Multi-channel receiving channel module assembly process

Abstract

The present invention discloses a multi-channel receiving channel module assembly process, which relates to the field of radio frequency technology. The multi-channel receiving channel module assembly process adopts a cavity structure design that combines electrical assembly and micro-assembly. Conventional micro-assembly requires the isolation of an entire surface or a portion of a sealed cavity to meet the micro-assembly operation. The bare chip is bonded to a soft substrate and then installed in a separately isolated sealed cavity and then connected to a PCBA printed circuit board in another cavity through an insulator. In this process, the printed circuit board is specially treated to meet the requirements of the gold wire bonding process, so that there is no need to isolate a separate sealed cavity. The bare chip is directly bonded to the printed circuit board to achieve the combination of electrical assembly and micro-assembly, reducing the redundant area and weight of the structural cavity.

Description

Technical Field

[0001] The present invention relates to the field of radio frequency technology, and in particular to an assembly process for a multi-channel receiving channel module. Background Art

[0002] A multi-channel receiver module is capable of simultaneously receiving and processing signals from multiple sources. It integrates the functionality of multiple channels into a single module, reducing system complexity and improving device reliability and stability. Multi-channel receiver modules are widely used in communications, radar, electronic warfare, and other fields.

[0003] Considering the product's independent reliability, domestic manufacturers are now required to independently develop and produce multi-channel receiving channel modules. Domestic manufacturers use conventional design solutions, with independent micro-assembly and electrical structure design, and achieve product design objectives by interconnecting the micro-assembly on the front of the structure with the electrical printed circuit board on the back.

[0004] Conventional multi-channel receiving channel modules require a sealed cavity, either entirely or partially, to meet micro-assembly requirements. The electrical components also require printed circuit board assembly, various components, and interconnect cables. The resulting module is heavy and bulky, failing to meet the requirements of miniaturization and lightweight design. The module cavity requires extensive gold plating, which increases printed circuit board area and the use of numerous components, further increasing costs. Summary of the Invention

[0005] The purpose of the present invention is to provide a multi-channel receiving channel module assembly process, which adopts a new process to realize a miniaturized and lightweight domestic multi-channel receiving channel module.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] A multi-channel receiving channel module assembly process includes the following steps:

[0008] Step S1: preparing materials, including a structural cavity, a printed circuit board (PCBA) with mounted electrical components, micro-components, an LC filter, an SMP connector, and radio frequency insulators; the micro-components include several bare chips;

[0009] Step S2: ultrasonically cleaning the structural cavity to remove machining stains and debris;

[0010] Step S3: soldering and sintering the SMP connector, LC filter, and RF insulator to the structural cavity according to the assembly drawing;

[0011] Step S4: Assemble the printed circuit board (PCBA) in the structural cavity, fix it with screws, and perform wire welding on the welding points;

[0012] Step S5: Perform first article verification. If the verification is qualified, proceed to step S6;

[0013] Step S6: Adhere the first-class bare chip and the soft substrate of one channel to the printed circuit board (PCBA) using conductive adhesive according to the assembly drawing, and bake the conductive adhesive; the soft substrate is used to connect the SMP connector pins and the printed circuit board;

[0014] Step S7: Perform a gold wire bonding operation on one channel, bonding the bonding points of the first type of bare chip to the chip capacitor or the printed circuit board pad with gold wires, soldering the welding points on one side of the flexible substrate microstrip line to the SMP connector pins, and bonding the other side of the flexible substrate microstrip line to the chip capacitor with gold wires; the chip capacitor is an electrical component installed on the printed circuit board (PCBA);

[0015] Step S8: Perform first article verification, program download, and high and low temperature tests. If all passes, proceed to step S9.

[0016] Step S9: The second type of bare chip and the carrier are subjected to a eutectic process, and the carrier is bonded to the printed circuit board (PCBA) using H20E conductive adhesive in one channel, and the conductive adhesive is baked;

[0017] Step S10: Repeat steps 6-9 until all channels are equipped with chips and wire bonded together.

[0018] Step S11: After the whole machine is assembled, debugging and testing procedures are carried out according to the process flow;

[0019] The second type of bare chips includes three types of bare chips: the first type is a switch chip, the second type is a high-power chip, the third type is the chip closest to the screw, and the remaining bare chips are the first type of bare chips.

[0020] As an optimal technical solution, the cavity is made of aluminum AL6061-T6 material, and the cavity is plated with dark nickel AL / AP.Ni8, and the inner cavity of the cavity is partially plated with gold Au0.5.

