Rapid prototyping device and method for EVA shoe material

By using an alternating displacement mechanism in the EVA shoe material molding device to automate the alternating use of the heating and cooling modules, the problem of low efficiency in the traditional EVA shoe sole molding process is solved, achieving highly efficient and automated heating and cooling, and reducing labor costs.

CN118906345BActive Publication Date: 2025-11-21ZHEJIANG LONGYUAN POLYMER TECH CO LTD
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Patent Information

Application Number
CN202410944754.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-07-15
Publication Date
2025-11-21
Estimated Expiration
2044-07-15

AI Technical Summary

Technical Problem

The traditional EVA sole molding process requires multiple people to work together, which is time-consuming, labor-intensive, and inefficient.

Method used

An EVA shoe material rapid prototyping device is adopted, which sets up a heating module and a cooling module under the mold through an alternating displacement mechanism to realize the automated heating and cooling process. The heating module and the cooling module alternately heat and cool under the mold, integrating heating and shaping into one unit.

Benefits of technology

It improves the efficiency of EVA sole molding, reduces labor, lowers costs, and enables automated operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of EVA shoe material's rapid forming device and method thereof, including frame and mold installed on frame, mold includes lower mould groove and upper mould cover, lower mould groove is fixedly installed on frame, the upper end of lower mould groove has the forming groove of retraction, upper mould cover is matched cover and is located in the upper end of lower mould groove, upper mould cover is moved by lifting mechanism and is installed on frame;The lower end of lower mould groove is provided with embedding groove, the lower of lower mould groove has lifting position, and by alternating position exchange mechanism, first base plate and second base plate can be alternately moved to lifting position, the upper end of first base plate is provided with heating module by first jacking mechanism, the upper end of second base plate is provided with refrigeration module by second jacking mechanism, heating module and refrigeration module are all adapted to embedding groove, the position of heating module and refrigeration module is exchanged by alternating position exchange mechanism, respectively heating and cooling mold, heating and cooling are integrated in one, reduce labor, reduce cost, improve forming efficiency.
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Description

Technical Field

[0001] This invention relates to the field of EVA molding technology, and specifically to a rapid prototyping device and method for EVA shoe materials. Background Technology

[0002] EVA soles offer high resilience and tensile strength, high toughness, and excellent shock absorption and cushioning. They also provide excellent heat insulation, warmth retention, and low-temperature performance, resisting extreme cold and sun exposure. Their closed-cell structure makes them non-absorbent, moisture-proof, and water-resistant, while also resisting corrosion from seawater, grease, acids, alkalis, and other chemicals. They are antibacterial, non-toxic, odorless, and pollution-free. Traditional EVA soles require heat setting during the molding process. This traditional method involves heating the sole in a heating chamber and then moving it to a cooling chamber for cooling. This entire process requires multiple people working together, is time-consuming, labor-intensive, and inefficient. Summary of the Invention

[0003] To address the shortcomings of the prior art, this invention proposes a rapid prototyping device and method for EVA shoe materials.

[0004] To achieve the above-mentioned technical effects, the present invention adopts the following solution:

[0005] A rapid prototyping device for EVA shoe materials includes a frame and a mold mounted on the frame. The mold includes a lower mold groove and an upper mold cover. The lower mold groove is fixedly mounted on the frame and has a recessed molding groove at its upper end. The upper mold cover is fitted onto the upper end of the lower mold groove and is mounted on the frame and moved via a lifting mechanism. An embedding groove is provided at the lower end of the lower mold groove. A lifting position is provided below the lower mold groove, and a first base plate and a second base plate are provided via an alternating positioning mechanism that can alternately move to the lifting position. A heating module is provided at the upper end of the first base plate via a first lifting mechanism, and a cooling module is provided at the upper end of the second base plate via a second lifting mechanism. Both the heating module and the cooling module are adapted to the embedding groove.

[0006] In a preferred embodiment, the heating module includes a first embedding block that matches the embedding groove. The upper end of the first embedding block has a spiral-shaped slot, into which a heating tube is inserted.

