A SMT printing detection method, system and medium based on 3D scanning

Abstract

The present application provides a method, system and medium for SMT printing detection based on 3D scanning. The method includes: obtaining the working data of the 3D scanning device, the parameter data of the printed circuit board and the parameter data of the steel mesh, processing the obtained data to obtain the steel mesh matching status data and the scanning status data, and calculating the steel mesh matching status data and the scanning status data to obtain the preceding process preparation status data, and then calculating the SMT printing effectiveness index according to the printing scanning data and the standard printing data, and obtaining the SMT printing status data after the threshold comparison of the SMT printing effectiveness index, and then processing the printed circuit board accordingly; thereby, through the judgment of the preceding process preparation status data and the calculation of the SMT printing effectiveness index, the SMT printing status data is obtained, and then the printed circuit board is processed accordingly, so as to realize the SMT printing detection technology based on 3D scanning.

Description

Technical Field

[0001] The present application relates to the field of SMT printing detection, and specifically, to a 3D scanning-based SMT printing detection method, system and medium. Background Art

[0002] Three-dimensional scanning, also known as 3D scanning, refers to a high-tech technology that integrates optical, mechanical, electrical and computer technologies. It is mainly used to scan the spatial shape, structure and color of an object to obtain the spatial coordinates of the object's surface. Surface Mount Technology (SMT) is called surface mounting or surface mounting technology. It is a circuit assembly technology that mounts pinless or short-lead surface mounting components (referred to as SMC / SMD, Chinese called sheet components) on the surface of a printed circuit board (PCB) or other substrates, and assembles them by soldering or dip soldering. In the production process of surface mounting technology (SMT), the quality of solder paste printing has a vital impact on the quality and reliability of the final product. Traditional detection methods are usually based on 2D images, and have limitations such as low detection accuracy and difficulty in fully evaluating the three-dimensional morphology of solder paste. With the development of technology, 3D scanning technology provides new possibilities for SMT printing quality detection. Therefore, how to realize SMT printing detection based on 3D scanning technology has become a problem that needs to be solved at present.

[0003] In view of the above problems, effective technical solutions are urgently needed. Summary of the invention

[0004] The purpose of this application is to provide an SMT printing detection method, system and medium based on 3D scanning, which can obtain SMT printing status data by judging the preparation status data of the previous process and calculating the SMT printing effectiveness index, and then perform corresponding processing on the printed circuit board to realize SMT printing detection technology based on 3D scanning.

[0005] The present application also provides a SMT printing detection method based on 3D scanning, comprising the following steps:

[0006] Obtaining 3D scanning equipment working information, printed circuit board parameter information and steel mesh parameter information, and extracting 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data respectively;

[0007] Obtain stencil matching data according to the printed circuit board parameter data and the stencil parameter data, and obtain stencil matching status data by threshold comparison;

[0008] Processing the working data of the 3D scanning device through a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data;

[0009] Calculate and obtain the preceding process preparation status data according to the steel mesh matching status data and the scanning accuracy status data;

[0010] According to the preparation status data of the preceding process, standard printing data and printing scanning data scanned by a 3D scanning device are obtained, and an SMT printing effectiveness index is calculated;

[0011] Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data;

[0012] The printed circuit board is processed accordingly according to the SMT printing status data.

[0013] Optionally, in the SMT printing detection method based on 3D scanning described in the present application, the obtaining of 3D scanning equipment working information, printed circuit board parameter information and steel mesh parameter information, and extracting 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data respectively, specifically includes:

[0014] Obtain the working information of the 3D scanning device and extract the working data of the 3D scanning device, including the light source stability floating data, the scanning speed floating index and the relative light intensity data;

[0015] Obtain printed circuit board parameter information and extract printed circuit board parameter data, including pad center position data, pad size data and solder mask thickness data;

[0016] Obtain steel mesh parameter information and extract steel mesh parameter data, including steel mesh opening center position data, steel mesh opening size data and steel mesh thickness data.

[0017] Optionally, in the SMT printing detection method based on 3D scanning described in the present application, the processing of obtaining steel mesh matching data according to the printed circuit board parameter data and the steel mesh parameter data, and obtaining steel mesh matching status data by threshold comparison, specifically includes:

[0018] Input the pad center position data, pad size data, solder mask thickness data, stencil opening center position data, stencil opening size data and stencil thickness data into a preset stencil matching detection model for processing to obtain stencil matching data;

[0019] Comparing the steel mesh matching degree data with a preset steel mesh matching degree threshold to obtain steel mesh matching status data;

[0020] If the steel mesh matching degree data is less than or equal to the steel mesh matching degree threshold, the steel mesh matching status data is valid matching status data;

[0021] If the steel mesh matching degree data is greater than the steel mesh matching degree threshold, the steel mesh matching status data is invalid matching status data.

[0022] Optionally, in the SMT printing detection method based on 3D scanning described in the present application, the processing of the working data of the 3D scanning device through a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data specifically includes:

[0023] Inputting the light source stability floating data, the scanning speed floating index and the illumination relative intensity data into a preset scanning accuracy change detection model for processing to obtain a scanning accuracy change index;

[0024] Comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data;

[0025] If the scanning accuracy change index is less than or equal to the scanning accuracy change index threshold, the scanning accuracy status data is valid scanning status data;

[0026] If the scanning accuracy change index is greater than the scanning accuracy change index threshold, the scanning accuracy status data is invalid scanning status data;

[0027] The calculation formula of scanning accuracy change index data in the scanning accuracy change detection model is:

[0028] ;

[0029] in, is the scanning accuracy variation index, Floating data for light source stability, is the scanning speed floating index, is the relative intensity data of light, , , , is the preset characteristic coefficient.

[0030] Optionally, in the SMT printing detection method based on 3D scanning described in the present application, the calculation of the preceding process preparation status data according to the steel mesh matching status data and the scanning accuracy status data specifically includes:

[0031] Performing AND operation on the steel mesh matching status data and the scanning accuracy status data to obtain the preceding process preparation status data;

[0032] The preceding process preparation status data includes ready data and to-be-adjusted status data.

