Plasma cleaning equipment for semiconductor packaging

Abstract

The present invention provides a plasma device for semiconductor packaging, comprising a loading and unloading module, a storage mechanism, a conveying mechanism, and a cleaning machine. The loading and unloading module includes an external docking mechanism and an internal docking mechanism disposed on opposite sides of the storage mechanism, with an external positioning platform provided between the external docking mechanism and the storage mechanism, and an internal positioning platform provided between the internal docking mechanism and the storage mechanism. The storage mechanism includes an intelligent storage bin, which seals and transfers materials via the external and internal positioning platforms. Manipulators 1, 2, and 3 are used to transfer materials between the loading and unloading module and the storage mechanism. The conveying mechanism is used to transport materials between the internal docking mechanism and the cleaning machine, which is used to clean materials. The present invention integrates automatic loading, work order storage, system sorting, automatic transportation, cleaning, and unloading, has a compact structure, achieves automated unmanned operation, and improves cleaning efficiency and quality.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to plasma cleaning equipment for semiconductor packaging. Background Art

[0002] In the semiconductor packaging industry, plasma cleaning is a critical step in semiconductor processing, involving product sorting, storage, loading and unloading, and cleaning. Traditional plasma cleaning processes often rely on manual sorting and loading and unloading. However, this manual process consumes significant manpower and results in high labor costs. Manual operations can also lead to sorting errors and accidents such as product magazine spillage, reducing product quality. Furthermore, the time it takes for products to flow between processes is difficult to manage manually, which can easily lead to product expiration.

[0003] In addition, most existing plasma cleaning equipment is installed separately from the sorting device and storage device, and the overall structure is large and complex, which causes trouble in loading and unloading and transportation, affecting production quality and efficiency. Summary of the Invention

[0004] The present invention aims to provide a plasma cleaning device for semiconductor packaging to overcome the deficiencies in the prior art.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: a plasma cleaning equipment for semiconductor packaging, including a loading and unloading module, a storage mechanism, a conveying mechanism, and a cleaning machine. The loading and unloading module is used for loading and unloading, including an external docking mechanism and an internal docking mechanism relatively arranged on both sides of the storage mechanism, and an external positioning platform abutting the storage mechanism is provided between the external docking mechanism and the storage mechanism, and an internal positioning platform abutting the storage mechanism is provided between the internal docking mechanism and the storage mechanism, the external docking mechanism is provided with a manipulator for transporting materials between the external docking mechanism and the external positioning platform, and the internal docking mechanism is provided with a manipulator for connecting the internal docking mechanism with the internal positioning platform. The storage mechanism includes a sealed and nitrogen-filled intelligent storage bin, in which a third manipulator is provided, and the third manipulator is used for transporting materials between the intelligent storage bin and the external positioning platform and the internal positioning platform, and the materials transported by the three are all magazines; the first manipulator, the second manipulator, and the third manipulator are all six-axis robots, and their output ends are provided with claws for clamping materials; the external positioning platform and the internal positioning platform are provided with placement slots, and the placement slots are in a closed state when connected to the intelligent storage bin; the conveying mechanism is provided with multiple ones, which are used for transporting materials between the internal docking mechanism and the cleaning machine, and the cleaning machine is used to clean materials.

[0006] Furthermore, in the above-mentioned plasma cleaning equipment for semiconductor packaging, there are multiple cleaning machines, and the number of cleaning machines is not less than the number of conveying mechanisms. The cleaning machines, loading and unloading modules, storage mechanisms, and conveying mechanisms form a ring-shaped cleaning center, and a safety fence is provided on the periphery of the ring to isolate and protect the cleaning center.

[0007] Furthermore, in the above-mentioned plasma cleaning equipment for semiconductor packaging, the external docking mechanism also includes an external docking platform and a docking cart. There are two external docking platforms, and the robot is arranged between the two external docking platforms. There is also an NG temporary storage platform between the two external docking platforms. There are also two docking carts, which are movably connected to the external docking platforms; the docking cart includes a mobile base and a shelf arranged above the mobile base, and the shelf is elastically connected to the mobile base through an elastic connecting piece arranged at the bottom; the top of the shelf is divided into a plurality of grooves arranged in an array by partitions, and the grooves are used to place magazines for loading products.

