A nanoscale leveling, deviation correction and alignment device and a semiconductor defect detection system

Abstract

The present application provides a nanoscale leveling, deviation rectifying and alignment device and a semiconductor defect detection system, relating to the technical field of semiconductor detection. In the present application, a plurality of lifting mechanisms are respectively drivingly connected to different positions of a carrier plate, and a lifting mechanism is constituted by a piezoelectric ceramic actuator, a base, an output member and two opposite connecting members. The base and the output member are relatively arranged between the two connecting members. Elastic beams are connected between each connecting member and the base and between each connecting member and the output member. The piezoelectric ceramic actuator is arranged between the base and the output member. By driving the two connecting members to move in the horizontal direction through the piezoelectric ceramic actuator, the output member is driven to move in the vertical direction through the elastic beams, and further the part of the carrier plate connected to the output member is driven to move in the vertical direction. By controlling the displacement amounts of the output members in each lifting mechanism, leveling and deviation rectifying of the wafer on the carrier plate can be achieved. Thus, the present application can achieve high-precision and high-stability leveling and deviation rectifying operations.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor detection, and particularly relates to a nanoscale leveling and alignment device and a semiconductor defect detection system. Background Art

[0002] Both Micro LED chips and Mini LED chips are key components in new display technologies. The size of Micro LED chips is very small, usually less than 100 μm, and they have higher brightness and contrast, lower power consumption, and higher color saturation. Although the cost of Micro LED chips is high due to the difficulty of mass transfer, they are still expected to bring revolutionary display effects to fields such as wearable devices, AR / VR, etc. in the future; the size of Mini LED chips is relatively large, usually 100 - 200 μm, and they can achieve finer local dimming than traditional LEDs, thereby improving the contrast and dynamic range of the picture. Compared with Micro LED chips, the manufacturing process of Mini LED chips is relatively mature, and the cost is easier to control.

[0003] Generally, multiple Mini / Micro LED chips can be fabricated on a single wafer. Taking Micro LED chips as an example, on a 6-inch wafer, the number of Micro LED chips can be as many as 150 million. Defect detection of wafers is a crucial step in the chip manufacturing process, and its essence is to detect defects on each chip on the wafer. In related technologies, when detecting defects on wafers, due to problems such as warping and assembly errors, some areas of the wafer to be detected are out of focus, which affects the accuracy and efficiency of defect detection; in response to this, the existing solution is to use a macro leveling and alignment platform composed of macro linear motors and perform leveling and alignment on the wafer to be detected that is not parallel to the focal plane based on the three-point leveling and alignment method. However, the displacement magnification ratio of the macro leveling and alignment platform is very low, and the stability is also insufficient. Its accuracy can only reach the micron level, while the errors caused by warping, assembly, etc. can reach the sub-micron level or even the nanometer level, that is, it is difficult for the macro leveling and alignment platform to achieve higher-precision leveling and alignment. Summary of the Invention

[0004] The present application provides a nanoscale leveling and alignment device and a semiconductor defect detection system, aiming to solve the problems of insufficient accuracy and stability in leveling and aligning wafers in related technologies.

[0005] To address the above drawbacks in the related art, the first aspect of the present application provides a nanoscale leveling, deviation correction, and alignment device, which includes a base, a carrier plate, and a plurality of lifting mechanisms. The base includes a bottom plate and a bearing platform. The bearing platform is disposed in the central area of the bottom plate. The carrier plate is disposed on the bearing platform and is elastically connected to the bearing platform. The plurality of lifting mechanisms surround the bearing platform and are disposed on the bottom plate. Each lifting mechanism is drivingly connected to the carrier plate. The carrier plate is used for placing the wafer to be detected. Further, the lifting mechanism includes a piezoelectric ceramic actuator, a base, an output member, and two relatively disposed connecting members. The base and the output member are both located between the two connecting members. The base is disposed on the bottom plate. The output member is opposite to the base and is disposed on the carrier plate. At least one elastic beam is connected between each connecting member and the base and between each connecting member and the output member. The piezoelectric ceramic actuator is located between the base and the output member. The opposite ends of the piezoelectric ceramic actuator are respectively drivingly connected to the two connecting members. Wherein, when a voltage is applied to the opposite ends of the piezoelectric ceramic actuator, the piezoelectric ceramic actuator drives the two connecting members to move in the horizontal direction, so as to drive the output member to move in the vertical direction through the elastic beam.

[0006] In some implementation solutions, the leveling, deviation correction, and alignment device further includes a plurality of displacement amplifying members. Each lifting mechanism is drivingly connected to the carrier plate through a displacement amplifying member. Specifically, the displacement amplifying member includes a flexible hinge. The flexible hinge includes a flexible plate and a flexible support portion extending outward from the middle of the flexible plate. Concave notches are formed on both opposite sides of the flexible support portion. The flexible support portion is connected to the output member, and the flexible plate is connected to the carrier plate. Or, the displacement amplifying member includes two vertically staggered flexible hinges. The flexible hinge includes a flexible plate and a flexible support portion extending outward from the middle of the flexible plate. Concave notches are formed on both opposite sides of the flexible support portion. The flexible support portion of the first flexible hinge is connected to the output member, the flexible support portion of the second flexible hinge is connected to the flexible plate of the first flexible hinge, and the flexible plate of the second flexible hinge is connected to the carrier plate.

