Chip Temperature Testing System, Method, Device, Testing Machine and Storage Medium

Abstract

The chip temperature testing system, method, device, testing machine and storage medium provided by the embodiments of the present invention relate to the technical field of temperature testing. The chip temperature testing system includes a testing machine and at least one analog temperature measurement module. The testing machine is used to obtain the first temperature detected by the internal sensor of each chip to be tested. The analog temperature measurement module is used to output a corresponding voltage signal to the testing machine according to the actual temperature of the corresponding chip to be tested. The testing machine is further used to convert the voltage signal into a second temperature, and determine the test result of the chip to be tested according to the second temperature and the first temperature. By sending a voltage signal to the testing machine according to the actual temperature of the chip to be tested through the analog temperature measurement module, the testing machine does not need to receive digital signals. Therefore, the testing machine does not need to have digital signal processing capabilities, reducing the cost of the testing machine, and thus reducing the cost of testing the chip temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature testing, and in particular, to a chip temperature testing system, method, device, testing machine, and storage medium. Background Art

[0002] With the rapid development of semiconductor technology, the reliability and performance testing of chips have become increasingly important. As one of the key factors affecting chip performance, accurately measuring the temperature is crucial to ensure the stable operation of the chip under various working conditions.

[0003] Existing chip temperature testing technologies rely on testing machines with digital interfaces. The testing machine receives digital signals from analog temperature measurement modules through digital channels. However, such testing machines with digital signal processing capabilities are costly, resulting in high costs for testing chip temperatures. Summary of the Invention

[0004] The purpose of the present invention is to provide a chip temperature testing system, method, device, testing machine, and storage medium to solve the problem of high costs for testing chip temperatures.

[0005] In a first aspect, the present invention provides a chip temperature testing system. The chip temperature testing system includes a testing machine and at least one analog temperature measurement module. The analog temperature measurement modules correspond to the chips to be tested one by one. The testing machine is electrically connected to the analog temperature measurement modules and the chips to be tested.

[0006] The testing machine is configured to obtain a first temperature detected by an internal sensor of each chip to be tested.

[0007] The analog temperature measurement module is configured to output a corresponding voltage signal to the testing machine according to the actual temperature of the corresponding chip to be tested.

[0008] The testing machine is further configured to convert the voltage signal into a second temperature, and determine a test result of the chip to be tested according to the second temperature and the first temperature.

[0009] In an optional embodiment, the testing machine is configured to calculate a temperature difference between the second temperature and the first temperature; if the temperature difference is within a preset range, obtain a first test result of the chip to be tested; if the temperature difference is not within the preset range, obtain a second test result of the chip to be tested; the first test result indicates that the chip to be tested is a qualified product, and the second test result indicates that the chip to be tested is not a qualified product.

[0010] In an alternative embodiment, the analog temperature measurement module includes a temperature measurement unit and a signal amplification unit; the temperature measurement unit is electrically connected to the signal amplification unit, and the signal amplification unit is electrically connected to the tester;

[0011] The temperature measurement unit is configured to output a voltage signal to the signal amplification unit according to the actual temperature of the chip under test corresponding to the analog temperature measurement module;

[0012] The signal amplification unit is configured to amplify the voltage signal and send the amplified voltage signal to the tester.

[0013] In an alternative embodiment, the temperature measurement unit includes an analog temperature sensor, and the signal amplification unit includes a signal amplifier; an input end of the analog temperature sensor is electrically connected to a power output end of the tester, an output end of the analog temperature sensor is electrically connected to an input end of the signal amplifier, and an output end of the signal amplifier is electrically connected to the tester.

[0014] In an alternative embodiment, the temperature measurement unit further includes a first capacitor, a second capacitor, a third capacitor, and a first resistor;

[0015] One end of the first capacitor is electrically connected to the input end of the analog temperature sensor, and the other end of the first capacitor is grounded; the second capacitor is connected in parallel with the first capacitor; one end of the first resistor is electrically connected between the output end of the analog temperature sensor and the positive input end of the signal amplifier, the other end of the first resistor is electrically connected to one end of the third capacitor, and the other end of the third capacitor is grounded.

[0016] In an alternative embodiment, the signal amplification unit further includes a fourth capacitor, a second resistor, a third resistor, and a fourth resistor;

[0017] One end of the fourth capacitor is electrically connected to the negative input end of the signal amplifier, and the other end of the fourth capacitor is electrically connected to the output end of the signal amplifier; the second resistor, the third resistor, and the fourth resistor are connected in series between the output end of the signal amplifier and the ground, and the tester is electrically connected between the second resistor and the third resistor.

