Device and method for coating integrated circuit chip packaging

Abstract

The present invention relates to the field of integrated circuit technology, specifically to a device and method for coating integrated circuit chip packaging, comprising a frame, two feed support shells are fixedly connected to the top of the frame, transmission components for transporting sheet frame chips are arranged inside the two feed support shells, positioning blocks for fixing the sheet frame chips are arranged on both sides of the two feed support shells, power components for driving the positioning blocks to move are arranged on both sides of the two feed support shells, a top frame is fixedly connected to the top of the frame, a driving cylinder is fixedly connected to the top of the top frame, two film coating shells are arranged at the output end of the driving cylinder, a plurality of shaping plates are arranged inside the two film coating shells, blades are arranged inside the plurality of shaping plates, and a film transport component is arranged on the top of the top frame. The positioning block can timely fix and support the sheet frame chip, and it cooperates with the coating shell to fix it during the coating work, thereby improving efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to a device and method for coating integrated circuit chip packaging. Background Art

[0002] With the rapid development of information technology, integrated circuit (IC) chips, as the core components of electronic devices, have a direct impact on the stability and reliability of the entire system through their performance and quality. In the manufacturing process of integrated circuits, packaging is a crucial link, which not only protects the chip from the influence of the external environment, but also provides a stable electrical connection. As a key technology in the packaging process, lamination technology is of great significance for improving the performance and quality of packaging.

[0003] For example, the patent application with the prior art announcement number CN219203136U discloses a device for IC chip encapsulation coating, which relates to the field of IC technology. The application includes: a fixed component connected to a frame component; wherein the fixed component includes a rubber layer, a fixed plate connected to the lower end of the rubber layer, bolts connected to both sides of the fixed plate, a movable plate connected to the front and rear ends of the bolts, a groove plate connected to the bottom end of the movable plate, a plurality of slots connected to both sides of the upper end of the groove plate, and a fixed rod I connected to the inner end of the slot; the front end of the bolt is connected to a baffle. By setting a fixed component, the application solves the problem that the packaging technology of integrated circuits is developing towards small size, high number of pins and high thermal efficiency. The continuous reduction in size makes the packaging of integrated circuits more difficult. Integrated circuits with high thermal efficiency will generate higher heat while improving performance. However, the existing small packaging technology lacks an effective heat dissipation mechanism, the heat dissipation effect of the packaged chip is not ideal, and the installation is troublesome during packaging, and the packaging efficiency is low.

[0004] The above-mentioned prior art, when packaging integrated circuits, ensures the stable fixation of each integrated circuit by setting a fixed component, thereby improving the packaging effect. However, in the large-scale production process of integrated circuits, due to the huge production volume, automated production lines have become the mainstream. The above-mentioned packaging method requires each integrated circuit to be placed separately in a fixed component, and fixed and packaged one by one. This discontinuous workflow greatly limits the production efficiency. Specifically, when the integrated circuit moves continuously on the assembly line, if a one-by-one fixing method is adopted, not only additional pause time is required to complete the fixing action, but also a robotic arm is required to operate one by one, which undoubtedly increases the complexity of the operation and time cost. In addition, since the fixing and packaging of each integrated circuit are carried out independently, it is difficult to form a continuous and efficient production rhythm, which further affects the overall production efficiency. To this end, the present application proposes a device and method for integrated circuit chip packaging coating. Summary of the invention

[0005] The object of the present invention is to provide a device and method for coating integrated circuit chip packaging to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for coating integrated circuit chip packaging, comprising a frame, two material feeding support shells are fixedly connected to the top of the frame, and the interiors of the two material feeding support shells are provided with transmission components for transporting sheet frame chips, and both sides of the two material feeding support shells are provided with positioning blocks for fixing the sheet frame chips, and both sides of the two material feeding support shells are provided with power components for driving the positioning blocks to move, the top of the frame is fixedly connected to a top frame, and the top of the top frame is fixedly connected to a driving cylinder, and the output end of the driving cylinder is provided with two coating shells, and the interiors of the two coating shells are provided with multiple shaping plates, and the interiors of the multiple shaping plates are provided with blades, and the top of the top frame is provided with a film feeding component.

[0007] Preferably, the transmission assembly includes a main synchronous wheel rotatably connected to the inside of the material feeding support shell, and the two ends of the inside of the material feeding support shell are respectively rotatably connected to rotating rods, and the outer surfaces of the two rotating rods are fixedly connected to two auxiliary synchronous wheels connected to the main synchronous wheel through a synchronous conveyor belt.