[0007] In some implementation solutions, the leveling, deviation correction, and alignment device further includes a flexible leaf spring located between the carrier plate and the bearing platform. The carrier plate is elastically connected to the bearing platform through the flexible leaf spring. Specifically, the flexible leaf spring includes a plurality of flexible rod groups surrounding the bearing platform. Each flexible rod group is located between two adjacent lifting mechanisms. Each flexible rod group includes two relatively disposed flexible bearing rods. The first end of the flexible bearing rod is disposed on the bearing platform, and the opposite second end is disposed on the carrier plate. An outer flexible connecting rod is connected between the second ends of the two flexible bearing rods in the same flexible rod group. An inner flexible connecting rod is connected between the first ends of the two closest flexible bearing rods in two adjacent flexible rod groups.

[0008] In some implementation solutions, a plurality of mounting holes are formed in the carrier plate around the bearing platform and penetrating through the carrier plate. The plurality of mounting holes respectively correspond to a plurality of lifting mechanisms. The leveling, deviation rectifying and alignment device further includes a plurality of flexible guiding members, and the plurality of flexible guiding members are respectively arranged in the plurality of mounting holes. Specifically, the flexible guiding member includes a flexible abutting portion, two relatively arranged flexible end rods, and two relatively arranged flexible side rods connected between the two flexible end rods. The flexible abutting portion is connected to the output member and is located between the two flexible side rods. At least one flexible guiding rod is connected between each flexible end rod and the flexible abutting portion.

[0009] The second aspect of the present application provides a semiconductor defect detection system. The semiconductor defect detection system includes a frame, a host computer, a vision detection device, and the leveling, deviation rectifying and alignment device mentioned in the first aspect of the present application. The vision detection device and the leveling, deviation rectifying and alignment device are respectively communicatively connected to the host computer. The vision detection device and the leveling, deviation rectifying and alignment device are both arranged on the frame. The vision detection device is located above the leveling, deviation rectifying and alignment device. The leveling, deviation rectifying and alignment device is used to fix the wafer to be detected. Specifically, the vision detection device is used to collect the image to be detected of the wafer to be detected; the host computer is used to judge whether the wafer to be detected meets the preset pose requirements according to the image to be detected, and when the preset pose requirements are not met, send a leveling and deviation rectifying instruction to the leveling, deviation rectifying and alignment device according to the difference from the preset pose requirements until the wafer to be detected meets the preset pose requirements; the leveling, deviation rectifying and alignment device is used to respond to the leveling and deviation rectifying instruction to level and rectify the wafer to be detected; the host computer is further used to perform defect detection according to the image to be detected re-collected by the vision detection device when the wafer to be detected meets the preset pose requirements.

[0010] In some implementation solutions, the semiconductor defect detection system further includes an active focusing device. The active focusing device is communicatively connected to the host computer. The active focusing device is arranged on the frame and is located above the leveling, deviation rectifying and alignment device. The active focusing device is drivingly connected to the vision detection device. Specifically, the host computer is further used to analyze the distance information between the wafer to be detected and the focal plane of the vision detection device according to the image to be detected, and judge whether the image to be detected meets the preset clarity requirements. When the image to be detected does not meet the preset clarity requirements, send a focusing instruction to the active focusing device according to the distance information, the preset depth of field, and the difference from the preset clarity requirements until the image to be detected meets the preset clarity requirements; the active focusing device is used to drive the vision detection device to move in the vertical direction according to the focusing instruction to adjust the focal length of the vision detection device; the host computer is specifically used to perform defect detection according to the image to be detected when the image to be detected meets the preset clarity requirements and the wafer to be detected meets the preset pose requirements.

[0011] For the leveling, deviation rectifying and alignment device mentioned in the first aspect of the present application, multiple lifting mechanisms are respectively driven and connected to different positions of the carrier plate. The lifting mechanism is composed of a piezoelectric ceramic actuator, a base, an output member and two relatively arranged connecting members. The base and the output member are relatively arranged between the two connecting members, and at least one elastic beam is connected between each connecting member and the base and between each connecting member and the output member. The piezoelectric ceramic actuator is arranged between the base and the output member, and the two opposite ends of the piezoelectric ceramic actuator are respectively drivingly connected to the two connecting members. Based on this, a voltage can be applied to the two opposite ends of the piezoelectric ceramic actuator to drive the two connecting members to move in the horizontal direction, so as to drive the output member to move in the vertical direction through the elastic beam, and further drive the part of the carrier plate connected to the output member to move in the vertical direction. By controlling the displacement of the output member in each lifting mechanism, the leveling and deviation rectifying of the wafer to be detected on the carrier plate can be realized. It can be understood that, compared with the traditional scheme, the present application does not use a linear electric mechanism to form the lifting mechanism, but designs a new type of lifting mechanism based on piezoelectric ceramics. This new type of lifting mechanism can convert the horizontal movement into the vertical movement, and has a high displacement magnification ratio and stiffness, and can realize high-speed, high-precision and high-stability leveling and deviation rectifying operations, so as to ensure that the wafer to be detected is always parallel to the focal plane and within the specified depth of field range.

