper laser slicer;
[0017] When it is higher than the threshold, it indicates that the area detected by the silicon wafer may be too high or there may be contaminants. At this time, the detected area can be cleaned with the help of external tools. After cleaning, if the detection is still higher than the threshold, it indicates that the silicon wafer in the detected area is thicker. At this time, the parameters of the upper laser slicer and the lower laser slicer can be increased to speed up the efficiency of cutting the silicon wafer.
[0018] Preferably, the detection track is provided with an electrically controlled displacement block which slides along the detection track, and the electrically controlled displacement block is provided with a dust collecting bin and a vacuum cleaner which is connected to the dust collecting bin. The vacuum cleaner, the electrically controlled displacement block and the distance sensor are connected through electrical signals. When a certain distance sensor senses that there is a distance higher than a threshold in a certain detection area, the electrically controlled displacement block drives the vacuum cleaner to slide to the area, and uses the vacuum cleaner to vacuum the silicon wafer. After the treatment, the test is conducted again. If it is still higher than the threshold, the parameters of the upper laser slicer and the lower laser slicer are adjusted to increase the efficiency of cutting the silicon wafer.
[0019] Preferably, the surface detection components are provided with two groups, which are respectively located above and below the placing platform. The surface detection component located above the placing platform can detect the thickness of the upper surface of the silicon wafer, and the surface detection component located below the placing platform can detect the thickness of the lower surface of the silicon wafer. The two surface detection components are electrically connected and can comprehensively analyze the detection data to better adjust the parameters of the upper laser slicer and the lower laser slicer to adapt to the cutting of silicon wafers with different thicknesses.
[0020] Preferably, a straight groove is provided at the position of the slicing frame corresponding to the lower laser slicer for the lateral displacement of the lower laser slicer, and the displacement distance of the upper laser slicer and the lower laser slicer is greater than the width of the placement platform, thereby ensuring that the upper laser slicer and the lower laser slicer can complete the lateral cutting of the silicon wafer on the placement platform.
[0021] Preferably, the lateral displacement frame is provided with a plurality of sprayers for cooling the silicon wafer during the cutting process at the position corresponding to the upper laser slicer, so as to avoid cracks and damage problems caused by excessive temperature in the cutting area of the silicon wafer.
[0022] Compared with the prior art, the present invention has the following beneficial effects:
[0023] 1. In the present invention, the upper and lower laser slicers can simultaneously cut the silicon wafer up and down, which greatly shortens the cutting time, increases the daily production capacity of each device, effectively improves the production efficiency, enhances the cutting adaptability, and sets an adjustable ball screw mechanism, which can adjust the distance between the upper and lower laser slicers according to the different thicknesses of the silicon wafer, so that the device can adapt to the cutting needs of silicon wafers of different thicknesses, thereby increasing the scope of application of the device.
[0024] 2. The spring sleeve structure of the present invention effectively avoids the lateral and slight longitudinal vibrations of the upper laser slicer and the lower laser slicer during the cutting process, ensures the stability of the cutting process, and thus improves the cutting quality and accuracy.
[0025] 3. The setting of the surface detection component in the present invention can accurately identify the height and contaminants on the surface of the silicon wafer, avoid cutting problems caused by uneven thickness or contaminants, improve cutting efficiency and silicon wafer yield, and the configuration of the dust collection bin and the vacuum cleaner can clean the contaminants on the surface of the silicon wafer in time, ensuring the cleanliness of the cutting area, while reducing dust in the working environment, improving working conditions, and ensuring the quality of the product after cutting.
[0026] 4. When the equipment in the present invention is not in working state, the upper laser slicer and the lower laser slicer can be recovered into the bin, which effectively avoids the risk of damage caused by long-term exposure to the external environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments in conjunction with the accompanying drawings.
[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0029] Figure 2 It is a front view of the present invention;
[0030] Figure 3 A top view of the present invention;
[0031] Figure 4 It is a schematic diagram of the structural installation of the ball screw, the upper electric-controlled gas rod and the lower electric-controlled gas rod in the present invention;
[0032] Figure 5 It is a schematic diagram of the structural installation of the high-precision displacement platform in the present invention;
[0033] Figure 6 for Figure 5 A partial enlarged view of point A in the middle.