[0008] Preferably, the power assembly includes support blocks fixedly connected to both sides of the feed support housing, the support blocks are rotatably connected internally with a transmission rod, the bottom of the positioning block is fixedly connected to two sliding blocks, one side of the two sliding blocks is provided with a transmission groove, and both ends of the transmission rod are respectively fixedly connected with cams adapted to the transmission groove.

[0009] Preferably, the two sides of the two feed support shells are fixedly connected with a fixing frame, the interior of the fixing frame is slidably connected with a guide rod fixedly connected to the positioning block, the outer surface of the guide rod is sleeved with a reset spring for driving it to reset, and the outer surface of the transmission rod is sleeved with a torsion spring for driving it to reset.

[0010] Preferably, trigger plates are fixedly connected to both sides of the coating shell, a crank is fixedly connected to the outer surface of the transmission rod, a slide groove is provided on the top of the crank, a trigger member is slidably connected to the top of the fixed frame, and both ends of the bottom of the trigger member are rotatably connected to hinge seats, and the hinge seats are slidably connected in the slide groove.

[0011] Preferably, the output end of the driving cylinder is fixedly connected to a connecting plate, the two ends of the bottom of the connecting plate are respectively fixedly connected to a light rod slidably connected to the coating shell, the bottom of the light rod is fixedly connected to a pressure plate connected to a plurality of shaping pressure plates, the outer surface of the light rod is sleeved with a pressure spring, the bottom of the pressure spring is fixedly connected to the coating shell, and the top of the pressure spring is fixedly connected to the connecting plate.

[0012] Preferably, the bottom of the pressure plate is fixedly connected with a sleeve, the bottom of the sleeve is slidably connected with a movable sliding rod fixedly connected to the shaping pressure plate, and a cavity is provided inside the sleeve for the movable sliding rod to slide, both sides of the sleeve are rotatably connected with hinge plates, the top of the shaping pressure plate is provided with a groove, the inside of the groove is slidably connected with an inclined protrusion rotatably connected to the hinge plate, the top of the blade is rotatably connected with a ball bearing that contacts with the inclined surface of the inclined protrusion, the top of the blade is fixedly connected with a connecting spring fixedly connected to the inside of the shaping pressure plate, and the outer surface of the movable sliding rod is sleeved with a buffer spring for driving its own reset.

[0013] Preferably, the film conveying assembly includes a feed roller fixedly connected to one side of the top of the top frame, two tubular films are fixedly connected to the outer surface of the feed roller, and films are wrapped around the outer surfaces of the two tubular films, and a receiving roller is fixedly connected to the other side of the top of the top frame, and the receiving roller can be connected to the film.

[0014] Preferably, an adjusting slide rod is fixedly connected to the bottom of the top frame, and an adjusting block is slidably connected to the outer surface of the adjusting slide rod, and a guide roller is rotatably connected to one side of the adjusting block.

[0015] The present invention also provides a method for coating integrated circuit chip packaging, comprising the following steps:

[0016] S1. First, place two cylindrical films on the film transport assembly for transport, and at the same time place the sheet frame chip inside the material transport support shell, start the control transmission assembly, and move the sheet frame chip to the bottom of the film covering shell and stop;

[0017] S2, then start the driving cylinder to drive the connecting plate to move downward, and then drive the film covering shell to move downward to contact the feeding support shell, so that it moves downward to fit the top surface of the feeding support shell, at this time, the film covering shell will contact the top of the feeding support shell, and at the same time, continue to drive the connecting plate downward to make multiple shaping pressing plates respectively contact the top of the sheet frame chip, at this time, the film is attached to the surface of the sheet frame chip for film covering;

[0018] S3. Then, when the shaping platen completely contacts the chip of the sheet frame, the film will be sandwiched between the two. As the driving cylinder is continuously driven, the blade will be driven downward to cut the film, so that the cut film is completely attached to the chip of the sheet frame. Then, the driving cylinder can be controlled to contract to drive the film covering shell to move upward, thereby completing a single set of film covering.