[0012] For the semiconductor defect detection system mentioned in the second aspect of the present application, it includes a host computer, a vision detection device and the leveling, deviation rectifying and alignment device mentioned in the first aspect of the present application. The vision detection device can collect the image to be detected of the wafer to be detected. The host computer can judge whether the wafer to be detected meets the preset pose requirements according to the image to be detected, and when it does not meet the preset pose requirements, send a leveling and deviation rectifying instruction to the leveling, deviation rectifying and alignment device according to the difference from the preset pose requirements until the wafer to be detected meets the preset pose requirements. The leveling, deviation rectifying and alignment device can respond to the leveling and deviation rectifying instruction to level and deviation rectify the wafer to be detected. Finally, when the wafer to be detected meets the preset pose requirements, the host computer will perform defect detection according to the image to be detected newly collected by the vision detection device. It can be seen that the semiconductor defect detection system of the present application realizes the leveling, deviation rectifying and defect detection of the wafer to be detected, and because it applies the leveling, deviation rectifying and alignment device mentioned in the first aspect of the present application, it has all the advantages of the leveling, deviation rectifying and alignment device. Description of the Drawings

[0013] In order to more clearly illustrate the related technologies or the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the related technologies or the embodiments of the present application. Obviously, the following drawings are only some embodiments of the present application, rather than all embodiments. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0014] Figure 1 It is the front view of the leveling, deviation correction and alignment device provided by the embodiment of the present application;

[0015] Figure 2 It is the assembly schematic diagram of the lifting mechanism and the displacement amplification member provided by the embodiment of the present application;

[0016] Figure 3 It is the structural schematic diagram of the leveling, deviation correction and alignment device provided by the embodiment of the present application from one perspective;

[0017] Figure 4 It is the structural schematic diagram of the flexible leaf spring provided by the embodiment of the present application;

[0018] Figure 5 It is the structural schematic diagram of the leveling, deviation correction and alignment device provided by the embodiment of the present application from another perspective;

[0019] Figure 6 It is the structural schematic diagram of the semiconductor defect detection system provided by the embodiment of the present application.

[0020] The marks in the above respective drawings represent respectively:

[0021] 100 - leveling, deviation correction and alignment device, 110 - base, 120 - carrier plate, 130 - lifting mechanism, 140 - displacement amplification member, 150 - flexible leaf spring, 160 - flexible guide, 111 - bottom plate, 112 - bearing platform, 131 - piezoelectric ceramic actuator, 132 - base, 133 - output member, 134 - connecting member, 135 - elastic beam, 141 - flexible hinge, 1411 - flexible plate, 1412 - flexible support portion, 1413 - notch, 151 - flexible rod group, 1511 - flexible bearing rod, 1512 - outer flexible connecting rod, 1513 - inner flexible connecting rod, 121 - mounting hole, 161 - flexible abutting portion, 162 - flexible end rod, 163 - flexible side rod, 164 - flexible guide rod, 200 - frame, 300 - vision detection device, 400 - active focusing device. Detailed implementation manners [[ID=3�]]

[0022] When detecting defects on a wafer, if there are problems such as offset, tilt, and misalignment of the wafer, it will cause defocus of some areas of the wafer, thus affecting the accuracy and efficiency of defect detection; when using the laser mass transfer technology to transfer several chips (such as Micro LED chips) on the wafer, if there are problems such as offset, tilt, and misalignment of the wafer, it will cause the transfer to fail, directly affecting the performance of the product; that is to say, whether it is defect detection or mass transfer, leveling and correcting the deviation of the wafer is a crucial step. In the related technology, a macro leveling and correcting platform composed of macro linear motors can be used, and based on the three-point leveling and correcting method, the wafer to be detected that is not parallel to the focal plane can be leveled and corrected. However, the displacement magnification ratio of the macro leveling and correcting platform is very low, the stability is insufficient, and it is difficult to achieve higher-precision leveling and correcting.

[0023] In view of this, the present application proposes a nanoscale leveling, correcting, and aligning device in the following embodiments. The advantages of this leveling, correcting, and aligning device are as follows: it has a high displacement magnification ratio and stiffness, can achieve high-speed, high-precision, and high-stability leveling and correcting operations, ensuring that the wafer to be detected is always parallel to the focal plane and within the specified depth of field; it can achieve automatic compensation of precision. During the process of driving the wafer to be detected to lift or deflect at an arbitrary angle in any direction, there is always a force pointing from the circumference to the center of the circle, so that the deflection center is always in the initial position; it has excellent decoupling performance, that is, the coupling degree between structures is low; the structure is compact and the manufacturing cost is low.