[0018] In a second aspect, the present invention provides a chip temperature testing method, which is applied to the tester in the temperature measurement system described in the foregoing embodiment, and the method includes:

[0019] Obtain the first temperature detected by the internal sensor of each chip under test and the voltage signal output by each analog temperature measurement module according to the actual temperature of the corresponding chip under test;

[0020] Convert the voltage signal into a second temperature;

[0021] Determine the test result of the chip to be tested according to the first temperature and the second temperature.

[0022] In a third aspect, the present invention provides a chip temperature testing device, which is applied to the tester in the temperature measurement system described in the foregoing embodiment. The device includes:

[0023] A signal acquisition module, configured to acquire the first temperature detected by the internal sensor of each chip to be tested and the voltage signal output by each analog temperature measurement module according to the actual temperature of the corresponding chip to be tested;

[0024] A temperature determination module, configured to convert the voltage signal into a second temperature;

[0025] A test result acquisition module, configured to determine the test result of the chip to be tested according to the first temperature and the second temperature.

[0026] In a fourth aspect, the present invention provides a tester, including a processor and a memory. The memory stores a computer program that can be executed by the processor. The computer program executable by the processor is used to implement the chip temperature testing method described in the foregoing embodiment.

[0027] In a fifth aspect, the present invention provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, it implements the chip temperature testing method described in the foregoing embodiment.

[0028] The chip temperature testing system, method, device, tester and storage medium provided by the embodiments of the present invention. The chip temperature testing system includes a tester and at least one analog temperature measurement module. The analog temperature measurement modules are in one-to-one correspondence with the chips to be tested. The tester is electrically connected to the analog temperature measurement modules and the chips to be tested. The tester is configured to acquire the first temperature detected by the internal sensor of each chip to be tested. The analog temperature measurement module is configured to output a corresponding voltage signal to the tester according to the actual temperature of the corresponding chip to be tested. The tester is further configured to convert the voltage signal into a second temperature and determine the test result of the chip to be tested according to the second temperature and the first temperature. By sending a voltage signal to the tester according to the actual temperature of the chip to be tested through the analog temperature measurement module, the tester does not need to receive digital signals. Therefore, the tester does not need to have digital signal processing capabilities, reducing the cost of the tester and thus reducing the cost of testing the chip temperature. Description of the Drawings

[0029] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0030] Figure 1 Shows a schematic diagram of a chip temperature test system provided by an embodiment of the present invention;

[0031] Figure 2 Shows another schematic diagram of a chip temperature test system provided by an embodiment of the present invention;

[0032] Figure 3 Shows a schematic diagram of a temperature measurement unit provided by an embodiment of the present invention;

[0033] Figure 4 Shows a schematic diagram of a signal amplification unit provided by an embodiment of the present invention;

[0034] Figure 5 Shows a schematic flowchart of a chip temperature test method provided by an embodiment of the present invention;

[0035] Figure 6 Shows a block diagram of a chip temperature test device provided by an embodiment of the present invention;

[0036] Figure 7 Shows a block schematic diagram of a test machine provided by an embodiment of the present invention.

[0037] Icons: 110 - Test machine; 111 - Memory; 112 - Processor; 113 - Communication module; 120 - Chip to be tested; 130 - Analog temperature measurement module; 131 - Temperature measurement unit; 132 - Signal amplification unit; U1 - Analog temperature sensor; U2 - Signal amplifier; R1 - First resistor; R2 - Second resistor; R3 - Third resistor; R4 - Fourth resistor; C1 - First capacitor; C2 - Second capacitor; C3 - Third capacitor; C4 - Fourth capacitor; C5 - Fifth capacitor; C6 - Sixth capacitor; 140 - Power supply; 200 - Chip temperature test device; 210 - Signal acquisition module; 220 - Temperature determination module; 230 - Test result acquisition module. Detailed implementation manners

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0039] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0040] It should be noted that relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprise," "include," or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device that comprises a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article, or device that comprises the element.

[0041] Please refer to Figure 1 , Figure 1 , which shows a schematic diagram of a chip temperature test system provided by an embodiment of the present invention. The chip temperature test system includes a tester 110 and at least one analog temperature measurement module 130. The analog temperature measurement modules 130 correspond to the chips 120 to be tested one by one. The tester 110 is electrically connected to the analog temperature measurement modules and the chips to be tested.