[0019] S4. When the film covering shell moves downward, the power assembly will be started, thereby driving the positioning block to move toward the direction of the sheet frame chip, and finally the positioning block will contact the sheet frame chip to fix and support it.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] By adjusting the sliding connection between the slide rod and the adjustment block, and the guiding effect of the guide roller on the film, it can be ensured that the film remains taut and flat during the laminating process, thereby improving the accuracy and quality of the laminating. The interaction between the trigger plate and the trigger member can ensure that the laminating shell moves down at the correct time point, and triggers the corresponding positioning mechanism to fix and support the chip on the sheet frame, thereby enhancing the stability and reliability of the entire system. The positioning block can fix and support the chip on the sheet frame in time to prevent the chip from moving or tilting during the laminating process, thereby avoiding potential safety hazards. At the same time, it cooperates with the laminating shell to fix it during laminating work, thereby improving efficiency.

[0022] When the connecting plate is driven downward by the driving cylinder, the film coating shell can be accurately fitted on the top surface of the feed support shell through precise cooperation, thereby ensuring that the film can be evenly and bubble-freely covered on the chip of the sheet frame. The shaping plate precisely contacts the top of the chip of the sheet frame, further improving the accuracy of the film coating and ensuring the fit between the film and the chip. The cooperation between the movable slide rod and the sleeve ensures the smooth film cutting action. At the same time, the blade can be driven downward to cut the film after the film coating is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0024] Figure 2 It is a partial structural schematic diagram of the present invention;

[0025] Figure 3 It is a structural schematic diagram of the material conveying support shell in the present invention;

[0026] Figure 4 It is a structural schematic diagram of the synchronous conveyor belt in the present invention;

[0027] Figure 5 It is a structural schematic diagram of the positioning block in the present invention;

[0028] Figure 6 For the present invention Figure 5 A schematic diagram of the structure enlargement in the middle;

[0029] Figure 7 It is a structural schematic diagram of the transmission rod in the present invention;

[0030] Figure 8 It is a schematic diagram of the structure of the trigger plate and the trigger member in the present invention;

[0031] Fig. 9 It is a schematic diagram of the structure of the film-covered shell in the present invention;

[0032] Fig.10It is a schematic diagram of the explosion structure of the film-coated shell and the polished rod in the present invention;

[0033] Fig.11 It is a structural schematic diagram of the shaping press plate in the present invention;

[0034] Fig.12 It is a structural schematic diagram of the sleeve in the present invention;

[0035] Fig.13 It is a schematic diagram of the cross-sectional structure of the shaping pressing plate in the present invention;

[0036] Fig.14 It is a schematic diagram of the structure of the blade in the present invention;

[0037] Fig.15 For the present invention Figure 5 Enlarged schematic diagram of the structure at point B in the middle.

[0038] In the figure: 100, frame; 101, top frame; 102, feed roller; 103, receiving roller; 104, tube film; 105, film; 106, adjustment block; 107, adjustment slide bar; 108, guide roller; 109, sheet frame chip; 200, feed support shell; 201, main synchronous wheel; 202, rotating rod; 203, auxiliary synchronous wheel; 204, synchronous conveyor belt; 205, positioning block; 206, slider; 207, transmission rod; 208, cam; 209, transmission groove; 210, crank; 211, trigger; 212, fixed Frame; 213, support block; 214, torsion spring; 215, slide groove; 216, guide rod; 217, return spring; 300, film shell; 301, drive cylinder; 302, trigger plate; 303, roller; 304, connecting plate; 305, light rod; 306, pressure plate; 307, shaping pressure plate; 308, pressure spring; 309, sleeve; 310, movable slide rod; 311, hinge plate; 312, oblique protrusion; 313, groove; 314, buffer spring; 400, blade; 401, ball; 402, connecting spring. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] Example 1: Please refer to Figure 1 , Figure 3 as well as Figure 4The present invention provides a technical solution: a device for packaging and laminating integrated circuit chips, comprising a frame 100, wherein two feeding support shells 200 are fixedly connected to the top of the frame 100, and sheet frame chips 109 are respectively arranged in the two feeding support shells 200, and transmission components for transporting the sheet frame chips 109 are arranged inside the two feeding support shells 200, and the transmission components include a main synchronous wheel 201 rotatably connected to the inside of the feeding support shell 200, and two ends of the inside of the feeding support shell 200 are rotatably connected to rotating rods 202, and the outer surfaces of the two rotating rods 202 are fixedly connected with two auxiliary synchronous wheels 203 connected to the main synchronous wheel 201 through a synchronous conveyor belt 204, and the outer surface of the main synchronous wheel 201 is provided with a plurality of convex strips to increase the friction between the synchronous conveyor belt 204, and the plurality of synchronous conveyor belts 204 are staggered, which can effectively transport the sheet frame chips 109, and at the same time, a board is arranged in the feeding support shell 200 to assist in supporting the synchronous conveyor belt 204, so that it has a stronger bearing capacity.