[0024] In order to make the purpose, technical solution, and advantages of the present application more obvious and understandable, the present application will be clearly and completely described below in conjunction with the embodiments of the present application and the corresponding drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. It should be understood that the various embodiments of the present application described below are only used to explain the present application and are not used to limit the present application. That is, based on the various embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application. In addition, the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0025] Please refer to Figure 1 and Figure 2 , Figure 1 which shows the front view of the leveling, correcting, and aligning device, Figure 2The assembly schematic diagram of the lifting mechanism and the displacement amplification member is shown. In some embodiments, the leveling and deviation correction alignment device 100 includes a base 110, a carrier plate 120, and a plurality of lifting mechanisms 130. Specifically, the base 110 includes a bottom plate 111 and a bearing platform 112. The bearing platform 112 is disposed on the central region of the bottom plate 111. The carrier plate 120 is disposed on the bearing platform 112 and is elastically connected to the bearing platform 112. The plurality of lifting mechanisms 130 surround the bearing platform 112 and are disposed on the bottom plate 111. Each lifting mechanism 130 is drivingly connected to the carrier plate 120. The carrier plate 120 is used for placing the wafer to be detected. It can be understood that since the carrier plate 120 and the bottom plate 111 are separated by the bearing platform 112, there is a gap surrounding the bearing platform 112 between the carrier plate 120 and the bottom plate 111. The plurality of lifting mechanisms 130 are disposed in this gap in a manner surrounding the bearing platform 112 and are respectively drivingly connected to different positions of the carrier plate 120. It should be noted that the number of the lifting mechanisms 130 in this application is not limited, preferably three, and the numbers of the displacement amplification member 140, the flexible rod group 151, and the flexible guide member 160 given below should be adapted to the lifting mechanism 130.

[0026] In actual applications, the lifting mechanism 130 can move in the vertical direction and drive the part of the carrier plate 120 connected to the lifting mechanism 130 to move in the vertical direction. Then, by controlling the displacement amounts of the respective lifting mechanisms 130 in the vertical direction, the leveling and deviation correction of the wafer to be detected on the carrier plate 120 can be achieved. It should be noted that when the displacement amounts of the respective lifting mechanisms 130 in the vertical direction are the same, the overall rise or fall of the carrier plate 120 (equivalent to the wafer to be detected) can be realized; when the displacement amounts of the respective lifting mechanisms 130 in the vertical direction are different, the leveling of the carrier plate 120 (equivalent to the wafer to be detected) can be realized; that is to say, the leveling and deviation correction alignment device 100 has at least three degrees of freedom, namely the movement in the vertical direction and the pitch and yaw of the carrier plate 120 (equivalent to the wafer to be detected). It should also be noted that the elastic connection between the carrier plate 120 and the bearing platform 112 is actually to realize the driving of the part of the carrier plate 120 connected to the lifting mechanism 130 by the lifting mechanism 130. Because if the carrier plate 120 is fixedly connected to the bearing platform 112, the lifting mechanism 130 cannot drive the part of the carrier plate 120 connected to the lifting mechanism 130 to move relative to the bearing platform 112.

[0027] Furthermore, the lifting mechanism 130 includes a piezoelectric ceramic actuator 131, a base 132, an output member 133, and two relatively arranged connecting members 134. Both the base 132 and the output member 133 are located between the two connecting members 134. The base 132 is disposed on the bottom plate 111, and the output member 133 is opposite to the base 132 and disposed on the load plate 120. At least one elastic beam 135 is connected between each connecting member 134 and the base 132, and at least one elastic beam 135 is also connected between each connecting member 134 and the output member 133. The piezoelectric ceramic actuator 131 is located between the base 132 and the output member 133, and the two opposite ends of the piezoelectric ceramic actuator 131 are respectively drivingly connected to the two connecting members 134.

[0028] In practical applications, a voltage can be applied to the two opposite ends of the piezoelectric ceramic actuator 131. The purpose is to drive the two connecting members 134 to move in the horizontal direction through the piezoelectric ceramic actuator 131, so as to drive the output member 133 to move in the vertical direction through the elastic beam 135, and then drive the part of the load plate 120 connected to the output member 133 to move in the vertical direction. Thus, the leveling and deviation correction of the wafer to be detected on the load plate 120 can be realized by controlling the displacement of the output member 133 in each lifting mechanism 130. It should be noted that elastic beams 135 are connected between each connecting member 134 and the base 132 and between each connecting member 134 and the output member 133. The function is to facilitate the conversion of the movement of the two connecting members 134 in the horizontal direction into the movement of the output member 133 in the vertical direction, so as to level and correct the deviation of the wafer to be detected on the load plate 120 through the movement of the output member 133 in the vertical direction. In addition, the number of elastic beams 135 between each connecting member 134 and the base 132 and between each connecting member 134 and the output member 133 is not limited in this application. It should also be noted that the piezoelectric ceramic actuator 131 is preferably a stacked piezoelectric ceramic actuator in which several layers of piezoelectric ceramics are stacked together.