[0033] Optionally, in the SMT printing detection method based on 3D scanning described in the present application, obtaining standard printing data and printing scanning data scanned by a 3D scanning device according to the preparation status data of the previous process, and calculating the SMT printing effectiveness index specifically includes:

[0034] Determine the preparation status data of the preceding process, and if the data is in a state to be adjusted, issue an adjustment warning message;

[0035] If it is ready data, obtain standard printing data, including solder paste standard height data, solder paste standard flatness data and solder paste standard coverage data;

[0036] The printing scanning data is obtained by scanning with a 3D scanning device, including solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data;

[0037] The solder paste standard height data, solder paste standard flatness data, solder paste standard coverage data, solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data are input into a preset printing condition detection model for processing to obtain an SMT printing effectiveness index.

[0038] Optionally, in the SMT printing detection method based on 3D scanning described in the present application, the SMT printing effectiveness index is compared with a preset SMT printing effectiveness index threshold to obtain SMT printing status data, specifically including:

[0039] Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data;

[0040] Extracting a first threshold and a second threshold according to the SMT printing effectiveness index threshold, wherein the first threshold is greater than the second threshold;

[0041] comparing the SMT printing effectiveness index with the first threshold and the second threshold;

[0042] If the SMT printing effectiveness index is greater than the first threshold, the SMT printing status data is unqualified data;

[0043] If the SMT printing effectiveness index is greater than the second threshold and less than or equal to the first threshold, the SMT printing status data is transitional use data;

[0044] If the SMT printing effectiveness index is less than or equal to the second threshold, the SMT printing status data is qualified data.

[0045] Optionally, in the SMT printing detection method based on 3D scanning described in the present application, the corresponding processing of the printed circuit board according to the SMT printing status data specifically includes:

[0046] Determining the SMT printing status data;

[0047] If the SMT printing status data is qualified data, the printed circuit board is transported to the next production process;

[0048] If the SMT printing status data is transitional use data, the printed circuit board is transported to the next production process and a transitional use warning is issued;

[0049] If the SMT printing status data is unqualified data, the printed circuit board is transported to an unqualified area and an early warning is issued.

[0050] In a second aspect, the present application provides an SMT printing detection system based on 3D scanning, the system comprising: a memory and a processor, the memory comprising a program of an SMT printing detection method based on 3D scanning, and the program of the SMT printing detection method based on 3D scanning is executed by the processor to implement the following steps:

[0051] Obtaining 3D scanning equipment working information, printed circuit board parameter information and steel mesh parameter information, and extracting 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data respectively;

[0052] Obtain stencil matching data according to the printed circuit board parameter data and the stencil parameter data, and obtain stencil matching status data by threshold comparison;

[0053] Processing the working data of the 3D scanning device through a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data;

[0054] Calculate and obtain the preceding process preparation status data according to the steel mesh matching status data and the scanning accuracy status data;

[0055] According to the preparation status data of the preceding process, standard printing data and printing scanning data scanned by a 3D scanning device are obtained, and an SMT printing effectiveness index is calculated;

[0056] Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data;

[0057] The printed circuit board is processed accordingly according to the SMT printing status data.

[0058] In a third aspect, the present application also provides a readable storage medium, which includes a 3D scanning-based SMT printing detection method program. When the 3D scanning-based SMT printing detection method program is executed by a processor, the steps of the 3D scanning-based SMT printing detection method as described in any one of the above items are implemented.

[0059] As can be seen from the above, the present application provides an SMT printing detection method, system and medium based on 3D scanning. The method obtains the working data of the 3D scanning device, the parameter data of the printed circuit board and the parameter data of the steel mesh, processes the working data of the 3D scanning device, the parameter data of the printed circuit board and the parameter data of the steel mesh, obtains the steel mesh matching status data and the scanning status data, and calculates the steel mesh matching status data and the scanning status data to obtain the preceding process preparation status data, and then calculates the SMT printing effectiveness index based on the printing scanning data and the standard printing data, obtains the SMT printing status data after the threshold comparison, and finally processes the printed circuit board accordingly; thereby, through the judgment of the preceding process preparation status data and the calculation of the SMT printing effectiveness index, the SMT printing status data is obtained, and then the printed circuit board is processed accordingly, realizing the SMT printing detection technology based on 3D scanning.

[0060] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures particularly pointed out in the written description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0062] Figure 1 A flow chart of a 3D scanning-based SMT printing detection method provided in an embodiment of the present application;

[0063] Figure 2A flow chart of obtaining 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data of the SMT printing detection method based on 3D scanning provided in an embodiment of the present application;

[0064] Figure 3 A flow chart of obtaining steel mesh matching status data of the SMT printing detection method based on 3D scanning provided in an embodiment of the present application;

[0065] Figure 4 A flow chart of obtaining scanning accuracy status data of an SMT printing detection method based on 3D scanning provided in an embodiment of the present application. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0067] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0068] Please refer to Figure 1 , Figure 1 1 is a flow chart of a 3D scanning-based SMT printing detection method in some embodiments of the present application. The 3D scanning-based SMT printing detection method is used in a terminal device, such as a computer. The 3D scanning-based SMT printing detection method comprises the following steps:

[0069] S11, obtaining 3D scanning equipment working information, printed circuit board parameter information and steel mesh parameter information, and extracting 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data respectively;

[0070] S12, obtaining steel mesh matching data according to the printed circuit board parameter data and the steel mesh parameter data, and obtaining steel mesh matching status data by threshold comparison;

[0071] S13, processing the working data of the 3D scanning device through a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data;

[0072] S14, calculating and obtaining the preceding process preparation status data according to the steel mesh matching status data and the scanning accuracy status data;

[0073] S15, acquiring standard printing data and printing scanning data scanned by a 3D scanning device according to the preparation status data of the preceding process, and calculating and obtaining an SMT printing effectiveness index;

[0074] S16, performing a threshold comparison between the SMT printing effectiveness index and a preset SMT printing effectiveness index threshold to obtain SMT printing status data;

[0075] S17, performing corresponding processing on the printed circuit board according to the SMT printing status data.