[0041] Among them, the top of the frame 100 is fixedly connected to the top of the top frame 101, and the top of the top frame 101 is fixedly connected to the driving cylinder 301. The output end of the driving cylinder 301 is provided with two coating shells 300, and the interior of the two coating shells 300 is provided with a plurality of shaping plates 307. The plurality of shaping plates 307 are adapted to the sheet frame chip 109, and the film can be accurately pressed to the top of the sheet frame chip 109 for coating.

[0042] For further information, see Figure 5 , Figure 6 as well as Fig.15 , positioning blocks 205 for fixing the chip frame 109 are arranged on both sides of the two feeding support shells 200, and power components for driving the positioning blocks 205 to move are arranged on both sides of the two feeding support shells 200, and the power components include support blocks 213 fixedly connected to both sides of the feeding support shells 200, and the internal rotation of the support blocks 213 is connected to a transmission rod 207, and the bottom of the positioning block 205 is fixedly connected to two sliders 206, and one side of the two sliders 206 is provided with a transmission groove 209, and the two ends of the transmission rod 207 are respectively fixedly connected to The transmission groove 209 is adapted to the cam 208, and the two sides of the two feed support shells 200 are fixedly connected with a fixing frame 212 respectively. The inside of the fixing frame 212 is slidably connected with a guide rod 216 fixedly connected to the positioning block 205. The outer surface of the guide rod 216 is sleeved with a reset spring 217 for driving it to return to its original position. The outer surface of the transmission rod 207 is sleeved with a torsion spring 214 for driving it to return to its original position. By setting the cam 208 to rotate, the transmission groove 209 can be driven to move, thereby driving the positioning block 205 to move close to the chip 109 of the sheet frame to fix it.

[0043] Among them, see Figure 6 , Figure 7 as well as Figure 8In order to reduce the operation process of fixing the sheet frame chip 109, trigger plates 302 are fixedly connected to both sides of the coating shell 300, and a crank 210 is fixedly connected to the outer surface of the transmission rod 207. A slide groove 215 is provided on the top of the crank 210. A trigger member 211 is slidably connected to the top of the fixed frame 212, and the two ends of the bottom of the trigger member 211 are rotatably connected to hinge seats, and the hinge seats are slidably connected in the slide groove 215. When the coating shell 300 is driven to move downward to coat the sheet frame chip 109, the trigger plate 302 moves downward with it and contacts the trigger member 211, which can drive the power component to start and drive the positioning block 205 to clamp the sheet frame chip 109, thereby improving efficiency and reducing manual operation.

[0044] Specifically, when the film shell 300 moves downward, it will drive the trigger plates 302 connected on both sides to move downward together with it. The continuous downward movement of the trigger plate 302 will conflict with the trigger member 211, causing it to move downward under pressure. As the trigger member 211 moves downward, it will push the crank 210 at its bottom to rotate, thereby driving the transmission rod 207 to rotate, and then drive the cam 208 to rotate and conflict with the transmission rod 207 on one side of the slider 206, thereby pushing the slider 206 to move. At this time, the movement of the slider 206 drives the positioning block 205 to move in the direction close to the sheet frame chip 109, and finally the positioning block 205 will conflict with the sheet frame chip 109 to fix and support it.

[0045] For further information, see Figure 1 Figure 2 In order to realize continuous coating, a film conveying assembly is arranged on the top of the top frame 101, and the film conveying assembly includes a feed roller 102 fixedly connected to one side of the top of the top frame 101, and two tube films 104 are fixedly connected to the outer surface of the feed roller 102, and a film 105 is wound around the outer surface of the two tube films 104, and a receiving roller 103 is fixedly connected to the other side of the top of the top frame 101, and the receiving roller 103 can be connected with the film 105, wherein the feed roller 102 and the receiving roller 103 are existing technologies, and are both equipped with a driving member to drive them to rotate, thereby improving the efficiency of film conveying, so that the used film is wound around the surface of the receiving roller 103.

