A high-isolation microwave clustering assembly

Abstract

This invention relates to the fields of radio frequency and microwave technology, and particularly to a high-isolation microwave clustering assembly, comprising: a base having a plurality of recessed cavities, the edges of which are provided with isolation bosses; a top cover having an isolation groove on the side of the top cover near the base that mates with the isolation bosses, the isolation groove containing a conductive material filling layer; a microwave device PCB disposed within the recessed cavities; and connectors including a first connector and a second connector respectively disposed at both ends of the microwave device PCB. The conductive material filling layer is disposed in the slit between the isolation bosses and the isolation grooves, actively establishing an electrical connection between the base and the top cover, greatly reducing backflow crosstalk; this crosstalk reduction method does not rely on mechanical fit, resulting in stable performance and high device consistency. The plurality of recessed cavities with top openings simplify the assembly of the microwave clustering assembly; simultaneously, the isolation grooves and their mating with the isolation bosses simplify the assembly of the conductive filling material.

Description

Technical Field

[0001] This invention relates to the fields of radio frequency and microwave technology, and more particularly to a high-isolation microwave clustering assembly. Background Technology

[0002] Expanding the number of qubits is fundamental to building practical superconducting quantum computers. However, as the number of qubits increases, the number of microwave components such as filters and attenuators required in superconducting quantum measurement and control systems also rises rapidly. Given the limited and precious internal space and cooling power of dilution refrigerators, increasing the integration of these components is crucial.

[0003] Most existing microwave component integration schemes for superconducting quantum computing adopt a clustered structure. A clustered assembly combines multiple functionally similar or complementary components to form a tightly integrated whole, which reduces the number of independent components and interconnection complexity in the system. On the other hand, to achieve high-fidelity manipulation and readout of qubits, it is necessary to significantly reduce channel crosstalk or improve channel isolation in the measurement and control system. Existing clustered assembly structures fall into two categories: one encapsulates multiple PCBs in independent cavities, offering relatively high channel isolation but complex connector and PCB assembly; the other encapsulates multiple PCBs in a single cavity, simplifying assembly but resulting in low channel isolation.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide a high-isolation microwave clustering assembly, which aims to solve the problems of complex assembly and low channel isolation of existing clustering assemblies.

[0006] The technical solution of the present invention is as follows:

[0007] A high-isolation microwave beamforming assembly, comprising:

[0008] The base has several grooved cavities, and the edges of the grooved cavities are provided with isolation protrusions;

[0009] The top cover has an isolation groove on the side near the base that mates with the isolation boss, and the isolation groove is filled with a conductive material layer.

[0010] A microwave device PCB is disposed within the recessed cavity;

[0011] The connector includes a first connector and a second connector respectively disposed at both ends of the PCB of the microwave device.

[0012] In the high-isolation microwave clustering assembly, the conductive material filling layer is selected from one or more of solder paste, solder, conductive adhesive, and conductive tape.

[0013] The high-isolation microwave clustering assembly, wherein a plurality of the grooved cavities are arranged in parallel.

[0014] The high-isolation microwave clustering assembly further includes a first connector fixing member and a second connector fixing member disposed on both sides of the groove cavity, and a fixing member for fixing the high-isolation microwave clustering assembly to the carrier; the first connector fixing member is disposed within the fixing member.

[0015] The high-isolation microwave clustering assembly has through holes on both the side of the groove cavity near the first connector fixing member and the side near the second connector fixing member; both the first connecting fixing member and the second connector fixing member have connector fixing holes corresponding to the groove cavity.

[0016] The high-isolation microwave clustering assembly further includes an insulator disposed between the microwave device PCB and the connector.

[0017] The high-isolation microwave clustering assembly includes an insulator comprising an outer conductor and a center conductor passing through the center of the outer conductor; the center conductor includes a first pin and a second pin; the first pin is connected to the connector, and the second pin is connected to the microwave device PCB.

[0018] In the high-isolation microwave clustering assembly, both the first connector and the second connector are provided with pin sockets, and the first pin is electrically connected to the pin sockets.

[0019] The high-isolation microwave clustering assembly, wherein a solder paste layer or conductive adhesive layer is provided between the microwave device PCB and the bottom of the recessed cavity.

[0020] The high-isolation microwave clustering assembly is provided in which the base is provided with a plurality of first fixing holes, the top cover is provided with a second fixing hole that mates with the first fixing holes, and the base and the top cover are fixed together by bolts passing through the first fixing holes and the second fixing holes.