[0042] Among them, the analog temperature measurement module 130 is arranged near the corresponding chip 120 to be tested to measure the actual temperature of the corresponding chip 120 to be tested.

[0043] The tester 110 is used to obtain the first temperature detected by the internal sensor of each chip 120 to be tested.

[0044] In some embodiments, the tester 110 can be electrically connected to the chip 120 to be tested through a test peripheral circuit. Among them, the specific test peripheral circuit is set according to user requirements.

[0045] The analog temperature measurement module 130 is used to output a corresponding voltage signal to the tester 110 according to the actual temperature of the corresponding chip 120 to be tested.

[0046] The tester 110 is further configured to convert the voltage signal into a second temperature, and determine the test result of the chip 120 to be tested according to the second temperature and the first temperature.

[0047] In this embodiment, the conversion relationship between the voltage signal and the second temperature can be preset and stored in the tester 110. When the tester 110 receives the voltage signal, it converts the voltage signal into the second temperature according to the preset conversion relationship.

[0048] The tester 110 can simultaneously measure the temperatures of multiple chips 120 to be tested, improving the efficiency of measuring the chip temperature. Among them, the number of chips to be tested can be one, or the number of chips to be tested can be multiple. Specifically, the number of chips to be tested that the tester 110 can simultaneously measure is determined according to the resources of the tester 110.

[0049] The chip temperature test system provided by the embodiment of the present invention includes a tester and at least one analog temperature measurement module. The analog temperature measurement modules correspond to the chips to be tested one by one. The tester is electrically connected to the analog temperature measurement modules and the chips to be tested. The tester is configured to obtain the first temperature detected by the internal sensor of each chip to be tested. The analog temperature measurement module is configured to output a corresponding voltage signal to the tester according to the actual temperature of the corresponding chip to be tested. The tester is further configured to convert the voltage signal into a second temperature, and determine the test result of the chip to be tested according to the second temperature and the first temperature. By sending a voltage signal to the tester according to the actual temperature of the chip to be tested through the analog temperature measurement module, the tester does not need to receive digital signals, so the tester does not need to have digital signal processing capabilities, reducing the cost of the tester, and thus reducing the cost of measuring the chip temperature.

[0050] To improve the accuracy of the tester 110 in measuring the temperature of the chip to be tested, the tester 110 is further configured to calculate the temperature difference between the second temperature and the first temperature. If the temperature difference is within the preset range, obtain the first test result of the chip to be tested; if the temperature difference is not within the preset range, obtain the second test result of the chip to be tested; the first test result indicates that the chip to be tested is a qualified product, and the second test result indicates that the chip to be tested is not a qualified product.

[0051] The tester 110 calculates the temperature difference for each chip to be tested, and determines the test result of the corresponding chip to be tested according to the temperature difference, without the situation that a non-conforming chip to be tested escapes when determining the test result only according to the temperature detected by the internal sensor of the chip to be tested, thereby improving the accuracy of measuring the temperature of the chip to be tested.

[0052] Please refer toFigure 2 The analog temperature measurement module 130 includes a temperature measurement unit 131 and a signal amplification unit 132. The temperature measurement unit 131 is electrically connected to the signal amplification unit 132, and the signal amplification unit 132 is electrically connected to the tester 110;

[0053] The temperature measurement unit 131 is configured to output a voltage signal to the signal amplification unit 132 according to the actual temperature of the chip under test 120 corresponding to the analog temperature measurement module 130.

[0054] The signal amplification unit 132 is configured to amplify the voltage signal and send the amplified voltage signal to the tester 110.

[0055] It should be noted that the signal amplification unit 132 can increase the intensity of the voltage signal relative to the noise, improve the signal-to-noise ratio, making the voltage signal sent to the tester 110 easier to be recognized by the tester 110. And the test conditions of different chips under test may require different voltage signal intensities. The signal amplification unit 132 can adjust the amplification factor as needed to adapt to different test environments and requirements, thereby improving the accuracy and reliability of measuring the temperature of the chip.

[0056] In some embodiments, the temperature measurement unit 131 includes an analog temperature sensor U1, and the signal amplification unit 132 includes a signal amplifier U2. The input end of the analog temperature sensor U1 is electrically connected to the power output end of the tester 110, the output end of the analog temperature sensor U1 is electrically connected to the input end of the signal amplifier U2, and the output end of the signal amplifier U2 is electrically connected to the tester 110.

[0057] Among them, the analog temperature sensor U1 may include a thermocouple, a thermal resistor, a diode temperature sensor, a transistor temperature sensor, etc., which are not limited herein.