[0029] As can be seen from the above, compared with the traditional solution, this application does not use a linear motor to form the lifting mechanism 130, but designs a new type of lifting mechanism 130 based on piezoelectric ceramics. This new type of lifting mechanism 130 can convert the horizontal movement into the vertical movement, and has a high displacement magnification ratio and stiffness, and can realize high-speed, high-precision, and high-stability leveling and deviation correction operations, so as to ensure that the wafer to be detected is always parallel to the focal plane and within the specified depth of field range. In addition, the accuracy of this new type of lifting mechanism 130 can reach the micron level, even the sub-micron level and the nano level; this new type of lifting mechanism 130 has a compact and simple structure, which is beneficial to reducing the errors generated during assembly.

[0030] As one of the embodiments, still referring to Figure 1 and Figure 2, in addition to the structures listed above, the leveling, deviation rectifying and alignment device 100 further includes a plurality of displacement amplifying members 140. Each lifting mechanism 130 is drivingly connected to the carrier plate 120 through a displacement amplifying member 140. The displacement amplifying member 140 can amplify the displacement of the output member 133 in the lifting mechanism 130 in the vertical direction, thereby broadening the leveling and deviation rectifying range of the carrier plate 120 (equivalent to the wafer to be detected).

[0031] In some implementation manners of this embodiment, the displacement amplifying member 140 includes a flexible hinge 141. The flexible hinge 141 includes a flexible plate 1411 and flexible support portions 1412 extending outward from the middle of the flexible plate 1411. Concave notches 1413 are formed on both opposite sides of the flexible support portions 1412. The flexible support portions 1412 are connected to the output member 133, and the flexible plate 1411 is connected to the carrier plate 120. In other implementation manners of this embodiment, the displacement amplifying member 140 includes two flexible hinges 141. The two flexible hinges 141 are vertically staggered in space. During the actual assembly process, the flexible support portion 1412 of the first flexible hinge 141 is connected to the output member 133, the flexible support portion 1412 of the second flexible hinge 141 is connected to the flexible plate 1411 of the first flexible hinge 141, and the flexible plate 1411 of the second flexible hinge 141 is connected to the carrier plate 120. It should be noted that the concave notches 1413 formed on both opposite sides of the flexible support portions 1412 can have any shape common in the art, such as semi-rectangular, semi-circular, semi-elliptical, semi-hexagonal, etc., and are preferably semi-circular. It should also be noted that based on the structure of the flexible hinge 141, using a single flexible hinge 141 or two vertically staggered flexible hinges 141 to form the displacement amplifying member 140 can greatly reduce the natural frequency, increase the deflection stroke of the carrier plate 120 (equivalent to the wafer to be detected) during the leveling and deviation rectifying process, make the overall movement of the carrier plate 120 more stable, and have better motion decoupling. The torques generated when the carrier plate 120 deflects will all act concentratedly at the flexible hinge 141, which makes the bending degree of the carrier plate 120 very low.

[0032] As one of the embodiments, please refer to Figure 3 and Figure 4 , Figure 3 is a schematic structural view of the leveling, deviation rectifying and alignment device from a perspective, Figure 4 is a schematic structural view of the flexible leaf spring. In addition to the structures given above, the leveling, deviation rectifying and alignment device 100 further includes a flexible leaf spring 150 located between the carrier plate 120 and the bearing table 112. The carrier plate 120 is elastically connected to the bearing table 112 through the flexible leaf spring 150.

[0033] In some implementation manners of this embodiment, the flexible leaf spring 150 includes a plurality of flexible rod groups 151 surrounding the bearing platform 112. Each flexible rod group 151 is located between two adjacent lifting mechanisms 130. Each flexible rod group 151 includes two relatively arranged flexible bearing rods 1511. The first ends of the flexible bearing rods 1511 are arranged on the bearing platform 112, and the opposite second ends are arranged on the load plate 120. An outer flexible connecting rod 1512 is connected between the second ends of the two flexible bearing rods 1511 in the same flexible rod group 151. An inner flexible connecting rod 1513 is connected between the first ends of the two closest flexible bearing rods 1511 in two adjacent flexible rod groups 151. It should be noted that the flexible leaf spring 150 can provide passive precision compensation for the leveling and deviation correction and alignment device 100. The flexible leaf spring 150 is composed of a plurality of flexible rod groups 151 surrounding the bearing platform 112. For each flexible rod group 151 (not only referring to the corresponding two flexible bearing rods 1511, but also referring to the outer flexible connecting rod 1512 and the inner flexible connecting rod 1513 having a connection relationship with the corresponding two flexible bearing rods 1511), due to its flexible structure, during the deflection of the load plate 120, there is always a radial force pointing to the center of the circle (i.e., the center of the load plate 120) to pull the load plate 120. Then, through a plurality of flexible rod groups 151, it is possible to ensure that when the load plate 120 is lifted or deflected at any angle in any direction, there is always a radial force pointing to the center of the circle, so that the deflection center of the load plate 120 always falls on the initial position, that is, it is ensured that the deflection center of the load plate 120 remains on the horizontal plane without displacement error after deflection.

