Power amplifier chip, electronic device, control method and device

Abstract

The application discloses a power amplifier chip, an electronic device, a control method and a device, wherein the power amplifier chip comprises a first power amplifier module and a control module; an input end of the first power amplifier module is connected to at least one group of audio signal input pins of the power amplifier chip; an output end of the first power amplifier module is connected to at least one group of audio signal output pins of the power amplifier chip; and a plurality of groups of parallel power tube paths are arranged between the input end and the output end of the first power amplifier module; the control module is connected to a control end of the first power amplifier module; and the control module is used for controlling the plurality of groups of power tube paths to be in a conduction state or a disconnected state between the input end and the output end of the first power amplifier module.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of communication, and particularly relates to a power amplifier chip, an electronic device, a control method and device. BACKGROUND

[0002] With the development of electronic devices such as mobile phones and tablets, and the increasing demand of users for scenarios such as audio-visual entertainment, the audio output of electronic devices gradually increases from a single speaker to stereo sound, and even more channels. Electronic devices with audio output functions usually use audio power amplifiers (PA) to drive passive devices such as loudspeakers. The current PA module (or PA chip) usually has a fixed amplification power, but in actual audio output scenarios, there may be a segment of audio signal that requires high power, which may cause the PA module or PA chip to fail to meet the power amplification requirement, or a segment of audio signal that requires low power, which may cause waste of power consumption. SUMMARY

[0003] The purpose of the embodiments of the present application is to provide a power amplifier chip, an electronic device, a control method and device, which can solve the problem that the current PA module or PA chip cannot meet the power amplification requirement or waste power consumption.

[0004] In a first aspect, the embodiments of the present application provide a power amplifier chip, comprising: a first power amplifier module, a control module, and at least one boost module.

[0005] The input end of the first power amplifier module is connected to at least one group of audio signal input pins of the power amplifier chip, the output end of the first power amplifier module is connected to at least one group of audio signal output pins of the power amplifier chip, and a plurality of groups of parallel power tube paths are arranged between the input end and the output end of the first power amplifier module.

[0006] Each boost module is connected to the first power amplifier module, and the boost module is used to supply power to one or more groups of power tube paths in the first power amplifier module.

[0007] The control module is connected to the control end of the first power amplifier module and each boost module, and the control module is used to control a plurality of groups of power tube paths to be in a conduction state or a disconnected state between the input end and the output end of the first power amplifier module.

[0008] In a second aspect, the embodiments of the present application provide an electronic device comprising the power amplifier chip as described above.

[0009] In a third aspect, the embodiments of the present application provide a control method of a power amplifier chip, applied to the power amplifier chip as described above, and the method comprises:

[0010] obtaining a load impedance of each group of audio signal output terminals of the power amplifier chip, and / or obtaining a value of a digital audio signal in a preset time period;

[0011] controlling a plurality of groups of the power tube paths to be in a conducting state or a disconnected state between the input terminal and the output terminal of the first power amplifier module according to the load impedance and / or the value of the digital audio signal, and / or adjusting a voltage value at which the voltage boosting module supplies power to one or more groups of the power tube paths.

[0012] In a fourth aspect, an embodiment of the present application provides a control device of a power amplifier chip, applied to the power amplifier chip as described above, and including:

[0013] an obtaining module, configured to obtain a load impedance of each group of audio signal output terminals of the power amplifier chip, and / or obtain a value of a digital audio signal in a preset time period;

[0014] a control module, configured to control a plurality of groups of the power tube paths to be in a conducting state or a disconnected state between the input terminal and the output terminal of the first power amplifier module according to the load impedance and / or the value of the digital audio signal, and / or adjust a voltage value at which the voltage boosting module supplies power to one or more groups of the power tube paths.

[0015] In a fifth aspect, an embodiment of the present application provides a readable storage medium, on which a program or instructions are stored, and the program or instructions are executed by a processor to implement the steps of the control method of the power amplifier chip according to the third aspect.

[0016] In a sixth aspect, an embodiment of the present application provides a computer program product stored in a storage medium, and the program product is executed by at least one processor to implement the steps of the control method of the power amplifier chip according to the third aspect.

[0017] In the embodiments of the present application, by arranging a plurality of groups of parallel power tube paths between the input terminal and the output terminal of the first power amplifier module of the power amplifier chip, and by the control module controlling a plurality of groups of the power tube paths to be in a conducting state or a disconnected state between the input terminal and the output terminal of the first power amplifier module, the number of power tube paths accessed by different groups of audio transmission channels can be flexibly adjusted, and the number of power tube paths accessed by the same group of audio transmission channels at different times can be flexibly adjusted, that is, the power allocation capability of the power amplifier chip is realized, power consumption waste can be reduced in the case of low power requirement, and the power amplification requirement can be met in the case of high power requirement, thereby solving the problem that the current PA module or PA chip cannot meet the power amplification requirement or waste power consumption. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1A is a schematic diagram of a power amplifier chip according to an embodiment of the present application;

[0019] Figure 1B is a schematic diagram of a power amplifier chip according to an embodiment of the present application;

[0020] Figure 2 is a schematic diagram of a first power amplifier module according to an embodiment of the present application;

[0021] Figure 3 is a schematic diagram of a first power amplifier module and a second power amplifier module according to an embodiment of the present application;

[0022] Figure 4A is a schematic diagram of a first power amplifier module according to an embodiment of the present application;

[0023] Figure 4B is a schematic diagram of a connection of a boost module according to an embodiment of the present application;

[0024] Figure 5 is a flowchart of a control method of a power amplifier chip according to an embodiment of the present application;

[0025] Figure 6 is a flowchart of a control method of a power amplifier chip according to an embodiment of the present application;

[0026] Figure 7 is a flowchart of a control method of a power amplifier chip according to an embodiment of the present application;

[0027] Figure 8 is a flowchart of a control method of a power amplifier chip according to an embodiment of the present application;

[0028] Figure 9 is a schematic diagram of a signal and voltage state when a single boost module is powered according to an embodiment of the present application;

[0029] Figure 10A is a graph of a relationship between power amplifier efficiency and output power according to an embodiment of the present application;

[0030] Figure 10B is a graph of a relationship between distortion and output power according to an embodiment of the present application;

[0031] Figure 11 is a flowchart of a control method of a power amplifier chip according to an embodiment of the present application;

[0032] Figure 12 is a block diagram of a control device of a power amplifier chip according to an embodiment of the present application;

[0033] Figure 13 is a block diagram of an electronic device according to an embodiment of the present application;

[0034] Figure 14Figure 2 is a block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0036] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and do not limit the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally represents an "or" relationship between the objects before and after it.

[0037] As shown in Figure 1A , Figure 1B and Figure 2 , the present application provides a power amplifier chip, comprising: a first power amplifier module 10, a control module 20, at least one voltage boosting module 90;

[0038] The input end of the first power amplifier module 10 is connected to at least one group of audio signal input pins of the power amplifier chip, the output end of the first power amplifier module 10 is connected to at least one group of audio signal output pins VOP, VON of the power amplifier chip, and a plurality of parallel power tube paths 101 are arranged between the input end and the output end of the first power amplifier module 10;

[0039] Each of the voltage boosting modules 90 is connected to the first power amplifier module 10, and the voltage boosting module 90 is used to supply power to one or more power tube paths 101 in the first power amplifier module 10;

[0040] The control module 20 is connected to the control end of the first power amplifier module 10 and each of the voltage boosting modules 90, respectively, and the control module 20 is used to control a plurality of power tube paths 101 to be in a conduction state or a disconnected state between the input end and the output end of the first power amplifier module 10.

[0041] Optionally, the control module 20 controls the multiple groups of power tube paths 101 to be in the conducting state or the disconnected state between the input end and the output end of the first power amplifier module 10. For example, the control module 20 controls all the power tube paths 101 to be in the conducting state, or controls all the power tube paths 101 to be in the disconnected state (in this case, the first power amplifier module 10 does not work), or controls a part of the power tube paths 101 to be in the conducting state and another part of the power tube paths 101 to be in the disconnected state, and the like. The embodiments of the present application are not limited in this regard.

[0042] For example, the power amplifier chip can be provided with a group of audio signal input pins and a group of audio signal output pins; or the power amplifier chip can be provided with multiple groups of audio signal input pins and multiple groups of audio signal output pins, and a group of audio signal input pins and a group of audio signal output pins can constitute an audio transmission channel of the power amplifier chip; or the power amplifier chip can also be provided with a group of audio signal input pins and multiple groups of audio signal output pins, and the group of audio signal input pins can constitute an audio transmission channel with each group of audio signal output pins, respectively. For example, the input end of the first power amplifier module 10 can be connected to only one group of audio signal input pins, and the output end of the first power amplifier module 10 is connected to only one group of audio signal output pins of the power amplifier chip, that is, the power amplifier chip has one audio transmission channel, and the first power amplifier module 10 with power allocation function is arranged on the audio transmission channel, that is, the power allocation function of the power amplifier chip is realized. For another example, the input end of the first power amplifier module 10 can be connected to at least one group of audio signal input pins, and the output end of the first power amplifier module 10 can be connected to multiple groups of audio signal output ends, that is, the power amplifier chip can support multiple audio transmission channels, and the first power amplifier module 10 with power allocation function is arranged on the multiple audio transmission channels, that is, the power allocation between multiple audio channels and on a single audio channel can be realized through the first power amplifier module 10.