[0008] Furthermore, in the above-mentioned plasma cleaning equipment for semiconductor packaging, a symmetrically arranged sliding rail group 1 is provided on both sides of the top of the external docking platform, the sliding rail group 1 includes an upper rail and a side guide rail provided on the inner side of the upper rail, and symmetrically arranged ground rails are provided on both sides of the bottom of the external docking platform. The docking trolley is a mobile trolley, which is plugged into the external docking platform through the sliding rail group 1 and the ground rail; a locking component 1 for locking the docking trolley is also provided in the middle of the external docking platform, the locking component 1 includes a cylinder 1, a slide, a locking rod, and a locking cylinder, the cylinder 1 is fixed on the external docking platform, and a slide is provided at its output end, and locking rods are provided at both ends of the slide, the locking rod is connected to the output end of the locking cylinder provided on the slide, and the slide is also slidably connected to the slide rail 1 through an adapter, and the slide rail 1 is arranged parallel to one side of the cylinder 1.

[0009] Furthermore, in the above-mentioned plasma cleaning equipment for semiconductor packaging, the internal docking mechanism also includes a support frame and a plurality of internal docking platforms arranged below the support frame, the support frame is a door-shaped arch frame, the second robot is fixed below the crossbeam of the support frame, and the plurality of internal docking platforms are arranged side by side along the outer side of the intelligent storage bin; the internal docking platform includes an internal docking frame and a tray arranged above the internal docking frame, the tray is provided with a plurality of grooves for placing magazines, a sliding rail group 2 is provided on the top of the internal docking frame, the tray is movably connected to the internal docking frame through the sliding rail group 2, and is fixedly connected to the inner docking frame through a locking component 2 provided on the inner docking frame.

[0010] Furthermore, in the above-mentioned plasma cleaning equipment for semiconductor packaging, the external positioning table has the same structure as the internal positioning table, including a table body and a transfer bin arranged above the table body, the internal cavity of the transfer bin is a placement slot, and the side of the transfer bin abutting the intelligent storage bin is provided with a through opening connected to the intelligent storage bin, and the top of the transfer bin is provided with a table cover that can open or close the placement slot and a pushing component that drives the table cover to open and close; preferably, the pushing component includes a synchronous belt transmission component and a second slide rail, and drive plates are provided on both sides of the table cover, and the drive plate located on one side of the table cover is connected to the synchronous belt of the synchronous belt transmission component through a toothed plate, and two slide rails 2 fixed to the top of the transfer bin are provided on both sides of the placement slot, and the drive plate is slidably connected to the second slide rail.

[0011] Furthermore, in the above-mentioned plasma cleaning equipment for semiconductor packaging, the storage mechanism also includes a work order module located in the safety fence, and the intelligent storage bin is divided into multiple storage spaces for placing magazines by partitions. The work order module is used to store work orders for processed products and bind the storage spaces with the material information of the magazines in the storage spaces for storage and management; preferably, the work order module includes a work order shelf and a control machine, and the work order shelf is provided with status lights corresponding to the storage spaces, and the control machine can be used to record and store work orders for processed products.

[0012] Furthermore, in the above-mentioned plasma cleaning equipment for semiconductor packaging, the conveying mechanism includes an AGV cart and a manipulator four arranged on the AGV cart, the AGV cart is provided with a storage table and a positioning groove, the storage table is movably connected to the tray, the positioning groove is used to place and position the magazine, and the output end of the manipulator four is also provided with a clamping claw, which is used for pushing the tray between the internal docking mechanism and the conveying mechanism, and for conveying the magazine between the conveying mechanism and the cleaning machine.

[0013] Furthermore, in the above-mentioned plasma cleaning equipment for semiconductor packaging, a clamping mechanism 1 is provided on one side of the positioning groove, and a clamping mechanism 2 is also provided on the output end of the robot 4. The clamping mechanism 1 cooperates with the clamping mechanism 2 to open the blocking rod of the clip in the positioning groove.

[0014] Furthermore, the aforementioned plasma cleaning equipment for semiconductor packaging further includes an identification mechanism, comprising identification component 1, identification component 2, and identification component 3. Identification component 1 is provided on robot arm 1 and comprises image recognition component 1 and code scanning recognition component 1. Identification component 2 is provided on robot arm 2 and comprises code scanning recognition component 2. Identification component 3 is provided on robot arm 4 of the conveying mechanism and comprises image recognition component 3 and code scanning recognition component 3. The aforementioned image recognition component is a camera and a corresponding light source, used to identify whether the product magazine and magazine retaining lever are closed, determine whether the material is in a safe state, and also identify the magazine position to assist in the loading and unloading of the magazine. The code scanning recognition component can be a scanner, used to identify barcodes, QR codes, and other markings on the product magazine and scan the material information within the magazine.