[0076] Among them, after SMT technology is combined with 3D scanning, in order to better ensure the accuracy of detection, before each SMT operation, the system itself needs to complete its own status detection and judgment, including the steel mesh parameter matching status and scanning accuracy status; first calculate the steel mesh matching data and scanning accuracy change index based on the acquired 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data, and then perform threshold comparison and judgment to obtain the steel mesh matching status data and scanning accuracy status data, and obtain the previous process preparation status data after performing AND operation on the two status data, and then calculate the SMT printing effectiveness index based on the standard printing data and printing scanning data, and then obtain the SMT printing status data after threshold comparison, and finally perform corresponding processing on the printed circuit board according to the SMT printing status data.

[0077] Please refer to Figure 2 , Figure 2 The present invention provides a flow chart of obtaining 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data of the SMT printing detection method based on 3D scanning according to the embodiment of the present invention. According to the embodiment of the present invention, the 3D scanning equipment working information, printed circuit board parameter information and steel mesh parameter information are obtained, and the 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data are extracted respectively, specifically including:

[0078] S21, obtaining working information of the 3D scanning device, and extracting working data of the 3D scanning device, including light source stability floating data, scanning speed floating index, and light relative intensity data;

[0079] S22, obtaining printed circuit board parameter information, and extracting printed circuit board parameter data, including pad center position data, pad size data, and solder mask thickness data;

[0080] S23, obtaining steel mesh parameter information, and extracting steel mesh parameter data, including steel mesh opening center position data, steel mesh opening size data, and steel mesh thickness data.

[0081] Among them, obtaining the working information of the 3D scanning device refers to obtaining the parameter information of the 3D scanning device when it is in the power-on state, so as to extract the working data of the 3D scanning device. The light source stability floating data refers to the data that reflects the stability of the light source used by the scanning device to a certain extent. The smaller the light source stability floating data, the smaller the light source changes, and the more conducive to work. The scanning speed floating index refers to the data on the floating size of the actual running speed of the scanning device compared with the preset standard speed. The relative intensity of light refers to the change size of the actual intensity of light compared with the preset standard intensity. The printed circuit board parameter data refers to the parameters of the printed circuit board itself. The pad center position data refers to the center position data of the pad on the printed circuit board. The data is based on the X-axis and Y-axis coordinates of the center of the pad, with the marking point of the entire circuit board as the origin. The pad size data refers to the size data of the pad, and the solder mask thickness data refers to the thickness of the solder mask in the printed circuit board. Stencils, also known as SMT templates, are a type of SMT special mold. Their main function is to help the deposition of solder paste, with the aim of transferring an accurate amount of solder paste to the accurate position parameters on the empty PCB. Stencil parameter data refers to data that reflects the parameters of the stencil itself. The stencil opening center position data refers to the center position coordinate data of the opening in the stencil, including the X-axis and Y-axis coordinates. The stencil opening size data refers to the size data of each opening in the stencil. The stencil thickness data reflects the solder paste thickness data that the opening can withstand.

[0082] Please refer to Figure 3 , Figure 3 The flowchart of obtaining steel mesh matching status data of the SMT printing detection method based on 3D scanning provided in the embodiment of the present application. According to the embodiment of the present invention, the steel mesh matching degree data is obtained according to the printed circuit board parameter data and the steel mesh parameter data, and the steel mesh matching status data is obtained by threshold comparison, specifically including:

[0083] S31, inputting the pad center position data, pad size data, solder mask thickness data, stencil opening center position data, stencil opening size data and stencil thickness data into a preset stencil matching detection model for processing, to obtain stencil matching data;

[0084] S32, comparing the steel mesh matching degree data with a preset steel mesh matching degree threshold to obtain steel mesh matching status data;

[0085] S33, if the steel mesh matching degree data is less than or equal to the steel mesh matching degree threshold, the steel mesh matching status data is valid matching status data;

[0086] S34: If the steel mesh matching degree data is greater than the steel mesh matching degree threshold, the steel mesh matching status data is invalid matching status data.

[0087] Among them, before the patch production, the first thing that needs to be confirmed is the matching degree between the steel mesh and the printed circuit board. Only the steel mesh and printed circuit board that match each other can be better produced. Therefore, the pad center position data, pad size data, solder mask thickness data, steel mesh opening center position data, steel mesh opening size data and steel mesh thickness data are processed through the preset steel mesh matching detection model to obtain the steel mesh matching data. The steel mesh matching data refers to the matching degree between the steel mesh and the corresponding printed circuit board. The steel mesh matching data is less than or equal to the steel mesh matching threshold, indicating that the difference between the two is relatively small, and the matching status data is the effective matching status data, that is, the steel mesh and the printed circuit board are matched. Brush circuit board matching is suitable for production, and the value is 1 in this embodiment; on the contrary, if the steel mesh matching data is greater than the steel mesh matching threshold, it means that the difference is relatively large, and the steel mesh matching status data is invalid matching status data, that is, the steel mesh does not match the printed circuit board, and it will produce unqualified or more unqualified products when used in production. In this embodiment, the value is 0; the preset steel mesh matching detection model is a calculation model obtained by obtaining a large amount of pad center position data, pad size data, solder mask thickness data, steel mesh opening center position data, steel mesh opening size data and steel mesh thickness data, and then training the model to obtain the steel mesh matching data.

[0088] The calculation formula of steel mesh matching data in the preset steel mesh matching detection model is:

[0089] ;

[0090] in, is the steel mesh matching data, , are the horizontal and vertical coordinates of the center position data of the i-th pad, respectively. , are the horizontal and vertical coordinates in the steel mesh opening center position data corresponding to the i-th pad center position data, is the pad size data corresponding to the i-th pad center position data, is the steel mesh opening size data corresponding to the center position data of the i-th pad, is the steel mesh thickness data, is the solder mask thickness data, n is the number of data of the center position of the pad in the printed circuit board, the number of data of the pad size, the number of data of the center position of the steel mesh opening in the steel mesh, the number of data of the steel mesh opening size, , , , , It is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset SMT printing detection platform based on 3D scanning).