[0043] It should be noted that when different audio transmission channels of the power amplifier chip multiplex the first power amplifier module 10, for any power tube path in the first power amplifier module 10, it only works in one audio transmission channel at a certain moment, for example, when the control module 20 controls one or more power tube paths 101 to be in the conducting state between the input end and the output end of the first power amplifier module 10, the one or more power tube paths 101 are at most in one audio transmission channel, so as to avoid interference.

[0044] Optionally, the control module 20 can be connected to the control pins SCL, SDA in the power amplifier chip, for controlling the state of the first power amplifier module 10 (i.e. which power tube path 101 in the first power amplifier module 10 is connected to the audio transmission channel). For example, the control module 20 can adopt the control mode of Inter-Integrated Circuit (IIC), or the control mode of General-purpose input / output (GPIO), to control the working state or mode of each power amplifier based on the high / low level distinction.

[0045] Optionally, as shown in Figure 1A The power amplifier chip can be provided with a boost module 90 for supplying power to one or more power tube paths 101 in the first power amplifier module 10 to drive the corresponding load (such as a loudspeaker, a vibration motor, etc.) to work. For example, when the control module 20 controls the number of power tube paths 101 between the input and output of the first power amplifier module 10 to be K (K is a positive integer), the boost module 90 can supply power to the K power tube paths 101. Specifically, the control module 20 can output a driving waveform signal to the boost module 90 to drive the boost module 90 to supply power to the power tube paths 101, and the voltage adjustment for different loads can be independently performed.

[0046] Optionally, as shown in Figure 1B The power amplifier chip can be provided with multiple boost modules 90 (for example, the number of boost modules 90 can be set according to the number of audio transmission channels provided by the power amplifier chip, for example, the power amplifier chip has 2 audio transmission channels, and 2 boost modules 90 can be provided), for independently supplying power to one or more power tube paths 101 working in different audio transmission channels to drive the corresponding load (such as a loudspeaker, a vibration motor, etc.) to work, and the supply voltage adjustment for the boost requirement of different loads can be independently performed.

[0047] In the above scheme, by arranging multiple groups of parallel power tube paths 101 between the input end and the output end of the first power amplifier module 10 of the power amplifier chip, and by controlling the multiple groups of power tube paths 101 to be in the on state or the off state between the input end and the output end of the first power amplifier module 10 through the control module 20, the number of power tube paths 101 connected between different groups of audio transmission channels can be flexibly adjusted, and the number of power tube paths 101 connected by the same group of audio transmission channels at different times can be flexibly adjusted, that is, the power allocation capability of the power amplifier chip is realized, which can reduce power waste under low power requirement, and can meet the power amplification requirement under high power requirement, thereby solving the problem that the current PA module or PA chip cannot meet the power amplification requirement or waste power consumption.

[0048] Optionally, one group of audio signal input pins of the power amplifier chip can include two input pins, and the power amplifier chip further includes:

[0049] a digital audio signal I2S interface 50 (Digital Audio Interface) connected to the pins BCK, WCK, DATAI, and DATAO of the power amplifier chip, for receiving an audio signal input to the power amplifier chip;

[0050] a digital audio processing module 40 (Digital Audio Processing path) connected to the output end of the digital audio signal I2S interface 50, for parsing audio data in the audio signal, and can also be used to calculate the value of the digital audio signal;

[0051] a digital-to-analog conversion (Digital Analog Converter, DAC) module 60 connected between the digital audio processing module 40 and the first power amplifier module 10, for converting a digital signal into an analog signal for processing by the first power amplifier module 10; Figure 1A and Figure 1B An example of single-channel signal input is given in the above embodiment, that is, the power amplifier chip has one group of audio signal input pins and at least one group of audio signal output pins. It should be noted that the power amplifier chip can also have multiple groups of audio signal input pins and multiple groups of audio signal output pins, and the embodiments of the present application are not limited thereto.

[0052] a data collection module 70 (DATA collector) connected to the digital audio processing module 40 and the digital-to-analog conversion module 60;

[0053] Analog-to-Digital Converter (ADC) module 80, connected with the first power amplifier module 10 and the data acquisition module 70, is used to convert analog signals into digital signals, such as converting the analog signals output by the first power amplifier module 10 into digital signals, and sending the digital signals to the digital audio processing module 40 for analysis and processing, etc. The embodiments of the present application are not limited thereto.

[0054] The boost module 90 is used to provide a high enough voltage for the first power amplifier module 10, and to increase the voltage input by the power supply pin VBAT of the power amplifier chip. The voltage boost can be controlled by the duty cycle of the driving waveform, and the embodiments of the present application are not limited thereto. The power supply pin VBAT is used to supply power for the entire system of the power amplifier chip, such as obtaining power from a battery in an electronic device, or obtaining power from other system power supply networks, etc. The embodiments of the present application are not limited thereto.

[0055] Optionally, please continue to refer to Figure 2 The first power amplifier module 10 includes: a first power tube unit 11, a second power tube unit 12, a first inverter 13.

[0056] The input end of the first power tube unit 11 is connected with the input end of the first inverter 13, the output end of the first power tube unit 11 is connected to one of the output ends of each group of audio signal output pins, and a plurality of parallel first power tube paths 110 are arranged between the input end and the output end of the first power tube unit 11.

[0057] The input end of the second power tube unit 12 is connected with the output end of the first inverter 13, the output end of the second power tube unit 12 is connected to the other output end of each group of audio signal output pins, and a plurality of parallel second power tube paths 120 are arranged between the input end and the output end of the second power tube unit 12.

[0058] The input end of the first inverter 13 is connected to the at least one group of audio signal input pins; wherein one first power tube path 110 and one second power tube path 120 constitute a group of power tube paths 101.

[0059] For example: the digital audio signal input pins of the power amplifier chip are input through the I2S interface 50 of the digital audio signal (such as the digital audio signal input pins including pins BCK, WCK, DATAI, and DATAO). Before the digital audio signal is input to the first power amplifier module 10, it can be converted into an analog audio signal through the digital audio processing module 40 and the DAC module 60.

[0060] Optionally, the first power amplifier module 10 further comprises a first modulator 17, and specifically, an output end of the DAC module 60 is connected to a negative input end of the first modulator 17, for inputting an analog audio signal converted by the DAC module 60 to the negative input end of the first modulator 17, a positive input end of the first modulator 17 inputs a modulation signal, and an output end of the first modulator 17 is connected to an input end of the first inverter 13. In this way, the analog audio signal at the negative input end is modulated into a pulse width modulation (PWM) signal based on the modulation signal input to the positive input end (for example, the modulation signal can be a preset triangular wave signal), and the PWM signal is input to the first inverter 13.

[0061] The analog audio signal processed by the digital-to-analog conversion module 60 is converted into a PWM wave by the modulator, and in one path, the PWM wave is output to a first output pin VOP in the group of audio output pins by the first power tube unit 11; and in another path, the PWM wave is converted into a reversed PWM wave by the first inverter 13 and then output to a second output pin VON in the group of audio output pins by the second power tube unit 12, so as to drive a load (such as a loudspeaker, a linear motor, etc.) on the group of audio output pins.

[0062] Specifically, the control module 20 can control the on or off state of the plurality of first power tube paths 110 between the input end and the output end of the first power tube unit 11, and control the on or off state of the plurality of second power tube paths 120 between the input end and the output end of the second power tube unit 12, thereby realizing flexible power allocation function. For example, if the power carrying requirements of each first power tube path 110 and each second power tube path 120 are the same, the number of first power tube paths 110 in the on state between the input end and the output end of the first power tube unit 11 can be controlled by the control module 20 to be the same as the number of second power tube paths 120 in the on state between the input end and the output end of the second power tube unit 12, that is, the combination of the first power tube path 110 and the second power tube path 120 has flexibility. Alternatively, if the power carrying requirements of each first power tube path 110 are different, a plurality of first power tube paths 110 can be set to have the same power carrying requirement as a plurality of second power tube paths 120. When the first power tube path 110 in the on state between the input end and the output end of the first power tube unit 11 is controlled by the control module 20 to have a power carrying requirement 1, the corresponding second power tube path 120 in the on state between the input end and the output end of the second power tube unit 12 also needs to have a power carrying requirement 1, that is, the combination of the first power tube path 110 and the second power tube path 120 is relatively fixed, but the power carrying requirements of the first power tube path 110 and the second power tube path 120 are relatively flexible.

[0063] Optionally, a first driving switch 111 and a first power tube 112 are arranged in series on each of the first power tube paths 110; the first driving switch 111 on each of the first power tube paths 110 is connected with the control module 20, and the control module 20 is used to control the switch state of the first driving switch 111.