[0015] Compared with the existing technology, the beneficial effects of the present invention are: the equipment of the present invention integrates automatic loading, work order storage, system sorting, automatic transportation, cleaning, and unloading, has good integration, a more compact structure, and realizes automated unmanned operation. While reducing manual work, it also solves the problem of human error in operations, greatly improves cleaning efficiency and cleaning quality, and reduces company costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 Schematic diagram of the structure of the plasma cleaning equipment for semiconductor packaging of the present invention Figure 1 ;

[0018] Figure 2 Schematic diagram of the structure of the plasma cleaning equipment for semiconductor packaging of the present invention Figure 2 ;

[0019] Figure 3 A schematic diagram of the partial structure of the external connection mechanism of the plasma cleaning equipment for semiconductor packaging of the present invention;

[0020] Figure 4 This is a structural schematic diagram of a docking trolley for a plasma cleaning device for semiconductor packaging according to the present invention;

[0021] Figure 5 Schematic diagram of the inner docking mechanism and inner positioning platform of the plasma cleaning equipment for semiconductor packaging of the present invention;

[0022] Figure 6 for Figure 5 A top view of

[0023] Figure 7 Schematic diagram of the structure of the conveying mechanism of the plasma cleaning equipment for semiconductor packaging of the present invention Figure 1 ;

[0024] Figure 8 Schematic diagram of the structure of the conveying mechanism of the plasma cleaning equipment for semiconductor packaging of the present invention Figure 2 ;

[0025] In the figure: 1. External docking mechanism; 11. Manipulator 1; 12. External docking platform; 121. Upper rail; 122. Side guide rail; 123. Floor rail; 13. Docking trolley; 131. Mobile chassis; 132. Shelf; 133. Elastic connector; 14. NG storage platform; 15. Locking assembly 1; 151. Cylinder 1; 152. Slide; 153. Locking rod; 154. Locking cylinder; 155. Slide rail 1;

[0026] 2. Internal docking mechanism; 21. Manipulator 2; 22. Support frame; 23. Internal docking platform; 231. Internal docking rack; 232. Tray; 233. Sliding track set 2;

[0027] 3. External positioning platform; 31. Placement slot;

[0028] 4. Inner positioning platform; 41. Platform body; 42. Transfer chamber; 421. Through port; 43. Platform cover; 431. Drive plate; 44. Push assembly; 441. Synchronous belt drive assembly; 442. Slide rail 2;

[0029] 5. Storage mechanism; 51. Intelligent storage bin; 52. Work order module;

[0030] 6. Conveying mechanism; 61. AGV trolley; 611. Storage platform; 612. Positioning slot; 62. Manipulator 4; 63. Clamping mechanism 1; 64. Clamping mechanism 2;

[0031] 7. Cleaning machine;

[0032] 8. Identification mechanism; 81. Identification component one; 82. Identification component two; 83. Identification component three. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] Example 1

[0035] like Figure 1-8 As shown, a plasma cleaning device for semiconductor packaging includes a loading and unloading module, a storage mechanism 5, a conveying mechanism 6, and a cleaning machine 7. The loading and unloading module is used for loading and unloading, and includes an external docking mechanism 1 and an internal docking mechanism 2 relatively arranged on both sides of the storage mechanism 5, and an external positioning platform 3 abutting the storage mechanism 5 is provided between the external docking mechanism 1 and the storage mechanism 5, and an internal positioning platform 4 abutting the storage mechanism 5 is provided between the internal docking mechanism 2 and the storage mechanism 5. The external docking mechanism 1 is provided with a manipulator 11 for transporting materials between the external docking mechanism 1 and the external positioning platform 3, and the internal docking mechanism 2 is provided with a manipulator 21 for transporting materials between the internal docking mechanism 2 and the internal positioning platform 4; the storage mechanism 5 includes a sealed and nitrogen-filled intelligent storage bin 51, and a manipulator 3 (not shown in the figure) is provided in the intelligent storage bin 51. The manipulator 3 is used for transporting materials between the intelligent storage bin 51 and the external positioning platform 3 and the internal positioning platform 4, that is, the loading and unloading module and the storage mechanism The material is transferred between the structures 5 through manipulator 1 11, manipulator 2 21 and manipulator 3; the intelligent storage bin 51 is sealed, and the material is taken out by sealing the outer positioning platform 3 and the inner positioning platform 4, which can reduce the oxidation and pollution of the product, improve the production quality, and reduce the nitrogen loss of the intelligent storage bin 51, saving energy; manipulator 1 11, manipulator 2 21 and manipulator 3 are all six-axis robots, and their output ends are all provided with claws for clamping materials, and the material taking range is large. The materials clamped and conveyed by manipulator 1 11, manipulator 2 21 and manipulator 3 are all clips, which are loaded with multiple chips, and the claws are provided with fitting silicone soft material clips for clamping product clips to prevent the clips from slipping; the outer positioning platform 3 and the inner positioning platform 4 are both provided with placement grooves 31, and the placement grooves 31 are in a closed state when connected to the intelligent storage bin 51; the conveying mechanism 6 is provided with multiple, which are used for transporting materials between the internal connecting mechanism 2 and the cleaning machine 7, and the cleaning machine 7 is used to clean materials. The present invention can fully realize the automation of the whole process by automatically loading and unloading materials through the loading and unloading modules, which can greatly reduce human errors while saving manpower time. It can also be combined with the storage mechanism to load and unload materials, and can seal and retrieve materials in the intelligent storage bin, reducing oxidation and contamination of the products during the loading and unloading process, and greatly improving the packaging efficiency and product quality.