[0091] Please refer to Figure 4 , Figure 4 The present invention provides a flowchart of obtaining scanning accuracy status data of the SMT printing detection method based on 3D scanning according to the embodiment of the present invention. According to the embodiment of the present invention, the scanning accuracy change index is obtained by processing the working data of the 3D scanning device through a preset scanning accuracy change detection model, and the scanning accuracy change index is compared with a preset scanning accuracy change index threshold to obtain scanning accuracy status data, specifically including:

[0092] S41, inputting the light source stability floating data, the scanning speed floating index and the illumination relative intensity data into a preset scanning accuracy change detection model for processing to obtain a scanning accuracy change index;

[0093] S42, comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data;

[0094] S43, if the scanning accuracy change index is less than or equal to the scanning accuracy change index threshold, the scanning accuracy status data is valid scanning status data;

[0095] S44, if the scanning accuracy change index is greater than the scanning accuracy change index threshold, the scanning accuracy status data is invalid scanning status data;

[0096] The calculation formula of scanning accuracy change index data in the scanning accuracy change detection model is:

[0097] ;

[0098] in, is the scanning accuracy variation index, Floating data for light source stability, is the scanning speed floating index, is the relative intensity data of light, , , , It is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset SMT printing detection platform based on 3D scanning).

[0099] The scanning accuracy variation index refers to data that can reflect the fluctuation of the accuracy of the data obtained by scanning when the scanner is working to a certain extent. The light source stability fluctuation data, the scanning speed fluctuation index and the relative intensity of light data can be processed by the preset scanning accuracy variation detection model to obtain the scanning accuracy index, and then the scanning accuracy variation index is compared with the preset scanning accuracy variation index threshold to obtain the scanning accuracy status data. The scanning accuracy status data reflects the working status of the scanning device. The valid scanning status data means that the device can obtain valid scanning data in this state, and the value is 1 in this embodiment. The invalid scanning status data means that the device cannot obtain valid scanning data in this state, and the value is 0 in this embodiment. The preset scanning accuracy variation detection model is a calculation model obtained by obtaining a large amount of light source stability fluctuation data, scanning speed fluctuation index and relative intensity of light data, and then training the model, and the scanning accuracy variation index can be calculated. In this embodiment, the scanning accuracy variation index threshold is set to: [0, 0.3], the scanning accuracy status data is valid scanning status data; (0.3, 1], the scanning accuracy status data is invalid scanning status data; when the scanning accuracy variation index calculated is 0.25, the scanning accuracy status data is valid scanning status data.

[0100] According to an embodiment of the present invention, the calculation of the preceding process preparation status data based on the steel mesh matching status data and the scanning accuracy status data specifically includes:

[0101] Performing AND operation on the steel mesh matching status data and the scanning accuracy status data to obtain the preceding process preparation status data;

[0102] The preceding process preparation status data includes ready data and to-be-adjusted status data.

[0103] Among them, the preparation status data of the previous process refers to the steel mesh matching status data and the scanning accuracy status data as the preparation status data of the previous process. Only when both are ready can the next process or process be continued. The preparation status data of the previous process includes ready data and pending adjustment status data. The pending adjustment status data means that the previous process needs to be further adjusted before the next process can be carried out;

[0104] The calculation formula for the preparation status data of the previous process is:

[0105] ;

[0106] in, Prepare status data for the previous process, For steel mesh matching status data, It is the scanning accuracy status data.

[0107] According to an embodiment of the present invention, the method of acquiring standard printing data and printing scanning data scanned by a 3D scanning device according to the preparation status data of the preceding process, and calculating the SMT printing effectiveness index specifically includes:

[0108] Determine the preparation status data of the preceding process, and if the data is in a state to be adjusted, issue an adjustment warning message;

[0109] If it is ready data, obtain standard printing data, including solder paste standard height data, solder paste standard flatness data and solder paste standard coverage data;

[0110] The printing scanning data is obtained by scanning with a 3D scanning device, including solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data;

[0111] The solder paste standard height data, solder paste standard flatness data, solder paste standard coverage data, solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data are input into a preset printing condition detection model for processing to obtain an SMT printing effectiveness index.

[0112] Among them, when carrying out SMT production, standard printing data will be designed according to the conditions of components and printed circuit boards. The standard height data of solder paste refers to the standard height of solder paste printed on the pad of the printed circuit board during printing. The solder paste may sometimes be uneven during printing, which will affect the welding effect of components, so the standard flatness data of solder paste is obtained. The standard coverage data of solder paste refers to the standard data reflecting the coverage of the solder pad by the solder paste printed on the circuit board; the solder paste scanning height data, the solder paste scanning flatness data and the solder paste scanning coverage data refer to the actual printing data obtained by scanning with a scanning device; the SMT printing effectiveness index refers to the data reflecting the effectiveness of printing; the preset printing condition detection model is a calculation model obtained by obtaining a large amount of solder paste standard height data, solder paste standard flatness data, solder paste standard coverage data, solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data, and then training the model, which can calculate the SMT printing effectiveness index;

[0113] The calculation formula of SMT printing effectiveness index in the printing condition detection model is:

[0114] ;

[0115] in, is the SMT printing effectiveness index, , , They are solder paste standard height data, solder paste standard flatness data and solder paste standard coverage data. , , They are solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data. , , It is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset SMT printing detection platform based on 3D scanning).

[0116] According to an embodiment of the present invention, the SMT printing effectiveness index is compared with a preset SMT printing effectiveness index threshold to obtain SMT printing status data, specifically including:

[0117] Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data;

[0118] Extracting a first threshold and a second threshold according to the SMT printing effectiveness index threshold, wherein the first threshold is greater than the second threshold;

[0119] comparing the SMT printing effectiveness index with the first threshold and the second threshold;

[0120] If the SMT printing effectiveness index is greater than the first threshold, the SMT printing status data is unqualified data;

[0121] If the SMT printing effectiveness index is greater than the second threshold and less than or equal to the first threshold, the SMT printing status data is transitional use data;

[0122] If the SMT printing effectiveness index is less than or equal to the second threshold, the SMT printing status data is qualified data.

[0123] The transitional use data means that although the data can be used in transition under this state, there is still a certain gap with the standard requirements and needs to be improved. In this embodiment, the SMT printing effectiveness index threshold is set to: [0, 0.3], the SMT printing status data is qualified data; (0.3, 0.5], the SMT printing status data is transitional use data; (0.5, 1], the SMT printing status data is unqualified data; when the calculated SMT printing effectiveness index is 0.25, the SMT printing status data is qualified data.