[0007] In a preferred embodiment, the cooling module includes a second embedded block that matches the embedded slot. The upper end of the second embedded block has an installation slot, in which a PTC cooling plate is installed with its cold end facing upward. The bottom of the installation slot is recessed and has a heat collection cavity with a size smaller than the installation slot. The heat collection cavity is connected to a plurality of heat dissipation holes extending out of the second embedded block.

[0008] In a preferred embodiment, the lower mold groove is provided with a sandwich layer, the sandwich layer covers the lower end of the forming groove, the sandwich layer is provided with a good heat-conducting plate, and the good heat-conducting plate is connected to a heat-conducting column extending to the upper end of the embedded groove.

[0009] In a preferred embodiment, the replacement mechanism includes two parallel first slide rails mounted on a frame. The first base plate is slidably mounted on the two first slide rails and driven to slide by a first lead screw mechanism. Two parallel second slide rails are provided between the two first slide rails, with the height of the second slide rails being lower than that of the first slide rails. A movable plate is slidably mounted on the two second slide rails and driven to slide by a second lead screw mechanism. The second base plate is located above the movable plate and is mounted on the movable plate for vertical lifting via a first guide rod. A guide plate parallel to the second slide rails is provided below the movable plate. A guide groove is provided on one side of the guide plate. The middle section of the guide groove is an arc shape that arches downwards, and the two ends of the guide groove are horizontal. The connection between the middle section and the two ends of the guide groove is an arc transition. A sliding slider is matched inside the guide groove. The outer end of the slider is fixedly connected to the lower end of the second base plate via a connecting rod. An opening is provided on the movable plate for the connecting rod to pass through.

[0010] In a preferred embodiment, the first lifting mechanism and the second lifting mechanism have the same structure. The first lifting mechanism includes four second guide rods arranged in a rectangular array. The four second guide rods are vertically installed on the upper end of the first base plate. A vertically movable lifting plate is matched and installed on the four second guide rods. The heating module is installed on the upper end of the lifting plate. A vertically downward connecting rod is provided at the lower end of the lifting plate. A rotating roller is provided at the lower end of the connecting rod. An adjusting strip is provided at the upper end of the first base plate, located below the roller. The adjusting strip is mounted on the first base plate via a guide rail and slides along the length of the adjusting strip. The adjusting strip is driven to slide by a push cylinder. The height of the upper end of the adjusting strip gradually changes along its length. The roller rolls against the upper end of the adjusting strip.

[0011] In a preferred embodiment, the lifting mechanism includes a lifting cylinder mounted on the frame, the lifting cylinder being vertically arranged, and the telescopic rod of the lifting cylinder being fixedly connected downward to the upper end of the upper trough cover.

[0012] A rapid prototyping method for EVA shoe material includes: a lifting mechanism raising the upper mold cover to add EVA raw material into the molding groove; the lifting mechanism lowering the upper mold cover to cover the lower mold groove; an alternating positioning mechanism moving the first substrate to the bottom of the lower mold groove so that the heating module corresponds to the embedding groove; then a first lifting mechanism raising the heating module and pressing it to the top of the embedding groove to heat the molding groove; after heating, the first lifting mechanism driving the heating module to descend and exit the embedding groove; then an alternating positioning mechanism swapping the first and second substrates so that the second substrate is located below the lower mold groove, aligning the cooling module with the embedding groove; a second lifting mechanism raising the cooling module and pressing it to the top of the embedding groove to cool the molding groove; after cooling, the second lifting mechanism driving the cooling module to descend and exit the embedding groove; finally, the lifting mechanism driving the upper mold cover to rise and remove the molded EVA product.

[0013] In a preferred embodiment, the heating module heats the forming tank at a temperature of 160℃-200℃ for 30-40 minutes.

[0014] In a preferred embodiment, the cooling module cools the molding tank at a temperature of 0°C to 5°C for 35 minutes to 60 minutes.