[0034] In the figure: 1. Slicing rack; 2. High-precision displacement platform; 201. Horizontal guide rail; 202. Horizontal displacement rack; 203. Longitudinal guide rail; 204. Longitudinal displacement rack; 205. Placing platform; 3. Lifting control bin; 4. Upper slicing bin; 5. Slicing assembly; 501. Slide rail; 502. Sliding block; 503. Upper laser slicer; 504. Wedge rack; 505. Upper electric-controlled gas rod; 506. Lower electric-controlled gas rod; 507. Lower laser slicer; 6. Ball screw; 7. Forward screw pair; 8. Reverse screw pair; 9. Fixed shaft sleeve; 10. Servo motor; 11. Spring sleeve rack; 12. Surface detection assembly; 1201. Adjustment rack; 1202. Electric telescopic rod; 1203. Detection track; 1204. Electric-controlled displacement block; 1205. Dust collection bin; 1206. Vacuum cleaner; 13. Straight slot; 14. Sprayer. DETAILED DESCRIPTION
[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0036] See also Figure 1-Figure 6The laser slicing and separation device of a solar cell of the present invention comprises a slicing frame 1 and a high-precision displacement platform 2 installed on the top of the slicing frame 1, a lifting control compartment 3 is provided on the slicing frame 1 on one side of the high-precision displacement platform 2, and an upper slicing compartment 4 is provided on the side of the lifting control compartment 3 facing the high-precision displacement platform 2;
[0037] The upper slicing chamber 4 is provided with a slicing assembly 5;
[0038] The slicing assembly 5 includes a slide rail 501 installed in the upper slicing chamber 4, a slider 502 sliding on the slide rail 501 is provided on the slide rail 501, an upper laser slicer 503 is provided on one side of the slider 502, the upper laser slicer 503 and the slider 502 are connected through a wedge frame 504, an upper electric control gas rod 505 is provided in the upper slicing chamber 4, the output end of the upper electric control gas rod 505 is connected to the wedge frame 504 at the position of the upper laser slicer 503, and the upper laser slicer 503 is driven by the upper electric control gas rod 505. The slicer 503 is displaced horizontally on the slide rail 501. A lower electrically-controlled gas rod 506 is provided in the slicer frame 1 below the upper electrically-controlled gas rod 505. The output end of the lower electrically-controlled gas rod 506 is connected to a lower laser slicer 507 via another wedge frame 504. The laser emitting ends of the upper laser slicer 503 and the lower laser slicer 507 are arranged in a positive symmetric state. The upper and lower laser slicers can simultaneously perform upper and lower synchronous cutting on the silicon wafer, which can shorten the cutting time and increase the daily production capacity of each device.
[0039] In a specific embodiment, a ball screw 6 is provided in a vertical state in the lifting control chamber 3, and a forward screw pair 7 and a reverse screw pair 8 are provided on the ball screw 6, which are respectively connected to the lower electric control gas rod 506 and the upper electric control gas rod 505. The threads in the forward screw pair 7 and the reverse screw pair 8 are arranged in opposite structures. A fixed shaft sleeve 9 is provided at the top of the ball screw 6, and the fixed shaft sleeve 9 is fixedly installed on the inner wall of the lifting control chamber 3. The bottom of the ball screw 6 is provided with a The servo motor 10 is fixedly mounted on the slicer frame 1. The servo motor 10 can drive the ball screw 6 to rotate, so that the forward screw pair 7 and the reverse screw are moved closer to or farther away from each other on the ball screw 6, so as to adjust the distance between the upper laser slicer 503 and the lower laser slicer 507 to adapt to silicon wafers of different thicknesses. At the same time, when the silicon wafers do not need to be cut, they can be recovered into the bin to avoid damage to the upper laser slicer 503 and the lower laser slicer 507 due to long-term exposure to the external environment.