[0034] As one of the embodiments, please refer to Figure 5 , Figure 5 FIG. is a schematic structural diagram of the leveling and deviation correction and alignment device from another perspective. A plurality of mounting holes 121 surrounding the bearing platform 112 and penetrating the load plate 120 are formed in the load plate 120. The plurality of mounting holes 121 respectively correspond to the plurality of lifting mechanisms 130. In addition to the structures listed above, the leveling and deviation correction and alignment device 100 further includes a plurality of flexible guiding members 160, and the plurality of flexible guiding members 160 are respectively arranged in the plurality of mounting holes 121.

[0035] In some implementation manners of this embodiment, the flexible guiding member 160 includes a flexible abutting portion 161, two relatively arranged flexible end rods 162, and two relatively arranged flexible side rods 163 connected between the two flexible end rods 162. The flexible abutting portion 161 is connected to the output member 133 and is located between the two flexible side rods 163. At least one flexible guiding rod 164 is connected between each flexible end rod 162 and the flexible abutting portion 161. The present application does not limit the number of flexible guiding rods 164 between each flexible end rod 162 and the flexible abutting portion 161. It should be noted that by respectively driving a plurality of lifting mechanisms 130 connected to different positions of the carrier plate 120 to level and correct the deviation of the carrier plate 120 (equivalent to the wafer to be detected), the deflection of the carrier plate 120 lacks a stable deflection center, which will cause a horizontal displacement error between the center of the carrier plate 120 and the connection points between each lifting mechanism 130 and the carrier plate 120. Therefore, in order to avoid this drawback, the present application internally embeds a plurality of flexible guiding members 160 around the bearing platform 112 on the carrier plate 120. The functions of the plurality of flexible guiding members 160 and the flexible leaf spring 150 are similar, that is, the plurality of flexible guiding members 160 can also provide passive precision compensation for the leveling and deviation correction alignment device 100. The plurality of flexible guiding members 160 can enable a degree of freedom along the radial direction of the carrier plate 120 to exist at the connection points between each lifting mechanism 130 and the carrier plate 120 during the deflection of the carrier plate 120, that is, the connection points between each lifting mechanism 130 and the carrier plate 120 can move radially on the carrier plate 120, so as to realize the compensation of the deflection center when the carrier plate 120 deflects.

[0036] In addition, in addition to the leveling and deviation correction alignment device 100 described above, the present application also provides a semiconductor defect detection system applying the leveling and deviation correction alignment device 100. Please refer to Figure 6 , Figure 6The figure shows a schematic structural diagram of a semiconductor defect detection system. In some embodiments, the semiconductor defect detection system includes a frame 200, a host computer (not shown in the figure), a vision detection device 300, and a leveling, deviation correction, and alignment device 100. The vision detection device 300 and the leveling, deviation correction, and alignment device 100 are respectively communicatively connected to the host computer. The vision detection device 300 and the leveling, deviation correction, and alignment device 100 are both disposed on the frame 200. The vision detection device 300 is located above the leveling, deviation correction, and alignment device 100. The leveling, deviation correction, and alignment device 100 is used to fix the wafer to be detected. Preferably, the frame 200 adopts a three-degree-of-freedom gantry. The three-degree-of-freedom gantry can drive the vision detection device 300 and / or the leveling, deviation correction, and alignment device 100 to move in the x, y, and z directions through the motors, transmission devices, etc. configured therein. Since the technology of the three-degree-of-freedom gantry is relatively mature, the specific structure of the three-degree-of-freedom gantry and how it realizes the driving in the x, y, and z directions will not be further described in this application.

[0037] In actual applications, the vision detection device 300 can collect the image to be detected of the wafer to be detected; the host computer can determine whether the wafer to be detected meets the preset pose requirements according to the image to be detected. When the wafer to be detected does not meet the preset pose requirements, the host computer can send a leveling and deviation correction instruction to the leveling, deviation correction, and alignment device 100 according to the difference from the preset pose requirements until the wafer to be detected meets the preset pose requirements; the leveling, deviation correction, and alignment device 100 can respond to the leveling and deviation correction instruction to level and correct the wafer to be detected; the host computer can also perform defect detection according to the image to be detected when the wafer to be detected meets the preset pose requirements. It should be noted that determining whether the wafer to be detected meets the preset pose requirements is actually determining whether it is necessary to level and correct the wafer to be detected. When the wafer to be detected does not meet the preset pose requirements, it means that it is necessary to level and correct the wafer to be detected through the leveling, deviation correction, and alignment device 100.