[0124] According to an embodiment of the present invention, the corresponding processing of the printed circuit board according to the SMT printing status data specifically includes:

[0125] Determining the SMT printing status data;

[0126] If the SMT printing status data is qualified data, the printed circuit board is transported to the next production process;

[0127] If the SMT printing status data is transitional use data, the printed circuit board is transported to the next production process and a transitional use warning is issued;

[0128] If the SMT printing status data is unqualified data, the printed circuit board is transported to an unqualified area and an early warning is issued.

[0129] Among them, according to the SMT printing status data, the usage of the printed circuit board can be judged. When it is qualified data, it can be directly transferred to the next process. When it is transitional use data, the printed circuit board will also be transferred to the next process, but a transitional use warning will be issued. Users can further handle it as needed, such as suspending use.

[0130] The present invention also discloses a 3D scanning-based SMT printing detection system, comprising a memory and a processor, wherein the memory comprises a 3D scanning-based SMT printing detection method program, and when the 3D scanning-based SMT printing detection method program is executed by the processor, the following steps are implemented:

[0131] Obtaining 3D scanning equipment working information, printed circuit board parameter information and steel mesh parameter information, and extracting 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data respectively;

[0132] Obtain stencil matching data according to the printed circuit board parameter data and the stencil parameter data, and obtain stencil matching status data by threshold comparison;

[0133] Processing the working data of the 3D scanning device through a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data;

[0134] Calculate and obtain the preceding process preparation status data according to the steel mesh matching status data and the scanning accuracy status data;

[0135] According to the preparation status data of the preceding process, standard printing data and printing scanning data scanned by a 3D scanning device are obtained, and an SMT printing effectiveness index is calculated;

[0136] Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data;

[0137] The printed circuit board is processed accordingly according to the SMT printing status data.

[0138] Among them, after SMT technology is combined with 3D scanning, in order to better ensure the accuracy of detection, before each SMT operation, the system itself needs to complete its own status detection and judgment, including the steel mesh parameter matching status and scanning accuracy status; first calculate the steel mesh matching data and scanning accuracy change index based on the acquired 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data, and then perform threshold comparison and judgment to obtain the steel mesh matching status data and scanning accuracy status data, and obtain the previous process preparation status data after performing AND operation on the two status data, and then calculate the SMT printing effectiveness index based on the standard printing data and printing scanning data, and then obtain the SMT printing status data after threshold comparison, and finally perform corresponding processing on the printed circuit board according to the SMT printing status data.

[0139] According to an embodiment of the present invention, the obtaining of 3D scanning device working information, printed circuit board parameter information and steel mesh parameter information, and extracting 3D scanning device working data, printed circuit board parameter data and steel mesh parameter data respectively, specifically includes:

[0140] Obtain the working information of the 3D scanning device and extract the working data of the 3D scanning device, including the light source stability floating data, the scanning speed floating index and the relative light intensity data;

[0141] Obtain printed circuit board parameter information and extract printed circuit board parameter data, including pad center position data, pad size data and solder mask thickness data;

[0142] Obtain steel mesh parameter information and extract steel mesh parameter data, including steel mesh opening center position data, steel mesh opening size data and steel mesh thickness data.

[0143] Among them, obtaining the working information of the 3D scanning device refers to obtaining the parameter information of the 3D scanning device when it is in the power-on state, so as to extract the working data of the 3D scanning device. The light source stability floating data refers to the data that reflects the stability of the light source used by the scanning device to a certain extent. The smaller the light source stability floating data, the smaller the light source changes, and the more conducive to work. The scanning speed floating index refers to the data on the floating size of the actual running speed of the scanning device compared with the preset standard speed. The relative intensity of light refers to the change size of the actual intensity of light compared with the preset standard intensity. The printed circuit board parameter data refers to the parameters of the printed circuit board itself. The pad center position data refers to the center position data of the pad on the printed circuit board. The data is based on the X-axis and Y-axis coordinates of the center of the pad, with the marking point of the entire circuit board as the origin. The pad size data refers to the size data of the pad, and the solder mask thickness data refers to the thickness of the solder mask in the printed circuit board. Stencils, also known as SMT templates, are a type of SMT special mold. Their main function is to help the deposition of solder paste, with the aim of transferring an accurate amount of solder paste to the accurate position parameters on the empty PCB. Stencil parameter data refers to data that reflects the parameters of the stencil itself. The stencil opening center position data refers to the center position coordinate data of the opening in the stencil, including the X-axis and Y-axis coordinates. The stencil opening size data refers to the size data of each opening in the stencil. The stencil thickness data reflects the solder paste thickness data that the opening can withstand.

[0144] According to an embodiment of the present invention, the processing of the printed circuit board parameter data and the steel mesh parameter data to obtain the steel mesh matching data, and obtaining the steel mesh matching status data by threshold comparison, specifically includes:

[0145] Input the pad center position data, pad size data, solder mask thickness data, stencil opening center position data, stencil opening size data and stencil thickness data into a preset stencil matching detection model for processing to obtain stencil matching data;

[0146] Comparing the steel mesh matching degree data with a preset steel mesh matching degree threshold to obtain steel mesh matching status data;

[0147] If the steel mesh matching degree data is less than or equal to the steel mesh matching degree threshold, the steel mesh matching status data is valid matching status data;

[0148] If the steel mesh matching degree data is greater than the steel mesh matching degree threshold, the steel mesh matching status data is invalid matching status data.

[0149] Among them, before the patch production, the first thing that needs to be confirmed is the matching degree between the steel mesh and the printed circuit board. Only the steel mesh and printed circuit board that match each other can be better produced. Therefore, the pad center position data, pad size data, solder mask thickness data, steel mesh opening center position data, steel mesh opening size data and steel mesh thickness data are processed through the preset steel mesh matching detection model to obtain the steel mesh matching data. The steel mesh matching data refers to the matching degree between the steel mesh and the corresponding printed circuit board. The steel mesh matching data is less than or equal to the steel mesh matching threshold, indicating that the difference between the two is relatively small, and the matching status data is the effective matching status data, that is, the steel mesh and the printed circuit board are matched. Brush circuit board matching is suitable for production, and the value is 1 in this embodiment; on the contrary, if the steel mesh matching data is greater than the steel mesh matching threshold, it means that the difference is relatively large, and the steel mesh matching status data is invalid matching status data, that is, the steel mesh does not match the printed circuit board, and it will produce unqualified or more unqualified products when used in production. In this embodiment, the value is 0; the preset steel mesh matching detection model is a calculation model obtained by obtaining a large amount of pad center position data, pad size data, solder mask thickness data, steel mesh opening center position data, steel mesh opening size data and steel mesh thickness data, and then training the model to obtain the steel mesh matching data.