[0040] In a specific embodiment, a spring frame 11 is provided at the positions of the upper electric control gas rod 505 and the lower electric control gas rod 506. The spring frame 11 includes an upper sleeve body and a lower fixed seat. The lower fixed seat of the spring frame 11 is connected to the nearest frame body. A telescopic spring is installed in the lower fixed seat. The top of the telescopic spring is connected to the upper sleeve body. The fixed ends of the upper electric control gas rod 505 and the lower electric control gas rod 506 respectively penetrate the spring frame 11 at the corresponding positions, and the forward screw pair 7 and the reverse screw pair 8 respectively drive When the lower electric-controlled gas rod 506 and the upper electric-controlled gas rod 505 are raised or lowered, the spring of the spring frame 11 is stretched, thereby avoiding limiting the displacement of the lower electric-controlled gas rod 506 and the upper electric-controlled gas rod 505. When the upper electric-controlled gas rod 505 and the lower electric-controlled gas rod 506 are kept in a fixed state, the spring frame 11 at the corresponding position can avoid lateral vibration and slight longitudinal vibration of the upper electric-controlled gas rod 505 and the lower electric-controlled gas rod 506, thereby ensuring the stability of the upper laser slicer 503 and the lower laser slicer 507 in the working state.
[0041] In a specific embodiment, the high-precision displacement platform 2 includes two spaced-apart transverse guide rails 201 installed on the upper surface of the slicer frame 1, the extension direction of the transverse guide rails 201 is consistent with the moving direction of the upper laser slicer 503, the two transverse guide rails 201 are provided with a sliding transverse displacement frame 202, the transverse displacement frame 202 is provided with two spaced-apart longitudinal guide rails 203, the extension direction of the two longitudinal guide rails 203 is perpendicular to the extension direction of the transverse guide rails 201, the two longitudinal guide rails 203 are provided with a longitudinal displacement frame 204, the two side ends of the longitudinal displacement frame 204 are provided with a placement platform 205 for placing silicon wafers, the transverse guide rail 201 can drive the transverse displacement frame 202 to perform transverse displacement under the drive of an external motor, and the longitudinal guide rail 203 can drive the longitudinal displacement frame 204 to perform longitudinal displacement on the transverse displacement frame 202 under the drive of an external motor.
[0042] In a specific embodiment, a surface detection component 12 is provided above the placement platform 205, and the surface detection component 12 includes an adjustment frame 1201 located on the transverse guide rail 201 outside the placement platform 205, and an electric telescopic rod 1202 is provided inside the adjustment frame 1201, and a detection track 1203 is provided on the top of the electric telescopic rod 1202, and a plurality of distance sensors are distributed at the bottom of the detection track 1203, and the distance sensors can detect a certain area to identify the height of the current silicon wafer surface and whether there are contaminants, etc.;
[0043] The distance detected by the preset distance sensor, when it is lower than the threshold value, indicates that the height of the area detected by the silicon wafer is low and there is a depression, etc. At this time, the parameters of the upper laser slicer 503 and the lower laser slicer 507 can be lowered to adapt to silicon wafers of different thicknesses, thereby avoiding the problem of cracks and damage to thinner silicon wafers caused by excessive cutting power of the upper laser slicer 503;
[0044] When it is higher than the threshold, it indicates that the area detected by the silicon wafer may be too high or there may be contaminants. At this time, the detected area can be cleaned with the help of external tools. After cleaning, if the detection is still higher than the threshold, it indicates that the silicon wafer in the detected area is thicker. At this time, the parameters of the upper laser slicer 503 and the lower laser slicer 507 can be increased to speed up the efficiency of cutting the silicon wafer.
[0045] In a specific embodiment, the detection track 1203 is provided with an electrically controlled displacement block 1204 that slides along the detection track 1203, and the electrically controlled displacement block 1204 is provided with a dust collecting bin 1205 and a vacuum cleaner 1206 that is connected to the dust collecting bin 1205. The vacuum cleaner 1206, the electrically controlled displacement block 1204 and the distance sensor are connected through electrical signals. When a certain distance sensor senses that a certain detection area exists above a distance threshold, the electrically controlled displacement block 1204 drives the vacuum cleaner 1206 to slide to the area, and the vacuum cleaner 1206 vacuums the silicon wafer, and then detects again after the processing. If it is still above the threshold, the parameters of the upper laser slicer 503 and the lower laser slicer 507 are adjusted to increase the efficiency of cutting the silicon wafer.