[0046] Among them, an adjusting slide bar 107 is fixedly connected to the bottom of the top frame 101, and an adjusting block 106 is slidably connected to the outer surface of the adjusting slide bar 107, and a guide roller 108 is rotatably connected to one side of the adjusting block 106, wherein the guide roller 108 can guide the film 105 to keep it in a taut state, and the adjusting block 106 is a lockable slider that can slide on the surface of the adjusting slide bar 107 and be fixed at a certain height.

[0047] Specifically, two tubular films 104 are placed on the feed roller 102, and the film 105 on the surface of the tubular film 104 is pulled through the bottom of the two guide rollers 108 and finally connected to the receiving roller 103. At the same time, the sheet frame chip 109 is placed inside the feed support shell 200 and above the synchronous conveyor belt 204. The main synchronous wheel 201 is controlled to rotate through the synchronous conveyor belt 204 so that the auxiliary synchronous wheel 203 rotates with it, so that the sheet frame chip 109 located on the top surface of the synchronous conveyor belt 204 moves.

[0048] In summary, by adjusting the sliding connection between the slide bar 107 and the adjustment block 106, and the guiding effect of the guide roller 108 on the film 105, it is possible to ensure that the film 105 remains taut and flat during the lamination process, thereby improving the accuracy and quality of the lamination. The interaction between the trigger plate 302 and the trigger member 211 can ensure that the lamination shell 300 moves down at the correct time point, and triggers the corresponding positioning mechanism to fix and support the sheet frame chip 109, thereby enhancing the stability and reliability of the entire system. The positioning block 205 can fix and support the sheet frame chip 109 in time to prevent the chip from moving or tilting during the lamination process, thereby avoiding potential safety hazards. At the same time, it cooperates with the lamination shell 300 to fix it during the lamination work, thereby improving efficiency.

[0049] Example 2: Please refer to Fig. 9 , Fig.10 as well as Fig.11 The present invention also provides a technical solution, which is different from the technical solution of Example 1: a device for coating integrated circuit chip packaging, wherein a plurality of shaping plates 307 are provided with blades 400 inside, and the blades 400 have the same shape as the shaping plates 307, and can cut the film 105 around the outer surface of the shaping plates 307, and the output end of the driving cylinder 301 is fixedly connected to a connecting plate 304, and the two ends of the bottom of the connecting plate 304 are respectively fixedly connected to a light rod 305 slidably connected to the film coating shell 300, and the bottom of the light rod 305 is fixedly connected to a pressure plate 306 connected to the plurality of shaping plates 307, and the outer surface of the light rod 305 is sleeved with a pressure spring 30 8. The bottom of the pressure spring 308 is fixedly connected to the film coating shell 300, the top of the pressure spring 308 is fixedly connected to the connecting plate 304, and the light rod 305 is slidably connected to the film coating shell 300, so that the light rod 305 relies on the elastic force of the pressure spring 308 to push the film coating shell 300 down when moving downward, thereby reducing the rigid contact between the film coating shell 300 and the film 105. At the same time, the film coating shell 300 can contact the top of the feed support shell 200 to fix the film 105. Subsequently, the continuous movement of the light rod 305 will compress the pressure spring 308 to make multiple shaping pressure plates 307 move down to contact the film 105, so that the film 105 is stably placed on the top of the sheet frame chip 109 to complete the coating.

[0050] Among them, see Fig.12 , Fig.13 as well as Fig.14 When the lamination is completed, the film 105 needs to be cut. The bottom of the pressure plate 306 is fixedly connected with a sleeve 309. The bottom of the sleeve 309 is slidably connected with a movable slide bar 310 fixedly connected to the shaping plate 307, and a cavity is provided inside the sleeve 309 for the movable slide bar 310 to slide. Both sides of the sleeve 309 are rotatably connected with hinge plates 311. The top of the shaping plate 307 is provided with a groove 313. The inside of the groove 313 is slidably connected with an inclined protrusion 312 rotatably connected to the hinge plate 311. The top of the blade 400 is rotatably connected with a ball 401 that contacts the inclined surface of the inclined protrusion 312. The top of the blade 400 is fixedly connected with a connecting spring 402 fixedly connected to the inside of the shaping plate 307. The movable slide bar 31 0 is sleeved with a buffer spring 314 that drives itself to reset. As the light rod 305 continues to move downward, the movable slide bar 310 will slide in the cavity of the sleeve 309, thereby compressing the buffer spring 314, so that the buffer spring 314 acts on the shaping plate 307 to exert a thrust, thereby increasing the fitting force between the shaping plate 307 and the film 105, so that the film 105 is completely fitted to the surface of the sheet frame chip 109, and then when the movable slide bar 310 enters the cavity of the sleeve 309, the hinge plate 311 will tilt, thereby driving the two inclined protrusions 312 away from each other, thereby causing the inclined protrusions 312 to collide with the ball 401, thereby driving the blade 400 to move downward to cut the film 105, thereby completing the whole set of lamination work.