[0064] For example, the first driving switch 111 can be a single-pole single-throw switch, and the switch state of the first driving switch 111 can include an on state and an off state. For example, when the first driving switch 111 is controlled by the control module 20 to be in the on state, the first power tube path 110 in which the first driving switch 111 is located is in the on state between the input end and the output end of the first power tube unit 11.

[0065] It should be noted that the number of first power tube paths 110 arranged in each first power tube unit 11 is not limited, such as 2, 3, 4, and the like, which can be designed based on the actual application power configuration requirements, and the embodiments of the present application are not limited.

[0066] Optionally, each second power tube path 120 is provided with a second drive switch 121 and a second power tube 122 connected in series; the second drive switch 121 on each second power tube path 120 is connected to the control module 20, and the control module 20 is used to control the switching state of the second drive switch 121.

[0067] For example, the second drive switch 121 may be a single-pole single-throw switch, and the switch state of the second drive switch 121 may include an on state and an off state. For example, when the second drive switch 121 is controlled by the control module 20 to be in the on state, the second power transistor path 120 where the second drive switch 121 is located is in the conducting state between the input end and the output end of the second power transistor unit 12.

[0068] It should be noted that there is no limit to the number of second power tube paths 120 set in each second power tube unit 12, for example, 2, 3, 4... etc. can be set, and the specific design can be based on the power configuration requirements required for actual applications, and the embodiment of this application does not make specific limitations.

[0069] Alternatively, as Figure 3 As shown, the power amplifier chip has at least two groups of audio signal output pins; the power amplifier chip also includes: a second power amplifier module 30;

[0070] The output end of the first power amplifier module 10 is connected to the first group of audio signal output pins of the at least two groups of audio signal output ends;

[0071] The input end of the second power amplifier module 30 is connected to the at least one group of audio signal input pins, the output end of the second power amplifier module 30 is connected to the second group of audio signal output pins of the at least two groups of audio signal output pins, and multiple groups of parallel power tube paths 301 are provided between the input end and the output end of the second power amplifier module 30;

[0072] Each of the boost modules 90 is respectively connected to the second power amplifier module 30 , and the boost module 90 is used to supply power to one or more power tube paths 301 in the second power amplifier module 30 ;

[0073] The control module 20 is connected to the control end of the second power amplifier module 30 , and is used to control the plurality of power tube paths 101 to be in an on state or a off state between the input end and the output end of the second power amplifier module 30 .

[0074] Optionally, the control module 20 controls the multiple groups of power tube paths 101 in the second power amplifier module 30 to be in the conducting state or the disconnected state between the input end and the output end of the second power amplifier module 30, which can be to control all groups of power tube paths 301 in the second power amplifier module 30 to be in the conducting state, or to control all groups of power tube paths 301 in the second power amplifier module 30 to be in the disconnected state (at this time, the second power amplifier module 30 does not work), or to control a part of power tube paths 301 in the second power amplifier module 30 to be in the conducting state and another part of power tube paths 301 to be in the disconnected state, etc., which is not limited by the embodiments of the present application.

[0075] For example, the power amplifier chip can be provided with multiple groups of audio signal input pins and multiple groups of audio signal output pins, and one group of audio signal input pins and one group of audio signal output pins can constitute an audio transmission channel of the power amplifier chip; or the power amplifier chip can also be provided with one group of audio signal input pins and multiple groups of audio signal output pins, and this group of audio signal input pins can constitute an audio transmission channel with each group of audio signal output pins, respectively. For example, the input end of the second power amplifier module 30 can be connected to only one group of audio signal input pins, and the output end of the second power amplifier module 30 is connected to only one group of audio signal output pins of the power amplifier chip, that is, the power amplifier chip has one audio transmission channel. For another example, the input end of the second power amplifier module 30 can be connected to multiple groups of audio signal input pins, and the output end of the second power amplifier module 30 can be connected to multiple groups of audio signal output pins, that is, the power amplifier chip can support multiple audio transmission channels, and the first power amplifier module 10 and the second power amplifier module 30 with power allocation function are arranged on the multiple audio transmission channels, that is, power allocation between multiple audio channels and on a single audio channel can be realized through the first power amplifier module 10 and the second power amplifier module 30, so as to ensure higher flexibility of power allocation for multiple audio transmission channels.

[0076] Optionally, in the case that the first power amplifier module 10 and the second power amplifier module 30 are arranged in different audio transmission channels, the power amplifier chip can be provided with multiple boost modules 90 (for example, the number of boost modules 90 can be arranged according to the number of audio transmission channels of the power amplifier chip, for example, the power amplifier chip has 2 audio transmission channels, the first power amplifier module 10 is arranged in one of the audio transmission channels, and the second power amplifier module 30 is arranged in the other audio transmission channel, and 2 boost modules 90 can be arranged), one of the boost modules is used to supply power to one or more power tube paths 101 of the first power amplifier module 10 working in the audio transmission channel, and the other boost module is used to supply power to one or more power tube paths 301 of the second power amplifier module 30 working in the other audio transmission channel, so as to realize independent power supply of the two boost modules to the power tube paths working in different audio transmission channels to independently drive the corresponding loads (such as loudspeakers, vibration motors, etc.) to work, and the power supply voltage can be adjusted independently according to the different boost requirements of the loads.

[0077] It should be noted that when different audio transmission channels of the power amplifier chip multiplex the second power amplifier module 30, for any power tube path 301 in the second power amplifier module 30, it only works in one audio transmission channel at a certain moment, for example, when the power tube path 301 in the second power amplifier module 30 is controlled by the control module 20 to be in a conductive state between the input end and the output end of the second power amplifier module 30, the power tube path 301 in the second power amplifier module 30 is at most in one audio transmission channel, so as to avoid interference.

[0078] Optionally, the second power amplifier module 30 comprises: a fifth power tube unit 31, a sixth power tube unit 32, and a third inverter 33.

[0079] The input end of the fifth power tube unit 31 is connected to the input end of the third inverter 33, the output end of the fifth power tube unit 31 is connected to one of the output pins of the second group of audio signal output pins, and multiple fifth power tube paths 310 are arranged in parallel between the input end and the output end of the fifth power tube unit 31.

[0080] The input end of the sixth power tube unit 32 is connected to the output end of the third inverter 33, the output end of the sixth power tube unit 32 is connected to the other output pin of the second group of audio signal output pins, and multiple sixth power tube paths 320 are arranged in parallel between the input end and the output end of the sixth power tube unit 32.

[0081] The input end of the third inverter 33 is connected to the at least one group of audio signal input pins; wherein one fifth power tube path 310 and one sixth power tube path 320 constitute a group of power tube paths 301 in the second power amplifier module 30.

[0082] Optionally, the second power amplifier module 30 further comprises a second modulator 34; specifically, the output end of the DAC module 60 is connected to the negative input end of the second modulator 34, for inputting one analog audio signal converted by the DAC module 60 to the negative input end of the second modulator 34, the positive input end of the second modulator 34 inputs a modulation signal, and the output end of the second modulator 34 is connected to the input end of the third inverter 33. In this way, the analog audio signal on the negative input end is modulated into a pulse width modulation (PWM) signal based on the modulation signal (such as a preset triangular wave signal) input to the positive input end by the second modulator 34, and is input to the third inverter 33.

[0083] For example: the PWM wave converted by the analog audio signal processed by the digital-to-analog conversion module 60 through the first modulator 17, in one of the paths, is output to the first output pin VOP1 in the group of audio output pins through the first power tube unit 11; in the other path, the PWM wave is converted into a reversed PWM wave by the first inverter 13 and then output to the second output pin VON1 in the group of audio output pins through the second power tube unit 12, so as to drive the load (such as a loudspeaker, a linear motor, etc.) on the group of audio output pins.

[0084] The PWM wave converted by the analog audio signal processed by the digital-to-analog conversion module 60 through the third inverter 33, in one of the paths, is output to the first output pin VOP2 in the group of audio output pins through the fifth power tube unit 31; in the other path, the PWM wave is converted into a reversed PWM wave by the third inverter 33 and then output to the second output pin VON2 in the group of audio output pins through the sixth power tube path 320, so as to drive the load (such as a loudspeaker, a linear motor, etc.) on the other group of audio output pins.

[0085] Optionally, the fifth drive switch 311 and the fifth power tube 312 are arranged in series on each fifth power tube path 310; the fifth drive switch 311 on each fifth power tube path 310 is connected to the control module 20, and the control module 20 is configured to control the switching state of the fifth drive switch 311.

[0086] For example, the fifth drive switch 311 can be a single-pole single-throw switch, and the switch state of the fifth drive switch 311 can include a conduction state and a disconnection state. For example, when the control module 20 controls the fifth drive switch 311 to be in the conduction state, the fifth power tube path 310 in which the fifth drive switch 311 is located is in the conduction state between the input end and the output end of the fifth power tube unit 31.

[0087] It should be noted that the number of fifth power tube paths 310 provided in each fifth power tube unit 31 is not limited, for example, two, three, four, and the like, and the specific design can be based on the power configuration requirements required by actual application, and the embodiments of the present application are not limited.