[0046] In a specific embodiment, the surface detection component 12 is provided with two groups, which are respectively located above the placement platform 205 and below the placement platform 205. The surface detection component 12 located above the placement platform 205 can detect the thickness of the upper surface of the silicon wafer, and the surface detection component 12 located below the placement platform 205 can detect the thickness of the lower surface of the silicon wafer. The two surface detection components 12 are electrically connected and can comprehensively analyze the detection data to better adjust the parameters of the upper laser slicer 503 and the lower laser slicer 507 to adapt to the cutting of silicon wafers with different thicknesses.
[0047] In a specific embodiment, a straight groove 13 is provided at the position of the slicing frame 1 corresponding to the lower laser slicer 507 for the lateral displacement of the lower laser slicer 507. The displacement distance of the upper laser slicer 503 and the lower laser slicer 507 is greater than the width of the placement platform 205, thereby ensuring that the upper laser slicer 503 and the lower laser slicer 507 can complete the lateral cutting of the silicon wafer on the placement platform 205.
[0048] In a specific embodiment, a plurality of sprayers 14 for cooling the silicon wafer during the silicon wafer cutting process are provided at the position of the lateral displacement frame 202 corresponding to the upper laser slicer 503 to avoid cracks and damage caused by excessive temperature in the silicon wafer cutting area.
[0049] Working principle: First, place the silicon wafer to be cut on the placement platform 205, and use the transverse guide rail 201 and the longitudinal guide rail 203 on the high-precision displacement platform 2 for precise positioning.
[0050] Next, the surface detection component 12 is started. This component is located above and below the placement platform 205, and detects the upper and lower surfaces of the silicon wafer respectively. The distance sensor is used to detect the height of the silicon wafer surface and check whether there are contaminants. If contaminants are found on the surface of the silicon wafer during the detection process, the vacuum cleaner 1206 is driven by the electric control displacement block 1204 to clean it, and the parameters of the laser slicer are adjusted accordingly according to the detection results.
[0051] The power and speed of the upper laser slicer 503 and the lower laser slicer 507 are adjusted according to the thickness and surface condition of the silicon wafer. If the silicon wafer is thin, the power is lowered to prevent cracks and damage; if the silicon wafer is thick, the power is increased to improve the cutting efficiency.
[0052] After the detection is completed, the silicon wafer is driven by the longitudinal displacement frame 204 to move to the corresponding positions of the upper laser slicer 503 and the lower laser slicer 507. At this time, the servo motor 10 is started to drive the ball screw 6 to rotate, and the relative positions of the upper electric control gas rod 505 and the lower electric control gas rod 506 are accurately adjusted through the forward screw pair 7 and the reverse screw pair 8, thereby changing the distance between the upper laser slicer 503 and the lower laser slicer 507 to adapt to silicon wafers of different thicknesses.
[0053] Afterwards, the upper electrically-controlled gas rod 505 and the lower electrically-controlled gas rod 506 respectively drive the upper laser slicer 503 and the lower laser slicer 507 to perform lateral horizontal displacement on the slide rail 501 to achieve synchronous cutting of the silicon wafer. During the cutting process, the cutting area is cooled by the sprayer 14 to lower the temperature and reduce thermal damage. During the cutting process, the telescopic spring of the spring sleeve 11 can absorb vibration to ensure the stability of the cutting. When cutting is not needed, the laser slicers can be retracted by the servo motor 10 to avoid them being exposed to the outside for a long time.
[0054] The above description is only a preferred embodiment of the present invention and is not intended to be a further limitation of the present invention. All equivalent changes made using the contents of the present specification and drawings are within the protection scope of the present invention.