[0015] Compared with existing technologies, the beneficial effects are:

[0016] This invention has a simple structure and is easy to use. The heating module and the cooling module are set below the mold, and the heating module and the cooling module are moved alternately to the bottom of the mold through an alternating replacement mechanism to cool the mold with heating agent. It integrates heating and cooling shaping into one compact structure. The EVA heating and cooling operation is automated. Compared with the traditional manual replacement of heating and cooling modules, it reduces labor, lowers costs, and improves molding efficiency. Attached Figure Description

[0017] Figure 1 This is a front view schematic diagram of the present invention;

[0018] Figure 2 This is a front view schematic diagram of the first lifting mechanism in this invention;

[0019] Figure 3 This is a side view of the first lifting mechanism in this invention;

[0020] Figure 4 This is a top view schematic diagram of a portion of the structure of the first lifting mechanism in this invention;

[0021] Figure 5 This is a side view of the alternation mechanism in this invention;

[0022] Figure 6 This is a cross-sectional schematic diagram of the mold in this invention.

[0023] Reference numerals: 1. Mold; 2. Lower mold groove; 3. Upper mold cover; 4. Lifting cylinder; 5. First slide rail; 6. Second slide rail; 7. First base plate; 8. Second base plate; 9. Heating module; 10. Cooling module; 11. First lifting mechanism; 12. Second lifting mechanism; 13. Moving plate; 14. First guide rod; 15. Connecting rod; 16. Guide plate; 17. Guide groove; 18. Slider; 19. Second guide rod; 20. Lifting plate; 21. Adjusting bar; 22. Guide rail; 23. Push cylinder; 24. Connecting rod; 25. Roller; 26. Forming groove; 27. High heat-conducting plate; 28. Heat-conducting column; 29. ​​Embedded groove. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0025] A rapid prototyping apparatus and method for EVA shoe material includes a frame and a mold 1 mounted on the frame. The mold 1 includes a lower mold groove 2 and an upper mold cover 3. The lower mold groove 2 is fixedly mounted on the frame. The upper end of the lower mold groove 2 has a recessed molding groove 26. The upper mold cover 3 is matched and covered on the upper end of the lower mold groove 2. The upper mold cover 3 is mounted on the frame and moved by a lifting mechanism. An embedding groove 29 is opened at the lower end of the lower mold groove 2. A lifting position is provided below the lower mold groove 2. A first base plate 7 and a second base plate 8 that can be alternately moved to the lifting position are provided by an alternating positioning mechanism. A heating module 9 is provided at the upper end of the first base plate 7 by a first lifting mechanism 11. A cooling module 10 is provided at the upper end of the second base plate 8 by a second lifting mechanism 12. Both the heating module 9 and the cooling module 10 are adapted to the embedding groove 29.

[0026] The lifting mechanism raises the upper mold cover 3, adding EVA material into the molding groove 26. The lifting mechanism lowers the upper groove cover to cover the lower mold groove 2. The alternation and repositioning mechanism moves the first substrate 7 to the bottom of the lower mold groove 2 so that the heating module 9 corresponds to the embedding groove 29. Then, the first lifting mechanism 11 raises the heating module 9 and pushes it to the top of the embedding groove 29, whereby the heating module 9 heats the molding groove 26. After heating is completed, the first lifting mechanism 11 drives the heating module 9 to descend and exit the embedding groove 29. Then, the alternation and repositioning mechanism swaps the first substrate 7 with the second substrate 8, placing the second substrate 8 below the lower mold groove 2, aligning the cooling module 10 with the embedding groove 29. The second lifting mechanism 12 raises the cooling module 10 and pushes it to the top of the embedding groove 29 to cool the molding groove 26. After cooling is completed, the second lifting mechanism 12 drives the cooling module 10 to descend and exit the embedding groove 29. Finally, the lifting mechanism drives the upper mold cover 3 to rise, removing the molded EVA product.

[0027] In a preferred embodiment, the heating module 9 heats the molding tank 26 at a temperature of 160℃-200℃ for a duration of 30min-40min.

[0028] In a preferred embodiment, the cooling module 10 cools the molding tank 26 at a temperature of 0°C to 5°C for a duration of 35 min to 60 min.