[0036] In the above structure, if Figure 1-2 As shown, there are multiple cleaning machines 7, and the number of cleaning machines 7 is not less than the number of conveying mechanisms 6, that is, the number of AGV carts 61 is less than the number of cleaning machines 7. One AGV cart can deliver materials to at least one cleaning machine 7. The cleaning machine in this embodiment adopts a plasma cleaning machine, which cleans without residue. The cleaning machine 7 and the loading and unloading modules, storage mechanism 5, and conveying mechanism 6 form a ring-shaped cleaning center, which integrates the cleaning equipment, has good compactness, and can adapt to mass production. A safety fence is provided on the circular periphery of the cleaning center to isolate and protect the cleaning center.

[0037] like Figure 3 、 5 As shown in Figures 7 and 8, the plasma cleaning equipment for semiconductor packages further includes an identification mechanism 8, which includes an identification component 1 81, an identification component 2 82, and an identification component 3 83. The identification component 1 81 is provided on the robot 1 11 and includes an image recognition component 1 and a code scanning recognition component 1. The identification component 2 82 is provided on the robot 2 21 and includes a code scanning recognition component 2. The identification component 3 83 is provided on the robot 4 62 of the conveying mechanism 6 and includes an image recognition component 3 and a code scanning recognition component 3. The image recognition component can be a camera and a corresponding light source, which is used to identify whether the product magazine and the magazine stop lever are closed, determine whether the material is in a safe state, and identify the magazine position to assist in the loading and unloading of the magazine. The code scanning recognition component can be a scanner, which is used to identify barcodes, QR codes, and other markings on the product magazine and scan the material information in the magazine, cooperating with the work order module.

[0038] In addition, if Figure 1-2 As shown, the storage mechanism 5 also includes a work order module 52 located within the safety fence. The intelligent storage bin 51 includes a cabinet and a host computer located on the cabinet. The host computer is used to control the intelligent storage bin 51. The cabinet of the intelligent storage bin is divided into multiple storage spaces for magazines by partitions. The work order module 52 is used to store work orders for processed products and bind the storage spaces with the material information of the magazines within them for storage and management. The work order module 52 includes a work order shelf and a control computer. The work order shelf is equipped with status lights corresponding to the storage spaces. The control computer is used to record and store work orders for processed products. Magazine material information includes storage time, work order number, product magazine number, cleaning status, etc. The control computer is equipped with a work order posting system (MES), which includes commands such as work order information, executing product magazine and work order binding, and binding cleaning procedures. When the magazine is loaded and unloaded from the intelligent storage bin, the corresponding material information is recorded, and the current site information and expiration time are connected with the MES to conduct in-and-out warehouse management. Moreover, the code scanning recognition component of the identification mechanism 8 cooperates with the work order module to better perform storage management and control, thereby better sorting and feeding the cleaning machine.

[0039] The equipment of the present invention integrates automatic loading, work order storage, system sorting, automatic transportation, cleaning, and unloading. It has good integration and a more compact structure, and realizes fully automatic cleaning without manual labor. While reducing manual work, it also solves the problem of human error in operation, greatly improving cleaning efficiency and cleaning quality, and reducing company costs.