[0088] Optionally, the sixth drive switch 321 and the sixth power tube 322 are connected in series on each sixth power tube path 320; the sixth drive switch 321 on each sixth power tube path 320 is connected with the control module 20, and the control module 20 is configured to control the switch state of the sixth drive switch 321.

[0089] For example, the sixth drive switch 321 can be a single-pole single-throw switch, and the switch state of the sixth drive switch 321 can include a conduction state and a disconnection state. For example, when the control module 20 controls the sixth drive switch 321 to be in the conduction state, the sixth power tube path 320 in which the sixth drive switch 321 is located is in the conduction state between the input end and the output end of the sixth power tube unit 32.

[0090] It should be noted that the number of sixth power tube paths 320 provided in each sixth power tube unit 32 is not limited, for example, two, three, four, and the like, and the specific design can be based on the power configuration requirements required by actual application, and the embodiments of the present application are not limited.

[0091] In this embodiment, two-way power amplifier modules are integrated in a power amplifier chip, which can realize multi-way output of the power amplifier chip. Since the two-way power amplifier modules can reuse the functional modules in the power amplifier chip, compared with the traditional power amplifier chip (which only supports one-way output), the design cost can be reduced, and the peripheral circuit cost and area can also be reduced. In addition, in this scheme, multiple power tubes are designed in the power amplifier module, which can reduce the overcurrent requirement of the power tube compared with the traditional single large power tube. Or, compared with the traditional single power tube, while keeping the power of each power tube unchanged, the present application is equivalent to stacking multiple power tubes to improve the output power of the power amplifier module, and can also support power allocation function to meet the power amplification requirement and reduce power consumption under low load.

[0092] Optionally, asFigure 4A As shown, the first power amplifier module 10 comprises: a third power tube unit 14, a fourth power tube unit 15, a plurality of second inverters 16;

[0093] The input end of the third power tube unit 14 is connected with the input end of each second inverter 16, the output end of the third power tube unit 14 is connected to one output pin of each group of audio signal output pins, and a plurality of parallel third power tube paths 140 are arranged between the input end and the output end of the third power tube unit 14.

[0094] The input end of the fourth power tube unit 15 is connected with the output end of each second inverter 16, the output end of the fourth power tube unit 15 is connected to the other output pin of each group of audio signal output pins, and a plurality of parallel fourth power tube paths 150 are arranged between the input end and the output end of the fourth power tube unit 15.

[0095] The input end of each second inverter 16 is connected to a group of audio signal input pins; wherein one third power tube path 140 and one fourth power tube path 150 constitute a group of power tube paths 101.

[0096] Optionally, the first power amplifier module 10 further comprises: a plurality of third modulators 18. Specifically, the output end of the DAC module 60 is connected with the negative input end of each third modulator 18, for inputting one analog audio signal converted by the DAC module 60 to the negative input end of the third modulator 18, the positive input end of the third modulator 18 inputs a modulation signal, and the output end of each third modulator 18 is connected with the input end of one second inverter 16. In this way, the third modulator 18 modulates the analog audio signal on the negative input end into a pulse width modulation (PWM) signal based on the modulation signal (such as a preset triangular wave signal) input to the positive input end, and inputs the PWM signal to the second inverter 16.

[0097] It should be noted that the working principle and function of the third modulator 18 are similar to those of the first modulator 17 in the first power amplifier module 10, and the working principle and function of the second inverter 16 are similar to those of the first inverter 13 in the first power amplifier module 10. Figure 2 Figure 2 For the sake of brevity, they will not be repeated here.

[0098] ​Specifically, the power amplifier chip has multiple audio transmission channels, i.e., supports multiple output channels, and the multiple audio transmission channels can multiplex the third power tube unit 14 and the fourth power tube unit 15. For example, taking two audio transmission channels as an example, the output end of the third power tube unit 14 can be connected to the first pin VOP1 of the first group of audio signal output pins and the first pin VOP2 of the second group of audio signal output pins, and the fourth power tube unit 15 can be connected to the second pin VON1 of the first group of audio signal output pins and the second pin VON2 of the second group of audio signal output pins. In this way, the multiple third power tube paths 140 in the third power tube unit 14 and the multiple fourth power tube paths 150 in the fourth power tube unit 15 can be power distributed based on the output load of each audio transmission channel.

[0099] It should be noted that when the multiple third power tube paths 140 in the third power tube unit 14 and the multiple fourth power tube paths 150 in the fourth power tube unit 15 are distributed, each third power tube path 140 and each fourth power tube path 150 only works in one audio transmission channel at a certain moment.

[0100] For example: taking two audio transmission channels, the third power tube unit 14 includes 6 third power tube paths 140 and the fourth power tube unit 15 includes 6 fourth power tube paths 150. For example, according to the output load of the two audio transmission channels, the number of third power tube paths 140 and fourth power tube paths 150 corresponding to each audio transmission channel (i.e., the number of groups of power tube paths 101) can be distributed, such as: the number of groups of power tube paths 101 corresponding to the two audio transmission channels can be 1:5 (i.e., one audio transmission channel corresponds to 1 group of power tube paths 101, and the other audio transmission channel corresponds to 5 groups of power tube paths 101), or 2:4 (i.e., one audio transmission channel corresponds to 2 groups of power tube paths 101, and the other audio transmission channel corresponds to 4 groups of power tube paths 101), or 1:1 (i.e., two audio transmission channels correspond to 3 groups of power tube paths 101), etc. The embodiments of the present application are not limited thereto.

[0101] Optionally, each third power tube path 140 is provided with a third drive switch 141, a third power tube 142, and a first power switch 143;

[0102] The input end of the third power tube 142 is connected to the input end of each second inverter 16 through the third drive switch 141, and the output end of the third power tube 142 is connected to one of the output pins of each group of audio signal output pins through the first power switch 143;

[0103] The third drive switch 141 and the first power switch 143 on each third power tube path 140 are connected with the control module 20, and the control module 20 is configured to control the switch states of the third drive switch 141 and the first power switch 143.

[0104] For example, in the case of supporting two audio transmission channels by the power amplifier chip, the third drive switch 141 can be a single-pole double-throw switch, that is, the third drive switch 141 can realize switching of the corresponding third power tube path 140 between the two audio transmission channels. For example, the switch states of the third drive switch 141 can include a state of the first channel being turned on and the second channel being turned off, a state of the second channel being turned on and the first channel being turned off, and a state of all being turned off.

[0105] It should be noted that the number of third power tube paths 140 in each third power tube unit 14 is not limited, such as 2, 3, 4, 5, 6, and the like. The more the number of power tube paths, the more the combination of power distribution. The actual application can be designed based on the power configuration requirements, and the embodiments of the present application are not limited.

[0106] Optionally, each fourth power tube path 150 is provided with a fourth drive switch 151, a fourth power tube 152, and a second power switch 153.

[0107] The input end of the fourth power tube 152 is connected with the output end of each second inverter 16 through the fourth drive switch 151, and the output end of the fourth power tube 152 is connected to the other output pin of each group of audio signal output pins through the second power switch 153.

[0108] The fourth drive switch 151 and the second power switch 153 on each fourth power tube path 150 are connected with the control module 20, and the control module 20 is configured to control the switch states of the fourth drive switch 151 and the second power switch 153.

[0109] For example, in the case of supporting two audio transmission channels by the power amplifier chip, the fourth drive switch 151 can be a single-pole double-throw switch, that is, the fourth drive switch 151 can realize switching of the corresponding fourth power tube path 150 between the two audio transmission channels. For example, the switch states of the fourth drive switch 151 can include a state of the first channel being turned on and the second channel being turned off, a state of the second channel being turned on and the first channel being turned off, and a state of all being turned off.

[0110] It should be noted that the number of fourth power tube paths 150 provided in each fourth power tube unit 15 is not limited, such as 2, 3, 4, 5, 6, …, etc. The more the number of power tube paths, the more the combination of power distribution. The actual application required power configuration can be designed, and the embodiments of the present application are not limited.

[0111] In this embodiment, two-way power amplifier modules are integrated in a power amplifier chip, which can realize multi-way output of the power amplifier chip. Since the two-way power amplifier modules can reuse the functional modules in the power amplifier chip, compared with the traditional power amplifier chip (which only supports one-way output), the design cost can be reduced, and the peripheral circuit cost and area can also be reduced. In this scheme, multiple power tubes are designed in the power amplifier module, which can reduce the overcurrent requirement of the power tube compared with the traditional single large power tube. Or compared with the traditional single power tube, while keeping the power of each power tube unchanged, the present application is equivalent to stacking multiple power tubes to improve the output power of the power amplifier module, and can also support power allocation function to meet the power amplification requirement and reduce power consumption under low load. In addition, multiple audio transmission paths can reuse multiple power tubes in the power amplifier module, so that power distribution can be performed based on the load condition of each audio transmission path to adapt to different load scenarios, such as the upper cavity and single body of the electronic device, which may have smaller power demand, and power consumption distribution can reduce energy loss.