[0029] In a preferred embodiment, the heating module 9 includes a first embedding block that matches the embedding groove 29. The upper end of the first embedding block has a spiral-shaped slot, into which a heating tube is inserted.

[0030] In a preferred embodiment, the cooling module 10 includes a second embedded block that matches the embedded slot 29. The upper end of the second embedded block is provided with an installation slot, and a PTC cooling plate is installed in the installation slot with the cold end of the PTC cooling plate facing upward. The bottom of the installation slot is recessed downward and provided with a heat collection cavity with a size smaller than the installation slot. The heat collection cavity is connected to a plurality of heat dissipation holes extending to the outside of the second embedded block.

[0031] The heat generated by the PTC cooling plate during operation is collected in the heat collection chamber and then dissipated through the heat dissipation holes.

[0032] In a preferred embodiment, the lower mold groove 2 is provided with a sandwich layer, which covers the lower end of the forming groove 26. A heat-conducting plate 27 is provided in the sandwich layer, and a heat-conducting column 28 extending to the upper end of the embedded groove 29 is connected to the heat-conducting plate 27.

[0033] The heat-conducting pillars 28 quickly transfer high and low temperatures to the heat-conducting plate, which is close to the forming groove, enabling rapid heating and cooling of the EVA material inside the forming groove.

[0034] In a preferred embodiment, the alternation mechanism includes two parallel first slide rails 5 mounted on a frame. A first base plate 7 is slidably mounted on the two first slide rails 5 and driven to slide by a first lead screw mechanism. Two parallel second slide rails 6 are provided between the two first slide rails 5, with the height of the second slide rails 6 lower than the height of the first slide rails 5. A movable plate 13 is slidably mounted on the two second slide rails 6 and driven to slide by a second lead screw mechanism. The second base plate 8 is located above the movable plate 13 and is vertically mounted on the movable plate 13 via a first guide rod 14. The movable plate 13 is provided with a guide plate 16 below it, which is parallel to the second slide rail 6. A guide groove 17 is provided on one side of the guide plate 16. The middle section of the guide groove 17 is an arc shape that arches downwards. The two ends of the guide groove 17 are horizontal. The connection between the middle section and the two ends of the guide groove 17 is set with an arc transition. A sliding slider 18 is matched in the guide groove 17. The outer end of the slider 18 is fixedly connected to the lower end of the second base plate 8 through a connecting rod 15. An opening is provided on the movable plate 13 for the connecting rod 15 to pass through.

[0035] The first substrate 7 slides horizontally on the first slide rail 5 under the drive of the first lead screw mechanism, and the moving plate 13 slides horizontally on the second slide rail 6 under the drive of the second lead screw mechanism. When the positions of the heating module 9 and the cooling module 10 are to be exchanged, the first substrate 7 and the moving plate 13 move relative to each other. The first substrate 7 always remains horizontal, and the moving plate 13 always remains horizontal. The moving plate 13 is located below the first substrate 7, so the moving plate 13 and the first substrate 7 will not collide. However, the highest position of the second substrate 8 is the same height as the first substrate 7. To avoid collisions during movement... When the first substrate 7 collides with the second substrate 8, the moving plate 13 will move through the second substrate 8 to drive the connecting rod 15 to move. The lower end of the connecting rod 15 is slidably installed in the guide groove 17 and slides along the guide groove 17. Since the middle section of the guide groove 17 is bent downward, the connecting rod 15 will move downward and pull the second substrate 8 downward, thereby misaligning the second substrate 8 with the first substrate 7. After the replacement, the connecting rod 15 moves upward with the guide groove 17 and lifts the second substrate 8, so that the second substrate 8 and the first substrate 7 are at the same height.