[0051] Specifically, the driving cylinder 301 is then turned on to drive the connecting plate 304 to move downward, thereby driving the film coating shell 300 to move downward and contact the feeding support shell 200, so that it moves downward and fits the top surface of the feeding support shell 200. At this time, the film coating shell 300 will contact the top of the feeding support shell 200. At the same time, the connecting plate 304 is continuously driven downward to make the light rod 305 drive the pressure plate 306 to move downward so that multiple shaping plates 307 are respectively at the top of the sheet frame chip 109. At this time, the film 105 is attached to the surface of the sheet frame chip 109 for coating. Then, when the shaping plate 307 completely contacts the sheet frame chip 109, the film 105 will be sandwiched between the two. As the driving cylinder 301 is continuously driven, The movable slide rod 310 will be forced to enter the interior of the sleeve 309. At this time, the sleeve 309 will move in the direction close to the shaping pressure plate 307, thereby driving the hinged plates 311 rotatably connected at both ends to tilt, so that the hinged plates 311 push the inclined protrusions 312 to move close to the blade 400. At this time, the inclined protrusions 312 slide inside the grooves 313 and collide with the ball 401 rotatably connected to the top of the blade 400. After the two collide, the ball 401 will slide along the inclined surface of the inclined protrusions 312 and drive the blade 400 to move downward, thereby cutting the film 105, so that the cut film 105 is completely attached to the sheet frame chip 109, and then the driving cylinder 301 can be controlled to contract to drive the film shell 300 to move upward.

[0052] In summary, when the connecting plate 304 is driven downward by driving the cylinder 301, precise cooperation can ensure that the coating shell 300 is accurately attached to the top surface of the feed support shell 200, thereby ensuring that the film 105 can be evenly and bubble-freely covered on the sheet frame chip 109. The shaping plate 307 precisely contacts the top of the sheet frame chip 109, further improving the accuracy of the coating and ensuring the fit between the film 105 and the chip. The cooperation between the movable slide bar 310 and the sleeve 309 ensures the smooth progress of the film cutting action. At the same time, the blade 400 can be driven downward to cut the film 105 after the coating is completed.

[0053] Example 3: Please refer to Figures 1 to 15 The present invention also provides a technical solution: a method for coating integrated circuit chip packaging, comprising the following steps:

[0054] S1. First, two tube films 104 are placed on the feeding roller 102, and the film 105 on the surface of the tube film 104 is pulled through the bottom of the two guide rollers 108 and finally connected to the receiving roller 103. At the same time, the sheet frame chip 109 is placed inside the feeding support shell 200 and above the synchronous conveyor belt 204. The main synchronous wheel 201 is controlled to rotate through the synchronous conveyor belt 204 so that the auxiliary synchronous wheel 203 rotates with it, so that the sheet frame chip 109 located on the top surface of the synchronous conveyor belt 204 moves until it moves to the bottom of the film coating shell 300 and stops. In this process, the feeding roller 102 is controlled to move and transport the film 105;

[0055] S2, then start the driving cylinder 301 to drive the connecting plate 304 to move downward, and then drive the film coating shell 300 to move downward to contact the feeding support shell 200, so that it moves downward to fit the top surface of the feeding support shell 200, at this time, the film coating shell 300 will contact the top of the feeding support shell 200, and at the same time, continue to drive the connecting plate 304 to move downward to make the light rod 305 drive the pressure plate 306 to move downward so that the multiple shaping pressure plates 307 are respectively with the top of the sheet frame chip 109, at this time, the film 105 is attached to the surface of the sheet frame chip 109 for coating;