[0112] Optionally, as shown in Figure 4B The power amplifier chip further includes a plurality of switching switch units 100; each power tube path 101 (301) is connected to each boost module 90 through one switching switch unit 100; the control module 20 is connected to each switching switch unit 100, and the control module 20 is used to control the switching state of the switching switch unit 100.

[0113] For example, the number of switching switch units 100 can be determined according to the number of power tube paths 101 (301), that is, one switching switch unit 100 can be provided for one group of power tube paths 101 (301). Alternatively, the specific form of the switching switch unit 100 can be determined based on the number of audio transmission channels or the number of boost modules 90, such as the number of audio transmission channels being 2. In order to ensure that each audio transmission channel can be independently powered and independently adjusted in power supply voltage, two boost modules can be correspondingly provided. Then, the switching switch unit 100 can be a single-pole double-throw switch or two single-pole single-throw switches, and the like. In this way, the control module 20 can control the switching of each group of power tube paths and the conduction of two boost modules 90. For example, the switching state of the switching switch unit 100 can include: a state in which the first path is turned on and the second path is turned off (that is, one of the boost modules 90 supplies power to the group of power tube paths corresponding to the switching switch unit 100), a state in which the second path is turned on and the first path is turned off (that is, the other boost module 90 supplies power to the group of power tube paths corresponding to the switching switch unit 100), and a state in which all are turned off (that is, the group of power tube paths corresponding to the switching switch unit 100 does not work), and the like.

[0114] Alternatively, when the number of audio transmission channels and the number of boost modules 90 are both 3, the switching switch unit 100 can be a single-pole three-throw switch or three single-pole single-throw switches, and the like, so as to realize that one power tube path works in one audio transmission channel at the same time, and the power tube paths in different audio transmission channels can be powered by independent boost modules 90, and the like. The embodiments of the present application are not limited thereto. Alternatively, the input end of the first power amplifier module 10 is connected with the at least one group of audio signal input ends through the digital audio processing module 40, and the digital audio processing module 40 is connected with the control module 20.

[0115] The digital audio processing module 40 is configured to calculate the value of the digital audio signal in a preset time period, and send the value of the digital audio signal to the control module 20.

[0116] The control module 20 controls the number of groups of power tube paths 101 between the input end and the output end of the first power amplifier module 10 to be in a conduction state according to the value of the digital audio signal; and / or, the control module 20 calculates the value of the analog audio signal according to the value of the digital audio signal and the gain value of the digital-to-analog conversion, and adjusts the voltage value of the power supply of the one or more groups of power tube paths 101 by the boost module 90 according to the value of the analog audio signal.

[0117] For example, the preset time period can be a preset time length (such as n seconds). When the digital audio processing module 40 is configured to calculate the value of the digital audio signal in the preset time period, the calculation can be the maximum value of the digital audio signal in the preset time period, such as the maximum value of the digital audio signal calculated in the first preset time period is K1, the maximum value of the digital audio signal calculated in the second preset time period is K2, and the like. That is, the maximum values of the digital audio signal calculated in different preset time periods can be the same or different. Therefore, the embodiments of the present application support dynamically and flexibly adjusting the number of groups of power tube paths 101 between the input end and the output end of the first power amplifier module 10 in the on state, so as to ensure that the power amplification demand can be met during the output of the audio signal, and the waste of power consumption can be avoided.

[0118] Optionally, when the digital audio processing module 40 is configured to calculate the value of the digital audio signal in the preset time period, the calculation can be the minimum value or the average value of the digital audio signal in the preset time period, and the embodiments of the present application are not limited thereto.

[0119] For another example, when a plurality of audio transmission channels and a plurality of boost modules 90 are provided in the power amplifier chip, the power distribution can be performed by the control module 20 based on the value of the digital audio signal on each audio transmission channel, that is, the number of groups of power tube paths in the on state in each audio transmission channel is controlled, and the switching state of the switching unit 100 is controlled by the control module 20, so that one or more power tube paths working in the same audio transmission channel are powered by the same boost module 90. In this way, the supply voltage value of the corresponding boost module 90 can be adjusted for the value of the analog audio signal on the same audio transmission channel, so as to realize independent voltage regulation of each boost module 90 following the output envelope of the audio transmission channel, which can improve the power supply efficiency and reduce distortion while ensuring driving force.

[0120] For example, the output voltage of the boost module 90 can be adjusted by adjusting the duty cycle of the drive waveform. The control module 20 can calculate the value of the analog audio signal according to the value of the digital audio signal and the gain value of the digital-to-analog conversion of the DAC module 60, and when it is determined that the output voltage of the boost module 90 needs to be adjusted according to the value of the analog audio signal, the duty cycle of the drive waveform can be adjusted to adjust the voltage value of the power supply provided by the boost module 90 to the one or more groups of power tube paths 101. For example, when the value of the analog audio signal is greater than the voltage value on the power supply pin VBAT of the power amplifier chip, the control module 20 can adjust the duty cycle of the drive waveform so that the voltage value of the power supply provided by the boost module 90 to the one or more groups of power tube paths 101 is higher than the value of the analog audio signal (and the voltage value of the power supply provided by the boost module 90 to the one or more groups of power tube paths 101 is less than the maximum output voltage supported by the boost module).

[0121] Optionally, the value of the analog audio signal can refer to the voltage value corresponding to the maximum analog audio signal. The voltage value corresponding to the maximum analog audio signal can be calculated by calculating the maximum value of the digital audio signal in a preset time period by the digital audio processing module 40, and calculating the voltage value corresponding to the maximum analog audio signal in the preset time period according to the maximum value of the digital audio signal in the preset time period and the gain value of the digital-to-analog conversion of the DAC module 60.

[0122] The embodiment of the present application provides an electronic device including the power amplifier chip as described above.

[0123] Optionally, the electronic device includes but is not limited to a mobile phone, a tablet computer, a wearable device, etc., or other electronic devices with audio output function, and the embodiment of the present application is not limited thereto.

[0124] The electronic device of the embodiment of the present application can implement the scheme of each audio circuit embodiment and achieve the same technical effect. To avoid repetition, details are not repeated here.

[0125] The control method of the power amplifier chip provided by the embodiment of the present application will be described in detail below in combination with the drawings, specific embodiments and application scenarios.

[0126] As shown in Figure 5 The embodiment of the present application provides a control method of a power amplifier chip, applied to the power amplifier chip as described above, and the method includes the following steps:

[0127] Step 51: obtaining the load impedance of each group of audio signal output pins of the power amplifier chip, and / or obtaining the value of the digital audio signal in a preset time period;

[0128] Optionally, the load impedance of each group of audio signal output pins can be obtained in advance based on the load (such as a loudspeaker, a linear motor) configured by each group of audio signal output pins, for example, the load impedance of each group of audio signal output pins is detected in advance during the design of the audio circuit of the electronic device or the electronic device, and is recorded in the control module 20 of the power amplifier chip.

[0129] Optionally, the value of the digital audio signal within the preset time period can be calculated by the digital audio processing module 40 in the power amplifier chip.

[0130] Step 52: According to the load impedance and / or the value of the digital audio signal, control the on or off state of the plurality of power tube paths between the input and output of the first power amplifier module, and / or adjust the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths.

[0131] Optionally, based on the above step 51, when the control module 20 in the power amplifier chip obtains the load impedance of each group of audio signal output pins and / or the value of the digital audio signal within the preset time period, the on or off state of the plurality of power tube paths between the input and output of the first power amplifier module 10 can be controlled, for example, the on or off state of the plurality of power tube paths between the input and output of the first power amplifier module 10 can be configured through a register, and / or the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths on the audio transmission channel of the digital audio signal can be adjusted according to the value of the digital audio signal, so that the voltage boosting module can follow the output envelope of the audio transmission channel for voltage regulation.

[0132] In this embodiment, by obtaining the load impedance of each group of audio signal output terminals of the power amplifier chip, and / or obtaining the value of the digital audio signal within the preset time period, and according to the load impedance and / or the value of the digital audio signal, the on or off state of the plurality of power tube paths between the input and output of the first power amplifier module can be controlled, which can realize power distribution of each audio transmission channel according to the load condition, and / or dynamically adjust the power during the transmission of the audio signal, so as to ensure the power amplification requirement and reduce the power waste; in addition, according to the value of the digital audio signal, the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths can be adjusted, so that the supply voltage of the voltage boosting module 90 can follow the output envelope of the audio output channel for adjustment, which can improve the power supply efficiency and reduce the distortion under the condition of ensuring the driving force.

[0133] It should be noted that when the power amplifier chip also includes a second power amplifier module 30, the multiple groups of power tube paths in the second power amplifier module 30 can be controlled to be in an on state or a off state between the input end and the output end of the second power amplifier module 30 according to the load impedance and / or the value of the digital audio signal. No further details are given here.