[0038] As one of the embodiments, in addition to the structures listed above, the semiconductor defect detection system further includes an active focusing device 400 communicatively connected to the host computer. The active focusing device 400 is disposed on the frame 200, above the leveling, deviation correction and alignment device 100, and is drivingly connected to the vision detection device 300. During the actual defect detection process, the host computer can also analyze the distance information between the wafer to be detected and the focal plane of the vision detection device 300 based on the image to be detected, and determine whether the image to be detected meets the preset clarity requirement. When the image to be detected does not meet the preset clarity requirement, the host computer can also send a focusing instruction to the active focusing device 400 according to the distance information, the preset depth of field, and the difference from the preset clarity requirement, until the image to be detected meets the preset clarity requirement; the active focusing device 400 can respond to the focusing instruction to drive the vision detection device 300 to move in the vertical direction, so as to adjust the focal length of the vision detection device 300; finally, when the image to be detected meets the preset clarity requirement and the wafer to be detected meets the preset pose requirement, the host computer performs defect detection based on the image to be detected. It can be understood that the preset depth of field refers to the front and back depth range when the vision detection device 300 can capture a clear image. After the active focusing device 400 performs active focusing according to the distance information, the preset depth of field, and the difference between the current clarity of the image to be detected and the preset clarity requirement, the distance between the wafer to be detected and the focal plane of the vision detection device 300 will surely fall within the preset depth of field.

[0039] In addition, it should be noted that in the traditional solution, the leveling and deviation correction platform based on the linear motor generally uses an internal capacitance sensor for position closed-loop feedback. The detection distance of the capacitance sensor is limited (less than 400μm), and the object to be detected is required to be a metal substance, so its use is limited; in response to this, the present application abandons the capacitance sensor in the traditional solution, but adopts an external vision detection device 300 and forms a motion closed-loop with the leveling, deviation correction and alignment device 100. The vision detection device 300 is used to collect the image to be detected of the wafer to be detected on the leveling, deviation correction and alignment device 100, and then determine whether it is necessary to level and correct the wafer to be detected and whether it is necessary to perform active focusing, and then perform subsequent leveling and correction and / or active focusing operations according to the judgment result, so as to ensure the motion accuracy and accuracy of the leveling, deviation correction and alignment device 100, and achieve high-precision detection and alignment operations.

[0040] The above embodiments are only the preferred implementations of the present application, and they are not the only limitations on the leveling and alignment device 100 and related content of the semiconductor defect detection system; in this regard, those skilled in the art can flexibly set according to the actual application scenarios on the basis of the above embodiments. It can be understood that through the implementation of the above embodiments of the present application, multiple lifting mechanisms 130 are respectively driven and connected to different positions of the carrier plate 120. The lifting mechanism 130 is composed of a piezoelectric ceramic actuator 131, a base 132, an output member 133, and two relatively arranged connecting members 134. The base 132 and the output member 133 are relatively arranged between the two connecting members 134, and at least one elastic beam 135 is connected between each connecting member 134 and the base 132 and between the connecting member 134 and the output member 133. The piezoelectric ceramic actuator 131 is arranged between the base 132 and the output member 133, and the two opposite ends of the piezoelectric ceramic actuator 131 are respectively drivingly connected to the two connecting members 134; based on this, a voltage can be applied to the two opposite ends of the piezoelectric ceramic actuator 131 to drive the two connecting members 134 to move in the horizontal direction, so as to drive the output member 133 to move in the vertical direction through the elastic beam 135, and further drive the part of the carrier plate 120 connected to the output member 133 to move in the vertical direction. By controlling the displacement of the output member 133 in each lifting mechanism 130, the leveling and alignment of the wafer to be detected on the carrier plate 120 can be achieved. Compared with the traditional scheme, the present application does not use a linear motor to form the lifting mechanism 130, but designs a new type of lifting mechanism 130 based on piezoelectric ceramics. The lifting mechanism 130 can convert the horizontal movement into the vertical movement, and has a high displacement amplification ratio and stiffness, and can realize high-speed, high-precision, and high-stability leveling and alignment operations, so as to ensure that the wafer to be detected is always parallel to the focal plane and within the specified depth of field range.

[0041] It should be noted that several embodiments shown above in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. It should also be noted that in the textual description of this application, relative terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply such an actual relationship or order between these entities or operations. Further, the term "comprising", "including" or any other corresponding variant is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes these elements, but may also include other elements not explicitly listed, or may also include elements inherent in such a process, method, article or device; and, without more limitations, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article or device including the said element.

[0042] In addition, by implementing several embodiments shown above in this application, those skilled in the art can implement or use this application. For the several embodiments shown above in this application, various modifications will be obvious to those skilled in the art. The general principles defined in this application can be implemented in other embodiments not shown without departing from the spirit or scope of this application. Therefore, this application will not be limited to the several embodiments shown above, but rather to the broadest scope consistent with the principles and novel features disclosed in this application.