[0058] In some embodiments, the accuracy of the analog temperature sensor U1 and the amplification factor of the signal amplifier U2 can be adjusted according to the test requirements.

[0059] Please refer to Figure 3 , the temperature measurement unit 131 further includes a first capacitor C1, a second capacitor C2, a third capacitor C3, and a first resistor R1.

[0060] One end of the first capacitor C1 is electrically connected to the input end of the analog temperature sensor U1, and the other end of the first capacitor C1 is grounded; the second capacitor C2 is connected in parallel with the first capacitor C1; one end of the first resistor R1 is electrically connected between the output end of the analog temperature sensor U1 and the positive input end of the signal amplifier U2, and the other end of the first resistor R1 is electrically connected to one end of the third capacitor C3, and the other end of the third capacitor C3 is grounded.

[0061] Among them, the parallel connection of the first capacitor C1 and the second capacitor C2 can form a low-pass filter to reduce the influence of high-frequency noise on the input signal of the analog temperature sensor U1. The series connection of the first resistor R1, the third capacitor C3 and the resistor can form a low-pass filter to filter out the high-frequency noise from the analog temperature sensor U1 or the external environment, so that the voltage signal output by the analog temperature sensor U1 is more stable.

[0062] Please refer to Figure 4 , the signal amplification unit 132 further includes a fourth capacitor C4, a second resistor R2, a third resistor R3 and a fourth resistor R4.

[0063] One end of the fourth capacitor C4 is electrically connected to the negative input terminal of the signal amplifier U2, and the other end of the fourth capacitor C4 is electrically connected to the output terminal of the signal amplifier U2; the second resistor R2, the third resistor R3 and the fourth resistor R4 are connected in series between the output terminal of the signal amplifier U2 and the ground, and the tester 110 is electrically connected between the second resistor R2 and the third resistor R3.

[0064] Among them, the fourth capacitor C4 can provide a low-impedance path to stabilize the voltage signal output by the signal amplifier U2. The amplification factor of the signal amplifier U2 is determined by the third resistor R3 and the fourth resistor R4, and the amplification factor of the signal amplifier U2 is 1 plus the ratio of the resistance value of the third resistor R3 to the resistance value of the fourth resistor R4.

[0065] In some embodiments, the signal amplification unit 132 further includes a fifth capacitor C5 and a sixth capacitor C6.

[0066] One end of the sixth capacitor C6 is electrically connected to the power input terminal of the signal amplifier U2, and the other end of the sixth capacitor C6 is grounded; the fifth capacitor C5 is connected in parallel with the sixth capacitor C6.

[0067] Among them, the parallel connection of the fifth capacitor C5 and the sixth capacitor C6 can form a low-pass filter to reduce the influence of high-frequency noise on the power supply input to the signal amplifier U2 from the power supply 140.

[0068] The chip temperature testing system provided by an embodiment of the present invention includes a tester and at least one analog temperature measurement module. The analog temperature measurement modules correspond to the chips to be tested one by one. The tester is electrically connected to the analog temperature measurement modules and the chips to be tested. The tester is configured to obtain a first temperature detected by an internal sensor of each chip to be tested. The analog temperature measurement module is configured to output a corresponding voltage signal to the tester according to the actual temperature of the corresponding chip to be tested. The tester is further configured to convert the voltage signal into a second temperature, and determine a test result of the chip to be tested according to the second temperature and the first temperature. By sending a voltage signal to the tester according to the actual temperature of the chip to be tested through the analog temperature measurement module, the tester does not need to receive digital signals, so the tester does not need to have digital signal processing capabilities, reducing the cost of the tester, and thus reducing the cost of testing the chip temperature.

[0069] Please refer to Figure 5 , Figure 5 which shows a schematic flowchart of a chip temperature testing method provided by an embodiment of the present invention. This chip temperature testing method can be applied to the tester in the above temperature measurement system. Taking the chip temperature testing as an example, the specific process of this embodiment will be described below. The following will elaborate in detail on the Figure 5 process shown below. The chip temperature testing method can specifically include the following steps:

[0070] Step 110: Obtain a first temperature detected by an internal sensor of each chip to be tested and a voltage signal output by each analog temperature measurement module according to the actual temperature of the corresponding chip to be tested.

[0071] Step 120: Convert the voltage signal into a second temperature.

[0072] In some embodiments, a conversion relationship between the voltage signal and the second temperature is preset and stored in the tester. The tester can convert the voltage signal into the second temperature according to the preset conversion relationship.