[0134] Optionally, according to the load impedance, the plurality of power tube paths are controlled to be in an on state or a off state between the input end and the output end of the first power amplifier module, that is, a fixed power distribution mode. Figure 6 As shown, the load impedance can be confirmed in advance. For example, in the scenario of single boost power supply, the voltage is the same, according to P=U 2 / R calculates the load impedance ratio to determine the corresponding power distribution ratio. The control module configures the registers to fix the power tube distribution combination.

[0135] Optionally, controlling the plurality of power tube paths between the input end and the output end of the first power amplifier module to be in an on state or a off state according to the load impedance and the value of the digital audio signal, i.e., a dynamic frequency allocation method, includes:

[0136] Determine the power tube path corresponding to the audio transmission channel where each group of audio signal output pins is located based on the load impedance of each group of audio signal output pins;

[0137] According to the value of the digital audio signal on the audio transmission channel where each group of audio signal output pins is located within a preset time period, the power tube path corresponding to the audio transmission channel is controlled to be in an on state or a off state between the input end and the output end of the first power amplifier module.

[0138] like Figure 7 As shown, the dynamic frequency allocation method can specifically determine the load impedance in advance to determine the corresponding power distribution ratio. The control module configures the registers and fixes the power tube distribution combination. During use, the number and ratio of power tubes turned on are adjusted in real time based on the amplitude of the output audio signal (i.e., the maximum value of the digital audio signal within a preset time period), thus achieving flexible and dynamic adjustment of power distribution.

[0139] Optionally, controlling the plurality of power tube paths between the input end and the output end of the first power amplifier module to be in an on state or a off state according to the value of the digital audio signal includes:

[0140] determining a target preset range within which the value of the digital audio signal lies;

[0141] Determining a target power regulation strategy corresponding to the target preset range based on a predetermined correspondence between a plurality of preset ranges and power regulation strategies; wherein different power regulation strategies correspond to different numbers of power tube path groups in a conductive state between the input end and the output end of the first power amplifier module;

[0142] According to the target power regulation strategy, the number of power tube path groups in a conducting state between the input end and the output end of the first power amplifier module is controlled.

[0143] Optionally, the number of preset ranges can be determined according to the number of power tube paths. For example, taking the number of power tube paths as 3 as an example, two thresholds a and b are set, and the relationship is satisfied: 0<a<b<max; when X<a, only one group of power tube paths is turned on; when a<X<b, two groups of power tube paths are turned on; when X>b, three groups of power tube paths are turned on.

[0144] Optionally, the thresholds a and b can be determined based on the maximum power max that the power amplifier module can carry. For example, a=1 / 3max and b=2 / 3max can be set. Of course, the thresholds a and b can also take other values ​​between 0 and max, etc. The embodiments of the present application are not limited to this.

[0145] like Figure 8 As shown, a flow chart of a control method for a power amplifier chip is provided, which specifically includes:

[0146] Step 81: Calculate the maximum value X of the digital audio signal within a preset time period in real time through the digital audio processing module 40;

[0147] Step 82: Determine whether X>a is satisfied;

[0148] Step 83: If X>a is not satisfied, a group of power tube paths are turned on;

[0149] Step 84: If X>a is satisfied, further determine whether X>b is satisfied;

[0150] Step 85: If X>b is not satisfied, then two groups of power tube paths are turned on;

[0151] Step 86: If X>b is satisfied, then three groups of power tube paths are turned on.

[0152] The control method of the power amplifier chip provided in the embodiment of the present application can be executed by a control device of the power amplifier chip. In the embodiment of the present application, the control device of the power amplifier chip performing the control method of the power amplifier chip is used as an example to illustrate the control device of the power amplifier chip provided in the embodiment of the present application.

[0153] It should be noted that the above embodiment is to explain the control method of the power amplifier chip by the control module of the power amplifier chip. When the power amplifier chip is applied to an electronic device, the control method of the power amplifier chip can be realized by the control module of the power amplifier chip, or can be realized by a processor in the electronic device, and the embodiments of the present application are not limited thereto.

[0154] Optionally, the adjusting the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths according to the numerical value of the digital audio signal comprises:

[0155] determining the numerical value of the analog audio signal according to the numerical value of the digital audio signal and the gain value of the digital-to-analog conversion;

[0156] adjusting the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths according to the numerical value of the analog audio signal.

[0157] For example, the maximum value of the digital audio signal in a preset time period is calculated by the digital audio processing module, and the voltage value corresponding to the maximum analog audio signal in the preset time period (i.e. the numerical value of the analog audio signal) is calculated according to the maximum value of the digital audio signal in the preset time period and the gain value of the digital-to-analog conversion of the DAC module. The voltage value of the voltage boosting module to supply power to one or more groups of power tube paths is adjusted according to the voltage value corresponding to the maximum analog audio signal.

[0158] For example, the output voltage (i.e. the supply voltage) of the voltage boosting module can be adjusted by adjusting the duty cycle of the driving waveform, i.e. the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths can be adjusted by adjusting the duty cycle of the driving waveform.

[0159] Optionally, the adjusting the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths according to the numerical value of the analog audio signal comprises:

[0160] In the case that the numerical value of the analog audio signal is greater than the voltage value of the power supply pin of the power amplifier chip, the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths is greater than the numerical value of the analog audio signal, and the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths is less than the maximum output voltage value supported by the voltage boosting module.

[0161] The technical effects of adjusting the voltage value of the voltage boosting module to supply power to one or more groups of power tube paths in the present application are described below in conjunction with specific embodiments:

[0162] For example, the maximum value of the digital audio signal in a preset time period is calculated by the digital audio processing module, and the voltage value corresponding to the maximum analog audio signal in the preset time period (i.e. the numerical value of the analog audio signal) is calculated according to the maximum value of the digital audio signal in the preset time period and the gain value of the digital-to-analog conversion of the DAC module. The voltage value of the voltage boosting module to supply power to one or more groups of power tube paths is adjusted according to the voltage value corresponding to the maximum analog audio signal. Figure 9As shown, taking two-way load output (i.e. first speaker, second speaker) as an example, when single boost power supply (i.e. single boost module for power supply) is adopted, the speaker drive signal is much smaller than the PVDD envelope signal, resulting in a decrease in power supply efficiency. When a single boost power supply is adopted, due to the difference in output envelope of different loads, the output envelope of each load cannot be considered for voltage adjustment. In the embodiment of the present application, multiple boost modules are set for the scenario of multiple audio output channels, which can have independent voltage envelope adjustment function, calculate the value of the analog audio signal based on the amplitude of the digital audio signal corresponding to each load and the DAC digital-to-analog conversion gain, and adjust the power supply voltage of the power tube path on each load to be greater than the value of the analog audio signal, that is, the output envelope of each load can independently adjust the power supply voltage value, which can improve the power supply efficiency.

[0163] As shown in Figure 10A and Figure 10B , a graph of the relationship between power amplifier efficiency and distortion (THD+N) and output power when single boost power supply is adopted is given. It can be seen that the power amplifier efficiency decreases with the increase of power, and the distortion increases with the increase of output power. In the embodiment of the present application, independent boost modules are set for the scenario of multiple audio output channels, that is, the power link of each audio output channel is independently powered, which is equivalent to reducing the power of a single boost module, so that the distortion can be reduced while ensuring the driving force.

[0164] As shown in Figure 11 , a flow chart of another control method of a power amplifier chip is given, which specifically includes:

[0165] Step 111: calculating the amplitude MAX of the digital audio signal and the digital-to-analog conversion gain a of the DAC module in a preset time period in real time through the digital audio processing module, and calculating the voltage value A corresponding to the maximum analog audio signal according to MAX and a;

[0166] Step 112: determining whether A is greater than the voltage value VBAT of the power supply pin of the power amplifier chip;

[0167] Step 113: if A > VBAT, adjusting the power supply voltage value of the corresponding boost module to be slightly greater than A;

[0168] Step 114: if A ≤ VBAT, not adjusting the power supply voltage value of the boost module.

[0169] It should be noted that the power supply voltage value of the power supply module is greater than A and less than the maximum output voltage value supported by the boost module.

[0170] In the embodiment, independent boost modules are used for power supply of each audio transmission channel, voltage regulation can be independently performed following the output envelope of each audio transmission channel, higher voltage regulation flexibility is achieved compared with the design of a single boost module, the overall efficiency can be improved, the power required by the boost module on each audio transmission channel can be reduced, and distortion can be effectively reduced. In addition, each boost module can be used in cooperation with the frequency distribution function, that is, based on the power distribution of the power tube path working in each audio transmission channel, a same boost module is further configured to supply power to the power tube path in a same audio transmission channel, and the flexibility of power supply configuration is ensured.

[0171] As shown in Figure 12 The embodiment of the application provides a control device 1200 of a power amplifier chip, which is applied to the power amplifier chip and comprises:

[0172] The acquisition module 1210 is configured to acquire the load impedance of each group of audio signal output pins of the power amplifier chip and / or acquire the value of the digital audio signal in a preset time period.

[0173] The control module 1220 is configured to control a plurality of groups of the power tube paths to be in a conduction state or a disconnected state between the input end and the output end of the first power amplifier module according to the load impedance and / or the value of the digital audio signal, and / or adjust the voltage value of power supply of the boost module to one or more groups of power tube paths.