Claims

1. A nanoscale leveling, deviation correction and alignment device, characterized in that It includes a base, a carrier plate and a plurality of lifting mechanisms. The base includes a bottom plate and a bearing platform. The bearing platform is arranged on the central area of the bottom plate. The carrier plate is arranged on the bearing platform and elastically connected to the bearing platform. The plurality of lifting mechanisms surround the bearing platform and are arranged on the bottom plate. Each lifting mechanism is drivingly connected to the carrier plate. The carrier plate is used for placing the wafer to be detected; The lifting mechanism includes a piezoelectric ceramic actuator, a base, an output member and two relatively arranged connecting members. Both the base and the output member are located between the two connecting members. The base is arranged on the bottom plate. The output member is opposite to the base and is arranged on the carrier plate. At least one elastic beam is connected between each connecting member and the base and between each connecting member and the output member. The piezoelectric ceramic actuator is located between the base and the output member. The two opposite ends of the piezoelectric ceramic actuator are respectively drivingly connected to the two connecting members; wherein, the piezoelectric ceramic actuator is used to drive the two connecting members to move in the horizontal direction, so as to drive the output member to move in the vertical direction through the elastic beam; A flexible leaf spring is connected between the carrier plate and the bearing platform. The flexible leaf spring includes a plurality of flexible rod groups surrounding the bearing platform. Each flexible rod group is located between two adjacent lifting mechanisms. Each flexible rod group includes two relatively arranged flexible bearing rods. The first end of the flexible bearing rod is arranged on the bearing platform, and the opposite second end is arranged on the carrier plate. An outer flexible connecting rod is connected between the second ends of the two flexible bearing rods in the same flexible rod group. An inner flexible connecting rod is connected between the first ends of the two closest flexible bearing rods in two adjacent flexible rod groups.

2. The leveling, deviation correction and alignment device according to claim 1, wherein It further includes a plurality of displacement amplifying members. Each lifting mechanism is drivingly connected to the carrier plate through one displacement amplifying member.

3. The leveling and deviation rectifying alignment device according to claim 2, wherein The displacement amplifying member includes a flexible hinge. The flexible hinge includes a flexible plate and a flexible support portion extending outward from the middle of the flexible plate. Concave notches are formed on both opposite sides of the flexible support portion. The flexible support portion is connected to the output member, and the flexible plate is connected to the carrier plate.

4. The leveling, deviation rectifying and alignment device according to claim 2, wherein, The displacement amplifying member includes two perpendicularly staggered flexible hinges. The flexible hinge includes a flexible plate and a flexible support portion extending outward from the middle of the flexible plate. Concave notches are formed on both opposite sides of the flexible support portion. The flexible support portion of the first flexible hinge is connected to the output member. The flexible support portion of the second flexible hinge is connected to the flexible plate of the first flexible hinge. The flexible plate of the second flexible hinge is connected to the carrier plate.

5. The leveling, deviation rectifying and alignment device according to claim 1, characterized in that, A plurality of mounting holes surrounding the bearing platform and penetrating the carrier plate are formed on the carrier plate. The plurality of mounting holes respectively correspond to the plurality of lifting mechanisms. The leveling, deviation correcting and alignment device further includes a plurality of flexible guiding members which are respectively arranged in the plurality of mounting holes.

6. The leveling, deviation rectifying and alignment device according to claim 5, characterized in that, The flexible guide includes a flexible abutting portion, two relatively arranged flexible end rods, and two relatively arranged flexible side rods connected between the two flexible end rods. The flexible abutting portion is connected to the output member and is located between the two flexible side rods. At least one flexible guide rod is connected between each flexible end rod and the flexible abutting portion.

7. A semiconductor defect detection system, characterized in that, It includes a frame, a host computer, a vision detection device, and a leveling, deviation correction and alignment device according to any one of claims 1 to 6. The vision detection device and the leveling, deviation correction and alignment device are respectively communicatively connected to the host computer. The vision detection device and the leveling, deviation correction and alignment device are both arranged on the frame. The vision detection device is located above the leveling, deviation correction and alignment device. The leveling, deviation correction and alignment device is used to fix the wafer to be detected, where: The vision detection device is used to collect the image to be detected of the wafer to be detected; The host computer is used to: judge whether the wafer to be detected meets the preset pose requirements according to the image to be detected; when the wafer to be detected does not meet the preset pose requirements, send a leveling and deviation correction instruction to the leveling, deviation correction and alignment device according to the difference from the preset pose requirements until the wafer to be detected meets the preset pose requirements; The leveling, deviation correction and alignment device is used to respond to the leveling and deviation correction instruction to level and correct the wafer to be detected; The host computer is further used to perform defect detection according to the image to be detected when the wafer to be detected meets the preset pose requirements.

8. The semiconductor defect detection system according to claim 7, characterized in that, It further includes an active focusing device. The active focusing device is communicatively connected to the host computer. The active focusing device is arranged on the frame and is located above the leveling, deviation correction and alignment device. The active focusing device is drivingly connected to the vision detection device, where: The host computer is further used to: analyze the distance information between the wafer to be detected and the focal plane of the vision detection device according to the image to be detected, and judge whether the image to be detected meets the preset clarity requirements; when the image to be detected does not meet the preset clarity requirements, send a focusing instruction to the active focusing device according to the distance information, the preset depth of field and the difference from the preset clarity requirements until the image to be detected meets the preset clarity requirements; The active focusing device is used to drive the vision detection device to move in the vertical direction according to the focusing instruction to adjust the focal length of the vision detection device; The host computer is specifically used to perform defect detection according to the image to be detected when the image to be detected meets the preset clarity requirements and the wafer to be detected meets the preset pose requirements.

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