[0150] The calculation formula of steel mesh matching data in the preset steel mesh matching detection model is:

[0151] ;

[0152] in, is the steel mesh matching data, , are the horizontal and vertical coordinates of the center position data of the i-th pad, respectively. , are the horizontal and vertical coordinates in the steel mesh opening center position data corresponding to the i-th pad center position data, is the pad size data corresponding to the i-th pad center position data, is the steel mesh opening size data corresponding to the center position data of the i-th pad, is the steel mesh thickness data, is the solder mask thickness data, n is the number of data of the center position of the pad in the printed circuit board, the number of data of the pad size, the number of data of the center position of the steel mesh opening in the steel mesh, the number of data of the steel mesh opening size, , , , , It is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset SMT printing detection platform based on 3D scanning).

[0153] According to an embodiment of the present invention, the 3D scanning device working data is processed by a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and the scanning accuracy change index is compared with a preset scanning accuracy change index threshold to obtain scanning accuracy status data, specifically including:

[0154] Inputting the light source stability floating data, the scanning speed floating index and the illumination relative intensity data into a preset scanning accuracy change detection model for processing to obtain a scanning accuracy change index;

[0155] Comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data;

[0156] If the scanning accuracy change index is less than or equal to the scanning accuracy change index threshold, the scanning accuracy status data is valid scanning status data;

[0157] If the scanning accuracy change index is greater than the scanning accuracy change index threshold, the scanning accuracy status data is invalid scanning status data;

[0158] The calculation formula of the scanning accuracy change index data in the scanning accuracy change detection model is:

[0159] ;

[0160] in, is the scanning accuracy variation index, Floating data for light source stability, is the scanning speed floating index, is the relative intensity data of light, , , , It is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset SMT printing detection platform based on 3D scanning).

[0161] The scanning accuracy variation index refers to data that can reflect the fluctuation of the accuracy of the data obtained by scanning when the scanner is working to a certain extent. The light source stability fluctuation data, the scanning speed fluctuation index and the relative intensity of light data can be processed by the preset scanning accuracy variation detection model to obtain the scanning accuracy index, and then the scanning accuracy variation index is compared with the preset scanning accuracy variation index threshold to obtain the scanning accuracy status data. The scanning accuracy status data reflects the working status of the scanning device. The valid scanning status data means that the device can obtain valid scanning data in this state, and the value is 1 in this embodiment. The invalid scanning status data means that the device cannot obtain valid scanning data in this state, and the value is 0 in this embodiment. The preset scanning accuracy variation detection model is a calculation model obtained by obtaining a large amount of light source stability fluctuation data, scanning speed fluctuation index and relative intensity of light data, and then training the model, and the scanning accuracy variation index can be calculated. In this embodiment, the scanning accuracy variation index threshold is set to: [0, 0.3], the scanning accuracy status data is valid scanning status data; (0.3, 1], the scanning accuracy status data is invalid scanning status data; when the scanning accuracy variation index calculated is 0.25, the scanning accuracy status data is valid scanning status data.

[0162] According to an embodiment of the present invention, the calculation of the preceding process preparation status data based on the steel mesh matching status data and the scanning accuracy status data specifically includes:

[0163] Performing AND operation on the steel mesh matching status data and the scanning accuracy status data to obtain the preceding process preparation status data;

[0164] The preceding process preparation status data includes ready data and to-be-adjusted status data.

[0165] Among them, the preparation status data of the previous process refers to the steel mesh matching status data and the scanning accuracy status data as the preparation status data of the previous process. Only when both are ready can the next process or process be continued. The preparation status data of the previous process includes ready data and pending adjustment status data. The pending adjustment status data means that the previous process needs to be further adjusted before the next process can be carried out;

[0166] The calculation formula for the preparation status data of the previous process is:

[0167] ;

[0168] in, Prepare status data for the previous process, For steel mesh matching status data, It is the scanning accuracy status data.

[0169] According to an embodiment of the present invention, the method of acquiring standard printing data and printing scanning data scanned by a 3D scanning device according to the preparation status data of the preceding process, and calculating the SMT printing effectiveness index specifically includes:

[0170] Determine the preparation status data of the preceding process, and if the data is in a state to be adjusted, issue an adjustment warning message;

[0171] If it is ready data, obtain standard printing data, including solder paste standard height data, solder paste standard flatness data and solder paste standard coverage data;

[0172] The printing scanning data is obtained by scanning with a 3D scanning device, including solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data;

[0173] The solder paste standard height data, solder paste standard flatness data, solder paste standard coverage data, solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data are input into a preset printing condition detection model for processing to obtain an SMT printing effectiveness index.

[0174] Among them, when carrying out SMT production, standard printing data will be designed according to the conditions of components and printed circuit boards. The standard height data of solder paste refers to the standard height of solder paste printed on the pad of the printed circuit board during printing. The solder paste may sometimes be uneven during printing, which will affect the welding effect of components, so the standard flatness data of solder paste is obtained. The standard coverage data of solder paste refers to the standard data reflecting the coverage of the solder pad by the solder paste printed on the circuit board; the solder paste scanning height data, the solder paste scanning flatness data and the solder paste scanning coverage data refer to the actual printing data obtained by scanning with a scanning device; the SMT printing effectiveness index refers to the data reflecting the effectiveness of printing; the preset printing condition detection model is a calculation model obtained by obtaining a large amount of solder paste standard height data, solder paste standard flatness data, solder paste standard coverage data, solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data, and then training the model, which can calculate the SMT printing effectiveness index;

[0175] The calculation formula of SMT printing effectiveness index in the printing condition detection model is:

[0176] ;

[0177] in, is the SMT printing effectiveness index, , , They are solder paste standard height data, solder paste standard flatness data and solder paste standard coverage data. , , They are solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data. , , It is the preset characteristic coefficient (the characteristic coefficient is obtained by querying the preset SMT printing detection platform based on 3D scanning).