[0021] As a preferred technical solution, the printed circuit board PCB of the printed circuit board PCBA is a surface-treated printed circuit board, and the treatment process is as follows:

[0022] Step S201: forming a nickel-palladium-gold alloy layer on the surface of the printed circuit board by metal deposition;

[0023] Step S202: The via holes on the printed circuit board are plugged with resin and plated flat.

[0024] As a preferred technical solution, in step S3, the sintering process is as follows:

[0025] Apply solder to the welding surface of RF insulators, SMP connectors and LC filters, wrap all RF insulators and SMP connectors with tin, and apply tin to the bottom contact points of LC filters. After the RF insulators, SMP connectors and LC filters are installed, place the cavity on the heating table. Use the high temperature of the heating table and the auxiliary heating of the hot air gun to wait for the solder paste on the RF insulators, SMP connectors and LC filters to melt and wet well at high temperature. Then, sintering is completed and self-inspection is performed.

[0026] As a preferred technical solution, in step S6, H20E conductive adhesive is coated under the bare chip and the soft substrate, the bare chip and the soft substrate are placed on the printed circuit board and pressed using a tooling press to ensure a tight fit, and then the structural cavity is placed in a drying oven, the temperature is set to 120°C, and the baking time is 1.5 hours. After being taken out and naturally cooled, the conductive adhesive bonding is completed.

[0027] As a preferred technical solution, in step S9, the second type of bare chip uses a eutectic process; the second type of bare chip is soldered on a molybdenum-copper material carrier using gold-tin Au80Sn20 eutectic, and the eutectic carrier is then bonded to the printed circuit board PCBA using H20E conductive adhesive.

[0028] As a preferred technical solution, the structural cavity is provided with a plurality of transverse cavities, and the corresponding transverse cavities on the front and back sides are interconnected by radio frequency insulators or high-temperature wires to form a channel; the structural cavity is provided with vertical cavities on both the front and back sides, and the vertical cavities are located on one side of the corresponding transverse cavities; the vertical cavities on the front and back sides are also interconnected by radio frequency insulators or high-temperature wires; and printed circuit boards are installed in both the transverse and vertical cavities;

[0029] The horizontal compartment is used to install the signal processing unit, and the vertical compartment is used to install the control and power supply unit; the signal processing unit includes a number of electrical components and micro components; the control and power supply unit includes a number of electrical components;

[0030] An SMP connector connected to the signal processing unit and an SMP connector connected to the control and power supply unit are soldered on the structural cavity.

[0031] As an optimal technical solution, laser sealing is adopted on both the front and back sides of the structural cavity, and the sealing cover material is aluminum AL4047.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1. Unlike conventional, micro-assembly, or electrical assembly cavity designs, the present invention utilizes a cavity structure design that combines electrical assembly with micro-assembly. Conventional micro-assembly requires isolating an entire surface or a portion of a sealed cavity to accommodate micro-assembly operations. The bare chip is bonded to a soft substrate and then installed in a separately isolated sealed cavity. It is then connected to the PCBA in another cavity via an insulator. In this process, special treatment of the printed circuit board allows for gold wire bonding, eliminating the need for a separate sealed cavity. The bare chip is directly bonded to the printed circuit board, achieving a combination of electrical assembly and micro-assembly, reducing the redundant area and weight of the structural cavity.

[0034] Specifically, conventional PCB designs use a laminated mixed-layer RO4350B+RF4 PCB, with gold immersion followed by solder mask. This PCB is not suitable for wire bonding. The new PCB process utilizes a surface treatment of chemical nickel-palladium-gold (suitable for wire bonding), with vias filled with resin and plated flat, supporting wire bonding of the PCB pads.

[0035] 2. The present invention adopts the combination of electrical and micro-assembly, channel and cavity design, and precise and reasonable layout. This accordingly reduces the printed circuit board area and the overall structural component volume, greatly reduces the weight, and achieves miniaturization.

[0036] 3. In conventional processes, SMP connector pins are soldered to the printed circuit board (PCB). However, this process requires micro-assembly processes involving solder sintering and conductive adhesive bonding, requiring high-temperature heating of the cavity. Therefore, the entire process requires a gradient temperature control from high to low, allowing the SMP connector to be soldered first, followed by PCB assembly. Because the SMP connector pins extend beyond the printed circuit board (PCB) after soldering, interfering with each other and preventing PCB assembly, this process uses a soft substrate bonded to the SMP connector, soldering to the pins, and gold wire bonding to cascade the microstrip lines and complete the connection to the chip capacitors. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of the front structure of a multi-channel receiving channel module cavity in the present invention.

