A method for manufacturing a circuit board V-CUT

Abstract

The application discloses a kind of circuit board V-CUT manufacturing method, comprising: V-CUT drawing design, wherein: the minimum distance of circuit pattern to V-CUT center line is S1=0.2+h×tg (α / 2), the minimum distance of character to V-CUT center line is S2=0.40+h×tg (α / 2), V-CUT minimum excess thickness is greater than or equal to 0.2mm;Wherein h indicates circuit board thickness, α indicates V-CUT angle;Ring V-CUT line, first ring V-CUT inner side line by cutter, then ring V-CUT outer side line by cutter.The circuit board V-CUT manufacturing method provided by the application can effectively avoid the problems of damaging circuit pattern and damaging circuit board structure strength during V-CUT manufacturing by optimizing the position and excess thickness of V-CUT line, thereby improving the quality of circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and specifically to a method for manufacturing V-CUT circuit boards. Background Technology

[0002] With the development of electronic technology products, the demand for printed circuit boards has been increasing, which has led to the rapid development of printed circuit board companies and increasingly higher requirements for the manufacturing precision of circuit boards.

[0003] V-CUT is a method of cutting PCBs. It involves making a series of V-shaped cuts on the PCB and then applying appropriate force to break the board, allowing the PCB panel to be separated into individual panels. The location and design of the V-CUT lines should fully consider the structural and functional requirements of the PCB. The cutting depth and angle should ensure that the cut unit boards can be easily separated without compromising the original structural strength of the PCB, thus preventing deformation and bending of the PCB with V-CUTs.

[0004] In existing manufacturing processes, the production of V-CUT lines is not standardized, which can easily lead to problems such as damage to the circuit pattern, or unreasonable control of the excess thickness of the circuit board, which can damage the structural strength of the circuit board and thus affect the quality of the circuit board.

[0005] Therefore, it is necessary to provide a method for manufacturing V-CUT circuit boards to solve the above-mentioned technical problems. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a method for manufacturing V-CUT lines on circuit boards, thereby improving the product quality of circuit boards by standardizing the manufacturing process of V-CUT lines.

[0007] The technical solution of the present invention is as follows:

[0008] A method for fabricating a V-CUT on a circuit board includes:

[0009] Step S1, V-CUT drawing design, including:

[0010] The minimum distance from the line graphic to the center line of the V-CUT is S1 = 0.2 + h × tg(α / 2), the minimum distance from the character to the center line of the V-CUT is S2 = 0.40 + h × tg(α / 2), and the minimum allowable thickness of the V-CUT is ≥ 0.2 mm.

[0011] Where h represents the thickness of the circuit board, and α represents the V-CUT angle;

[0012] Step S2: Run the V-CUT lines. First, run the inner V-CUT lines, then run the outer V-CUT lines.

[0013] Furthermore, when the circuit board forming line overlaps with the V-CUT line, the circuit board forming line is moved inward or the V-CUT line is moved outward.

[0014] Furthermore, the distance by which the circuit board forming line moves inward or the V-CUT line moves outward is 0.05-0.15mm.

[0015] Furthermore, when the unit panels of the panel are connected by combining TAB and V-CUT, the V-CUT line is shifted outward by 0.05mm.

[0016] Furthermore, the V-CUT excess thickness control is as follows:

[0017] When 0.6mm ≤ board thickness h < 0.8mm, the allowable thickness should be controlled at 0.20-0.30mm;

[0018] When 0.8mm ≤ board thickness h ≤ 1.6mm, the excess thickness should be controlled at 0.25-0.35mm;

[0019] When 1.6mm < PCB thickness h < 3.2mm, the excess thickness should be controlled at 0.40-0.50mm.

[0020] Furthermore, the V-CUT angle α is 30°, 45°, or 60°.

[0021] Furthermore, this includes large-board V-CUT processes and small-board V-CUT processes, wherein:

[0022] The maximum processing size of the large-format V-CUT is 750mm*700mm, the minimum processing size is 150mm*110mm, the minimum spacing between the jump cutters is 15mm, the minimum spacing between the hanging hole and the V-CUT line is 8mm, and the processing board thickness is 0.6-3.2mm.

[0023] The maximum processing size for small board V-CUT is 400mm*450mm, the minimum processing size is 75mm*75mm, the processing board thickness is 0.8-3.2mm, and the minimum distance between the V-CUT line and the edge of the board is 3mm.

[0024] Furthermore, in the large-panel V-CUT process, each unit panel is distributed in one direction.

[0025] Compared with the prior art, the circuit board V-CUT fabrication method provided by the present invention has the following advantages:

[0026] The circuit board V-CUT manufacturing method provided by this invention can effectively avoid problems such as damage to the circuit pattern and the structural strength of the circuit board during V-CUT manufacturing by optimizing the position and thickness of the V-CUT lines, thereby improving the quality of the circuit board. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the V-CUT in this invention;

[0029] Figure 2 This is a schematic diagram of one embodiment of the V-CUT manufacturing process of the present invention;

[0030] Figure 3 This is a schematic diagram of the skip-blade V-CUT process in the large-plate V-CUT process of this invention. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be further described below.