[0056] S3, then when the shaping plate 307 completely conflicts with the sheet frame chip 109, the film 105 will be sandwiched between the two, and with the continuous driving of the driving cylinder 301, the movable slide bar 310 will be forced to enter the interior of the sleeve 309, at this time, the sleeve 309 will move in the direction close to the shaping plate 307, thereby driving the hinged plates 311 rotatably connected at both ends thereof to tilt, so that the hinged plates 311 push the inclined protrusions 312 to move in the direction close to the blade 400, at this time, the inclined protrusions 312 slide in the groove 313 to conflict with the ball 401 rotatably connected to the top of the blade 400, after the two conflict, the ball 401 will slide along the inclined surface of the inclined protrusions 312 and thus drive the blade 400 to move downward, thereby cutting the film 105, so that the cut film 105 is completely attached to the sheet frame chip 109, and then the driving cylinder 301 can be controlled to contract to drive the film coating shell 300 to move upward, so as to complete a single set of coating;

[0057] S4. When the film coating shell 300 moves downward, it will drive the trigger plates 302 connected on both sides to move downward with it. The continuous downward movement of the trigger plate 302 will conflict with the trigger member 211, causing it to move downward under pressure. As the trigger member 211 moves downward, the crank 210 at its bottom will be pushed to rotate, thereby driving the transmission rod 207 to rotate, thereby driving the cam 208 to rotate and conflict with the transmission rod 207 on one side of the slider 206, thereby pushing the slider 206 to move. At this time, the movement of the slider 206 drives the positioning block 205 to move in the direction close to the sheet frame chip 109. Finally, the positioning block 205 will conflict with the sheet frame chip 109 to fix and support it. When the trigger plate 302 no longer conflicts with the trigger member 211, the transmission rod 207 will rotate under the force of the torsion spring 214 to drive the positioning block 205 to reset, release the fixation of the sheet frame chip 109, and then drive the main synchronous wheel 201 to drive the synchronous conveyor belt 204 to convey the sheet frame chip 109 for subsequent coating work.

[0058] In summary, the entire lamination and cutting process is automated, from sleeve film, placement of chip on sheet frame, lamination, cutting, and finally to removal of the lamination shell and moving chip, all completed by mechanical and pneumatic devices, reducing manual operations and improving production efficiency.

[0059] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0060] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for packaging and laminating integrated circuit chips, comprising a frame (100), characterized in that: The top of the frame (100) is fixedly connected with two material conveying support shells (200), and the interiors of the two material conveying support shells (200) are both provided with transmission components for transporting the sheet frame chips (109). Positioning blocks (205) for fixing the sheet frame chips (109) are both provided on both sides of the two material conveying support shells (200), and power components for driving the positioning blocks (205) to move are both provided on both sides of the two material conveying support shells (200). The top of the frame (100) is fixedly connected with a top frame (101), and the top of the top frame (101) is fixedly connected with a driving cylinder (301), and the output end of the driving cylinder (301) is provided with two film coating shells (300), and the interiors of the two film coating shells (300) are provided with a plurality of shaping plates (307), and the interiors of the plurality of shaping plates (307) are each provided with a blade (400), and the top of the top frame (101) is provided with a film conveying component; The output end of the driving cylinder (301) is fixedly connected to a connecting plate (304), and the two ends of the bottom of the connecting plate (304) are respectively fixedly connected to a polished rod (305) slidably connected to the film shell (300), and the bottom of the polished rod (305) is fixedly connected to a pressure plate (306) connected to a plurality of shaping pressure plates (307), and the outer surface of the polished rod (305) is sleeved with a pressure spring (308), the bottom of the pressure spring (308) is fixedly connected to the film shell (300), and the top of the pressure spring (308) is fixedly connected to the connecting plate (304); The bottom of the pressure plate (306) is fixedly connected with a sleeve (309), and the bottom of the sleeve (309) is slidably connected with a movable sliding rod (310) fixedly connected to the shaping plate (307), and a cavity for the movable sliding rod (310) to slide is provided inside the sleeve (309), and both sides of the sleeve (309) are rotatably connected with hinge plates (311), and the top of the shaping plate (307) is provided with a groove (313), and the groove The inner sliding connection of (313) is provided with an inclined protrusion (312) which is rotatably connected to the hinge plate (311); the top of the blade (400) is rotatably connected with a ball (401) which contacts the inclined surface of the inclined protrusion (312); the top of the blade (400) is fixedly connected with a connecting spring (402) which is fixedly connected to the inside of the shaping pressure plate (307); the outer surface of the movable slide rod (310) is provided with a buffer spring (314) which drives itself to reset.