[0040] Example 2

[0041] Based on the structure of Example 1, Figure 1-4As shown, the external docking mechanism 1 also includes an external docking platform 12 and a docking trolley 13. There are two external docking platforms 12. The manipulator 11 is arranged between the two external docking platforms 12. An NG temporary storage platform 14 is also provided between the two external docking platforms 12. When the identification mechanism 8 identifies that there is a problem with the magazine (the barrier lever is not closed, etc.), the manipulator 11 clamps the NG magazine and places it on the NG temporary storage platform 14 to ensure stable production of the equipment.

[0042] Among them, such as Figure 4 As shown, the docking cart 13 includes a mobile chassis 131 and a shelf 132 mounted above the chassis 131. The chassis 131 is equipped with wheels at the bottom and a handle on one end for easy movement and operation. The shelf 132 is elastically connected to the chassis 131 via an elastic connector 133 at the bottom. The top of the shelf 132 is divided into a plurality of grooves arranged in an array by a partition made of antistatic material to reduce the damage caused by static electricity to the products. The grooves are used to hold the magazines loaded with the products. The partitions and elastic connector 133 can reduce vibration during transportation and prevent the magazines from colliding during transportation.

[0043] In addition, if Figure 1-3 As shown, the docking trolleys 13 are also provided with two, which are movably connected to the external docking platform 12. Specifically, the top of the external docking platform 12 is provided with a symmetrically arranged sliding track group 1 on both sides, and the sliding track group 1 includes an upper track 121 and a side guide track 122 provided on the inner side of the upper track 121. The bottom of the external docking platform 12 is provided with a symmetrically arranged ground track 123 on both sides. The docking trolley 13 is a mobile trolley, which is plugged into the external docking platform 12 through the sliding track group 1 and the ground track 123; specifically, the moving wheels at the bottom of the docking trolley 13 cooperate with the ground track 123, and the lower guide plate and side guide plate on the shelf 132 cooperate with the sliding track group 1 to accurately insert the docking trolley 13 into the docking position of the external docking platform 12. A locking assembly 15 for locking the docking trolley 13 is also provided in the middle of the external docking platform 12. The locking assembly 15 includes a cylinder 151, a slide 152, a locking rod 153, and a locking cylinder 154. The cylinder 151 is fixed on the external docking platform 12, and a slide 152 is provided at its output end. Locking rods 153 are provided at both ends of the slide 152. The locking rod 153 is connected to the output end of the locking cylinder 154 provided on the slide 152. The slide 152 is also slidably connected to a slide rail 155 through an adapter seat. The slide rail 155 is arranged parallel to one side of the cylinder 151.

[0044] During loading, the docking trolley 13 loaded with magazines is inserted onto the external docking platform 12 via the guide rail assembly 1 and the ground rail 123. The docking trolley 13 is then locked to the external docking platform 12 using the locking assembly 15, completing the loading and positioning. To unload, the locking assembly 15 is released from the docking trolley 13, which is then dragged outward to remove it from the external docking platform 12 and transferred to the finished product placement area. The two external docking platforms 12 can be used for loading, one while the other unloads, or both simultaneously, depending on production needs. This is not a limitation.

[0045] like Figure 1 、 5 -6, the internal docking mechanism 2 also includes a support frame 22 and a plurality of internal docking platforms 23 provided below the support frame 22. In this embodiment, there are three internal docking platforms 23, and the three internal docking platforms 23 can be used for loading and unloading respectively to speed up the loading and unloading speed. The support frame 22 is a door-shaped arch frame, and the manipulator 21 is fixed below the crossbeam of the support frame 22. The plurality of internal docking platforms 23 are arranged side by side along the outer side of the intelligent storage bin 51; the internal docking platform 23 includes an internal docking frame 231 and a tray 232 provided above the internal docking frame 231, and the tray 232 is provided with a plurality of grooves for placing magazines, and the top of the internal docking frame 231 is provided with a sliding rail group 233, and the tray 232 is movably connected to the internal docking frame 231 through the sliding rail group 233, and is fixedly connected to the internal docking frame 231 through a locking component 2 (not shown in the figure) provided on the internal docking frame 231. The structures of the second sliding track group 233 and the second locking assembly in this embodiment are similar to those of the first sliding track group and the first locking assembly 15, respectively, and will not be described in detail here.