[0032] It should be noted that the descriptions of these embodiments are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0033] A method for fabricating a V-CUT on a circuit board includes the following steps:

[0034] Step S1, V-CUT drawing design;

[0035] Specifically, the ability to create V-CUT lines from graphics is as follows:

[0036] The minimum distance from the circuit diagram to the center line of V-CUT is S1 = 0.2 + h × tg(α / 2);

[0037] The minimum distance from the character to the center line of the V-CUT is S2 = 0.40 + h × tg(α / 2);

[0038] Where h represents the circuit board thickness, and α represents the V-CUT angle, such as Figure 1 As shown;

[0039] In this invention, the V-CUT angle α is 30°, 45° or 60°.

[0040] When the PCB forming line overlaps with the V-CUT line, the PCB forming line needs to be moved inward or the V-CUT line needs to be moved outward. Preferably, the distance the PCB forming line is moved inward or the V-CUT line is moved outward is 0.05-0.15mm. When the unit boards of the panel are connected by combining TAB and V-CUT, the V-CUT line is moved outward by 0.05mm. Figure 2 As shown, when the PCB forming line overlaps with the V-CUT line, the PCB forming line is moved inward by 2mil to form a new outline.

[0041] In this invention, the minimum V-CUT thickness is ≥0.2mm, and different V-CUT thicknesses are set according to different circuit board thicknesses. Figure 1 In this context, T represents the excess thickness, as detailed below:

[0042] When 0.6mm ≤ board thickness h < 0.8mm, the allowable thickness should be controlled at 0.20-0.30mm;

[0043] When 0.8mm ≤ board thickness h ≤ 1.6mm, the excess thickness should be controlled at 0.25-0.35mm;

[0044] When 1.6mm < PCB thickness h < 3.2mm, the excess thickness should be controlled at 0.40-0.50mm;

[0045] When the circuit board thickness h ≤ 1.6mm and there is no router space, and the V-CUT length > 50mm, the excess thickness should be controlled at 0.25-0.35mm.

[0046] Step S2: According to the design, use a router to router the V-CUT lines. First, router the inner V-CUT lines, then router the outer V-CUT lines.

[0047] In this invention, the circuit board V-CUT includes large board V-CUT process and small board V-CUT process, wherein:

[0048] The maximum machining size for large-format V-CUT is 750mm*700mm, and the minimum machining size is 150mm*110mm. The minimum skip tool spacing is 15mm, and the minimum distance from the hanging hole to the V-CUT line is 8mm. The machining board thickness is 0.6-3.2mm. The minimum skip tool spacing of 15mm means that the V-CUT entry and exit points must maintain a safe distance of at least 15mm from the inside of the board. Figure 3 As shown.

[0049] The maximum processing size for small board V-CUT is 400mm*450mm, the minimum processing size is 75mm*75mm, the processing board thickness is 0.8-3.2mm, and the minimum distance between the V-CUT line and the edge of the board is 3mm.

[0050] In the large-panel V-CUT process, each unit panel is distributed in one direction, and the splicing direction of each unit panel cannot be staggered horizontally or vertically.

[0051] The circuit board V-CUT manufacturing method provided by this invention can effectively avoid problems such as damage to the circuit pattern and the structural strength of the circuit board during V-CUT manufacturing by optimizing the position and thickness of the V-CUT lines, thereby improving the quality of the circuit board.

[0052] The embodiments of the present invention have been described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A method for fabricating a V-CUT on a circuit board, characterized in that, include: Step S1, V-CUT drawing design, including: The minimum distance from the line graphic to the center line of the V-CUT is S1=0.2+h×tg(α / 2), the minimum distance from the character to the center line of the V-CUT is S2=0.40+h×tg(α / 2), and the minimum allowable thickness of the V-CUT is ≥0.2mm; Where h represents the thickness of the circuit board, and α represents the V-CUT angle; When the PCB forming line overlaps with the V-CUT line, the PCB forming line is moved inward or the V-CUT line is moved outward. The distance of the inward or outward movement of the PCB forming line or the V-CUT line is 0.05-0.15mm. When the unit boards of the panel are connected by combining TAB and V-CUT, the V-CUT line is moved outward by 0.05mm. V-CUT excess thickness control is as follows: When 0.6mm ≤ board thickness h < 0.8mm, the allowable thickness should be controlled at 0.20-0.30mm; When 0.8mm ≤ board thickness h ≤ 1.6mm, the excess thickness should be controlled at 0.25-0.35mm; When 1.6mm < PCB thickness h < 3.2mm, the excess thickness should be controlled at 0.40-0.50mm; Step S2: Run the V-CUT lines. First, run the inner V-CUT lines, then run the outer V-CUT lines. This includes large-board V-CUT processes and small-board V-CUT processes, among which: The maximum machining size of the large-format V-CUT is 750mm×700mm, the minimum machining size is 150mm×110mm, the minimum spacing between the jump cutters is 15mm, the minimum spacing between the hanging hole and the V-CUT line is 8mm, and the machining board thickness is 0.6-3.2mm. The maximum processing size of the small board V-CUT is 400mm×450mm, the minimum processing size is 75mm×75mm, the processing board thickness is 0.8-3.2mm, and the minimum distance between the V-CUT line and the edge of the board is 3mm.

2. The method for fabricating a V-CUT on a circuit board according to claim 1, characterized in that, The V-CUT angle α is 30°, 45°, or 60°.

3. The method for fabricating a V-CUT on a circuit board according to claim 1, characterized in that, In the large-panel V-CUT process, each unit panel is distributed in one direction.

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