[0036] In a preferred embodiment, the first lifting mechanism 11 and the second lifting mechanism 12 have the same structure. The first lifting mechanism 11 includes four second guide rods 19 arranged in a rectangular array. The four second guide rods 19 are vertically installed on the upper end of the first base plate 7. A vertically movable lifting plate 20 is matched and installed on the four second guide rods 19. The heating module 9 is installed on the upper end of the lifting plate 20. A vertically downward connecting rod 24 is provided at the lower end of the lifting plate 20. A rotating roller 25 is provided at the lower end of the connecting rod 24. An adjusting strip 21 is provided at the upper end of the first base plate 7, located below the roller 25. The adjusting strip 21 is installed on the first base plate 7 via a guide rail 22 and slides along the length direction of the adjusting strip 21. The adjusting strip 21 is driven to slide by a pushing cylinder 23. The height of the upper end of the adjusting strip 21 gradually changes along its length direction. The height of the upper end of the adjusting strip 21 can gradually decrease or gradually increase. The roller 25 rolls against the upper end of the adjusting strip 21.

[0037] The cylinder 23 pushes the adjusting bar 21 to move along the guide rail 22. Since the roller 25 is against the upper end of the adjusting bar 21, the roller 25 will move up and down as the height of the upper end of the adjusting bar 21 changes, thereby driving the first substrate 7 to move up and down.

[0038] In a preferred embodiment, the lifting mechanism includes a lifting cylinder 4 mounted on a frame. The lifting cylinder 4 is vertically arranged, and its telescopic rod is fixedly connected downward to the upper end of the upper trough cover.

[0039] In a preferred embodiment, the heating module 9 heats the molding tank 26 at a temperature of 160℃-200℃ for a duration of 30min-40min.

[0040] In a preferred embodiment, the cooling module 10 cools the molding tank 26 at a temperature of 0°C to 5°C for a duration of 35 min to 60 min.

[0041] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0043] Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this invention.

Claims

1. A rapid prototyping device for EVA shoe material, characterized by, The utility model provides a moulding machine, including frame and install mould (1) on frame, mould (1) includes lower mould groove (2) and upper mould cover (3), lower mould groove (2) is fixedly installed on frame, and the upper end of lower mould groove (2) has the concave forming groove (26), and the upper mould cover (3) is matched cover to be arranged in the upper end of lower mould groove (2), and the upper mould cover (3) is installed on frame and moves through lifting mechanism, the lower end of lower mould groove (2) is provided with embedding groove (29), and the lower of lower mould groove (2) has lifting position, and through the alternate position mechanism is provided with the first base plate (7) and second base plate (8) that can be moved to the lifting position alternately, the upper end of first base plate (7) is provided with heating module (9) through first jacking mechanism (11), and the upper end of second base plate (8) is provided with refrigeration module (10) through second jacking mechanism (12), and heating module (9) and refrigeration module (10) are all adapted with embedding groove (29), The alternate position mechanism includes two first slide rails (5) that are installed in parallel on the frame, the first base plate (7) is slidably installed on the two first slide rails (5) and is driven to slide by a first lead screw mechanism, two second slide rails (6) are provided in parallel between the two first slide rails (5), the height of the second slide rails (6) is lower than the height of the first slide rails (5), a moving plate (13) is slidably installed on the two second slide rails (6) and is driven to slide by a second lead screw mechanism, the second base plate (8) is located above the moving plate (13) and is vertically lifted by being installed on the moving plate (13) through a first guide rod (14), a guide plate (16) parallel to the second slide rails (6) is provided below the moving plate (13), a guide sliding groove (17) is formed in one side of the guide plate (16), the middle section of the guide sliding groove (17) is in the shape of a downward arch, the two ends of the guide sliding groove (17) are horizontal, the connection between the middle section and the two ends of the guide sliding groove (17) is in the shape of a circular arc, a sliding block (18) is slidably provided in the guide sliding groove (17), the outer end of the sliding block (18) is fixedly connected to the lower end of the second base plate (8) through a connecting rod (15), and an opening is formed in the moving plate (13) for the connecting rod (15) to pass through.

2. The rapid prototyping apparatus for EVA shoe material as claimed in claim 1, wherein The heating module (9) includes a first embedding block matched with the embedding groove (29), a spiral groove is formed in the upper end of the first embedding block, and a heating pipe is clamped in the spiral groove.