[0038] Figure 2 This is a schematic diagram of the back structure of a multi-channel receiving channel module cavity in the present invention.

[0039] The reference numerals are as follows: 1- horizontal compartment, 2- vertical compartment. DETAILED DESCRIPTION

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0041] Example 1

[0042] like Figure 1-2 As shown, a multi-channel receiving channel module includes a structural cavity with several transverse cavities. The corresponding transverse cavities on the front and back sides are interconnected by radio frequency insulators or high-temperature wires to form a channel. Vertical cavities are also provided on both sides of the cavity, located to one side of the corresponding transverse cavities. The vertical cavities on the front and back sides are also interconnected by radio frequency insulators or high-temperature wires.

[0043] As a preferred embodiment, if it is a five-channel receiving channel module, five transverse partitions are provided on both the front and back sides of the structural cavity.

[0044] In this embodiment, the signal processing unit is installed in a horizontal partition, and the control and power supply unit is installed in a vertical partition. The clear cavity layout makes the circuit structure clearer and simpler.

[0045] In this embodiment, the signal processing unit forms a signal channel to complete functions such as frequency conversion, RF input / IF output, and system clock / local oscillator signal output for signals in various frequency bands.

[0046] In this embodiment, the control and power supply unit completes the switch off signal and signal function control for each channel, as well as the power supply voltage regulation conversion, to provide power supply for the chip.

[0047] In the prior art, the signal processing unit includes: CMOS packaged IC series-parallel conversion chip, single-pole four-throw switch chip, GaAs MMIC absorptive single-pole single-throw switch chip, FET driver chip, GaAs six-bit attenuator chip, GaAs monolithic integrated FET switch filter chip, GaAs limiter, MMIC mixer, low-noise amplifier, chip capacitor, LC filter, high-pass and low-pass filters, dielectric filter, and stacked resistors and capacitors.

[0048] Among them, the CMOS packaged IC series-parallel conversion chip, single-pole four-throw switch chip, GaAs MMIC absorptive single-pole single-throw switch chip, FET driver chip, GaAs six-bit attenuator chip, and GaAs monolithic integrated FET switch filter chip are bare chips and are assembled using a micro-assembly process; for ease of description, they are defined as micro-assembly components;

[0049] MMIC mixers, low-noise amplifiers, chip capacitors, high-pass and low-pass filters, dielectric filters, and multilayer resistors and capacitors are assembled using electrical equipment processes; for ease of description, they are defined as electrical equipment components.

[0050] It is worth emphasizing that in the signal processing unit, the LC filter is a customized special LC filter, and its bottom gold-plated layer is directly soldered to the cavity.

[0051] In existing technology, control and power supply units include: multilayer resistors and capacitors, BKML series power inductors, power conversion chips, LDO voltage regulators, digitally controlled attenuation chips, domestic FPGA control chips, surface mount crystal oscillators, and Flash chips. These components are all electrical components.

[0052] Specifically, in this embodiment, a signal processing unit is installed within the transverse compartment using a combination of electrical and micro-assembly technology. It's worth noting that this embodiment does not involve any improvements to the circuit principles; the circuit principles of the signal processing unit, control unit, and power supply unit remain consistent with the prior art. The improvements in this embodiment primarily concern the structural layout and assembly process of the multi-channel receiving module cavity.

[0053] Furthermore, an SMP connector connected to the signal processing unit and an SMP connector connected to the control and power supply unit are soldered and sintered on the cavity.

[0054] Laser sealing is used on both the front and back of the cavity. The sealing cover is made of AL4047 aluminum. The cavity uses solder-sintered SMP connectors to ensure the cavity's airtightness.

[0055] Furthermore, conventional printed circuit boards utilize a laminated, mixed-pressed RO4350B+RF4 composite, with gold immersion followed by solder mask application. This type of board does not meet the requirements for gold wire bonding in micro-assembly technology. Therefore, the new process employed in this embodiment utilizes a surface treatment of electroless nickel-palladium-gold (suitable for gold wire bonding), with vias filled with resin and then plated flat, supporting bare chip bonding.