[0046] like Figure 1-2As shown in Figures 5-6, the outer positioning platform 3 has the same structure as the inner positioning platform 4, including a platform body 41 and a transfer bin 42 provided above the platform body 41. The internal cavity of the transfer bin 42 is a placement slot 31. The side of the transfer bin 42 abutting against the intelligent storage bin 51 is provided with a through port 421 communicating with the intelligent storage bin 51, and the top of the transfer bin 42 is provided with a platform cover 43 that can open or close the placement slot 31 and a pushing component 44 that drives the platform cover 43 to open and close. Specifically, the pushing component 4 4 includes a synchronous belt transmission assembly 441 and a second slide rail 442. Drive plates 431 are provided on both sides of the platform cover 43. The drive plate 431 on one side of the platform cover 43 is connected to the synchronous belt of the synchronous belt transmission assembly 441 through a toothed plate. Two second slide rails 442 are provided on both sides of the placement groove 31 and are fixed to the top of the transfer bin 42. The drive plate 431 is slidably connected to the second slide rail 442, and the opening and closing of the platform cover 43 is achieved through the forward and reverse actions of the synchronous belt transmission assembly 441. When the intelligent storage bin 51 is feeding, the table cover 43 is closed first to make the placement slot 31 a sealed space, and then the sealing door connected to the through port 421 on the intelligent storage bin 51 is opened, and the robot three takes out the magazine in the placement slot 31 and places it on the position of the intelligent storage bin 51, thereby realizing the sealed feeding of the magazine, reducing the nitrogen leakage in the intelligent storage bin 51, saving energy, and avoiding the oxidation of the product in the intelligent storage bin 51; conversely, when the intelligent storage bin 51 is discharging, the table cover 43 is closed first, and then the sealing door is opened, and the robot three takes out the magazine on the position and places it in the placement slot 31, and then the sealing door is closed. At this time, the table cover 43 can be opened, and the robot one 11 or the robot two 21 takes away the magazine from the placement slot 31.

[0047] like Figure 1 、 7-8, the conveying mechanism 6 includes an AGV trolley 61 and a manipulator 4 62 arranged on the AGV trolley 61, the AGV trolley 61 is provided with a storage platform 611 and a positioning groove 612, the storage platform 611 is movably connected to the tray 232, the positioning groove 612 is used to place and position the magazine, and the output end of the manipulator 4 62 is also provided with a clamping claw for pushing the tray 232 between the internal docking mechanism 2 and the conveying mechanism 6, and for conveying the magazine between the conveying mechanism 6 and the cleaning machine 7. When the AGV trolley 61 retrieves materials, it moves close to the inner docking station 23 so that the storage platform 611 is flush with the sliding track group 233 of the inner docking station 23. Then, the robot arm 4 62 pushes the entire tray 232 onto the storage platform 611. At the same time, after the inner docking station 23 is docked with the storage platform 611, the robot arm 4 62 can also push the tray 232 loaded with cleaned products on the storage platform 611 to the inner docking station 23, thereby pushing the tray 232. In addition, the gripper of the robot arm 4 62 can also grab the magazine on the storage platform 611 and place it in the positioning slot 612, realizing the magazine conveyance between the conveying mechanism 6 and the cleaning machine 7. This embodiment uses multiple AGVs to load materials to the cleaning machine, which is flexible, has few restrictions on the location of the cleaning machine, and can greatly improve the production efficiency of large-scale production.

[0048] In addition, if Figure 7-8 As shown, a first opening mechanism 63 is provided on one side of the positioning slot 612, and a second opening mechanism 64 is further provided at the output end of the fourth manipulator 62. The first opening mechanism 63 and the second opening mechanism 64 cooperate to open the magazine retaining rod in the positioning slot 612. After the fourth manipulator 62 places the magazine into the positioning slot 612, the positioning slot 612 corrects and positions the magazine. Then, the first opening mechanism 63 and the second opening mechanism 64 cooperate to open the magazine retaining rod, facilitating the subsequent cleaning of the chips in the magazine.

[0049] The present invention also provides a method for operating a plasma cleaning device for semiconductor packaging, comprising the following steps:

[0050] S1. After the core is loaded, the product clip is placed on the docking trolley 13. The groove on the docking trolley 13 positions and fixes the product clip. The docking trolley 13 is inserted into the docking position of the external docking platform under the guidance of the trolley sliding track group 1 and the ground rail.

[0051] S2. The identification component 81 on the manipulator 11 identifies the position, quantity, marking code, etc. of the product clip on the external docking station, and then retrieves the MES information based on the product clip scan code and transmits it to the console. The information includes the product clip barcode information, the status of the product clip blocking rod, etc. The console controls the manipulator 1, the docking trolley, and the external positioning station according to the information.