[0178] According to an embodiment of the present invention, the SMT printing effectiveness index is compared with a preset SMT printing effectiveness index threshold to obtain SMT printing status data, specifically including:

[0179] Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data;

[0180] Extracting a first threshold and a second threshold according to the SMT printing effectiveness index threshold, wherein the first threshold is greater than the second threshold;

[0181] comparing the SMT printing effectiveness index with the first threshold and the second threshold;

[0182] If the SMT printing effectiveness index is greater than the first threshold, the SMT printing status data is unqualified data;

[0183] If the SMT printing effectiveness index is greater than the second threshold and less than or equal to the first threshold, the SMT printing status data is transitional use data;

[0184] If the SMT printing effectiveness index is less than or equal to the second threshold, the SMT printing status data is qualified data.

[0185] The transitional use data means that although the data can be used in transition under this state, there is still a certain gap with the standard requirements and needs to be improved. In this embodiment, the SMT printing effectiveness index threshold is set to: [0, 0.3], the SMT printing status data is qualified data; (0.3, 0.5], the SMT printing status data is transitional use data; (0.5, 1], the SMT printing status data is unqualified data; when the calculated SMT printing effectiveness index is 0.25, the SMT printing status data is qualified data.

[0186] According to an embodiment of the present invention, the corresponding processing of the printed circuit board according to the SMT printing status data specifically includes:

[0187] Determining the SMT printing status data;

[0188] If the SMT printing status data is qualified data, the printed circuit board is transported to the next production process;

[0189] If the SMT printing status data is transitional use data, the printed circuit board is transported to the next production process and a transitional use warning is issued;

[0190] If the SMT printing status data is unqualified data, the printed circuit board is transported to an unqualified area and an early warning is issued.

[0191] Among them, according to the SMT printing status data, the usage of the printed circuit board can be judged. When it is qualified data, it can be directly transferred to the next process. When it is transitional use data, the printed circuit board will also be transferred to the next process, but a transitional use warning will be issued. Users can further handle it as needed, such as suspending use.

[0192] A third aspect of the present invention provides a readable storage medium, which includes a 3D scanning-based SMT printing detection method program. When the 3D scanning-based SMT printing detection method program is executed by a processor, the steps of the 3D scanning-based SMT printing detection method as described in any one of the above items are implemented.

[0193] The SMT printing detection method, system and medium based on 3D scanning disclosed in the present invention obtain the working data of 3D scanning equipment, the parameter data of printed circuit board and the parameter data of steel mesh, and obtain the steel mesh matching status data and scanning status data after processing the working data of 3D scanning equipment, the parameter data of printed circuit board and the parameter data of steel mesh, and obtain the preparation status data of the preceding process after calculating the steel mesh matching status data and the scanning status data, and then obtain the SMT printing effectiveness index according to the printing scanning data and the standard printing data, obtain the SMT printing status data after performing threshold comparison on the SMT printing effectiveness index, and finally process the printed circuit board accordingly; thereby, the SMT printing status data is obtained by judging the preparation status data of the preceding process and calculating the SMT printing effectiveness index, and then the printed circuit board is processed accordingly, thereby realizing the SMT printing detection technology based on 3D scanning.

[0194] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0195] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; they may be located in one place or distributed on multiple network units; some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0196] In addition, all functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately used as a unit, or two or more units may be integrated into one unit; the above-mentioned integrated units may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0197] Those skilled in the art can understand that: all or part of the steps of implementing the above method embodiments can be completed by hardware related to program instructions, the aforementioned program can be stored in a readable storage medium, and when the program is executed, it executes the steps of the above method embodiments; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), disks or optical disks, and other media that can store program codes.

[0198] Alternatively, if the above-mentioned integrated unit of the present invention is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present invention can be essentially or partly reflected in the form of a software product that contributes to the prior art. The software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROM, RAM, magnetic disks or optical disks.

Claims

1. A SMT printing detection method based on 3D scanning, It is characterized in that include: Obtaining 3D scanning equipment working information, printed circuit board parameter information and steel mesh parameter information, and extracting 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data respectively; Obtain stencil matching data according to the printed circuit board parameter data and the stencil parameter data, and obtain stencil matching status data by threshold comparison; Processing the working data of the 3D scanning device through a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data; Calculate and obtain the preceding process preparation status data according to the steel mesh matching status data and the scanning accuracy status data; According to the preparation status data of the preceding process, standard printing data and printing scanning data scanned by a 3D scanning device are obtained, and an SMT printing effectiveness index is calculated; Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data; Perform corresponding processing on the printed circuit board according to the SMT printing status data; The obtaining of the working information of the 3D scanning device, the parameter information of the printed circuit board and the parameter information of the steel mesh, and extracting the working data of the 3D scanning device, the parameter data of the printed circuit board and the parameter data of the steel mesh respectively, specifically includes: Obtain the working information of the 3D scanning device and extract the working data of the 3D scanning device, including the light source stability floating data, the scanning speed floating index and the relative light intensity data; Obtain printed circuit board parameter information and extract printed circuit board parameter data, including pad center position data, pad size data and solder mask thickness data; Obtain steel mesh parameter information and extract steel mesh parameter data, including steel mesh opening center position data, steel mesh opening size data and steel mesh thickness data; The step of obtaining steel mesh matching data according to the printed circuit board parameter data and the steel mesh parameter data, and obtaining steel mesh matching status data by threshold comparison specifically includes: Input the pad center position data, pad size data, solder mask thickness data, stencil opening center position data, stencil opening size data and stencil thickness data into a preset stencil matching detection model for processing to obtain stencil matching data; Comparing the steel mesh matching degree data with a preset steel mesh matching degree threshold to obtain steel mesh matching status data; If the steel mesh matching degree data is less than or equal to the steel mesh matching degree threshold, the steel mesh matching status data is valid matching status data; If the steel mesh matching degree data is greater than the steel mesh matching degree threshold, the steel mesh matching status data is invalid matching status data.