[0021] Beneficial Effects: This invention provides a high-isolation microwave clustering assembly, comprising: a base having a plurality of recessed cavities, the edges of which are provided with isolation bosses; a top cover having an isolation groove on the side of the top cover near the base that mates with the isolation bosses, the isolation groove containing a conductive material filling layer; a microwave device PCB disposed within the recessed cavities; and connectors including a first connector and a second connector respectively disposed at both ends of the microwave device PCB. This invention provides a conductive material filling layer in the slit between the isolation bosses and the isolation grooves, which can actively establish an electrical connection between the base and the top cover, greatly reducing backflow crosstalk. This crosstalk reduction method does not rely on mechanical fit, resulting in stable performance and high device consistency. Furthermore, the multiple recessed cavities with top openings simplify the assembly of the microwave clustering assembly; the isolation grooves mate with the isolation bosses, simplifying the assembly of the conductive filling material. Additionally, due to the simplified assembly of the high-isolation microwave clustering assembly, the overall yield of the assembly is significantly improved. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the exploded structure of a high-isolation microwave clustering assembly according to the present invention;

[0023] Figure 2 This is a structural diagram of the top cover and base;

[0024] Figure 3 This is a schematic diagram of the structure of an insulator and a connector.

[0025] Figure 4 Comparison diagram of near-neighbor crosstalk for microwave clustering assemblies without top covers, microwave clustering assemblies with top covers but without conductive material filling layers, and microwave clustering assemblies with top covers and conductive material filling layers.

[0026] Explanation of reference numerals in the attached drawings: base 10, groove cavity 11, through hole 111, isolation boss 12, second connector fixing member 13, connector fixing hole 131, fixing member 14, component fixing hole 141, first fixing hole 15, top cover 20, isolation groove 21, second fixing hole 22, microwave device PCB 30, connector 40, first connector 41, pin socket 411, second connector 42, insulator 50, outer conductor 51, center conductor 52, first pin 521, second pin 522, bolt 60. Detailed Implementation

[0027] This invention provides a high-isolation microwave clustering assembly. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention is further described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0028] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," and "rear," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of the stated features.

[0029] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0030] like Figures 1-2 As shown, the present invention provides a high-isolation microwave beamforming assembly, comprising:

[0031] The base 10 is provided with a plurality of grooved cavities 11, and the edges of the grooved cavities 11 are provided with isolation protrusions 12;

[0032] The top cover 20 has an isolation groove 21 that mates with the isolation boss 12 on the side of the top cover 20 near the base 10, and the isolation groove 21 is filled with a conductive material layer.

[0033] The microwave device PCB30 is disposed within the recessed cavity 11;

[0034] The connector 40 includes a first connector 41 and a second connector 42 respectively disposed at both ends of the microwave device PCB.

[0035] In this embodiment, a conductive material filling layer is provided in the slit between the isolation boss 12 and the isolation groove 21, which can actively establish an electrical connection between the base 10 and the top cover 20, greatly reducing backflow crosstalk and significantly improving channel isolation. This method of reducing crosstalk does not rely on mechanical fit, has stable performance, and high device consistency. Furthermore, the present invention simplifies the assembly of the microwave clustering assembly by providing several groove cavities 11 with top openings; at the same time, providing the isolation groove 21 and making it cooperate with the isolation boss 12 simplifies the assembly of the conductive filling material. In addition, due to the ease of assembly of the high-isolation microwave clustering assembly, the overall yield of the assembly will be significantly improved.

[0036] Specifically, in this invention, the microwave device PCB 30 is respectively disposed within a plurality of the recessed cavities 11, and the edges of the recessed cavities 11 are raised to form isolation bosses 12. An isolation groove 21 is provided on the top cover 20 to cooperate with the isolation bosses 12. When the top cover 20 is placed on the base 10, the isolation bosses 12 are embedded in the isolation grooves 21 and abut against the conductive material filling layer disposed within the isolation grooves 21. This actively establishes an electrical connection between the base 10 and the top cover 20, greatly reducing backflow crosstalk and significantly improving channel isolation. Furthermore, this method of reducing crosstalk does not rely on mechanical fit, ensuring stable performance and high device consistency. Moreover, the high-isolation microwave clustering assembly of this invention mainly consists of the base 10, the top cover 20, the microwave device PCB 30, and the connector 40. The base and top cover are detachably assembled into a microwave clustering assembly, offering the advantage of simple assembly and improving the overall yield of the microwave clustering assembly.

[0037] It should be explained that since microwave devices, such as surface mount filters, can be mounted on PCBs, and corresponding routing patterns can be directly designed to achieve filtering functions, they are generally referred to as microwave device PCBs.

[0038] In some embodiments, the conductive material filling layer is selected from one or more of solder paste, solder, conductive adhesive, and conductive tape.