2. The device for coating integrated circuit chip packaging according to claim 1, characterized in that: The transmission assembly comprises a main synchronous wheel (201) rotatably connected to the inside of a material conveying support housing (200), and two ends of the inside of the material conveying support housing (200) are rotatably connected to rotating rods (202), and the outer surfaces of the two rotating rods (202) are fixedly connected to two auxiliary synchronous wheels (203) connected to the main synchronous wheel (201) via a synchronous conveyor belt (204).

3. The device for coating integrated circuit chip packaging according to claim 1, characterized in that: The power assembly comprises support blocks (213) fixedly connected to both sides of the material feeding support housing (200), the support blocks (213) are rotatably connected to a transmission rod (207) inside, the bottom of the positioning block (205) is fixedly connected to two sliders (206), one side of the two sliders (206) is provided with a transmission groove (209), and the two ends of the transmission rod (207) are respectively fixedly connected to cams (208) adapted to the transmission groove (209).

4. The device for IC chip packaging and lamination according to claim 3, characterized in that: A fixing frame (212) is fixedly connected to both sides of the two material conveying support shells (200), and a guide rod (216) fixedly connected to the positioning block (205) is slidably connected inside the fixing frame (212). A reset spring (217) for driving the guide rod (216) to reset is sleeved on the outer surface of the guide rod (216), and a torsion spring (214) for driving the transmission rod (207) to reset is sleeved on the outer surface of the transmission rod (207).

5. The device for coating integrated circuit chip packaging according to claim 4, characterized in that: The two sides of the film shell (300) are respectively fixedly connected with a trigger plate (302), the outer surface of the transmission rod (207) is fixedly connected with a crank (210), the top of the crank (210) is provided with a slide groove (215), the top of the fixed frame (212) is slidably connected with a trigger member (211), and the two ends of the bottom of the trigger member (211) are respectively rotatably connected with an articulated seat, and the articulated seat is slidably connected in the slide groove (215).

6. The device for coating integrated circuit chip packaging according to claim 1, characterized in that: The film conveying assembly comprises a feed roller (102) fixedly connected to one side of the top of the top frame (101); two tube films (104) are fixedly connected to the outer surface of the feed roller (102); and films (105) are wound around the outer surfaces of the two tube films (104); a receiving roller (103) is fixedly connected to the other side of the top of the top frame (101); and the receiving roller (103) can be connected to the film (105).

7. The device for IC chip packaging and lamination according to claim 6, characterized in that: The bottom of the top frame (101) is fixedly connected to an adjusting slide bar (107), and the outer surface of the adjusting slide bar (107) is slidably connected to an adjusting block (106), and one side of the adjusting block (106) is rotatably connected to a guide roller (108).

8. A method for coating integrated circuit chip packaging, using the device for coating integrated circuit chip packaging as claimed in any one of claims 1 to 7, characterized in that: The following steps are involved: S1. First, two cylindrical films (104) are placed on the film transport assembly for transport, and at the same time, the sheet frame chip (109) is placed inside the material transport support shell (200), the control transmission assembly is started, and the sheet frame chip (109) is moved to the bottom of the film coating shell (300) and stopped; S2, then start the driving cylinder (301) to drive the connecting plate (304) to move downward, and then drive the film coating shell (300) to move downward to contact the feeding support shell (200), so that it moves downward to fit the top surface of the feeding support shell (200), at this time, the film coating shell (300) will contact the top of the feeding support shell (200), and at the same time, continue to drive the connecting plate (304) downward to make the multiple shaping pressing plates (307) respectively contact the top of the sheet frame chip (109), at this time, the film (105) is attached to the surface of the sheet frame chip (109) for coating; S3, when the shaping plate (307) completely contacts the sheet frame chip (109), the film (105) will be sandwiched between the two, and as the driving cylinder (301) is continuously driven, the blade (400) will be driven to move downward, thereby cutting the film (105), so that the cut film (105) is completely attached to the sheet frame chip (109), and then the driving cylinder (301) can be controlled to contract to drive the film coating shell (300) to move upward, thereby completing a single set of film coating; S4. When the film shell (300) moves downward, the power assembly is started, thereby driving the positioning block (205) to move in a direction close to the sheet frame chip (109). Finally, the positioning block (205) contacts the sheet frame chip (109) to fix and support it.

Images