2. According to claim 1, a SMT printing detection method based on 3D scanning, It is characterized in that The method of processing the working data of the 3D scanning device through a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data specifically includes: Inputting the light source stability floating data, the scanning speed floating index and the illumination relative intensity data into a preset scanning accuracy change detection model for processing to obtain a scanning accuracy change index; Comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data; If the scanning accuracy change index is less than or equal to the scanning accuracy change index threshold, the scanning accuracy status data is valid scanning status data; If the scanning accuracy change index is greater than the scanning accuracy change index threshold, the scanning accuracy status data is invalid scanning status data; The calculation formula of scanning accuracy change index data in the scanning accuracy change detection model is: ； in, is the scanning accuracy variation index, Floating data for light source stability, is the scanning speed floating index, is the relative intensity data of light, , , , is the preset characteristic coefficient.

3. According to claim 2, a 3D scanning-based SMT printing detection method, It is characterized in that The calculating and obtaining the preceding process preparation status data according to the steel mesh matching status data and the scanning accuracy status data specifically includes: Performing AND operation on the steel mesh matching status data and the scanning accuracy status data to obtain the preceding process preparation status data; The preceding process preparation status data includes ready data and to-be-adjusted status data.

4. According to the SMT printing detection method based on 3D scanning according to claim 3, It is characterized in that The method of obtaining the standard printing data and the printing scanning data scanned by the 3D scanning device according to the preparation status data of the preceding process, and calculating the SMT printing effectiveness index specifically includes: Determine the preparation status data of the preceding process, and if the data is in a state to be adjusted, issue an adjustment warning message; If it is ready data, obtain standard printing data, including solder paste standard height data, solder paste standard flatness data and solder paste standard coverage data; The printing scanning data is obtained by scanning with a 3D scanning device, including solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data; The solder paste standard height data, solder paste standard flatness data, solder paste standard coverage data, solder paste scanning height data, solder paste scanning flatness data and solder paste scanning coverage data are input into a preset printing condition detection model for processing to obtain an SMT printing effectiveness index.

5. The SMT printing detection method based on 3D scanning according to claim 4, It is characterized in that The step of comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data specifically includes: Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data; Extracting a first threshold and a second threshold according to the SMT printing effectiveness index threshold, wherein the first threshold is greater than the second threshold; comparing the SMT printing effectiveness index with the first threshold and the second threshold; If the SMT printing effectiveness index is greater than the first threshold, the SMT printing status data is unqualified data; If the SMT printing effectiveness index is greater than the second threshold and less than or equal to the first threshold, the SMT printing status data is transitional use data; If the SMT printing effectiveness index is less than or equal to the second threshold, the SMT printing status data is qualified data.

6. The SMT printing detection method based on 3D scanning according to claim 5, It is characterized in that The corresponding processing of the printed circuit board according to the SMT printing status data specifically includes: Determining the SMT printing status data; If the SMT printing status data is qualified data, the printed circuit board is transported to the next production process; If the SMT printing status data is transitional use data, the printed circuit board is transported to the next production process and a transitional use warning is issued; If the SMT printing status data is unqualified data, the printed circuit board is transported to an unqualified area and an early warning is issued.

7. A SMT printing inspection system based on 3D scanning, It is characterized in that The invention comprises a memory and a processor, wherein the memory comprises a SMT printing detection method program based on 3D scanning, and the SMT printing detection method program based on 3D scanning is executed by the processor to implement the following steps: Obtaining 3D scanning equipment working information, printed circuit board parameter information and steel mesh parameter information, and extracting 3D scanning equipment working data, printed circuit board parameter data and steel mesh parameter data respectively; Obtain stencil matching data according to the printed circuit board parameter data and the stencil parameter data, and obtain stencil matching status data by threshold comparison; Processing the working data of the 3D scanning device through a preset scanning accuracy change detection model to obtain a scanning accuracy change index, and comparing the scanning accuracy change index with a preset scanning accuracy change index threshold to obtain scanning accuracy status data; Calculate and obtain the preceding process preparation status data according to the steel mesh matching status data and the scanning accuracy status data; According to the preceding process preparation status data, standard printing data and printing scanning data scanned by a 3D scanning device are acquired, and an SMT printing effectiveness index is calculated; Comparing the SMT printing effectiveness index with a preset SMT printing effectiveness index threshold to obtain SMT printing status data; Perform corresponding processing on the printed circuit board according to the SMT printing status data; The obtaining of the working information of the 3D scanning device, the parameter information of the printed circuit board and the parameter information of the steel mesh, and extracting the working data of the 3D scanning device, the parameter data of the printed circuit board and the parameter data of the steel mesh respectively, specifically includes: Obtain the working information of the 3D scanning device and extract the working data of the 3D scanning device, including the light source stability floating data, the scanning speed floating index and the relative light intensity data; Obtain printed circuit board parameter information and extract printed circuit board parameter data, including pad center position data, pad size data and solder mask thickness data; Obtain steel mesh parameter information and extract steel mesh parameter data, including steel mesh opening center position data, steel mesh opening size data and steel mesh thickness data; The step of obtaining steel mesh matching data according to the printed circuit board parameter data and the steel mesh parameter data, and obtaining steel mesh matching status data by threshold comparison specifically includes: Input the pad center position data, pad size data, solder mask thickness data, stencil opening center position data, stencil opening size data and stencil thickness data into a preset stencil matching detection model for processing to obtain stencil matching data; Comparing the steel mesh matching degree data with a preset steel mesh matching degree threshold to obtain steel mesh matching status data; If the steel mesh matching degree data is less than or equal to the steel mesh matching degree threshold, the steel mesh matching status data is valid matching status data; If the steel mesh matching degree data is greater than the steel mesh matching degree threshold, the steel mesh matching status data is invalid matching status data.

8. A computer-readable storage medium, It is characterized in that The computer-readable storage medium includes a 3D scanning-based SMT printing detection method program. When the 3D scanning-based SMT printing detection method program is executed by a processor, the steps of the 3D scanning-based SMT printing detection method as described in any one of claims 1 to 6 are implemented.

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