Claims
1. A laser slicing and separation device for solar cell sheets, characterized in that: The invention comprises a slicing frame (1) and a high-precision displacement platform (2) mounted on the top of the slicing frame (1), wherein a lifting control compartment (3) is provided on the slicing frame (1) located on one side of the high-precision displacement platform (2), and an upper slicing compartment (4) is provided on the side of the lifting control compartment (3) facing the high-precision displacement platform (2); The upper slicing chamber (4) is provided with a slicing assembly (5); The slicing assembly (5) comprises a slide rail (501) installed in an upper slicing chamber (4); a slider (502) sliding on the slide rail (501) is provided on the slide rail (501); an upper laser slicer (503) is provided on one side of the slider (502); the upper laser slicer (503) and the slider (502) are connected via a wedge-shaped frame (504); an upper electric-controlled gas rod (505) is provided in the upper slicing chamber (4); an output end of the upper electric-controlled gas rod (505) is connected to the wedge-shaped frame (504) at the position of the upper laser slicer (503); a lower electric-controlled gas rod (506) is provided in the slicing frame (1) below the upper electric-controlled gas rod (505); an output end of the lower electric-controlled gas rod (506) is connected to a lower laser slicer (507) via another wedge-shaped frame (504); and laser emitting ends of the upper laser slicer (503) and the lower laser slicer (507) are arranged in a positive symmetric state; The high-precision displacement platform (2) comprises two spaced-apart transverse guide rails (201) mounted on the upper surface of the slicer frame (1), the extension direction of the transverse guide rails (201) being consistent with the moving direction of the upper laser slicer (503), the two transverse guide rails (201) being provided with a sliding transverse displacement frame (202), the transverse displacement frame (202) being provided with two spaced-apart longitudinal guide rails (203), the extension direction of the two longitudinal guide rails (203) being perpendicular to the extension direction of the transverse guide rails (201), the two longitudinal guide rails (203) being provided with a longitudinal displacement frame (204), and two side ends of the longitudinal displacement frame (204) being provided with a placement platform (205) for placing silicon wafers; A surface detection component (12) is provided above the placement platform (205), the surface detection component (12) comprising an adjustment frame (1201) located on a transverse guide rail (201) outside the placement platform (205), an electric telescopic rod (1202) being provided inside the adjustment frame (1201), a detection track (1203) being provided on the top of the electric telescopic rod (1202), and a plurality of distance sensors being distributed at the bottom of the detection track (1203); An electrically controlled displacement block (1204) is provided on the detection track (1203) and slides along the detection track (1203); a dust collecting bin (1205) and a dust collector (1206) which is in communication with the dust collecting bin (1205) are provided on the electrically controlled displacement block (1204); the dust collector (1206), the electrically controlled displacement block (1204) and the distance sensor are connected via electrical signals; The surface detection components (12) are provided in two groups, which are respectively located above the placement platform (205) and below the placement platform (205), and the two surface detection components (12) are electrically connected.
2. The laser slicing and separation device for solar cell according to claim 1, characterized in that: A ball screw (6) arranged in a vertical state is provided in the lifting control chamber (3); a forward screw pair (7) and a reverse screw pair (8) are provided on the ball screw (6), which are respectively connected to a lower electric control gas rod (506) and an upper electric control gas rod (505); the threads in the forward screw pair (7) and the reverse screw pair (8) are arranged in opposite structures; a fixed shaft sleeve (9) is provided at the top of the ball screw (6); the fixed shaft sleeve (9) is fixedly mounted on the inner wall of the lifting control chamber (3); a servo motor (10) for driving the ball screw (6) to rotate is provided at the bottom of the ball screw (6); the servo motor (10) is fixedly mounted on the slice rack (1).
3. The laser slicing and separation device for solar cell according to claim 2, characterized in that: A spring frame (11) is provided at the positions of the upper electrically controlled gas rod (505) and the lower electrically controlled gas rod (506), the spring frame (11) comprising an upper frame body and a lower fixing seat, the lower fixing seat of the spring frame (11) being connected to the nearest frame body, a telescopic spring being installed in the lower fixing seat, the top end of the telescopic spring being connected to the upper frame body, and the fixed ends of the upper electrically controlled gas rod (505) and the lower electrically controlled gas rod (506) respectively passing through the spring frame (11) at corresponding positions.
4. The laser slicing and separation device for solar cell according to claim 1, characterized in that: The slicer frame (1) is provided with a straight groove (13) at a position corresponding to the lower laser slicer (507) for lateral displacement of the lower laser slicer (507), and the displacement distance of the upper laser slicer (503) and the lower laser slicer (507) is greater than the width of the placement platform (205).
5. The laser slicing and separation device for solar cell according to claim 4, characterized in that: A plurality of sprayers (14) for cooling the silicon wafer during the cutting process are arranged at the position of the lateral displacement frame (202) corresponding to the upper laser slicer (503).