[0174] Optionally, the control module 1220 further comprises:

[0175] The first determination unit is configured to determine the power tube path corresponding to the audio transmission channel in which each group of audio signal output pins is located according to the load impedance of each group of audio signal output pins.

[0176] The first control unit is configured to control the power tube path corresponding to the audio transmission channel in which each group of audio signal output pins is located to be in a conduction state or a disconnected state between the input end and the output end of the first power amplifier module according to the value of the digital audio signal in a preset time period on the audio transmission channel.

[0177] Optionally, the control module 1220 further comprises:

[0178] The second determination unit is configured to determine a target preset range in which the value of the digital audio signal is located.

[0179] The third determining unit is configured to determine a target power adjustment strategy corresponding to the target preset range according to a preset correspondence between a plurality of preset ranges and power adjustment strategies, wherein the number of groups of power tube paths between the input end and the output end of the first power amplifier module in a conducting state is different for different power adjustment strategies.

[0180] The second control unit is configured to control the number of groups of power tube paths between the input end and the output end of the first power amplifier module in a conducting state according to the target power adjustment strategy.

[0181] Optionally, the control module 1220 comprises:

[0182] The fourth determining unit is configured to determine the value of the analog audio signal according to the value of the digital audio signal and a gain value of digital-to-analog conversion.

[0183] The adjusting unit is configured to adjust the voltage value of the voltage supplied by the voltage boosting module to one or more groups of power tube paths according to the value of the analog audio signal.

[0184] Optionally, the adjusting unit is further configured to:

[0185] In the case where the value of the analog audio signal is greater than the voltage value of the power supply pin of the power amplifier chip, the voltage value of the voltage supplied by the voltage boosting module to one or more groups of power tube paths is greater than the value of the analog audio signal, and the voltage value of the voltage supplied by the voltage boosting module to one or more groups of power tube paths is less than the maximum output voltage value supported by the voltage boosting module.

[0186] The device in this embodiment can achieve power distribution of each audio transmission channel according to the load condition by acquiring the load impedance of each group of audio signal output ends of the power amplifier chip and / or acquiring the value of the digital audio signal in a preset time period, and controlling a plurality of groups of power tube paths to be in a conducting state or a disconnected state between the input end and the output end of the first power amplifier module according to the load impedance and / or the value of the digital audio signal. In addition, the voltage value of the voltage supplied by the voltage boosting module to one or more groups of power tube paths can be adjusted according to the value of the digital audio signal, so that the power supply voltage of each audio output channel can be adjusted following the envelope of the respective audio output channel, which can improve the power supply efficiency and reduce distortion while ensuring driving force.

[0187] The control device of the power amplifier chip in the embodiments of the present application can be a component in an electronic device, for example, an integrated circuit or a chip. The electronic device can be a terminal or other device other than a terminal. For example, the electronic device can be a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a Mobile Internet Device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), and can also be a server, a Network Attached Storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, and the like, and the embodiments of the present application are not limited in this regard.

[0188] The electronic device in the embodiments of the present application can be a device with an operating system. The operating system can be an Android operating system, an IOS operating system, or other possible operating systems, and the embodiments of the present application are not limited in this regard.

[0189] The control device of the power amplifier chip provided in the embodiments of the present application can implement the method embodiments Figures 5 to 11 of the present application, and each process of the method embodiments is not repeated here to avoid repetition.

[0190] Optionally, as shown in Figure 13 , the embodiments of the present application further provide an electronic device 1300, which includes a processor 1301 and a memory 1302, and the memory 1302 stores programs or instructions that can be run on the processor 1301. When the programs or instructions are executed by the processor 1301, the programs or instructions output audio signals and / or control instructions to the power amplifier chip, and can achieve the same technical effects as the power amplifier chip, and the details are not repeated here to avoid repetition.

[0191] It should be noted that the electronic device in the embodiments of the present application includes a mobile electronic device and a non-mobile electronic device.

[0192] Figure 14 To implement the hardware structure of an electronic device according to an embodiment of the present application.

[0193] The electronic device 1400 includes, but is not limited to, a radio frequency unit 1401, a network module 1402, an audio output unit 1403, an input unit 1404, a sensor 1405, a display unit 1406, a user input unit 1407, an interface unit 1408, a memory 1409, and a processor 1410, etc.

[0194] Those skilled in the art can understand that the electronic device 1400 can further include a power supply (such as a battery) for supplying power to each component, and the power supply can be logically connected to the processor 1410 through a power management system, so as to realize the functions of managing charging, discharging, and power consumption management through the power management system. Figure 14 The electronic device structure shown in the figure does not constitute a limitation on the electronic device, and the electronic device can include more or fewer components than the figure, or combine certain components, or different component arrangements, which are not described here.

[0195] The processor 1410 is configured to output an audio signal and / or a control instruction to the power amplifier chip, and can achieve the same technical effects as the power amplifier chip. To avoid repetition, details are not described here.

[0196] It should be understood that in the embodiments of the present application, the input unit 1404 can include a graphics processor (GPU) 14041 and a microphone 14042. The graphics processor 14041 processes image data of a still picture or a video obtained by an image capture device (such as a camera) in a video capture mode or an image capture mode. The display unit 1406 can include a display panel 14061, which can be configured in the form of a liquid crystal display, an organic light-emitting diode, etc. The user input unit 1407 includes at least one of a touch panel 14071 and other input devices 14072. The touch panel 14071 is also called a touch screen. The touch panel 14071 can include a touch detection device and a touch controller. The other input devices 14072 can include, but are not limited to, a physical keyboard, function keys (such as volume control keys, on-off keys, etc.), trackballs, mice, joysticks, etc., which are not described here.

[0197] The memory 1409 can be used to store software programs and various data. The memory 1409 can mainly include a first storage area storing programs or instructions and a second storage area storing data, wherein the first storage area can store an operating system, application programs or instructions required by at least one function (such as a sound playing function, an image playing function, etc.), and the like. In addition, the memory 1409 can include a volatile memory or a non-volatile memory, or the memory 1409 can include both volatile and non-volatile memories. The non-volatile memory can be a Read-Only Memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically EPROM (EEPROM), or a flash memory. The volatile memory can be a Random Access Memory (RAM), a Static RAM (SRAM), a Dynamic RAM (DRAM), a Synchronous DRAM (SDRAM), a Double Data Rate SDRAM (DDR SDRAM), an Enhanced SDRAM (ESDRAM), a Synch link DRAM (SLDRAM), and a Direct Rambus RAM (DRRAM). The memory 1409 in the embodiments of the present application includes but is not limited to these and any other suitable types of memories.

[0198] The processor 1410 can include one or more processing units; optionally, the processor 1410 integrates an application processor and a modem processor, wherein the application processor mainly processes operations related to an operating system, a user interface, and an application program, and the modem processor mainly processes wireless communication signals, such as a baseband processor. It can be understood that the above-mentioned modem processor can also not be integrated into the processor 1410.

[0199] The embodiments of the present application also provide a readable storage medium, the readable storage medium stores programs or instructions, the programs or instructions are executed by a processor to realize each process of the control method embodiments of the power amplifier chip, and the same technical effects can be achieved. To avoid repetition, details are not described here.

[0200] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes a computer readable storage medium, such as a computer readable only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc.

[0201] The embodiment of the application provides a computer program product, which is stored in a storage medium, and is executed by at least one processor to realize each process of the control method of the power amplifier chip, and can achieve the same technical effects. To avoid repetition, details are not repeated here.

[0202] It should be noted that in this paper, the term "including", "containing" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the method and device in the embodiment of the application is not limited to the order of the functions shown or discussed, but also includes the functions performed in a substantially simultaneous manner or in the opposite order, for example, the described method can be performed in a different order from the described order, and various steps can also be added, omitted or combined. In addition, the features described with reference to some examples can be combined in other examples.

[0203] From the above description of the embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment method can be realized by software and necessary general hardware platform, of course, it can also be realized by hardware, but in many cases, the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), including a plurality of instructions for making a terminal (which can be a mobile phone, computer, server, or network equipment, etc.) execute the method described in each embodiment of the present application.

[0204] The embodiments of the application are described above in combination with the drawings, but the application is not limited to the above specific embodiments, which are only illustrative and not limiting. Those skilled in the art can make many forms under the inspiration of the application without departing from the scope of the application and the protection scope of the claims.

Claims

1. A power amplifier chip, characterized in that: include: A first power amplifier module, a control module, and at least one boost module; The input end of the first power amplifier module is connected to at least one group of audio signal input pins of the power amplifier chip, the output end of the first power amplifier module is connected to at least one group of audio signal output pins of the power amplifier chip, and multiple groups of parallel power tube paths are provided between the input end and the output end of the first power amplifier module; wherein one power tube path of each group of power tube paths is connected to one output pin of each group of audio signal output pins in the at least one group of audio signal output pins, and another power tube path of each group of power tube paths is connected to another output pin of each group of audio signal output pins in the at least one group of audio signal output pins; Each of the boost modules is respectively connected to the first power amplifier module, and the boost module is used to supply power to one or more power tube paths in the first power amplifier module; The control module is respectively connected to the control end of the first power amplifier module and each of the boost modules, and is used to control multiple groups of power tube paths to be in an on state or a off state between the input end and the output end of the first power amplifier module.