[0039] Specifically, by using one or more of the following as conductive material filling layers—molten solder paste, molten solder, conductive adhesive, or conductive tape—an electrical connection can be effectively established between the base 10 and the top cover 20, greatly reducing backflow crosstalk and significantly improving channel isolation.

[0040] In some embodiments, several of the groove cavities 11 are arranged in parallel. Arranging the groove cavities 11 in a parallel manner can eliminate electromagnetic signal backflow crosstalk and make the structure of the microwave cluster assembly more reasonable.

[0041] In some embodiments, the base 10 further includes a first connector fixing member and a second connector fixing member 13 disposed on both sides of the groove cavity 11, and a fixing member 14 for fixing the high isolation microwave cluster assembly to the carrier; the first connector fixing member is disposed within the fixing member 14.

[0042] Specifically, a plurality of the grooved cavities 11 are arranged in parallel. The first connector fixing member and the second connector fixing member 13 are disposed on both sides of the parallel arrangement direction of the grooved cavities 11. That is, the first connector fixing member and the second connector fixing member 13 are provided on both sides of the parallel arrangement direction of the grooved cavities 11, such that a plurality of grooved cavities 11 are sandwiched between the first connector fixing member and the second connector fixing member 13, and both ends of each grooved cavity 11 abut against the first connector fixing member and the second connector fixing member 13. The first connector fixing member and the second connector fixing member 13 are used to fix the connector, ensuring that the signal leakage path of the side wall through hole is completely blocked. The high isolation microwave clustering assembly can be fixed to the carrier using the fixing member 14. The fixing member 14 is provided with an assembly fixing hole 141, which allows the high isolation microwave clustering assembly to be detachably fixed to the carrier. For structural simplicity, the fixing member 14 covers the first connector fixing member, but the fixing member 14 has an opening on the side opposite to the groove cavity 11, which facilitates fixing the connector to the first connector fixing member.

[0043] In some embodiments, the groove cavity 11 is provided with through holes 111 on the side near the first connector fixing member and the side near the second connector fixing member 13; the first connecting fixing member and the second connector fixing member 13 are both provided with connector fixing holes 131 corresponding to the groove cavity 11.

[0044] In some embodiments, the high-isolation microwave clustering assembly further includes an insulator 50 disposed between the microwave device PCB 30 and the connector 40.

[0045] Specifically, the connector fixing hole 131 is provided with an internal thread, and the connector 40 is provided with an external thread that matches the internal thread of the connector fixing hole 131. The threaded structure allows the connector 40 to be fixed on the first connecting fastener and the second connector fastener 13. The threaded locking structure allows the connector 40 to be fixed on the base 10. This ensures that the signal leakage path of the through hole 111 on the side wall is completely blocked. By combining the conductive material filling layer provided in the isolation groove 21, the channel isolation of the cluster assembly can reach the same level as that of all microwave device PCBs packaged in independent cavities. The channel isolation can be stably greater than 90dB.

[0046] In some embodiments, the insulator 50 is a glass insulator.

[0047] In some implementations, such as Figure 3 As shown, the insulator 50 includes an outer conductor 51 and a center conductor 52 passing through the center of the outer conductor 51; the center conductor 52 includes a first pin 521 and a second pin 522; the first pin 521 is connected to the connector 40, and the second pin 522 is connected to the microwave device PCB 30.

[0048] In some implementations, such as Figure 3 As shown, both the first connector 41 and the second connector 42 are provided with pin sockets 411, and the first pin 521 is electrically connected to the pin sockets 411.

[0049] Specifically, in traditional fully discrete cavity microwave clustering assemblies, all microwave device PCBs are encapsulated in separate internal cavities, which only contain openings in two connector directions. Electrical connection between the connector's center pin and the microwave device PCB is inconvenient. In contrast, the present invention features several open grooves on the base. After placing the microwave device PCB into these grooves, the connection points between the first pin and the pin socket, and between the second pin and the microwave device PCB, can be soldered first, simplifying assembly. Furthermore, the isolation groove 21, filled with a conductive material layer, allows for better cooperation between the isolation groove and the isolation boss, establishing an electrical connection between the base 10 and the top cover 20, significantly reducing backflow crosstalk and substantially improving channel isolation.

[0050] Furthermore, the entire device is connected via a microwave device PCB-insulator-connector configuration. The insulator and connector are flexibly connected via pins and sockets. This flexible connection ensures that the electrical connection will not fail due to thermal expansion and contraction during component temperature rise and fall, thus enhancing the reliability of the component.