[0056] A multi-channel receiving channel module assembly process employs a combination of electrical and micro-assembly. The electrical components are reflow soldered onto a printed circuit board (PCB) according to the drawings. Conventional mounting methods are sufficient and are not a technical improvement of this application. However, the PCB on which the electrical components are mounted undergoes a special surface treatment, allowing for direct wire bonding of bare chips to the PCB pads.

[0057] On this basis, a multi-channel receiving channel module assembly process is implemented, which includes the following steps:

[0058] Step S1: Prepare all materials, including a structural cavity, a printed circuit board (PCBA) with installed electrical components, micro-components, an LC filter, an SMP connector, and a radio frequency insulator;

[0059] Among them, the structural cavity is made of aluminum AL6061-T6 material, and the cavity is plated with dark nickel AL / AP.Ni8, and the cavity is partially plated with gold Au0.5.

[0060] Step S2: ultrasonically cleaning the structural cavity to remove machining stains and debris;

[0061] Step S3: soldering and sintering the SMP connector, LC filter, and RF insulator to the structural cavity;

[0062] Specifically, the structural cavity is heated at 200-220° C. (heating table), and lead solder paste is used to position and sinter the SMP connectors, RF insulators, and LC filters at various locations in the cavity according to the assembly drawing position number requirements.

[0063] Specifically, the sintering process is as follows: solder is coated on the welding surfaces of the RF insulator, SMP connector, and LC filter, all RF insulators and SMP connectors are tinned, and the bottom contact points of the LC filter are coated with tin. After the RF insulator, SMP connector, and LC filter are installed into the structural cavity according to the position numbers on the drawing, the structural cavity is placed on a heating table. Through heating, the solder paste on the RF insulator, SMP connector, and LC filter is melted and well wetted by high temperature, and the sintering is completed and self-inspection is performed.

[0064] The LC filter itself is relatively large in size and requires a relatively high soldering temperature, making it unsuitable for soldering to a printed circuit board. Therefore, it is directly applied to the cavity. This LC filter is a custom-made product, and the gold-plated layer on the back can be directly soldered and sintered.

[0065] Step S4: Assemble the printed circuit board PCBA in the structural cavity, fix it with screws, and connect the welding points with high-temperature wires;

[0066] Specifically, the printed circuit board is assembled in the inner cavity of the cavity by screws (M1.6*3 hexagon socket screws).

[0067] Specifically, the printed circuit board PCB is a printed circuit board that has undergone surface treatment, and the treatment process is as follows: a nickel-palladium-gold alloy layer is formed on the surface of the printed circuit board by metal deposition; and the via holes on the printed circuit board are plugged with resin and plated flat.

[0068] It is worth mentioning that step S4 completes all electrical installation steps.

[0069] Step S5: Perform first article verification. If the verification is qualified, proceed to step S6;

[0070] Step S6: Bond the first-category bare chip and the flexible substrate of one channel to the printed circuit board (PCBA) using H20E conductive adhesive according to the position numbers of the assembly drawing, and bake the conductive adhesive;

[0071] Specifically, the soft substrate is used to connect the SMP connector pins and the printed circuit board, and H20E conductive adhesive is used to bond the soft substrate used to solder the SMP connector pins. The bonding process is as follows: conductive silver adhesive is coated under the soft substrate, the soft substrate is placed on the printed circuit board and pressed with a tooling press to ensure a tight fit, and then the structural cavity is placed in a drying oven, the temperature is set to 120°C, and the baking time is 1.5 hours. After being taken out and naturally cooled, the conductive adhesive bonding is completed.

[0072] In conventional processes, SMP connector pins are soldered to the printed circuit board (PCB). However, this process requires micro-assembly processes involving solder sintering and conductive adhesive bonding, requiring high-temperature heating of the cavity. Therefore, the entire process requires a gradient temperature control from high to low, allowing the SMP connector to be soldered first, followed by PCB assembly. Because the SMP connector pins extend beyond the printed circuit board (PCB) after soldering, interfering with each other and preventing PCB assembly, this process uses a soft substrate as a transition point for the SMP connection. The pins are then connected by soldering, and the connection to the chip capacitors is completed by gold wire bonding using cascaded microstrip lines.

[0073] In general processes, the printed circuit board does not support gold wire bonding of bare chips (the immersion gold layer will cause poor contact, gold wire detachment, and poor reliability); in this embodiment, the printed circuit board is specially processed so that the bare chip can be directly bonded to the bare chip.