2. The power amplifier chip according to claim 1, characterized in that: The first power amplifier module includes: a first power tube unit, a second power tube unit, and a first inverter; An input end of the first power tube unit is connected to an input end of the first inverter, an output end of the first power tube unit is connected to one output pin of each group of audio signal output pins in the at least one group of audio signal output pins, and a plurality of parallel first power tube paths are provided between the input end and the output end of the first power tube unit; An input end of the second power tube unit is connected to an output end of the first inverter, an output end of the second power tube unit is connected to another output pin of each group of audio signal output pins in the at least one group of audio signal output pins, and a plurality of parallel second power tube paths are provided between the input end and the output end of the second power tube unit; An input terminal of the first inverter is connected to the at least one group of audio signal input pins; A first power tube path and a second power tube path constitute a group of power tube paths.

3. The power amplifier chip according to claim 2, characterized in that: Each of the first power tube paths is provided with a first drive switch and a first power tube connected in series; Each first driving switch on the first power tube path is connected to the control module, and the control module is used to control the switching state of the first driving switch.

4. The power amplifier chip according to claim 2, characterized in that: Each of the second power tube paths is provided with a second drive switch and a second power tube connected in series; Each second driving switch on the second power tube path is connected to the control module, and the control module is used to control the switching state of the second driving switch.

5. The power amplifier chip according to any one of claims 1 to 4, characterized in that: The power amplifier chip has at least two groups of audio signal output pins; the power amplifier chip also includes: a second power amplifier module; The output end of the first power amplifier module is connected to the first group of audio signal output pins among the at least two groups of audio signal output pins; The input end of the second power amplifier module is connected to the at least one group of audio signal input pins, the output end of the second power amplifier module is connected to the second group of audio signal output pins of the at least two groups of audio signal output pins, and multiple groups of parallel power tube paths are provided between the input end and the output end of the second power amplifier module; wherein one power tube path of each group of power tube paths is connected to one output pin of the second group of audio signal output pins, and another power tube path of each group of power tube paths is connected to another output pin of the second group of audio signal output pins; Each of the boost modules is respectively connected to the second power amplifier module, and the boost module is used to supply power to one or more power tube paths in the second power amplifier module; The control module is connected to the control end of the second power amplifier module, and is used to control the multiple groups of power tube paths to be in an on state or a off state between the input end and the output end of the second power amplifier module.

6. The power amplifier chip according to claim 1, characterized in that: The first power amplifier module includes: a third power tube unit, a fourth power tube unit, and a plurality of second inverters; An input end of the third power tube unit is connected to an input end of each second inverter, an output end of the third power tube unit is connected to one output pin of each group of audio signal output pins, and a plurality of parallel third power tube paths are provided between the input end and the output end of the third power tube unit; An input end of the fourth power tube unit is connected to an output end of each second inverter, an output end of the fourth power tube unit is connected to another output pin of each group of audio signal output pins, and a plurality of parallel fourth power tube paths are provided between the input end and the output end of the fourth power tube unit; An input terminal of each of the second inverters is connected to a group of audio signal input pins; A third power tube path and a fourth power tube path constitute a group of power tube paths.

7. The power amplifier chip according to claim 6, characterized in that: Each of the third power tube paths is provided with a third drive switch, a third power tube, and a first power switch; The input end of the third power tube is connected to the input end of each second inverter through the third drive switch, and the output end of the third power tube is connected to one output pin of each group of audio signal output pins through the first power switch; The third drive switch and the first power switch on each of the third power tube paths are connected to the control module, and the control module is used to control the switching states of the third drive switch and the first power switch.

8. The power amplifier chip according to claim 6, characterized in that: Each of the fourth power tube paths is provided with a fourth drive switch, a fourth power tube, and a second power switch; The input end of the fourth power tube is connected to the output end of each second inverter through the fourth drive switch, and the output end of the fourth power tube is connected to another output pin of each group of audio signal output pins through the second power switch; The fourth drive switch and the second power switch on each of the fourth power tube paths are connected to the control module, and the control module is used to control the switching states of the fourth drive switch and the second power switch.

9. The power amplifier chip according to claim 1, characterized in that: Also includes: a plurality of switching units; Each group of power tube paths is connected to each of the boost modules via one of the switching units; The control module is connected to each of the switching units respectively, and the control module is used to control the switching state of the switching unit.

10. The power amplifier chip according to claim 1, characterized in that: Also includes: Digital audio processing module; The input end of the first power amplifier module is connected to the at least one group of audio signal input ends through the digital audio processing module, and the digital audio processing module is connected to the control module; The digital audio processing module is used to calculate the value of the digital audio signal within a preset time period and send the value of the digital audio signal to the control module; In which, the control module controls the number of power tube path groups in the conductive state between the input end and the output end of the first power amplifier module according to the value of the digital audio signal; and / or, the control module calculates the value of the analog audio signal according to the value of the digital audio signal and the gain value of the digital-to-analog conversion, and adjusts the voltage value supplied by the boost module to the one or more power tube paths according to the value of the analog audio signal.

11. An electronic device, characterized in that: The invention comprises the power amplifier chip according to any one of claims 1 to 10.

12. A control method for a power amplifier chip, characterized in that: Applied to the power amplifier chip according to any one of claims 1 to 10, the method comprising: Obtaining the load impedance of each group of audio signal output pins of the power amplifier chip, and / or obtaining the value of the digital audio signal within a preset time period; According to the load impedance and / or the value of the digital audio signal, control the multiple groups of power tube paths between the input end and the output end of the first power amplifier module to be in an on state or a disconnected state, and / or adjust the voltage value of the boost module supplying power to one or more groups of power tube paths.

13. The control method of the power amplifier chip according to claim 12, characterized in that: The controlling, according to the load impedance and the value of the digital audio signal, of the plurality of power tube paths between the input end and the output end of the first power amplifier module to be in an on state or a off state includes: Determine the power tube path corresponding to the audio transmission channel where each group of audio signal output pins is located based on the load impedance of each group of audio signal output pins; According to the value of the digital audio signal on the audio transmission channel where each group of audio signal output pins is located within a preset time period, the power tube path corresponding to the audio transmission channel is controlled to be in an on state or a off state between the input end and the output end of the first power amplifier module.

14. The control method of the power amplifier chip according to claim 12, characterized in that: The controlling, according to the value of the digital audio signal, of the plurality of power tube paths between the input end and the output end of the first power amplifier module to be in an on state or a off state includes: determining a target preset range within which the value of the digital audio signal lies; Determining a target power regulation strategy corresponding to the target preset range based on a predetermined correspondence between a plurality of preset ranges and power regulation strategies; wherein different power regulation strategies correspond to different numbers of power tube path groups in a conductive state between the input end and the output end of the first power amplifier module; According to the target power regulation strategy, the number of power tube path groups in a conducting state between the input end and the output end of the first power amplifier module is controlled.

15. The control method of the power amplifier chip according to claim 12, characterized in that: The step of adjusting the voltage value supplied by the boost module to one or more power tube paths according to the value of the digital audio signal includes: Determining the value of the analog audio signal according to the value of the digital audio signal and the gain value of the digital-to-analog conversion; According to the value of the analog audio signal, the voltage value of the boost module supplying power to one or more groups of power tube paths is adjusted.

16. The control method of the power amplifier chip according to claim 15, characterized in that: The step of adjusting the voltage value supplied by the boost module to one or more power tube paths according to the value of the analog audio signal includes: When the value of the analog audio signal is greater than the voltage value of the power pin of the power amplifier chip, the voltage value supplied by the boost module to one or more power tube paths is adjusted to be greater than the value of the analog audio signal, and the voltage value supplied by the boost module to one or more power tube paths is less than the maximum output voltage value supported by the boost module.

17. A control device for a power amplifier chip, characterized in that: The power amplifier chip according to any one of claims 1 to 10, comprising: an acquisition module, configured to acquire the load impedance of each group of audio signal output terminals of the power amplifier chip, and / or acquire the value of the digital audio signal within a preset time period; A control module is used to control the multiple groups of power tube paths to be in an on state or a off state between the input end and the output end of the first power amplifier module according to the load impedance and / or the value of the digital audio signal, and / or to adjust the voltage value of the boost module supplying power to one or more groups of power tube paths.

18. A readable storage medium, characterized in that: The readable storage medium stores a program or instruction, and when the program or instruction is executed by the processor, the steps of the control method of the power amplifier chip according to any one of claims 12 to 16 are implemented.

19. A computer program product, characterized in that The program product is stored in a storage medium, and is executed by at least one processor to implement the steps of the method for controlling a power amplifier chip according to any one of claims 12 to 16.

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