[0073] Step 130: Determine a test result of the chip to be tested according to the first temperature and the second temperature.

[0074] The tester can calculate the temperature difference between the second temperature and the first temperature. If the temperature difference is within a preset range, obtain a first test result of the chip to be tested; if the temperature difference is not within the preset range, obtain a second test result of the chip to be tested; the first test result indicates that the chip to be tested is a qualified product, and the second test result indicates that the chip to be tested is not a qualified product.

[0075] The chip temperature testing method provided by the embodiments of the present invention obtains the first temperature detected by the internal sensor of each chip to be tested and the voltage signal output by each analog temperature measurement module according to the actual temperature of the corresponding chip to be tested, converts the voltage signal into a second temperature, and determines the test result of the chip to be tested based on the first temperature and the second temperature. The testing machine calculates the temperature difference for each chip to be tested and determines the test result of the corresponding chip to be tested according to the temperature difference, and there will be no situation where unqualified chips to be tested escape by only determining the test result based on the temperature of the internal sensor of the chip to be tested, thereby improving the accuracy of testing the chip temperature.

[0076] To execute the corresponding steps in the above embodiments and various possible ways, an implementation manner of a chip temperature testing device 200 is given below. Further, please refer to Figure 6 , the figure is a functional module diagram of a chip temperature testing device 200 provided by the embodiments of the present invention. It should be noted that the basic principle and the technical effects generated by the chip temperature testing device 200 provided in this embodiment are the same as those in the above embodiments. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the above embodiments. The chip temperature testing device 200 includes: a signal acquisition module 210, a temperature determination module 220, and a test result acquisition module 230, where:

[0077] The signal acquisition module 210 is configured to obtain the first temperature detected by the internal sensor of each chip to be tested and the voltage signal output by each analog temperature measurement module according to the actual temperature of the corresponding chip to be tested;

[0078] The temperature determination module 220 is configured to convert the voltage signal into a second temperature;

[0079] The test result acquisition module 230 is configured to determine the test result of the chip to be tested based on the first temperature and the second temperature.

[0080] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described devices and modules can refer to the corresponding processes in the foregoing method embodiments, and will not be described herein again.

[0081] In several embodiments provided by the present invention, the coupling between modules can be electrical, mechanical, or other forms of coupling.

[0082] In addition, in each embodiment of the present invention, the functional modules can be integrated in a processing module, or each module can exist physically alone, or two or more modules can be integrated in one module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software functional modules.

[0083] Please refer to Figure 7 , which is a block diagram of the testing machine 110 provided by an embodiment of the present invention. The testing machine 110 includes a memory 111, a processor 112, and a communication module 113. Each of the memory 111, the processor 112, and the communication module 113 is directly or indirectly electrically connected to each other to achieve data transmission or interaction. For example, these components can be electrically connected to each other through one or more communication buses or signal lines.

[0084] Among them, the memory 111 is used to store programs or data. The memory 111 can be, but is not limited to, a random access memory 111 (RAM), a read-only memory 111 (ROM), a programmable read-only memory 111 (PROM), an erasable programmable read-only memory 111 (EPROM), an electrically erasable programmable read-only memory 111 (EEPROM), etc.

[0085] The processor 112 is used to read / write the data or programs stored in the memory 111 and perform corresponding functions. For example, when the computer program stored in the memory 111 is executed by the processor 112, the chip temperature testing methods disclosed in the above embodiments can be implemented.

[0086] The communication module 113 is used to establish a communication connection between the testing machine 110 and the server through a network and is used to transmit and receive data through the network.

[0087] It should be understood that Figure 7 the structure shown is only a schematic diagram of the structure of the testing machine 110, and the testing machine 110 may further include more or fewer components than those shown Figure 7 in. Figure 7 Each of the components shown in can be implemented by hardware, software, or a combination thereof.

[0088] An embodiment of the present invention also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by the processor 112, the chip temperature testing method described in the above method embodiments can be implemented.

[0089] A computer-readable storage medium may be an electronic memory such as a flash memory, EEPROM (Electrically Erasable Programmable Read-Only Memory 111), EPROM, a hard disk, or a ROM. Optionally, the computer-readable storage medium includes a non-transitory computer-readable storage medium. The computer-readable storage medium has a storage space for program code that executes any of the method steps in the above-described method. This program code may be read from or written to one or more computer program products. The program code may be compressed, for example, in a suitable form.