[0074] In general micro-assembly processes, the bare chip is bonded to the soft substrate, which requires a separate cavity space and occupies some area. Micro-assembly milling grooves are required. The soft substrate is connected to the printed circuit board through insulators, which requires a separate space, resulting in a larger cavity volume and heavier space. In this process, the bare chip is directly placed on the printed circuit board, saving some space, making it small in size and light in weight.

[0075] Step S7: Perform a gold wire bonding operation on one channel, perform gold wire bonding on the bonding points of the first type of bare chip and the chip capacitor (electrical component) or the printed circuit board pad, weld the welding points on one side of the flexible substrate microstrip line to the SMP connector pin, and perform gold wire bonding on the other side of the flexible substrate microstrip line to the chip capacitor (electrical component);

[0076] Step S8: Perform first article verification, program download, and high and low temperature tests. If all passes, proceed to step S9.

[0077] Step S9: Process the second type of bare chip and the carrier board with a eutectic process, bond the carrier board to the printed circuit board using H20E conductive adhesive in one channel, and bake the conductive adhesive;

[0078] Specifically, the bare chip is eutectically soldered to a molybdenum-copper substrate using a gold-tin alloy solder (Au80Sn20). The substrate is then bonded to the printed circuit board using H20E conductive adhesive. The melting point of the gold-tin solder used in the eutectic process is 280°C. Using a eutectic heating station set at 305±5°C, the gold-tin solder is applied to the bottom of the chip and placed on the molybdenum-copper substrate. The solder is then heated and friction-welded on the heating station to ensure sufficient wetting and soldering.

[0079] Step S10: Repeat steps 6-9 until all channels are equipped with chips and wire bonded together.

[0080] Step S11: After the whole machine is assembled, debugging and testing procedures are carried out according to the process flow.

[0081] The second category of bare chips includes three types of bare chips: the first is the switch chip, the second is the high-power chip, and the third is the chip closest to the screw. The remaining bare chips are the first category. The reason for using eutectic treatment for the second category of bare chips is to ensure the process reliability of the bare chips. Specifically, the switch chip is large in size, and the conductive adhesive bonding is prone to unstable bonding. The expansion coefficient of the bonding between the large chip and the printed circuit board is subject to stress damage. The high-power chip does not dissipate heat well when directly bonded with conductive adhesive, so a certain amount of heat conduction is achieved through the eutectic and molybdenum-copper carrier. The chip close to the screw has a greater pulling force, stress concentration, poor process reliability, and the pulling force can easily cause device damage.

[0082] The high-power chip described in this embodiment is designed to have a burnout resistance power of 5W for reliability (burnout resistance is the maximum power at which a component can maintain normal operation without being damaged under excessive current or power).

[0083] Specifically, the gold wire bonding process is as follows: The bonder settings are: pressure 20±5g, ultrasonic power 130-280 LSB, ultrasonic time 90-100 ms, tail wire length 160μm, a 19mm splitter heated for 3-5 turns, and 25μm gold wire used for all bonding points. Cascade gold wire bonding is performed on microstrip lines on a flexible substrate, chip capacitors, chip pin pads, and insulators.

[0084] Compared with existing conventional assembly and design methods, the process scheme of this invention, combined with the selection of appropriate electronic components, significantly reduces the module's dimensions to 97mm*95mm*12.6mm, achieving the design goal of 100mm*100mm*13mm and a weight of 400g. This meets the design requirements of miniaturization, lightweighting, and localization of the product module.