3. The rapid prototyping apparatus for EVA shoe material as claimed in claim 1, wherein The refrigeration module (10) includes a second embedding block matched with the embedding groove (29), an installation groove is formed in the upper end of the second embedding block, a PTC refrigeration plate is installed in the installation groove, the cold end of the PTC refrigeration plate faces upward, the bottom of the installation groove is recessed downward to form a heat collecting cavity smaller than the installation groove, and a plurality of heat dissipation holes extending to the outside of the second embedding block are connected to the heat collecting cavity.

4. The rapid prototyping apparatus for EVA shoe material as claimed in claim 1, wherein A sandwich layer is provided in the lower mould groove (2), the sandwich layer covers the lower end of the forming groove (26), a good heat conduction plate (27) is provided in the sandwich layer, and a heat conduction column (28) extending to the upper end of the embedding groove (29) is connected to the good heat conduction plate (27).

5. The rapid prototyping apparatus for EVA shoe material as claimed in claim 1, wherein The first jacking mechanism (11) and the second jacking mechanism (12) are consistent in structure, wherein the first jacking mechanism (11) comprises four second guide rods (19) arranged in a rectangular array, the four second guide rods (19) are vertically installed at the upper end of the first base plate (7), a vertically moving lifting plate (20) is matched and installed on the four second guide rods (19), the heating module (9) is installed at the upper end of the lifting plate (20), a vertically downward connecting rod (24) is arranged at the lower end of the lifting plate (20), a rotating roller (25) is arranged at the lower end of the connecting rod (24), the upper end of the first base plate (7) is provided with an adjusting strip (21) located below the roller (25), the adjusting strip (21) is installed on the first base plate (7) through a guide rail (22) and slides along the length direction of the adjusting strip (21), the adjusting strip (21) is driven to slide by a push cylinder (23), the height of the upper end of the adjusting strip (21) gradually changes along the length direction thereof, and the roller (25) rolls and moves against the upper end of the adjusting strip (21).

6. The rapid prototyping apparatus for EVA shoe material as claimed in claim 1, wherein The lifting mechanism comprises a lifting cylinder (4) installed on the rack, the lifting cylinder (4) is vertically arranged, and the telescopic rod of the lifting cylinder (4) is fixedly connected to the upper end of the upper groove cover in a downward manner.

7. A molding method using a rapid prototyping apparatus based on the EVA shoe material according to claim 1, characterized by, The lifting mechanism lifts the upper mold cover (3), the EVA raw material is added into the forming groove (26), the lifting mechanism lowers the upper groove cover to cover the lower mold groove (2), the alternating displacement mechanism drives the first base plate (7) to move below the lower mold groove (2) so that the heating module (9) corresponds to the embedded groove (29), then the first jacking mechanism (11) lifts the heating module (9) and tops the upper end of the embedded groove (29), and the heating module (9) heats the forming groove (26); after heating is completed, the first jacking mechanism (11) drives the heating module (9) to descend and exit the embedded groove (29), then the alternating displacement mechanism exchanges the first base plate (7) and the second base plate (8) to make the second base plate (8) located below the lower mold groove (2), the refrigeration module (10) corresponds to the embedded groove (29), the second jacking mechanism (12) lifts the refrigeration module (10) and tops the upper end of the embedded groove (29) to cool the forming groove (26), after cooling is completed, the second jacking mechanism (12) drives the refrigeration module (10) to descend and exit the embedded groove (29), and finally the lifting mechanism drives the upper mold cover (3) to lift to take out the formed EVA product.

8. The rapid prototyping apparatus of EVA shoe material and method thereof as claimed in claim 7, wherein, The heating temperature of the heating module (9) on the forming groove (26) is 160-200 DEG C, and the heating time is 30-40 min.

9. The rapid prototyping apparatus of EVA shoe material and method thereof as claimed in claim 7, wherein, The cooling temperature of the refrigeration module (10) on the forming groove (26) is 0-5 DEG C, and the cooling time is 35-60 min.

Citation Information

Patent Citations

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    CN106346650A

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