[0051] In some embodiments, a solder paste layer or conductive adhesive layer is provided between the microwave device PCB30 and the bottom of the recessed cavity 11. The solder paste layer or conductive adhesive layer is used to establish an electrical connection between the microwave device PCB30 and the base 10.

[0052] In some embodiments, the base 10 is provided with a plurality of first fixing holes 15, and the top cover 20 is provided with second fixing holes 22 that mate with the first fixing holes 15. The base 10 and the top cover 20 are fixed together by bolts 60 passing through the first fixing holes 15 and the second fixing holes 22. Assembling the base 10 and the top cover 20 with the bolts 60 makes the high-isolation microwave clustering assembly detachable, facilitating later maintenance and extending the service life of the assembly.

[0053] Specifically, to demonstrate the advantages of the high-isolation microwave clustering assembly provided by this invention, microwave clustering assemblies without a top cover (uncovered), microwave clustering assemblies with a cover but without a conductive material filling layer (covered but not filled), and microwave clustering assemblies with a cover and a conductive material filling layer (covered and filled) were used as test objects. Their near-neighbor crosstalk comparison diagrams are shown below. Figure 4 As shown, without the cover closed, the maximum adjacent crosstalk is approximately -45dB; with the cover closed but without using conductive filler material to fill the gap, the maximum adjacent crosstalk is approximately -36dB, indicating that the presence of the gap actually reduces channel isolation. After using molten solder paste as a conductive filler layer, the adjacent crosstalk is reduced to below -80dB, indicating that the conductive filler material placed in the gap has a significant effect on improving isolation.

[0054] In summary, the present invention provides a high-isolation microwave clustering assembly, comprising: a base having a plurality of recessed cavities, the edges of which are provided with isolation bosses; a top cover having an isolation groove on the side of the top cover near the base that mates with the isolation bosses, the isolation groove containing a conductive material filling layer; a microwave device PCB disposed within the recessed cavities; and connectors including a first connector and a second connector respectively disposed at both ends of the microwave device PCB. The present invention provides a conductive material filling layer in the slit between the isolation bosses and the isolation grooves, which can actively establish an electrical connection between the base and the top cover, greatly reducing backflow crosstalk; this method of reducing crosstalk does not rely on mechanical fit, resulting in stable performance and high device consistency. Furthermore, the present invention simplifies the assembly of the microwave clustering assembly by providing a plurality of recessed cavities with top openings; simultaneously, the isolation grooves and their mating with the isolation bosses simplify the assembly of the conductive filling material. In addition, due to the ease of assembly of the high-isolation microwave clustering assembly, the overall yield of the assembly is significantly improved.

[0055] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A high-isolation microwave clustering assembly, characterized in that, include: The base has several grooved cavities, and the edges of the grooved cavities are provided with isolation protrusions; The top cover has an isolation groove on the side near the base that mates with the isolation boss, and the isolation groove is filled with a conductive material layer. A microwave device PCB is disposed within the recessed cavity; The connector includes a first connector and a second connector respectively disposed at both ends of the PCB of the microwave device; The high-isolation microwave clustering assembly further includes an insulator disposed between the microwave device PCB and the connector; the insulator includes an outer conductor and a center conductor passing through the center of the outer conductor; the center conductor includes a first pin and a second pin; the first pin is connected to the connector, and the second pin is connected to the microwave device PCB; both the first connector and the second connector are provided with pin sockets, and the first pin is electrically connected to the pin sockets.

2. The high-isolation microwave clustering assembly according to claim 1, characterized in that, The conductive material filling layer is selected from one or more of solder paste, solder, conductive adhesive, and conductive tape.

3. The high-isolation microwave clustering assembly according to claim 1, characterized in that, Several of the grooved cavities are arranged in parallel.

4. The high-isolation microwave clustering assembly according to claim 1, characterized in that, The base also includes a first connector fixing member and a second connector fixing member disposed on both sides of the groove cavity, and a fixing member for fixing the high isolation microwave cluster assembly to the carrier; the first connector fixing member is disposed within the fixing member.

5. The high-isolation microwave clustering assembly according to claim 4, characterized in that, The groove cavity has through holes on both the side near the first connector fixing member and the side near the second connector fixing member; both the first connector fixing member and the second connector fixing member have connector fixing holes corresponding to the groove cavity.

6. The high-isolation microwave clustering assembly according to claim 1, characterized in that, A solder paste layer or conductive adhesive layer is provided between the microwave device PCB and the bottom of the recessed cavity.

7. The high-isolation microwave clustering assembly according to claim 1, characterized in that, The base is provided with a plurality of first fixing holes, and the top cover is provided with a second fixing hole that mates with the first fixing holes. The base and the top cover are fixed together by bolts passing through the first fixing holes and the second fixing holes.

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