[0052] S3, feeding, after the code scanning is completed, the table cover 43 of the external positioning table 3 is opened, the robot arm 11 clamps the material magazine and puts it in the placement slot 31, and then the table cover 43 is closed, connecting the intelligent storage bin and the placement slot, and the robot arm 3 in the intelligent storage bin is started to clamp the magazine in the placement slot 31 and put it on the vacant bin, so as to realize the material flow between the inside and outside of the intelligent storage bin in a sealed state; at the same time, the corresponding bin and warehousing time, work order number, product magazine number and other material information are recorded, and the current site information and expiration time are connected with the MES to perform warehousing card control.

[0053] S4: Discharging. The cover 43 of the inner positioning platform 4 closes, and the control system directs Manipulator 3 in the intelligent storage bin 51 to pick up the corresponding material clip and place it in the placement slot 31 of the inner positioning platform 4, following the first-in, first-out principle. The cover 43 then opens, and Manipulator 21 picks up the material from the placement slot and places it on the tray 232 on the inner docking platform 23. Before placing it on the pallet, Identification Component 2 82 on Manipulator 21 identifies the product clip number and records the product information. During discharging, the CIM system indicates that the plasma cleaning machine 7 is idle. The control system automatically schedules production based on the storage time and the expiration date of the requested product, following the first-in, first-out principle. Furthermore, the manual operator console can jump the queue to request expedited product.

[0054] S5. The CIM system sends a transport instruction to the transport mechanism 5. The corresponding AGV trolley 61 moves to dock with the inner docking station 23. The robot arm 4 62 pushes the entire pallet 232 on the inner docking station 23 to the storage table 611 of the AGV trolley 61, and then transports it to the idle plasma cleaning machine 7 assigned by the control console. The AGV trolley 61 opens the blocking lever of the magazine and sends a command to the control system to start the machine. The control system sends a message to the CIM that the loading is completed. The plasma cleaning machine 7 receives the CIM signal to turn on the equipment and start cleaning.

[0055] S6. After the cleaning is completed, the CIM reports to the control system the cleaning machine where the operation is completed and the operation completion time. The control system calls the AGV to close the magazine stop lever, unload the material, and transport the cleaned material magazine back to the inner docking platform 23. The control system controls the second robot 21 to clamp the magazine on the inner docking platform 23, identify the product magazine number and record the product information, so as to achieve the function of reading and uploading the code after the cleaning is completed, forming a closed loop of product magazine entry and exit; after recording the product information, the second robot 21 places the magazine into the placement slot 31 of the inner positioning platform 4.

[0056] S7, cleaning and feeding, the robot arm 3 receives the command from the control system to take out the material magazine from the inner positioning platform 4 and put it into the vacant position of the intelligent storage bin, and records the corresponding position and storage time, work order number, product magazine number, and cleaning status.

[0057] S8, unloading, the subsequent work time for cleaning is required, the work order module cooperates with the control system to send a material picking instruction to the robot three, the robot three grabs the product clip of the corresponding bin and puts it into the external positioning platform 3, then the robot one 11 grabs the material clip in the external positioning platform 3 and puts it onto the docking trolley 13, separates the docking trolley 13 from the external docking platform 12, and moves it to the next work station to complete the unloading.

[0058] The entire implementation process adopts intelligent unmanned operation, which is easy to operate, reduces the error rate and improves production efficiency.

[0059] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0060] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A plasma cleaning device for semiconductor packaging, characterized in that: The loading and unloading module comprises an external docking mechanism and an internal docking mechanism relatively arranged on both sides of the storage mechanism, and an external positioning platform abutting the storage mechanism is provided between the external docking mechanism and the storage mechanism, and an internal positioning platform abutting the storage mechanism is provided between the internal docking mechanism and the storage mechanism, and the external docking mechanism is provided with a robot 1 for transporting materials between the external docking mechanism and the external positioning platform, and the internal docking mechanism is provided with a robot 2 for transporting materials between the internal docking mechanism and the internal positioning platform; the storage mechanism comprises a sealed and nitrogen-filled intelligent storage bin, and a robot 3 is provided in the intelligent storage bin, and the robot 3 is used for transporting materials between the intelligent storage bin and the external positioning platform and the internal positioning platform; the output ends of the robot 1, the robot 2 and the robot 3 are all provided with claws for clamping materials; the external positioning platform and the internal positioning platform are all provided with placement slots, and the placement slots are in a closed state when connected to the intelligent storage bin; the conveying mechanism is provided with multiple ones for transporting materials between the internal docking mechanism and the cleaning machine, and the cleaning machine is used to clean materials.