[0090] In several embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architectures, functions, and operations of apparatuses, methods, and computer program products according to multiple embodiments of the present invention. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, may be implemented by a dedicated hardware-based system that performs the specified functions or actions, or may be implemented by a combination of dedicated hardware and computer instructions.

[0091] If a function is implemented in the form of a software functional module and sold or used as an independent product, it may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of this technical solution, may be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in various embodiments of the present invention. The aforementioned storage medium includes: various media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk, or an optical disc that can store program code.

[0092] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A chip temperature testing system, characterized in that: The chip temperature testing system comprises a testing machine and at least one analog temperature measurement module, wherein the analog temperature measurement module corresponds to the chip to be tested one by one, and the testing machine is electrically connected to the analog temperature measurement module and the chip to be tested; The testing machine is used to obtain a first temperature detected by an internal sensor of each chip to be tested; The analog temperature measurement module is used to output a corresponding voltage signal to the tester according to the actual temperature of the corresponding chip to be tested; The tester is also used to convert the voltage signal into a second temperature, and determine the test result of the chip to be tested according to the second temperature and the first temperature; The testing machine is used to calculate the temperature difference between the second temperature and the first temperature; If the temperature difference is within a preset range, obtaining a first test result of the chip to be tested; If the temperature difference is not within the preset range, obtaining a second test result of the chip to be tested; The first test result indicates that the chip to be tested is a qualified product, and the second test result indicates that the chip to be tested is not a qualified product.

2. The chip temperature testing system according to claim 1, characterized in that: The analog temperature measurement module includes a temperature measurement unit and a signal amplification unit; the temperature measurement unit is electrically connected to the signal amplification unit, and the signal amplification unit is electrically connected to the test machine; The temperature measurement unit is used to output a voltage signal to the signal amplification unit according to the actual temperature of the chip to be tested corresponding to the analog temperature measurement module; The signal amplifying unit is used to amplify the voltage signal and send the amplified voltage signal to the testing machine.

3. The chip temperature testing system according to claim 2, characterized in that: The temperature measurement unit includes an analog temperature sensor, and the signal amplification unit includes a signal amplifier; the input end of the analog temperature sensor is electrically connected to the power output end of the test machine, the output end of the analog temperature sensor is electrically connected to the input end of the signal amplifier, and the output end of the signal amplifier is electrically connected to the test machine.

4. The chip temperature testing system according to claim 3, characterized in that: The temperature measurement unit further includes a first capacitor, a second capacitor, a third capacitor and a first resistor; One end of the first capacitor is electrically connected to the input end of the analog temperature sensor, and the other end of the first capacitor is grounded; the second capacitor is connected in parallel with the first capacitor; one end of the first resistor is electrically connected between the output end of the analog temperature sensor and the positive input end of the signal amplifier, the other end of the first resistor is electrically connected to one end of the third capacitor, and the other end of the third capacitor is grounded.

5. The chip temperature testing system according to claim 3, characterized in that: The signal amplifying unit further includes a fourth capacitor, a second resistor, a third resistor and a fourth resistor; One end of the fourth capacitor is electrically connected to the negative input terminal of the signal amplifier, and the other end of the fourth capacitor is electrically connected to the output terminal of the signal amplifier; the second resistor, the third resistor and the fourth resistor are connected in series between the output terminal of the signal amplifier and the ground, and the test machine is electrically connected between the second resistor and the third resistor.

6. A chip temperature testing method, characterized in that: Applied to the chip temperature testing system of claim 1, the method comprising: Acquire a first temperature detected by an internal sensor of each of the chips to be tested and a voltage signal output by each of the analog temperature measurement modules according to an actual temperature of the corresponding chip to be tested; converting the voltage signal into a second temperature; A test result of the chip to be tested is determined according to the first temperature and the second temperature.

7. A chip temperature testing device, characterized in that: The chip temperature testing system according to claim 1, wherein the device comprises: A signal acquisition module, used to acquire a first temperature detected by an internal sensor of each of the chips to be tested and a voltage signal output by each of the analog temperature measurement modules according to an actual temperature of the corresponding chip to be tested; a temperature determination module, configured to convert the voltage signal into a second temperature; The test result obtaining module is used to determine the test result of the chip to be tested according to the first temperature and the second temperature.

8. A testing machine, characterized in that: The device comprises a processor and a memory, wherein the memory stores a computer program executable by the processor, and the processor can execute the computer program to implement the chip temperature testing method according to claim 6.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by the processor, the chip temperature testing method according to claim 6 is implemented.

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