[0085] Thus far, various embodiments of the present disclosure have been described in detail. To avoid obscuring the concept of the present disclosure, some details known in the art have not been described. Based on the above description, those skilled in the art can fully understand how to implement the technical solutions disclosed herein. Those skilled in the art should understand that the above embodiments may be modified or some technical features may be replaced with equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A multi-channel receiving channel module assembly process, characterized in that: The following steps are involved: Step S1: preparing materials, including a structural cavity, a printed circuit board (PCBA) with mounted electrical components, micro-components, an LC filter, an SMP connector, and radio frequency insulators; the micro-components include several bare chips; Step S2: ultrasonically cleaning the structural cavity to remove machining stains and debris; Step S3: soldering and sintering the SMP connector, LC filter, and RF insulator to the structural cavity according to the assembly drawing; Step S4: Assemble the printed circuit board (PCBA) in the structural cavity, fix it with screws, and perform wire welding on the welding points; Step S5: Perform first article verification. If the verification is qualified, proceed to step S6; Step S6: Adhere the first-class bare chip and the flexible substrate of one channel to the printed circuit board (PCBA) using conductive adhesive according to the assembly drawing, and bake the conductive adhesive; The soft substrate is used to connect the SMP connector pins and the printed circuit board; Step S7: Perform a gold wire bonding operation on one channel, bonding the bonding points of the first type of bare chip to the chip capacitor or the printed circuit board pad with gold wires, soldering the welding points on one side of the flexible substrate microstrip line to the SMP connector pins, and bonding the other side of the flexible substrate microstrip line to the chip capacitor with gold wires; the chip capacitor is an electrical component installed on the printed circuit board (PCBA); Step S8: Perform first article verification, program download, and high and low temperature tests. If all passes, proceed to step S9. Step S9: The second type of bare chip and the carrier are subjected to a eutectic process, and the carrier is bonded to the printed circuit board (PCBA) using H20E conductive adhesive in one channel, and the conductive adhesive is baked; Step S10: Repeat steps S6 to S9 until chip mounting and gold wire bonding operations for all channels are completed; Step S11: After the whole machine is assembled, debugging and testing procedures are carried out according to the process flow; The second type of bare chips includes three types of bare chips: the first type is a switch chip, the second type is a high-power chip, the third type is the chip closest to the screw, and the remaining bare chips are the first type of bare chips.

2. A multi-channel receiving channel module assembly process according to claim 1, characterized in that: The cavity is made of aluminum AL6061-T6 material, and the cavity is plated with dark nickel AL / AP.Ni8, and the cavity is partially plated with gold Au0.

5.

3. The multi-channel receiving channel module assembly process according to claim 1, characterized in that: The printed circuit board (PCB) of the printed circuit board (PCBA) is a surface-treated printed circuit board. The treatment process is as follows: Step S201: forming a nickel-palladium-gold alloy layer on the surface of the printed circuit board by metal deposition; Step S202: The via holes on the printed circuit board are plugged with resin and plated flat.

4. The multi-channel receiving channel module assembly process according to claim 1, characterized in that: In step S3, the sintering process is as follows: Apply solder to the welding surface of RF insulators, SMP connectors and LC filters, wrap all RF insulators and SMP connectors with tin, and apply tin to the bottom contact points of LC filters. After the RF insulators, SMP connectors and LC filters are installed, place the cavity on the heating table. Use the high temperature of the heating table and the auxiliary heating of the hot air gun to wait for the solder paste on the RF insulators, SMP connectors and LC filters to melt and wet well at high temperature. Then, sintering is completed and self-inspection is performed.

5. The multi-channel receiving channel module assembly process according to claim 1, characterized in that: In step S6, H20E conductive adhesive is applied under the bare chip and the soft substrate, and the bare chip and the soft substrate are placed on the printed circuit board and pressed using a tooling press to ensure a tight fit. Then, the structural cavity is placed in a drying oven, the temperature is set to 120°C, and the baking time is 1.5 hours. After being taken out and naturally cooled, the conductive adhesive bonding is completed.

6. The multi-channel receiving channel module assembly process according to claim 1, characterized in that: In step S9, the second type of bare chip uses a eutectic process; the second type of bare chip is soldered on a molybdenum-copper material carrier using gold-tin Au80Sn20 eutectic, and the eutectic carrier is then bonded to the printed circuit board PCBA using H20E conductive adhesive.

7. The multi-channel receiving channel module assembly process according to claim 1, characterized in that: The structural cavity is provided with a plurality of transverse cavities. The corresponding transverse cavities on the front and back sides are interconnected by radio frequency insulators or high-temperature wires to form a channel. The structural cavity is provided with vertical cavities on both sides. The vertical cavities are located on one side of the corresponding transverse cavities. The vertical cavities on the front and back sides are also interconnected by radio frequency insulators or high-temperature wires. Printed circuit boards are installed in both the transverse and vertical cavities. The horizontal compartment is used to install the signal processing unit, and the vertical compartment is used to install the control and power supply unit; the signal processing unit includes a number of electrical components and micro components; the control and power supply unit includes a number of electrical components; An SMP connector connected to the signal processing unit and an SMP connector connected to the control and power supply unit are soldered on the structural cavity.

8. The multi-channel receiving channel module assembly process according to claim 7, characterized in that: The front and back of the structural cavity are both laser sealed, and the sealing cover material is aluminum AL4047.

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