2. The plasma cleaning equipment for semiconductor packaging according to claim 1, wherein: There are multiple cleaning machines, and the number of cleaning machines is not less than the number of conveying mechanisms. The cleaning machines, loading and unloading modules, storage mechanisms, and conveying mechanisms form a ring-shaped cleaning center, and a safety fence is provided on the periphery of the ring.

3. The plasma cleaning equipment for semiconductor packaging according to claim 1, wherein: The external docking mechanism also includes an external docking platform and a docking trolley. There are two external docking platforms. The manipulator is arranged between the two external docking platforms. There is also an NG temporary storage platform between the two external docking platforms. There are also two docking trolleys, which are movably connected to the external docking platforms; the docking trolley includes a mobile base frame and a shelf arranged above the mobile base frame, and the shelf is elastically connected to the mobile base frame through an elastic connecting piece arranged at the bottom; the top of the shelf is divided by a partition into a plurality of grooves arranged in an array, and the grooves are used to place magazines loaded with products.

4. The plasma cleaning equipment for semiconductor packaging according to claim 3, wherein: A symmetrically arranged sliding rail group is provided on both sides of the top of the external docking platform, and the sliding rail group includes an upper rail and a side guide rail provided on the inner side of the upper rail. A symmetrically arranged ground rail is provided on both sides of the bottom of the external docking platform. The docking trolley is a mobile trolley, which is plugged into the external docking platform through the sliding rail group and the ground rail; a locking assembly for locking the docking trolley is also provided in the middle of the external docking platform, and the locking assembly includes a cylinder, a slide, a locking rod, and a locking cylinder. The cylinder is fixed on the external docking platform, and a slide is provided at its output end. Locking rods are provided at both ends of the slide, and the locking rod is connected to the output end of the locking cylinder provided on the slide. The slide is also slidably connected to the slide rail through an adapter, and the slide rail is arranged parallel to one side of the cylinder.

5. The plasma cleaning equipment for semiconductor packaging according to claim 1, wherein: The internal docking mechanism also includes a support frame and multiple internal docking platforms arranged below the support frame. The support frame is a door-shaped arch frame, and the second manipulator is fixed below the crossbeam of the support frame. The multiple internal docking platforms are arranged side by side along the outer side of the intelligent storage bin; the internal docking platform includes an internal docking frame and a tray arranged above the internal docking frame, and the tray is provided with multiple grooves for placing magazines. A sliding rail group 2 is provided on the top of the internal docking frame, and the tray is movably connected to the internal docking frame through the sliding rail group 2, and is fixedly connected to the internal docking frame through a locking component 2 provided on the internal docking frame.

6. The plasma cleaning equipment for semiconductor packaging according to any one of claims 1 to 5, characterized in that: The external positioning platform has the same structure as the internal positioning platform, including a platform body and a transfer bin arranged above the platform body. The internal cavity of the transfer bin is a placement slot. The side where the transfer bin abuts the intelligent storage bin is provided with a through opening connected to the intelligent storage bin, and the top of the transfer bin is provided with a platform cover that can open or close the placement slot and a pushing component that drives the platform cover to open and close.

7. The plasma cleaning equipment for semiconductor packaging according to claim 1, wherein: The storage mechanism also includes a work order module located within the safety fence. The intelligent storage bin is divided into multiple locations for placing magazines by partitions. The work order module is used to store processing product work orders and bind the location with the material information of the magazine in the location for storage management and control.

8. The plasma cleaning equipment for semiconductor packaging according to claim 1, wherein: The conveying mechanism includes an AGV trolley and a manipulator four arranged on the AGV trolley. The AGV trolley is provided with a storage platform and a positioning slot. The storage platform is movably connected to the tray. The positioning slot is used to place and position the magazine. The output end of the manipulator four is also provided with a clamping claw, which is used for pushing the tray between the internal docking mechanism and the conveying mechanism, and for conveying the magazine between the conveying mechanism and the cleaning machine.

9. The plasma cleaning equipment for semiconductor packaging according to claim 8, wherein: A first clamping mechanism is provided on one side of the positioning groove, and a second clamping mechanism is further provided on the output end of the manipulator four. The first clamping mechanism cooperates with the second clamping mechanism to open the blocking rod of the magazine in the positioning groove.

10. The plasma cleaning equipment for semiconductor packaging according to claim 1, wherein: It also includes an identification mechanism, which includes identification component one, identification component two and identification component three. The identification component one is arranged on robot one, and includes image recognition component one and code scanning recognition component one. The identification component two is arranged on robot two, and includes code scanning recognition component two. The identification component three is arranged on robot four of the conveying mechanism, and includes image recognition component three and code scanning recognition component three.

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